JP6338478B2 - Cutting method and product manufacturing method - Google Patents

Description

  The present invention relates to a cutting apparatus and a cutting method for manufacturing a plurality of products obtained by cutting an object to be cut.

  A substrate composed of a printed circuit board, a lead frame, etc. is virtually divided into a plurality of grid-like areas, and chip-like elements (for example, semiconductor chips) are attached to the respective areas, and then the entire board is sealed with resin. This is called a sealed substrate. A product obtained by cutting a sealed substrate by a cutting mechanism using a rotary blade or the like and dividing it into individual region units becomes a product.

  Conventionally, a predetermined region of a sealed substrate is cut by a cutting mechanism such as a rotary blade using a cutting device. For example, a BGA (Ball Grid Array Package) product is cut as follows. First, the sealed substrate is fixed on a cutting table. Next, the sealed substrate is aligned (positioned). By aligning, the position of a virtual cutting line that divides a plurality of regions is set. Next, the cutting table on which the sealed substrate is fixed and the cutting mechanism are relatively moved. The cutting water is sprayed onto the cut portion of the sealed substrate, and the sealed substrate is cut along the cutting line set on the sealed substrate by the cutting mechanism. An individualized product is manufactured by cutting the sealed substrate.

  The cutting table has a metal table and a suction jig fixed on the metal table. The suction jig is provided with a plurality of plate-like protrusions that suck and hold a plurality of regions of the sealed substrate. The plurality of protrusions are provided with suction holes that penetrate the suction jig and the metal table from the surface of the protrusion. A plurality of cutting grooves corresponding to positions of a plurality of cutting lines that divide each region of the sealed substrate are provided between the protrusions. By relatively moving the cutting table and the cutting mechanism, the sealed substrate is cut along the plurality of cutting grooves into individual pieces.

  Cutting waste and resin residue generated by cutting the sealed substrate are discharged by cutting water or the like. However, the cutting waste and the resin residue are not completely discharged and are gradually accumulated as a residue at the bottom of the cutting groove. When the residue is accumulated to some extent in the cutting groove, the rotary blade that is cutting the sealed substrate contacts the residue, and the residue is swept out. The removed residue adheres to the sealed substrate or the separated product and causes contamination (contamination). Therefore, it is important to periodically remove the residue accumulated in the cutting groove.

  As a jig for a substrate to be cut that can shorten the manufacturing time of the product substrate, “(substantially) a mounting portion on which the substrate to be cut is placed and a blade groove into which a blade for cutting the substrate to be cut is inserted. And a removing means for removing the broken material in the blade groove ”and“ (substantially) a plurality of water supply holes (removal is made on the bottom surface of the blade groove 45 from the bottom surface to the lower end of the metal layer M ”). A jig in which an opening 46a of the means (fluid hole) 46 is formed has been proposed (see, for example, paragraphs [0009], [0021], FIG. 2 and FIG. 3 of Patent Document 1).

JP 2012-004225 A

  However, the jig 40 for a substrate to be cut disclosed in Patent Document 1 has the following problems. As shown in FIGS. 2 and 3 of Patent Document 1, the blade groove 45 includes a side wall of the resin layer R (mounting portion 41) and an upper surface of the metal layer M. The bottom surface of the blade groove 45 is formed with a plurality of water supply holes (removal means, fluid holes) 46 a that penetrate from the bottom surface to the lower end of the metal layer M. Three water supply holes 46 are provided corresponding to the four sides of one mounting portion 41. Moreover, the space | interval of the adjacent water supply hole 46 is set to 1 mm or less, for example. Thereby, water supply to the blade groove 45 through the water supply hole 46 is performed uniformly and sufficiently to each part of the blade groove 45.

  In such a jig 40, a large number of water supply holes 46 having an adjacent interval of 1 mm or less are formed in the blade groove 45 (see paragraph [0021] of Patent Document 1). However, it is technically difficult to form a large number of water supply holes 46 at intervals of 1 mm or less. Therefore, it is difficult to manufacture the jig 40 stably. In addition, the cost for producing the jig 40 increases.

  The present invention solves the above problem, and in the cutting device, it is possible to easily remove the residue in the cutting groove of the suction jig without adding new components such as a water supply hole and new functions such as water supply. It is an object of the present invention to provide a cutting device and a cutting method that can be removed.

  In order to solve the above problems, a cutting apparatus according to the present invention includes a table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is placed, a cutting means for cutting the workpiece, A moving mechanism that relatively moves the table and the cutting means, and a cutting water supply mechanism that supplies cutting water to a processing point where the cutting means and the workpiece are in contact with each other. A cutting device used when manufacturing a product corresponding to each of the above, a base provided on the table, a suction jig fixed on the base, and a suction jig provided on the suction jig A plurality of cutting grooves corresponding to positions of a plurality of cutting lines in a state where the workpiece is placed on the jig, and cutting in a state where the workpiece is not placed on the suction jig At least a part of the means enters the inside of the cutting groove and supplies cutting water. Is supplied cutting water towards the cutting means from the mechanism, the residue inside the cutting groove by the table and the cutting means is moved relatively along the cutting groove, characterized in that it is removed.

