CN101653971A - A cutting apparatus - Google Patents
A cutting apparatus Download PDFInfo
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- CN101653971A CN101653971A CN200910160397A CN200910160397A CN101653971A CN 101653971 A CN101653971 A CN 101653971A CN 200910160397 A CN200910160397 A CN 200910160397A CN 200910160397 A CN200910160397 A CN 200910160397A CN 101653971 A CN101653971 A CN 101653971A
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- cutting
- washing fluid
- pressure
- supply passageway
- chuck table
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- 238000005520 cutting process Methods 0.000 title claims abstract description 232
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 144
- 230000007246 mechanism Effects 0.000 claims abstract description 118
- 239000012530 fluid Substances 0.000 claims abstract description 88
- 238000005406 washing Methods 0.000 claims abstract description 88
- 239000007921 spray Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 50
- 239000004065 semiconductor Substances 0.000 description 42
- 230000007723 transport mechanism Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002324 mouth wash Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Dicing (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
A cutting apparatus has a cleaning mechanism; a cutting mechanism provided with a cutting blade for cutting the machined article held by the chuck station; a cutting feed gear, for feeding the chuck station in the cutting feed direction relative to the cutting mechanism; and a washing fluid ejection mechanism has the following washing fluid ejection nozzles, namely provided on the first and secondhousing components in the downstream side of the cutting feed direction of the chuck station of the cutting water ejection nozzles, ejecting washing fluid to the region of the machined article clipping the cutting groove. The cutting mechanism has a blade housing composed of a first housing component and a second housing component provided at the both side of the front end of the housing for clipping the cutting blade and covering the cutting blade; and a cutting water ejection mechanism, having cutting water ejection nozzles provided on the first and second housing components for ejecting cutting water to the machined article held by the cutting blade and the chuck station.
Description
Technical field
The present invention relates to a kind of topping machanism that is used to cut wafers such as semiconductor wafer.
Background technology
In semiconductor devices manufacturing process, on the surface of roughly discoideus semiconductor wafer, divided a plurality of zones by forming the cancellate preset lines of cutting apart of cutting apart that is called, in this zone of dividing, form devices such as IC, LSI.Then, by cutting off semiconductor wafer, cut apart the zone that is formed with device thus, and make each semiconductor devices along cutting apart.And, for the optical device wafer that on the surface of Sapphire Substrate, is laminated with gallium nitride compound semiconductor etc., also cut off, be divided into optical devices such as each light emitting diode, laser diode thus, and be widely used in the electrical equipment along cutting apart.
Above-mentioned semiconductor wafer or optical device wafer etc. along the cut-out of cutting apart, undertaken by the topping machanism that is called dicer usually.This topping machanism possesses: chuck table keeps wafers such as semiconductor wafer; Cutting mechanism has the cutting tip that wafer that this chuck table is kept cuts; The cutting feed mechanism cuts direction of feed feeding with respect to cutting mechanism to this with this chuck table; And cutting water feed mechanism, supply with cutting water to cutting tip; By supplying with cutting water to the cutting tip of rotation, cool off cutting tip thus, on one side and the cutting portion of the wafer of cutting tip is supplied with cutting water on one side and implement cutting operation by this cutting water feed mechanism.
But, when by cutting tip along cutting apart when cutting wafer, produce cutting swarf, this cutting swarf is mixed in the cutting water and becomes dirt and be detained on the surface attached to the wafer that clips cutting slot.In order to eliminate this problem, the topping machanism that possesses wiper mechanism is disclosed in following patent documentation 1, this wiper mechanism can mix the washing fluid of rinse water and pressure-air to the zone ejection that clips the cutting slot that is formed by the cutting tip cutting.
Patent documentation 1: TOHKEMY 2006-187834 communique
Yet the wiper mechanism of above-mentioned patent documentation 1 disclosed topping machanism is, is used to spray the washer jet of the washing fluid that is made of rinse water and pressure-air, is provided in the cutting direction of feed downstream of chuck table with respect to cutting tip.Therefore, for the All Ranges ejection washing fluid that clips the cutting slot that is formed by the cutting tip cutting is cleaned, need make chuck table surpass cutting stroke and move significantly, the amount of movement of chuck table is elongated, and not necessarily can satisfy aspect productivity ratio.
Summary of the invention
The present invention carries out in view of the above fact, its major technology problem is for providing a kind of topping machanism that possesses wiper mechanism, it is mobile significantly that this wiper mechanism does not need to make chuck table to surpass cutting stroke, and just the zone of the cutting slot that can cut clipping is cleaned.
