201209950 六、發明說明： r:發明戶斤屬之技術領域3 發明領域 本發明係有關於一種使用刀具，來車削形成於半導體 晶圓之凸塊之加工裝置 I：先前技術3 發明背景 以分割預定線劃分IC、LSI等複數元件而形成於表面之 晶圓沿著分割預定線被切斷，而分割成諸個元件，以供各 種電子機器利用。 又，關於具有從元件之表面突出，稱為凸塊之電極之 晶圓，於進行分割加工前，以加工裝置削凸塊之頭部，以 使凸塊之高度一致。進行使凸塊之高度一致之加工的裝置 可使用於專利文獻1記載之加工裝置。 於專利文獻1記載之加工裝置包含有保持被加工物之 夾頭台、車削保持在夾頭台之被加工物之刀具，使夾頭台 與刀具相對地旋轉，刀具可削取凸塊之頭部，藉此，可使 凸塊之高度一致統一。 先行技術文獻 專利文獻 專利文獻1日本專利公開公報2005-327838號 【發明内容】 發明概要 發明欲解決之課題 201209950 然而行刀具所作之車肖㈣，有碎片附著於刀具 之月J端車削月匕力降低，而使被加工物之品質降低之問題。 又，當碎片附著於刀具之前端，產生熱時，有刀具惡化之 問題。 本發明即疋鑑於此種事實而發明者，其技術性課題在 於防止ϋ賴，碎片附著於刀具之前端，以防範車削能力 之降低，並且，防止刀具因熱而惡化。 用以欲解決課題之手段 本發明係有關於-種包含有夾頭台、車削機構、失頭 台安置機構、搬入機構及搬出機構之加工裝置，該夹頭台 係具有料被加X物之保持面者；該車職構係具有車削 夾頭。所保持之被加工物的刀具，並使該刀具可旋轉者； 該夾頭台安置機構係將夹頭台安置於為進行被加工物對該 失頭台之裝卸之區域的裝卸區域與為進行被加卫物之車削 之區域的加工區域者；該搬入機構係將被加工物搬入安置 在裝卸區域之夾頭台者；該搬出機構係將被加工物從安置 在裝卸區域之夾頭台搬出者；該加工裝置特徵在於配設有 冷卻水喷射機構，該冷卻水喷射機構具有朝剛將安置在該 加工區域之被加工物車削後之該刀具前端噴射冷卻水的喷 嘴。 發明效果 由於本發明包含有具有於車削安置在加工區域之被加 工物後’立即朝刀具之前端噴射冷卻水之嘴嘴的冷卻水喷 射機構’故可以所噴射之冷卻水沖刷附著於刀具前端之碎 ⑧ 4 201209950 片，而可防止刀具之車削能力之降低。又，由於可以冷卻 水冷卻刀具之前端，故可防止因熱引起之刀具之惡化。再 者’由於藉麗縮空氣噴射冷卻水，故可有效地從刀具之前 端去除碎片。 圖式簡單說明 第1圖係顯示加工裝置之一例之立體圖。 第2圖係顯示冷卻水嘴射機構之一例之概略的截面圖。 第3圖係顯示半導體晶圓之一例之平面圖。 第4圖係顯示對刀具噴射冷卻水，並車削半導體晶圓之 凸塊之狀態的說明圖。 第5圖係顯示對刀具噴射冷卻水，並車削半導體晶圓之 凸塊之狀態的立體圖。 【實施冷式】 用以實施發明之形態 (1)裝置之結構 第1圖所示之加工裝置1係以車削機構3將保持在夹頭 台2之被加工物加工之裝置。加工裝置1以為進行被加工物 對夾頭台2之裝卸之區域的裝卸區域Α與為進行被加工物 之車削加工之區域的加工區域B構成。 於加工裝置1之前部配設有可載置收容有加工前之被 加工物之匣40a之匣載置部4a、可載置用以收容加工後之被 加工物之匣40b之匣載置部4b。 於匣載置部4a、4b之附近配設有進行被加工物從匣40a 之取出及被加工物往匣40b之收納的搬出搬入機構5。搬出 5 201209950 搬入機構5具有吸引保持被加工物之保持部％、使保持部5〇 移動至所期位置之臂部51。 於構成搬出搬入機構5之保持部5〇之可動區配設有可 被加工物，並且將该被加工物對位於一定位置之對位 機構6。對位機構6由可載置被加工物之載置部及配設成 圓弧狀’且可於轉^向移動之複數突起部Η構成。 於構成搬出搬入機構5之保持部5〇之可動區配設有洗 爭車削加工後之被加工物之洗淨機構7。洗淨機構7具有保 持被加工物且可旋轉之旋轉台7G、對保持在旋轉台7〇之被 加工物噴出高壓水或高壓空氣之圖中未示之喷嘴。 於搬出搬入機構5之後方向配設有將加工前之被加工 物搬入至安置在裝卸區域A之失頭台2的搬人機構8、從安置 在裝卸區域A之夾頭台2搬出加工後之被加工物之搬出機構 9。搬入機構8由吸附被加工物之保持部8〇、構造成可升降 及旋繞，以使保持部80移動至所期位置之臂部81構成，搬 出機構9由吸附被加工物之保持部9〇、構造成可升降及旋 繞，以使保持部90移動至所期位置之臂部91構成。 車削機構3配設於加工區域b，由具有錯直方向之軸心 之旋轉軸30、將旋轉軸30旋轉驅動之馬達31、形成於旋轉 軸30之下端之座32、固定於座32之刀具33構成，而形成為 藉馬達31使旋轉軸30旋轉，刀具33可劃出圓軌道而旋轉之 結構》 車削機構3可以車削進給機構1〇驅動而升降。車削進給 機構10由於鉛直方向延伸之滾珠螺桿1〇〇、配設成與滾珠螺 ⑧ 201209950 桿100平行之一對引導軌道101、連結於滾珠螺桿1〇〇之— 端，以使滾珠螺桿100旋動之脈衝馬達1〇2、圖中未示之内 部之螺帽螺合於100，並且，側部與引導軌道1〇1滑動接觸， 而可固定車肖《構3之升降構件⑽構成，而形成為藉脈衝 馬達102使滾珠螺桿100旋動，升降構件1〇3可為引導軌道 101所引導而升降’藉此，可使車削機構3升降的結構。 夾頭台2具有保持被加工物之保持面2〇，可旋轉，並 且可以夾頭台女置機構11於水平方向移動，而可在裝卸 區域A與加工區域B間移動。夾頭台安裝機構n由將夾頭台 2支撐成可旋轉，並且於水平方向移動之支撐台11〇、隨著 支撐台110之水平方向之移動而伸縮之蛇管lu構成，蛇管 m發揮了作為蓋構件之作用，該蓋構件係防止加工時使用 之水或因加工而產生之碎片侵入裝置内部者。 於車削機構3之附近配設有朝構成車削機構3之刀具33 喷射冷卻水之冷卻水喷射機構12。冷卻水喷射機構12具有 喷射冷卻水之喷嘴120。又，於加工區域B形成有用以將從 喷嘴120喷出之冷卻水排放之排水口 13。排水口 13形成於低 於支撐台11〇及蛇管111之上面之位置。 如第2圖所示’於噴嘴120之内部形成有喷出口 12〇a。 喷出口 120a之結構係連通於藉由閥12ι連通於壓縮空氣源 122之空氣流路123及||由閥124 ’連通於水源125之水流路 126 ’藉水流路丨26與空氣流路123合流，水可藉壓縮空氣加 速，而從喷出口 120a噴出。 (2)裝置之動作 7 201209950 接著’就車肖彳形成於第3圖所示之半導體晶圓w之元件 D之凸塊B時的加卫震置以動作作㈣。&半導體晶圓w 於其表面側縱仏形成分割預定線L，以分割預定線乙割分而 形成有元件D。凸塊b從元件D突出形成。 參照第來說明’將複數個加功之半導體晶圓W收 合於g4Ga。然後，以構成搬出搬人機構5之保持部％予以 保持’逐片取出’然後搬送至對位機構6，載置於載置部6〇。 接著’藉突起部61於相互靠近之方向㈣，可將半導體晶 圓W對位於一定之位置。 即匪埤八之狀態下，構成搬 入機構8之歸部啊附半導體晶圓w，藉臂部以旋繞， 將半導體晶B1W搬送至夾頭台2，在其保持面2()，吸引保持 半導體晶圓之背面側(未形成有凸塊B之側）。 如此進行，當將半導體晶圓鄉持於夾頭台辦，夹頭 移動至加工區_，而可將半導體晶圓w安置於加工區 。然後’藉馬達31使旋轉軸3〇旋轉，可-面使刀具33 = 6_RPM左右之旋轉速度旋轉，—面使車 I::安置於預定高度，在此狀態下，使二二 以咖⑽具33接觸半導體晶圓 高度。 *所有凸塊B，以使其頭部-致成預定 心:所:而’^ 直車削^ 在往c方向旋轉當中，並非一 !凸塊B’也有位於不接觸凸塊B之非作用位置之情 201209950 形。又，如第5圖所示，從水源125及壓縮空氣源122分別將 冷卻水及壓縮空氣供至構成冷卻水喷射機構12之喷嘴 120，朝位於非作用位置之刀具33從喷嘴120喷射冷卻水 127，以洗淨刀具33之前端，亦即與凸塊接觸之部份。冷卻 水127所作之刀具33之洗淨於刀具33所作之凸塊B之加工後 進行。如此進行，於加工後，藉將冷卻水碰觸刀具33，每 當刀具33作用於凸塊B時，可隨後立即將刀具洗淨，故每次 可沖刷附著於刀具33之前端之碎片，而可一直防止車削能 力之降低。因而，也不致使凸塊B之加工品質降低。又，由 於可冷卻刀具33之前端，故亦可防止刀具33因發熱而惡 化。再者，由於藉壓縮空氣喷射冷卻水，故可從刀具33之 前端有效地去除碎片。 L圖式簡單說明3 第1圖係顯示加工裝置之一例之立體圖。 第2圖係顯示冷卻水喷射機構之一例之概略的截面圖。 第3圖係顯示半導體晶圓之一例之平面圖。 第4圖係顯示對刀具噴射冷卻水，並車削半導體晶圓之 凸塊之狀態的說明圖。 第5圖係顯示對刀具喷射冷卻水，並車削半導體晶圓之 凸塊之狀態的立體圖。 201209950 【主要元件符號說明】 1.. .加工裝置 2.. .爽頭台 3.. .車削機構 4a，4b...匣載置部 5.. .搬出搬入機構 6.. .對位機構 7.. .洗淨機構 8.. .搬入機構 9.. .搬出機構 10.. .車削進給機構 11.. .夾頭台安置機構 12.. .冷卻水喷射機構 13.. .排水口 20.. .保持面 30.. .旋轉軸 31.. .馬達 32…座 33.. .刀具 40a，40b...匣 50，80，90...保持部 51，81，91...臂部 60.. .載置部 61.. .突起部 70.. .旋轉台 100.. .滾珠螺桿 101.. .引導軌道 102.. .脈衝馬達 103.. .升降構件 110.. .支撐台 111.. .蛇管 120.. .喷嘴 120a...喷出口 12卜 124...閥 122.. .壓縮氣體源 123.. .空氣流路 124…閥 125.. .水源 126.. .水流路 127.. .冷卻水 A...裝卸區域 B···加工區域(第1圖) B··.凸塊(第3圖） C. ..方向 D. ..元件 L...分割預定線 W...半導體晶圓 10201209950 VI. INSTRUCTIONS: r: TECHNICAL FIELD OF THE INVENTION The invention relates to a processing apparatus for turning a bump formed on a semiconductor wafer using a cutter: prior art 3 A wafer formed on a surface by dividing a plurality of elements such as an IC or an LSI is cut along a predetermined dividing line, and is divided into individual elements for use in various electronic devices. Further, regarding the wafer having the electrode protruding from the surface of the element and called the bump, the processing device cuts the head of the bump so that the height of the bump coincides before the division processing. The apparatus for processing the heights of the bumps can be used in the processing apparatus described in Patent Document 1. The processing apparatus described in Patent Document 1 includes a chuck for holding a workpiece, a tool for turning a workpiece held by the chuck table, and the chuck table is rotated relative to the cutter, and the cutter can cut the head of the bump. In this way, the height of the bumps can be uniformly unified. PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1 Japanese Patent Laid-Open Publication No. 2005-327838 SUMMARY OF THE INVENTION SUMMARY OF THE INVENTION The problem to be solved by the invention is 201209950. However, the car made by the tool (4) has a piece of debris attached to the tool. Lowering the problem of lowering the quality of the workpiece. Further, when the debris adheres to the front end of the cutter, when the heat is generated, there is a problem that the cutter deteriorates. The present invention has been made in view of such a fact, and a technical problem thereof is to prevent stagnation, and debris is attached to the front end of the cutter to prevent a reduction in turning ability and to prevent the cutter from being deteriorated by heat. Means for Solving the Problems The present invention relates to a processing apparatus including a chuck table, a turning mechanism, a head