KR20120030784A - Board dicing system and apparatus for supporting board - Google Patents

Abstract

PURPOSE: A system for cutting a substrate and an apparatus for supporting a substrate are provided to efficiently eliminate a scrap unit which is not required in a following process of a sawing process by dividing the substrate into units and discharging a part of the units. CONSTITUTION: A system for cutting a substrate includes a substrate cutting apparatus(1000) and a substrate support apparatus(3000). The substrate cutting apparatus cuts and divides the substrate into a plurality of units and sprays liquid when the substrate is cut. The substrate support apparatus includes a supporting pad(3100) with a plurality of partition walls supporting a lower part of the substrate. The substrate support apparatus includes an inflow groove to pass liquid through partial partition walls of the plurality of partition walls and form a water layer caused by the liquid on a partial area of a lower part of the substrate when the substrate is cut by the substrate cutting apparatus.

Description

Board Cutting System and Board Supporting Equipment {BOARD DICING SYSTEM AND APPARATUS FOR SUPPORTING BOARD}

The present invention relates to a substrate cutting system and a substrate support device. More specifically, the present invention relates to a substrate cutting system capable of discharging the scrap unit to the outside at the same time as the cutting operation when cutting the substrate into a plurality of units, and a substrate supporting device constituting the substrate cutting system.

In general, a semiconductor manufacturing process is mainly composed of a fabrication (FAB) process and an assembly process. In the FAB process, an integrated circuit is designed on a silicon wafer to form a semiconductor chip, and in the assembly process, a lead frame is attached to the semiconductor chip. , A soldering process for forming a wire bonding or solder ball for conducting electricity between the semiconductor chip and the lead frame, and a molding process using a resin such as epoxy, and the like, in order to perform a semiconductor strip ( A semiconductor substrate or a semiconductor package assembly, such as a strip) or a wafer level package (WLP), is formed.

Such a semiconductor substrate is mounted on a chuck table by a strip picker, transferred to a cutting device, and cut into individual units by cutting blades (rotary blades). Is transported to the place. A strip picker for transferring the semiconductor substrate to the chuck table, or a unit picker for transferring the individually separated units to the stacking part or the like is attached with a suction pad for vacuum adsorption of the semiconductor substrate or the semiconductor unit.

In addition, the chuck table may include a holder made of a metal material having a rectangular or disc shape and a rubber pad mounted on the holder to substantially support the semiconductor substrate so as to correspond to the shape of the semiconductor substrate.

As described above, the semiconductor substrate is cut into individual units by the cutting blade of the cutting device, and in this cutting process, an unnecessary unit may be generated that is not used in a subsequent process. For example, when the semiconductor substrate is a wafer, some of the units cut at the circumferential portion of the wafer may not have a perfect square plate shape. Such a unit is called a scrap unit, and since the scrap unit cannot be a perfect product, it must be properly disposed of during the process.

In order to process the scrap unit and to transfer only the completely cut good quality unit to the next process, conventionally, an air suction hole is formed on the lower surface of the strip picker corresponding to the portion cut into the good quality unit of the semiconductor scrap to adsorb only the good quality unit. I was using the method.

However, in the process of cutting the semiconductor substrate, the coolant injected to the rotating blades to cool the heat of the rotating blades remains on the good unit as well as the scrap unit, so that when the strip picker picks up the cut unit, The remaining moisture causes some of the scrap units to stick to the bottom of the strip picker.

In addition, even in the process of cutting the semiconductor substrate itself, there is a problem that if the scrap unit is not properly discharged or the position is not firmly fixed, it is attached onto the good unit due to the rotational force of the rotating blade.

An object of the present invention is to provide a substrate cutting system and a substrate supporting apparatus capable of discharging some units to the outside of the substrate supporting apparatus at the same time when cutting the substrate to divide the substrate into a plurality of units. .

In addition, the present invention is to solve the problem to provide a substrate cutting system and a substrate support apparatus that can supply only the desired unit without adding a separate process after the substrate is divided into a plurality of units.

However, the problem to be solved by the present invention is not limited to the above-mentioned problem, another task not mentioned will be clearly understood by those skilled in the art from the following description. .

In order to solve the above problems, the present invention includes a substrate cutting device configured to cut the substrate into a plurality of units, and spray the liquid when cutting the substrate, and a plurality of partition walls supporting the lower surface of the substrate. And a support pad for passing the liquid through the partition walls of some of the plurality of partition walls such that when the substrate is cut by the substrate cutting device, a water layer due to the liquid is formed in a portion of the lower surface of the substrate. Provided is a substrate cutting system including a substrate support device on which an inlet groove is formed.