In order to solve above-mentioned major technology problem, according to the present invention, provide a kind of topping machanism, it is characterized in that possessing: chuck table keeps machined object; Cutting mechanism has the cutting tip that machined object that this chuck table is kept cuts; The cutting feed mechanism cuts direction of feed relatively feeding with respect to this cutting mechanism to this with this chuck table; And index feed mechanism, with this cutting mechanism with respect to this chuck table to the index feed direction of this cutting direction of feed quadrature index feed relatively,
This cutting mechanism possesses: shaft housing, and rotation freely is supported in front end this cutting tip rotating shaft has been installed; The blade housing clips this cutting tip and the 1st housing parts and the 2nd housing parts that are provided in both sides and cover this cutting tip constitute by the leading section at this shaft housing; And cut water ejection mechanism, and possessing cutting water jetting nozzle, this cutting water jetting nozzle is provided in respectively on the 1st housing parts and the 2nd housing parts that constitutes this blade housing, and the machined object that this cutting tip and this chuck table are kept sprays cutting water,
In this topping machanism, possesses washing fluid ejection mechanism with washing fluid jetting nozzle, this washing fluid jetting nozzle is, cut the cutting direction of feed downstream of this chuck table of water jetting nozzle at this, be provided in respectively on the 1st housing parts and the 2nd housing parts, to machined object that this chuck table kept, clip by soon the zone of cutting slot after this cutting tip cutting, the washing fluid that ejection is made of rinse water and pressure-air.
Above-mentioned washing fluid jetting nozzle is provided in the downstream position of cutting direction of feed from the cutting direction of feed downstream side of the chuck table of cutting water jetting nozzle to the chuck table of cutting tip periphery.
Above-mentioned washing fluid sprays mechanism to be possessed: the rinse water supply passageway is connected with the rinse water feed mechanism of supplying with rinse water; The pressure-air supply passageway is connected with the pressure-air feed mechanism of supplying with pressure-air; Mixing chamber mixes the rinse water that supplies to the rinse water supply passageway with the pressure-air that supplies to the pressure-air supply passageway; And the washing fluid supply passageway, make the washing fluid that mixes by this mixing chamber flow out above-mentioned washing fluid jetting nozzle.
The rinse water outlet of preferred above-mentioned rinse water supply passageway and the pressure-air outlet of pressure-air supply passageway are in the roof upper shed of mixing chamber, and the pressure-air outlet of the washing fluid of above-mentioned washing fluid supply passageway inlet and pressure-air supply passageway is oppositely arranged.
And the diapire of preferred above-mentioned mixing chamber forms flexure plane, and this flexure plane will flow into the washing fluid inlet of the rinse water guiding washing fluid supply passageway of rinse water supply passageway.
The effect of invention:
Topping machanism of the present invention as above constitutes, the washing fluid jetting nozzle set for, cutting direction of feed downstream in the chuck table of cutting the water jetting nozzle, zone machined object, that clip by cutting tip cutting cutting slot soon that chuck table kept is sprayed cutting fluid, therefore in cutting process, the end of the machined object that chuck table kept moves to by the washing fluid jetting nozzle and gets final product, and does not therefore need to make chuck table to surpass cutting stroke and moves significantly.
Description of drawings
Fig. 1 is the stereogram of the topping machanism of formation according to the present invention.
Fig. 2 is the major part stereogram that constitutes the cutting mechanism of topping machanism shown in Figure 1.
Fig. 3 is the stereogram with the component parts exploded representation of cutting mechanism shown in Figure 2.
Fig. 4 is constituting the side view that the cutting water that sets on the 1st housing parts shown in Figure 2 and the 2nd housing parts sprays mechanism and washing fluid ejection mechanism.
Fig. 5 is the key diagram that the major part that the cutting water ejection mechanism that sets and washing fluid ejection mechanism are represented is blocked expression on the 2nd housing parts that constitutes cutting mechanism shown in Figure 2.
Fig. 6 is the side view that the washing fluid jetting nozzle of the cutting water jetting nozzle of cutting water ejection mechanism shown in Figure 4 and washing fluid ejection mechanism is blocked expression.
Fig. 7 is the side view that the washing fluid jetting nozzle of cutting water ejection mechanism shown in Figure 4 and washing fluid ejection mechanism is blocked expression.
Fig. 8 is the key diagram by the cutting process of topping machanism enforcement shown in Figure 1.
The specific embodiment
Below, be described in detail with reference to the preferred implementation of accompanying drawing the topping machanism that constitutes according to the present invention.
