CN105280554A - Cutting Device And Cutting Method - Google Patents
Cutting Device And Cutting Method Download PDFInfo
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- CN105280554A CN105280554A CN201510378174.6A CN201510378174A CN105280554A CN 105280554 A CN105280554 A CN 105280554A CN 201510378174 A CN201510378174 A CN 201510378174A CN 105280554 A CN105280554 A CN 105280554A
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- cutting
- cut
- thing
- shearing device
- cutting groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a cutting device and a cutting method. In a cutting device, the remains accumulated in cutting grooves of an adsorption clamp are easily removed. In the cutting device, a cutting workbench for fixing the adsorption clamp onto a metal workbench is set. A first cutting groove and a second cutting groove corresponding to the position of a first cutting wire and a second cutting wire of a package substrate are respectively set on the adsorption clamp. Under the state that the package substrate is not disposed on the cutting workbench, the lower end of a rotary blade is lowered to the inside of the first cutting groove and the second cutting groove. The rotating rotary blade moves relatively along the first cutting groove and the second cutting groove while supplying cutting water, thereby removing the remains accumulated in the first cutting groove and the second cutting groove; and the rotary blade and the cutting water are used to discharge the remains. In existing cutting devices, the remains accumulated in the first cutting groove and the second cutting groove can be easily removed.
Description
Technical field
The present invention relates to a kind of by cutting off cut-off thing to manufacture shearing device through multiple products of singualtion and cutting-off method.
Background technology
The substrate be made up of printed base plate and lead frame etc. is divided into cancellate multiple region in virtual manner, and the element of mounting core sheet (such as in regional, semiconductor chip) after, substrate substrate entirety being carried out to resin-encapsulated is called base plate for packaging.Cut off base plate for packaging by using the shut-off mechanism that rotates sword etc., and be product by regional unit singualtion.
In the past, use shearing device and the regulation region of passing through to rotate the shut-off mechanisms such as sword and cutting off base plate for packaging.Such as, by cutting off BGA (BGA Package, BallGridArrayPackage) product with under type.First, base plate for packaging is fixed on cut-out workbench.Then, base plate for packaging is aimed at (contraposition).By aiming at, set the position of the virtual cutting line for dividing multiple region.Then, the cut-out workbench of fixing base plate for packaging and shut-off mechanism is made relatively to move.Place of incision to base plate for packaging sprays and cuts water, and cuts off base plate for packaging by shut-off mechanism along the cutting line be set on base plate for packaging.The product manufactured through singualtion by cutting off base plate for packaging.
Cut-out workbench has metallic work table and is fixed on the suction jig on metallic work table.Suction jig is provided with and adsorbs respectively and remain potted the jut of multiple tablelands shape in multiple regions of substrate.The adsorption hole from the through suction jig in the surface of jut and metallic work table is respectively arranged with at multiple jut.The multiple cutting grooves corresponding with the position of multiple cutting lines in each region for dividing base plate for packaging are provided with each other at jut.By making cut-out workbench and shut-off mechanism relatively move, thus carry out singualtion along multiple cutting groove cut-out base plate for packaging.
The cut-out bits produced by cutting off base plate for packaging and resin slag are cut the discharges such as water.But cut-out bits and resin slag are not fully drained, and are gradually accumulated in the bottom surface of cutting groove as residue.When residue is accumulated to a certain degree in cutting groove, because the rotation sword cut off in base plate for packaging process contacts with residue, residue is swept out.Be attached to base plate for packaging due to the residue be swept out or on the product of singualtion, become the reason of pollution (contamination).Therefore, the residue be accumulated in cutting groove is regularly removed very important.
As the fixture of cut-off substrate of manufacturing time that can shorten product substrate, propose just like lower clamp (such as, paragraph [0009], [0021] and Fig. 2, Fig. 3 with reference to patent documentation 1): " (summary) possesses: placement section, for the cut-off substrate of placement; Insert groove, inserts for the blade cutting off described cut-off substrate; And removal unit, for removing the crushing material in described insert groove ", and " (summary) is formed with the opening 46a of multiple water supply holes (removal unit, fluid bore) 46 of the lower end penetrating into metal level M from this bottom surface in the bottom surface of insert groove 45 ".
Patent documentation 1: JP 2012-004225 publication
But there are the following problems in the fixture 40 of substrate cut-off disclosed in patent documentation 1.As shown in Fig. 2 and Fig. 3 of patent documentation 1, insert groove 45 is made up of the sidewall of resin bed R (placement section 41) and the upper surface of metal level M.In addition, the opening 46a of multiple water supply holes (removal unit, fluid bore) 46 of the lower end penetrating into metal level M from this bottom surface is formed in the bottom surface of insert groove 45.Four limits of water supply hole 46 and a placement section 41 are provided with three accordingly.In addition, the interval of adjacent water supply hole 46 is such as set to below 1mm.Thus, can to each position of insert groove 45 evenly and carry out by the water supply to insert groove 45 in water hole 46 fully.
In this fixture 40, the adjacent water supply hole 46 being spaced apart below 1mm is formed multiple (paragraph [0021] with reference to patent documentation 1) in insert groove 45.But, very difficult technically with the multiple water supply hole of the gap-forming of below 1mm 46.Therefore, be difficult to stably make fixture 40.And then the expense making fixture 40 improves.
Summary of the invention
The present invention solves the above problems, and its object is to provides a kind of shearing device and cutting-off method, in shearing device, without the need to the function that new structural element and the water supply etc. such as additional water supply hole are new, can remove the residue in the cutting groove of suction jig simply.
