CN105904029A - Cutting apparatus - Google Patents
Cutting apparatus Download PDFInfo
- Publication number
- CN105904029A CN105904029A CN201610088193.XA CN201610088193A CN105904029A CN 105904029 A CN105904029 A CN 105904029A CN 201610088193 A CN201610088193 A CN 201610088193A CN 105904029 A CN105904029 A CN 105904029A
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- China
- Prior art keywords
- cutting
- chuck table
- plate workpiece
- unit
- high pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Abstract
The present invention provides a cutting apparatus which is capable of jetting high pressure water in a high pressure with no need for large-capacity compressor, and obtains good burring effect through a low-cost structure. The cutting structure comprises: a clamp disc table (4) configured to maintain the board workpiece (W); a [Theta] worktable (14) configured to rotate the clamp disc table; a cutting unit (3) configured to cut the board workpiece through a cutting tool (31); a cutting feeding unit (15) configured to allow the clamp disc table and the cutting unit to relatively perform cutting feeding on the X direction; and a burring unit (5) configured to remove the burring formed on the cutting groove (G) on the board workpiece, wherein the burring unit has a burring nozzle (51) for jetting high-pressure water to the upper surface of the board workpiece. The clamp disc table is rotated according to each regular angle and is subjected to cutting feeding relative to the high-pressure water jetted by the burring nozzle.
Description
Technical field
The present invention relates to the topping machanism by cutting tool cutting plate workpiece, cut particularly to by cutting tool
The topping machanism of base plate for packaging.
Background technology
The plate workpiece of base plate for packaging etc. is formed by casting resin on the base material being made up of resin substrate.Utilizing
Burr can be produced on the cutting slot that the cutting of this plate workpiece is formed by cutting tool.In order to remove this burr,
Propose and possess the topping machanism of the injection nozzle to the plate workpiece injection water under high pressure after processing (for example, referring to patent
Document 1).In the topping machanism described in patent documentation 1, form a line arranging by multiple injection nozzles, to be more than
The upper surface of plate workpiece is sprayed water under high pressure by the width of the width of the length direction of plate workpiece.Plate in this state
Shape workpiece and injection nozzle relative movement, thus the injected water under high pressure in whole surface of plate workpiece so that burr is gone
Remove.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2007-125667 publication
But, the topping machanism described in patent documentation 1 is configured to spray high pressure with the width of the width more than plate workpiece
Water, in the case of therefore the width at plate workpiece becomes greatly further, needs to increase the width of injection nozzle, or increases
Add the quantity of injection nozzle.Accordingly, it is difficult to the pressure of the water under high pressure sprayed from injection nozzle is maintained higher state,
The pressure making water under high pressure reduces, and its result there will be the problem that cannot obtain good deburring effect.And in order to tie up
Hold the pressure of water under high pressure, it is also possible to consider to import jumbo compressor, but this is for cost standpoint and not preferred.
Summary of the invention
The present invention is exactly to complete in view of the foregoing, its object is to provide one can not use jumbo
Compressor and maintain high pressure state under spray water under high pressure, good deburring effect can be obtained by cheap structure
Topping machanism.
The topping machanism of the present invention is characterised by having: chuck table, and it keeps plate workpiece;Chuck table rotates single
Unit, it makes chuck table rotate;Cutting unit, it is can install cutting tool in the way of rotating, by cutting
The plate workpiece kept by chuck table is cut by cutter;Cutting feed unit, it makes chuck table in the X direction
Carry out cutting feed;Index feed unit, it makes cutting unit carry out index feed in the Y direction;And unhairing
Thorn unit, its burr being formed at plate workpiece from cutting slot removal, this cutting slot is to chuck by cutting unit
The plate workpiece that platform keeps carries out cutting and being formed, and deburring unit has: deburring nozzle, and it has to chuck
The jet of the upper surface injection water under high pressure of the plate workpiece that platform keeps;And water under high pressure feed unit, it is to deburring
Nozzle supply water under high pressure, chuck table rotary unit has: rotary driving part, and it makes chuck table rotate;And angle
Degree instruction department, it makes chuck table rotate with the angle of regulation by rotary driving part, from deburring nozzle injection height
Setting-out, makes to utilize chuck table rotary unit by cutting feed unit and is located in the regulation specified by angle command portion
Angle at chuck table carry out cutting feed such that it is able to remove chuck table keep plate workpiece on formed hair
Thorn.