Here, the substrate support device is provided with an air suction pipe passage configured to suck air through the support pad, wherein the plurality of partition walls are substrate adsorption support partition walls and the inlet grooves to shield the space in communication with the air suction pipe passage It may include a scrap partition wall is formed.

In this case, a cutting guide groove corresponding to the cutting line of the substrate is formed between the plurality of partition walls, the scrap partition wall is composed of at least two vertical walls, the inlet groove is formed in at least one of the vertical walls, The inflow groove is preferably in communication with the cutting guide groove.

The scrap partition wall may include an outer scrap partition wall supporting the outer portion of the substrate, and a portion of an upper surface of the outer scrap partition wall may be spaced apart from the lower surface of the substrate by a predetermined distance in a vertical direction.

More preferably, the predetermined distance may gradually increase as the distance away from the substrate in the horizontal direction.

In addition, the inflow groove may be formed obliquely in the direction in which the substrate cutting by the substrate cutting device proceeds toward the inside of the partition wall in which the inflow groove is formed.

In this case, the side surface of the inlet groove preferably forms a curved surface.

In addition, the lower surface of the inlet groove may be formed obliquely to the upper side of the partition wall toward the inner side of the partition in which the inlet groove is formed.

In this case, the lower surface of the inlet groove preferably forms a curved surface.

The substrate cutting apparatus may include a blade which is connected to a shaft and rotates at a high speed to cut the substrate, and a nozzle which sprays the liquid toward the blade to cool the heat generated when the substrate is cut.

In addition, the substrate cutting apparatus may be a laser-jet liquid apparatus configured to spray the liquid toward the substrate to generate a liquid column, and to cut the substrate by irradiating a laser beam into the liquid column.

Or, the substrate cutting device is a laser irradiation device for irradiating a laser beam toward the substrate to cut the substrate, and a liquid spray for injecting the liquid toward the substrate to cool the heat generated when cutting the substrate It may include a device.

In addition, in order to solve the above problems, the present invention provides a substrate aligning device for aligning and supplying a substrate, supporting the lower surface of the substrate supplied from the substrate aligning device, the substrate is cut and divided into a plurality of units A substrate supporting apparatus in which a water layer is formed in a portion of the lower surface of the substrate so that some of the plurality of units can be discharged to the outside, and a substrate which divides the substrate supported on the substrate supporting apparatus into the plurality of units. Provided is a substrate cutting system comprising a cutting device and a unit transfer device configured to carry out a unit remaining in the substrate support device of the plurality of units.

In addition, in order to solve the above problems, the present invention penetrates through a support pad having a plurality of partition walls configured to contact the lower surface of the substrate to support the substrate, a holder on which the support pad is seated, and the support pad. And an air suction pipe path communicating with a part of the space shielded by the plurality of partition walls, wherein the partition walls of some of the plurality of partition walls have inlet grooves formed therein for passing liquid from the outside. To provide.

According to the present invention, the substrate can be cut and divided into units, and at the same time, some units can be discharged, so that the scrap unit which is not required in the next step of the cutting process can be effectively removed.

In addition, according to the present invention, since no additional artificial process for removing the scrap unit is required during or after cutting the substrate, it is possible to reduce the processing cost and shorten the processing time. Therefore, mass productivity is improved.

1 shows a top view of a substrate cutting system in accordance with one embodiment of the present invention.
2 is an exploded perspective view of a substrate and a substrate support apparatus according to an embodiment of the present invention.
3 illustrates a perspective view of a substrate support apparatus according to an embodiment of the present invention.
4 is a cross-sectional view taken along the line III-III of the substrate supporting apparatus shown in FIG.
5 illustrates a state in which a substrate cutting system operates according to an embodiment of the present invention.
6 shows a substrate supporting apparatus according to another embodiment of the present invention.
Figure 7 shows a substrate support apparatus according to another embodiment of the present invention.
8 illustrates a substrate cutting system according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.

1 shows a top view of a substrate cutting system in accordance with one embodiment of the present invention.

Substrate cutting system 10000 according to an embodiment of the present invention is to cut the substrate (W, see Figure 2) divided into a plurality of units, substrate cutting apparatus 1000 configured to spray the liquid when cutting the substrate (W) And a lower surface of the substrate W and configured to form a water layer due to the liquid on a portion of the lower surface of the substrate W when the substrate W is cut by the substrate cutting device 1000. It may include a support device 3000.