In order to solve the above problems, shearing device involved in the present invention possesses: workbench, and for the cut-off thing of placement, described cut-off thing has the multiple regions surrounded by multiple cutting line; Cutting unit, for cutting off described cut-off thing; Travel mechanism, relatively moves for making described workbench and described cutting unit; And cut water feed mechanism, processed supply for contacting to described cutting unit with described cut-off thing cuts water, described shearing device is used when by carrying out singualtion to manufacture the product corresponding with region described in each to described cut-off thing, the feature of described shearing device is to possess:
Base, is arranged on described workbench;
Suction jig, is fixed on described base; And
Multiple cutting groove, is arranged on described suction jig, and corresponding with the position of described multiple cutting line under the state being placed with described cut-off thing on described suction jig,
Under the state that described suction jig is not placed with described cut-off thing, the inside entering into described cutting groove at least partially of described cutting unit, described cutting water is supplied towards described cutting unit from described cutting water feed mechanism, and described workbench and described cutting unit relatively move along described cutting groove, remove the residue in the inside of described cutting groove thus.
Shearing device involved in the present invention has following execution mode:
Possesses the rinse water feed mechanism for the periphery supply rinse water to described cutting groove.
In addition, shearing device involved in the present invention has following execution mode,
Described shearing device has multiple described cutting unit.
In addition, shearing device involved in the present invention has following execution mode,
Described suction jig is formed by silicon system resin or fluorine resin.
In addition, shearing device involved in the present invention has following execution mode,
Described cut-off thing is base plate for packaging.
In addition, shearing device involved in the present invention has following execution mode,
Described cut-off thing is the substrate of the circuit element including corresponding multiple described region respectively.
In order to solve the above problems, cutting-off method involved in the present invention comprises: the cut-off thing with the multiple regions surrounded by multiple cutting line is placed operation on the table; Make the operation of described workbench and cutting unit relatively movement; By making described workbench and described cutting unit relatively move, thus use described cutting unit to cut off the operation of described cut-off thing; And to contact to described cutting unit with described cut-off thing processedly supply the operation of cutting water, the feature of described cutting-off method is, comprising:
The operation of described workbench is prepared by the suction jig fixedly on base with multiple cutting grooves corresponding with described multiple cutting line;
The operation entering into the inside of described cutting groove at least partially of described cutting unit is made under the state that described suction jig is not placed with described cut-off thing;
Cut the operation of water towards described cutting unit supply under the state that described suction jig is not placed with described cut-off thing; And
Make described workbench and described cutting unit relatively move along described cutting groove under the state that described suction jig is not placed with described cut-off thing, remove the operation of the residue in the inside of described cutting groove thus.
Cutting-off method involved in the present invention has following execution mode,
Be included in the operation towards the periphery supply rinse water of described cutting groove under the state described suction jig not being placed with described cut-off thing.
In addition, cutting-off method involved in the present invention has following execution mode,
Described shearing device has multiple cutting unit.
In addition, cutting-off method involved in the present invention has following execution mode,
Described suction jig is formed by silicon system resin or fluorine resin.
In addition, cutting-off method involved in the present invention has following execution mode,
Described cut-off thing is base plate for packaging.
In addition, cutting-off method involved in the present invention has following execution mode,
Described cut-off thing is the substrate of the circuit element including corresponding multiple described region respectively.
According to the present invention, in shearing device, possess: workbench, for the cut-off thing of placement, described cut-off thing has the multiple regions surrounded by multiple cutting line; Cutting unit, for cutting off cut-off thing; Travel mechanism, relatively moves for making workbench and cutting unit; And cut water feed mechanism, cut water for processed supply theed contact with cut-off thing to cutting unit.The suction jig that workbench has base and is fixed on the base.The multiple cutting grooves corresponding with the position of multiple cutting line are formed on suction jig.Under the state that suction jig is not placed with cut-off thing, make the inside entering into multiple cutting groove at least partially of cutting unit.Cut water from cutting water feed mechanism towards cutting unit supply, and cutting unit is relatively moved along multiple cutting groove, the residue in multiple cutting groove can be removed thus.
Accompanying drawing explanation
Fig. 1 is the schematic diagram representing the base plate for packaging used in the embodiment 1 of shearing device involved in the present invention, and (a) of Fig. 1 is the vertical view observed from substrate-side, and (b) of Fig. 1 is front view.
Fig. 2 is the schematic diagram representing the cut-out workbench corresponding with the base plate for packaging shown in Fig. 1, and (a) of Fig. 2 is vertical view, and (b) of Fig. 2 is front view.
Fig. 3 is the schematic diagram of the general configuration of each nozzle that the shearing device represented in embodiment 1 has, (a) of Fig. 3 is the vertical view rotating sword periphery, and (b) of Fig. 3 observes the schematic cross sectional views rotating sword from the side contrary with axle.
(a) to (c) of Fig. 4 is the schematic cross sectional views carrying out the process of singualtion by cutting off base plate for packaging.
(a) to (b) of Fig. 5 rotates by using the schematic cross sectional views that sword removes the process of the residue in the cutting groove being accumulated in the suction jig shown in Fig. 2.
Fig. 6 is the vertical view of the general configuration representing shearing device in the embodiment 2 of shearing device involved in the present invention.
