TWI675730B - Cutting device - Google Patents

Abstract

High-pressure water can be sprayed without using a large-capacity compressor while maintaining a high pressure, and a good burr removal effect can be achieved with an inexpensive structure.

The cutting device (1) is provided with: a disk mounting table (4) for holding a plate-shaped workpiece (W); a θ mounting table (14) for rotating the disk mounting table; and a cutting tool (31) for cutting a plate-shaped workpiece Cutting means (3); cutting feed means (15) for relative cutting feed of the disk mounting table and cutting means in the X direction; and burr removing means for removing burrs that form a cutting groove (G) of a plate-like work (5). The burr removing means includes a burr removing nozzle (51) that sprays high-pressure water on the upper surface of the plate-shaped workpiece. The disk mounting table rotates at each specific angle to perform cutting feed to the high-pressure water sprayed from the burr by removing the nozzle.

Description

Cutting device

The present invention relates to a cutting device for cutting a plate-shaped workpiece with a cutting tool, and more particularly to a cutting device for cutting a package substrate with a cutting tool.

A plate-like work such as a package substrate is formed by molding a resin on a substrate made of a resin substrate. The cutting groove after cutting such a plate-shaped work with a cutting tool generates burrs. In order to remove this burr, a cutting device including a spray nozzle that sprays high-pressure water on a plate-shaped workpiece after processing is proposed (for example, refer to Patent Document 1). In the cutting device described in Patent Document 1, a plurality of spray nozzles are arranged in a row and arranged, and high-pressure water is sprayed onto the plate-shaped workpiece with a width greater than the longitudinal direction of the plate-shaped workpiece. In this state, by the relative movement of the plate-shaped workpiece and the spray nozzle, high-pressure water is sprayed to the entire surface of the plate-shaped workpiece to remove burrs.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2007-125667

However, the cutting device described in Patent Document 1 is configured to spray high-pressure water with a width larger than the width of the plate-shaped workpiece. Therefore, when the width of the plate-shaped workpiece is larger, it is necessary to increase the width of the spray nozzle or increase the width of the spray nozzle. Quantity. Therefore, it is difficult to maintain the pressure of the high-pressure water sprayed from the spray nozzle at a high state, and as a result, the pressure of the high-pressure water is reduced, and there is a problem that a good burr effect cannot be obtained. In order to maintain the pressure of high-pressure water, although the introduction of a large-capacity compressor is also considered, it is not ideal from the viewpoint of cost.

The present invention was created in view of such a problem, and its object is to provide a cutting device that can eject high-pressure water while maintaining a high pressure without using a large-capacity compressor, and can obtain an inexpensive structure and a good effect of removing burrs. .

The cutting device of the present invention is provided with: a disk mounting table for holding a rectangular plate-shaped work; a disk mounting table rotation means for rotating the disk mounting table; and a cutting method for cutting tools Mounted so that it can rotate and use a cutting tool to cut the plate-shaped workpiece held by the swash plate mounting table; cutting feed means is used to make the swash plate mounting table cut in the X direction; indexing feed means is used to cut The index feed is in the Y direction; and the burr removal method is carried out by cutting the cymbal disk by using a cutting method. The cutting groove after the plate-shaped work held by the table removes the burrs formed on the plate-shaped work. The burr removal means is provided with a burr-removing nozzle having an upper surface of the plate-shaped work held toward the pan mounting table. High-pressure water supply means for supplying high-pressure water to a burr removal nozzle, and a high-pressure water supply means for supplying high-pressure water to a burr removal nozzle. It is used to rotate the disk mounting table; and an angle commanding unit, which rotates the disk mounting table at a specified angle by a rotation driving section. After the cutting of the plate-shaped work, the nozzle is ejected from the burr to spray high pressure water. By the cutting feed means, the disk mounting table positioned at a specified angle commanded by the angle command section by the disk table rotation method is used to perform cutting feed, and is changed by a command from the angle command section. The angle of the disk mounting table is in accordance with each specified angle of the disk mounting table, so that the disk mounting table has a range smaller than the width of the short side of the plate-shaped work object. The burr removal of high pressure water jet cutting feed nozzles, capable of removing the burrs formed in the plate-shaped work piece is held in the nip of the disc mount table.