  Moreover, the cutting device which concerns on this invention is provided with the washing water supply mechanism which supplies washing water toward the periphery of a cutting groove in the above-mentioned cutting device.

  The cutting device according to the present invention is characterized in that in the above-described cutting device, the cutting device has a plurality of cutting means.

  The cutting device according to the present invention is characterized in that, in the above-described cutting device, the suction jig is formed of a silicone resin or a fluorine resin.

  The cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the object to be cut is a sealed substrate.

  The cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the object to be cut is a substrate on which circuit elements respectively corresponding to a plurality of regions are formed.

  In order to solve the above problems, a cutting method according to the present invention includes a step of placing a workpiece having a plurality of regions surrounded by a plurality of cutting lines on a table, and the table and the cutting means relatively Cutting water is supplied to the work point where the cutting means and the workpiece are in contact with each other, the step of moving, the step of cutting the workpiece using the cutting means by relatively moving the table and the cutting means A step of preparing a table by fixing a suction jig having a plurality of cutting grooves corresponding to a plurality of cutting lines on a base, and on the suction jig Cutting at least a part of the cutting means into the cutting groove when the workpiece is not placed, and cutting toward the cutting means when the workpiece is not placed on the suction jig Supplying water and absorbing water Removing a residue in the cutting groove by relatively moving the table and the cutting means along the cutting groove in a state where the object to be cut is not placed on the jig. It is characterized by.

  Moreover, the cutting method according to the present invention includes the step of supplying cleaning water toward the periphery of the cutting groove in a state where the object to be cut is not placed on the suction jig in the above-described cutting method. Features.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the cutting device has a plurality of cutting means.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the adsorption jig is formed of a silicone resin or a fluorine resin.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the object to be cut is a sealed substrate.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the object to be cut is a substrate on which circuit elements respectively corresponding to a plurality of regions are formed.

  According to the present invention, in the cutting apparatus, a table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is placed, a cutting means for cutting the workpiece, and the table and the cutting means are relative to each other. And a cutting water supply mechanism for supplying cutting water to a processing point where the cutting means and the workpiece are in contact with each other. The table has a base and a suction jig fixed on the base. A plurality of cutting grooves corresponding to the positions of the plurality of cutting lines are formed in the suction jig. In a state where the object to be cut is not placed on the suction jig, at least a part of the cutting means is allowed to enter the plurality of cutting grooves. By supplying cutting water from the cutting water supply mechanism toward the cutting means and relatively moving the cutting means along the plurality of cutting grooves, residues in the plurality of cutting grooves can be removed.

It is a general-view figure which shows the sealed board | substrate used in Example 1 of the cutting device which concerns on this invention, Fig.1 (a) is the top view seen from the board | substrate side, FIG.1 (b) is a front view. FIG. 2 is a schematic view showing a cutting table corresponding to the sealed substrate shown in FIG. 1, FIG. 2A is a plan view, and FIG. 2B is a front view. 3A and 3B are schematic views showing an outline of each nozzle included in the cutting device according to the first embodiment. FIG. 3A is a plan view around the rotary blade, and FIG. 3B is a view of the rotary blade viewed from the side opposite to the spindle. It is a schematic sectional drawing. (A)-(c) is a schematic sectional drawing which shows the process in which the sealed board | substrate shown by FIG. 1 is cut | disconnected and separated into pieces. (A)-(b) is a schematic sectional drawing which shows the process of removing the residue accumulate | stored in the cutting groove of the adsorption jig shown by FIG. 2 using a rotary blade. In Example 2 of the cutting device which concerns on this invention, it is a top view which shows the outline | summary of a cutting device.

  As shown in FIG. 5, in the cutting device 28, the cutting table 7 having the suction jig 9 fixed on the metal table 8 is provided. The suction jig 9 is provided with a first cutting groove 12 and a second cutting groove 13 corresponding to the positions of the first cutting line 4 and the second cutting line 5 of the sealed substrate 1, respectively. The lower end of the rotary blade 16 is lowered into the first cutting groove 12 and the second cutting groove 13 in a state where the sealed substrate 1 is not placed on the cutting table 7. The first cutting groove 12 and the second cutting groove are moved by relatively moving the rotating blade 16 along the first cutting groove 12 and the second cutting groove 13 while supplying the cutting water 24. The residue 27 accumulated in 13 is swept out, and the residue 27 is discharged by the rotary blade 16 and the cutting water 24. In the existing cutting device 28, the residue 27 accumulated in the first cutting groove 12 and the second cutting groove 13 can be easily removed.

  Example 1 of the cutting device according to the present invention will be described with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  As shown in FIG. 1, a sealed substrate 1 includes a substrate 2 made of a printed circuit board, a lead frame, etc., a plurality of chip-like components (not shown) mounted in a plurality of regions of the substrate 2, and a plurality of The sealing resin 3 is formed so as to be covered together. The sealed substrate 1 is an object to be cut that is finally cut into pieces.