The substrate W according to the present invention is a concept including all of the plates on which the electric circuit is organized, which is assumed to be cut into each unit by the substrate cutting system 1000. That is, the substrate W according to the present invention is a concept including both a strip of a square plate type, a wafer of a disc shape, and the like. However, hereinafter, for convenience of explanation, the substrate W will be described on the assumption that it is a wafer.

As shown in FIG. 1, the substrate cutting system 10000 may include a substrate aligning device 5000 for aligning and supplying a substrate (W). The substrate W may be a FAB (fabrication) process and an assembly (assembly) process. The substrate W, which has been subjected to the above processes, is stacked on a magazine or the like and then transferred to the substrate by a robot arm or the like. It is moved to the alignment device 5000 in sequence.

The substrate aligning device 5000 includes an alignment table 5100 on which the substrate W is mounted and a guide portion 5300 for guiding the mounting of the substrate W when the substrate W is transferred and mounted on the alignment table 5100. It may be made, including.

The substrate W is aligned in a direction, position, posture, etc. by the substrate aligning device 5000 so that the substrate W may be cut along a cutting line provided on the substrate W. FIG.

The completed substrate W is supplied to the substrate support apparatus 3000 by the substrate transfer apparatus 6000.

A suction pad configured to suck air at a high speed may be attached to a lower surface of the substrate transfer device 6000. Therefore, the aligned substrate W is vacuum-adsorbed to the lower surface of the substrate transfer device 6000.

Further, an inspection vision 6100 may be provided at one side of the substrate transfer apparatus 6000 to inspect the alignment state of the substrate W.

The substrate support apparatus 3000 supports the lower surface of the substrate W supplied from the substrate alignment apparatus 5000 by the substrate transfer apparatus 6000, and the substrate support apparatus 3000 is cut when the substrate W is cut and divided into a plurality of units. The water layer may be formed in a portion of the lower surface of the substrate W so that some of the two units may be discharged to the outside. The detailed structure of the substrate support apparatus 3000 will be described later.

When the substrate W is supplied to the substrate support apparatus 3000, the substrate cutting apparatus 1000 divides the substrate W supported on the substrate support apparatus 3000 into a plurality of units. The substrate cutting system 10000 according to the present exemplary embodiment includes a cutting transfer device for moving the substrate supporting apparatus 3000 along a cutting direction so that the substrate supporting apparatus 3000 may cut the substrate W along a cutting line thereof. 9000). A detailed description of the cutting process of the substrate W will be described later.

In addition, the substrate cutting system 10000 may include a unit transfer device 7000 configured to take out a unit remaining in the substrate support apparatus 3000 among the plurality of divided units after the cutting of the substrate W is completed. .

In detail, a suction pad configured to suck air at a high speed, such as the substrate transfer device 6000, may be attached to a bottom surface of the unit transfer device 7000. Therefore, the unit remaining in the substrate support apparatus 3000 may be vacuum-adsorbed to the lower surface of the substrate transfer apparatus 6000 and transferred toward the unit carry-out unit 2000.

The cleaner 2100 for blowing air may be provided on the unit discharge part 2000. As will be described later, the substrate cutting apparatus 1000 according to the present exemplary embodiment is configured to inject liquid when cutting the substrate W, and a unit after the cutting of the substrate W is completed by some of the liquid injected in the process. Since the cleaner 2100 may be buried in the air, the cleaner 2100 strongly ejects air to remove water remaining in the unit.

On the other hand, the substrate cutting system 10000 according to the present embodiment is to remove the cutting residue, moisture, etc. of the substrate W remaining on the substrate support device 3000 after the cutting of the substrate (W) and the transfer of the unit is completed. It may be provided with a brush 4000 to.

2 is an exploded perspective view of a substrate and a substrate support apparatus according to an embodiment of the present invention.

As shown in FIG. 2, the substrate support apparatus 3000 according to the exemplary embodiment includes a plurality of partitions 3110 configured to contact the bottom surface of the substrate W to support the substrate W. As shown in FIG. The support pad 3100, a holder 3300 on which the support pad 3100 is seated, and a portion of a space shielded by the plurality of partitions 3110 through the support pad 3100. It may include an air suction pipe (3500).

It is preferable that the cutting line Wcl is formed in the upper surface of the said board | substrate W. As shown in FIG. The cutting line Wcl of the substrate W according to the present embodiment is formed to form a lattice pattern. The substrate W is cut along the cutting line Wcl to be divided into a plurality of units U. FIG.

