JP6866038B2 - Manufacturing method of packaged device - Google Patents

Description

The present invention relates to a method for manufacturing a package device for manufacturing a plurality of package devices by dividing a resin package substrate containing a mold resin.

In electronic devices such as mobile phones and personal computers, a device chip including a device such as an electronic circuit is an indispensable component. In the device chip, for example, the surface of a wafer made of a semiconductor material such as silicon is partitioned by a plurality of scheduled division lines (streets), devices are formed in each region, and then the wafer is divided along the planned division lines. Obtained at.

The device chip obtained by the above method is fixed to a mother substrate for CSP (Chip Size Package), electrically connected by a method such as wire bonding, and then the surface side is molded with a mold resin. It is sealed. By sealing the device chip with the mold resin to form the package device in this way, the device chip can be protected from external factors such as impact, light, heat, and water.

In recent years, a method of covering the surface and side surfaces of the device chip with a mold resin has also been studied (see, for example, Patent Document 1). In this method, first, a groove is formed along a planned division line set on the surface side of the wafer. Next, the surface side of the wafer is covered with a mold resin to complete the resin package substrate. At this time, the mold resin is also filled in the groove of the wafer. Then, by dividing the resin package substrate along the groove, a package device in a state where the surface and side surfaces of the device chip are covered with the mold resin can be obtained.

In this method, since the side surface of the device chip is not exposed to the outside, the resistance to the above-mentioned external factors is further increased. When dividing the wafer into package devices along the groove, it is preferable to apply ablation processing by a laser beam. In this ablation process, the width (cutting allowance) of the mold resin removed is narrower than that of cutting with a cutting blade, so the width of the planned division line can be set narrower and the number of package devices can be increased. ..

JP-A-2002-100709

By the way, there is a large difference between the coefficient of linear expansion (coefficient of thermal expansion) of the mold resin used when sealing the wafer or the device chip and the coefficient of linear expansion of the wafer or the device chip. Therefore, in order to prevent the resin package substrate from warping due to the difference in the coefficient of linear expansion, a granular filler made of silica or the like is mixed in the mold resin.

However, the laser beam emitted during the ablation process for dividing the package substrate is absorbed by the mold resin but hardly absorbed by the filler. Therefore, the exposed filler may remain on the side surface of the completed package device. If this filler falls off later, it adversely affects the manufacturing process of other products, which is a problem.

The present invention has been made in view of such problems, and an object of the present invention is to provide a method for manufacturing a package device capable of preventing the filler mixed in the mold resin from falling off.

According to one aspect of the present invention, it is a method of manufacturing a package device for manufacturing a plurality of package devices by dividing a resin package substrate containing a mold resin mixed with a filler, and the resin package substrate is stretched over an opening of an annular frame. A fixing step of fixing the resin package substrate to the adhesive tape, and after the fixing step, a laser beam having a wavelength that is absorbent to the mold resin and transparent to the filler is applied to the resin package substrate. By irradiating the mold resin of the above, removing a part of the mold resin, and forming a groove having a width exceeding the size of the filler, the resin package substrate is divided into a plurality of package devices. Then, a cleaning fluid is supplied to the exposed portion of the divided resin package substrate including the groove, mixed with a part of the mold resin removed in the dividing step, and not removed in the dividing step. Provided is a method of manufacturing a packaged device comprising a cleaning step of removing the filler remaining in the groove from the groove.

In one aspect of the present invention described above, the resin package substrate comprises a mold substrate obtained by coating a device chip with the mold resin and an interposer substrate that overlaps the mold substrate, and before the division step, A liquid resin coating step of applying a liquid resin to the exposed surface of the interposer substrate to form a protective film is further included, and in the fixing step, the mold substrate side of the resin package substrate is fixed to the adhesive tape. In the division step, a laser beam having a wavelength that is absorbent to the interposer substrate is irradiated from the surface side of the interposer substrate to form a first groove for dividing the interposer substrate, and then the first groove is formed. The bottom of the first groove is irradiated with a laser beam having a wavelength that is absorbent to the mold resin and transparent to the filler, and is connected to the first groove to divide the mold resin. A second groove may be formed, and in the cleaning step, the protective film may be removed from the surface of the interposer substrate while removing the filler remaining in the groove without being removed in the dividing step from the groove. ..

Further, in one aspect of the present invention described above, the fluid is water, and it is preferable to supply the water to the exposed portion at a pressure of 5 MPa or more and 12 MPa or less in the washing step.