  As shown in FIG. 1A, a plurality of first cutting lines 4 along the short direction and a plurality of second cutting lines 5 along the longitudinal direction are virtually provided on the sealed substrate 1 respectively. Set to A plurality of regions 6 surrounded by the plurality of first cutting lines 4 and the plurality of second cutting lines 5 are separated into individual products. In FIG. 1 (a), for example, nine first cutting lines 4a, 4b,..., 4i are set in the short direction, and four second cutting lines 5a, 5b in the longitudinal direction. ... 5d is set. Therefore, three regions 6 are formed in the short direction and eight regions 6 are formed in the longitudinal direction, and a total of 24 regions 6 are formed in a lattice shape. Each region 6 corresponds to a product.

  The interval between the first cutting lines 4, for example, the interval between the cutting line 4b and the cutting line 4c is set to L1. The interval between the second cut lines 5, for example, the interval between the cut line 5b and the cut line 5c is set to L2. Accordingly, each region 6 corresponding to a product has an area of L1 × L2. The region 6 formed on the sealed substrate 1 is arbitrarily set depending on the size and number of products to be separated.

  As shown in FIG. 2, the cutting table 7 is a table for cutting the sealed substrate 1 into pieces by a cutting device. The cutting table 7 includes, for example, a metal table 8 and a suction jig 9 fixed on the metal table 8. The suction jig 9 is preferably formed of, for example, a silicone resin or a fluorine resin. The suction jig 9 is provided with a plurality of plate-like projections 10 that suck and hold the plurality of regions 6 in the sealed substrate 1 respectively. The plurality of protrusions 10 are respectively provided with suction holes 11 that penetrate the suction jig 9 and the metal table 8 from the surface of the protrusion 10.

  In order to correspond to the plurality of first cutting lines 4 and the plurality of second cutting lines 5 that divide the plurality of regions 6 of the sealed substrate 1 shown in FIG. A first cutting groove 12 and a plurality of second cutting grooves 13 are respectively provided. The plurality of first cutting grooves 12 are formed along the short direction of the suction jig 9, and the plurality of second cutting grooves 13 are formed along the longitudinal direction of the suction jig 9. Specifically, the suction jig 9 is set so as to correspond to the first cutting lines 4b, 4c,..., 4h (see FIG. 1A) set in the short direction of the sealed substrate 1. Are formed with first cutting grooves 12b, 12c,..., 12h, respectively. The second cutting grooves 13b and 13c are formed in the suction jig 9 so as to correspond to the second cutting lines 5b and 5c (see FIG. 1A) set in the longitudinal direction of the sealed substrate 1. It is formed. For the first cutting lines 4a and 4i and the second cutting lines 5a and 5d set at the extreme end of the sealed substrate 1, the outside of the protrusion 10 formed on the outermost periphery of the suction jig 9 Have the same role as the cutting groove. The depths of the plurality of first cutting grooves 12 and the plurality of second cutting grooves 13 (the distance from the upper surface of the protrusion 10 to the upper surface of the suction jig 9) are set to about 0.5 mm to 1.0 mm. The

  The interval between the first cutting grooves 12 (center-to-center distance), for example, the interval between the cutting groove 12b and the cutting groove 12c is set to L1. The interval between the second cutting grooves 13, for example, the interval between the cutting groove 13b and the cutting groove 13c is set to L2. The suction jig 9 includes the first cutting grooves 12 so as to correspond to the distance L1 between the first cutting lines 4 and the distance L2 between the second cutting lines 5 provided on the sealed substrate 1. Is set to L1, and the interval between the second cutting lines 13 is set to L2.

  In Example 1, cutting grooves corresponding to the first cutting lines 4 a and 4 i and the second cutting lines 5 a and 5 d set at the end of the sealed substrate 1 are formed in the suction jig 9. Not done. Not only this but the cutting groove corresponding to the 1st cutting lines 4a and 4i and the 2nd cutting lines 5a and 5d can also be formed in adsorption jig 9. In this case, a dummy protrusion is further provided so as to surround the outer periphery of the protrusion 10.

  As shown in FIG. 3A, the cutting device includes a spindle 14, and the spindle 14 has a rotating shaft 15. A rotary blade 16 is attached to the rotary shaft 15. A rotary blade cover 17 (indicated by a two-dot chain line in the figure) is attached to the spindle 14. The rotary blade 16 is covered with a rotary blade cover 17. A nozzle that supplies processing water to the sealed substrate 1 and the rotary blade 16 is attached to the cover 17 for the rotary blade. For example, one cutting water supply nozzle 18, two cooling water supply nozzles 19, and two cleaning water supply nozzles 20 are attached to the rotary blade cover 17. The cutting water supply nozzle 18 is connected to the cutting water supply pipe 21, the two cooling water supply nozzles 19 are connected to the cooling water supply pipe 22, and the two cleaning water supply nozzles 20 are connected to the cleaning water supply pipe 23. , Each connected. In a present Example, the case where pure water is used as processing water is shown.

