CN110549223B - Water jet machining device - Google Patents

Water jet machining device Download PDF

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Publication number
CN110549223B
CN110549223B CN201910444907.XA CN201910444907A CN110549223B CN 110549223 B CN110549223 B CN 110549223B CN 201910444907 A CN201910444907 A CN 201910444907A CN 110549223 B CN110549223 B CN 110549223B
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China
Prior art keywords
nozzle
unit
motor
ejection
rotation speed
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CN201910444907.XA
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Chinese (zh)
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CN110549223A (en
Inventor
齐藤亮太
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Disco Corp
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

Provided is a water jet machining device, wherein the installed spray nozzle can be identified even after the spray nozzle is installed in the water jet machining device. The water jet machining device comprises: an ejection unit having an ejection nozzle that ejects pressurized liquid to a workpiece; and a nozzle determination unit that determines the diameter or area of the ejection nozzle, the ejection unit having a pump that pressurizes the liquid in accordance with the rotation speed of the motor, the nozzle determination unit having: a motor rotation speed storage unit that stores a rotation speed of a motor required to eject liquid from an ejection opening of the ejection nozzle at a predetermined pressure, in accordance with a diameter or an area of the ejection opening of the ejection nozzle; a determination unit that determines the diameter or area of an ejection opening of the ejection nozzle that ejects the liquid, based on the rotational speed of the motor when the liquid is ejected from the ejection nozzle at a predetermined pressure; and a notification unit that notifies the determination result of the determination unit.

Description

Water jet machining device
Technical Field
The present invention relates to a water jet machining apparatus that machines a workpiece by ejecting pressurized liquid.
Background
A cutting apparatus having an annular cutting tool attached thereto is mainly used for dividing a plate-shaped workpiece, such as a package substrate in which device chips arranged on a substrate are covered with a sealing material (mold resin) made of a resin, or a semiconductor wafer on which a plurality of devices are formed. The cutting tool is rotated to cut into the workpiece while the workpiece is held on the chuck table of the cutting device, thereby cutting the workpiece.
When a metal is contained in a workpiece, when the workpiece is cut by a cutting tool, the metal may contact the cutting tool and be elongated, thereby generating a whisker-like burr. Since the burr causes a reduction in the quality of chips obtained by dividing the workpiece, it is desirable to suppress the generation of the burr as much as possible when the workpiece is divided.
In order to suppress the generation of burrs, a method of dividing a workpiece by using a water jet machining apparatus has been proposed. The water jet machining apparatus performs machining such as removing a part of a workpiece by pressurizing water with a pump and jetting the pressurized water toward the workpiece. Patent documents 1 and 2 disclose methods of dividing a package substrate into a plurality of chips by jetting high-pressure water along streets (lines to divide) of the package substrate.
In addition, a method of removing burrs generated by cutting by a water jet while using a cutting tool in cutting a workpiece has been proposed. Patent document 3 discloses a machining apparatus in which a deburring nozzle that sprays high-pressure water is provided at a position adjacent to a cutting tool, and the deburring nozzle sprays high-pressure water toward a cutting groove formed by cutting a workpiece with the cutting tool to remove burrs.
Patent document 1: japanese patent laid-open publication No. 2004-130401
Patent document 2: japanese patent laid-open publication No. 2012-109327
Patent document 3: japanese patent laid-open publication No. 2016-157722
The water jet machining apparatus is provided with a jet nozzle for jetting high-pressure water from a jet port toward a workpiece. The shape and diameter of the ejection port of the ejection nozzle are set according to various processing conditions such as the size of the processing region, the shape of the processing region, and the material of the workpiece, and therefore, when the processing conditions are changed, the ejection nozzle needs to be replaced.
The replacement of the injection nozzle is performed by an operator who operates the water jet machining apparatus, but when the operator mistakenly installs the injection nozzle, the operator performs machining by the wrong injection nozzle, and there is a possibility that the workpiece cannot be properly machined, resulting in a defective product. Therefore, it is preferable to prevent machining by an erroneous spray nozzle by checking whether or not a proper spray nozzle is mounted in the water jet machining apparatus after replacement of the spray nozzle.
However, the injection nozzle is installed inside a water jet machining apparatus in which a plurality of components are arranged in a complicated manner. Therefore, once the injection nozzle is attached to the water jet machining apparatus, it is difficult to check the type of the injection nozzle, the diameter of the injection port, and the like.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a water jet machining apparatus capable of specifying an attached spray nozzle even after the spray nozzle is attached to the water jet machining apparatus.
According to one aspect of the present invention, there is provided a water jet machining apparatus including: a spray unit to which a spray nozzle for spraying pressurized liquid to a workpiece held on a chuck table for holding the workpiece is detachably attached; a moving unit relatively moving the chuck table and the spray nozzle; and a nozzle determination unit that determines a diameter or an area of the ejection nozzle, the ejection unit including a pump that pressurizes the liquid in accordance with a rotation speed of a motor, the nozzle determination unit including: a motor rotation speed storage unit that stores a rotation speed of the motor required to eject the liquid from the ejection opening of the ejection nozzle at a predetermined pressure in accordance with a diameter or an area of the ejection opening of the ejection nozzle; a determination unit that determines the diameter or area of the ejection opening of the ejection nozzle that has ejected the liquid, based on the rotation speed of the motor when the liquid has been ejected from the ejection nozzle at a predetermined pressure, with reference to the information stored in the motor rotation speed storage unit; and a notification unit that notifies the determination result of the determination unit.