According to this structure, after defining cutting slot by cutting tool on plate workpiece, according to chuck table
Each predetermined angular, makes plate workpiece be cut feeding relative to the deburring nozzle of injection water under high pressure.Thus, exist
The size of jet is less than in the case of plate workpiece, it is possible to the whole upper surface of plate workpiece is sprayed water under high pressure.Its
As a result, it is possible to remove the burr of the upper surface being formed at plate workpiece.Additionally, due to big without according to plate workpiece
Little and increase jet, therefore, it is possible to the injection high pressure when not using jumbo compressor and maintain high pressure
Water.Therefore, it is possible to obtain good deburring effect by cheap structure.
The effect of invention
According to the present invention, according to each predetermined angular of chuck table, make the plate workpiece unhairing relative to injection water under high pressure
Thorn nozzle and cutting feed such that it is able to the injection high pressure when not using jumbo compressor and maintain high pressure
Water, it is possible to obtain good deburring effect by cheap structure.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the topping machanism of present embodiment.
Fig. 2 is the side view of the topping machanism of present embodiment.
Fig. 3 is the schematic diagram when arrow A observes the injection nozzle shown in Fig. 2.
Fig. 4 is the side view of the stock removal action of the topping machanism representing present embodiment.
Fig. 5 is the table of the action pattern of the chuck table in the deburring action of the topping machanism representing present embodiment.
Fig. 6 is the side view of the deburring action of the topping machanism representing present embodiment.
Fig. 7 is the top view of an example of the deburring action of the topping machanism representing present embodiment.
Fig. 8 is the top view of an example of the deburring action of the topping machanism representing present embodiment.
Fig. 9 is the top view of an example of the deburring action of the topping machanism representing present embodiment.
Figure 10 is the top view of an example of the deburring action of the topping machanism representing present embodiment.
Figure 11 is the top view of an example of the deburring action of the topping machanism representing present embodiment.
Figure 12 is the schematic diagram of the injection nozzle of variation.
Label declaration
W: plate workpiece, G: cutting slot, 1: topping machanism, 14: θ workbench (rotary driving part), 15:
Cutting feed unit, 20: index feed unit, 27: angle command portion, 3: cutting unit, 31: cutting tool,
32: main shaft, 33: cutter hood, 4: chuck table, 5: deburring unit, 50: injection nozzle, 51: deburring is sprayed
Mouth, 52: water under high pressure feed unit, 53: jet.
Detailed description of the invention
Hereinafter, referring to the drawings, the topping machanism of present embodiment is described.Fig. 1 is the topping machanism of present embodiment
Axonometric chart.Fig. 2 is the side view of the topping machanism of present embodiment.Fig. 3 observes shown in Fig. 2 from arrow A
Schematic diagram during injection nozzle.It addition, a following example to topping machanism illustrates, but the cutting of present embodiment
The structure of turning device is not limited to this.As long as plate workpiece can be cut, then topping machanism can use arbitrary structure.
Additionally, Fig. 1 has been greatly exaggerated to show the size of plate workpiece relative to chuck table.
As depicted in figs. 1 and 2, topping machanism 1 is configured to by making chuck table 4 carry out phase relative to cutting unit 3
To movement, thus the plate workpiece W being held in chuck table 4 is divided into each chip.Plate workpiece W leads to
Cross and be alongst disposed with multiple (present embodiment is 3) in the front of rectangular resin substrate 60
The base plate for packaging of resinous protuberance 61 and constitute.Resin substrate 60 e.g. PCB substrate.Plate workpiece W quilt
It is divided into and is configured with multiple protuberance 61 and is equipped with multiple device area A1 of semiconductor device of electrode in inside
And the remaining area A2 around device area A1.Each device area A1 is divided into by cancellate segmentation preset lines L
Multiple regions, are equipped with semiconductor device (not shown) in each region.
The remaining area A2 of this plate workpiece W is removed as end material, and device area A1 is then predetermined along segmentation
Line L and be divided into each chip.It addition, plate workpiece W is not limited to the substrate of semiconductor device, it is also possible to
It it is the metal basal board of LED component.Additionally, plate workpiece W is not limited to the substrate after chip carrying, it is also possible to be
Substrate before chip carrying.The protuberance 61 of plate workpiece W is such as formed by epoxy resin, silicones, and only
Want on resin substrate 60, to form protuberance 61, then can be arbitrary resin.
Upper surface at shell 11 is formed at the upper OBL peristome extended of X-direction (cutting direction)
(not shown).X-axis workbench 12 that this peristome can be moved together with chuck table 4 and Serpentis abdomen shape waterproof
Cover 13 covering.The ball screw type making chuck table 4 move in the X-axis direction it is provided with in the lower section of bucker 13
Cutting feed unit 15 (with reference to Fig. 2).