Embodiment
As shown in Figure 5, in shearing device 28, the cut-out workbench 7 be fixed on by suction jig 9 on metallic work table 8 is set.In suction jig 9, first cutting groove 12 and second cutting groove 13 corresponding with the first cutting line 4 of base plate for packaging 1 and the position of the second cutting line 5 is set respectively.Under the state that cut-out workbench 7 is not placed with base plate for packaging 1, the lower end of rotation sword 16 is made to drop to the inside of the first cutting groove 12 and the second cutting groove 13.Supply makes the rotation sword 16 of rotation relatively move along the first cutting groove 12 and the second cutting groove 13 while cutting water 24, scan out the residue 27 be accumulated in the first cutting groove 12 and the second cutting groove 13 thus, and discharge residue 27 by rotating sword 16 and cutting water 24.In existing shearing device 28, easily can remove the residue 27 be accumulated in the first cutting groove 12 and the second cutting groove 13.
(embodiment 1)
Referring to figs. 1 through Fig. 5, the embodiment 1 of shearing device involved in the present invention is described.To arbitrary figure in present specification, all suitably omit for ease of understanding or exaggerate schematically to describe.Identical Reference numeral is used for identical structural element, and suitably omits the description.
As shown in Figure 1, base plate for packaging 1 has the substrate 2 be made up of printed base plate and lead frame etc., the potting resin 3 being installed in the multiple shaped like chips parts (not shown) in multiple regions that substrate 2 has and being formed in the mode covering multiple region in the lump.Base plate for packaging 1 is the cut-off thing eventually through cutting off singualtion.
As shown in (a) of Fig. 1, base plate for packaging 1 is set with multiple first cutting line 4 and multiple second cutting lines 5 along its length of broad ways respectively in virtual manner.Each product is become through singualtion by the multiple regions 6 surrounded by multiple first cutting line 4 and multiple second cutting line 5.In (a) of Fig. 1, be such as set with in the direction of the width nine the first cutting line 4a, 4b ..., 4i, be set with in the longitudinal direction four the second cutting line 5a, 5b ..., 5d.Therefore, be formed with three regions 6 in the direction of the width, and be formed with eight regions 6 in the longitudinal direction, add up to and be formed with 24 cancellate regions 6.Regional 6 is equivalent to product.
The interval of the first cutting line 4 interval each other such as cutting line 4b and cutting line 4c is set to L1.The interval of the second cutting line 5 interval each other such as cutting line 5b and cutting line 5c is set to L2.Therefore, the regional 6 being equivalent to product has the area of L1 × L2.Region 6 to be formed on base plate for packaging 1 can be set arbitrarily according to the size of the product through singualtion and quantity.
As shown in Figure 2, cut-out workbench 7 is the workbench for carrying out singualtion by cutting off base plate for packaging 1 in shearing device.The suction jig 9 that cut-out workbench 7 such as has metallic work table 8 and is fixed on metallic work table 8.Preferred suction jig 9 is such as formed by silicon system resin or fluorine resin etc.Be provided with in suction jig 9 and adsorb respectively and remain potted the jut 10 of multiple tablelands shape in the multiple regions 6 in substrate 1.The adsorption hole 11 of through suction jig 9 and metallic work table 8 from the surface of jut 10 is respectively arranged with in multiple jut 10.
With multiple first cutting line 4 in the multiple regions 6 for dividing base plate for packaging 1 shown in Fig. 1 and multiple second cutting line 5 accordingly, be respectively arranged with multiple first cutting groove 12 and multiple second cutting groove 13 each other at jut 10.Multiple first cutting groove 12 is formed along the Width of suction jig 9, and multiple second cutting groove 13 is formed along the length direction of suction jig 9.Specifically, with the first cutting line 4b be set on the Width of base plate for packaging 1,4c ..., 4h (with reference to (a) of Fig. 1) accordingly, be formed respectively in suction jig 9 first cutting groove 12b, 12c ..., 12h.Accordingly, in suction jig 9, second cutting groove 13b, 13c is formed with respectively with second cutting line 5b, 5c be set on the length direction of base plate for packaging 1 ((a) with reference to Fig. 1).For first cutting line 4a, 4i on the most edge being set in base plate for packaging 1 and second cutting line 5a, 5d, the space being formed in the outside of the jut 10 on the most peripheral of suction jig 9 has the effect identical with cutting groove.The degree of depth of multiple first cutting groove 12 and multiple second cutting groove 13 (from the upper surface of jut 10 to the distance of the upper surface of suction jig 9) is set to about 0.5mm ~ 1.0mm.
The interval of the first cutting groove 12 interval each other (distance between centers) such as cutting groove 12b and cutting groove 12c is set to L1.The interval of the second cutting groove 13 interval each other such as cutting groove 13b and cutting groove 13c is set to L2.And be arranged on the first cutting line 4 on base plate for packaging 1 interval L1 each other and the second cutting line 5 interval L2 each other accordingly, in suction jig 9, the first cutting groove 12 interval is each other set to L1, and the second cutting groove 13 interval is each other set to L2.
In addition, concerning embodiment 1, in suction jig 9, the cutting groove corresponding with first cutting line 4a, 4i on the most edge being set in base plate for packaging 1 and second cutting line 5a, 5d is not formed.Be not limited thereto, the cutting groove corresponding with first cutting line 4a, 4i and second cutting line 5a, 5d can also be formed in suction jig 9.In this case, virtual jut is set further in the mode of surrounding the periphery of jut 10.
