JP2004130401A - Water jet machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a water jet machining device equipped with a workpiece holding mechanism having a function of receiving high pressure water jet which has passed through a workpiece and moderating its force and also facilitating handling of the workpiece after cutting. <P>SOLUTION: This water jet machining device is provided with the workpiece holding mechanism for holding the workpiece 100, and a nozzle for jetting water jet to the workpiece held by the workpiece holding mechanism. The workpiece holding mechanism is composed of a base table 36 and an attaching/detaching table 10 for detachably positioning the workpiece on the base table. The attaching/detaching table is provided with a support face 101 for supporting the workpiece, and high pressure water receiving grooves 105 for receiving the water jet which was jetted from the nozzle and passed through the workpiece. Moderating members 105 for moderating the force of the water jet are filled in the high pressure receiving grooves. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a water jet processing apparatus for cutting a workpiece such as a semiconductor wafer by jetting a high-pressure water jet.
[0002]
[Prior art]
In a semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice on the surface of a semiconductor wafer having a substantially disk shape, and each region where the circuits are formed is formed into a predetermined street. Individual semiconductor chips are manufactured by dicing along a cutting line called "cutting line". The semiconductor chips thus divided are packaged and widely used for electric devices such as mobile phones and personal computers.
Electric devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology that can reduce the size of a semiconductor chip package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-lead Package (QFN) has been put to practical use. This package technology called QFN is based on a technique in which a plurality of connection terminals corresponding to connection terminals of a semiconductor chip are formed, and a plurality of semiconductor chips are mounted on a metal plate such as a copper plate in which streets defined for each semiconductor chip are formed in a grid pattern. Are arranged in a matrix, and the metal plate and the semiconductor chip are integrated by a resin portion molded with resin from the back surface side of the semiconductor chip to form a CSP substrate. The CSP substrate is cut along the streets to be divided into individually packaged chip size packages (CSP).
[0003]
The CSP substrate is cut by a precision cutting device generally called a dicing device. The dicing apparatus includes a cutting blade provided with an annular abrasive layer, and cuts the CSP substrate along the street by rotating the cutting blade and relatively moving along the street of the CSP substrate. Divide into CSPs. However, when the CSP substrate is cut by a cutting blade, burrs are generated on the connection terminals, and adjacent connection terminals are short-circuited, thereby deteriorating the quality and reliability of the chip size package (CSP).
[0004]
Further, when a workpiece such as a semiconductor wafer is cut by a cutting blade, not only the CSP substrate, there is also a problem that fine cutting chips adhere to the surface of the workpiece and become contaminated.
As a cutting technique for solving such a problem in the cutting by the cutting blade, a water jet cutting process for cutting a workpiece by injecting a high-pressure water jet to the workpiece held by the workpiece holding mechanism has been proposed. ing. (For example, refer to Patent Document 1.)
[0005]
[Patent Document 1]
Japanese Patent No. 2596768 [0006]
[Problems to be solved by the invention]
In the water jet cutting process, since the water jet penetrates the workpiece, it is necessary to prevent the workpiece holding means from damaging the workpiece by the water jet penetrating the workpiece. . For this reason, the workpiece holding means is configured to support the workpiece at a portion other than the cut portion, and jets a water jet penetrating the workpiece into the water tank. However, in the case of a workpiece formed in a lattice shape such as a CSP substrate, it is difficult to support and cut at a portion other than the cut portion, and it is difficult to handle the workpiece after cutting. is there. Therefore, in the case of a workpiece such as a CSP substrate, the workpiece holding means has a function of receiving a high-pressure water jet penetrating the workpiece and reducing the momentum thereof, and the workpiece after cutting. Need to be easy to handle.
[0007]
The present invention has been made in view of the above facts, and its main technical problem is to have a function of receiving a high-pressure water jet penetrating the workpiece and reducing its momentum, and to reduce the strength of the workpiece after cutting. An object of the present invention is to provide a water jet processing apparatus provided with a workpiece holding mechanism capable of facilitating handling.
