CN102343444B - The processing unit (plant) of semiconductor wafer - Google Patents
The processing unit (plant) of semiconductor wafer Download PDFInfo
- Publication number
- CN102343444B CN102343444B CN201110210555.5A CN201110210555A CN102343444B CN 102343444 B CN102343444 B CN 102343444B CN 201110210555 A CN201110210555 A CN 201110210555A CN 102343444 B CN102343444 B CN 102343444B
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- CN
- China
- Prior art keywords
- lathe tool
- machined object
- chuck table
- turning
- cooling fluid
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 239000012809 cooling fluid Substances 0.000 claims abstract description 34
- 238000003754 machining Methods 0.000 claims abstract description 16
- 238000002347 injection Methods 0.000 claims abstract description 11
- 239000007924 injection Substances 0.000 claims abstract description 11
- 239000007921 spray Substances 0.000 claims abstract description 10
- 230000007423 decrease Effects 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 5
- 230000011218 segmentation Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000013138 pruning Methods 0.000 description 1
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Turning (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Milling Processes (AREA)
Abstract
The invention provides a kind of processing unit (plant) of semiconductor wafer, it can prevent chip be attached to the end of lathe tool due to turning thus prevent the decline of turning ability, and lathe tool can be prevented deteriorated due to heat.Described processing unit (plant) (1) at least has the cutting member (3) comprising lathe tool (33), described lathe tool (33) carries out turning to the machined object being held in chuck table (2) and arranges in the mode that can rotate, in described processing unit (plant) (1), there is the cooling fluid injection member (12) comprising nozzle (120), wherein said nozzle (120) sprays cooling fluid to being positioned at after just having carried out turning to the machined object being positioned machining area (B) with the end of the lathe tool of the discontiguous non-working position of described machined object (33), thus, cooling fluid is utilized to rinse the chip of attachment removal at lathe tool (33) end, thus prevent the decline of the turning ability of lathe tool (33), and the end of cooling turning tool (33), thus prevent the deterioration of lathe tool (33).
Description
Technical field
The present invention relates to and utilize lathe tool to carry out the processing unit (plant) of turning to the projection (バ Application プ) being formed at semiconductor wafer.
Background technology
About be formed with multiple device such as IC (IntegratedCircuit: integrated circuit), LSI (largescaleintegration: large scale integrated circuit) from the teeth outwards by segmentation preset lines wafer with demarcating, be divided into device one by one by carrying out cutting off along segmentation preset lines, and be used in various electrical equipment.
In addition, about the wafer with electrode that give prominence to from the surface of device, that be referred to as projection, before carrying out division processing, prune to make the height of projection consistent by processing unit (plant) on the head of projection.As the device carrying out the processing making the height of projection consistent, the processing unit (plant) recorded in such as patent document 1 can be used.
The processing unit (plant) recorded in patent document 1 has the chuck table keeping machined object and the lathe tool machined object being held in chuck table being carried out to turning, by making, chuck table is relative with lathe tool to be rotated and the head of projection of being pruned by lathe tool, and the height of projection can be made consistent all the time.
Patent document 1: Japanese Unexamined Patent Publication 2005-327838 publication
But when carrying out turning by lathe tool, there is such problem: chip is attached to the end of lathe tool, the turning ability of lathe tool reduces, thus makes the Quality Down of machined object.In addition, when chip is attached to the end of lathe tool and produces heat, there is the problem of lathe tool deterioration.
Summary of the invention
The present invention completes just in view of the above fact, and its technical task is to prevent chip be attached to the end of lathe tool due to turning thus prevent the decline of turning ability, and prevents lathe tool deteriorated due to heat.
The present invention relates to a kind of processing unit (plant) of semiconductor wafer, it comprises: chuck table, and described chuck table has the holding surface keeping machined object; Turning component, described turning component has the lathe tool that can rotate, and described lathe tool carries out turning to the machined object being held in chuck table; Chuck table align member, chuck table is positioned loading and unloading area and machining area by described chuck table align member, described loading and unloading area carries out the region of machined object relative to the handling of chuck table, and described machining area is the region of machined object being carried out to turning; Move into component, described in move into component and machined object be moved to the chuck table being positioned loading and unloading area; And take out of component, machined object takes out of from the chuck table being positioned loading and unloading area by the described component that takes out of, the feature of described processing unit (plant) is, described processing unit (plant) is equipped with the cooling fluid injection member with nozzle, and described nozzle sprays cooling fluid to being positioned at after just having carried out turning to the machined object being positioned machining area with the end of the lathe tool of the discontiguous non-working position of described machined object.Cooling fluid injection member is preferably configured to: cooling fluid and compressed air are supplied to nozzle, and spray cooling fluid from nozzle by compressed air.