In the method for manufacturing a package device according to one aspect of the present invention, when the resin package substrate is divided into a plurality of package devices, a groove having a width exceeding the size of the filler contained in the mold resin is formed. Is exposed, and the filler with at least both ends (two places) fixed to the mold resin does not remain in the groove. That is, the filler in a state that is difficult to remove by subsequent cleaning does not remain in the groove.

Therefore, by supplying the cleaning fluid to the groove, the filler remaining in the groove at the time of division into the package device can be removed from the groove. Therefore, the filler does not fall off from the completed package device. As described above, according to one aspect of the present invention, there is provided a method for manufacturing a package device capable of preventing the filler mixed in the mold resin from falling off.

1 (A) and 1 (B) are perspective views showing a fixing step. 2 (A) and 2 (B) are cross-sectional views showing a liquid resin coating step. FIG. 3 (A) is a cross-sectional view showing how the interposer substrate is divided in the division step, and FIG. 3 (B) shows an enlarged state after the interposer substrate is divided in the division step. It is a cross-sectional view. FIG. 4 (A) is a cross-sectional view showing how the mold substrate is divided in the division step, and FIG. 4 (B) is an enlarged sectional view showing a state after the mold substrate is divided in the division step. Is. 5 (A) is a cross-sectional view showing a cleaning step, and FIG. 5 (B) is an enlarged cross-sectional view showing a state after the cleaning step. FIG. 6A is a perspective view showing a fixing step according to a modified example, and FIG. 6B is an enlarged cross-sectional view showing a state after the fixing step according to the modified example. FIG. 7 (A) is an enlarged cross-sectional view showing the state after the division step according to the modified example, and FIG. 7 (B) is an enlarged cross-sectional view showing the state after the cleaning step according to the modified example. It is a figure.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. The method for manufacturing the package device according to the present embodiment includes a fixing step (see FIGS. 1A and 1B), a liquid resin coating step (see FIGS. 2A and 2B), and a dividing step. (See FIGS. 3 (A), 3 (B), 4 (A), 4 (B)), and a cleaning step (see FIGS. 5 (A), 5 (B)).

In the fixing step, the resin package substrate containing the mold resin is fixed to the adhesive tape stretched on the opening of the annular frame. In the liquid resin coating step, a liquid resin is applied to the resin package substrate to form a protective film. In the division step, the resin package substrate is irradiated with a laser beam to divide the resin package substrate into a plurality of package devices. Specifically, the resin package substrate is divided into a plurality of package devices by forming a groove having a width exceeding the size of the filler mixed in the mold resin.

In the cleaning step, a cleaning fluid is supplied to the exposed portion of the resin package substrate including the groove, and the filler remaining in the groove without being removed in the dividing step is removed from the groove. In this cleaning step, the protective film formed in the liquid resin coating step is also removed. Hereinafter, the method for manufacturing the package device according to the present embodiment will be described in detail.

In the present embodiment, first, a fixing step of fixing the resin package substrate is performed. 1 (A) and 1 (B) are perspective views showing a fixing step. As shown in FIGS. 1A and 1B, the resin package substrate 1 used in the present embodiment includes a disk-shaped mold substrate 3 and a disk-shaped interposer substrate 5 that overlaps the mold substrate 3. And, including.

The mold substrate 3 is formed, for example, by coating a plurality of device chips (not shown) with a mold resin 3b (see FIG. 3B). Granular filler 3c made of silica or the like (see FIG. 3B) is mixed in the mold resin 3b in order to suppress the warp of the resin package substrate 1 due to the difference in the coefficient of linear expansion (coefficient of thermal expansion). Has been done.

The interposer substrate 5 is a wafer made of a semiconductor material such as silicon (Si). The surface 5a side of the interposer substrate 5 is divided into a plurality of regions 15 by scheduled division lines (streets) 13 set in a grid pattern, and each region 15 is connected to a device chip in the mold substrate 3. Wiring, terminals, etc. are provided. The device chip is arranged only at a position corresponding to each region 15 and does not overlap the planned division line 13 in a plan view.

However, there are no restrictions on the material, shape, structure, size, etc. of the resin package substrate 1 (mold substrate 3, interposer substrate 5). A resin package substrate made of other materials such as semiconductors, ceramics, resins, and metals can also be used. Further, a WL-CSP (Wafer Level Chip Size Package) substrate or the like obtained by sealing the surface side of the wafer with a mold resin may be used as the resin package substrate 1.