The plurality of units U divided from the substrate W may be divided into a good quality unit Ug and a scrap unit Us. The non-defective unit (Ug) is a unit that can be transferred to a post-process after cutting the substrate (W) and used as an actual material, and may be referred to as a seal unit. The scrap unit Us is a unit that cannot be used as an actual material and must be properly disposed of before being discharged or removed before being transported to a later process.

The scrap unit Us includes, but is not limited to, the shape of which does not form a square plate like the good unit Ug. That is, even if any unit U has a rectangular flat plate shape, it can be treated as the scrap unit Us in accordance with a manufacturer's request or a quality request.

On the other hand, the support pad 3100 is formed on a flat disc-shaped support plate 3130 and the support plate 3130 protruding upward and include a plurality of partitions 3110 for supporting the bottom surface of the substrate (W). Can be. The support plate 3130 and the plurality of partitions 3110 are preferably formed of a rubber material.

In some of the plurality of partitions 3110, an inflow groove (not shown) may be formed to allow the liquid to flow from the outside. More specifically, the inlet groove is formed to pass the liquid injected from the substrate cutting device 1000 (see FIG. 1). As such, the liquid from the substrate cutting apparatus 1000 may be introduced through the inflow groove so that a water layer may be formed on a portion of the lower surface of the substrate W, which will be described later.

The holder 3300 is for accommodating the support pad 3100, and preferably has a diameter larger than that of the support pad 3100. In addition, the holder 3100 may include a seating surface 3310 on which the support pad 3100 is seated.

Meanwhile, the substrate support apparatus 3000 may include an air suction pipe path 3500 formed through the support pad 3100. The air suction pipe path 3500 communicates with a part of a space shielded by the plurality of partitions 3110, and sucks air existing in a space sealed by the bottom surface and the partition wall of the substrate W ( W) for adsorbing to the support pad 3100. As shown in FIG. 2, the air suction pipe path 3500 may be formed through the mounting surface 3310 of the holder 3300 as well as the support pad 3100.

3 illustrates a perspective view of a substrate support apparatus according to an embodiment of the present invention.

As shown in FIG. 3, the substrate support apparatus 3000 according to the exemplary embodiment of the present invention includes an air suction pipe path 3500 configured to suck air through the support pad 3100 and includes a plurality of partition walls. 3110 is formed with a substrate adsorption support partition 3111 for shielding a space communicating with the air suction pipe path 3500 and an inflow groove 3700 for passing liquid injected from the substrate cutting device 1000 (see FIG. 1). It may include a scrap partition wall 3113.

The space communicating with the air suction pipe path 3500 is sealed by a substrate adsorption support barrier 3111 and a substrate W (see FIG. 2) supported on the substrate adsorption support barrier 3111. In this state, when the air suction pipe 3500 sucks air in the enclosed space, a vacuum is formed in the enclosed space so that the substrate W may be adsorbed on the substrate adsorption support partition 3111.

More specifically, a portion of the substrate W that is cut and becomes the good quality unit Ug (see FIG. 2) is supported to correspond to an upper portion of the adsorption support partition 3111, and is cut out of the substrate W to scrap the scrap. The portion that becomes the unit Us (refer to FIG. 2) is preferably supported correspondingly to the upper portion of the scrap partition 3113.

In this way, when the substrate W is cut by the substrate cutting device 1000 (refer to FIG. 1), the non-defective unit Ug is formed by the vacuum suction of the air suction pipe line 3500. Adsorbed to 3111, it is firmly supported.

On the other hand, the air suction pipe path as described above is not formed in the space formed by the scrap partition wall 3113 and the scrap unit Us supporting the scrap unit Us. This is because, as will be described later, the scrap unit Us is in a state capable of freely flowing on the scrap partition wall 3113 and must be discharged to the outside at the same time as the cutting of the substrate W. FIG.

Furthermore, when the substrate W is cut by the substrate cutting device 1000, the scrap unit Us is free to flow on the scrap partition 3113 by a water layer formed between the lower portion and the scrap partition 3113. It becomes the state that I can.

As such, the liquid forming the aqueous layer into the scrap partition 3113 so that the aqueous layer can be formed between the lower portion of the region to be the scrap unit Us and the upper portion of the scrap partition 3113 when the substrate W is cut. Needs to be introduced. To this end, the scrap partition wall 3113 may be formed with at least one inlet groove 3700 for passing the liquid injected from the substrate cutting device 1000.

In the substrate cutting system 10000 according to the present exemplary embodiment, since the substrate W is cut along the cutting line Wcl formed on the substrate W by the substrate cutting apparatus 1000, the cutting line Wcl of the substrate W is cut. The lower portion of the) is required to allow a space to allow the movement of a portion of the substrate cutting device (1000). Therefore, it is preferable that a cutting guide groove 3900 corresponding to the cutting line Wcl of the substrate is formed between the plurality of partitions 3110 in the support pad 3100.

