JP2004136397A - Water jet processing equipment - Google Patents

Abstract

To provide a water jet processing apparatus capable of discharging processing water mixed with abrasive particles accumulated in a nozzle after stopping a processing operation and preventing clogging of an injection hole by the abrasive particles.
A workpiece holding mechanism for holding a workpiece, a nozzle for jetting a water jet to the workpiece held by the workpiece holding mechanism, and high-pressure processing in which abrasive grains are mixed into the nozzle A water jet processing apparatus comprising: a processing water supply unit for supplying water; and a clean water supply unit for supplying clean water to a nozzle.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a water jet processing apparatus for cutting a workpiece such as a semiconductor wafer by jetting a high-pressure water jet.
[0002]
[Prior art]
In a semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice on the surface of a semiconductor wafer having a substantially disk shape, and each region where the circuits are formed is formed into a predetermined street. Individual semiconductor chips are manufactured by dicing along a cutting line called "cutting line". The semiconductor chips thus divided are packaged and widely used for electric devices such as mobile phones and personal computers.
Electric devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology that can reduce the size of a semiconductor chip package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-lead Package (QFN) has been put to practical use. This package technology called QFN is based on a technique in which a plurality of connection terminals corresponding to connection terminals of a semiconductor chip are formed, and a plurality of semiconductor chips are mounted on a metal plate such as a copper plate in which streets defined for each semiconductor chip are formed in a grid pattern. Are arranged in a matrix, and the metal plate and the semiconductor chip are integrated by a resin portion molded with resin from the back surface side of the semiconductor chip to form a CSP substrate. The CSP substrate is cut along the streets to be divided into individually packaged chip size packages (CSP).
[0003]
The CSP substrate is cut by a precision cutting device generally called a dicing device. The dicing apparatus includes a cutting blade provided with an annular abrasive layer, and cuts the CSP substrate along the street by rotating the cutting blade and relatively moving along the street of the CSP substrate. Divide into CSPs. However, when the CSP substrate is cut by a cutting blade, burrs are generated on the connection terminals, and adjacent connection terminals are short-circuited, thereby deteriorating the quality and reliability of the chip size package (CSP).
[0004]
Further, when a workpiece such as a semiconductor wafer is cut by a cutting blade, not only the CSP substrate, there is also a problem that fine cutting chips adhere to the surface of the workpiece and become contaminated.
As a cutting technique that solves such problems in cutting with a cutting blade, a high-pressure water jet in which abrasive grains such as silica and garnet are mixed into a workpiece held by a workpiece holding mechanism is sprayed from a nozzle. Water jet cutting processing for cutting a workpiece has been proposed. (For example, refer to Patent Document 1.)
[0005]
[Patent Document 1]
JP-A-2002-205298 [0006]
[Problems to be solved by the invention]
Therefore, if the operation of the water jet processing apparatus is stopped and left for a while, the abrasive particles mixed in the processing water accumulated in the nozzle settle and close the injection hole, so that the injection hole of the nozzle is used at the next use. There is a problem that the holes are clogged and cannot be used.
[0007]
The present invention has been made in view of the above-mentioned facts, and its main technical problem is that after stopping the processing operation, the processing water mixed with the abrasive particles accumulated in the nozzle is discharged, and the injection hole by the abrasive particles is discharged. It is an object of the present invention to provide a water jet processing apparatus capable of preventing clogging of the water jet.
[0008]
[Means for Solving the Problems]
In order to solve the main technical problem, according to the present invention, a workpiece holding mechanism that holds a workpiece, a nozzle that jets a water jet to the workpiece held by the workpiece holding mechanism, A processing water supply unit for supplying high-pressure processing water mixed with abrasive grains to the nozzle,
It is provided with clean water supply means for supplying clean water to the nozzle,
A water jet processing apparatus is provided.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of a water jet processing apparatus constituted according to the present invention will be described in more detail with reference to the accompanying drawings.
[0010]
FIG. 1 is an exploded perspective view of a part of a water jet processing apparatus configured according to the present invention. The water jet processing apparatus shown in FIG. 1 includes a stationary base 2 and a workpiece holding mechanism 3 that is disposed on the stationary base 2 so as to be movable in a cutting and feeding direction indicated by an arrow X and holds a workpiece. A water jet injection unit support mechanism 4 disposed on the stationary base 2 so as to be movable in an indexing direction indicated by an arrow Y perpendicular to the direction indicated by the arrow X, and an arrow Z provided on the water jet injection unit support mechanism 4. The water jet injection unit 5 is provided so as to be movable in the direction shown by.