As shown in (a) of Fig. 3, shearing device possesses axle 14, and axle 14 has rotating shaft 15.Rotating shaft 15 is provided with and rotates sword 16.Rotate sword lid 17 (representing with double dot dash line in the drawings) to be installed in axle 14.Rotate sword 16 to be covered by rotation sword lid 17.Nozzle for supplying process water to base plate for packaging 1 and rotation sword 16 is installed in and rotates sword lid 17.Such as, cutting water supply nozzle 18, two cooling water supply nozzles 19 and two rinse water supply nozzles 20 are installed in and rotate on sword lid 17.Cut water supply nozzle 18 to be connected with cutting water supply pipe arrangement 21, two cooling water supply nozzles 19 are connected with cooling water supply pipe arrangement 22, and two rinse water supply nozzles 20 are connected with rinse water supply pipe arrangement 23.In the present embodiment, the situation using pure water as process water is shown.
As shown in (b) of Fig. 3, cut-out workbench 7 is fixed with base plate for packaging 1 by absorption.The processed injection contacted with rotation sword 16 from cutting water supply nozzle 18 towards base plate for packaging 1 cuts water 24.Cut water 24 and there is the function reducing the friction rotated between sword 16 and base plate for packaging 1 by preventing the blocking in the side of rotation sword 16.Two cooling water supply nozzles 19 are configured to make it across rotation sword 16.Each cooling water supply nozzle 19 is individually configured as parallel with the upper surface of base plate for packaging 1 with the side rotating sword 16.Cooling water 25 is sprayed towards the established part comprising the side rotating sword 16 from cooling water supply nozzle 19.Cooling water 25 has function rotation sword 16 and base plate for packaging 1 being carried out cooling.In addition, from two rinse water supplies with nozzle 20 towards the upper surface of base plate for packaging 1 and close to the established part jet cleaning water 26 of side rotating sword 16.Rinse water 26 has the function removed by the cut-out bits etc. produced by rotation sword 16.In cut-out bits except powdery or granular material except, the elongated leftover pieces of generation when cutting line 4a, 4i, 5a, the 5d ((a) with reference to Fig. 1) also comprised along the most edge in base plate for packaging 1 cuts off base plate for packaging 1.Cut water 24, cooling water 25 and rinse water 26 and be used as process water.
Cut-out workbench 7 is moved back and forth along Y-direction with feed speed V by travel mechanism (not shown).Rotate sword 16 by being assembled in the motor (not shown) in axle 14, along the counter clockwise direction in figure with revolution R High Rotation Speed.
Referring to figs. 1 through Fig. 4, the operation carrying out singualtion by cutting off base plate for packaging 1 is described.As shown in (a) of Fig. 4, base plate for packaging 1 is placed on cut-out workbench 7 by the surface of substrate 2 side upward.Under the state being placed on cut-out workbench 7 by base plate for packaging 1, each region 6 ((a) with reference to Fig. 1) of base plate for packaging 1 is separately placed on the jut 10 (with reference to Fig. 2) of the suction jig 9 be fixed on cut-out workbench 7.Therefore, multiple first cutting lines 4 ((a) with reference to Fig. 1) be set on the Width of base plate for packaging 1 be configured in be set in suction jig 9 Width on multiple first cutting grooves 12 ((a) with reference to Fig. 2) on.Specifically, as shown in (a) of Fig. 4, cutting groove 12b is configured with cutting line 4b, cutting groove 12c is configured with cutting line 4c, cutting groove 12d is configured with cutting line 4d ... cutting groove 12g is configured with cutting line 4g, cutting groove 12h is configured with cutting line 4h.Similarly, multiple second cutting lines 5 ((a) with reference to Fig. 1) be set on the length direction of base plate for packaging 1 be configured in be set in suction jig 9 length direction on multiple second cutting grooves 13 ((a) with reference to Fig. 2) on.Under the state that the assigned position of cut-out workbench 7 is placed with base plate for packaging 1, adsorbed each region 6 of base plate for packaging 1 respectively by each adsorption hole 11 be arranged on cut-out workbench 7.By adsorbing each region 6 respectively, base plate for packaging 1 is fixed on cut-out workbench 7.
Then, cut-out workbench 7 and axle 14 ((a) with reference to Fig. 3) is made relatively to move.So-called " relatively moving " this term comprises following three kinds of modes.These modes are: fixing cut-out workbench 7 also makes the mode of axle 14 movement, stationary spindle 14 make the mode of cut-out workbench 7 movement and make the mode of cut-out workbench 7 and axle 14 both sides movement.In embodiment 1, show stationary spindle 14, made the mode of cut-out workbench 7 movement by travel mechanism (not shown).
Then, as shown in (b) of Fig. 4, axle 14 is declined, until the lower end being arranged on the rotation sword 16 on the front end of axle 14 arrives the dark position of the lower surface of the potting resin 3 had than base plate for packaging 1.Axle 14 is preferably made to decline, until rotate lower end about the 0.1mm ~ 0.2mm darker in the lower surface of potting resin 3 of sword 16.Then, make rotation sword 16 with revolution R High Rotation Speed.Such as, rotation sword 16 is made to divide High Rotation Speed with 30000rpm/.Then, cut-out workbench 7 is made such as to move second with feed speed 60mm/ towards+Y-direction ((b) with reference to Fig. 3) (from the depths of paper in front in (b) of Fig. 4).By the rotation sword 16 of High Rotation Speed, along multiple first cutting lines 4 be set on base plate for packaging 1, cut off base plate for packaging 1 successively.