As shown in FIG. 1A, in the fixing step of the present embodiment, the center of the circular adhesive tape 7 having a diameter larger than that of the resin package substrate 1 is located on the surface 3a side of the mold substrate 3 included in the resin package substrate 1. Paste the part. Further, the outer peripheral portion of the adhesive tape 7 is attached to the first surface 9a side of the annular frame 9 having an opening having a diameter larger than that of the resin package substrate 1. Specifically, the adhesive surface 7a of the adhesive tape 7 is brought into close contact with the surface 3a of the mold substrate 3 and the first surface 9a of the frame 9.

As a result, the resin package substrate 1 is fixed to the adhesive tape 7 stretched in the opening of the annular frame 9 with the surface 5a of the interposer substrate 5 exposed. That is, the resin package substrate 1 is supported by the frame 9 via the adhesive tape 7. In the present embodiment, the adhesive tape 7 having a shape and size corresponding to the frame 9 is used. For example, after the band-shaped adhesive tape is attached to the resin package substrate (mold substrate) and the frame, the adhesive tape 7 is used. The adhesive tape may be cut according to the shape of the frame.

After the fixing step, a liquid resin coating step of coating the resin package substrate 1 with a liquid resin to form a protective film is performed. Specifically, a liquid resin is applied to the surface 5a side of the interposer substrate 5 included in the resin package substrate 1 to form a protective film. 2 (A) and 2 (B) are cross-sectional views showing a liquid resin coating step.

The liquid resin coating step is performed using, for example, the spin coater 2 shown in FIG. 2 (A) or the like. The spin coater 2 includes a spinner table 4 for holding the resin package substrate 1. The spinner table 4 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the vertical direction.

A part of the upper surface of the spinner table 4 is a holding surface 4a for holding the resin package substrate 1. The holding surface 4a is formed substantially flat and horizontally, and is connected to a suction source (not shown) via a suction path 4b or the like provided inside the spinner table 4. A plurality of clamps 6 for fixing the frame 9 are provided around the spinner table 4. Further, above the spinner table 4, a nozzle 8 for dropping the liquid resin 17 which is a raw material of the protective film is arranged.

In the liquid resin coating step, first, the non-adhesive surface 7b of the adhesive tape 7 attached to the resin package substrate 1 is brought into contact with the holding surface 4a of the spinner table 4. By applying the negative pressure of the suction source in this state, the resin package substrate 1 is held on the spinner table 4 with the surface 5a side of the interposer substrate 5 exposed upward.

Next, as shown in FIG. 2A, the liquid resin 17 is dropped from the nozzle 8 moved above the resin package substrate 1 toward the resin package substrate 1. Further, the spinner table 4 is rotated to coat the entire surface 5a side of the interposer substrate 5 with the liquid resin 17. As a result, the protective film 19 shown in FIG. 2 (B) is completed. The clamp 6 fixes the frame 9 by utilizing the centrifugal force generated by the rotation of the spinner table 4.

There are no particular restrictions on the type of resin 17 that is the raw material for the protective film 19. In the present embodiment, a resin 17 that is substantially transparent in the visible region is used so that the planned division line 13 of the interposer substrate 5 can be appropriately detected and processed in a later division step. Further, in the present embodiment, the water-soluble resin 17 is used so that the protective film 19 can be easily removed in the subsequent cleaning step.

The amount of the resin 17 dropped onto the resin package substrate 1 is adjusted within a range in which a protective film 19 having a thickness of 5 μm or less can be formed, for example. When the diameter of the resin package substrate 1 is 4 inches, for example, 10 to 15 ml, typically about 12 ml of resin 17, may be dropped onto the resin package substrate 1. The rotation speed of the spinner table 4 is, for example, 2000 rpm to 3000 rpm, and the rotation time of the spinner table 4 is, for example, 20 seconds to 40 seconds, typically about 30 seconds.

After the liquid resin coating step, a division step of dividing the resin package substrate 1 into a plurality of package devices is performed. Specifically, the resin package substrate 1 is irradiated with a laser beam, and the resin package substrate 1 is ablated to divide the resin package substrate 1 into a plurality of package devices.