[0011]
The workpiece holding mechanism 3 includes a pair of guide rails 31, 31 disposed on the stationary base 2 in parallel along a direction indicated by an arrow X, and an arrow X on the guide rails 31, 31. A first sliding block 32 movably disposed in a direction, a second sliding block 33 movably disposed on the first sliding block 32 in a direction indicated by an arrow Y, and the second sliding block 33. And a base table 36 supported by a cylindrical member 34 on the sliding block 33. The base table 36 is attached to the upper end of a rotating shaft 340 that is disposed so as to pass through the inside of the cylindrical member 34, and is described below of the water jet injection unit 5 by a pulse motor (not shown) provided inside the cylindrical member 34. It is configured to be rotated in a plane perpendicular to the direction of the water jet injected from the nozzle, that is, in a horizontal plane. A detachable table for removably positioning a workpiece is placed and held on the base table 36. Hereinafter, the base table 36 and the detachable table will be described with reference to FIGS.
[0012]
2 is an exploded perspective view showing the detachable table 10, FIG. 3 is a perspective view showing the detachable table 10 and a CSP board 100 as a workpiece, and FIG. 4 shows a state in which the detachable table 10 is held on a base table 36. It is sectional drawing.
First, the base table 36 will be described with reference to FIGS.
The base table 36 in the illustrated embodiment is formed in a rectangular shape including a bottom wall 361, an upper wall 362, and a frame-shaped side wall 363, and includes a negative pressure chamber 360 formed by these walls. At the center of the bottom wall 361 of the base table 36, a negative pressure introducing hole 361a is formed, which communicates with the negative pressure chamber 360 and a passage 340a provided in the rotating shaft 340. The passage 340a provided in the rotating shaft 340 is connected to a suction source via a negative pressure control circuit (not shown). The upper wall 362 of the base table 36 is provided with a suction port 362a and a communication hole 362b which communicate with the negative pressure chamber 360 and open on the upper surface serving as a mounting surface. The suction port 362a is formed in the center, and the communication hole 362b is formed on the suction port 362a on the right side in FIG.
[0013]
As shown in FIG. 2, the detachable table 10 in the illustrated embodiment includes a rectangular parallelepiped relief member 11 and a holding tray 12 for holding the relief member 11. The relaxation member 11 is formed of urethane in the illustrated embodiment, and has an upper surface serving as a support surface 11a for supporting a workpiece. In addition, as a material constituting the relaxing member 11, a metal such as stainless steel, tungsten, nickel, and copper, and a ceramic such as alumina can be used in addition to a resin such as urethane. The relaxation member 11 is provided with a plurality of suction holes 11b that are open on the support surface 11a, which is the upper surface, and penetrate the lower surface. The suction holes 11b are formed at positions on the support surface 11a that face the individual chips into which the workpiece is divided.
[0014]
As shown in FIG. 2, the holding tray 12 constituting the attaching / detaching table 10 includes a rectangular bottom wall 121 and a frame-shaped side wall 122 formed to protrude upward from a peripheral edge of the bottom wall 121. It is open. The holding tray 12 is made of a metal material such as stainless steel. A frame-shaped support shelf 121a for placing and supporting the lower surface of the relaxing member 11 is formed around the upper surface of the bottom wall 121 constituting the holding tray 12. A communication hole 121b is formed in the bottom wall 121 of the holding tray 12 at a position corresponding to the communication hole 362b provided in the upper wall 362 of the base table 36. A check valve 123 is provided in the communication hole 121b as shown in FIG. The check valve 123 allows the flow when the negative pressure on the negative pressure chamber 360 side of the base table 36 is high, but shuts off the flow when the negative pressure in the holding tray 12 is high. That is, the check valve 123 allows the negative pressure to flow into the holding tray 12, but shuts off the negative pressure from the holding tray 12. In connection with the check valve 123, an operating rod 124 for opening the function of the check valve 123 is disposed on the bottom wall 121 constituting the holding tray 12. As shown in FIGS. 3 and 4, the lower portion of the relaxation member 11 is fitted to the holding tray 12 configured as described above from the upper opening side. In this fitted state, the periphery of the lower surface of the relaxation member 11 is placed on a frame-shaped support shelf 121 a formed on the bottom wall 121 constituting the holding tray 12. Therefore, a suction chamber 120 is formed between the upper surface of the bottom wall 121 and the lower surface of the relaxation member 11 as shown in FIG. As a result, the plurality of suction holes 11b formed in the relaxation member 11 communicate with the suction chamber 120.