rest placement mechanism, a loading mechanism, and a carry-out mechanism, the chuck table having a material to be added with X material Keep the face; the car structure has a turning chuck. a cutter for holding the workpiece and rotating the cutter; the chuck placement mechanism is configured to position the chuck table in a loading and unloading area for loading and unloading the workpiece to the lost platform The processing area of the area to be turned by the edging object; the loading mechanism is to carry the workpiece into the chuck table disposed in the loading and unloading area; the moving out mechanism removes the workpiece from the chuck table disposed in the loading and unloading area The processing apparatus is characterized in that a cooling water ejecting mechanism is provided, and the cooling water ejecting mechanism has a nozzle that ejects cooling water toward the tip end of the tool just after turning the workpiece placed in the processing area. Advantageous Effects of Invention Since the present invention includes a cooling water spray mechanism having a nozzle for immediately spraying a cooling water toward a front end of a tool after turning a workpiece placed in a processing region, the sprayed cooling water can be attached to the front end of the tool. Broken 8 4 201209950 pieces, which can prevent the turning ability of the tool from decreasing. Moreover, since the front end of the tool can be cooled by the cooling water, the deterioration of the tool due to heat can be prevented. Furthermore, since the cooling water is sprayed by the air, the debris can be effectively removed from the front end of the tool. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a processing apparatus. Fig. 2 is a schematic cross-sectional view showing an example of a cooling nozzle mechanism. Fig. 3 is a plan view showing an example of a semiconductor wafer. Fig. 4 is an explanatory view showing a state in which cooling water is sprayed to the tool and the bump of the semiconductor wafer is turned. Fig. 5 is a perspective view showing a state in which cooling water is sprayed to the tool and the bump of the semiconductor wafer is turned. [Embodiment of the invention] (1) Configuration of the apparatus The processing apparatus 1 shown in Fig. 1 is a device for processing a workpiece held by the chuck table 2 by the turning mechanism 3. The processing apparatus 1 is configured to perform a loading/unloading area 区域 in a region where the workpiece is attached to and detached from the chuck table 2, and a processing region B in a region where the workpiece is turned. In the front part of the processing apparatus 1, a mounting portion 4a on which a crucible 40a containing a workpiece before processing is placed, and a crucible mounting portion on which a crucible 40b for storing a processed object can be placed 4b. A loading/unloading mechanism 5 that takes out the workpiece from the crucible 40a and stores the workpiece into the crucible 40b is disposed in the vicinity of the crucible placing portions 4a and 4b. Carrying out 5 