[0008]
[Means for Solving the Problems]
In order to solve the main technical problem, according to the present invention, a workpiece holding mechanism for holding a workpiece, and a nozzle for jetting a water jet to the workpiece held by the workpiece holding mechanism are provided. In the equipped water jet processing equipment,
The workpiece holding mechanism includes a base table, and a detachable table that detachably positions the workpiece on the base table,
The attachment / detachment table includes a support surface for supporting the workpiece, and a high-pressure water receiving groove for receiving a water jet that is ejected from the nozzle and penetrates the workpiece. Filled with relieving cushioning material,
A water jet processing apparatus is provided.
[0009]
The attachment / detachment table forms the support surface corresponding to each of the chips into which the workpiece is divided, and communicates the suction hole opened in the support surface with the suction source through the base table. It is preferable that a communication unit is provided, and the base table is configured to hold the detachable table by suction and to connect the communication unit to a suction source. In addition, it is desirable that the communication means of the detachable table be provided with a check valve that permits the inflow of negative pressure into the detachable table but blocks the outflow of negative pressure in the detachable table.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of a water jet processing apparatus constituted according to the present invention will be described in more detail with reference to the accompanying drawings.
[0011]
FIG. 1 is an exploded perspective view of a part of a water jet processing apparatus configured according to the present invention. The water jet processing apparatus shown in FIG. 1 includes a stationary base 2 and a workpiece holding mechanism 3 that is disposed on the stationary base 2 so as to be movable in a cutting and feeding direction indicated by an arrow X and holds a workpiece. A water jet injection unit support mechanism 4 disposed on the stationary base 2 so as to be movable in an indexing direction indicated by an arrow Y perpendicular to the direction indicated by the arrow X, and an arrow Z provided on the water jet injection unit support mechanism 4. The water jet injection unit 5 is provided so as to be movable in the direction shown by.
[0012]
The workpiece holding mechanism 3 includes a pair of guide rails 31, 31 disposed on the stationary base 2 in parallel along a direction indicated by an arrow X, and an arrow X on the guide rails 31, 31. A first sliding block 32 movably disposed in a direction, a second sliding block 33 movably disposed on the first sliding block 32 in a direction indicated by an arrow Y, and the second sliding block 33. And a base table 36 supported by a cylindrical member 34 on the sliding block 33. The base table 36 is attached to the upper end of a rotating shaft 340 that is disposed so as to pass through the inside of the cylindrical member 34, and is described below of the water jet injection unit 5 by a pulse motor (not shown) provided inside the cylindrical member 34. It is configured to be rotated in a plane perpendicular to the direction of the water jet injected from the nozzle, that is, in a horizontal plane. A detachable table for removably positioning a workpiece is placed and held on the base table 36. Hereinafter, the base table 36 and the detachable table will be described with reference to FIGS. 2 and 3.
[0013]
FIG. 2 is a perspective view showing a CSP board 100 as a workpiece to be processed according to the present invention, and FIG. 3 is a cross-sectional view showing a state where the detachable table 10 is held on a base table 36.
First, the base table 36 will be described with reference to FIGS.
The base table 36 in the illustrated embodiment is formed in a rectangular shape including a bottom wall 361, an upper wall 362, and a frame-shaped side wall 363, and includes a negative pressure chamber 360 formed by these walls. At the center of the bottom wall 361 of the base table 36, a negative pressure introducing hole 361a is formed, which communicates with the negative pressure chamber 360 and a passage 340a provided in the rotating shaft 340. The passage 340a provided in the rotating shaft 340 is connected to a suction source via a negative pressure control circuit (not shown). The upper wall 362 of the base table 36 is provided with a suction port 362a and a communication hole 362b which communicate with the negative pressure chamber 360 and open on the upper surface serving as a mounting surface. The suction port 362a is formed in the center, and the communication hole 362b is formed on the right side of the suction port 362a in FIG.