Preferably, the jet nozzle determining unit further includes a nozzle type storage unit in which the type of the jet nozzle is stored in accordance with the diameter or the area of the jet port of the jet nozzle, the determining unit further determines the type of the jet nozzle based on the diameter or the area of the jet port of the jet nozzle determined in accordance with the rotation speed of the motor with reference to the information stored in the nozzle type storage unit, and the notifying unit notifies the type of the jet nozzle determined by the determining unit.
Preferably, the water jet machining apparatus further includes a cutting unit that cuts the workpiece held on the chuck table with a cutting tool.
Preferably, the pump is a plunger pump, and the rotation speed of the motor when the liquid is ejected from the ejection nozzle at a predetermined pressure is a rotation speed of the motor specified by a signal input to an inverter connected to the motor or a rotation speed of the motor detected by an encoder connected to the motor.
A water jet machining apparatus according to an aspect of the present invention includes a nozzle determination unit that determines a spray nozzle attached to the water jet machining apparatus based on a rotation speed of a motor connected to a pump that pressurizes a liquid. Thus, whether or not the water jet machining device is equipped with the proper jet nozzle can be confirmed, and the machined object can be prevented from being machined by the wrong jet nozzle to cause machining failure.
Drawings
Fig. 1 is a perspective view showing a water jet machining apparatus.
Fig. 2 (a) is a perspective view showing the frame unit, and fig. 2 (B) is an enlarged perspective view showing the workpiece.
Fig. 3 is a side view, partly in section, showing the water jet unit.
Fig. 4 (a) and 4 (B) are front views showing the ejection nozzle.
Fig. 5 is a graph showing a relationship between the pressure of the liquid ejected from the ejection nozzle and the rotation speed of the motor.
Fig. 6 is a perspective view showing an external appearance of the water jet machining apparatus.
Fig. 7 is a partially sectional front view showing a case where machining is performed by the cutting unit.
Fig. 8 is a partially sectional front view showing a case where machining is performed by the water jet unit.
Description of the reference symbols
2: a water jet machining device; 4: a base station; 4a: an opening; 4b: an opening; 4c: an opening; 6: a cassette supporting table; 8: a cartridge; 10: an X-axis moving mechanism; 12: a table cover; 14: a dustproof anti-dripping cover; 16: a temporary release mechanism; 16a, 16b: a guide rail; 18: a chuck table; 18a: a holding surface; 20: a clamp; 22: a cutting unit; 24: a water jet unit; 26: a support structure; 28a, 28b: a mobile unit; 30: a Y-axis guide rail; 32a, 32b: moving the plate along the Y axis; 34a, 34b: a Y-axis ball screw; 36: a Y-axis pulse motor; 38a, 38b: a Z-axis guide rail; 40a, 40b: moving the plate along the Z axis; 42a, 42b: a Z-axis ball screw; 44: a Z-axis pulse motor; 46a, 46b: a shooting unit; 48: a cleaning unit; 50: a spray nozzle; 50a: an ejection port; 52: a liquid; 54: a cover; 54a: an opening; 54b: a rim; 54c: an opening; 56: a tube; 60: a pump unit; 62: a pump; 64: a flow control unit; 66: an electric motor; 68: an inverter; 70: an encoder; 72: a liquid supply source; 80: a control unit; 82: a flow rate control unit; 84: a pressurization control unit; 90: a nozzle determination unit; 92: a motor rotation speed storage unit; 94: a nozzle type storage unit; 96: a determination unit; 98: a notification unit; 100: a spray nozzle; 100a: an ejection port; 100b: a flow path; 102: a spray nozzle; 102a: an ejection port; 102b: a flow path; 110: a cover; 112: a monitor; 114: a display lamp; 120: a main shaft; 122: a cutting tool; 11: a workpiece; 11a: cutting a groove; 13: a substrate; 13a: a front side; 13b: a back side; 15: a resin layer; 15a: a front side; 15b: a recess; 17: an adhesive tape; 19: an annular frame; 21: a frame unit; 23: and (4) separating channels.
Detailed Description
The present embodiment will be described below with reference to the drawings. Fig. 1 is a perspective view showing a water jet machining apparatus 2 according to the present embodiment. The water jet machining device 2 cuts a workpiece with a cutting tool and machines the workpiece by injecting pressurized liquid to the workpiece. In fig. 1, a part of the structure of the water jet machining apparatus 2 is shown by blocks.
The water jet machining device 2 includes a base 4 that supports each of the components constituting the water jet machining device 2. An opening 4a is formed at a front corner of the base 4, and a cartridge support base 6 which is raised and lowered by a raising and lowering mechanism (not shown) is provided in the opening 4a. A cassette 8 for accommodating a plurality of workpieces is mounted on the upper surface of the cassette support base 6. In fig. 1, for convenience of explanation, only the outline of the cartridge 8 is shown.
The workpiece is accommodated in the case 8 while being supported by the annular frame. Fig. 2 (a) is a perspective view showing a frame unit 21 that supports the workpiece 11 by the annular frame 19.
The workpiece 11 is a package substrate having a substrate 13 formed in a plate shape rectangular in plan view and a plurality of device chips (not shown) arranged on the front surface 13a side of the substrate 13. A resin layer (mold resin) 15 for sealing the plurality of device chips is formed on the front surface 13a side of the substrate 13. Here, a case where the workpiece 11 is a package substrate will be described as an example, but the type of the workpiece 11 is not limited. For example, the workpiece 11 may be a semiconductor wafer having devices such as an IC (Integrated Circuit) formed on the front surface thereof.