As described above, since the substrate cutting apparatus 1000 according to the present exemplary embodiment cuts through the substrate W, a gap is formed by the cutting line Wcl of the substrate W, and the substrate is cut by the substrate cutting apparatus 1000. When the (W) is cut, the liquid injected from the substrate cutting apparatus 1000 flows into the cutting guide groove 3900.

The specific structure for introducing the liquid introduced into the cutting guide groove 3900 into the scrap partition 3113 is as follows.

Each scrap partition wall 3113 may include at least two vertical walls 3114, and the inflow groove 3700 may be formed in at least one of the vertical walls 314. More specifically, the inflow groove 3700 is in communication with the cutting guide groove 3900.

As described above, a cutting guide groove 3900 is formed between the scrap partition wall 3113 and the scrap partition wall 3113, and between the scrap partition wall 3113 and the suction support partition wall 3111 along the cutting guide groove 3900. The substrate cutting apparatus 1000 moves to supply liquid to the cutting guide groove 3900, and the liquid thus supplied flows into the scrap partition 3113 through the inflow groove 3700.

That is, the inflow groove 3700 may be formed in the vertical wall, which is in contact with the movement path of the substrate cutting device 1000, among the vertical walls 3114 constituting the scrap partition wall 3113.

4 is a cross-sectional view taken along the line III-III of the substrate supporting apparatus shown in FIG.

As shown in FIGS. 4 and 3, the scrap partition 3113 includes an outer scrap partition 3113 ′ supporting an outer portion of the substrate W, and a part of an upper surface of the outer scrap partition 3113 ′. The region is preferably spaced apart from the lower surface of the substrate W by a predetermined distance in the vertical direction.

The outer scrap partition wall 3113 ′ supports the outermost part of the scrap partition wall 3113 from the center of the substrate W, more specifically, when the substrate W is assumed to have a disk shape. Means bulkhead. That is, the outer scrap partition 3113 ′ is a scrap partition wall located farthest from the center of the support plate 3130 among the scrap partition walls 3113 protruding from the support plate 3130.

The scrap partition wall 3113 is configured to form a water layer between an upper portion of the upper surface and a lower surface of the substrate W to discharge the scrap unit located at the upper portion of the scrap partition wall 3113 to the outside when the substrate W is cut. Since a predetermined gap is formed between a portion of the upper surface of the outer scrap partition 3113 'and the lower surface of the substrate W as described above, the substrate W cut from the upper surface of the outer scrap partition 3113' is easy to the outside. Fall off.

More preferably, the predetermined distance may be configured to gradually increase as the horizontal distance away from the substrate (W).

That is, the upper surface of the outer scrap partition 3113 'is configured to have an inclined surface 3115' inclined downward.

With this configuration, the scrap unit supported on the upper surface of the exterior scrap partition wall 3113 'can be more easily discharged to the outside.

Hereinafter, a state in which the substrate cutting system configured as described above operates and an embodiment of the substrate cutting apparatus will be described in detail with reference to FIG. 5.

5 illustrates a state in which a substrate cutting system operates according to an embodiment of the present invention.

More specifically, FIG. 5A is a perspective view illustrating a state in which the substrate cutting system 10000 operates. In FIG. 5A, illustration of the substrate to be cut is omitted for convenience of description.

As shown in Figure 5 (a), the substrate cutting apparatus 1000 according to an embodiment of the present invention is connected to the shaft 1500 to cut the substrate (W, see Figure 5 (b)) by rotating at high speed The blade 1100 may include a nozzle 1300 for spraying liquid toward the blade 1100 to cool the heat generated when the substrate W is cut.

In addition, the substrate cutting apparatus 1000 may include a motor 1700 for driving the shaft 1500.

Preferably, at least two substrate cutting devices 1000 may be provided and disposed to be spaced apart from each other.

In the embodiment illustrated in FIG. 5A, the substrate cutting apparatus 1000 includes a first substrate cutting apparatus 1000a and a second substrate cutting apparatus 1000b spaced apart from each other. As such, by arranging a plurality of substrate cutting apparatuses 1000, the time required for the cutting operation can be reduced.

When the substrate W is supplied to the substrate support apparatus 3000 by the substrate transfer apparatus 6000 (see FIG. 1), the first and second substrate cutting apparatuses 1000a and 1000b may move the substrate W in the first direction. Cut along (①), transfer the pitch by one pitch in the second direction (②) and repeat the process of cutting along the first direction (①) again.

