JP2016159376A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove fine chips adhering to a cutting groove of a plate-like workpiece.SOLUTION: A cutting device (1) includes: a chuck table (20) holding a plate-like workpiece (W); cutting means (30) which cuts the plate-like workpiece with a cutting blade (33); and a cleaning nozzle (41) having an injection tip (45) which injects a mixture formed by mixing washing water with high pressure air toward a cutting groove (64) of the plate-like workpiece cut by the cutting means. The mixture injected by the injection tip of the cleaning nozzle becomes misty droplets to remove fine chips adhering to a wall surface of the cutting groove.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a cutting apparatus that cuts a plate-shaped workpiece with a cutting blade while cleaning the plate-shaped workpiece with cleaning water.

  In the cutting apparatus, cutting waste (contamination) is generated when the plate-like workpiece is cut by the cutting blade, and the cutting waste adheres to the upper surface of the plate-like workpiece or the cutting groove formed in the plate-like workpiece. The cutting waste adhering to the plate-like workpiece is washed by the cleaning unit. However, if the plate-like workpiece is dried during the transfer to the washing unit, the cutting waste cannot be removed from the plate-like workpiece by the washing unit. For this reason, a cutting device for cleaning the plate-like workpiece on the chuck table (see Patent Document 1), or cutting water is always supplied to the upper surface of the plate-like workpiece, and cutting chips adhere to the upper surface of the plate-like workpiece and the cutting groove. A cutting device (see Patent Documents 2 and 3) for preventing the above has been proposed.

JP 2003-234308 A JP 2002-329685 A JP 2006-231474 A

  However, in the cutting apparatus described in Patent Documents 1-3, large cutting waste adhering to the surface of the plate-like workpiece can be removed by the cleaning water, but fine cutting that adheres to the cutting groove of the plate-like workpiece. Even the waste could not be removed sufficiently.

  This invention is made | formed in view of this point, and it aims at providing the cutting device provided with the washing | cleaning function which can remove the fine cutting waste adhering to the cutting groove of a plate-shaped workpiece.

  The cutting apparatus of the present invention includes a chuck table for holding a plate-like workpiece, a cutting means for cutting the plate-like workpiece held by the chuck table with a cutting blade, and the chuck table and the cutting means relatively in the X direction. Cutting feed means for cutting and feeding, index feed means for relatively feeding the chuck table and the cutting means in the Y direction, and a cutting groove obtained by cutting a plate-like workpiece held by the chuck table with the cutting means A cutting device comprising: a spindle for rotatably mounting the cutting blade; and a blade for projecting and covering a part of the cutting blade mounted on the spindle A cover, and the cleaning means sprays a mixed liquid in which cleaning water and high-pressure air are mixed toward the cutting groove cut by the cutting means. A cleaning nozzle having an injection port, a cleaning water supply means for supplying the cleaning water to the cleaning nozzle, and a high-pressure air supply means for supplying the high-pressure air to the cleaning nozzle. The cutting groove is washed with the liquid mixture ejected from the mouth.

  According to this configuration, the cleaning water and the high-pressure air are mixed, so that the mixed liquid is sprayed as droplets and ejected from the ejection port toward the cutting groove. By spraying the sprayed droplets onto the wall surface of the cutting groove, fine cutting chips are peeled off from the wall surface of the cutting groove and removed. In this way, sprayed droplets are sprayed aiming at the cutting groove rather than the surface of the plate-like workpiece, so that the sprayed droplets collide with the fine cutting waste adhering to the cutting groove, and the plate shape It makes it easy to remove fine cutting waste from the workpiece.

  According to the present invention, the fine cutting waste adhering to the cutting groove can be suitably removed by spraying spray droplets toward the cutting groove.

It is a perspective view of the cutting device concerning this embodiment. It is a top view of the plate-shaped workpiece | work which concerns on this Embodiment. It is a figure which shows an example of the cutting operation by the cutting device which concerns on this Embodiment. It is a figure which shows the washing | cleaning state of the cutting groove by the washing nozzle which concerns on this Embodiment. It is a figure which shows an example of adjustment operation | movement of the adjustment mechanism which concerns on a modification.

  Hereinafter, the cutting apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a cutting apparatus according to the present embodiment. FIG. 2 is a plan view of the plate-like workpiece according to the present embodiment. In the following description, a cutting device that cuts a package substrate as a plate-like workpiece will be described as an example. However, the present invention is not limited to this configuration. The cutting apparatus may be an apparatus that cuts a semiconductor wafer or an optical device wafer as a plate-like workpiece.