Fig. 1 represents the stereogram of the topping machanism that constitutes according to the present invention.Topping machanism shown in Figure 1 possesses roughly rectangular-shaped crust of the device 2.In this crust of the device 2, keep the chuck table 3 of machined object to be configured to, can be to move on the direction shown in the arrow X in the cutting direction of feed.Chuck table 3 possesses the absorption chuck and supports platform 31 and the absorption chuck 32 that is configured on this absorption chuck support platform 31, works by making not shown attraction mechanism, and machined object is attracted to remain on the top i.e. maintenance face of this absorption chuck 32.And chuck table 3 constitutes and can rotate by not shown rotating mechanism.In addition, be equipped with the anchor clamps 33 that are used for fixing ring-shaped frame on chuck table 3, this ring-shaped frame is to support the wafer described later as machined object via cutting belt (ダ イ シ Application グ テ one プ).So the chuck table 3 that constitutes moves on the cutting direction of feed shown in the arrow X by not shown cutting feed mechanism.
Topping machanism shown in Figure 1 possesses the axle unit 4 as cutting mechanism.Axle unit 4 is by not shown index feed mechanism, with the index feed direction shown in the arrow Y of the cutting direction of feed quadrature shown in the above-mentioned arrow X on move, and, on the incision direction of feed shown in the arrow Z vertical, move with respect to the maintenance face of above-mentioned chuck table 3 by not shown incision feed mechanism.This axle unit 4 possesses: shaft housing 41, be installed on the not shown mobile base station, and be that direction shown in the arrow Y and incision direction are to be moved adjustment on the direction shown in the arrow Z in index direction; Rotating shaft 42 rotates freely and is supported in this shaft housing 41; And, be installed in the cutting tip 43 of the leading section of this rotating shaft 42.Shown in Fig. 2 and 3, cutting tip 43 for example comprises: the discoid base station 431 that is formed by aluminium; With the emery wheel portion 432 of ring-type, on the peripheral part side of this base station 431, fix diamond particle and form the thickness of 15～30 μ m by nickel plating.
Go on to say with reference to Fig. 2 and Fig. 3, the blade housing 44 of the first half that covers cutting tip 43 is installed at the leading section of above-mentioned shaft housing 41.In the illustrated embodiment, blade housing 44 comprises the 1st housing parts 441 and the 2nd housing parts 442 that is installed on the 1st housing parts 441 that is installed on the shaft housing 41.As shown in Figure 3, be provided with female threaded hole 441a and 2 alignment pin 441b in the side of the 1st housing parts 441, on the 2nd housing parts 442, on the position corresponding, be provided with inserting hole 442a with above-mentioned female threaded hole 441a.And, on the face relative of the 2nd housing parts 442, be formed with chimeric 2 the not shown recesses of above-mentioned 2 alignment pin 441b with the 1st housing parts 441.The 1st housing parts 441 and the 2nd housing parts 442 that constitutes like this is by positioning thus at 2 the not shown recesses that form on the 2nd housing parts 442, chimeric with 2 alignment pin 441b that are provided with on the 1st housing parts 441.Afterwards, lead among the inserting hole 442a of the 2nd housing parts 442 by fastening bolt 443 is inserted, and screw togather, thus the 2nd housing parts 442 is installed on the 1st housing parts 441 with the female threaded hole 441a that on the 1st housing parts 441, is provided with.
As shown in Figure 4 and Figure 5, on the 1st housing parts 441 and the 2nd housing parts 442 that constitute above-mentioned blade housing 44, be respectively equipped with: cutting water ejection mechanism 5, to being cut the machined object W ejection cutting water that blade 43 and chuck table 3 are kept; With washing fluid ejection mechanism 6, the washing fluid that will constitute by rinse water and pressure-air, the machined object W that chuck table 3 is kept, clip zone ejection by cutting tip 43 cuttings cutting slot soon.
Mainly cutting water ejection mechanism 5 and washing fluid ejection mechanism 6 are described with reference to Fig. 5.In addition, cutting water ejection mechanism 5 and washing fluid ejection mechanism 6 are provided in respectively on the 1st housing parts 441 and the 2nd housing parts 442 that constitutes blade housing 44, but in Fig. 5, cutting water ejection mechanism 5 and washing fluid ejection mechanism 6 on the 2nd housing parts 442 have been represented to be provided in.In the formation of the cutting water that sets on the 1st housing parts 441 ejection mechanism 5 and washing fluid ejection mechanism 6, identical in fact with washing fluid ejection mechanism 6, and constitute in the face of title with respect to cutting tip 43 with the cutting water that on the 2nd housing parts 442, sets ejection mechanism 5 shown in Figure 5.