201209950 The loading mechanism 5 has an arm portion 51 that sucks and holds the holding portion % of the workpiece and moves the holding portion 5 至 to the desired position. In the movable area constituting the holding portion 5 of the carry-in/out mechanism 5, a workable object is disposed, and the workpiece 6 is positioned at a predetermined position. The registration mechanism 6 is composed of a mounting portion on which a workpiece can be placed and a plurality of projections 配 arranged in an arc shape and movable in the direction of rotation. The cleaning mechanism 7 for washing the workpiece after the turning process is disposed in the movable area constituting the holding portion 5 of the loading/unloading mechanism 5. The cleaning mechanism 7 has a rotary table 7G that holds the workpiece and is rotatable, and a nozzle (not shown) that discharges high-pressure water or high-pressure air to the workpiece held on the rotary table 7A. After the loading and unloading mechanism 5 is disposed, the carrying mechanism 8 for loading the workpiece before processing into the headrest 2 placed in the loading and unloading area A is disposed, and is carried out from the chuck table 2 placed in the loading and unloading area A. The unloading mechanism 9 of the workpiece. The loading mechanism 8 is configured by a holding portion 8 that sucks the workpiece, and is configured to be movable up and down and spirally wound, and the holding portion 80 is moved to the arm portion 81 at the desired position, and the carrying-out mechanism 9 is held by the holding portion 9 that sucks the workpiece. The arm portion 91 is configured to be movable up and down and to be wound to move the holding portion 90 to the desired position. The turning mechanism 3 is disposed in the machining region b, and includes a rotary shaft 30 having a shaft center in a wrong direction, a motor 31 for rotationally driving the rotary shaft 30, a seat 32 formed at a lower end of the rotary shaft 30, and a cutter fixed to the seat 32. The configuration is such that the rotary shaft 30 is rotated by the motor 31, and the cutter 33 can be rotated by the circular orbit. The turning mechanism 3 can be driven by the turning feed mechanism 1 to be raised and lowered. The turning feed mechanism 10 has a ball screw 1 that extends in the vertical direction, a guide rail 101 that is disposed in parallel with the ball screw 8 201209950 rod 100, and is coupled to the end of the ball screw 1 to make the ball screw 100 The pulsating pulse motor 1 〇 2, the inner nut not shown in the figure is screwed to 100, and the side portion is in sliding contact with the guide rail 1 〇 1 , and the vehicle can be fixed to the lifting member (10) of the structure 3, On the other hand, the ball screw 100 is rotated by the pulse motor 102, and the lifting member 1〇3 can be guided by the guide rail 101 to be lifted and lowered, whereby the turning mechanism 3 can be moved up and down. The chuck table 2 has a holding surface 2〇 for holding the workpiece, is rotatable, and is movable in the horizontal direction