FIG. 3A is a cross-sectional view showing how the interposer substrate 5 is divided in the division step, and FIG. 3B is an enlarged view of the state after the interposer substrate 5 is divided in the division step. It is sectional drawing which shows. Further, FIG. 4A is a cross-sectional view showing how the mold substrate 3 is divided in the division step, and FIG. 4B is an enlarged view of the state after the mold substrate 3 is divided in the division step. It is sectional drawing which shows.

The division step is performed using, for example, the laser processing apparatus 12 shown in FIGS. 3 (A), 4 (A), and the like. The laser processing apparatus 12 includes a chuck table 14 for holding the resin package substrate 1. The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the vertical direction.

A moving mechanism (not shown) is provided below the chuck table 14. The chuck table 14 moves in the machining feed direction (first horizontal direction) and the index feed direction (second horizontal direction) by this moving mechanism.

A part of the upper surface of the chuck table 14 is a holding surface 14a for holding the resin package substrate 1. The holding surface 14a is connected to a suction source (not shown) via a suction path 14b or the like formed inside the chuck table 14. A plurality of clamps 16 for fixing the frame 9 are provided around the chuck table 14.

A laser irradiation unit 18 is arranged above the chuck table 14. The laser irradiation unit 18 irradiates and condenses laser beams 18a and 18b pulse-oscillated by a laser oscillator (not shown) at predetermined positions, for example. The laser oscillator includes a laser beam 18a having a wavelength that is absorbent to the interposer substrate 5, and a laser beam 18b having a wavelength that is absorbent to the mold resin 3b and transparent to the filler 3c. Is configured to be able to selectively oscillate a pulse.

In the dividing step, first, the non-adhesive surface 7b of the adhesive tape 7 attached to the resin package substrate 1 is brought into contact with the holding surface 14a of the chuck table 14. At the same time, the frame 9 is fixed by the clamp 16. By applying the negative pressure of the suction source in this state, the resin package substrate 1 is held on the chuck table 14 with the protective film 19 side exposed upward.

After that, the chuck table 14 is rotated and moved to adjust the positional relationship between the resin package substrate 1 and the laser irradiation unit 18. Then, the interposer substrate 5 is ablated along the scheduled division line 13. Specifically, as shown in FIG. 3A, while irradiating the laser beam 18a from the laser irradiation unit 18, the chuck table 14 is moved so that the laser beam 18a is irradiated along the scheduled division line 13. Let me.

As described above, the laser beam 18a irradiated from the laser irradiation unit 18 has absorbency to the interposer substrate 5. Therefore, as shown in FIG. 3A, the interposer substrate 5 is ablated by irradiating the laser beam 18a from the surface 5a side of the interposer substrate 5 along the scheduled division line 13, and FIG. 3B ), The first groove 5b for dividing the interposer substrate 5 is formed along the scheduled division line 13.

Here, the width of the first groove 5b is set so as to exceed the size of the filler 3c mixed in the mold resin 3b. Specifically, for example, it is desirable to set the width of the first groove 5b to 1.2 times or more the particle size of the filler 3c (for example, the average particle size). This allows the filler 3c to be properly removed in a later cleaning step. The particle size of the filler 3c is arbitrarily set, but is typically about 5 μm to 25 μm.

After repeating the above-mentioned operation to form the first groove 5b along all the scheduled division lines 13, the mold substrate 3 is ablated along the first groove 5b. Specifically, as shown in FIG. 4A, the chuck table 14 irradiates the laser beam 18b from the laser irradiation unit 18 so that the laser beam 18b is irradiated along the bottom of the first groove 5b. To move.

As described above, the laser beam 18b irradiated from the laser irradiation unit 18 has absorbency to the mold resin 3b and has transparency to the filler 3c. Therefore, as shown in FIG. 4A, the mold resin 3b of the mold substrate 3 can be ablated by irradiating the laser beam 18b from the surface 5a side of the interposer substrate 5 along the bottom of the first groove 5b. ..

On the other hand, with the laser beam 18b as described above, the filler 3c of the mold substrate 3 can hardly be ablated. Therefore, as shown in FIG. 4B, the irradiation of the laser beam 18b forms the second groove 3d which is connected to the first groove 5d and divides the mold substrate 3 (mold resin 3b), while the second groove 3d is formed. In the 2 grooves 3d, the filler 3c in a state where a part is exposed from the mold resin 3b remains.