To this end, the substrate cutting system 10000 according to the present exemplary embodiment includes a cutting transfer device 9000 which reciprocally transfers the substrate support device 3000 in the first direction ① when the substrate cutting device 1000 operates. It may include.

In addition, each time the substrate support apparatus 3000 is transported by one stroke by the cutting transfer apparatus 9000, the substrate cutting apparatus 1000 is moved in the second direction ② different from the first direction ①. It may be configured to be transported.

That is, when the substrate support device 3000 is transferred in the first direction ① by one stroke, two cutting lines parallel to the first direction ① of the cutting lines Wcl provided on the substrate W may be provided. Since the cutting is completed, the substrate cutting apparatus 1000 is transferred by one pitch in the second direction ② to start the cutting in the first direction ① again.

Here, the first direction (1) and the second direction (②) preferably correspond to the direction of the cutting line (Wcl) to cross at right angles to each other. That is, the first direction ① and the second direction ② may be perpendicular to each other.

On the other hand, when the cutting of the substrate W along the cutting line parallel to the first direction (①) is completed, the substrate supporting device 3000 is not cut along the cutting line parallel to the second direction (②). ) Should be rotated 90 °.

Therefore, the substrate cutting system 10000 further includes a cutting rotating device (not shown) which rotates the substrate support device 3000 in a direction different from the specific direction when the cutting of the substrate W is completed in any particular direction. It is desirable to.

5B is a partial cross-sectional view illustrating a state in which the substrate cutting system 10000 operates.

As shown in FIG. 5 (b), while cutting the substrate W into the blade 1100 of the substrate cutting device, a lot of heat is generated due to friction between the blade 1100 and the substrate W rotating at high speed. Will occur.

Thus, as shown in FIG. 5A, the nozzle 1300 sprays the liquid toward the blade 1100 for cooling purposes, which is the substrate W cut by the blade 1100. It may be introduced into the inlet groove 3700 formed in the scrap partition 3113 through the gap of the. Herein, the liquid flowing into the inflow groove 3700 has a very high speed due to the strong jetting force of the nozzle 1300 and the high speed rotation of the blade 1100.

As such, a liquid having a high speed flows into the scrap partition 3113 through the inflow groove 3700, so that a portion of the substrate W supported on the scrap partition 3113 is fixed by the liquid. Injured as much.

As a result, a water layer is formed on the upper part of the scrap partition wall 3113 and the lower part of the substrate W, particularly in the lower part of the region to be the scrap unit Us after cutting of the substrate W, so that the scrap unit Us is a scrap partition wall ( At the top of 3113, the state is freely flowable.

That is, in the state where there is almost no restraining force between the scrap unit Us and the scrap partition 3113, the mechanical vibration generated by the high speed rotation of the blade 1100 or the liquid ejected from the nozzle 1300 Due to the high speed, the scrap unit Us naturally discharges to the outside of the substrate support apparatus 3000.

As described above, according to the present invention, the scrap unit Us is simultaneously cut at the same time as the cutting of the substrate W without applying an external force or removing a separate process to remove the scrap unit Us. Since it falls from the outside, mass productivity improves.

At this time, the space enclosed by the substrate adsorption support bulkhead 3111 and the lower surface of the substrate W is in a vacuum state by the action of the air suction pipe line 3500, so that the product unit Ug is connected to the substrate adsorption support partition 3111. It is firmly adsorbed and fixed.

Therefore, according to one embodiment of the present invention, after the cutting is completed by the substrate cutting device 1000, only the good unit Ug remains on the substrate support device 3000, and the scrap unit Us is all removed, thereby transferring the unit. The problem due to the remaining of the scrap unit Us does not arise when the device 7000 transfers the cut unit.

Hereinafter, various embodiments of a substrate support apparatus to a substrate cutting apparatus according to the present invention will be described with reference to FIGS. 6 to 8.

6 shows a substrate supporting apparatus according to another embodiment of the present invention. More specifically, Figure 6 (a) is a perspective view showing an enlarged portion of the substrate support and substrate cutting apparatus according to the present embodiment, Figure 6 (b) is a plan view of the scrap partition wall according to the present embodiment, Figure 6 (c) is a plan view of a scrap partition wall according to an embodiment different from FIG. 6 (b).

6 (a) and 6 (b), the inlet groove 3700a according to the present embodiment faces the inside of the partition 3113 in which the inlet groove 3700a is formed. It is characterized by being formed obliquely in the direction in which the substrate cutting by (1000) proceeds.