A circular adhesive tape 17 is attached to the back surface 13b side of the substrate 13, and the circular adhesive tape 17 has a diameter capable of covering the entire back surface 13b of the substrate 13. An annular frame 19 is attached along the outer periphery of the adhesive tape 17, and the back surface 13b side of the substrate 13 is attached to the central portion of the adhesive tape 17, thereby constituting a frame unit 21 formed of the work 11, the adhesive tape 17, and the annular frame 19, and the work 11 is supported by the annular frame 19 in a state where the resin layer 15 is exposed upward. However, the resin layer 15 may be attached to the adhesive tape 17 so that the rear surface 13b side of the substrate 13 is exposed upward.
Fig. 2 (B) is an enlarged perspective view showing the workpiece 11. The workpiece 11 is divided into a plurality of regions by a plurality of streets (lines to divide) 23 arranged in a grid shape so as to intersect each other. The work 11 is divided along the streets 23 and singulated to obtain a plurality of packaged devices each including a device chip.
Further, a plurality of recesses (cavities) 15b having an elliptical shape in plan view are formed on the front surface 15a side of the resin layer 15 along the streets 23. The recesses 15b are arranged such that the long axis direction thereof is along a direction perpendicular to the longitudinal direction of the streets 23, and the depth of the recesses 15b is smaller than the thickness of the resin layer 15.
A metal (electrode) connected to the device chip covered with the resin layer 15 is disposed inside the resin layer 15, and when the recessed portion 15b is formed on the front surface 15a side of the resin layer 15, the metal is exposed on the inner wall and bottom surface of the recessed portion 15b. When the workpiece 11 is divided into a plurality of packaged devices and each packaged device is mounted on another mounting board, the exposed metal functions as a connection electrode connected to a terminal formed on the mounting board side.
A rectangular opening 4b is formed in a side of the cassette support base 6 shown in fig. 1 so that the longitudinal direction thereof is along the X-axis direction (front-back direction, processing feed direction). In the opening 4b, a ball screw type X-axis movement mechanism 10, and a table cover 12 and a dust-proof drip-proof cover 14 that cover the upper portion of the X-axis movement mechanism 10 are disposed. The X-axis moving mechanism 10 has an X-axis moving table (not shown) covered with a table cover 12, and moves the X-axis moving table in the X-axis direction.
A temporarily placing mechanism 16 for temporarily placing the workpiece 11 is provided at a position close to the side of the cassette support base 6. The temporarily placing mechanism 16 includes, for example, a pair of guide rails 16a and 16b that approach and separate from each other while maintaining a state of being parallel to the Y-axis direction (the left-right direction, the indexing direction). The pair of guide rails 16a and 16b clamp the workpiece 11 drawn out from the cassette 8 in the X-axis direction and align the workpiece at a predetermined position.
A chuck table 18 for sucking and holding the workpiece 11 is provided on the upper surface of the X-axis movable table so as to be exposed from the table cover 12. The chuck table 18 is connected to a rotation driving source (not shown) such as a motor, and rotates about a rotation axis substantially parallel to the Z-axis direction (vertical direction). The chuck table 18 is moved in the X-axis direction together with the X-axis moving table and the table cover 12 by the X-axis moving mechanism 10.
The upper surface of the chuck table 18 constitutes a holding surface 18a for sucking and holding the workpiece 11. The holding surface 18a is formed substantially parallel to the X-axis direction and the Y-axis direction, and is connected to a suction source (not shown) such as an injector via a suction passage (not shown) or the like provided inside the chuck table 18.
Four jigs 20 are provided around the chuck table 18, and the four jigs 20 fix, from four sides, an annular frame 19 (see fig. 2 a) that supports the workpiece 11. In addition, a conveying unit (not shown) that conveys the workpiece 11 to the chuck table 18 and the like is disposed in a region adjacent to the opening 4b.
Above the chuck table 18 are provided: a cutting unit 22 that cuts the workpiece 11 with an annular cutting tool; and a water jet unit 24 that jets the pressurized liquid to the workpiece 11. A gate-shaped support structure 26 for supporting the cutting unit 22 and the water jet unit 24 is disposed on the upper surface of the base 4 so as to extend over the opening 4b.
Provided on the upper front surface of the support structure 26 are: a moving unit 28a that moves the cutting unit 22 in the Y-axis direction and the Z-axis direction; and a moving unit 28b that moves the water jet unit 24 in the Y-axis direction and the Z-axis direction.
The moving unit 28a has a Y-axis moving plate 32a, and the moving unit 28b has a Y-axis moving plate 32b. The Y-axis moving plate 32a and the Y-axis moving plate 32b are slidably attached to a pair of Y-axis rails 30, and the pair of Y-axis rails 30 are arranged on the front surface of the support structure 26 along the Y-axis direction.
A nut portion (not shown) is provided on the rear surface side (rear surface side) of the Y-axis moving plate 32a, and a Y-axis ball screw 34a is screwed into the nut portion, and the Y-axis ball screw 34a is provided along a direction substantially parallel to the Y-axis guide rail 30. A nut portion (not shown) is provided on the rear surface side (rear surface side) of the Y-axis moving plate 32b, and a Y-axis ball screw 34b is screwed into the nut portion, and the Y-axis ball screw 34b is provided along a direction substantially parallel to the Y-axis guide rail 30.
A Y-axis pulse motor 36 is connected to one end of each of the Y-axis ball screws 34a and 34 b. The Y-axis moving plate 32a moves in the Y-axis direction along the Y-axis guide 30 by rotating the Y-axis ball screw 34a by a Y-axis pulse motor 36 connected to the Y-axis ball screw 34 a. Further, the Y-axis moving plate 32b moves in the Y-axis direction along the Y-axis guide 30 by rotating the Y-axis ball screw 34b by the Y-axis pulse motor 36 connected to the Y-axis ball screw 34 b.