Here, the width of the second groove 3d is set so as to exceed the size of the filler 3c mixed in the mold resin 3b. Specifically, for example, it is desirable to set the width of the second groove 3d to 1.2 times or more the particle size (for example, average particle size) of the filler 3c. As a result, the filler 3c remaining in the second groove 3d can be appropriately removed in a later cleaning step.

When the second groove 3d is formed along all the scheduled division lines 13 and the resin package substrate 1 is divided into the plurality of package devices 21 by repeating the above-mentioned operation, the division step ends. In the present embodiment, since the surface 5a side of the interposer substrate 5 is covered with the protective film 19, debris generated during the ablation process hardly adheres to the surface 5a of the interposer substrate 5. Absent. Therefore, a high quality package device 21 can be obtained.

After the division step, a cleaning step is performed in which a cleaning fluid is supplied to the exposed portion of the resin package substrate 1 including the first groove 5b and the second groove 3d to clean the resin package substrate 1. 5 (A) is a cross-sectional view showing a cleaning step, and FIG. 5 (B) is an enlarged cross-sectional view showing a state after the cleaning step.

The cleaning step is performed using, for example, the cleaning device 22 shown in FIG. 5 (A) or the like. The cleaning device 22 includes a spinner table 24 for holding the resin package substrate 1. The spinner table 24 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the vertical direction.

A part of the upper surface of the spinner table 24 is a holding surface 24a for holding the resin package substrate 1. The holding surface 24a is formed substantially flat and horizontally, and is connected to a suction source (not shown) via a suction path 24b or the like provided inside the spinner table 24. A plurality of clamps 26 for fixing the frame 9 are provided around the spinner table 24. A nozzle 28 for injecting a cleaning fluid is arranged above the spinner table 24.

In the cleaning step, first, the non-adhesive surface 7b of the adhesive tape 7 attached to the resin package substrate 1 is brought into contact with the holding surface 24a of the spinner table 24. By applying the negative pressure of the suction source in this state, the resin package substrate 1 is held on the spinner table 24 with the protective film 19 side exposed upward.

Next, as shown in FIG. 5A, the spinner table 24 is rotated to inject the cleaning fluid 23 toward the resin package substrate 1 from the nozzle 28 moved above the resin package substrate 1. As a result, the resin package substrate 1 can be cleaned by supplying a cleaning fluid to the exposed portion of the resin package substrate 1 including the first groove 5b and the second groove 3d. The clamp 26 fixes the frame 9 by utilizing the centrifugal force generated by the rotation of the spinner table 24.

There are no particular restrictions on the type of cleaning fluid 23, injection pressure, etc., but in this embodiment, water is used as the cleaning fluid 23, and the injection pressure is 5 MPa or more and 12 MPa or less. As a result, the filler 3c in a state where a part of the filler 3c is exposed from the mold resin 3b can be removed from the second groove 3d without causing a problem with the package device 21.

Table 1 shows the results of investigating the injection pressure when water is used as the cleaning fluid 23.

As shown in Table 1, when the pressure is 3 MPa, the filler 3c remains in the second groove 3d. On the other hand, when the pressure is 14 MPa, the package device 21 is peeled off from the adhesive tape 7 and scattered. Therefore, when water is used as the cleaning fluid 23, it is desirable that the injection pressure be 5 MPa or more and 12 MPa or less. More preferably, it is 10 MPa or more and 12 MPa or less.

In the present embodiment, as described above, the protective film 19 is formed by using the water-soluble resin 17. Therefore, by using water as the cleaning fluid 23, the filler 3c remaining in the second groove 3d without being removed in the dividing step is removed from the second groove 3d, and the protective film is removed from the surface 5a of the interposer substrate 5. 19 can be removed. As the cleaning fluid 23, a mixed fluid (two fluids) in which water and air are mixed can also be used.

As described above, in the method for manufacturing a package device according to the present embodiment, when the resin package substrate 1 is divided into a plurality of package devices 21, the width exceeds the size of the filler 3c contained in the mold resin 3b. Since the two grooves 3d (and the first groove 5b) are formed, the filler 3c in a state where the central portion is exposed and at least both end portions (two places) are fixed to the mold resin 3b does not remain in the second groove 3d. .. That is, the filler 3c, which is difficult to remove by subsequent cleaning, does not remain in the second groove 3d.