Here, the direction in which the substrate is cut is indicated by a straight arrow in Figs. 6 (b) and 6 (c).

As such, when the shape of the inflow groove 3700a is formed obliquely in the direction in which the substrate is cut, the relative speed between the substrate moving device 3000 and the substrate cutting device 1000 and the velocity of the liquid injected from the nozzle 1300 are determined. The direction of the synthesized speed and the opening direction of the inflow groove 3700a may be substantially the same. Therefore, even though the liquid is introduced through the inflow groove 3700a, the liquid can be introduced in a short time, so that the formation of the water layer is facilitated.

Furthermore, as shown in FIG. 6C, the inflow groove 3700a 'may be formed such that the side surface of the inflow groove 3700a' forms a curved surface.

In this case, in addition to the advantages of the inflow groove 3700a shown in FIG. 6 (b), when the liquid flows into the inflow groove 3700a ', the velocity of the inflow groove 3700a' impinges on the side thereof. It can compensate for the reduction. Furthermore, in the case of the shape of the inflow groove 3700a 'shown in FIG. 6C, since more liquid can flow into the scrap partition 3113, the amount of liquid that can form the water layer There is an advantage to increase.

Figure 7 shows a substrate support apparatus according to another embodiment of the present invention. More specifically, more specifically, Figure 7 (a) is a perspective view showing an enlarged portion of the substrate support device and the substrate cutting device according to the present embodiment, Figure 7 (b) is a cross-sectional view of Figure 7 (a) It is a side sectional view of the scrap partition wall cut | disconnected by the line, and FIG.7 (c) is a side sectional view which shows another Example of the scrap partition wall which cut | disconnected FIG.7 (a) by the Ⅶ-Ⅶ line.

As shown in FIGS. 7A and 7B, the lower surface 3710b of the inflow groove 3700b according to the present embodiment faces the inside of the partition 3113 on which the inflow groove 3700b is formed. As a result, it is characterized by being formed obliquely to the upper side of the partition 3133.

As such, when the shape of the inflow groove 3700b is obliquely formed upward, when the liquid is injected from the substrate cutting device 1000 and flows into the inflow groove 3700b, there is an effect of rising flow. Therefore, even if the amount of liquid flowing through the inflow groove 3700b is small, the amount of liquid reaching the upper portion of the scrap partition 3113 does not change significantly, so that the water layer is stably formed regardless of the amount of liquid supplied. can do. In addition, due to the generation of the upward flow due to the shape of the inflow groove 3700b, a force for floating a portion of the substrate W may be stronger.

Furthermore, as shown in FIG. 7C, the inflow groove 3700b 'may be formed such that the lower surface 3710b' of the inflow groove 3700b 'forms a curved surface.

In this case, in addition to the advantages of the inflow groove 3700b shown in FIG. 7 (b), when the liquid flows into the inflow groove 3700b ', it collides with the lower surface 3710b' of the inflow groove 3700b '. It is possible to prevent a decrease in speed which may be caused by friction.

In the above, different examples of the inflow grooves have been described with reference to FIGS. 6 and 7, but the shape of the inflow grooves is not limited to that shown in FIG. 6 or 7, and the inflow grooves 3700a or 3700a ′ of FIG. 6. Obviously, the inlet grooves 3700b or 3700b 'of FIG. 7 may be formed in a mixed shape.

8 illustrates a substrate cutting system according to another embodiment of the present invention.

As shown in FIG. 8 (a), the substrate cutting apparatus 1000 ′ sprays liquid toward the substrate W to generate a liquid column 1100 ′ and into the liquid column 1100 ′. It may be a laser-jet liquid apparatus configured to cut the substrate (W) by irradiating the laser beam 1300 '.

The laser beam 1300 'for cutting the substrate W is preferably an Nd: YAG laser having a wavelength of 1.06 mu m and an output of 100 W, for example. The power range of the laser can range from several watts to kilowatts. Other types of lasers can be used depending on the type of application. The laser beam 1300 ′ is irradiated toward the substrate W and cuts the substrate W along a predetermined cutting line.

As shown in FIG. 8 (a), the laser beam 1300 ′ is irradiated into the liquid column 1100 ′, and the liquid column 1100 ′ guides the progress of the laser beam 1300 ′. The injection pressure of the injection liquid can be set between several bar to several thousand bar, and preferably set to a pressure of 50-100 bar. The width of the liquid column 1100 'is set in the range of millimeters or less, and is generally set between 5-500 µm, preferably 20-500 µm.