[0015]
In the detachable table 10 configured as described above, the workpiece 100 such as the CSP board is placed on the support surface 11a which is the upper surface of the relaxation member 11, and as shown in FIG. On the upper surface. In this manner, when the detachable table 10 supporting the workpiece 100 on the support surface 11a of the relaxation member 11 is placed on the base table 36, a negative pressure control circuit (not shown) is controlled and provided on the rotating shaft 340. When the provided passage 340 a is communicated with a suction source (not shown), the suction passage 362 a provided on the bottom wall 361 of the base table 36, the negative pressure chamber 360, and the upper wall 362 of the base table 36 is provided. Negative pressure acts on the lower surface of the holding tray 12 constituting the detachable table 10, and the holding tray 12 is suction-held on the base table 36. On the other hand, when the negative pressure chamber 360 of the base table 36 is connected to the suction source as described above, the negative pressure chamber 360 is provided in the communication hole 362 b provided in the upper wall 362 of the base table 36 and in the bottom wall 121 of the holding tray 12. A negative pressure acts on the lower surface of the workpiece 100 through the check valve 123, the suction chamber 120, and the suction hole 11b provided in the relief member 11 provided in the communication hole 121b. It is held by suction.
[0016]
Returning to FIG. 1 and continuing the description, the first sliding block 32 is provided with a pair of guided grooves 321 fitted on the lower surface thereof so as to be fitted with the pair of guide rails 31, 31. A pair of guide rails 322 and 322 formed in parallel on the upper surface along the direction indicated by arrow Y are provided. The first sliding block 32 configured as described above is configured so that the guided grooves 321, 321 are fitted into the pair of guide rails 31, 31 so that the direction indicated by the arrow X along the pair of guide rails 31, 31. Is configured to be movable. The workpiece holding mechanism 3 in the illustrated embodiment includes first moving means 37 for moving the first sliding block 32 along the pair of guide rails 31, 31 in the direction indicated by the arrow X. I have. The first moving means 37 includes a male screw rod 371 disposed in parallel between the pair of guide rails 31 and 31, and a driving source such as a pulse motor 372 for driving the male screw rod 371 to rotate. I have. One end of the male screw rod 371 is rotatably supported by a bearing block 373 fixed to the stationary base 2, and the other end is power-coupled to the output shaft of the pulse motor 372 via a speed reducer (not shown). ing. The male screw rod 371 is screwed into a female screw hole (not shown) formed in a female screw block (not shown) protruding from the lower surface of the central portion of the first sliding block 32. Therefore, by driving the male screw rod 371 to rotate forward and reverse by the pulse motor 372, the first sliding block 32 is driven along the guide rails 31, 31 by the water jet jetting unit 5, which jets water jets from nozzles to be described later. It is moved in the direction indicated by arrow X in a plane perpendicular to the direction, that is, in a horizontal plane.
[0017]
The second sliding block 33 has a pair of guided grooves 331 and 331 fitted on a lower surface thereof with a pair of guide rails 322 and 322 provided on an upper surface of the first sliding block 32. By fitting the guided grooves 331 and 331 to the pair of guide rails 322 and 322, the guide grooves 331 and 331 can be moved in the direction indicated by the arrow Y. The workpiece holding mechanism 3 in the illustrated embodiment moves the second sliding block 33 in a direction indicated by an arrow Y along a pair of guide rails 322 and 322 provided on the first sliding block 32. A second moving means 38 is provided. The second moving means 38 includes a male screw rod 381 disposed in parallel between the pair of guide rails 322 and 322, and a drive source such as a pulse motor 382 for rotating the male screw rod 381. I have. One end of the male screw rod 381 is rotatably supported by a bearing block 383 fixed to the upper surface of the first sliding block 32, and the other end is connected to an output shaft of the pulse motor 382 via a speed reducer (not shown). Transmission connection. The male screw rod 381 is screwed into a female screw hole (not shown) formed in a female screw block (not shown) protruding from the lower surface of the center of the second sliding block 33. Therefore, by driving the male screw rod 381 to rotate forward and reverse by the pulse motor 382, the second sliding block 33 is moved along the guide rails 322 and 322 in the index feed direction indicated by the arrow Y perpendicular to the arrow X. .