As shown in FIG. 3B, the sealed substrate 1 is fixed on the cutting table 7 by suction. The cutting water 24 is jetted from the cutting water supply nozzle 18 toward the processing point where the sealed substrate 1 and the rotary blade 16 come into contact. The cutting water 24 has a function of reducing friction between the rotary blade 16 and the sealed substrate 1 by preventing clogging on the side surface of the rotary blade 16. The two cooling water supply nozzles 19 are arranged so as to sandwich the rotary blade 16. Each cooling water supply nozzle 19 is disposed so as to be parallel to the side surface of the rotary blade 16 and the upper surface of the sealed substrate 1. Cooling water 25 is jetted from the cooling water supply nozzle 19 toward a predetermined portion including the side surface of the rotary blade 16. The cooling water 25 has a function of cooling the rotary blade 16 and the sealed substrate 1. Further, the cleaning water 26 is jetted from the two cleaning water supply nozzles 20 toward a predetermined portion near the side surface of the rotary blade 16 on the upper surface of the sealed substrate 1. The cleaning water 26 has a function of removing cutting waste generated by the rotary blade 16. In addition to the powdery and granular substances, the cut substrate includes the sealed substrate 1 along the cutting lines 4a, 4i, 5a, and 5d (see FIG. 1A) at the end of the sealed substrate 1. Included is an elongated end material that occurs when cut. Cutting water 24, cooling water 25, and cleaning water 26 are used as processing water.

The cutting table 7 is reciprocated in the Y direction at a feed speed V by a moving mechanism (not shown). The rotary blade 16 is rotated at a high rotational speed R counterclockwise by a motor (not shown) incorporated in the spindle 14.

  With reference to FIGS. 1-4, the process of cut | disconnecting and separating the sealed board | substrate 1 is demonstrated. As shown in FIG. 4A, the sealed substrate 1 is placed on the cutting table 7 with the surface on the substrate 2 side facing up. In a state where the sealed substrate 1 is placed on the cutting table 7, each region 6 (see FIG. 1A) of the sealed substrate 1 is a suction jig 9 fixed on the cutting table 7. Are respectively placed on the protrusions 10 (see FIG. 2). Therefore, the plurality of first cutting lines 4 (see FIG. 1A) set in the short direction of the sealed substrate 1 are the plurality of first cutting lines 4 set in the short direction of the suction jig 9. It arrange | positions on the cutting groove 12 (refer Fig.2 (a)). Specifically, as shown in FIG. 4A, a cutting line 4b is formed on the cutting groove 12b, a cutting line 4c is formed on the cutting groove 12c, a cutting line 4d is formed on the cutting groove 12d, The cutting line 4g is arranged on the cutting groove 12g, and the cutting line 4h is arranged on the cutting groove 12h. Similarly, a plurality of second cutting lines 5 (see FIG. 1A) set in the longitudinal direction of the sealed substrate 1 are a plurality of second cutting lines set in the longitudinal direction of the suction jig 9. It arrange | positions on the groove | channel 13 (refer Fig.2 (a)). In a state where the sealed substrate 1 is placed at a predetermined position of the cutting table 7, each region 6 of the sealed substrate 1 is sucked by the suction holes 11 provided in the cutting table 7. By sealing each region 6, the sealed substrate 1 is fixed to the cutting table 7.

  Next, the cutting table 7 and the spindle 14 (see FIG. 3A) are relatively moved. The term “relatively move” includes the following three modes. These modes include a mode in which the cutting table 7 is fixed and the spindle 14 is moved, a mode in which the spindle 14 is fixed and the cutting table 7 is moved, and both the cutting table 7 and the spindle 14 are moved. It is an aspect. The first embodiment shows a mode in which the spindle 14 is fixed and the cutting table 7 is moved by a moving mechanism (not shown).

  Next, as shown in FIG. 4B, the spindle 14 is moved to a position where the lower end of the rotary blade 16 attached to the tip of the spindle 14 is deeper than the lower surface of the sealing resin 3 of the sealed substrate 1. Is lowered. It is preferable to lower the spindle 14 so that the lower end of the rotary blade 16 is about 0.1 mm to 0.2 mm deeper than the lower surface of the sealing resin 3. Next, the rotary blade 16 is rotated at a high speed with the rotation speed R. For example, the rotary blade 16 is rotated at a high speed at 30,000 rpm / min. Next, the cutting table 7 is moved in the + Y direction (see FIG. 3B) (in FIG. 4B, from the back of the sheet to the front), for example, at a feeding speed of 60 mm / second. The sealed substrate 1 is sequentially cut along the plurality of first cutting lines 4 set on the sealed substrate 1 by the rotating blade 16 rotating at high speed.