Cutting water ejection mechanism 5 shown in Figure 5 comprises: cutting water supply passageway 51; With cutting water jetting nozzle 52, be communicated with this cutting water supply passageway 51, and with the side extension of the maintenance face almost parallel ground of chuck table 3 along cutting tip 43; Cutting water supply passageway 51 is connected with cutting water feed mechanism 53.Cutting water jetting nozzle 52 possesses: the access 521 that is communicated with above-mentioned cutting water supply passageway 51; With at the upwardly extending slit ejiction opening 522 of upper and lower, be communicated with access 521 as shown in Figure 6, and in the side upper shed relative with cutting tip 43.
Go on to say with reference to Fig. 5, above-mentioned cutting water feed mechanism 53 comprises: the cutting water supply source 531 that is preferably pure water; Cutting water supplying pipe 532 connects this cutting water supply source 531 and above-mentioned cutting water supply passageway 52; And be provided in electromagnetic opening and closing valve 533 on this cutting water supplying pipe 532.So the cutting water feed mechanism 53 that constitutes is, be disengaged the application of force (ending) and under the state of closed access at electromagnetic opening and closing valve 533, the connection of cutting water supply source 531 and above-mentioned cutting water supply passageway 51 is blocked, when electromagnetic opening and closing valve 533 is opened path by the application of force (conducting), cutting water supply source 531 and above-mentioned cutting water supply passageway 51 are communicated with.Therefore, when electromagnetic opening and closing valve 533 during by the application of force (conducting), cutting water is by the cutting water supply passageway 51 and the access 521 of cutting water ejection mechanism 5, the machined object W ejection that is kept towards cutting tip 43 and chuck table 3 from slit ejiction opening 522.
As shown in Figure 5, above-mentioned washing fluid ejection mechanism 6 comprises: rinse water supply passageway 61; Pressure-air supply passageway 62; Mixing chamber 63 mixes the rinse water that supplies to rinse water supply passageway 61 with the pressure-air that supplies to pressure-air path 62; Washing fluid supply passageway 64 flows out the washing fluid that rinse water and pressure-air mix in this mixing chamber 63; And washing fluid jetting nozzle 65, be communicated with this washing fluid supply passageway 64, to cutting direction of feed (X1) downstream (right side among Fig. 5) the ejection fluid-mixing of the chuck table 3 of the cutting water jetting nozzle 52 that constitutes above-mentioned cutting water ejection mechanism 5; Rinse water supply passageway 61 is connected with rinse water feed mechanism 66, and pressure-air supply passageway 62 is connected with pressure-air feed mechanism 67.
Above-mentioned rinse water supply passageway 61 is, rinse water inlet 61a is connected with above-mentioned rinse water feed mechanism 66, and rinse water exports 61b at the roof 63a of above-mentioned mixing chamber 63 opening.Above-mentioned pressure-air supply passageway 62 is, pressure-air inlet 62a is connected with above-mentioned pressure-air feed mechanism 67, and pressure-air exports 62b at the roof 63a of mixing chamber 63 opening.In addition, the diameter of the rinse water of rinse water supply passageway 61 outlet 61b is preferably 0.15～0.25mm, and the diameter of pressure-air outlet 62b is preferably 0.7～0.9mm.Above-mentioned washing fluid supply passageway 64 is, it is relative with the pressure-air outlet 62b of pressure-air supply passageway 62 that washing fluid inlet 64a is set to, and at the diapire 63b of above-mentioned mixing chamber 63 opening, washing fluid outlet 64b is communicated with the access 651 of above-mentioned washing fluid jetting nozzle 65.In addition, the diapire 63b of above-mentioned mixing chamber 63 forms flexure plane, and this flexure plane will be directed to the washing fluid inlet 64a of washing fluid supply passageway 64 from enter the mouth rinse water that 61a flow into mixing chamber 63 of rinse water.
Above-mentioned washing fluid jetting nozzle 65 comprises: access 651 is communicated with above-mentioned washing fluid supply passageway 64 as shown in Figure 5; With slit ejiction opening 652, be communicated with access 651 as shown in Figure 7, and towards lower opening.So, the slit ejiction opening 652 that is arranged on the washing fluid jetting nozzle 65 is positioned in as upper/lower positions: cutting direction of feed (X1) the downstream side (right-hand member Fig. 5) from the chuck table of the cutting water jetting nozzle 52 that constitutes above-mentioned cutting water ejection mechanism 5 as shown in Figure 5, to the downstream position of the cutting direction of feed (X1) of the chuck table of cutting tip 43 peripheries.Therefore, from washing fluid slit ejiction opening 652 ejection of washing fluid jetting nozzle 65, that rinse water and pressure-air mix, be ejected into machined object W that chuck table 3 kept, clip on the zone by cutting tip 43 cuttings cutting slot soon.