[0014]
The attachment / detachment table 10 in the illustrated embodiment has a rectangular parallelepiped shape as shown in FIG. 2, and is made of a metal such as stainless steel, tungsten, nickel, or copper, or a ceramic such as alumina. A plurality of support surfaces 101 arranged in a lattice are formed on the upper surface of the detachable table 10. The plurality of support surfaces 101 are formed corresponding to individual chips into which the workpiece 100 such as a CSP substrate is divided. The attachment / detachment table 10 having the plurality of support surfaces 101 arranged in a lattice like this has a plurality of suction holes 102 respectively opened on the support surface 101, and a plurality of suction holes 102 communicating with the plurality of suction holes 102. And a communication hole 104 communicating with the communication passage 103 and opening on the lower surface. The communication hole 104 is formed at a position corresponding to the communication hole 362b provided in the upper wall 362 of the base table 36. Therefore, the communication hole 104 and the communication passage 103 formed in the detachable table 10 function as communication means for connecting the plurality of suction holes 102 to the suction source via the base table 36. A check valve 11 is provided in the communication hole 104 constituting the communication means, as shown in FIG. The check valve 11 allows the flow when the negative pressure on the negative pressure chamber 360 side of the base table 36 is large, but shuts off the flow when the negative pressure in the detachable table 10 is large. In other words, the check valve 11 allows the negative pressure to flow into the detachable table 10, but shuts off the negative pressure from the detachable table 10. In connection with the check valve 11, the detachable table 10 is provided with an operating rod 12 for opening the function of the check valve 11. Further, the detachable table 10 is provided with a plurality of high-pressure water receiving grooves 105 formed in a lattice around a plurality of support surfaces 101 arranged in a lattice. The plurality of high-pressure water receiving grooves 105 are formed at a predetermined depth, and the high-pressure water receiving grooves 105 are filled with a resin 106 such as urethane, for example, as a relaxation member for reducing the force of the water jet. In addition, it is preferable that the resin 106 such as urethane or the like as a relaxation member is formed by injecting a gel resin into the high-pressure water receiving groove 105 and solidifying the resin.
[0015]
In the detachable table 10 configured as described above, a workpiece 100 such as a CSP board is placed on a plurality of support surfaces 101, and is placed on an upper surface serving as a placement surface of a base table 36 as shown in FIG. Is placed. In this manner, when the detachable table 10 supporting the workpiece 100 on the support surface 101 of the relaxation member 11 is mounted on the base table 36, the negative pressure control circuit (not shown) is controlled to be provided on the rotating shaft 340. When the provided passage 340 a is communicated with a suction source (not shown), the suction passage 362 a provided on the bottom wall 361 of the base table 36, the negative pressure chamber 360, and the upper wall 362 of the base table 36 is provided. A negative pressure acts on the lower surface of the detachable table 10, and the detachable table 10 is suction-held by the base table 36. On the other hand, when the negative pressure chamber 360 of the base table 36 communicates with the suction source as described above, the communication hole 362 b provided on the upper wall 362 of the base table 36 and the communication hole 104 provided on the detachable table 10 are Negative pressure is applied to the lower surface of the workpiece 100 through the check valve 11, the communication passage 103, and the suction hole 102, and the workpiece 100 is suction-held on the detachable table 10.
[0016]
Returning to FIG. 1 and continuing the description, the first sliding block 32 is provided with a pair of guided grooves 321 fitted on the lower surface thereof so as to be fitted with the pair of guide rails 31, 31. A pair of guide rails 322 and 322 formed in parallel on the upper surface along the direction indicated by arrow Y are provided. The first sliding block 32 configured as described above is configured so that the guided grooves 321, 321 are fitted into the pair of guide rails 31, 31 so that the direction indicated by the arrow X along the pair of guide rails 31, 31. Is configured to be movable. The workpiece holding mechanism 3 in the illustrated embodiment includes first moving means 37 for moving the first sliding block 32 along the pair of guide rails 31, 31 in the direction indicated by the arrow X. I have. The first moving means 37 includes a male screw rod 371 disposed in parallel between the pair of guide rails 31 and 31, and a driving source such as a pulse motor 372 for driving the male screw rod 371 to rotate. I have. One end of the male screw rod 371 is rotatably supported by a bearing block 373 fixed to the stationary base 2, and the other end is power-coupled to the output shaft of the pulse motor 372 via a speed reducer (not shown). ing. The male screw rod 371 is screwed into a female screw hole (not shown) formed in a female screw block (not shown) protruding from the lower surface of the central portion of the first sliding block 32. Therefore, by driving the male screw rod 371 to rotate forward and reverse by the pulse motor 372, the first sliding block 32 is driven along the guide rails 31, 31 by the water jet jetting unit 5, which jets water jets from nozzles to be described later. It is moved in the direction indicated by arrow X in a plane perpendicular to the direction, that is, in a horizontal plane.