A pair of Z-axis guide rails 38a are provided on the front surface (front surface) side of the Y-axis moving plate 32a along the Z-axis direction, and a pair of Z-axis guide rails 38b are provided on the front surface (front surface) side of the Y-axis moving plate 32b along the Z-axis direction. Further, a Z-axis moving plate 40a is slidably attached to the pair of Z-axis guide rails 38a, and a Z-axis moving plate 40b is slidably attached to the pair of Z-axis guide rails 38b.
A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 40a, and a Z-axis ball screw 42a is screwed into the nut portion, and the Z-axis ball screw 42a is provided along a direction substantially parallel to the Z-axis guide rail 38 a. A Z-axis pulse motor 44 is connected to one end of the Z-axis ball screw 42a, and the Z-axis moving plate 40a is moved in the Z-axis direction along the Z-axis guide rail 38a by rotating the Z-axis ball screw 42a by the Z-axis pulse motor 44.
A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 40b, and a Z-axis ball screw 42b is screwed into the nut portion, and the Z-axis ball screw 42b is provided along a direction substantially parallel to the Z-axis guide rail 38b. A Z-axis pulse motor 44 is connected to one end of the Z-axis ball screw 42b, and the Z-axis moving plate 40b is moved in the Z-axis direction along the Z-axis guide rail 38b by rotating the Z-axis ball screw 42b by the Z-axis pulse motor 44.
A cutting unit 22 is provided at a lower portion of the Z-axis moving plate 40 a. An imaging unit (camera) 46a for imaging the workpiece 11 and the like sucked and held by the chuck table 18 is provided at a position adjacent to the cutting unit 22. Further, a water jet unit 24 is provided below the Z-axis moving plate 40b. An imaging unit (camera) 46b for imaging the workpiece 11 and the like sucked and held by the chuck table 18 is provided at a position adjacent to the water jet unit 24.
The positions of the cutting unit 22 and the imaging unit 46a in the Y-axis direction and the Z-axis direction are controlled by the moving unit 28a, and the positions of the water jet unit 24 and the imaging unit 46b in the Y-axis direction and the Z-axis direction are controlled by the moving unit 28 b. That is, the position of the cutting unit 22 and the position of the water jet unit 24 are independently controlled, respectively.
An opening 4c is formed in a region located on the opposite side of the opening 4a to the opening 4b. A cleaning unit 48 for cleaning the workpiece 11 is disposed in the opening 4c, and the workpiece 11 on which a predetermined process is performed on the chuck table 18 is cleaned by the cleaning unit 48.
The workpiece 11 can be cut by rotating an annular cutting tool (not shown) attached to the cutting unit 22 to cut into the workpiece 11. Specifically, the cutting unit 22 includes a spindle having an axial center in a direction substantially parallel to the holding surface 18a of the chuck table 18, and an annular cutting tool is attached to a tip end portion of the spindle. The cutting tool is constituted by, for example, an electroformed grindstone in which diamond abrasive grains are fixed by nickel plating.
The spindle is connected to a rotary drive source such as a motor, and a cutting tool attached to the spindle is rotated by a force transmitted from the rotary drive source. The cutting tool is rotated to cut into the workpiece 11 held by the chuck table 18, and the workpiece 11 and the cutting tool are relatively moved in the X-axis direction (machining feed direction), thereby cutting the workpiece 11.
Further, by ejecting the pressurized liquid from the water jet unit 24 toward the workpiece 11, it is possible to perform machining such as removal of a part of the workpiece 11 and removal of metal burrs formed on the workpiece 11. The removal of the burrs by the water jet unit 24 will be described later.
Fig. 3 is a side view, partly in section, showing the water jet unit 24. A detachable injection nozzle 50 is attached to the water jet unit 24, and the injection nozzle 50 injects a pressurized liquid 52 downward. The spray nozzle 50 is connected to a pump unit 60 (see fig. 1) that pressurizes the liquid, and the liquid supplied from the pump unit 60 is sprayed from a spray port 50a of the spray nozzle 50 toward the workpiece 11, thereby machining the workpiece 11.
In addition, the water jet unit 24 has a cover 54 covering the lower portion of the injection nozzle 50. The cover 54 is formed in a hemispherical shape (bowl shape) having an inner cavity, and an opening 54a is provided in a central region (top portion) of the cover 54 in a plan view. The spray nozzle 50 is inserted into the opening 54a, and the cap 54 is attached to the spray nozzle 50 such that the annular edge 54b faces the holding surface 18a of the chuck table 18.
As shown in fig. 3, when the workpiece 11 is processed by ejecting the liquid 52 from the ejection nozzle 50, the cover 54 is positioned so as to cover the region of the workpiece 11 to be processed. Therefore, the cover 54 prevents the mist and machining chips generated by machining from scattering. The shape of the cover 54 may be appropriately changed as long as it can prevent scattering of mist and machining chips. For example, the cover 54 may be formed in a conical shape having an inner cavity.
An opening 54c is formed in the cover 54 at a position different from the opening 54a, and the opening 54c is connected to one end of a pipe 56 provided outside the cover 54. The other end of the pipe 56 is connected to a suction source (not shown), and mist or machining chips generated inside the cover 54 by machining the workpiece 11 are sucked and removed through the pipe 56.
In addition, the position of the spray nozzle 50 can be controlled by the moving unit 28b shown in fig. 1. By controlling the moving unit 28b, the chuck table 18 and the spray nozzle 50 can be relatively moved.
As shown in fig. 1, the water jet unit 24 is connected to a pump unit 60. The pump unit 60 pressurizes a liquid such as water and supplies the pressurized liquid to the injection nozzle 50 of the water jet unit 24. The pump unit 60 is connected to the control unit 80, and the operation of the pump unit 60 is controlled by the control unit 80.