According to this configuration, after the cutting groove is formed in a plate shape by a cutting tool, the plate-shaped work object is cut and fed to the burr removing nozzle that jets high-pressure water in accordance with each specific angle of the disk mounting object. According to this, even if the size of the injection port is small compared to the plate-shaped work, high-pressure water can be sprayed on the entire upper surface of the plate-shaped work. As a result, the burrs formed on the plate-shaped work can be removed. In addition, since it is not necessary to increase the injection port in accordance with the size of the plate-shaped work, it is possible to inject high-pressure water without using a large-capacity compressor and maintaining a high pressure. According to this, it can be cheaper The composition achieves a good burr removal effect.

According to the present invention, according to each specific angle of the disk mounting table, the plate-shaped workpiece is cut and fed to the burr removal nozzle that sprays high-pressure water, so that a high-pressure state can be maintained without using a large-capacity compressor. High-pressure water is sprayed downward, and a good burr removal effect can be obtained with a cheap structure.

W‧‧‧ plate-shaped work

G‧‧‧ cutting groove

1‧‧‧ cutting device

14‧‧‧θ mounting table (rotary drive unit)

15‧‧‧ cutting feed means

20‧‧‧ indexing feeding means

27‧‧‧Angle Command Department

3‧‧‧ cutting means

31‧‧‧ cutting tools

32‧‧‧ shaft

33‧‧‧Tool cover

4‧‧‧ pan tray mounting table

5‧‧‧ Deburring means

50‧‧‧jet nozzle

51‧‧‧burr removal nozzle

52‧‧‧High-pressure water supply means

53‧‧‧jet port

FIG. 1 is a perspective view of a cutting device related to this embodiment.

Fig. 2 is a side view of a cutting device related to this embodiment.

FIG. 3 is a schematic view when the spray nozzle shown in FIG. 2 is viewed from an arrow A. FIG.

FIG. 4 is a side view of a cutting operation of the cutting device according to the embodiment.

FIG. 5 is a table showing an operation mode of a disk mounting table in a burr removing operation of a cutting device according to this embodiment.

FIG. 6 is a side view of the burr removing operation of the cutting device according to the embodiment.

FIG. 7 is a top view of an example of burr removal of the cutting device according to the embodiment.

FIG. 8 is a top view of an example of the burr removing operation of the cutting device according to the embodiment.

FIG. 9 is a top view of an example of the burr removing operation of the cutting device according to the embodiment.

FIG. 10 is a top view of an example of the burr removing operation of the cutting device according to the embodiment.

FIG. 11 is a top view of an example of the burr removing operation of the cutting device according to the embodiment.

FIG. 12 is a schematic view of a spray nozzle related to a modification.

Hereinafter, the cutting device related to this embodiment mode will be described with reference to the attached drawings. FIG. 1 is a perspective view of a cutting device related to this embodiment. Fig. 2 is a side view of a cutting device related to this embodiment. FIG. 3 is a schematic view when the spray nozzle shown in FIG. 2 is viewed from an arrow A. FIG. In the following, although an example of the cutting device is described, the configuration of the cutting device according to the embodiment is not limited to this. When the plate-like work can be cut, any configuration may be adopted as the cutting device. Furthermore, in FIG. 1, the size of the plate-like work is exaggerated relative to the pan mounting table.

As shown in FIGS. 1 and 2, the cutting device 1 is configured to relatively move the cutting table 3 to the cutting means 3 to divide the plate-shaped work W held on the cutting table 4 into individual wafers. . The plate-like work W is a package substrate formed by arranging a plurality of resin protrusions 61 (three in this embodiment) on the surface of a rectangular resin substrate 60 in the longitudinal direction. The resin substrate 60 is, for example, a PCB substrate. The plate-shaped workpiece W is divided into a plurality of device regions A1 for a semiconductor device in which a plurality of convex portions 61 are arranged and electrodes are arranged inside, and a remaining region A2 around the device region A1. Each device area A1 is divided into a plurality of areas by a grid-like predetermined division line L, and a semiconductor device is provided in each area (not shown). 示).

In this plate-like work W, the remaining area A2 is removed as an end material, and the device area A1 is divided into individual wafers along a predetermined division line L1. The plate-like work W is not limited to a substrate for a semiconductor device, and may be a metal substrate for an LED device. In addition, it is not limited to the substrate after wafer mounting, and it may be a substrate before wafer mounting. Although the convex portion 61 of the plate-like work W is formed of, for example, epoxy resin or silicone resin, if the convex portion 61 can be formed on the resin substrate 60, any resin may be used.