  When cutting the sealed substrate 1, the cutting water 24 is supplied from the cutting water supply nozzle 18, the cooling water 25 is supplied from the cooling water supply nozzle 19, and the cleaning water 26 is supplied from the cleaning water supply nozzle 20. 1 and the rotary blade 16 are respectively sprayed (see FIG. 3). For example, the flow rate of the cutting water 24 sprayed from the cutting water supply nozzle 18 is 4 L / min, the flow rate of the cooling water 25 sprayed from the cooling water supply nozzle 19 is 4 L / min, and the cleaning is sprayed from the cleaning water supply nozzle 20. The flow rate of water 26 is set to 2 L / min. The cutting water 24 is sprayed toward the processing point where the sealed substrate 1 and the rotary blade 16 come into contact. In FIG. 4B, in order to make it easy to understand the direction in which the cutting water 24 is jetted, the cutting water 24 (indicated by an arrow in the drawing) is shown in parallel with the rotary blade 16. Cutting waste and resin residue generated by cutting the sealed substrate 1 are discharged by the cutting water 24 and the cleaning water 26.

  FIG. 4B shows the case of using a so-called single spindle configuration cutting apparatus that cuts the sealed substrate 1 using one spindle 14, specifically, one rotary blade 16. . First, first cutting lines 4 i and 4 a (see FIG. 4A) at both ends set in the short direction of the sealed substrate 1 are cut by the rotary blade 16. By cutting the first cutting lines 4i and 4a at both ends in this way, unnecessary elongated end materials are first removed from the sealed substrate 1. Next, the first cutting lines 4b, 4c,..., 4h set on the sealed substrate 1 are sequentially cut from the left. By cutting all the first cutting lines 4, the cutting in the short direction is completed.

  4B, first, first cutting lines 4i and 4a at both ends set on the sealed substrate 1 were cut. Not limited to this, the first cutting lines 4a, 4b,..., 4i set on the sealed substrate 1 may be sequentially cut from the left.

  Next, as shown in FIG. 4C, the cutting table 7 is rotated 90 degrees by a rotating mechanism (not shown). Next, the sealed substrate 1 is cut along a plurality of second cutting lines 5 set in the longitudinal direction of the sealed substrate 1. First, the second cutting lines 5 d and 5 a (see FIG. 1A) at both ends set on the sealed substrate 1 are cut by the rotary blade 16. Next, the second cutting lines 5 b and 5 c are cut by the rotary blade 16. In this manner, each of the divided regions 6 is manufactured as a product P by cutting all of the first cutting line 4 and the second cutting line 5. Each product P is adsorbed by the respective adsorbing holes 11 provided in the cutting table 7.

  Also in FIG. 4C, first, the second cutting lines 5d and 5a at both ends set on the sealed substrate 1 were cut. Not limited to this, the second cutting lines 5a, 5b, 5c, and 5d set on the sealed substrate 1 may be sequentially cut.

  With reference to FIG. 5, an operation for removing the residue accumulated in the plurality of first cutting grooves 12 and the plurality of second cutting grooves 13 formed in the suction jig 9 included in the cutting table 7 will be described. To do. As shown in FIG. 5A, when cutting of the sealed substrate 1 is continued, a plurality of first cutting grooves 12 and a plurality of second cutting grooves 13 formed in the suction jig 9 are formed. Then, cutting waste, resin residue, and the like gradually accumulate as the residue 27. In particular, when moisture in the first cutting groove 12 and the second cutting groove 13 evaporates due to maintenance of the cutting device, a factory holiday, etc., the residue 27 adheres firmly to the inner surface of the groove. .

  As shown in FIG. 5A, first, in a state where the sealed substrate 1 is not placed on the cutting table 7, the position where the lower end of the rotary blade 16 is slightly away from the bottom of the cutting groove 12. The spindle 14 (see FIG. 3 (a)) is lowered until it comes to. Specifically, it is preferable to lower the spindle 14 until the lower end of the rotary blade 16 floats about 0.1 mm to 0.2 mm from the bottom of the cutting groove 12. Next, for example, the rotary blade 16 is rotated at a high speed of 30,000 rpm / minute under the same conditions as when the sealed substrate 1 is cut. Next, the cutting table 7 is moved at a feed rate of 60 mm / sec in the + Y direction (see FIG. 3B) (from the back to the front in FIG. 5A). The rotary blade 16 rotating at high speed is relatively moved along the plurality of first cutting grooves 12 formed in the short direction of the suction jig 9.

  When the rotary blade 16 is moved relatively, the cutting water 24 is cut from the cutting water supply nozzle 18, the cooling water 25 is cut from the cooling water supply nozzle 19, and the cleaning water 26 is cut from the cleaning water supply nozzle 20. Each is injected under the same conditions. The cutting water 24 rotates from the cutting water supply nozzle 18 by 4 L / min, the cooling water 25 from the cooling water supply nozzle 19, and the cleaning water 26 from the cleaning water supply nozzle 20 rotates by 2 L / min. It sprays toward the periphery of the blade 16 or the rotary blade 16, respectively. The residue 27 accumulated at the bottom of the cutting groove 12 is swept out by the rotary blade 16 rotating at high speed, and the residue 27 is discharged by the cutting water 24 and the cleaning water 26. Remaining from each cutting groove 12 by relatively moving the rotary blade 16 sequentially along the first cutting grooves 12b, 12c,..., 12h (see FIG. 2) formed in the suction jig 9. Object 27 is removed.