Go on to say with reference to Fig. 5, same with above-mentioned cutting water, above-mentioned rinse water feed mechanism 66 can be supplied with pure water as rinse water.Therefore, the rinse water feed mechanism 66 in the illustrated embodiment is also used as the rinse water supply source with the cutting water supply source 531 of above-mentioned cutting water feed mechanism 53.Rinse water feed mechanism 66 in the illustrated embodiment comprises: as the cutting water supply source 531 of rinse water supply source; Rinse water supply pipe 662 connects this cutting water supply source 531 and above-mentioned rinse water supply passageway 61; And electromagnetic opening and closing valve 663, be provided on this rinse water supply pipe 662.So the rinse water feed mechanism 66 that constitutes is, be disengaged the application of force (ending) and become under the state of closed access at electromagnetic opening and closing valve 663, the connection of cutting water supply source 531 and above-mentioned rinse water supply passageway 61 is interdicted, when electromagnetic opening and closing valve 663 was opened path by the application of force (conducting), cutting water supply source 531 and above-mentioned rinse water supply passageway 61 were communicated with via rinse water supply pipe 662.Like this rinse water feed mechanism 66 that constitutes is that the rinse water of 0.2～0.3Mp supplies to above-mentioned rinse water supply passageway 61 with pressure.
Then, with reference to Fig. 5 above-mentioned pressure-air feed mechanism 67 is described.
Pressure-air feed mechanism 67 in the illustrated embodiment comprises: pressure-air supply source 671; Pressure-air supply pipe 672 connects this pressure-air supply source 671 and above-mentioned pressure-air supply passageway 62; And electromagnetic opening and closing valve 673, be provided on this pressure-air supply pipe 672.So the pressure-air feed mechanism 67 that constitutes is, be disengaged the application of force (ending) and become under the state of closed access at electromagnetic opening and closing valve 673, the connection of pressure-air supply source 671 and pressure-air supply passageway 62 is interdicted, when electromagnetic opening and closing valve 673 was opened path by the application of force (conducting), pressure-air supply source 671 and above-mentioned pressure-air supply passageway 62 were communicated with via pressure-air supply pipe 672.Like this pressure-air feed mechanism 67 that constitutes is that the pressure-air of 0.2～0.3Mp supplies to above-mentioned pressure-air supply passageway 62 with pressure.
The washing fluid ejection mechanism 6 that constitutes as described above is, when the electromagnetic opening and closing valve 663 of above-mentioned rinse water feed mechanism 66 during by the application of force (conducting), rinse water flows into mixing chamber 63 by rinse water supply passageway 61.The rinse water that flows into this mixing chamber 63 is directed to the washing fluid inlet 64a of washing fluid supply passageway 64 along the flexure plane of the diapire 63b that forms mixing chamber 63.On the other hand, when the electromagnetic opening and closing valve 673 of above-mentioned pressure-air feed mechanism 67 during by the application of force (conducting), pressure-air flows into towards the washing fluid inlet 64a at the washing fluid supply passageway 64 of the diapire 63b of mixing chamber 63 upper shed by pressure-air supply passageway 62.Therefore, flow into mixing chambers 63 and be directed to the rinse water of the washing fluid inlet 64a of washing fluid supply passageway 64 along the flexure plane of the diapire 63b that forms mixing chamber 63 from rinse water supply passageway 61, with from pressure-air supply passageway 62 and the pressure-air that flows into towards the washing fluid inlet 64a at the washing fluid supply passageway 64 of the diapire 63b of mixing chamber 63 upper shed mixes mutually, and imported washing fluid supply passageway 64 swimmingly.
Return Fig. 1 and go on to say, topping machanism possesses image mechanism 8, and this image mechanism 8 is used for being made a video recording in the surface of the machined object that is kept on the above-mentioned chuck table 3, to being detected by the zone of above-mentioned cutting tip 43 cuttings.This image mechanism 8 is made of optical facilities such as microscope or ccd video cameras.And topping machanism 1 possesses indication mechanism 9, the image that this indication mechanism 9 shows by image mechanism 8 shootings.
Put at the box of said apparatus shell 2 and to dispose box mounting table 11 on the regional 11a, this box mounting table 11 puts the box of accommodating machined object.This box mounting table 11 constitutes and can move up at upper and lower by not shown elevating mechanism.Upload at box mounting table 11 and to be placed with box 12, this box 12 is accommodated the semiconductor wafer 10 as machined object.The semiconductor wafer 10 that is housed in the box 12 is, is formed with cancellate cutting apart from the teeth outwards, in that be formed with devices such as IC, LSI cancellate cutting apart on a plurality of rectangular areas of dividing by this.Like this semiconductor wafer 10 that forms, be secured at the back side cutting belt T on the supporting frame F that is installed on ring-type lip-deep state, accommodate in the box 12.