A rectangular opening (not shown) extending in the X-axis direction (cutting direction) is formed on the upper surface of the casing 11. This opening is simultaneously covered by the movable X-axis mounting table 12 and the bellows-shaped waterproof cover 13 at the same time as the disk mounting table 4. A ball screw type cutting feed means 15 (refer to FIG. 2) is provided below the waterproof cover 13 to move the disk mounting table 4 in the X-axis direction.

The X-axis mounting table 12 is provided with an upside-down rectangular pan-shaped disk mounting table 4 that can be rotated by the θ mounting table 14. The θ mounting table 14 functions as a rotation driving unit that rotates the disk mounting table 4 with the center of the disk mounting table 4 as an axis. The disk mounting table 4 has a suction surface 41 that holds a plate-shaped work W. A plurality of concave portions 42 corresponding to the plurality of convex portions 61 of the plate-shaped workpiece W are formed on the suction surface 41 of the pan mounting table 4 in the longitudinal direction. Each of the recesses 42 of the disk mounting table 4 has a depth corresponding to the height of each of the protrusions 61 of the plate-like work W, and is formed to accommodate each of the protrusions 61 of the plate-like work W. Branches are formed around each of the recesses 42. The supporting surface 43 supports the remaining area A2 around the convex portion 61 of the plate-shaped workpiece W.

Further, on the suction surface 41 of the disk mounting table 4, an entry groove 44 is formed in which the cutting tool 31 enters in correspondence with the planned division line L of the plate-like work W. On the bottom surface (attraction surface 41) of the recessed portion 42 of the disk mounting table 4, a plurality of suction holes for sucking and holding each of the wafers after the division of the plate-like work W are formed in a region partitioned into a grid by the entry groove 44. (Not shown). Further, a plurality of suction holes (not shown) are formed on the support surface 43 (suction surface 41) around the recessed portion 42 to suck and hold the remaining area A2 of the plate-shaped work W. Each suction hole is connected to a suction source (not shown) through a flow path in the pan mounting table 4.

The disk mounting table 4 moves back and forth between the receiving position in the center of the apparatus and the processing position facing the cutting means 3. In addition, FIG. 1 shows a state where the disk mounting table 4 is waiting at the receiving position. A pair of guide rails 16 are provided in the housing 11 on the deep side of a corner portion adjacent to the receiving position in parallel with the Y-axis direction. The pair of guide rails 16 are positioned in the X-axis direction of the plate-shaped workpiece W.

Near the pair of guide rails 16, a first conveying arm 17 for conveying a plate-shaped workpiece W between the guide rail 16 and the pan mounting table 4 is provided. When the L-shaped arm portion 17 a is seen from above the first conveying arm 17, the plate-shaped workpiece W is conveyed. Furthermore, a spinner-type washing mechanism 18 is provided behind the pan loading platform 4 at the receiving position. In the cleaning mechanism 18, after the washing water is sprayed toward the rotating mounting table 18a to wash the plate-shaped work W, the drying gas is blown to dry the plate-shaped work.

The housing 11 is provided with a supporting table 19 for supporting the cutting means 3. The cutting means 3 is positioned above the disk mounting table 4 at the processing position, and is configured to cut the cutting tool 31 from the surface of the plate-shaped work W by cutting it. The cutting means 3 is such that a cutting tool 31 for cutting a plate-shaped workpiece W is attached to be rotatable. The cutting means 3 performs indexing feed in the Y-axis direction based on the indexing feed means 20, so that the cutting means 3 and the disk table 4 are relatively moved in the Y-axis direction. The cutting means 3 is moved in the Z-axis direction by a lifting means (not shown). The indexing feeding means 20 and the lifting means are configured by a ball screw type moving mechanism, for example.

The cutting means 3 is configured such that a cutting tool 31 is attached to the front end of the rotating shaft 32 and a tool cover 33 is provided so as to cover the outer periphery of the cutting tool 31. The cutting tool 31 is formed of, for example, a ring-shaped shower plate, and is formed by bonding abrasives such as diamond with a bonding material. The tool cover 33 is formed in a box shape covering a slightly upper half of the cutting tool 31. The tool cover 33 is provided with a cutting water nozzle 34 that sprays cutting water toward the cutting portion. Here, it will be described that the receiving position side is considered to be forward with respect to the processing position, and the processing position side is considered to be backward with respect to the processing position.

The cutting water nozzles 34 are formed in an L-shape extending from the lower end of the tool cover 33 toward the front, and the front ends of the cutting water nozzles 34 are positioned on the lower half of the cutting tool 31. A plurality of slits 35 are formed at the front end of the cutting water nozzle 34 (see FIG. 2). Cutting water is sprayed from the slot 35 toward the cutting plate 31. The cutting tool 31 rotating at a high speed is cut into the plate-shaped workpiece W by supplying cutting water while the plate-shaped workpiece W The division line is cut.