[0018]
Bellows means 391 and 392 are provided on both sides of the support table 35 in the direction indicated by the arrow X, and each component other than the base table 36 constituting the workpiece holding mechanism 3 is provided by the bellows means 391 and 392. Covered. Opposing ends of the bellows means 391 and 392 are attached to the support table 35, respectively. Both end portions of the bellows means 391 and 392 are attached to the inner end walls 393a and 393b of the frame-shaped drain gutter means 393 disposed on the stationary base 2 by surrounding the workpiece holding mechanism 3. .
[0019]
The water jet injection unit support mechanism 4 includes a pair of guide rails 41, 41 disposed on the stationary base 2 in parallel along the index feed direction indicated by the arrow Y, and arrows on the guide rails 41, 41. The movable support base 42 is provided so as to be movable in the direction indicated by Y. The movable support base 42 includes a movable support portion 421 movably disposed on the guide rails 41, 41, and a mounting portion 422 attached to the movable support portion 421. The mounting portion 422 is provided with a pair of guide rails 422a and 422a extending in a direction indicated by an arrow Z on one side surface in parallel. The water jet injection unit support mechanism 4 in the illustrated embodiment is a third moving means for moving the movable support base 42 along the pair of guide rails 41, 41 in the direction indicated by the arrow Y which is the indexing feed direction. 43. The third drive means 43 includes a male screw rod 431 disposed in parallel between the pair of guide rails 41, 41, and a drive source such as a pulse motor 432 for driving the male screw rod 431 to rotate. I have. One end of the male screw rod 431 is rotatably supported by a bearing block (not shown) fixed to the stationary base 2, and the other end is transmission-coupled to the output shaft of the pulse motor 432 via a speed reducer (not shown). Have been. The male screw rod 431 is screwed into a female screw hole (not shown) formed in a female screw block (not shown) protruding from the lower surface of the central part of the movable support part 421 constituting the movable support base 42. Therefore, by driving the male screw rod 431 to rotate forward and reverse by the pulse motor 432, the movable support base 42 is moved along the guide rails 41, 41 in the indexing feed direction indicated by the arrow Y.
[0020]
The water jet injection unit 5 in the illustrated embodiment includes a unit holder 51 and a water jet injection unit 52 attached to the unit holder 51. The unit holder 51 is provided with a pair of guided grooves 51a, 51a that are slidably fitted to a pair of guide rails 422a, 422a provided on the mounting portion 422. The guided grooves 51a, 51a By being fitted to the guide rails 422a and 422a, it is movably supported in the direction indicated by the arrow Z. The water jet injection unit 5 in the illustrated embodiment includes a fourth moving unit 53 for moving the unit holder 51 along the pair of guide rails 422a and 422a in the direction indicated by the arrow Z. The fourth moving means 53 is, similarly to the first to third moving means, provided with a male screw rod (not shown) disposed between the pair of guide rails 422a and 422a, and for rotationally driving the male screw rod. A drive source such as a pulse motor 532 is driven, and a male screw rod (not shown) is driven to rotate forward and reverse by the pulse motor 532, so that the unit holder 51 and the water jet injection unit 52 are moved along the guide rails 422a and 422a by arrows. Move in the direction indicated by Z.
[0021]
The water jet injection means 52 includes a nozzle 522 disposed at the tip of a cylindrical casing 521 fixed to the unit holder 51 and extending substantially horizontally. The nozzle 522 will be described with reference to FIG.
The nozzle 522 shown in FIG. 5 includes a nozzle main body 522a, a passage 522b formed in the nozzle main body 522a, and an injection hole 522c having a diameter of 30 to 100 μm which communicates with the passage 522b and opens on the lower surface. In the nozzle 522 thus configured, a processing water introduction passage 522d communicating with the passage 522b is provided above the nozzle body 522a, and a clean water introduction passage communicating with the passage 522b at an intermediate portion of the nozzle body 522a. 522e is provided. A processing water supply unit described later is connected to the processing water introduction passage 522d, and a clean water supply unit described later is connected to the clean water introduction passage 522e.
[0022]
Next, the processing water supply means 6 and the clean water supply means 7 will be described with reference to FIG.