[0017]
The second sliding block 33 has a pair of guided grooves 331 and 331 fitted on a lower surface thereof with a pair of guide rails 322 and 322 provided on an upper surface of the first sliding block 32. By fitting the guided grooves 331 and 331 to the pair of guide rails 322 and 322, the guide grooves 331 and 331 can be moved in the direction indicated by the arrow Y. The workpiece holding mechanism 3 in the illustrated embodiment moves the second sliding block 33 in a direction indicated by an arrow Y along a pair of guide rails 322 and 322 provided on the first sliding block 32. A second moving means 38 is provided. The second moving means 38 includes a male screw rod 381 disposed in parallel between the pair of guide rails 322 and 322, and a drive source such as a pulse motor 382 for rotating the male screw rod 381. I have. One end of the male screw rod 381 is rotatably supported by a bearing block 383 fixed to the upper surface of the first sliding block 32, and the other end is connected to an output shaft of the pulse motor 382 via a speed reducer (not shown). Transmission connection. The male screw rod 381 is screwed into a female screw hole (not shown) formed in a female screw block (not shown) protruding from the lower surface of the center of the second sliding block 33. Therefore, by driving the male screw rod 381 to rotate forward and reverse by the pulse motor 382, the second sliding block 33 is moved along the guide rails 322 and 322 in the index feed direction indicated by the arrow Y perpendicular to the arrow X. .
[0018]
Bellows means 391 and 392 are provided on both sides of the support table 35 in the direction indicated by the arrow X, and each component other than the base table 36 constituting the workpiece holding mechanism 3 is provided by the bellows means 391 and 392. Covered. Opposing ends of the bellows means 391 and 392 are attached to the support table 35, respectively. Both end portions of the bellows means 391 and 392 are attached to the inner end walls 393a and 393b of the frame-shaped drain gutter means 393 disposed on the stationary base 2 by surrounding the workpiece holding mechanism 3. .
[0019]
The water jet injection unit support mechanism 4 includes a pair of guide rails 41, 41 disposed on the stationary base 2 in parallel along the index feed direction indicated by the arrow Y, and arrows on the guide rails 41, 41. The movable support base 42 is provided so as to be movable in the direction indicated by Y. The movable support base 42 includes a movable support portion 421 movably disposed on the guide rails 41, 41, and a mounting portion 422 attached to the movable support portion 421. The mounting portion 422 is provided with a pair of guide rails 422a and 422a extending in a direction indicated by an arrow Z on one side surface in parallel. The water jet injection unit support mechanism 4 in the illustrated embodiment is a third moving means for moving the movable support base 42 along the pair of guide rails 41, 41 in the direction indicated by the arrow Y which is the indexing feed direction. 43. The third drive means 43 includes a male screw rod 431 disposed in parallel between the pair of guide rails 41, 41, and a drive source such as a pulse motor 432 for driving the male screw rod 431 to rotate. I have. One end of the male screw rod 431 is rotatably supported by a bearing block (not shown) fixed to the stationary base 2, and the other end is transmission-coupled to the output shaft of the pulse motor 432 via a speed reducer (not shown). Have been. The male screw rod 431 is screwed into a female screw hole (not shown) formed in a female screw block (not shown) protruding from the lower surface of the central part of the movable support part 421 constituting the movable support base 42. Therefore, by driving the male screw rod 431 to rotate forward and reverse by the pulse motor 432, the movable support base 42 is moved along the guide rails 41, 41 in the indexing feed direction indicated by the arrow Y.
[0020]
The water jet injection unit 5 in the illustrated embodiment includes a unit holder 51 and a water jet injection unit 52 attached to the unit holder 51. The unit holder 51 is provided with a pair of guided grooves 51a, 51a that are slidably fitted to a pair of guide rails 422a, 422a provided on the mounting portion 422. The guided grooves 51a, 51a By being fitted to the guide rails 422a and 422a, it is movably supported in the direction indicated by the arrow Z. The water jet injection unit 5 in the illustrated embodiment includes a fourth moving unit 53 for moving the unit holder 51 along the pair of guide rails 422a and 422a in the direction indicated by the arrow Z. The fourth moving means 53 is, similarly to the first to third moving means, provided with a male screw rod (not shown) disposed between the pair of guide rails 422a and 422a, and for rotationally driving the male screw rod. A drive source such as a pulse motor 532 is driven, and a male screw rod (not shown) is driven to rotate forward and reverse by the pulse motor 532, so that the unit holder 51 and the water jet injection unit 52 are moved along the guide rails 422a and 422a by arrows. Move in the direction indicated by Z.