A second conveying arm 21 that conveys the plate-shaped workpiece W between the guide rail 4 and the cleaning mechanism 18 is provided on the side surface 19 a of the support base 19. An arm portion 21a of the second conveying arm 21 extends obliquely, and the plate-shaped workpiece W is conveyed by the arm portion 21a moving in the Y-axis direction. Further, a cantilever support portion 23 that supports the photographing portion 22 is provided on the support table 19 so as to traverse the movement path (X-axis direction) of the pan mounting table 4. The imaging section 22 projects from below the cantilever support section 23, and the plate-shaped work W is photographed by the imaging section 22. The photographic image formed by the photographing section 22 is aligned by the cutting means 3 and the disk mounting table 4.

Moreover, the cutting device 1 is provided with the burr removing means 5 which removes the burr formed on the upper surface of the plate-shaped workpiece W. As shown in FIG. The burr removal means 5 includes a plurality of burr removal nozzles 51 that spray high-pressure water toward the plate-shaped work W, and a high-pressure water supply means 52 that supplies high-pressure water to the burr removal nozzles 51. In the present embodiment, a plurality of the burr removing nozzles 51 are bundled into a bundle to serve as one spray nozzle 50, and the spray nozzle 50 is disposed inside the cantilever support portion 23. The injection nozzle 50 is configured to be movable in the Z-axis direction by a lifting means 55 (see FIG. 2).

The burr removing nozzle 51 is formed in a cylindrical shape extending in the vertical direction. A spraying port 53 is formed at the lower end of the burr removing nozzle 51 and sprays high-pressure water toward the upper surface of the plate-shaped workpiece W. The injection port 53 communicates with a flow path (not shown) formed inside the burr removal nozzle 51, and a high-pressure water supply means 52 is connected to the flow path through a valve 54. The high-pressure water supply means 52 supplies a fluid (high-pressure water) having a high pressure through a compressor (not shown). The burrs are removed to the nozzles 51.

Here, a detailed configuration of the injection nozzle 50 will be described with reference to FIG. 3. As shown in FIG. 3, the ejection port 53 is formed in the center of the burr removing nozzle 51 and forms a slit in the Y-axis direction. The width in the Y-axis direction of the ejection port 53 is greater than or equal to the radius of the burr removing nozzle 51 (half and a half of the pitch P described later). In this embodiment, seven burr removing nozzles 51 of the same shape are arranged in two rows in a direction (Y-axis direction) orthogonal to the cutting feed direction (X-axis direction), and the X-axis direction is rearwardly arranged. The side (upstream) side is aligned in four, and the X-axis direction front side (downstream) is aligned in three. The outer peripheral surfaces of the burr removing nozzles 51 are in contact with each other. Here, the center-to-center distance in the Y-axis direction of each adjacent burr removing nozzle 51 is shown and described as the pitch P.

The three burr removal nozzles 51 on the front side in the X-axis direction are offset by half a distance from the four burr removal nozzles 51 on the back side in the X-axis direction. Accordingly, one end of the injection port 53 on the rear side in the X-axis direction and one end of the injection port 53 on the front side in the X-axis direction partially overlap in the X-axis direction. That is, the injection port 53 on the front side in the X-axis direction is positioned so that the gap S between the end portion of the injection port 53 on the rear side in the X-axis direction and the end portion of the adjacent injection port 53 is buried. As a result, high-pressure water can be sprayed in a range R (3 pitches + width of one spray port 53 (hereinafter, referred to as spray range R)) indicated by a two-dot chain line. In addition, the spray range R of the high-pressure water formed by the plurality of spray ports 53 is smaller than the width in the short-side direction of the plate-shaped work W.