  Next, as shown in FIG. 5B, the cutting table 7 is rotated 90 degrees by a rotating mechanism (not shown). Next, the rotary blade 16 is relatively moved along the plurality of second cutting grooves 13 formed in the longitudinal direction of the suction jig 9. The rotary blade 16 is relatively moved along the second cutting grooves 13b and 13c. With the rotary blade 16, more specifically, with the processing water flowing at a high speed by the rotary blade 16, the residue 27 accumulated in the plurality of second cutting grooves 13 is peeled off from the inner surface of the second cutting groove 13. The residue 27 is discharged by the cutting water 24 and the cleaning water 26. In this way, the residue 27 accumulated in the second cutting grooves 13b and 13c is removed.

  In the first embodiment, using the same conditions as those for cutting the sealed substrate 1 except for the position where the spindle 14 is lowered, the first cutting grooves 12 and the plurality of first cutting grooves 12 of the suction jig 9 are used. The residue 27 accumulated in the two cutting grooves 13 was removed. Not only this but the rotation speed R of the rotary blade 16, the feed speed V of the cutting table 7, the flow rate of the cutting water 24, the cooling water 25, the cleaning water 26, etc. are changed, and the plurality of first cutting grooves 12 and The residue 27 accumulated in the plurality of second cutting grooves 13 can be removed. The positions where the spindles 14 are lowered are as close as possible to the inner bottom surfaces of the rotary blades 16 as long as the peripheral ends (lower ends in FIG. 5) do not contact the inner bottom surfaces of the first cutting groove 12 and the second cutting groove 13. It is preferable that the position is close. In particular, reducing the feed speed V of the cutting table 7 is effective in removing the residue 27.

  According to this embodiment, in the cutting apparatus, the cutting table 7 having the suction jig 9 fixed on the metal table 8 is provided. The suction jig 9 is provided with first cutting grooves 12 and second cutting grooves 13 corresponding to the positions of the plurality of first cutting lines 4 and the plurality of second cutting lines 5 of the sealed substrate 1, respectively. Provide. The lower end of the rotary blade 16 is lowered into the first cutting groove 12 and the second cutting groove 13 in a state where the sealed substrate 1 is not placed on the cutting table 7. Accumulated in the first cutting groove 12 and the second cutting groove 13 by relatively moving the rotary blade 16 along the plurality of first cutting grooves 12 and the plurality of second cutting grooves 13. The residue 27 is swept out, and the residue 27 is discharged by the cutting water 24 and the cleaning water 26. In the existing cutting apparatus, the residue 27 accumulated in the first cutting groove 12 and the second cutting groove 13 can be easily removed.

  Further, according to the present embodiment, the residue 27 accumulated in the first cutting groove 12 and the second cutting groove 13 is removed by bringing the rotary blade 16 rotating at a high speed into contact with the residue 27. Peel off and sweep away. Due to the mechanical force of the rotary blade 16, even the residue 27 that is firmly attached can be easily peeled off and swept out. Therefore, by using the rotary blade 16, it is possible to reliably remove the residue 27 that cannot be removed only with the machining water.

  Further, according to the present embodiment, the first cutting groove 12 and the second cutting can be performed using the existing cutting conditions as they are without adding new components and new functions to the existing cutting apparatus. The residue 27 accumulated in the groove 13 can be removed. Therefore, the residue 27 can be easily removed without improving the cutting apparatus and without generating costs. In addition, it is not necessary to remove the cutting table 7 from the cutting device and clean the suction jig 9. Therefore, the time required for maintenance of the cutting device can be reduced and the operating rate of the cutting device can be improved.

  With reference to FIG. 6, Example 2 of the cutting device based on this invention is demonstrated. The cutting device 28 shown in FIG. 6 divides the workpiece into a plurality of products P. The cutting device 28 includes a receiving unit A, a cutting unit B, an inspection unit C, and a storage unit D as components (modules). Each component (each unit A to D) is detachable and replaceable with respect to other components. The cutting device 28 is configured including the components A to D.

  The receiving unit A is provided with a prestage 29. The sealed substrate 1 corresponding to the object to be cut is received by the prestage 29 from the resin sealing device which is a device in the previous process. The sealed substrate 1 (for example, a BGA-type sealed substrate) is arranged on the prestage 29 with the surface on the substrate 2 side (see FIG. 1) facing up.

  The cutting device 28 is a single-cut table type cutting device. Therefore, the cutting unit B is provided with one cutting table 7. The cutting table 7 can be moved in the Y direction in the figure by the moving mechanism 30, and can be rotated in the θ direction by the rotating mechanism 31. The sealed substrate 1 is placed on the cutting table 7. The cutting unit B includes a substrate placement unit 32 and a substrate cutting unit 33.

  The substrate platform 32 is provided with an alignment camera 34. The camera 34 can move independently in the X direction in the substrate platform 32. In the sealed substrate 1, the alignment mark is detected by the camera 34, and a plurality of first cutting lines 4 and a plurality of second cutting lines 5 are set (see FIG. 1A).