When cutting off base plate for packaging 1, spray cutting water 24, cooling water 25 and rinse water 26 (with reference to Fig. 3) from cutting water supply nozzle 18, cooling water supply nozzle 19 and rinse water supply nozzle 20 respectively to base plate for packaging 1 and rotation sword 16.Such as, will be that 4L/ divides, is that 4L/ divides, is that 2L/ divides by the flow set of the rinse water 26 ejected from rinse water supply nozzle 20 by the flow set of the cooling water 25 ejected from cooling water supply nozzle 19 from the flow set cutting the cutting water 24 that water supply nozzle 18 ejects.The processed injection that can contact towards base plate for packaging 1 with rotation sword 16 cuts water 24.In (b) of Fig. 4, for ease of understanding the direction of cutting water 24 and ejecting, illustrating abreast with rotation sword 16 and cutting water 24 (representing with arrow in the drawings).Discharge by cutting off cutting swarf that base plate for packaging 1 produces and resin slag etc. by cutting water 24 and rinse water 26.
In (b) of Fig. 4, show use axle 14, specifically use a rotation sword 16 to cut off the situation of the shearing device of base plate for packaging 1, so-called holocentric axle construction.First, first cutting line 4i, the 4a ((a) with reference to Fig. 4) at the two ends be set on the Width of base plate for packaging 1 is cut off by rotating sword 16.So, by cutting off first cutting line 4i, the 4a at two ends, first from base plate for packaging 1, unwanted elongated leftover pieces are removed.Then, cut off successively from a left side the first cutting line 4b be set in base plate for packaging 1,4c ..., 4h.By cutting off all first cutting lines 4, the cut-out on Width completes.
In (b) of Fig. 4, first, first cutting line 4i, the 4a at the two ends be set on base plate for packaging 1 is cut off.Be not limited thereto, can also cut off successively from a left side the first cutting line 4a be set in base plate for packaging 1,4b ..., 4i.
Then, as shown in (c) of Fig. 4, cut-out workbench 7 90-degree rotation is made by rotating mechanism (not shown).Then, base plate for packaging 1 is cut off along multiple second cutting lines 5 be set on the length direction of base plate for packaging 1.First, second cutting line 5d, the 5a ((a) with reference to Fig. 1) at the two ends be set on base plate for packaging 1 is cut off by rotating sword 16.Then, second cutting line 5b, 5c is cut off by rotating sword 16.So, by cutting off all first cutting line 4 and the second cutting lines 5, the regional 6 through singualtion is manufactured to product P.Each product P is adsorbed by each adsorption hole 11 be arranged on cut-out workbench 7.
In (c) of Fig. 4, first, second cutting line 5d, the 5a at the two ends be set on base plate for packaging 1 is cut off.Be not limited thereto, second cutting line 5a, 5b, 5c, the 5d be set on base plate for packaging 1 can also be cut off successively.
With reference to Fig. 5, to remove be formed at the suction jig 9 that cut-out workbench 7 has multiple first cutting groove 12 and multiple second cutting groove 13 in the action of residue of accumulation be described.As shown in (a) of Fig. 5, carry out the cut-out of base plate for packaging 1 continuously, then cut off bits and resin slag etc. and be gradually accumulated in multiple first cutting groove 12 and multiple second cutting groove 13 being formed at suction jig 9 as residue 27.Particularly, when moisture evaporation in the first cutting groove 12 and the second cutting groove 13 because of the maintenance of shearing device and the day off of factory etc., residue 27 is attached on the inner surface of groove securely.
As shown in (a) of Fig. 5, first, under the state that cut-out workbench 7 is not placed with base plate for packaging 1, axle 14 ((a) with reference to Fig. 3) is declined until the lower end rotating sword 16 arrives the position left a little from the bottom surface of cutting groove 12.Specifically, axle 14 is preferably made to decline until rotate bottom surface suspension about the 0.1mm ~ 0.2mm of lower end from cutting groove 12 of sword 16.Then, such as, under the condition identical with during cut-out base plate for packaging 1, rotation sword 16 is made to divide High Rotation Speed with 30000rpm/.Then, cut-out workbench 7 is made to move second towards+Y-direction ((b) with reference to Fig. 3) (from the depths of paper in front in (b) of Fig. 5) with feed speed 60mm/.The rotation sword 16 of High Rotation Speed is relatively moved along multiple first cutting grooves 12 on the Width being formed in suction jig 9.
When making rotation sword 16 relatively move, spraying with under identical condition when cutting off respectively cut water 24, cooling water 25 and rinse water 26 from cutting water supply nozzle 18, cooling water supply nozzle 19 and rinse water supply nozzle 20.From cutting water supply nozzle 18, cooling water supply nozzle 19 and rinse water supply nozzle 20 spray to the periphery rotating sword 16 or rotate sword 16 cutting water 24 that 4L/ divides respectively, 4L/ divides cooling water 25 and the rinse water 26 that 2L/ divides.Scan out the residue 27 in the bottom surface being accumulated in cutting groove 12 by the rotation sword 16 of High Rotation Speed, and discharge residue 27 by cutting water 24 and rinse water 26.By make rotation sword 16 along the first cutting groove 12b be formed on suction jig 9,12c ..., 12h (with reference to Fig. 2) relatively moves successively, from each cutting groove 12, remove residue 27.
Then, as shown in (b) of Fig. 5, cut-out workbench 7 90-degree rotation is made by rotating mechanism (not shown).Then, rotation sword 16 is made relatively to move along multiple second cutting grooves 13 on the length direction being formed in suction jig 9.Rotation sword 16 is relatively moved along second cutting groove 13b, 13c.By rotating sword 16, more in particular by rotation sword 16 and by swiftly flowing process water, the residue 27 be accumulated in multiple second cutting groove 13 is peeled off from the inner surface of the second cutting groove 13 and scanned out, and discharges residue 27 by cutting water 24 and rinse water 26.So, the residue 27 be accumulated in second cutting groove 13b, 13c is removed respectively.