On X-axis workbench 12 across θ workbench 14 in time can being provided with top view in the way of rotating in
OBL chuck table 4.Chuck table 4 is rotated as axle by θ workbench 14 as the center with chuck table 4
The rotary driving part driven is operated.Chuck table 4 has the suction surface 41 keeping plate workpiece W.In chuck table
In the suction surface 41 of 4 in the way of corresponding to multiple protuberances 61 of plate workpiece W, arrange shape in the longitudinal direction
Become to have multiple recess 42.Each recess 42 of chuck table 4 has the highly consistent of each protuberance 61 with plate workpiece W
The degree of depth, and be formed as can each protuberance 61 of Ingathering board shape workpiece W.The surrounding of each recess 42 is with support plate
The mode of the remaining area A2 of the surrounding of the protuberance 61 of shape workpiece W and be formed with bearing-surface 43.
The suction surface 41 of chuck table 4 is formed in the way of corresponding to segmentation preset lines L of plate workpiece W
The entrance groove 44 entered for cutting tool 31.Being entered on the bottom surface (suction surface 41) of the recess 42 of chuck table 4
Enter groove 44 to be divided into cancellate region and be formed with the multiple of each chip after the segmentation of attracting holding plate workpiece W
Suction hole (not shown).Additionally, be formed with attraction on bearing-surface 43 (suction surface 41) around recess 42
Keep multiple suction holes (not shown) of the remaining area A2 of plate workpiece W.Each suction hole passes through chuck table respectively
Stream in 4 and be connected with attracting source (not shown).
What chuck table 4 was entreated in a device delivers position and reciprocates between the Working position of cutting unit 3.Separately
Outward, Fig. 1 illustrates that chuck table 4 is delivering the state that position is standby.Shell 11 to deliver position with this adjacent
The depths in one corner is provided with the pair of guide rails 16 being parallel to Y direction.Pair of guide rails 16 is to plate workpiece W
Position in the X-axis direction.
Near pair of guide rails 16, it is provided with between guide rail 16 and chuck table 4 the of conveyance plate workpiece W
1 carrying arm 17.It is the arm 17a convolution of L-shaped during the top view of the 1st carrying arm 17, so that tabular work
Part W is transported.Additionally, be provided with revolving wiper mechanism 18 at the rear of the chuck table 4 delivering position.?
In wiper mechanism 18, rotary table 18a jet cleaning water in rotating and after plate workpiece W is cleaned by,
Blow out dry air and plate workpiece W is dried.
Shell 11 is provided with the supporting station 19 of supporting cutting unit 3.Cutting unit 3 is positioned in Working position
The top of chuck table 4, and be configured to from the front of plate workpiece W incision cutting tool 31 to cut plate workpiece
W.The cutting tool 31 of cutting plate workpiece W is installed in the way of can rotating by cutting unit 3.Cutting
Unit 3 is indexed feeding in the Y-axis direction by index feed unit 20, thus cutting unit 3 and chuck table
4 relative movements in the Y-axis direction.Additionally, cutting unit 3 by lifting unit (not shown) in Z-direction
Upper movement.Index feed unit 20 and lifting unit are such as made up of the travel mechanism of ball screw type.
Cutting unit 3 installs cutting tool 31 at the end of main shaft 32, and to cover the periphery of cutting tool 31
Mode cutter hood 33 is set and constitutes.Cutting tool 31 is such as made up of ring-type packing ring cutter, by combining material
Expect that the abrasive particle of bonded diamond etc. is formed.Cutter hood 33 is formed as covering the case of the substantially first half of cutting tool 31
Type.Cutter hood 33 arranges the cutting water nozzle 34 of oriented cutting tip injection cutting water.Here, relative to adding
Station will deliver side, position as front for putting, and is entered as rear Working position side for delivering position
Row explanation.
Cutting water nozzle 34 is formed as the substantially L-shaped that the lower end, rear from cutter hood 33 forwards extends, cutting water
The end of nozzle 34 is located in the substantially lower half of cutting tool 31.End at cutting water nozzle 34 is formed
A plurality of seam 35 (with reference to Fig. 2).Cutting water is ejected towards cutting tool 31 from this seam 35.While supply cutting water,
Plate workpiece W cut by the cutting tool 31 utilizing high speed rotating, thus plate workpiece W is along segmentation preset lines
It is cut.