And the topping machanism of illustrated embodiment possesses: move into and take out of mechanism 14, take out of on the interim mounting table 13 putting the semiconductor wafer 10 of accommodating at the box on the box mounting table 11 12 (being supported on the state on the framework F of ring-type via cutting belt T); The 1st transport mechanism 15 will be taken out of semiconductor wafer 10 conveyances on the interim mounting table 13 on above-mentioned chuck table 3; Wiper mechanism 16 cleans the manufactured semiconductor wafer 10 that is cut on the chuck table 3; And the 2nd transport mechanism 17, will be cut manufactured semiconductor wafer 10 to wiper mechanism 16 conveyances on the chuck table 3.
The topping machanism of illustrated embodiment constitutes as described above, below its effect is described.
By not shown elevating mechanism box mounting table 11 is moved up and down, putting, be positioned to and take out of the position thus in the semiconductor wafer 10 of being accommodated on the assigned position of the box 12 of box mounting table 11 (being supported on the state on the framework F of ring-type via cutting belt T).Then, take out of and move into mechanism 14 action of advancing and retreat, take out of locational semiconductor wafer 10 and take out of interim mounting table 13 and will be positioned at.Taken out of the semiconductor wafer 10 of interim mounting table 13, the revolution action by the 1st transport mechanism 15 and by conveyance on above-mentioned chuck table 3.
If semiconductor wafer 10 is put on the chuck table 3, then not shown attraction mechanism action and semiconductor wafer 10 is attracted to remain on the chuck table 3.And, support the framework F of the ring-type of semiconductor wafer 10 via cutting belt T, fixing by above-mentioned anchor clamps 33.So, make the chuck table 3 that has kept semiconductor wafer 10 move to image mechanism 8 under.When chuck table 3 be positioned to image mechanism 8 under the time, be formed on by 8 pairs of image mechanisms and detect cutting apart on the semiconductor wafer 10, and be to move adjusting on the arrow Y direction with axle unit 4 in index direction, aim at operation and cut apart with the precision positions of cutting tip 43.
Afterwards, chuck table 3 is moved to the machining zone of the below of cutting tip 43, shown in Fig. 8 (a), the direction rotation that cutting tip 43 is represented to arrow 43a, and cut the feeding ormal weight to the direction that arrow Z1 represents from the position of readiness of among Fig. 8 (a), representing by double dot dash line, and as representing by solid line among Fig. 8 (a), with being positioned at bottom on the position that reaches cutting belt 12 of cutting tip 43.Then, making the chuck table 3 that attracts to have kept semiconductor wafer 10 is that the cutting feed speed with regulation moves on the direction represented of arrow X1 in the cutting direction of feed.As a result, the semiconductor wafer 10 that is kept on the chuck table 3 is cut blade 43 and cuts apart cut-out (cutting process) along regulation.
When implementing this cutting process, the electromagnetic opening and closing valve 533 of cutting water ejection mechanism 5 is by the application of force (conducting), and it is such as mentioned above, the machining portion ejection cutting water of the semiconductor wafer 10 that is kept from slit ejiction opening 522, towards cutting tip 43 and chuck table 3 by cutting water supply passageway 51 and access 521, cutting tip 43 is cooled.And when implementing cutting process, the electromagnetic opening and closing valve 663 of the rinse water feed mechanism 66 of formation washing fluid ejection mechanism 6 is by the application of force (conducting), and the electromagnetic opening and closing valve 673 of pressure-air feed mechanism 67 is by the application of force (conducting).When the electromagnetic opening and closing valve 673 of the electromagnetic opening and closing valve 663 of this rinse water feed mechanism 66 and pressure-air feed mechanism 67 during by the application of force (conducting), such as mentioned above, rinse water flows into mixing chamber 63 by rinse water supply passageway 61, and pressure-air is by pressure-air supply passageway 62 and towards the washing fluid inlet 64a inflow at the washing fluid supply passageway 64 of the diapire 63b of mixing chamber 63 upper shed.The result, flow into mixing chambers 63 and be directed to the rinse water of the washing fluid inlet 64a of washing fluid supply passageway 64 along the flexure plane of the diapire 63b that forms mixing chamber 63 from rinse water supply passageway 61, with mix towards the pressure-air that the washing fluid inlet 64a at the washing fluid supply passageway 64 of the diapire 63b of mixing chamber 63 upper shed flows into from pressure-air supply passageway 62, and be imported into washing fluid supply passageway 64.So, flow into the washing fluid that constitutes by rinse water and pressure-air of washing fluid supply passageway 64, by the access 651 of washing fluid jetting nozzle 65, and spray to zone semiconductor wafer 10, that clip by cutting tip 43 cuttings cutting slot soon that chuck table 3 is kept from slit ejiction opening 652.Therefore, in above-mentioned cutting process, the cutting swarf that generates owing to the cutting of cutting tip 43 mixes with cutting water and is dirt, and be trapped on the surface of the wafer that clips cutting slot, but the washing fluid that is made of rinse water and pressure-air that this dirt is sprayed as described above cleans and flows away, can surface attached to semiconductor wafer 10 on.