In embodiment 1, except the condition except the position making axle 14 decline, use the condition identical with during cut-out base plate for packaging 1, remove the residue 27 in multiple first cutting groove 12 and multiple second cutting groove 13 being accumulated in suction jig 9.Be not limited thereto, by changing the revolution R, the feed speed V of cut-out workbench 7, the flow etc. of cutting water 24, cooling water 25 and rinse water 26 that rotate sword 16, the residue 27 be accumulated in multiple first cutting groove 12 and multiple second cutting groove 13 can be removed.Preferably as the position making axle 14 decline, for rotating the Zhou Duan (lower end in Fig. 5) of sword 16 in the scope of inner bottom surface not contacting the first cutting groove 12 and the second cutting groove 13 as far as possible close to the position of these inner bottom surfaces.Particularly, slow down cut-out workbench 7 feed speed V removal residue 27 in there is effect.
According to the present embodiment, the cut-out workbench 7 be fixed on by adsorption tool 9 on metallic work table 8 is set in shearing device.In adsorption tool 9, first cutting groove 12 and second cutting groove 13 corresponding with multiple first cutting line 4 of base plate for packaging 1 and the position of multiple second cutting line 5 is set respectively.Under the state that cut-out workbench 7 is not placed with base plate for packaging 1, the lower end of rotation sword 16 is made to drop to the inside of the first cutting groove 12 and the second cutting groove 13.By making rotation sword 16 relatively move along multiple first cutting groove 12 and multiple second cutting groove 13, scan out the residue 27 be accumulated in the first cutting groove 12 and the second cutting groove 13, and discharge residue 27 by cutting water 24 and rinse water 26.In existing shearing device, easily can remove the residue 27 be accumulated in the first cutting groove 12 and the second cutting groove 13.
In addition, according to the present embodiment, by making the rotation sword 16 of High Rotation Speed contact with residue 27, peeling off and scanning out the residue 27 be accumulated in the first cutting groove 12 and the second cutting groove 13.By the mechanical force caused by rotation sword 16, also easily can peel off and scan out the residue 27 as firm attachment.Therefore, rotating sword 16 by using, also positively can removing the residue 27 as only leaned on process water to remove.
In addition, according to the present embodiment, without the need to adding new structural element and new function to existing shearing device, by directly using existing cut-out condition, the residue 27 be accumulated in the first cutting groove 12 and the second cutting groove 13 can be removed.Therefore, without the need to improveing shearing device, and can not expense be produced, can easily remove residue 27.In addition, do not need from shearing device dismounting cut-out workbench 7 to clean adsorption tool 9.Therefore, it is possible to reduce the time needed for maintenance of shearing device, improve the running rate of shearing device.
(embodiment 2)
With reference to Fig. 6, the embodiment 2 of shearing device involved in the present invention is described.Shearing device 28 shown in Fig. 6 makes cut-off thing monolithic turn to multiple product P.Shearing device 28 has respectively as receiving element A, the cutting unit B of structural element (module), inspection unit C and accepting unit D.Relative to other structural elements, each structural element (each unit A to D) can load and unload respectively and can exchange.Shearing device 28 is formed by comprising each structural element A to D.
Preposition objective table 29 is provided with in receiving element A.Preposition objective table 29 receives from the resin encapsulation equipment of the device as front operation the base plate for packaging 1 being equivalent to cut-off thing.Base plate for packaging 1 (such as, the base plate for packaging of BGA mode) is configured on preposition objective table 29 in the surface of substrate 2 side (with reference to Fig. 1) mode upward.
Shearing device 28 is the shearing device of single station platform mode.Therefore, in cutting unit B, a cut-out workbench 7 is provided with.Cut-out workbench 7 can be moved along the Y-direction in figure by travel mechanism 30, and can be rotated along θ direction by rotating mechanism 31.Cut-out workbench 7 is placed with base plate for packaging 1.Cutting unit B has substrate placement section 32 and substrate cutting portion 33.
Substrate placement section 32 is provided with to mutatis mutandis camera 34.Camera 34 can move in X direction independently on substrate placement section 32.About base plate for packaging 1, detect registration mark by camera 34, and be set with multiple first cutting line 4 and multiple second cutting line 5 ((a) with reference to Fig. 1).
Two axle 14A, 14B as cutting unit are provided with in substrate cutting portion 33.Shearing device 28 is the shearing device of diplocardia axle construction.Two axle 14A, 14B can move independently in X direction.Two axle 14A, 14B are respectively arranged with and rotate sword 16A, 16B.These rotate sword 16A, 16B and are comprising the face inward turning of Y-direction and Z-direction then cutting off base plate for packaging 1 respectively.
Each axle 14A, 14B are provided with and spray for suppressing the cutting water supply nozzle of the cutting water 24 of the frictional heat produced because of rotation sword 16A, 16B of High Rotation Speed (not shown, with reference to Fig. 3).Water 24 is cut towards the processed injection rotating sword 16A, 16B cut-out base plate for packaging 1.
Inspection unit C is provided with inspection objective table 35.By cut off aggregate 36 that base plate for packaging 1 forms through multiple product P of singualtion in the lump transfer on inspection objective table 35.Inspection objective table 35 is configured to move in X direction, and can be that axle rotates with Y-direction.The aggregate 36 be made up of the multiple product P through singualtion checks the surface (with reference to Fig. 1) of the surface of potting resin 3 side and substrate 2 side by inspection camera 37, and screened be qualified product and substandard products.The aggregate 36 be made up of Insp'd product P is transplanted on turn table 38.Inspection unit C is provided with the multiple transfer mechanisms 39 for being configured in the product P on turn table 38 to tray conveying.