Therefore, by supplying the cleaning fluid 23 to the second groove 3d, the filler 3c remaining in the second groove 3d at the time of division into the package device 21 is removed from the second groove 3d (and the first groove 5b). it can. Therefore, the filler 3c does not fall off from the completed package device 21.

The present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, in the above embodiment, the resin package substrate 1 composed of the mold substrate 3 and the interposer substrate 5 is divided to manufacture a plurality of package devices 21, but a plurality of resin package substrates 21 of other embodiments are produced. Packaged devices can also be manufactured.

FIG. 6A is a perspective view showing a fixing step according to a modified example, and FIG. 6B is an enlarged cross-sectional view showing a state after the fixing step according to the modified example. Further, FIG. 7 (A) is an enlarged cross-sectional view showing a state after the division step according to the modified example, and FIG. 7 (B) is an enlarged view of the state after the cleaning step according to the modified example. It is sectional drawing which shows.

As shown in FIGS. 6A and 6B, the resin package substrate 31 used in the modified example is a disk-shaped device wafer 33 and a mold resin that covers the surface 33a side of the device wafer 33 and the like. It includes a film 35 and a spherical electrode 37 exposed from the mold resin film 35.

The device wafer 33 is separated into a plurality of chips by grooves 33c formed in a grid pattern, and a device 39 such as an IC (Integrated Circuit) is provided on the surface 33a side of each chip. On the other hand, the mold resin film 35 is composed of the mold resin 35a and the granular filler 35b mixed in the mold resin 35a, is filled in the groove 33c, and is a central portion (device) on the surface 33a side of the device wafer 33. The area where 39 is provided) is covered. The electrode 37 is connected to the terminal of the device 39.

In the fixing step according to the modification, the central portion of the circular adhesive tape 7 having a diameter larger than that of the resin package substrate 31 is attached to the back surface 33b side of the device wafer 33 included in the resin package substrate 31. Further, the outer peripheral portion of the adhesive tape 7 is attached to the first surface 9a side of the annular frame 9 having an opening having a diameter larger than that of the resin package substrate 31.

Specifically, the adhesive surface 7a of the adhesive tape 7 is brought into close contact with the back surface 33b of the device wafer 33 and the first surface 9a of the frame 9. As a result, the resin package substrate 31 is fixed to the adhesive tape 7 stretched in the opening of the annular frame 9 with the mold resin film 35 and the electrodes 37 exposed. That is, the resin package substrate 31 is supported by the frame 9 via the adhesive tape 7.

After the fixing step, a dividing step is performed. The division step according to the modified example can be performed by using the laser processing apparatus 12 shown in FIGS. 3 (A), 4 (A), and the like. In this division step, first, the non-adhesive surface 7b of the adhesive tape 7 attached to the resin package substrate 31 is brought into contact with the holding surface 14a of the chuck table 14. At the same time, the frame 9 is fixed by the clamp 16. By applying the negative pressure of the suction source in this state, the resin package substrate 31 is held on the chuck table 14 in a state where the mold resin film 35 and the electrode 37 are exposed upward.

After that, the chuck table 14 is rotated and moved to adjust the positional relationship between the resin package substrate 31 and the laser irradiation unit 18. Then, the mold resin film 35 is ablated along the groove 33c. Specifically, while irradiating the laser beam 18b from the laser irradiation unit 18, the chuck table 14 is moved so that the laser beam 18b is irradiated along the groove 33c.

Here, the laser beam 18b irradiated from the laser irradiation unit 18 has absorbency with respect to the mold resin 35a and has transparency with respect to the filler 35b. Therefore, the mold resin 35a of the mold resin film 35 can be ablated by irradiating the laser beam 18b from the surface side of the mold resin film 35 along the groove 33c.

On the other hand, with the laser beam 18b as described above, the filler 35b of the mold resin film 35 can hardly be ablated. Therefore, as shown in FIG. 7A, the irradiation of the laser beam 18b forms a groove 35c that divides the mold resin film 35 (mold resin 35a), while a part of the groove 35c is molded. The filler 35b exposed from the resin 35a remains.

Here, the width of the groove 35c is set so as to exceed the size of the filler 35b mixed in the mold resin 35a. Specifically, for example, it is desirable to set the width of the groove 35c to 1.2 times or more the particle size (for example, average particle size) of the filler 35b. As a result, the filler 35b remaining in the groove 35c can be appropriately removed in a later cleaning step.

When the above-mentioned operation is repeated, grooves 35c are formed along all the grooves 33c, and the resin package substrate 31 is divided into a plurality of package devices 41, the division step ends.