by the chuck table female mechanism 11, and is movable between the loading and unloading area A and the processing area B. The chuck table mounting mechanism n is constituted by a support tube 11 that supports the chuck table 2 so as to be rotatable and movable in the horizontal direction, and a coil tube that expands and contracts with the horizontal movement of the support table 110, and the coil tube m functions as a The cover member functions to prevent water used during processing or debris generated by processing from entering the inside of the device. A cooling water injection mechanism 12 that sprays cooling water toward the cutter 33 constituting the turning mechanism 3 is disposed in the vicinity of the turning mechanism 3. The cooling water injection mechanism 12 has a nozzle 120 that sprays cooling water. Further, a drain port 13 for discharging the cooling water discharged from the nozzle 120 is formed in the processing region B. The drain port 13 is formed at a position lower than the support table 11 and the upper portion of the flexible tube 111. As shown in Fig. 2, a discharge port 12〇a is formed inside the nozzle 120. The structure of the discharge port 120a is connected to the air flow path 123 and the || communicated by the valve 12' to the compressed air source 122. The water flow path 126 is connected to the water source 125 by the valve 124'. The water flow path 26 is merged with the air flow path 123. The water can be accelerated by the compressed air and ejected from the discharge port 120a. (2) Operation of the device 7 201209950 Next, the operation of the bump B when the car B is formed on the bump B of the element D of the semiconductor wafer w shown in Fig. 3 is operated (4). The semiconductor wafer w is formed on the surface side longitudinally to form a dividing line L, and the element D is formed by dividing the predetermined line B. The bump b is formed to protrude from the element D. Referring to the description, a plurality of energized semiconductor wafers W are collected in g4Ga. Then, the holding unit % constituting the carry-out/transfer mechanism 5 is held "taken one by one" and then transported to the registration mechanism 6 and placed on the placing portion 6A. Then, by the direction in which the protrusions 61 are close to each other (four), the semiconductor wafer W can be positioned at a certain position. In the state of the eighth, the semiconductor wafer w is attached to the home portion of the loading mechanism 8, and the semiconductor wafer B1W is transferred to the chuck table 2 by the arm portion, and the holding surface 2 () is attracted and held by the semiconductor. The back side of the wafer (the side of the bump B is not formed). In this way, when the semiconductor wafer is held in the chuck, the chuck is moved to the processing area, and the semiconductor wafer w can be placed in the processing area. Then, 'by the motor 31, the rotating shaft 3〇 is rotated, the surface can be rotated by the cutter 33 = 6_RPM, and the surface is used to set the car I:: at a predetermined height. In this state, the second and second coffee makers (10) are provided. 