Accepting unit D is provided with the qualified product pallet 40 for accommodating qualified product and the substandard products pallet 41 for accommodating substandard products.Screened be qualified product and substandard products product P by transfer mechanism 39 by collecting in each pallet 40,41.In figure 6, illustrate only each pallet 40,41, but each pallet 40,41 can be set in multiple accepting unit D.
In addition, in the present embodiment, the control part CTL that the action by setting shearing device 28 and cut-out condition etc. carry out controlling is arranged in receiving element A.Be not limited thereto, control part CTL can also be arranged in other unit.
In the present embodiment, the shearing device 28 of single station platform mode, diplocardia axle construction is illustrated.Be not limited thereto, in the shearing device etc. of the shearing device of double platform mode, diplocardia axle construction or single station platform mode, holocentric axle construction, also can be suitable for the present invention.
In addition, in embodiments, first cut off base plate for packaging 1 along the first cutting line 4 formed in the direction of the width, then cut off base plate for packaging 1 along the second cutting line 5 formed in the longitudinal direction.Be not limited thereto, as variation, base plate for packaging 1 can also be cut off along the second cutting line 5, then cut off base plate for packaging 1 along the first cutting line 4.
In addition, in embodiments, the situation using pure water as cutting water 24, cooling water 25 and rinse water 26 is shown.Be not limited thereto, as cutting water 24, cooling water 25 and rinse water 26, the liquid comprising the additive such as surfactant, rust inhibitor can also be used except pure water.
In addition, in embodiments, the situation cut off and comprise the base plate for packaging 1 of the element of shaped like chips as cut-off thing is shown.Be not limited thereto, can the present invention be suitable for when by cutting off and carrying out singualtion as the following cut-off thing of the cut-off thing except base plate for packaging 1.First for carrying out the situation of singualtion to the semiconductor wafer be made up of silicon and compound semiconductor.Second is by carrying out singualtion to the ceramic substrate etc. including resistance, capacitor and sensor circuit element, manufactures the situation of chip-resistance, chip capacitor and chip-shaped sensor product.In both cases, semiconductor wafer and ceramic substrate etc. are equivalent to the substrate of the circuit element including corresponding multiple region respectively.3rd is by carrying out singualtion to synthetic resin, manufactures the situation of the opticses such as lens, optical module, light guide plate.4th is by carrying out singualtion to synthetic resin, manufactures the situation of general shaped article.In the various situations comprising above-mentioned four kinds of situations, the content illustrated before can both being suitable for.
In addition, in embodiments, the situation cut off and there is as cut-off thing the cut-off thing of the rectangular shape possessing length direction and Width is shown.Be not limited thereto, when cut off have the cut-off thing of square shape situation or cut off as semiconductor wafer there is in fact round-shaped cut-off thing, before also can being suitable for explanation content.Even if when using fret saw or band saw to replace rotating sword 16 as cutting unit, the content illustrated before also can using.In this case, fret saw or band saw is preferably made to advance abreast relative to the inner bottom surface of the first cutting groove 12 and the second cutting groove 13.
The present invention is not limited to above-mentioned each embodiment, without departing from the spirit and scope of the invention, can as required, any and appropriately combined and change, or optionally adopt.
Description of reference numerals
1 base plate for packaging (cut-off thing)
2 substrates
3 potting resins
4,4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i first cutting line (cutting line)
5,5a, 5b, 5c, 5d second cutting line (cutting line)
6 regions
7 cut off with workbench (workbench)
8 metallic work tables (base)
9 suction jigs
10 juts
11 adsorption holes
12,12b, 12c, 12d, 12e, 12f, 12g, 12h first cutting groove (cutting groove)
13,13b, 13c second cutting groove (cutting groove)
14 axles
15 rotating shafts
16 rotate sword (cutting unit)
17 rotate sword lid
18 cut water supply nozzle (cutting water feed mechanism)
19 cooling water supply nozzles
20 rinse water supply nozzles (rinse water feed mechanism)
21 cut water supply pipe arrangement
22 cooling water supply pipe arrangements
23 rinse water supply pipe arrangements
24 cut water
25 cooling waters
26 rinse water
27 residues
28 shearing devices
29 preposition objective tables
30 travel mechanisms
31 rotating mechanisms
32 substrate placement sections
33 substrate cutting portions
34 pairs of mutatis mutandis cameras
35 inspection objective tables
36 aggregates be made up of multiple product P
37 inspection cameras
38 turn tables
39 transfer mechanisms
40 qualified product pallets
41 substandard products pallets
L1 first cutting line interval each other, the first cutting groove interval each other
L2 second cutting line interval each other, the second cutting groove interval each other
V feed speed
R revolution
P product
A receiving element
B cutting unit
C inspection unit
D accepting unit
CTL control part
Claims (12)
1. a shearing device, possesses: workbench, and for the cut-off thing of placement, described cut-off thing has the multiple regions surrounded by multiple cutting line; Cutting unit, for cutting off described cut-off thing; Travel mechanism, relatively moves for making described workbench and described cutting unit; And cut water feed mechanism, processed supply for contacting to described cutting unit with described cut-off thing cuts water, described shearing device is used when by carrying out singualtion to manufacture the product corresponding with region described in each to described cut-off thing, the feature of described shearing device is to possess:
Base, is arranged on described workbench;
Suction jig, is fixed on described base; And
Multiple cutting groove, is arranged on described suction jig, and corresponding with the position of described multiple cutting line under the state being placed with described cut-off thing on described suction jig,
Under the state that described suction jig is not placed with described cut-off thing, the inside entering into described cutting groove at least partially of described cutting unit, described cutting water is supplied to described cutting unit from described cutting water feed mechanism, and described workbench and described cutting unit relatively move along described cutting groove, remove the residue in the inside of described cutting groove thus.