  As shown in FIG. 1, the cutting apparatus 1 cuts a plate-like workpiece W held on the chuck table 20 with a cutting blade 33 and cleans cutting chips (contamination) generated during the cutting on the chuck table 20. It is configured. As shown in FIG. 2A and FIG. 2B, the plate-like workpiece W includes a plurality of locations in the longitudinal direction of a substantially rectangular base material (for example, a resin plate for a semiconductor device, a metal plate for an LED device) 61 (this embodiment). In this case, device areas A1 are provided at three locations, and surplus areas A2 are provided so as to surround each device area A1. On the surface of the base material 61, each device region A1 is covered with a resin mold (for example, an epoxy resin or a silicone resin), so that a resin convex portion 62 is formed.

  The plate-like workpiece W is divided into a large number of regions by grid-like division planned lines 63. By cutting the plate-like workpiece W along the grid-like division planned line 63, the surplus region A2 is cut off from the plate-like workpiece W as an end material, and the device region A1 is divided as individual chips. The plate-like workpiece W is not limited to a package substrate after the device is mounted, such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate, but may be a substrate before the device is mounted. Further, either the semiconductor device or the LED device may be disposed in the device region A1.

  Returning to FIG. 1, a rectangular opening extending in the X direction is formed on the upper surface of the housing 10, and this opening is covered with a movable plate 11 movable together with the chuck table 20 and a bellows-shaped waterproof cover 12. Has been. Below the waterproof cover 12, ball screw type cutting feed means 21 (see FIG. 3) for cutting and feeding the chuck table 20 in the X direction is provided. A chuck table 20 is supported on the movable plate 11 via a θ table 22 so as to be rotatable around the Z axis. On the upper surface of the chuck table 20, a plurality of concave portions 23 that can accommodate the convex portions 62 of the plate-like workpiece W are formed at positions corresponding to the convex portions 62 of the plate-like workpiece W.

  In addition, on the upper surface of the chuck table 20, an entry groove 24 into which the cutting blade 33 enters is formed corresponding to the scheduled division line 63 of the plate-like workpiece W. A plurality of suction holes 27 for sucking and holding individual chips after the division of the plate-like workpiece W are formed in the bottom surface 25 of the concave portion 23 of the chuck table 20 in a region partitioned in a lattice shape by the entry grooves 24. . In addition, a plurality of suction holes 28 for sucking and holding the surplus area A2 of the plate-like workpiece W are formed in the support surface 26 around the recess 23. Each of the suction holes 27 and 28 is connected to a suction source (not shown) through a flow path in the chuck table 20.

  The cutting means 30 is positioned above the chuck table 20, indexed in the Y direction by a ball screw type index feeding means 31 (see FIG. 3), and in the Z direction by a ball screw type lifting means (not shown). Go up and down. The cutting means 30 is configured by rotatably mounting a cutting blade 33 on the tip of a spindle 32 and providing a box-shaped blade cover 34 that covers a part of the cutting blade 33 (substantially lower half) protruding. . The cutting blade 33 is formed in a ring shape by bonding abrasive grains such as diamond with a bonding material. The blade cover 34 is provided with a pair of cutting water nozzles 35 (only one is shown) that injects cutting water toward the cutting blade 33.

  The pair of cutting water nozzles 35 are formed in a substantially L shape extending from the rear lower end of the blade cover 34 toward the front, and the tip of each cutting water nozzle 35 is positioned at a substantially lower half of the cutting blade 33. Yes. A plurality of slits 36 (see FIG. 3) are formed at the tip of the cutting water nozzle 35, and cutting water is jetted from the slits 36 toward a cutting position by the cutting blade 33. The plate-like workpiece W is cut along the division line 63 by the cutting blade 33 rotating at high speed while cleaning and cooling the cutting portion by the cutting blade 33 with the cutting water sprayed from the cutting water nozzle 35.

  By the way, when a cutting groove is formed in the plate-like workpiece W by the cutting blade 33, fine cutting waste adheres to the wall surface of the cutting groove. At this time, the cutting water is ejected from the L-shaped cutting water nozzle 35 toward the cutting portion of the cutting blade 33, but since the droplets of the cutting water ejected from the cutting water nozzle 35 have a large particle size, they are large. Although it is suitable for removing machining waste, it is not suitable for removing fine cutting waste. Further, most of the droplets of the cutting water ejected from the cutting water nozzle 35 collide with the cutting blade 33 and the upper surface of the plate-like workpiece W without colliding with fine cutting chips adhering to the cutting groove. Flows out of the workpiece.