Returning to FIG. 1, input means 24 for receiving instructions to various parts of the device are provided at the corners of the housing 11. Furthermore, above the support 19 The surface is provided with a monitor 25. On the monitor 25, an image captured by the imaging unit 22, processing conditions of the plate-like work W, and the like are displayed. In addition, the cutting device 1 is provided with a control means 26 for coordinating each part of the control device. The control means 26 is constituted by a processor, a memory, or the like that performs various processes. The memory system is composed of one or more memory media such as ROM (Read Only Memory), RAM (Random Access Memory), etc., depending on the application. In addition, the control means 26 includes an angle instruction unit 27 that instructs the θ mounting table 14 to rotate the disk mounting table 4 at a specific angle. The control means 26 memorizes the operation mode of the disk mounting table 4 described later in FIG. 5, and the angle command unit 27 issues a command to the θ mounting table 14 based on the operation mode shown in FIG. 5. In accordance with this, the θ mounting table 14 rotates the disk mounting table 4 at a specific angle upon receiving a command from the angle command section 27. In this embodiment mode, the θ-mounting table 14 and the angle command unit 27 constitute a disk-mounting table rotation means.

In the cutting device 1 configured as described above, after the plate-shaped workpiece W is attracted and held by the disk mounting table 4, the cutting means 3 is positioned at a specific position. Then, the cutting tool 31 is rotated at a high speed to cut and feed the plate-shaped workpiece, thereby forming a cutting groove in the plate-shaped workpiece W. After the cutting process, the plate-shaped workpiece W is cut and fed to the burr removing nozzle 51 that jets high-pressure water while changing the angle of the pan mounting table 4. Accordingly, high-pressure water is sprayed on the entire surface of the plate-shaped workpiece W, and the burrs formed on the surface of the plate-shaped workpiece W are removed.

Hereinafter, the cutting operation of the cutting device according to this embodiment mode will be described with reference to FIG. 4. Represents the cuts related to this implementation type Side view of the cutting action of the cutting device.

As shown in FIG. 4, first, the plate-shaped workpiece W is placed on the disk mounting table 4 with the surface side on which the plurality of convex portions 61 are formed facing downward. At this time, each convex portion 61 of the plate-shaped work W is accommodated in each concave portion 42 of the pan mounting table 4, the device area A1 is in contact with the bottom surface of the concave portion 42, and the remaining area A2 is in contact with the support surface 43. Then, the negative pressure generated on the suction surface 41 causes the plate-shaped workpiece W to be sucked and held by the disk mounting table 4 (the suction surface 41).

In this state, the disk mounting table 4 is rotated by the θ mounting table 14 so that the cutting feed direction (X-axis direction) of the cutting feed means 15 and the planned division line L of the plate-shaped work W are aligned in parallel. In addition, the cutting means 3 is moved in the Y-axis direction by the indexing feeding means 20 to adjust the position of the cutting means 3 so that the cutting tool 31 is positioned on a predetermined division line L of the plate-like work W.

Next, the cutting means 3 is moved in the Z-axis direction by a lifting means (not shown), and the cutting tool 31 is lowered to a height capable of fully cutting the plate-like work W. Then, while the high-pressure water is sprayed toward the plate-like work W from the burr removing nozzle 51, the chuck plate mounting table 4 moves the pair of high-speed cutting tools 31 in the X-axis direction (cutting feed). The cutting tool 31 intrudes into the groove 44 and cuts a plate-shaped workpiece W along a predetermined division line L. As a result, a cutting groove G is formed in the plate-like work W along a predetermined division line L. At this time, at the edge portion of the cutting groove G (resin substrate 60), a burr (not shown) rolled up along the rotation direction of the cutting plate 31 is generated.

When the cutting of a line of division lines L is completed, the cutting means 3 is moved in the Y-axis direction by the index feeding means 20 (see FIG. 1), and the cutting tool 31 is positioned on the adjacent division line L. Then, cutting processing is performed along a new division line L. When the cutting processing is completed along all of the planned division lines L in one direction, cutting processing of the planned division lines L in other directions orthogonal to the planned division line L in one direction is performed. In this way, when all of the planned division lines L of the plate-like work W are cut, a cutting groove G is formed in the plate-like work W, and a burr is formed in the cutting groove G.

Hereinafter, referring to FIG. 5 to FIG. 11, a burr removing method related to this embodiment will be described. FIG. 5 is a table showing an operation mode of a disk mounting table in a burr removing operation of a cutting device according to this embodiment. FIG. 6 is a side view of the burr removing operation of the cutting device according to the embodiment. 7 to 11 are top views of an example of a burr removing operation of a cutting device according to the embodiment.

In this embodiment, as described in FIG. 3, the plurality of burr removing nozzles 51 are bundled into a bundle to form one spray nozzle 50, and the plate-shaped workpiece W is formed with a specific width (range R shown in FIG. 3). The surface is sprayed with high pressure water. As described above, the spray range R of the high-pressure water formed by the plurality of spray ports 53 is smaller than the width of the plate-shaped work W. Therefore, even when the plate-shaped workpiece W is subjected to one cutting feed to the injection nozzle 50 in a state where high-pressure water is sprayed from the injection port 53, the entire surface of the plate-shaped workpiece W cannot be sprayed with high-pressure water.