  The substrate cutting part 33 is provided with two spindles 14A and 14B as cutting means. The cutting device 28 is a cutting device having a twin spindle configuration. The two spindles 14A and 14B are independently movable in the X direction. The two spindles 14A and 14B are provided with rotary blades 16A and 16B, respectively. These rotary blades 16A and 16B cut the sealed substrate 1 by rotating in a plane including the Y direction and the Z direction, respectively.

  Each spindle 14A, 14B is provided with a cutting water supply nozzle (not shown, see FIG. 3) for injecting the cutting water 24 to suppress frictional heat generated by the rotary blades 16A, 16B rotating at high speed. The cutting water 24 is sprayed toward the processing point where the rotary blades 16A and 16B cut the sealed substrate 1.

  The inspection unit C is provided with an inspection stage 35. The assembly 36 composed of a plurality of products P cut into pieces by cutting the sealed substrate 1 is collectively transferred to the inspection stage 35. The inspection stage 35 is configured to be movable in the X direction and to be rotatable about the Y direction. The assembly 36 made up of a plurality of separated products P is inspected by a camera 37 for inspection on the surface on the sealing resin 3 side and the surface on the substrate 2 side (see FIG. 1). Sorted out. The assembly 36 composed of the inspected products P is transferred to the index table 38. The inspection unit C is provided with a plurality of transfer mechanisms 39 for transferring the products P arranged on the index table 38 to the tray.

  The storage unit D is provided with a non-defective product tray 40 for storing non-defective products and a defective product tray 41 for storing defective products. The products P sorted into non-defective products and defective products by the transfer mechanism 39 are accommodated in the respective trays 40 and 41. Although only one tray 40, 41 is shown in FIG. 6, a plurality of trays 40, 41 are provided in the storage unit D.

  In the present embodiment, the control unit CTL for setting and controlling the operation of the cutting device 28 and the cutting conditions is provided in the receiving unit A. Not limited to this, the control unit CTL may be provided in another unit.

  In the present embodiment, the single-cut table type and twin-spindle cutting device 28 has been described. The present invention is not limited to this, and the present invention can also be applied to a twin-cut table type, twin-spindle-type cutting device, a single-cut table type, a single-spindle-type cutting device, or the like.

  In each embodiment, first, the sealed substrate 1 is cut along the first cutting line 4 formed in the short direction, and then the second cutting line 5 formed in the longitudinal direction. The sealed substrate 1 was cut along Not limited to this, as a modification, the sealed substrate 1 may be cut along the second cutting line 5, and then the sealed substrate 1 may be cut along the first cutting line 4. .

  Moreover, in each Example, the case where the pure water was used as the cutting water 24, the cooling water 25, and the washing water 26 was shown. Not only this but the cutting water 24, the cooling water 25, and the washing | cleaning water 26 can use the liquid containing additives, such as surfactant and a rust preventive agent other than a pure water.

  Moreover, in each Example, the case where the sealed board | substrate 1 containing a chip-shaped element as a to-be-cut | disconnected object was shown was shown. However, the present invention is not limited to this, and the present invention can be applied to the case where the next object to be cut is cut into pieces as the object to be cut other than the sealed substrate 1. First, a semiconductor wafer made of silicon or a compound semiconductor is singulated. Secondly, a product such as a chip resistor, a chip capacitor, or a chip-type sensor is manufactured by dividing a ceramic substrate on which circuit elements such as a resistor, a capacitor, and a sensor are built. In these two cases, a semiconductor wafer, a ceramic substrate, or the like corresponds to a substrate on which circuit elements corresponding to a plurality of regions are formed. Third, the resin molded product is singulated to produce optical components such as lenses, optical modules, and light guide plates. Fourth, it is a case where a general molded product is manufactured by dividing a resin molded product into individual pieces. The contents described so far can be applied to various cases including the above four cases.

  Moreover, in each Example, the case where the to-be-cut object which has a rectangular shape with a longitudinal direction and a transversal direction as a to-be-cut object was cut | disconnected was shown. The present invention is not limited to this, and the contents described so far can also be applied when cutting a workpiece having a square shape or cutting a workpiece having a substantially circular shape such as a semiconductor wafer. . Even when a wire saw or a band saw is used as the cutting means instead of the rotary blade 16, the contents described so far can be applied. In these cases, it is preferable to run the wire saw or the band saw parallel to the inner bottom surfaces of the first cutting groove 12 and the second cutting groove 13.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