The processing water supply means 6 shown in FIG. 1 includes a processing water storage tank 61 and a high-pressure water generation means 62. The processing water storage tank 61 contains processing water in which fine abrasive grains such as silica and garnet are mixed in water, and is connected to a high-pressure water generating means 62 by a flexible pipe 63. The high-pressure water generating means 62 pressurizes the processing water to 300 to 500 megapascals (MPa). The processing water pressurized by the high-pressure water generating means 62 is supplied to the processing water introduction passage 522d of the nozzle 522 through a passage (not shown) provided in the flexible pipe 64 and the cylindrical casing 521.
[0023]
The clean water supply means 7 shown in FIG. 1 includes a clean water storage tank 71 and a pressure pump 72. The clean water storage tank 71 contains water for cleaning the nozzle 522, and is connected to a pressurizing pump 72 by a flexible pipe 73. The water sent out by the pressure pump 72 is supplied to the clean water introduction passage 522 e of the nozzle 522 through the flexible pipe 74 and the pipe 75. A check valve 76 is provided between the clean water introduction passage 522 e and the pipe 75 to shut off the flow from the clean water introduction passage 522 e to the pipe 75.
[0024]
An imaging unit 8 is provided at a front end of a casing 521 that constitutes the water jet injection unit 52. The imaging means 8 is composed of a microscope, a CCD camera, or the like for capturing an image of a street or the like formed on a workpiece such as a CSP board, and sends a captured image signal to a control means (not shown).
[0025]
The water jet processing apparatus in the illustrated embodiment is configured as described above, and the cutting operation will be described below mainly with reference to FIG.
With the base table 36 constituting the workpiece holding mechanism 3 positioned at the position shown in FIG. 1, the holding tray 12 of the detachable table 10 is suction-held on the base table 36 as described above, The workpiece 100 is suction-held on the support surface 11a. Next, the base table 36 and the attachment / detachment table 10 are moved along the guide rails 31, 31 by the operation of the first moving means 37, and are positioned immediately below the imaging means 8.
[0026]
When the base table 36 and the attachment / detachment table 10 are positioned directly below the imaging unit 58 as described above, a street formed on the workpiece 100 on which the attachment / detachment table 10 is held by the imaging unit 8 and a control unit (not shown); Image processing such as pattern matching for alignment with the nozzle 522 of the water jet injection unit 5 that jets a water jet along the street is performed, and alignment of the water jet injection position is performed.
[0027]
After the alignment is performed as described above, the base table 36 and the attachment / detachment table 10 are moved to a cutting area where the nozzle 522 of the water jet injection unit 5 is located, and the high-pressure water generation unit 62 of the processing water supply unit 6 is moved. In operation, high-pressure processing water is jetted as a water jet from the injection holes 522c of the nozzle 522 along the streets detected as described above in the workpiece 100 in the cutting area, and cut along the streets. In this cutting operation, the water jet penetrates the workpiece 100 at the time of cutting, but the cut water jet is received by the relaxation member 11 of the detachable table 10 and its momentum is reduced. Since the relaxation member 11 is gradually damaged by the action of the water jet, the relaxation member 11 is replaced after being used a predetermined number of times. The water whose power has been reduced after the cutting action falls from the bellows means 391 and 392 and flows to the frame-shaped drain gutter means 393.
[0028]
After cutting along the predetermined street as described above, the cutting operation is performed by indexing and feeding the base table 36 and the detachable table 10 in the indexing direction indicated by the arrow Y at intervals of the street. The index feed of the base table 36 and the detachable table 10 is performed by the second moving means 38 constituting the workpiece holding mechanism 3. Note that the index feed may be performed by the third moving unit 43 constituting the water jet injection unit support mechanism, but it is preferable to move the base table 36 because it affects the high-pressure water generating unit 62. When the cutting operation and the indexing operation are performed for all the streets extending in the predetermined direction in this way, the base table 36 and the detachable table 10 are rotated by 90 degrees, and each of the streets extending perpendicular to the predetermined direction is rotated. By executing the cutting operation and the indexing operation along the street, the workpiece 100 held on the detachable table 10 is divided into individual chips.