  Therefore, in the cutting apparatus 1 according to the present embodiment, a cleaning unit 40 for cleaning the cutting groove of the plate-like workpiece W cut by the cutting unit 30 is provided, and the plate-like workpiece W is mixed with a mixed liquid in which cleaning water and high-pressure air are mixed. The two grooves are cleaned with two fluids. By ejecting the mixed liquid from the injection port 45 (see FIG. 3) of the cleaning nozzle 41 of the cleaning means 40, the mixed liquid is sprayed into the cutting groove as spray droplets. At this time, the spray droplets are ejected at high speed, so that the cutting scraps are peeled off from the wall surface of the cutting groove by the collision between the droplets and the fine cutting scraps, and the droplets collide with the wall surface of the cutting groove. The cutting waste is washed away by the jet water flow generated.

  The support wall 13 in front of the cutting means 30 is provided with a curtain nozzle 50 that injects cleaning water over the entire surface of the plate-like workpiece W held by the chuck table 20 in the support wall 13. The curtain nozzle 50 extends in the Y direction orthogonal to the X direction, which is the moving direction of the chuck table 20, and is formed longer than the long side of the plate-like workpiece W. In the curtain nozzle 50, a plurality of injection ports 51 (see FIG. 3) are formed at equal intervals, and a water curtain is formed with the cleaning water injected from the plurality of injection ports 51. As the plate-like workpiece W passes through the water curtain, the entire plate-like workpiece W is washed with the washing water.

  The water curtain formed on the curtain nozzle 50 prevents re-attachment of the cutting waste removed from the cutting groove by the cleaning nozzle 41. A cleaning water supply source (cleaning water supply means) 42 and a high-pressure air supply source (high-pressure air supply means) 43 as cleaning means 40 are connected to the cleaning nozzle 41, and a cleaning water supply source 37 is connected to the curtain nozzle 50. Is connected. The cleaning nozzle 41 is supplied with cleaning water from a cleaning water supply source 42 and high-pressure air from a high-pressure air supply source 43. The curtain nozzle 50 is supplied with cleaning water from a cleaning water supply source 37.

  In this embodiment, cleaning water is supplied from the different cleaning water supply sources 42 and 37 to the cleaning nozzle 41 and the curtain nozzle 50. However, the cleaning nozzle 41 and the curtain nozzle 50 are cleaned from the same cleaning water supply source 42. Water may be supplied. Further, the support wall 13 is provided with an image pickup means 55 for alignment between the cutting means 30 and the chuck table 20. The cutting blade 33 is aligned with respect to the scheduled division line 63 by the image captured by the imaging unit 55. This imaging means 55 may be used for alignment of the cleaning nozzle 41 with respect to the cutting groove (division planned line 63). The position adjustment of the cleaning nozzle 41 with respect to the cutting groove will be described later.

  With reference to FIG.3 and FIG.4, the cutting operation by a cutting device is demonstrated. FIG. 3 is a diagram illustrating an example of a cutting operation by the cutting apparatus according to the present embodiment. FIG. 4 is a diagram showing a cleaning state of the cutting groove by the cleaning nozzle according to the present embodiment. In the present embodiment, the configuration in which the cutting operation by the cutting blade and the cleaning operation by the cleaning nozzle are performed at the same time has been described. However, the cleaning operation by the cleaning nozzle may be performed after the cutting operation by the cutting blade.

  As shown in FIGS. 3A and 3B, a cleaning nozzle connected to a cleaning water supply source 42 and a high-pressure air supply source 43 through valves 46 and 47 at the rear part (left side in the drawing) of the blade cover 34 of the cutting means 30. 41 is provided. The cleaning nozzle 41 has an injection port 45 that injects a mixed liquid obtained by mixing cleaning water and high-pressure air toward the cutting groove 64 cut by the cutting means 30. The cleaning water supplied from the cleaning water supply source 42 and the high pressure air supplied from the high pressure air supply source 43 are mixed in the mixing channel 48 in the cleaning nozzle 41, and the mixed liquid is sprayed from the injection port 45. Are ejected as droplets.