If implement cutting process as described above, and shown in Fig. 8 (b) like that the semiconductor wafer 10 that is kept on the chuck table 3 in Fig. 8 (b), left end passed through washing fluid jetting nozzle 65, then stops the cutting feeding of chuck table 3.Then, cutting tip 43 is moved to the direction shown in the arrow Z2 from the position of being represented by solid line among Fig. 8 (b), and be positioned at the position of readiness that double dot dash line is represented.In addition, in illustrated embodiment, the slit ejiction opening 652 of washing fluid jetting nozzle 65, be configured in from cutting direction of feed (X1) the downstream side of the chuck table of the cutting water jetting nozzle 51 that constitutes above-mentioned cutting water ejection mechanism 5, between the downstream position of the cutting direction of feed (X1) of the chuck table of cutting tip 43 peripheries, therefore in above-mentioned cutting process, such shown in Fig. 8 (b), the left end of the semiconductor wafer 10 that is kept on the chuck table 3 moves to by washing fluid jetting nozzle 65 and gets final product, and does not therefore need to make chuck table 3 to surpass cutting stroke and moves significantly.
As mentioned above, if along the cutting apart and cut off semiconductor wafer 10 of regulation, the interval that index feed is cut apart on the direction that chuck table 3 is represented by arrow Y in Fig. 1 then, and implement above-mentioned cutting process.Then, implemented cutting process if cut apart along all of on the prescribed direction of semiconductor wafer 10, extending, chuck table 3 is revolved to be turn 90 degrees, and along the side with the prescribed direction quadrature of semiconductor wafer 10 upwardly extending cutting apart implement cutting process, on semiconductor wafer 10, form thus cancellate all cut apart and be cut, and be divided into each device.In addition, the dispersion of each device of being cut apart because the effect of cutting belt T can not become, and can keep by the state of the wafer of the framework F of ring-type support.
If the cutting process of cutting apart along semiconductor wafer 10 finishes as mentioned above, then kept the chuck table 3 of semiconductor wafer 10 to turn back to the position that initial attraction keeps semiconductor wafer 10.Then, remove the attraction maintenance of semiconductor wafer 10.Then, semiconductor wafer 10 is arrived wiper mechanism 16 by the 2nd transport mechanism 17 by conveyance.Be cleaned herein by the semiconductor wafer 10 of conveyance to wiper mechanism 16.The semiconductor wafer 10 that so is cleaned arrives interim mounting table 13 by 15 conveyances of the 1st transport mechanism after drying.Then, semiconductor wafer 10 is moved into the assigned position that mechanism 14 is received to box 12 by taking out of.
Claims (5)
1. a topping machanism is characterized in that,
Possess: chuck table keeps machined object; Cutting mechanism has the cutting tip that the machined object that is used for that this chuck table is kept cuts; The cutting feed mechanism relatively cuts feeding with respect to this cutting mechanism with this chuck table on the cutting direction of feed; And index feed mechanism, with this cutting mechanism with respect to this chuck table with the index feed direction of this cutting direction of feed quadrature on index feed relatively,
This cutting mechanism possesses: shaft housing, will the rotating shaft support of this cutting tip be installed for rotating freely at front end; The blade housing clips this cutting tip and the 1st housing parts and the 2nd housing parts that are provided in both sides and cover this cutting tip constitute by the leading section at this shaft housing; And cut water ejection mechanism, and possessing cutting water jetting nozzle, this cutting water jetting nozzle is provided in respectively on the 1st housing parts and the 2nd housing parts that constitutes this blade housing, and the machined object that this cutting tip and this chuck table are kept sprays cutting water,
In this topping machanism, possesses washing fluid ejection mechanism with washing fluid jetting nozzle, this washing fluid jetting nozzle is, cut the cutting direction of feed downstream of this chuck table of water jetting nozzle at this, be provided in respectively on the 1st housing parts and the 2nd housing parts, to machined object that this chuck table kept, clip by soon the zone of cutting slot after this cutting tip cutting, the washing fluid that ejection is made of rinse water and pressure-air.
2. topping machanism as claimed in claim 1 is characterized in that,
This washing fluid jetting nozzle is equipped on, from the cutting direction of feed downstream side of this chuck table of this cutting water jetting nozzle, to the downstream position of the cutting direction of feed of the chuck table of this cutting tip periphery.
