JPS6235805U - - Google Patents
Info
- Publication number
- JPS6235805U JPS6235805U JP12617485U JP12617485U JPS6235805U JP S6235805 U JPS6235805 U JP S6235805U JP 12617485 U JP12617485 U JP 12617485U JP 12617485 U JP12617485 U JP 12617485U JP S6235805 U JPS6235805 U JP S6235805U
- Authority
- JP
- Japan
- Prior art keywords
- dicing
- nozzle
- semiconductor wafer
- diamond blade
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims 2
- 239000010432 diamond Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
Description
第１図及び第２図はそれぞれ本考案を説明する
ための側面図、正面図、第３図及び第４図はそれ
ぞれ従来のダイシング装置を説明するための側面
図、正面図である。
主な図番の説明、１はブレード保持部、２はウ
エハー保持部、３はノズル、３ａは第１のノズル
、３ｂは第２のノズル、９は切溝、１０は洗浄液
である。
1 and 2 are a side view and a front view, respectively, for explaining the present invention, and FIGS. 3 and 4 are a side view and a front view, respectively, for explaining a conventional dicing apparatus. Explanation of main figure numbers: 1 is a blade holding part, 2 is a wafer holding part, 3 is a nozzle, 3a is a first nozzle, 3b is a second nozzle, 9 is a kerf, and 10 is a cleaning liquid.
Claims (1)
て切削するダイヤモンドブレードと前記半導体ウ
エハーに洗浄液を噴出するノズルとを備えたダイ
シング装置において、前記ノズルを前記ダイヤモ
ンドブレードの軌跡線上にも配置し、加工直後の
切溝内を直接洗浄するように構成したことを特徴
とするダイシング装置。 In a dicing apparatus equipped with a diamond blade that cuts a semiconductor wafer along its dicing line and a nozzle that spouts a cleaning liquid onto the semiconductor wafer, the nozzle is also arranged on the locus line of the diamond blade, so that the dicing groove can be cut immediately after processing. A dicing device characterized by being configured to directly clean the inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12617485U JPS6235805U (en) | 1985-08-19 | 1985-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12617485U JPS6235805U (en) | 1985-08-19 | 1985-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6235805U true JPS6235805U (en) | 1987-03-03 |
Family
ID=31019728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12617485U Pending JPS6235805U (en) | 1985-08-19 | 1985-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6235805U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010123823A (en) * | 2008-11-21 | 2010-06-03 | Disco Abrasive Syst Ltd | Cutting device |
| JP2013022717A (en) * | 2011-07-25 | 2013-02-04 | Shindengen Electric Mfg Co Ltd | Dicing device |
| JP2016159376A (en) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | Cutting device |
| JP2019206048A (en) * | 2018-05-29 | 2019-12-05 | 株式会社ディスコ | Water jet processing device |
-
1985
- 1985-08-19 JP JP12617485U patent/JPS6235805U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010123823A (en) * | 2008-11-21 | 2010-06-03 | Disco Abrasive Syst Ltd | Cutting device |
| JP2013022717A (en) * | 2011-07-25 | 2013-02-04 | Shindengen Electric Mfg Co Ltd | Dicing device |
| JP2016159376A (en) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | Cutting device |
| JP2019206048A (en) * | 2018-05-29 | 2019-12-05 | 株式会社ディスコ | Water jet processing device |