The pump unit 60 has a pump 62 that pressurizes the liquid. The pump 62 is connected to a liquid supply source 72 formed of a container or the like, and a liquid such as water supplied from the liquid supply source 72 is pressurized by the pump 62.
The pump 62 is connected to the liquid supply source 72 via the flow rate control unit 64, and the flow rate of the liquid supplied from the liquid supply source 72 to the pump 62 is controlled by the flow rate control unit 64. The flow rate control unit 64 is connected to the control unit 80, and the operation of the flow rate control unit 64 is controlled by the control unit 80.
Specifically, the control unit 80 includes a flow rate control unit 82 connected to the flow rate control unit 64. The flow rate control unit 82 controls the operation of the flow rate control unit 64 so that the liquid is supplied from the liquid supply source 72 to the pump 62 at a predetermined flow rate. Whether or not liquid is supplied from the liquid supply source 72 to the pump 62 can also be controlled by the flow control unit 64.
The pump 62 is connected to a motor 66, and controls the pressure of the liquid supplied from the flow rate control unit 64 according to the rotation speed of the motor 66. As the pump 62 for pressurizing the liquid in accordance with the rotation speed of the motor 66, for example, a plunger pump can be used.
An inverter 68 is connected to the motor 66, and the inverter 68 controls the rotation speed of the motor 66 in accordance with a signal output from the control unit 80. Specifically, the control unit 80 includes a pressurization control unit 84 connected to the inverter 68, and the pressurization control unit 84 outputs a signal for specifying the rotation speed (frequency) of the motor 66 to the inverter 68. When the signal is input to the inverter 68, the inverter 68 rotates the motor 66 at a rotation speed (command frequency) designated by the pressurization control unit 84.
The pump 62 pressurizes the liquid to a predetermined pressure in accordance with the rotation speed of the motor 66 controlled by the inverter 68. As a result, the liquid at a predetermined pressure is supplied to the jet nozzle 50 (see fig. 3) of the water jet unit 24, and the liquid 52 is jetted from the jet port 50a toward the workpiece 11.
An encoder 70 is connected to the motor 66, and the rotational speed of the motor 66 is detected by the encoder 70. The rotation speed of the motor 66 detected by the encoder 70 is output to the control unit 80.
When the pressurized liquid 52 is ejected from the water jet unit 24 onto the workpiece 11, a predetermined flow rate of the liquid is first supplied from the liquid supply source 72 to the pump 62 via the flow rate control unit 64, and the rotation speed of the motor 66 is controlled by the inverter 68. The pump 62 then pressurizes the liquid to a pressure corresponding to the rotational speed of the motor 66. The rotation speed of the motor 66 at this time is detected by the encoder 70 and output to the control unit 80. The liquid pressurized to a prescribed pressure is then supplied to the water jet unit 24 by the pump 62.
In this way, the water jet unit 24 and the pump unit 60 constitute a unit (jetting unit) that jets the liquid onto the workpiece 11 held by the chuck table 18 by pressurizing the liquid supplied from the liquid supply source 72.
Further, the control unit 80 is also connected to components such as the elevating mechanism for elevating the cassette support base 6, the X-axis moving mechanism 10, the chuck table 18, the conveying unit (not shown), the cutting unit 22, the moving units 28a and 28b, the imaging units 46a and 46b, and the cleaning unit 48, and the operations of these components are controlled by the control unit 80.
When the workpiece 11 is machined by the water jet unit 24, the shape and diameter of the injection port 50a of the injection nozzle 50 may need to be changed depending on machining conditions (the size of the machining region, the shape of the machining region, the material of the workpiece 11, and the like). In this case, the operator performs the operation of replacing the spray nozzle 50, but when the operator mistakenly attaches the spray nozzle 50, the workpiece 11 is machined by the wrong spray nozzle 50, which may cause a machining failure.
The water jet machining device 2 of the present embodiment includes a nozzle determination unit 90, and the nozzle determination unit 90 determines the type of the injection nozzle 50 attached to the water jet unit 24. After the replacement of the injection nozzle 50, the nozzle determination unit 90 confirms the type of the injection nozzle 50 attached to the water jet unit 24, and thus it is possible to prevent the machining failure from occurring due to the machining of the workpiece 11 by the wrong injection nozzle 50.
The type of the spray nozzle 50 can be distinguished, for example, by the diameter or the area of the spray opening 50a of the spray nozzle 50. Fig. 4 (a) is a front view showing an injection nozzle 100 as an example of the injection nozzle 50, and fig. 4 (B) is a front view showing an injection nozzle 102 as another example of the injection nozzle 50. The diameters of the ejection ports of the ejection nozzle 100 and the ejection nozzle 102 are different.
The spray nozzle 100 has a circular spray opening 100a for spraying the liquid, and the spray opening 100a is connected to the pump unit 60 (see fig. 1) through a flow path 100b formed inside the spray nozzle 100. The injection nozzle 102 similarly has a circular injection port 102a for injecting the liquid, and the injection port 102a is connected to the pump unit 60 (see fig. 1) through a flow path 102b formed inside the injection nozzle 102.
The diameter of the ejection opening 102a of the ejection nozzle 102 is larger than the diameter of the ejection opening 100a of the ejection nozzle 100. Specifically, the ejection opening 100a is formed to have a diameter
Figure BDA0002073295860000101
Is formed to have a diameter ^ the injection port 102a is formed>
Figure BDA0002073295860000102
Is circular.