Therefore, in this embodiment mode, the plate-shaped work W After cutting back and forth several times in the same direction, the disk mounting table 4 is rotated by a specific angle by a command from the angle command section 27, and the cutting feed is performed again. Therefore, it is possible to spray high-pressure water to a region where high-pressure water cannot be sprayed on the plate-shaped workpiece W in the previous cutting feed. According to this, by adjusting the disk mounting table 4 to various angles, the plate-shaped workpiece W can cut and feed the injection nozzle 50 according to each angle. Regardless of the injection range R of the injection nozzle 50, the plate can be aligned. High-pressure water is sprayed on the entire surface of the workpiece W. As a result, the burrs formed on the upper surface of the plate-like work W by cutting can be removed.

In this embodiment, the entire system above the plate-like work W refers to the entire device region A1 forming a semiconductor device or the like, and is set to a portion excluding the remaining region A2. As described above, the remaining area A2 is removed as an end material after the division, so there is no problem even if the burr of the remaining area A2 is not removed. In addition, it is not limited to this configuration, and it is also possible to adjust the rotation angle of the disk mounting table 4 so that high-pressure water is sprayed in the entire remaining area A2.

First, the operation mode of the reel mounting table 4 in the burr operation will be described. As shown in FIG. 5, in this embodiment, the operation modes from No. 1 to No. 6 are stored in the control means 26 in advance. The "angle" in the table indicates the angle of the plate-shaped workpiece W with respect to the longitudinal direction (the disk mounting table 4) of the cutting feed direction (X-axis direction). The "step angle" in the table refers to the feed angle of the disk mounting table 4. "Return times" in the table indicates the return times of cutting feed in each angle.

In the No. 1 operation mode, the angle of the pan mounting table 4 It advances 2 ° each time in the range of 0 ° to 14 °, and performs 4 rounds of cutting feed at various angles. In the operation mode of No. 2, the angle of the disk mounting table 4 advances by -2 ° each time in a range of -2 ° to -14 °, and 4 rounds of cutting feed are performed at each angle. In the operation mode of No. 3, the angle of the disk mounting table 4 advances 2 ° at a time within a range of 182 ° to 194 °, and 4 rounds of cutting feed are performed at each angle. In the operation mode of No. 4, the angle of the disk mounting table 4 advances by -2 ° each time in the range of 178 ° to 166 °, and 4 rounds of cutting feed are performed at each angle. In the operation mode of No. 5, the angle of the disk mounting table 4 is rotated to 52 °, and 4 rounds of cutting feed are performed at the angle. In the operation mode of No. 6, the angle of the disk mounting table 4 is rotated to -52 °, and a four-round cutting feed is performed at the angle.

In this embodiment, the angle of the disk mounting table 4 is adjusted in the order of No. 1 to No. 6, and the plate-shaped workpiece W (disk mounting table 4) cuts the injection nozzle 50 at each angle. give. Hereinafter, the burr removal operation and each operation mode up to No. 1 to No. 6 will be described with reference to FIGS. 6 to 11. In addition, in FIG. 7 to FIG. 11, for convenience of explanation, a region where high-pressure water is sprayed is indicated by a spray region T. As shown in FIG. 6 and FIG. 7, in the operation mode of No. 1, the angle between the long side direction and the cutting feed direction of the pan-shaped worktable W rotated into a plate-like work W becomes 0 °. Further, the index feeding means 20 (refer to FIG. 1) is moved to the Y-axis direction so that the center of the Y-axis direction of the spray range R in the spray nozzle 50 (plural burr removal nozzle 51) and the plate-shaped work object The center of the short-side direction (Y-axis direction) of W is the same. The ejection nozzle 50 is lowered by the raising and lowering means 55 and approaches the position before the ejection opening 53. There is a little gap between the end and the upper surface of the plate-shaped work W.

Then, while the high-pressure water is sprayed from the spray port 53 in the spray range R, the plate-shaped workpiece W (the disk mounting table 4) is cut and fed to the spray nozzle 50. As a result, high-pressure water is sprayed on only the portion of the spray area T above the plate-shaped workpiece W. In addition, this cutting feed is performed 4 times at 0 °. The cutting feed rate during the burr removal operation is, for example, 200 mm / sec, and is adjusted so that the burr formed in the cutting groove G can be appropriately removed. In addition, as described above, since the front end of the injection port 53 is close to the upper surface of the plate-shaped workpiece W, the pressure drop of the high-pressure water can be reduced while the high-pressure water collides with the upper surface of the plate-shaped workpiece W. As a result, burrs can be removed satisfactorily.