1 Sealed substrate (object to be cut)
2 Substrate 3 Sealing resin 4, 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i First cutting line (cutting line)
5, 5a, 5b, 5c, 5d Second cutting line (cutting line)
6 Area 7 Cutting table (table)
8 Metal table (base)
9 Suction Jig 10 Projection 11 Suction Hole 12, 12b, 12c, 12d, 12e, 12e, 12f, 12g, 12h First Cutting Groove (Cut Groove)
13, 13b, 13c Second cutting groove (cutting groove)
14 Spindle 15 Rotating shaft 16 Rotating blade (cutting means)
17 Rotating blade cover 18 Cutting water supply nozzle (Cutting water supply mechanism)
19 Nozzle for cooling water supply 20 Nozzle for washing water supply (washing water supply mechanism)
DESCRIPTION OF SYMBOLS 21 Cutting water supply pipe 22 Cooling water supply pipe 23 Washing water supply pipe 24 Cutting water 25 Cooling water 26 Washing water 27 Residue 28 Cutting device 29 Prestage 30 Moving mechanism 31 Rotating mechanism 32 Substrate placing part 33 Substrate cutting part 34 Alignment Camera 35 Inspection Stage 36 Aggregation of Plural Products P 37 Inspection Camera 38 Index Table 39 Transfer Mechanism 40 Non-defective Product Tray 41 Defective Product Tray L1 Interval Between First Cutting Lines, First L2 Interval between cutting grooves L2 Interval between second cutting lines, Interval between second cutting grooves V Feed rate R Number of revolutions P Product A Receiving unit B Cutting unit C Inspection unit D Receiving unit CTL Control unit

Claims (12)

Placing a workpiece having a plurality of regions surrounded by a plurality of cutting lines on a table; relatively moving the table and the cutting means; and relatively moving the table and the cutting means The cutting means comprising: a step of cutting the workpiece using the cutting means by moving; and a step of supplying cutting water to a processing point where the cutting means and the workpiece are in contact with each other . A cutting method using a cutting device comprising :
Fixing the suction jig having a plurality of cutting grooves corresponding to the plurality of cutting lines on a base, and preparing the table;
Entering at least a portion of the cutting means into the cutting groove in a state where the object to be cut is not placed on the suction jig; and
Supplying the cutting water toward the cutting means in a state where the object to be cut is not placed on the suction jig;
Relatively moving the table and the cutting means along the cutting groove in a state where the object to be cut is not placed on the suction jig ;
And a step of causing machining water including the cutting water to flow by the cutting means that moves into the cutting groove and moves relative to the inside of the cutting groove when the workpiece is not placed on the suction jig. ,
The step of supplying the cutting water toward the cutting means, the step of relatively moving the table and the cutting means, and the step of flowing the working water are performed in parallel, so that the inside of the cutting groove The cutting method characterized by removing the residue in the said cutting groove with the said process water which flows in (2) . The cutting method according to claim 1 ,
A cutting method comprising a step of supplying cleaning water toward the periphery of the cutting groove in a state where the object to be cut is not placed on the suction jig. In the cutting method according to claim 1 or 2 ,
The cutting method, wherein the cutting device has a plurality of cutting means. In the cutting method described in any one of Claims 1-3 ,
The cutting method, wherein the suction jig is formed of a silicone resin or a fluorine resin. In the cutting method according to any one of claims 1 to 4 ,
The cutting method, wherein the object to be cut is a sealed substrate. In the cutting method according to any one of claims 1 to 4 ,
The cutting method according to claim 1, wherein the object to be cut is a substrate on which circuit elements respectively corresponding to the plurality of regions are formed. Placing a workpiece having a plurality of regions surrounded by a plurality of cutting lines on a table; relatively moving the table and the cutting means; and relatively moving the table and the cutting means The cutting means comprising: a step of cutting the workpiece using the cutting means by moving; and a step of supplying cutting water to a processing point where the cutting means and the workpiece are in contact with each other . A product manufacturing method for manufacturing a product corresponding to each of the regions by using a cutting device including :
Fixing the suction jig having a plurality of cutting grooves corresponding to the plurality of cutting lines on a base, and preparing the table;
Entering at least a portion of the cutting means into the cutting groove in a state where the object to be cut is not placed on the suction jig; and
Supplying the cutting water toward the cutting means in a state where the object to be cut is not placed on the suction jig;
Relatively moving the table and the cutting means along the cutting groove in a state where the object to be cut is not placed on the suction jig ;
And a step of causing machining water including the cutting water to flow by the cutting means that moves into the cutting groove and moves relative to the inside of the cutting groove when the workpiece is not placed on the suction jig. ,
The step of supplying the cutting water toward the cutting means, the step of relatively moving the table and the cutting means, and the step of flowing the working water are performed in parallel, so that the inside of the cutting groove Removing the residue in the cutting groove by the working water flowing in
In the step of cutting the workpiece, the workpiece is cut by the cutting means that moves relative to the table in a state where the workpiece is placed on the suction jig. A method for producing a product characterized by the above. In the manufacturing method of the product described in Claim 7 ,
A method for producing a product, comprising: supplying cleaning water toward the periphery of the cutting groove in a state where the object to be cut is not placed on the suction jig. In the manufacturing method of the product according to claim 7 or 8 ,
The method for manufacturing a product, wherein the cutting device has a plurality of cutting means. In the manufacturing method of the product according to any one of claims 7 to 9 ,
The method of manufacturing a product, wherein the suction jig is formed of a silicone resin or a fluorine resin. In the manufacturing method of the product as described in any one of Claims 7-10 ,
The method for manufacturing a product, wherein the object to be cut is a sealed substrate. In the manufacturing method of the product as described in any one of Claims 7-10 ,
The method for manufacturing a product, wherein the object to be cut is a substrate on which circuit elements respectively corresponding to the plurality of regions are formed.

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