3. topping machanism as claimed in claim 1 or 2 is characterized in that,
This washing fluid ejection mechanism comprises: the rinse water supply passageway is connected with the rinse water feed mechanism of supplying with rinse water; The pressure-air supply passageway is connected with the pressure-air feed mechanism of supplying with pressure-air; Mixing chamber mixes the rinse water that supplies to this rinse water supply passageway with the pressure-air that supplies to this pressure-air supply passageway; And the washing fluid supply passageway, make the washing fluid that mixes by this mixing chamber flow out this washing fluid jetting nozzle.
4. topping machanism as claimed in claim 3 is characterized in that,
The rinse water outlet of this rinse water supply passageway and the pressure-air outlet of this pressure-air supply passageway are in the roof upper shed of this mixing chamber, and the washing fluid inlet of this washing fluid supply passageway is oppositely arranged with this pressure-air outlet of this pressure-air supply passageway.
5. topping machanism as claimed in claim 4 is characterized in that,
The diapire of this mixing chamber forms flexure plane, and this flexure plane will flow into this washing fluid inlet that rinse water in this rinse water supply passageway is directed to this washing fluid supply passageway.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP210783/2008 | 2008-08-19 | ||
| JP2008210783A JP5399662B2 (en) | 2008-08-19 | 2008-08-19 | Cutting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101653971A true CN101653971A (en) | 2010-02-24 |
| CN101653971B CN101653971B (en) | 2014-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910160397.XA Active CN101653971B (en) | 2008-08-19 | 2009-08-11 | A cutting apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5399662B2 (en) |
| CN (1) | CN101653971B (en) |
| TW (1) | TWI454356B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102756167A (en) * | 2011-04-27 | 2012-10-31 | 承澔科技股份有限公司 | Cover-lifting device for cutter protecting cover of cutting machine |
| CN103406945A (en) * | 2013-08-23 | 2013-11-27 | 昆山升东物资有限公司 | Rotating high-pressure gas cutting device |
| CN103847034A (en) * | 2012-11-30 | 2014-06-11 | 株式会社迪思科 | Cutting apparatus |
| CN104616972A (en) * | 2013-11-05 | 2015-05-13 | 株式会社迪思科 | Cutting device and cutting method |
| CN105931990A (en) * | 2015-02-27 | 2016-09-07 | 株式会社迪思科 | Cutting Apparatus |
| CN106976018A (en) * | 2016-01-15 | 2017-07-25 | 株式会社迪思科 | Cutter hood |
| CN109571268A (en) * | 2018-12-31 | 2019-04-05 | 大连思博科技服务有限公司 | A kind of eyeglass grinding apparatus |
| CN110202479A (en) * | 2018-02-28 | 2019-09-06 | 株式会社迪思科 | Cutter hood |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI655685B (en) * | 2015-01-28 | 2019-04-01 | 迪思科股份有限公司 | Cutting device |
| JP6985034B2 (en) * | 2017-06-21 | 2021-12-22 | 株式会社ディスコ | Cutting equipment |
| JP7105039B2 (en) | 2017-06-26 | 2022-07-22 | 株式会社ディスコ | blade cover |
| JP7327974B2 (en) | 2019-04-01 | 2023-08-16 | 株式会社ディスコ | Wafer division method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102756167A (en) * | 2011-04-27 | 2012-10-31 | 承澔科技股份有限公司 | Cover-lifting device for cutter protecting cover of cutting machine |
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| CN104616972A (en) * | 2013-11-05 | 2015-05-13 | 株式会社迪思科 | Cutting device and cutting method |
| CN104616972B (en) * | 2013-11-05 | 2019-11-29 | 株式会社迪思科 | Cutting apparatus and cutting process |
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| CN106976018A (en) * | 2016-01-15 | 2017-07-25 | 株式会社迪思科 | Cutter hood |
| CN106976018B (en) * | 2016-01-15 | 2020-08-14 | 株式会社迪思科 | Cutter cover |
| CN110202479A (en) * | 2018-02-28 | 2019-09-06 | 株式会社迪思科 | Cutter hood |
| CN109571268A (en) * | 2018-12-31 | 2019-04-05 | 大连思博科技服务有限公司 | A kind of eyeglass grinding apparatus |
| CN109571268B (en) * | 2018-12-31 | 2019-12-10 | 苏州市相城区黄桥工业园经济发展有限公司 | Glasses lens equipment of polishing |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI454356B (en) | 2014-10-01 |
| CN101653971B (en) | 2014-12-31 |
| JP5399662B2 (en) | 2014-01-29 |
| TW201016418A (en) | 2010-05-01 |
| JP2010046726A (en) | 2010-03-04 |
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