  In this case, the supply amounts of cleaning water and high-pressure air are controlled by the valves 46 and 47, and the particle size of the droplets ejected from the ejection port 45 is adjusted. For example, when the diameter of the cutting waste adhering to the cutting groove 64 is 0.5 μm to 2 μm, the diameter of the droplet ejected from the ejection port 45 is adjusted to be 1 μm to 4 μm. Further, the cleaning nozzle 41 is attached to the blade cover 34 so that the center of the injection port 45 of the cleaning nozzle 41 is positioned on a center line C that bisects the blade width of the cutting blade 33. Accordingly, by aligning the cutting blade 33 with the planned division line 63 of the plate-like workpiece W, the injection port 45 is aligned with the planned division line 63 (the cutting groove 64). In other words, the diameter of the droplet ejected from the ejection port 45 is set larger than the diameter of the cutting waste, the droplet collides with the cutting waste, and cleaning is effective when the movement energy of the droplet is larger than the positional energy of the cutting waste. Can be done. However, if the droplets are too large, they collide with a plurality of cutting chips and the cleaning effect is reduced, so it is desirable to make them slightly larger than the cutting chips.

  In the cutting apparatus 1 configured as described above, the plate-shaped workpiece W is placed on the upper surface of the chuck table 20 with the surface thereof facing downward. At this time, the convex portion 62 on the surface side of the plate-like workpiece W is positioned in the concave portion 23 of the chuck table 20. The convex portion 62 of the plate-like workpiece W is held on the bottom surface of the concave portion 23 of the chuck table 20, and the surplus area A <b> 2 of the plate-like workpiece W is held on the support surface 26 of the chuck table 20. In a state where the plate-like workpiece W is held on the chuck table 20, the grid-like division planned line 63 is aligned with the grid-like entrance groove 24 formed on the chuck table 20.

  Then, the cutting blade 33 is indexed in the Y direction by the index feeding means 31 and aligned with the scheduled division line 63, and the cutting blade 33 is moved to a height at which the plate-like workpiece W can be fully cut by the lifting means. . At this time, the ejection port 45 of the cleaning nozzle 41 is also aligned with the planned division line 63 and the ejection port 45 is moved to a height near the plate-like workpiece W. In this state, while the cutting water is jetted from the cutting water nozzle 35 and the mixed liquid is jetted from the cleaning nozzle 41, the chuck table 20 is cut and fed in the X direction to the cutting blade 33 that rotates at high speed.

  As a result, the cutting blade 33 enters the entrance groove 24 of the chuck table 20, and the plate-like workpiece W is cut along the scheduled division line 63. As a result, a cutting groove 64 is formed along the scheduled division line 63 behind the cutting blade 33. When cutting the plate-like workpiece W, fine cutting debris adheres to the wall surface of the cutting groove 64, but the mixed liquid of cleaning water and high-pressure air is cut from the injection port 45 of the cleaning nozzle 41 positioned directly above the cutting groove 64. It is injected toward the groove 64. The mixed liquid becomes spray droplets and collides with the wall surface of the cutting groove 64, whereby fine cutting waste is removed from the wall surface of the cutting groove 64.

  In this case, as shown in FIG. 4A, the injection port 45 of the cleaning nozzle 41 is formed to have the same width as the cutting groove 64. Since the spray-like droplet 71 spreads downward from the spray port 45, the spray port 45 is brought as close as possible to the plate-like workpiece W, so that the spray-like droplet 71 has a spot diameter substantially the same as the groove width of the cutting groove 64. A droplet 71 is ejected toward the cutting groove 64. As a result, the momentum of the spray-like droplets ejected from the narrow ejection port 45 is strengthened and the cleaning power is increased, and the spray-like droplets are ejected along the wall surface 65 of the cutting groove 64. The droplets easily collide with the fine cutting waste 75 adhering to the wall surface 65 of the cutting groove 64.

  When the atomized droplet 71 collides with the fine cutting waste 75, the cutting waste 75 is peeled off from the wall surface 65 of the cutting groove 64 by the pressure fluctuation caused by the shock wave and the expansion wave generated in the droplet 71. Further, when the atomized droplet 71 collides with the wall surface 65 of the cutting groove 64 without colliding with the fine cutting waste 75, a jet water flow is created on the wall surface 65 of the cutting groove 64 and the cutting waste 75 is washed away. At this time, since the entrance groove 24 of the chuck table 20 is positioned below the cutting groove 64 of the plate-like workpiece W, the cutting groove 45 is cut from the injection port 45 so that the sprayed droplet 71 blows through the cutting groove 64. The spray droplet 71 can be strongly ejected aiming at 64.