Because the present invention has the cooling fluid injection member comprising nozzle, wherein said nozzle is to just spraying cooling fluid to the end being positioned at the lathe tool of the discontiguous non-working position with machined object after the machined object being positioned machining area has carried out turning, so the chip of attachment removal at lathe tool end can be rinsed by the cooling fluid ejected, thus the decline of the turning ability of lathe tool can be prevented.In addition, because the end of lathe tool is cooled by cooling fluid, so the deterioration of the lathe tool produced because of heat can be prevented.In addition, because spray cooling fluid by compressed air, so can effectively from the end removing chip of lathe tool.
Accompanying drawing explanation
Fig. 1 is the stereogram of the example representing processing unit (plant).
Fig. 2 is the sectional view of the example schematically showing cooling fluid injection member.
Fig. 3 is the top view of the example representing semiconductor wafer.
Fig. 4 represents spray cooling fluid to lathe tool and the projection of semiconductor wafer carried out to the key diagram of the state of turning.
Fig. 5 represents spray cooling fluid to lathe tool and the projection of semiconductor wafer carried out to the stereogram of the state of turning.
Label declaration
1: processing unit (plant); A: loading and unloading area; B: machining area; 2: chuck table; 20: holding surface; 3: turning component; 30: rotating shaft; 31: motor; 32: mount pad; 33: lathe tool; 4a, 4b: box mounting portion; 40a, 40b: box; 5: moved member; 50: maintaining part; 51: arm; 6: position alignment component; 60: mounting portion; 61: jut; 7: cleaning element; 70: rotary table; 8: move into component; 80: maintaining part; 81: arm; 9: take out of component; 90: maintaining part; 91: arm; 10: turning feeding component; 100: ball-screw; 101: guide rail; 102: pulse motor; 103: Lift Part; 11: chuck table align member; 110: supporting base; 111: corrugated cover; 12: cooling fluid injection member; 120: nozzle; 120a: ejiction opening; 121: valve; 122: compressed air source; 123: air flow channel; 124: valve; 125: water source; 126: water flow passage; 127: cooling fluid; 13: leakage fluid dram; W: semiconductor wafer; D: device; B: projection; L: segmentation preset lines.
Detailed description of the invention
(1) structure of device
Processing unit (plant) 1 shown in Fig. 1 is the device processed the machined object being held in chuck table 2 by turning component 3.Processing unit (plant) 1 is made up of loading and unloading area A and machining area B, and wherein said loading and unloading area A carries out the region of machined object relative to the handling of chuck table 2, and described machining area B is the region of machined object being carried out to turnery processing.
In the front portion of processing unit (plant) 1, be equipped with the box mounting portion 4a of mounting box 40a and the box mounting portion 4b of mounting box 40b, wherein box 40a contains the machined object before processing, and box 40b is for accommodating the machined object after processing.
Near box mounting portion 4a, 4b, be equipped with moved member 5, described moved member 5 carries out machined object from the taking-up of box 40a and machined object to the storage of box 40b.Moved member 5 has: the maintaining part 50 of attracting holding machined object; With the arm 51 making maintaining part 50 move to desired position.
In the movable area of the maintaining part 50 of formation moved member 5, be equipped with position alignment component 6, described position alignment component 6 loads machined object and the position position alignment of this machined object fixed.Position alignment component 6 is made up of mounting portion 60 and multiple jut 61, and described mounting portion 60 is for loading machined object, and described multiple jut 61 is arranged to arc-shaped and can moves in the radial direction.
In the movable area of the maintaining part 50 of formation moved member 5, be equipped with the cleaning element 7 of the machined object after cleaning turnery processing.Cleaning element 7 has: keep machined object and the rotary table 70 rotated; With the not shown nozzle to the machined object ejection water under high pressure or pressure-air that are held in rotary table 70.
At the rear side of moved member 5, be equipped and move into component 8 and take out of component 9, described move into component 8 by processing before machined object be moved to the chuck table 2 being positioned loading and unloading area A, described in take out of component 9 by processing after machined object take out of from the chuck table 2 being positioned loading and unloading area A.Move into component 8 to be made up of maintaining part 80 and arm 81, wherein said maintaining part 80 adsorbs machined object, described arm 81 is can be elevated and pivotal mode is formed and makes maintaining part 80 move to desired position, take out of component 9 to be made up of maintaining part 90 and arm 91, wherein said maintaining part 80 adsorbs machined object, and described arm 91 is can be elevated and pivotal mode is formed and makes maintaining part 90 move to desired position.
Turning component 3 is disposed in machining area B, and be made up of rotating shaft 30, motor 31, mount pad 32 and lathe tool 33, wherein said rotating shaft 30 has the axle center of vertical direction, described motor 31 drives rotating shaft 30 to rotate, described mount pad 32 is formed at the lower end of rotating shaft 30, described lathe tool 33 is fixed on mount pad 32, and turning component 3 is configured to: by utilizing motor 31 to make rotating shaft 30 rotate, lathe tool 33 rotates in the mode describing circuit orbit.