When the cutting feed 4 is performed in one direction (0 °), the chuck table 4 is rotated only 2 °, and the cutting feed in 4 is performed in the same manner as described above. This operation is repeated until the angle of the disk mounting table 4 becomes 14 °. As a result, only in the part of the spray area T shown in FIG. 8, high-pressure water is sprayed on the plate-shaped work W.

Next, the No. 2 operation mode is implemented. In the operation mode of No. 2, until the angle of the disk mounting table 4 is turned to -2 °, the cutting feed is performed 4 times while the high-pressure water is sprayed. Furthermore, by performing a cutting feed of 4 rounds of -2 ° to -14 ° each time, high-pressure water is sprayed on the plate-shaped workpiece W only in the portion of the spray area T shown in FIG. 9.

Next, the operation mode of No. 3 is implemented. In the operation mode of No. 3, the angle of the disk mounting table 4 is rotated to 182 °. The high-pressure water is sprayed, and the cutting feed is returned 4 times. Moreover, by performing a cutting feed of 4 rounds from 2 ° to 194 ° each time, as in FIG. 8, only high-pressure water is sprayed on the plate-like work W only in the portion of the spray area T.

Next, the operation mode of No. 4 is implemented. In the operation mode of No. 4, until the angle of the disk mounting table 4 is rotated to 178 °, the high-pressure water is sprayed while the cutting feed is returned to 4 times. Furthermore, by performing a cutting feed of 4 rounds from -2 ° to 166 ° each time, as in FIG. 9, only high-pressure water is sprayed on the plate-shaped workpiece W in a portion of the spray area T.

In addition, operation modes No. 5 and No. 6 are implemented. In the operation mode of No. 5, as shown in FIG. 10, until the angle of the pan mounting table 4 is rotated to 52 °, the high-pressure water is sprayed and the cutting feed is performed 4 times again. After that, in the operation mode of No. 6, as shown in FIG. 11, until the angle of the disk mounting table 4 is turned to -52 °, the high-pressure water is sprayed and the cutting feed is performed again for 4 times. As described above, in all the device regions A1, high-pressure water is sprayed onto the plate-like work W, and the burrs formed on the plate-like work W by the cutting process can be removed.

As described above, if the cutting device 1 according to the present embodiment is used, the cutting grooves G are formed on all the predetermined division lines L of the plate-shaped workpiece W by the cutting tool 31, and then the disk mounting table 4 is formed. At each specific angle, the plate-shaped workpiece W is cut and fed to the burr removing nozzle 51 that jets high-pressure water. Accordingly, even if it is ejected from the ejection port 53 When the width of the spray range R is smaller than the width of the plate-shaped work W, high-pressure water may be sprayed on the entire upper surface of the plate-shaped work W (the cutting grooves G formed in all the device regions A1). That is, regardless of the width of the plate-shaped workpiece W, high-pressure water can be sprayed on the entire surface of the plate-shaped workpiece W. As a result, the burrs formed on the upper surface of the plate-like work W can be removed. In addition, since it is not necessary to increase the ejection port 53 in accordance with the size of the plate-like work W, it is possible to eject high-pressure water without maintaining a high-pressure compressor. According to this, a good burr removal effect can be obtained with an inexpensive structure.

In addition, the present invention is not limited to the above-mentioned embodiments, and can be implemented with various modifications. In the above-mentioned embodiment, the size, shape, and the like shown on the drawing of the accessory are not limited to this, and can be appropriately changed within a range where the effect of the present invention is exhibited. In addition, as long as it does not deviate from the purpose of the present invention, it can be appropriately modified and implemented.

For example, in the above-mentioned embodiment, although the configuration of the spray nozzles 50 in which seven burr removal nozzles 51 are bundled is provided, the configuration is not limited to this. The number of the burr removing nozzles 51 is not particularly limited, and it may be configured with a small number (for example, five or six). Even when the number is changed, the burr removing nozzles 51 are arranged in two rows, and the burr removing nozzles 51 having different rows are arranged by being offset by half a pitch. For example, although a single injection nozzle 50 (a burr removal nozzle 51) having a nozzle having a specific width in the Y-axis direction may be configured, a plurality of nozzles 53 are provided, and the nozzles 53 are configured in two rows with different rows. The port 53 is offset by a half pitch.