  As shown in FIG. 4B, when the fine cutting waste 75 is peeled off from the wall surface 65 of the cutting groove 64 by the spray droplet 71, the cutting waste 75 is externally exposed by the water flow flowing through the entrance groove 24 of the chuck table 20. To be discharged. In this way, the fine droplets 75 adhering to the wall surface 65 of the cutting groove 64 are removed by locally spraying the sprayed droplets 71 onto the cutting groove 64 of the plate-like workpiece W. .

  Returning to FIG. 3, a curtain nozzle 50 is provided in front of the cutting means 30 so as to cross the plate-like workpiece W, and a water curtain is formed by the cleaning water sprayed from the spray nozzle 51 of the curtain nozzle 50. Yes. In this case, since the cleaning water is jetted obliquely rearward from the curtain nozzle 50, a flow of cleaning water directed backward from the curtain nozzle 50 is created on the back surface of the plate-like workpiece W. The entire plate-like workpiece W is effectively washed by the flow of the washing water, and reattachment of the cutting waste removed from the cutting groove 64 by the washing nozzle 41 to the plate-like workpiece W is prevented.

  As described above, the fine cutting waste 75 adhering to the cutting groove 64 of the plate-like workpiece W is removed by the cleaning nozzle 41 and the plate-like workpiece W passes under the curtain nozzle 50 so that the entire plate-like workpiece W is entirely passed. Is washed. For this reason, in the cutting device 1 according to the present embodiment, spinner cleaning is not required for the plate-like workpiece W after cutting. In the present embodiment, the cleaning nozzle 41 is positioned behind the cutting blade 33. However, if the cleaning nozzle 41 is positioned in the cutting groove 64 after the cutting blade 33 has passed through the plate-like workpiece W, the cleaning nozzle 41 is positioned. Good. For example, the cleaning nozzle 41 may be positioned on the side of the cutting blade 33 and the cutting groove 64 in the adjacent line may be cleaned with the cleaning nozzle 41. When cleaning the cutting groove 64 in the adjacent line, the cutting groove 64 can be satisfactorily cleaned with spray droplets without receiving the resistance of the cutting water wound up backward by the cutting blade 33.

  By the way, if the injection hole 45 of the cleaning nozzle 41 is not aligned with the cutting groove 64 of the plate-like workpiece W with high accuracy, a sufficient cleaning effect cannot be obtained. In the above example, the cutting nozzle 33 is aligned with the scheduled division line 63, so that the cleaning nozzle 41 is aligned with the scheduled division line 63, but the center of the cleaning nozzle 41 and the cutting blade 33 is in the index direction. If they are misaligned, the ejection port 45 of the cleaning nozzle 41 is disengaged from the cutting groove 64. Therefore, the cutting unit 30 may be provided with an adjustment mechanism capable of adjusting the position of the cleaning nozzle 41 in the index direction (Y direction) with respect to the cutting blade 33.

  Hereinafter, the adjustment mechanism will be described with reference to FIG. FIG. 5 is a diagram illustrating an example of the adjustment operation of the adjustment mechanism according to the modification. In FIG. 5, it is assumed that the cutting blade is already aligned with respect to the division planned line.

  As shown in FIG. 5A, the cleaning nozzle 41 is attached to the blade cover 34 of the cutting means 30 via an adjustment mechanism 49 driven by a motor so as to be movable in the index direction (Y direction). In a state where the cutting blade 33 is aligned with the division line 63, the mixed liquid is spot-injected from the injection port 45 of the cleaning nozzle 41 toward the plate-like workpiece W before the start of the cutting process. Next, the spot position P of the liquid mixture is imaged by the imaging means 55 (see FIG. 1), and a deviation amount ΔL in the index direction between the center of the spot position P and the planned division line 63 is calculated based on the captured image. Then, the cleaning nozzle 41 is moved by the amount of deviation ΔL by the adjustment mechanism 49, and the ejection port 45 of the cleaning nozzle 41 is aligned with the scheduled division line 63.

  Further, as shown in FIG. 5B, the injection port 45 of the cleaning nozzle 41 may be aligned with a line adjacent to the planned division line where the cutting blade 33 is positioned. In this case, as described above, after the injection port 45 of the cleaning nozzle 41 is aligned with the division line 63 where the cutting blade 33 is positioned, the cleaning nozzle 41 is moved by one index by the adjustment mechanism 49 and cleaned. The nozzle 45 of the nozzle 41 is aligned with the adjacent line. One index indicates an interval between the division planned lines 63. With such a configuration, the cutting groove 64 (see FIG. 4) of the adjacent line that has already been cut can be cleaned by the cleaning nozzle 41 while the cutting line 33 is cutting the division line 63 of the plate-like workpiece W. In addition, not only the motor drive adjustment mechanism 49 but a manual adjustment mechanism 49 may be used.