Conveyance plate workpiece W it is provided with between chuck table 4 and wiper mechanism 18 at the side surface 19a of supporting station 19
The 2nd carrying arm 21.The arm 21a of the 2nd carrying arm 21 extends obliquely out, and this arm 21a moves in the Y-axis direction
Move and plate workpiece W is transported.Additionally, to cross the mobile route (X-axis of chuck table 4 on supporting station 19
Direction) the mode of top, be provided with the single armed support 23 of supporting image pickup part 22.Image pickup part 22 props up from single armed
The lower section of bearing portion 23 highlights, and is imaged plate workpiece W by image pickup part 22.The shooting of image pickup part 22
Image is for the calibration of cutting unit 3 with chuck table 4.
Additionally, topping machanism 1 has the deburring unit 5 of the burr removing the upper surface being formed at plate workpiece W.
Deburring unit 5 has the multiple deburring nozzles 51 to plate workpiece W injection water under high pressure and sprays deburring
Mouth 51 supplies the water under high pressure feed unit 52 of water under high pressure.In the present embodiment, by multiple above-mentioned deburring nozzles 51
Terminate and as 1 injection nozzle 50, and this injection nozzle 50 is disposed in the inside of single armed support 23.Spray
Penetrate nozzle 50 to be configured to can be moved in the Z-axis direction by lifting unit 55 (with reference to Fig. 2).
Deburring nozzle 51 be formed as in vertical direction extend cylindric.Formed in the lower end of deburring nozzle 51
The jet 53 of the upper surface injection water under high pressure of oriented plate workpiece W.Jet 53 be formed at deburring nozzle
Stream (not shown) connection of the inside of 51, this stream is connected to water under high pressure feed unit 52 by valve 54.High
Setting-out feed unit 52 will be improve fluid (water under high pressure) supply of pressure to each unhairing by compressor (not shown)
Thorn nozzle 51.
Here, the detailed construction of injection nozzle 50 is described with reference to Fig. 3.As it is shown on figure 3, jet 53 is in deburring
The centre of nozzle 51 is formed as the longest seam.The width of the Y direction of jet 53 has
The size more than radius (half of spacing P described later) of deburring nozzle 51.In the present embodiment, will be with
7 deburring nozzles 51 of one shape are in the direction (Y direction) orthogonal with cutting feed direction (X-direction)
On be divided into 2 row, and arrange as to arrange out the row of (upstream side) on rear side of 4 X-directions, arrange out 3 X
The row in (downstream) on front side of direction of principal axis.The outer peripheral face of each deburring nozzle 51 contacts with each other.Here, by adjacent
Distance between centers in the Y direction of each deburring nozzle 51 is labeled as spacing P.
4 deburring nozzles 51 on rear side of 3 deburring nozzles 51 on front side of X-direction and X-direction stagger
Half pitch.Thus, the jet 53 on front side of one end of the jet 53 on rear side of X-direction and X-direction
Local in the X-axis direction, one end overlapping.That is, to fill the end of the jet 53 on rear side of X-direction with adjacent
Jet 53 end between the mode of gap S, the jet 53 on front side of X-direction is positioned.
It is as a result, it is possible to (width of 3 spacing+1 jets 53 (below, is denoted as in scope R shown in double dot dash line
Spray regime R)) injection water under high pressure.It addition, the spray regime R of the water under high pressure formed by multiple jets 53
The width of the short side direction less than plate workpiece W.
Return Fig. 1, be provided with the input block 24 of the instruction accepting portion each for device in the corner of shell 11.This
Outward, the upper surface at supporting station 19 is configured with monitor 25.Monitor 25 is demonstrated and is imaged by image pickup part 22
The image that arrives, the processing conditions etc. of plate workpiece W.Additionally, it is each that topping machanism 1 is provided with composite control apparatus
The control unit 26 in portion.Control unit 26 is made up of the processor performing various process and memorizer etc..Memorizer root
According to purposes by ROM (Read Only Memory: read only memory), RAM (Random Access
Memory: random access memory) etc. one or more storage mediums constitute.Additionally, control unit 26 has
In the way of making chuck table 4 according to the angle rotation of regulation, θ workbench 14 is sent the angle command portion 27 of instruction.
Containing the action pattern in Fig. 5 chuck table described later 4 at control unit 26 internal memory, angle command portion 27 is according to Fig. 5
Shown action pattern and θ workbench 14 is sent instruction.Thus, θ workbench 14 accepts from angle command portion
The instruction of 27 and make chuck table 4 rotate with the angle of regulation.In the present embodiment, worked by above-mentioned θ
Platform 14 and angle command portion 27 constitute chuck table rotary unit.