Turning component 3 is driven by turning feeding component 10 and can be elevated, and turning feeding component 10 comprises: the ball-screw 100 extended in vertical direction; The pair of guide rails 101 arranged in the mode parallel with ball-screw 100; Be connected with one end of ball-screw 100 and make the pulse motor 102 that ball-screw 100 rotates; And for the Lift Part 103 of fixing turning component 3, the nut of the not shown inside of described Lift Part 103 and ball-screw 100 screw togather and the sidepiece of described Lift Part 103 and guide rail 101 are slidably connected, and turning component 3 is configured to: make ball-screw 100 rotate by utilizing pulse motor 102, Lift Part 103 is guided by guide rail 101 and is elevated, and makes turning component 3 be elevated thus.
Chuck table 2 has the holding surface 20 keeping machined object, and described chuck table 2 can rotate, and can be moved in the horizontal direction by chuck table align member 11 thus be moved between loading and unloading area A and machining area B.Chuck table align member 11 comprises: support chuck table 2 in the mode that can rotate and the supporting base 110 moved in the horizontal direction; With the flexible corrugated cover 111 along with supporting base 110 movement in the horizontal direction, corrugated cover 111 plays a role as the cover component prevented adding the water used man-hour and the chip intrusion device inside produced due to processing.
Near turning component 3, be equipped with the cooling fluid injection member 12 of spraying cooling fluid to the lathe tool 33 forming turning component 3.Cooling fluid injection member 12 has the nozzle 120 spraying cooling fluid.In addition, at machining area B, be formed with the leakage fluid dram 13 for discharging the cooling fluid sprayed from nozzle 120.Leakage fluid dram 13 is formed in the position lower than the upper surface of supporting base 110 and corrugated cover 111.
As shown in Figure 2, ejiction opening 120a is formed with in the inside of nozzle 120.Ejiction opening 120a is communicated with water flow passage 126 with air flow channel 123, wherein said air flow channel 123 is communicated with compressed air source 122 via valve 121, described water flow passage 126 is communicated with water source 125 via valve 124, and described ejiction opening 120a is configured to: by making water flow passage 126 and air flow channel 123 converge, thus water is accelerated by compressed air and sprays from ejiction opening 120a.
(2) action of device
Next, the action of the processing unit (plant) 1 when the projection B be formed in turning on the device D of semiconductor wafer W is described.Be formed with segmentation preset lines L in length and breadth in the face side of this semiconductor wafer W, and be formed with device D with demarcating by segmentation preset lines L.Give prominence to from device D and be formed with projection B.
Be described with reference to Fig. 1, the semiconductor wafer W before multiple processing is contained in box 40a.Then, keep the semiconductor wafer W before described processing by the maintaining part 50 forming moved member 5, one piece one piece of ground is taken out, and conveyance is to position alignment component 6, and is placed in mounting portion 60.Then, by making jut 61 move to direction close to each other, the position fixing by the position alignment of semiconductor wafer W.
Next, under the state making chuck table 2 be positioned at loading and unloading area A, form the maintaining part 80 moving into component 8 and adsorb semiconductor wafer W, and by the revolution of arm 81 by semiconductor wafer W conveyance to chuck table 2, and in the holding surface 20 of chuck table 2 rear side (not forming the side of projection B) of attracting holding semiconductor wafer W.
When semiconductor wafer W being held in like this after on chuck table 2, chuck table 2 moves to machining area B, thus semiconductor wafer W is located in machining area B.Then, by utilizing motor 31, rotating shaft 30 is rotated, lathe tool 33 is rotated with the rotary speed of such as about 6000RPM, and turning component 3 is declined thus lathe tool 33 is positioned predetermined height, chuck table 2 is made to move in the horizontal direction in this condition, make the lathe tool 33 of rotation contact with whole projection B of semiconductor wafer W thus, thus the projection B pruning whole align at predetermined height to make its head.
As shown in Figure 4, the radius of the radius ratio semiconductor wafer W of the swing-around trajectory of lathe tool 33 is large.Therefore, lathe tool 33 is when rotating to C direction, and not always turning projection B, is also positioned at non-working position discontiguous with projection B sometimes.And, as shown in Figure 5, cooling fluid and compressed air are supplied to the nozzle 120 forming cooling fluid injection member 12 respectively from water source 125 and compressed air source 122, and cooling fluid 127 is sprayed from nozzle 120 to the lathe tool 33 being positioned at non-working position, to the end of lathe tool 33, namely clean with the part of bump contact.The cleaning of cooling fluid 127 pairs of lathe tools 33 is carried out after being processed by lathe tool 33 couples of projection B.By making cooling fluid contact with lathe tool 33 after processing like this, thus lathe tool is cleaned immediately after each lathe tool 33 acts on projection B, and the chip being attached to the end of lathe tool 33 thus is all rinsed at every turn, thus always can prevent turning ability from reducing.Therefore, the crudy of projection B also can not be made to decline.In addition, because the end of lathe tool 33 is cooled, so it is deteriorated because of heating to prevent lathe tool 33.In addition, because spray cooling fluid by compressed air, so can effectively from the end removing chip of lathe tool 33.