  As described above, in the cutting apparatus 1 according to the present embodiment, the cleaning water and the high-pressure air are mixed, so that the mixed liquid becomes the spray droplet 71 toward the cutting groove 64 from the injection port 45. Be injected. By spraying the sprayed droplet 71 onto the wall surface 65 of the cutting groove 64, fine cutting waste 75 is peeled off from the wall surface 65 of the cutting groove 64 and removed. As described above, the spray-like droplet 71 is sprayed aiming at the cutting groove 64 instead of the surface of the plate-like workpiece W, so that the spray-like droplet 71 is applied to the fine cuttings 75 attached to the cutting groove 64. It is made to collide and it is easy to remove the fine cutting waste 75 from the plate-shaped workpiece W.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the present embodiment and the modification, the package substrate chuck table 20 as the plate-like workpiece W has been exemplified and described, but the present invention is not limited to this configuration. When the plate-like workpiece W is a semiconductor wafer or an optical device wafer, a wafer chuck table having a circular porous surface may be used.

  Moreover, in this Embodiment and the modification, it was set as the structure by which the curtain nozzle 50 is provided in the support wall 13 ahead of the cutting means 30, However, It is not limited to this structure. The curtain nozzle 50 may be configured to be movable together with the chuck table 20. For example, the curtain nozzle 50 may be provided on the moving plate 11 so as to be adjacent to the chuck table 20. With such a configuration, the curtain nozzle 50 is also cut and fed together with the chuck table 20, so that cleaning water can always be sprayed onto the plate-like workpiece W. Therefore, the plate-like workpiece W does not dry and the cutting waste does not adhere to the plate-like workpiece W.

  Moreover, in this Embodiment and the modification, although it was set as the structure by which the single washing nozzle 41 is provided in the cutting means 30, it is not limited to this structure. A plurality of cleaning nozzles 41 may be provided in the cutting means 30. The cleaning nozzle 41 is not limited to the configuration in which one ejection port 45 is formed, and a plurality of ejection ports 45 may be formed in the cleaning nozzle 41.

  Moreover, in this Embodiment and the modification, although the washing nozzle 41 was set as the structure provided in the blade cover 34 of the cutting means 30, it is not limited to this structure. The cleaning nozzle 41 only needs to be movable relative to the chuck table 20 together with the cutting means 30. For example, the cleaning nozzle 41 may be provided on the spindle 32.

  As described above, the present invention has an effect that fine cutting chips adhering to a cutting groove can be removed, and in particular, a cutting apparatus that performs cutting while cleaning a package substrate such as a CSP substrate or a QFN substrate. Useful for.

DESCRIPTION OF SYMBOLS 1 Cutting device 20 Chuck table 21 Cutting feed means 30 Cutting means 31 Index feed means 32 Spindle 33 Cutting blade 34 Blade cover 40 Cleaning means 41 Cleaning nozzle 42 Cleaning water supply source (cleaning water supply means)
43 High pressure air supply source (High pressure air supply means)
45 Cleaning nozzle injection port 49 Adjustment mechanism 50 Curtain nozzle 51 Curtain nozzle injection port 64 Cutting groove 71 Droplet 75 Cutting waste W Plate-shaped workpiece

Claims (1)

A chuck table for holding a plate-like workpiece, a cutting means for cutting a plate-like workpiece held by the chuck table with a cutting blade, and a cutting feed means for cutting and feeding the chuck table and the cutting means relatively in the X direction And index feeding means for index-feeding the chuck table and the cutting means relative to each other in the Y direction, and a cleaning means for cleaning a cutting groove obtained by cutting the plate-like workpiece held by the chuck table with the cutting means, A cutting device comprising:
The cutting means includes a spindle on which the cutting blade is rotatably mounted, and a blade cover that projects and covers a part of the cutting blade mounted on the spindle,
The cleaning means has a cleaning nozzle having an injection port for injecting a mixed liquid obtained by mixing cleaning water and high-pressure air toward the cutting groove cut by the cutting means, and supplies the cleaning water to the cleaning nozzle. Cleaning water supply means, and high-pressure air supply means for supplying the high-pressure air to the cleaning nozzle,
A cutting device for cleaning the cutting groove with the mixed liquid ejected from the ejection port of the cleaning nozzle.

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