When the Nd: YAG laser is used as the laser beam 1300 ', the liquid constituting the liquid column 1100' is preferably water, and other liquids may be mixed as necessary. As a liquid mixed with water, a conductive liquid or a nonconductive liquid can be used. As a liquid to be mixed with the injection liquid, oil such as silicone oil can be mixed.

FIG. 8B illustrates a substrate cutting apparatus 1000 ″ having a device for irradiating a laser beam 1300 ″ and a device for spraying liquid 1100 ″ separately provided in FIG. 8 (a). Illustrated.

That is, as shown in FIG. 8B, the substrate cutting apparatus 1000 ″ of the present embodiment irradiates a laser beam 1300 ″ toward the substrate W to cut the substrate W. FIG. Laser irradiation device 1500 '' and a liquid spraying device 1700 '' for injecting liquid 1100 '' toward the substrate W to cool the heat generated when the substrate W is cut. It can be done by.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

1000: substrate cutting device 1100: blade
1300: nozzle 3000: substrate support device
3100: support pad 3110: bulkhead
3111: substrate adsorption support bulkhead 3113: scrap partition wall
3700, 3700a, 3700b: Inflow Groove

Claims (14)

A substrate cutting device configured to cut a substrate and divide the substrate into a plurality of units, and to spray liquid when cutting the substrate; And
And a support pad having a plurality of partition walls for supporting a lower surface of the substrate, wherein the plurality of partitions form a water layer due to the liquid on a portion of the lower surface of the substrate when the substrate is cut by the substrate cutting device. And a substrate support device formed with an inflow groove for allowing the liquid to pass through a portion of the partition walls. The method of claim 1,
The substrate support apparatus is provided with an air suction pipe passage configured to suck air through the support pad,
The plurality of barrier ribs may include a substrate adsorption support barrier that shields a space communicating with the air suction pipe passage, and a scrap barrier rib formed with the inlet groove. The method of claim 2,
Cutting guide grooves corresponding to the cutting lines of the substrate are formed between the plurality of partition walls,
The scrap partition wall is composed of at least two vertical walls,
The inlet groove is formed in at least one of the vertical walls,
And the inlet groove is in communication with the cutting guide groove. The method of claim 2,
The scrap partition wall includes an outer scrap partition wall for supporting the outer portion of the substrate,
And a portion of an upper surface of the outer scrap partition wall is spaced apart from the lower surface of the substrate by a predetermined distance in a vertical direction. The method of claim 4, wherein
And said predetermined distance gradually increases as it moves away from said substrate in a horizontal direction. The method of claim 1,
The inlet groove is formed in an oblique direction in the direction in which the substrate cutting by the substrate cutting device proceeds toward the inside of the partition in which the inlet groove is formed. The method of claim 6,
And a side surface of the inlet groove forms a curved surface. The method of claim 1,
And a lower surface of the inflow groove is formed obliquely to an upper side of the partition wall toward the inner side of the partition wall in which the inflow groove is formed. The method of claim 8,
The lower surface of the inlet groove is a substrate cutting system, characterized in that forming a curved surface. The method of claim 1,
The substrate cutting device,
A blade connected to a shaft to cut the substrate by rotating at a high speed; And
And a nozzle for injecting the liquid toward the blades to cool the heat generated during cutting of the substrate. The method of claim 1,
The substrate cutting device,
And a laser-injection liquid apparatus configured to eject the liquid toward the substrate to generate a liquid column, and to cut the substrate by irradiating a laser beam into the liquid column. The method of claim 1,
The substrate cutting device,
A laser irradiation device for irradiating a laser beam toward the substrate to cut the substrate; And
And a liquid spraying device for injecting the liquid toward the substrate to cool the heat generated during the cutting of the substrate. A substrate aligning device for aligning and supplying a substrate;
A water layer is formed on a portion of the lower surface of the substrate to support a lower surface of the substrate supplied from the substrate aligning device and to allow some of the plurality of units to be discharged to the outside when the substrate is cut and divided into a plurality of units. A substrate support apparatus formed thereon;
A substrate cutting device that divides the substrate supported on the substrate supporting device into the plurality of units; And
And a unit transfer device configured to take out a unit remaining in the substrate support device among the plurality of units. A support pad having a plurality of partition walls configured to contact the bottom surface of the substrate and support the substrate;
A holder on which the support pad is seated; And
And an air suction pipe passage passing through the support pad and communicating with a part of a space shielded by the plurality of partition walls.
Substrate support device is formed in the partition of the plurality of partitions of the inlet groove for passing the liquid flowing from the outside.

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