The pressure of the liquid ejected from the ejection nozzles is determined according to the degree of pressurization of the liquid by the pump 62 provided in the pump unit 60, and the pressurization of the pump 62 is controlled by the rotation speed of the motor 66. That is, in order to eject the liquid at a predetermined pressure from the ejection nozzle, the motor 66 needs to be rotated at a predetermined rotation speed corresponding to the pressure. The relationship between the pressure of the liquid ejected from the ejection nozzles and the rotation speed of the motor 66 differs depending on the type of the ejection nozzles.
FIG. 5 is for a sample having a diameter
Figure BDA0002073295860000103
And an ejection nozzle 100 having an ejection orifice 100a and a nozzle tip having a diameter
Figure BDA0002073295860000104
The ejection nozzles 102 of the ejection openings 102a each show a graph of a relationship between the pressure of the liquid ejected from the ejection nozzle and the rotation speed (frequency) of the motor 66. Fig. 5 shows the rotation speed of the motor 66 required to eject the liquid from the ejection nozzle at a predetermined pressure (0 MPa to 70 MPa).
As shown in fig. 5, the relationship between the pressure of the liquid ejected from the ejection nozzle and the rotation speed of the motor 66 differs depending on the diameter of the ejection port of the ejection nozzle. Therefore, the relationship between the pressure of the liquid ejected from the ejection nozzle and the rotation speed of the motor 66 is recorded in advance for each diameter of the ejection opening, and when the ejection nozzle is replaced, the liquid is ejected from the replaced ejection nozzle at a predetermined pressure, and the rotation speed of the motor 66 at that time is detected, whereby the diameter of the ejection opening can be specified, and the type of the ejection nozzle can be determined.
The type of the spray nozzle may be determined based on a parameter other than the diameter of the spray nozzle. For example, the relationship between the pressure of the liquid ejected from the ejection nozzle and the rotation speed of the motor 66 is recorded in advance for each area of the ejection opening, and the type of the ejection nozzle can be determined by determining the area of the ejection opening of the ejection nozzle.
The control unit 80 shown in fig. 1 includes a nozzle determination unit 90, and the nozzle determination unit 90 determines the type of the injection nozzle 50 attached to the water jet unit 24. The nozzle determination unit 90 determines the type of the injection nozzle 50 by determining the diameter or the area of the injection port 50a based on the rotation speed of the motor 66 when the liquid is injected at a predetermined pressure from the injection port 50a of the injection nozzle 50 attached to the water jet unit 24. Specifically, the nozzle determination unit 90 includes: a motor rotation speed storage unit 92 that stores a relationship between the pressure of the liquid ejected from the ejection nozzle and the rotation speed of the motor 66; and a nozzle type storage unit 94 that stores the type of the ejection nozzle.
The motor rotation speed storage unit 92 stores the rotation speed of the motor 66 required for ejecting the liquid from the ejection nozzle at a predetermined pressure, for each diameter or area of the ejection opening of the ejection nozzle. That is, the relationship between the pressure of the liquid and the rotation speed of the motor 66 as shown in fig. 5 is stored in the motor rotation speed storage unit 92. The data stored in the motor rotation speed storage unit 92 is obtained by, for example, performing the following experiment in advance: the liquid is ejected from a plurality of ejection nozzles having different ejection port diameters or areas, and the pressure of the liquid and the rotation speed of the motor 66 at this time are recorded.
The nozzle type storage unit 94 stores the diameters or the areas of the ejection openings of the plurality of ejection nozzles and the types of the ejection nozzles having the diameters or the areas. As the type of the ejection nozzle, for example, the name, identification symbol, classification symbol, and the like of the ejection nozzle can be used. In fig. 1, the motor rotation speed storage unit 92 and the nozzle type storage unit 94 are provided separately, but the motor rotation speed storage unit 92 and the nozzle type storage unit 94 may be configured by a single storage unit.
The nozzle determination unit 90 includes a determination unit 96, and the determination unit 96 determines the diameter or the area of the ejection port 50a of the injection nozzle 50 attached to the water jet unit 24 and the type of the injection nozzle 50 by referring to the information stored in the motor rotation number storage unit 92 and the nozzle type storage unit 94.
The determination unit 96 receives the rotation speed (input rotation speed) of the motor 66 when the liquid is ejected at a predetermined pressure (predetermined pressure) from the ejection nozzle 50 attached to the water jet unit 24. The input rotation speed is input to the determination unit 96 from the pressurization control unit 84, for example. The input rotation speed is the same as the rotation speed (command frequency) of the motor 66 specified by a signal input from the pressurization control unit 84 to the inverter 68.
Whether or not the liquid is ejected from the ejection nozzle 50 at a predetermined pressure (predetermined pressure) can be checked by measuring the pressure of the liquid pressurized by the pump 62 with a pressure measuring instrument, for example. The pressure measuring instrument is provided, for example, in a flow path of the liquid from the pump 62 to the ejection port 50a of the ejection nozzle 50. The determination unit 96 determines the diameter or the area of the injection nozzle 50 based on the input rotation speed by referring to the information stored in the motor rotation speed storage unit 92.
For example, it is conceivable that the relationship between the pressure and the motor rotation speed shown in fig. 5 is stored in the motor rotation speed storage unit 92. When determining the type of the injection nozzle 50 attached to the water jet unit 24, the determination unit 96 refers to the information stored in the motor rotation speed storage unit 92 and determines which of the 2 types of injection nozzles shown in fig. 5 the injection nozzle 50 is, based on the input rotation speed input from the pressurization control unit 84.
Specifically, for each of the two types of ejection nozzles shown in fig. 5, the rotation speed of the motor (reference rotation speed) required to eject the liquid supplied from the liquid supply source 72 at a constant flow rate at a predetermined pressure is referred to. Then, it is determined whether or not the two reference rotational speeds coincide with the input rotational speed (or whether or not the difference between the two reference rotational speeds and the input rotational speed is equal to or less than a predetermined value), and it is determined which of the two types of injection nozzles the injection nozzle 50 attached to the water jet unit 24 is. Thus, the determination unit 96 determines the diameter of the ejection opening 50a of the ejection nozzle 50 (determination step 1).