[0021]
The water jet injection means 52 includes a nozzle 522 disposed at the tip of a cylindrical casing 521 fixed to the unit holder 51 and extending substantially horizontally. The nozzle 522 has an injection port having a diameter of 30 to 100 μm, and is connected to the high-pressure water generation unit 55 via a passage (not shown) provided in the casing 521 and the flexible pipe 54. The high-pressure water generating means 55 is connected to a water tank 57 by a flexible pipe 56. The high-pressure water pressurized to 300 to 500 megapascals (MPa) by the high-pressure water generation unit 55 is jetted as a water jet from the nozzle 522 through a flexible pipe 54 and a passage (not shown) provided in the cylindrical casing 521. . The water tank 57 may be made of only water, but may be mixed with fine abrasive grains such as silica and garnet. Although the water jet injection means 52 in the illustrated embodiment is provided with one nozzle 522, a plurality of nozzles may be arranged in parallel so that a plurality of nozzles can be cut simultaneously.
[0022]
At a front end of a casing 521 constituting the water jet injection means 52, an imaging means 58 is provided. The image pickup means 58 is constituted by a microscope, a CCD camera, or the like for picking up an image of a street or the like formed on a workpiece such as a CSP board, and sends a picked-up image signal to a control means (not shown).
[0023]
The water jet processing apparatus in the illustrated embodiment is configured as described above, and the cutting operation will be described below mainly with reference to FIG.
With the base table 36 constituting the workpiece holding mechanism 3 positioned at the position shown in FIG. 1, the attachment / detachment table 10 is suction-held on the base table 36 as described above, and on the support surface 101 of the attachment / detachment table 10. The workpiece 100 is held by suction. Next, the base table 36 and the attachment / detachment table 10 are moved along the guide rails 31 by the operation of the first moving means 37, and are positioned immediately below the imaging means 58.
[0024]
When the base table 36 and the attachment / detachment table 10 are positioned directly below the imaging unit 58 as described above, a street formed on the workpiece 100 on which the attachment / detachment table 10 is held by the imaging unit 58 and a control unit (not shown); Image processing such as pattern matching for alignment with the nozzle 522 of the water jet injection unit 5 that jets a water jet along the street is performed, and alignment of the water jet injection position is performed.
[0025]
After the alignment is performed as described above, the base table 36 and the attachment / detachment table 10 are moved to the cutting area where the nozzle 522 of the water jet injection unit 5 is located. A water jet is jetted from the nozzle 522 along the detected street, and cut along the street. At the time of this cutting operation, the water jet penetrates the workpiece 100 at the time of cutting, but the cut water jet is made of a resin 106 such as urethane as a relaxation member filled in the high-pressure water receiving groove 105 of the detachable table 10. The momentum is reduced. Since the resin 106 such as urethane is gradually damaged by the action of the water jet, the gel-like resin is refilled into the high-pressure water receiving groove 105 and solidified after a predetermined number of uses. The water whose power has been reduced after the cutting action falls from the bellows means 391 and 392 and flows to the frame-shaped drain gutter means 393.
[0026]
After cutting along the predetermined street as described above, the cutting operation is performed by indexing and feeding the base table 36 and the detachable table 10 in the indexing direction indicated by the arrow Y at intervals of the street. The index feed of the base table 36 and the detachable table 10 is performed by the second moving means 38 constituting the workpiece holding mechanism 3. Note that the indexing feed may be executed by the third moving unit 43 constituting the water jet injection unit support mechanism, but it is preferable to move the base table 36 because it affects the high-pressure water generating unit 55. When the cutting operation and the indexing operation are performed for all the streets extending in the predetermined direction in this way, the base table 36 and the detachable table 10 are rotated by 90 degrees, and each of the streets extending perpendicular to the predetermined direction is rotated. By executing the cutting operation and the indexing operation along the street, the workpiece 100 held on the detachable table 10 is divided into individual chips.