33 contact semiconductor wafer height. * All bumps B, so that their heads - to a predetermined center: and: ^ ^ straight turning ^ in the direction of c rotation, not one! The bump B' also has an inactive position in the non-contact bump B The feeling 201209950 shape. Further, as shown in Fig. 5, cooling water and compressed air are supplied from the water source 125 and the compressed air source 122 to the nozzle 120 constituting the cooling water injection mechanism 12, and the cooling water is sprayed from the nozzle 120 toward the cutter 33 located at the inoperative position. 127, to clean the front end of the cutter 33, that is, the portion in contact with the bump. The cleaning of the cutter 33 by the cooling water 127 is performed after the processing of the bump B by the cutter 33. In this way, after the processing, by the cooling water hitting the cutter 33, each time the cutter 33 acts on the bump B, the cutter can be immediately washed, so that the debris attached to the front end of the cutter 33 can be washed each time. It can always prevent the reduction of turning ability. Therefore, the processing quality of the bump B is not lowered. Further, since the front end of the cutter 33 can be cooled, it is possible to prevent the cutter 33 from being deteriorated by heat. Further, since the cooling water is sprayed by the compressed air, the debris can be effectively removed from the front end of the cutter 33. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a processing apparatus. Fig. 2 is a schematic cross-sectional view showing an example of a cooling water injection mechanism. Fig. 3 is a plan view showing an example of a semiconductor wafer. Fig. 4 is an explanatory view showing a state in which cooling water is sprayed to the tool and the bump of the semiconductor wafer is turned. Fig. 5 is a perspective view showing a state in which cooling water is sprayed to the tool and the bump of the semiconductor wafer is turned. 201209950 [Description of main component symbols] 1.. Processing device 2. Cooling table 3.. Turning mechanism 4a, 4b... 匣 mounting section 5. Loading and unloading mechanism 6.. Alignment mechanism 7... Washing mechanism 8.. Loading mechanism 9.. Moving out mechanism 10.. Turning feeding mechanism 11.. Chuck table setting mechanism 12. Cooling water jetting mechanism 13.. 20.. Holding surface 30.. Rotating shaft 31.. Motor 32... Seat 33.. Tool 40a, 40b...匣50, 80, 90... Holding parts 51, 81, 91... Arm portion 60.. Mounting portion 61.. Projection portion 70.. Rotary table 100.. Ball screw 101.. Guide rail 102.. Pulse motor 103.. Lifting member 110.. Support Table 111.. Snake tube 120.. nozzle 120a...spray outlet 12 124 124... Valve 122.. Compressed gas source 123.. Air flow path 124... Valve 125.. Water source 126.. Water flow path 127.. Cooling water A... Loading and unloading area B···Processing area (Fig. 1) B··. Bump (Fig. 3) C. .. Direction D. .. Element L... Dividing the predetermined line W...the semiconductor wafer 10