The determination unit 96 receives the rotation speed of the motor 66 detected by the encoder 70 connected to the motor 66. The determination unit 96 may determine the diameter or the area of the ejection port 50a using the rotation speed of the motor 66 detected by the encoder 70 instead of the rotation speed of the motor 66 output from the pressurization control unit 84. In this case, the diameter or the area of the injection port 50a is determined according to the actual rotation speed of the motor 66, and the input of the rotation speed of the motor 66 from the pressurization control unit 84 to the determination unit 96 may be omitted.
Next, the determination unit 96 refers to the information stored in the nozzle type storage unit 94, and determines the type of the injection nozzle 50 based on the diameter or the area of the injection port 50a determined in the 1 st determination step (the 2 nd determination step). For example, the nozzle type storage unit 94 stores the diameters or areas of the ejection ports of the plurality of ejection nozzles in association with the identification marks of the ejection nozzles. In this case, the determination unit 96 compares the diameter or area of the ejection opening 50a determined in the above-described determination step 1 with the diameter or area of the ejection openings of the plurality of ejection nozzles stored in the nozzle type storage unit 94.
Then, the determination unit 96 identifies the ejection nozzle (or the ejection nozzle having a diameter or area difference of a certain value or less) having a diameter or area that matches the diameter or area of the ejection port 50a determined in the 1 st determination step, from among the plurality of ejection nozzles stored in the nozzle type storage unit 94, and identifies the type of the ejection nozzle (identification mark). Thereby, the type of the injection nozzle 50 attached to the water jet unit 24 is determined.
The type of the injection nozzle 50 determined by the determination unit 96 is output from the determination unit 96 to the notification unit 98, and is notified to the operator by the notification unit 98. The notification unit 98 is constituted by, for example, a monitor provided in the water jet machining apparatus 2.
Fig. 6 is a perspective view showing an external appearance of the water jet machining apparatus 2. As shown in fig. 6, a part of the components of the water jet machining apparatus 2 is covered with a cover 110, and a touch panel type monitor 112 as a user interface is provided on the side surface side of the cover 110. The operation of the monitor 112 is controlled by the control unit 80 (see fig. 1).
The type of the spray nozzle 50 determined by the determination unit 96 is displayed on the monitor 112. This allows the operator to confirm the type of the injection nozzle 50 attached to the water jet unit 24.
In the above description, the description has been given of the case where the type of the ejection nozzle 50 is displayed in the notification portion 98, but the diameter or the area of the ejection opening 50a of the ejection nozzle 50 may be displayed in the notification portion 98. In this case, after the determination unit 96 performs the 1 st determination step, information on the diameter or area of the ejection port 50a is output to the notification unit 98, and the notification unit 98 displays the diameter or area of the ejection port 50 a. In this way, when the notification portion 98 displays the diameter or the area of the ejection opening 50a, the nozzle type storage portion 94 and the 2 nd determination step can be omitted.
In addition, as the notification unit 98, a device other than the monitor 112 may be used. For example, the indicator lamp 114 provided on the upper surface side of the cover 110 may notify the kind of the ejection nozzle 50. In this case, the type of the ejection nozzle 50 is indicated by a lighting color, a lighting pattern, or the like of the display lamp 114. The operation of the indicator lamp 114 is controlled by the control unit 80 (see fig. 1).
As described above, the water jet machining device 2 according to the present embodiment includes the nozzle determination unit 90, and the nozzle determination unit 90 determines the injection nozzle 50 mounted on the water jet unit 24 according to the rotation speed of the motor 66 connected to the pump 62 that pressurizes the liquid. This makes it possible to check whether or not the water jet unit 24 has the appropriate injection nozzle 50 attached, and to prevent a machining failure from occurring due to machining of the workpiece 11 by the wrong injection nozzle 50.
The water jet unit 24 provided in the water jet machining apparatus 2 described above may be used alone to machine the workpiece 11, or may be used together with the cutting unit 22 to machine the workpiece 11. An example of machining the workpiece 11 shown in fig. 2 (B) using both the cutting unit 22 and the water jet unit 24 will be described below.
Fig. 7 is a partially sectional front view showing a case where machining is performed by the cutting unit 22. The upper surface of the chuck table 18 constitutes a holding surface 18a that performs suction holding of the workpiece 11, and the holding surface 18a is connected to a suction source (not shown) via a suction path (not shown) or the like provided inside the chuck table 18.
A cutting unit 22 for cutting the workpiece 11 is disposed above the chuck table 18. The cutting unit 22 includes a spindle 120 having an axial center in a direction substantially parallel to the holding surface 18a, and an annular cutting blade 122 is attached to a distal end portion of the spindle 120. The spindle 120 is coupled to a rotary drive source (not shown) such as a motor, and the cutting tool 122 attached to the spindle 120 is rotated by a force transmitted from the rotary drive source.
When processing the workpiece 11, first, the workpiece 11 is placed on the holding surface 18a of the chuck table 18 via the adhesive tape 17, and the ring frame 19 is fixed by the jig 20. In this state, negative pressure from the suction source is applied to the holding surface 18a, and the workpiece 11 is sucked and held by the chuck table 18 via the adhesive tape 17.