[0029]
When the workpiece 100 is divided into individual chips in this way, the operation of the high-pressure water generating means 62 is stopped, and the injection of the processing water from the injection holes 522c of the nozzle 522 is stopped. Then, the detachable table 10 and the base table 36 holding the workpiece 100 are returned to the positions shown in FIG. 1, and here, the communication between the detachable table 10 and the suction source is cut off. As a result, the suction holding of the detachable table 10 on the base table 36 is released. On the other hand, since the check valve 123 is provided in the communication hole 121b formed in the bottom wall 121 of the holding tray 12 constituting the attachment / detachment table 10, even if the communication with the suction source is cut off, the suction chamber 120 is kept open. It is maintained in a negative pressure state. As a result, the suction holding of the workpiece 100 by the detachable table 10 is maintained. At this time, the workpiece 100 is divided into individual chips, but the plurality of suction holes 11b provided in the relaxation member 11 are located on the support surface 11a at positions facing the individual chips into which the workpiece is divided. The suction holding is maintained even in the state of the chip. Therefore, the individual chips into which the workpiece 100 has been divided can be transported to a predetermined place while being suction-held on the detachable table 10. When each chip transported while being suction-held on the detachable table 10 is to be removed, the check rod 123 is opened by pushing the operating rod 124 disposed on the holding tray 12, and the inside of the suction chamber 120 becomes large. The air pressure is reached and the suction holding of each chip is released.
[0030]
When the processing operation is completed as described above, the water supply pump 72 of the clean water supply means 7 is operated to introduce clean water into the clean water introduction passage 522e of the nozzle 522 at a pressure of 1 to 10 megapascal (MPa). As a result, the processing water mixed with the abrasive remaining in the passage 522b of the nozzle 522 at the end of the processing operation is discharged together with the clean water through the injection hole 522c, and the high-pressure water generating means 62 is generated by the pressure of the clean water. Is pushed back to. Therefore, since only the clean water remains in the nozzle 522, even if the operation is stopped and left, the abrasive grains mixed in the processing water do not settle and clog the injection holes 522c. In the illustrated embodiment, an example is shown in which clean water is directly introduced into the nozzle 522, but clean water may be introduced into a path from the high-pressure water generating means 62 to the processing water supply passage 522d.
[0031]
【The invention's effect】
The water jet processing apparatus according to the present invention is configured as described above, and supplies a nozzle for jetting a water jet to the workpiece held by the workpiece holding mechanism, and supplies high-pressure processing water mixed with abrasive grains to the nozzle. In a water jet processing apparatus equipped with a processing water supply means, a clean water supply means for supplying clean water to the nozzle is provided, so that when the processing operation is completed, the clean water supply means is operated to introduce the clean water into the nozzle. By doing so, the processing water mixed with the abrasive grains remaining in the nozzle at the end of the processing operation is discharged together with the clean water. Therefore, since only the clean water remains in the nozzle, even if the operation is stopped and left, the abrasive grains mixed in the processing water do not settle and clog the injection holes.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a part of a water jet processing apparatus configured according to the present invention.
FIG. 2 is an exploded perspective view showing a relaxation member and a holding tray constituting a detachable table used in the water jet processing apparatus shown in FIG. 1;
FIG. 3 is a perspective view showing a detachable table and a workpiece to be used in the water jet processing apparatus shown in FIG. 1;
FIG. 4 is a sectional view showing a state in which the detachable table shown in FIG. 3 is held on a base table.
FIG. 5 is a sectional view of a nozzle for jetting a water jet used in the water jet processing apparatus shown in FIG.
[Explanation of symbols]
2: Stationary base 3: Workpiece holding mechanism 31: Guide rail 32: First sliding block 33: Second sliding block 35: Support table 36: Base table 4: Water jet injection unit support mechanism 41: Guide rail 42: movable support base 5: water jet injection unit 51: unit holder 52: water jet injection means 522: nozzle 522a: nozzle body 522c: injection hole 522d: processing water introduction passage 522e: clean water introduction passage 53: fourth Moving means 6: processing water supply means 61: processing water storage tank 62: high pressure water generation means 7: clean water supply means 71: clean water storage tank 72: pressurizing pump 76: check valve 8: imaging means 10: detachable table 11: Relaxing member 12: Holding tray 100: Workpiece

Claims (1)

A workpiece holding mechanism for holding the workpiece, a nozzle for jetting a water jet to the workpiece held by the workpiece holding mechanism, and high-pressure processing water mixed with abrasive grains is supplied to the nozzle. Processing water supply means, and a water jet processing apparatus comprising:
It is provided with clean water supply means for supplying clean water to the nozzle,
A water jet processing apparatus characterized by the above-mentioned.

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