[0027]
When the workpiece 100 is divided into individual chips in this manner, the detachable table 10 and the base table 36 holding the workpiece 100 are returned to the positions shown in FIG. And the suction source is disconnected. As a result, the suction holding of the detachable table 10 on the base table 36 is released. On the other hand, since the check valve 11 is provided in the communication hole 104 formed in the attachment / detachment table 10, the communication passage 103 and the suction hole 102 are maintained in a negative pressure state even when the communication with the suction source is cut off. You. As a result, the suction holding of the workpiece 100 by the detachable table 10 is maintained. At this time, the workpiece 100 is divided into individual chips, but since the plurality of suction holes 102 are opened in the support surface 101, the suction and holding is maintained even in the state of the chips. Therefore, the individual chips into which the workpiece 100 has been divided can be transported to a predetermined place while being suction-held on the detachable table 10. When removing each chip transported while being suction-held on the attachment / detachment table 10, when the operating rod 12 is pushed to open the check valve 11, the communication passage 103 and the inside of the suction hole 102 become atmospheric pressure. The suction holding of each chip is released.
[0028]
【The invention's effect】
The water jet processing apparatus according to the present invention is configured as described above, and the workpiece holding mechanism includes a base table and a detachable table that detachably positions the workpiece on the base table. Has a supporting surface for supporting the workpiece, and a high-pressure water receiving groove for receiving a water jet injected from the nozzle and penetrating the workpiece, and the high-pressure water receiving groove is filled with a relaxation member for reducing the force of the water jet. Therefore, the workpiece can be attached to and detached from the base table while the workpiece is supported by the detachable table, and the handling of the workpiece is facilitated. Further, the relief member is gradually damaged by the action of the water jet, but when the function is lost, the relief member may be filled in the high-pressure water receiving groove again, which is economical.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a part of a water jet processing apparatus configured according to the present invention.
FIG. 2 is a perspective view showing a detachable table and a workpiece to be used in the water jet processing apparatus shown in FIG.
FIG. 3 is a sectional view showing a state in which the detachable table shown in FIG. 3 is held on a base table.
[Explanation of symbols]
2: stationary base 3: workpiece holding mechanism 31: guide rail 32: first sliding block 33: second sliding block 35: support table 36: base table 360: negative pressure chamber 37: first moving means 38: second moving means 4: water jet injection unit support mechanism 41: guide rail 42: movable support base 43: third moving means 5: water jet injection unit 51: unit holder 52: water jet injection means 522: Nozzle 53: fourth moving means 55: high-pressure water generating means 57: water tank 58: imaging means 10: detachable table 101: support surface 102: suction hole 11: check valve 100: workpiece

Claims (4)

In a water jet processing apparatus including a workpiece holding mechanism that holds a workpiece, and a nozzle that jets a water jet to the workpiece held by the workpiece holding mechanism,
The workpiece holding mechanism includes a base table, and a detachable table that detachably positions the workpiece on the base table,
The attachment / detachment table includes a support surface for supporting the workpiece, and a high-pressure water receiving groove for receiving a water jet that is ejected from the nozzle and penetrates the workpiece. Filled with relieving cushioning material,
A water jet processing apparatus characterized by the above-mentioned. In the detachable table, the support surface is formed corresponding to each chip into which a workpiece is divided, and a suction hole opened in the support surface and the suction hole communicate with a suction source through the base table. Communication means,
The water jet processing apparatus according to claim 1, wherein the base table is configured to hold the detachable table by suction and to connect the communication unit to a suction source. The check means according to claim 2, wherein the communication means of the detachable table is provided with a check valve which permits the inflow of negative pressure into the detachable table, but shuts off the outflow of negative pressure in the detachable table. Water jet processing equipment. The base table is configured to be movable in a cutting direction and an indexing direction perpendicular to the cutting direction in a plane perpendicular to the direction of the water jet ejected from the nozzle, and is ejected from the nozzle. The water jet processing apparatus according to any one of claims 1 to 3, wherein the water jet processing apparatus is configured to be rotatable in a plane perpendicular to the water jet.

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