Moreover, in the above-mentioned embodiment, although the injection port 53 is provided Although it is a structure formed by the long slit in a Y-axis direction, it is not limited to this structure. The injection port 53 may be formed in a circular or oval shape, for example.

In addition, in the above-mentioned embodiment, although the configuration in which the width of the ejection port 53 in the Y-axis direction has a size equal to or greater than the radius of the burr removal nozzle 51 is adopted, the configuration is not limited to this. For example, it is good also as a structure as shown in FIG. FIG. 12 is a schematic view of a spray nozzle related to a modification. The point that the width of the spray nozzle 50 in the Y-axis direction of the spray port 53 related to the modification is smaller than the radius of the burr removal nozzle 51 is different from this embodiment. At this time, by reducing the width of the injection port 53, the pressure of the high-pressure water can be further increased, and the burr removal effect can be improved. In addition, when the high-pressure water sprayed from the ejection port 53 collides with the plate-shaped workpiece W, the diameter of the ejection port 53 becomes larger than the diameter of the ejection port 53, and the shape of the point becomes slightly oval. At this time, the central portion of the point becomes the highest pressure, and the central portion of the point conflicts with the burr, so that the burr can be detached from the layered work W and effectively removed. In addition, as the width of the ejection port 53 becomes smaller, the ejection region of the high-pressure water becomes narrower, and as shown in FIG. 12, the ejection range R in the Y-axis direction is intermittently formed. However, as illustrated in FIG. 5, the operation pattern from No. 1 to No. 4 is used to subdivide the angle of the disk mounting table 4 by 2 ° each time to repeatedly perform burr removal (cutting feed). The cutting groove G formed in all the device regions A1 can be sprayed with high-pressure water.

Furthermore, in the above-mentioned embodiment, the so-called undercut is formed by rotating the cutting tool 31 to the same direction as the cutting feed of the chuck table 4 to form a cutting groove G, but It is not limited to this structure. Even by rotating the cutting tool 31 to The cutting loading direction of the disk mounting table 4 is reversed, and cutting is performed, and the cutting groove G may be formed.

[Industrial possibilities]

As described above, the present invention has the effect of being able to inject high-pressure water while maintaining a high pressure without using a large-capacity compressor, and achieving a good burr removal effect with an inexpensive structure, especially for cutting a package substrate with a cutting tool. Effective on the cutting device.

Claims (2)

A cutting device includes: a cymbal plate mounting table for holding a rectangular plate-shaped work; a cymbal plate mounting table rotation means for rotating the cymbal plate mounting table; and a cutting method for making the cutting The cutter is installed to be rotatable, and a cutting tool is used to cut the plate-shaped workpiece held by the shim tray mounting table; a cutting feed means is used to make the shim tray mounting table cut in the X direction; an indexing feed means, which The cutting means is made to feed in the Y direction, and the burr removing means removes the cutting groove formed on the plate-shaped work from the cutting groove after cutting the plate-shaped work held by the reel mounting table by the cutting method. The burr removing means includes: a burr removing nozzle provided with an upper surface of a plate-shaped work object held by the reel mounting table, and spraying high-pressure water in a range smaller than a width of the plate-shaped work object in a short side direction An ejection port; and a high-pressure water supply means for supplying high-pressure water to the burr removing nozzle, the reel mounting table rotation means includes: a rotation driving unit for rotating the reel mounting table; and The degree command section rotates the disk mounting table at a specified angle by the rotation driving section, and after cutting the plate-shaped workpiece, the nozzle is ejected from the burr to spray high-pressure water, and the cutting feed means is used. Cutting feed of the disk mounting table positioned at an angle specified by the angle command section by the rotation method of the disk mounting table is performed, and the disk loading is changed by a command from the angle command section. Set the angle of the table, in accordance with each specified angle of the pan mounting table, make the pan mounting table cut into the burr removal nozzle that sprays high-pressure water in a range smaller than the width of the short-side direction of the plate-shaped work. It is possible to remove the burr of the plate-shaped work object held on the reel mounting table. The cutting device according to claim 1, wherein the burr removing nozzle is configured by bundling a plurality of nozzles, and the nozzles are arranged in a line at a regular interval in the Y direction to form a row, and at least two are arranged in the X direction. This column is arranged to be pitch-shifted in the Y direction.