After the division step, a cleaning step is performed in which the cleaning fluid is supplied to the exposed portion of the resin package substrate 31 including the groove 35c to clean the resin package substrate 31. The cleaning step according to the modified example can be performed by using the cleaning device 22 shown in FIG. 5A or the like.

In this cleaning step, first, the non-adhesive surface 7b of the adhesive tape 7 attached to the resin package substrate 31 is brought into contact with the holding surface 24a of the spinner table 24. By applying the negative pressure of the suction source in this state, the resin package substrate 31 is held on the spinner table 24 with the mold resin film 35 and the electrode 37 exposed upward.

Next, the spinner table 24 is rotated to inject the cleaning fluid 23 toward the resin package substrate 31 from the nozzle 28 moved above the resin package substrate 31. As a result, the cleaning fluid 23 can be supplied to the exposed portion of the resin package substrate 31 including the groove 35c to clean the resin package substrate 31.

There are no particular restrictions on the type of cleaning fluid 23, injection pressure, etc., but in this embodiment, water is used as the cleaning fluid 23, and the injection pressure is 5 MPa or more and 12 MPa or less. As a result, the filler 35b in a state where a part of the filler 35b is exposed from the mold resin 35a can be removed from the groove 35c without causing a problem with the package device 41.

In addition, the structure, method, etc. according to the above-described embodiment and modification can be appropriately modified and implemented as long as the scope of the object of the present invention is not deviated.

1 Resin package substrate 3 Mold substrate 3a Surface 3b Mold resin 3c Filler 3d 2nd groove 5 Interposer substrate 5a Surface 5b 1st groove 7 Adhesive tape 7a Adhesive surface 7b Non-adhesive surface 9 Frame 9a 1st surface 13 Scheduled division line (street) )
15 area 17 resin 19 protective film 21 package device 23 fluid 31 resin package substrate 33 device wafer 33a front surface 33b back surface 33c groove 35 mold resin film 35a mold resin 35b filler 35c groove 37 electrode 39 device 41 package device 2 spin coater 4 spinner table 4a Holding surface 4b Suction path 6 Clamp 8 Nozzle 12 Laser processing device 14 Chuck table 14a Holding surface 14b Suction path 16 Clamp 18 Laser irradiation unit 18a, 18b Laser beam 22 Cleaning device 24 Spinner table 24a Holding surface 24b Suction path 26 Clamp 28 Nozzle

Claims (3)

A method for manufacturing a package device in which a resin package substrate containing a mold resin mixed with a filler is divided to manufacture a plurality of package devices.
A fixing step of fixing the resin package substrate to the adhesive tape stretched on the opening of the annular frame, and
After the fixing step, one of the mold resins is irradiated with a laser beam having a wavelength that is absorbent to the mold resin and transparent to the filler. A division step of dividing the resin package substrate into a plurality of package devices by removing the portion and forming a groove having a width exceeding the size of the filler.
A cleaning fluid is supplied to the exposed portion of the divided resin package substrate including the groove, mixed with a part of the mold resin removed in the dividing step, and not removed in the dividing step into the groove. A method for manufacturing a package device, comprising: a cleaning step of removing the remaining filler from the groove. The resin package substrate includes a mold substrate in which a device chip is coated with the mold resin, and an interposer substrate that overlaps the mold substrate.
Prior to the division step, a liquid resin coating step of applying a liquid resin to the exposed surface of the interposer substrate to form a protective film is further included.
In the fixing step, the mold substrate side of the resin package substrate is fixed to the adhesive tape.
In the division step, a laser beam having a wavelength capable of absorbing the interposer substrate is irradiated from the surface side of the interposer substrate to form a first groove for dividing the interposer substrate, and then the interposer substrate is divided. A laser beam having a wavelength that is absorbent to the mold resin and transparent to the filler is applied to the bottom of the first groove, and the laser beam is connected to the first groove to divide the mold resin. Form 2 grooves,
The cleaning step according to claim 1, wherein the protective film is removed from the surface of the interposer substrate while removing the filler remaining in the groove without being removed in the dividing step from the groove. How to manufacture packaged devices. The fluid is water
The method for manufacturing a package device according to claim 1 or 2, wherein in the washing step, the water is supplied to the exposed portion at a pressure of 5 MPa or more and 12 MPa or less.

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