2. shearing device according to claim 1, is characterized in that,
Possesses the rinse water feed mechanism for the periphery supply rinse water to described cutting groove.
3. shearing device according to claim 1 and 2, is characterized in that,
Described shearing device has multiple described cutting unit.
4. shearing device according to claim 1 and 2, is characterized in that,
Described suction jig is formed by silicon system resin or fluorine resin.
5. shearing device according to claim 1 and 2, is characterized in that,
Described cut-off thing is base plate for packaging.
6. shearing device according to claim 1 and 2, is characterized in that,
Described cut-off thing is the substrate of the circuit element including corresponding multiple described region respectively.
7. a cutting-off method, comprising: the cut-off thing with the multiple regions surrounded by multiple cutting line is placed operation on the table; Make the operation of described workbench and cutting unit relatively movement; By making described workbench and described cutting unit relatively move, thus use described cutting unit to cut off the operation of described cut-off thing; And to contact to described cutting unit with described cut-off thing processedly supply the operation of cutting water, the feature of described cutting-off method is, comprising:
The operation of described workbench is prepared by the suction jig fixedly on base with multiple cutting grooves corresponding with described multiple cutting line;
The operation entering into the inside of described cutting groove at least partially of described cutting unit is made under the state that described suction jig is not placed with described cut-off thing;
Supply the operation of described cutting water towards described cutting unit under the state that described suction jig is not placed with described cut-off thing; And
Make described workbench and described cutting unit relatively move along described cutting groove under the state that described suction jig is not placed with described cut-off thing, remove the operation of the residue in the inside of described cutting groove thus.
8. cutting-off method according to claim 7, is characterized in that,
Be included in the operation towards the periphery supply rinse water of described cutting groove under the state described suction jig not being placed with described cut-off thing.
9. the cutting-off method according to claim 7 or 8, is characterized in that,
Described shearing device has multiple described cutting unit.
10. the cutting-off method according to claim 7 or 8, is characterized in that,
Described suction jig is formed by silicon system resin or fluorine resin.
11. cutting-off methods according to claim 7 or 8, is characterized in that,
Described cut-off thing is base plate for packaging.
12. cutting-off methods according to claim 7 or 8, is characterized in that,
Described cut-off thing is the substrate of the circuit element including corresponding multiple described region respectively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-147251 | 2014-07-18 | ||
| JP2014147251A JP6338478B2 (en) | 2014-07-18 | 2014-07-18 | Cutting method and product manufacturing method |
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| Publication Number | Publication Date |
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| CN105280554A true CN105280554A (en) | 2016-01-27 |
| CN105280554B CN105280554B (en) | 2018-04-24 |
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| CN201510378174.6A Active CN105280554B (en) | 2014-07-18 | 2015-07-01 | Disconnecting device and cutting-off method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6338478B2 (en) |
| KR (1) | KR101733290B1 (en) |
| CN (1) | CN105280554B (en) |
| TW (1) | TWI567809B (en) |
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| TW201812887A (en) | 2016-09-23 | 2018-04-01 | 頎邦科技股份有限公司 | Wafer dicing method |
| JP2018164964A (en) * | 2017-03-28 | 2018-10-25 | Ｔｏｗａ株式会社 | Resinoid wheel, method of manufacturing the same, and processing device |
| JP6964504B2 (en) * | 2017-12-12 | 2021-11-10 | 株式会社ディスコ | Cutting method of work piece |
| JP6967276B2 (en) * | 2017-12-28 | 2021-11-17 | 三星ダイヤモンド工業株式会社 | Break device |
| JP7328507B2 (en) * | 2019-04-25 | 2023-08-17 | 日亜化学工業株式会社 | Semiconductor device manufacturing method |
| CN109969475A (en) * | 2019-05-13 | 2019-07-05 | 苏州恒星医用材料有限公司 | A kind of packaging facilities |
| JP6746756B1 (en) * | 2019-05-24 | 2020-08-26 | Ｔｏｗａ株式会社 | Suction plate, cutting device and cutting method |
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| JP5226472B2 (en) * | 2008-11-17 | 2013-07-03 | 株式会社ディスコ | Cutting method |
| JP5732356B2 (en) * | 2011-09-08 | 2015-06-10 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| JP2013010180A (en) | 2012-10-12 | 2013-01-17 | Towa Corp | Cutting device and cutting method |
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- 2014-07-18 JP JP2014147251A patent/JP6338478B2/en active Active
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2015
- 2015-06-15 TW TW104119206A patent/TWI567809B/en active
- 2015-07-01 CN CN201510378174.6A patent/CN105280554B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI567809B (en) | 2017-01-21 |
| KR20160010310A (en) | 2016-01-27 |
| TW201618172A (en) | 2016-05-16 |
| KR101733290B1 (en) | 2017-05-08 |
| JP6338478B2 (en) | 2018-06-06 |
| JP2016025167A (en) | 2016-02-08 |
| CN105280554B (en) | 2018-04-24 |
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