Subsequently, the spindle 120 is rotated to cut the cutting blade 122 into the front surface 15a side of the resin layer 15. Then, the chuck table 18 is moved in a direction (machining feed direction) substantially parallel to the holding surface 18a and substantially perpendicular to the axial center of the spindle 120, and the workpiece 11 and the cutting tool 122 are relatively moved along the streets 23 (see fig. 2B). As a result, a linear cut groove 11a is formed in the workpiece 11 along the street 23.
A recess 15b is formed along the streets 23 on the front surface 15a side of the resin layer 15, and a metal connected to the device chip (not shown) covered with the resin layer 15 is exposed inside the recess 15b. The cutting insert 122 is positioned such that the lower end thereof is positioned below the bottom of the recess 15b and above the back surface 13b of the substrate 13. Therefore, the depth of the cutting groove 11a is larger than the depth of the recess 15b and smaller than the thickness of the workpiece 11, and the workpiece 11 is not completely cut.
When the workpiece 11 is cut along the streets 23 in this way, the metal exposed in the concave portion 15b may be elongated by contact with the cutting tool 122, and a whisker-like burr formed of the metal may be generated on a surface (cut surface) generated by cutting the workpiece 11. If the burrs remain inside the concave portion 15b, the burrs are preferably removed because the burrs may hinder the connection of the metal exposed inside the concave portion 15b to another metal (e.g., a connection terminal of a mounting board) in a subsequent step. Therefore, after the workpiece 11 is cut by the cutting tool 122, burrs remaining inside the cutting groove 11a are removed by the water jet unit 24.
Fig. 8 is a partially sectional front view showing a case where machining is performed by the water jet unit 24. After the cutting groove 11a is formed in the workpiece 11, as shown in fig. 8, the jet nozzle 50 of the water jet unit 24 is positioned so that the jet port 50a is disposed in the cutting groove 11a. Then, the pressurized liquid is supplied from the pump unit 60 (see fig. 1) to the water jet unit 24, and the liquid 52 is ejected from the ejection port 50a toward the cutting groove 11a at a predetermined pressure.
Thereby, the burr remaining in the recess 15b is blown off by the liquid 52 and removed. The burr is removed by the water jet unit 24 in a state where the workpiece 11 is not completely cut. Therefore, the individual pieces of the workpiece 11 can be prevented from falling off the adhesive tape 17 by the ejection of the pressurized liquid 52.
The movement of the water jet unit 24 is controlled independently of the cutting unit 22 by a moving unit 28b (see fig. 1). Therefore, the position at which the pressurized liquid 52 is ejected can be freely set. For example, after one cutting groove 11c is formed by the cutting tool 122, the water jet unit 24 is relatively moved along the cutting groove 11c, and the liquid 52 is ejected to the cutting groove 11c to remove burrs.
The timing of removing the burr is not limited to the above timing. For example, after the cut grooves 11a are formed along all the streets 23, the burrs may be removed together. Further, while one cutting groove 11c is being cut by the cutting means 22, the water jet means 24 may be moved relatively along the other already formed cutting groove 11c to remove burrs. In this case, the cutting of the workpiece 11 and the removal of the burr can be performed simultaneously.
After the removal of the burrs by the water jet unit 24 is completed, the workpiece 11 is further cut along the streets 23 by the cutting unit 22. At this time, the cutting blade 122 is positioned so that the lower end is positioned below the rear surface 13b of the substrate 13. Thereby, the workpiece 11 is divided along the streets 23. The dicing is performed along all the streets 23, thereby dividing the work 11 into a plurality of packaged devices.
When the burrs are removed by the water jet unit 24, the appropriate injection nozzle 50 is selected and attached to the water jet unit 24 according to the material and thickness of the workpiece 11, the shape and depth of the cutting groove 11c, and the like. At this time, the nozzle determination unit 90 shown in fig. 1 can appropriately perform the flash removal by checking whether or not the appropriate spray nozzle 50 is mounted.
In addition, the structure, method, and the like of the above embodiments may be modified and implemented as appropriate without departing from the scope of the object of the present invention.

Claims (3)

1. A water jet machining apparatus, wherein,
the water jet machining device comprises:
a spray unit to which a spray nozzle for spraying pressurized liquid to a workpiece held on a chuck table for holding the workpiece is detachably attached;
a moving unit relatively moving the chuck table and the spray nozzle; and
a nozzle determination unit which determines the diameter or area of the injection nozzle,
the injection unit has a pump that pressurizes the liquid according to the rotation speed of the motor,
the nozzle determination unit includes:
a motor rotation speed storage unit that stores a rotation speed of the motor required to eject the liquid from the ejection opening of the ejection nozzle at a predetermined pressure in accordance with a diameter or an area of the ejection opening of the ejection nozzle;
a nozzle type storage unit for storing the type of the injection nozzle according to the diameter or area of the injection port of the injection nozzle;
a determination unit that determines the diameter or area of the ejection opening of the ejection nozzle that has ejected the liquid based on the rotation speed of the motor when the liquid has been ejected from the ejection nozzle at a predetermined pressure with reference to the information stored in the motor rotation speed storage unit, and then further determines the type of the nozzle based on the diameter or area of the ejection opening of the ejection nozzle that has been determined based on the rotation speed of the motor with reference to the information stored in the nozzle type storage unit; and
and a notification unit configured to notify the type of the nozzle determined by the determination unit.
2. The water jet machining apparatus according to claim 1,
the water jet machining apparatus further includes a cutting unit that cuts the workpiece held on the chuck table with a cutting tool.
3. The water jet machining apparatus according to claim 1 or 2,
the pump is a plunger pump and the pump is,
the rotation speed of the motor when the liquid is ejected from the ejection nozzle at a predetermined pressure is a rotation speed of the motor specified by a signal input to an inverter connected to the motor or a rotation speed of the motor detected by an encoder connected to the motor.
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