Claims (2)
1. a processing unit (plant) for semiconductor wafer, it comprises: chuck table, and described chuck table has the holding surface keeping machined object; Turning component, described turning component has the lathe tool that can rotate, and described lathe tool carries out turning to the machined object being held in described chuck table; Chuck table align member, chuck table is positioned loading and unloading area and machining area by described chuck table align member, described loading and unloading area carries out the region of machined object relative to the handling of described chuck table, and described machining area is the region of machined object being carried out to turning; Move into component, described in move into component and machined object be moved to the chuck table being positioned described loading and unloading area; And take out of component, described in take out of component machined object taken out of from the described chuck table being positioned described loading and unloading area, the feature of described processing unit (plant) is,
Described processing unit (plant) is equipped with the cooling fluid injection member with nozzle, and described nozzle sprays cooling fluid to being positioned at after just having carried out turning to the machined object being positioned described machining area with the end of the described lathe tool of the discontiguous non-working position of described machined object.
2. the processing unit (plant) of semiconductor wafer as claimed in claim 1, wherein,
Cooling fluid and compressed air are supplied to nozzle by described cooling fluid injection member, and spray described cooling fluid from described nozzle by described compressed air.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010169085A JP5695359B2 (en) | 2010-07-28 | 2010-07-28 | Processing equipment |
| JP2010-169085 | 2010-07-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102343444A CN102343444A (en) | 2012-02-08 |
| CN102343444B true CN102343444B (en) | 2015-12-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110210555.5A Active CN102343444B (en) | 2010-07-28 | 2011-07-26 | The processing unit (plant) of semiconductor wafer |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5695359B2 (en) |
| KR (1) | KR101687423B1 (en) |
| CN (1) | CN102343444B (en) |
| TW (1) | TWI546876B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013233629A (en) * | 2012-05-10 | 2013-11-21 | Disco Corp | Cutting device with cutting tool |
| CN106181400B (en) * | 2016-06-23 | 2018-05-08 | 慈溪市多邦电器有限公司 | One kind is used for jack holding rod automatically grinding equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4829859A (en) * | 1986-08-29 | 1989-05-16 | Ulticon Systems, Inc. | Method of high speed machining |
| CN1499580A (en) * | 2002-10-28 | 2004-05-26 | 株式会社迪斯科 | Cutting appts. |
| CN201132274Y (en) * | 2007-12-26 | 2008-10-15 | 沈阳机床股份有限公司钣焊件厂 | Cooler bin of multifunctional machine tool |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425309A (en) * | 1990-05-18 | 1992-01-29 | Genichi Sato | Cutting method and device therefore |
| JP3549741B2 (en) * | 1998-09-08 | 2004-08-04 | 日本スピードショア株式会社 | Atomizer supply device |
| JP4319942B2 (en) * | 2004-05-13 | 2009-08-26 | 株式会社ディスコ | Processing device for electrode formed on plate |
| JP4837973B2 (en) * | 2005-10-13 | 2011-12-14 | 株式会社ディスコ | Cutting blade changer |
| JP2009285799A (en) * | 2008-05-30 | 2009-12-10 | Disco Abrasive Syst Ltd | Cutting device |
-
2010
- 2010-07-28 JP JP2010169085A patent/JP5695359B2/en active Active
-
2011
- 2011-07-19 TW TW100125475A patent/TWI546876B/en active
- 2011-07-22 KR KR1020110073109A patent/KR101687423B1/en active IP Right Grant
- 2011-07-26 CN CN201110210555.5A patent/CN102343444B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4829859A (en) * | 1986-08-29 | 1989-05-16 | Ulticon Systems, Inc. | Method of high speed machining |
| CN1499580A (en) * | 2002-10-28 | 2004-05-26 | 株式会社迪斯科 | Cutting appts. |
| CN201132274Y (en) * | 2007-12-26 | 2008-10-15 | 沈阳机床股份有限公司钣焊件厂 | Cooler bin of multifunctional machine tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102343444A (en) | 2012-02-08 |
| KR101687423B1 (en) | 2016-12-19 |
| JP5695359B2 (en) | 2015-04-01 |
| TWI546876B (en) | 2016-08-21 |
| JP2012030290A (en) | 2012-02-16 |
| KR20120011809A (en) | 2012-02-08 |
| TW201209950A (en) | 2012-03-01 |
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