In topping machanism 1 as constructed as above, after plate workpiece W is attracted to maintain in chuck table 4, cutting
Unit 3 is located at assigned position.And, while cutting tool 31 high speed rotating, plate workpiece W is cut
Cut feeding, thus on plate workpiece W, form cutting slot.After machining, in the angle changing chuck table 4
Simultaneously so that plate workpiece W is cut feeding relative to the deburring nozzle 51 of injection water under high pressure.Thus, plate
The injected water under high pressure of whole upper surface of shape workpiece W so that the burr of the upper surface being formed at plate workpiece W is gone
Remove.
Then, with reference to Fig. 4, the stock removal action of the topping machanism of present embodiment is described.Fig. 4 is to represent this embodiment party
The side view of the stock removal action of the topping machanism of formula.
As shown in Figure 4, first plate workpiece W is so that being formed with the face side of multiple protuberance 61 state down and putting
It is placed in chuck table 4.Now, each protuberance 61 of plate workpiece W is incorporated in each recess 42 of chuck table 4,
Device area A1 contacts with the bottom surface of recess 42, and remaining area A2 contacts with bearing-surface 43.And, pass through
Result from the negative pressure in suction surface 41 so that plate workpiece W is attracted to maintain in chuck table 4 (suction surface 41).
In this state, by θ workbench 14, chuck table 4 is rotated so that cutting feed unit 15
The segmentation preset lines L parallel alignment of cutting feed direction (X-direction) and plate workpiece W.And, pass through
Index feed unit 20 makes cutting unit 3 move in the Y-axis direction, so that cutting tool 31 is located in
Mode in segmentation preset lines L of plate workpiece W carries out the position adjustment of cutting unit 3.
Then, by not shown lifting unit, cutting unit 3 is moved in the Z-axis direction, cutting tool 31
Drop to all to cut off the height of plate workpiece W.Then, spray to plate workpiece W from deburring nozzle 51
Penetrate water under high pressure, make chuck table move (cutting in the X-axis direction relative to the cutting tool 31 of high speed rotating simultaneously
Feeding).Cutting tool 31 enters into entrance groove 44 and cuts plate workpiece W along segmentation preset lines L.Thus,
The cutting slot G along segmentation preset lines L is formed on plate workpiece W.It addition, now, cutting slot G (resin base
Plate 60) edge part branch produce the burr (not shown) that tilts along the direction of rotation of cutting tool 31.
After the cutting that string is split preset lines L terminates, made by index feed unit 20 (with reference to Fig. 1)
Obtaining cutting unit 3 to move in the Y-axis direction, cutting tool 31 is located in adjacent segmentation preset lines L.And
And, implement machining along new segmentation preset lines L.Tie in all segmentation preset lines L along a direction
After having restrainted machining, segmentation preset lines L in another direction of the segmentation preset lines L-orthogonal in enforcement and a direction
Machining.So, after all segmentation preset lines L of plate workpiece W have been carried out cutting, can be in tabular
Form cutting slot G on workpiece W, and be formed with burr on cutting slot G.
Then, with reference to Fig. 5 to Figure 11, the burr removing method of present embodiment is described.Fig. 5 is to represent this embodiment party
The table of the action pattern of the chuck table in the deburring action of the topping machanism of formula.Fig. 6 is to represent cutting of present embodiment
The side view of the deburring action of turning device.Fig. 7 to Figure 11 is the deburring of the topping machanism representing present embodiment
The top view of one example of action.
In the present embodiment, as described in Figure 3, multiple deburring nozzle 51 is concentrated to be configured to 1 injection nozzle
50, and with the width (scope R shown in Fig. 3) of regulation, water under high pressure is sprayed in the front of plate workpiece W.As
Upper described, the spray regime R of the water under high pressure formed by multiple jets 53 width less than plate workpiece W.
Therefore, plate workpiece W is made to carry out relative to injection nozzle 50 when ejecting water under high pressure from jet 53
In the case of 1 cutting feed, it is impossible to the whole upper surface of plate workpiece W is sprayed water under high pressure.
Then, in the present embodiment, after making plate workpiece W come and go cutting feed the most for several times, root
According to the instruction from angle command portion 27, after making chuck table 4 rotate predetermined angular, again implement cutting feed.Cause
This, for the region failed when cutting feed before to plate workpiece W injection water under high pressure, it is possible to injection high pressure
Water.Therefore, by chuck table 4 is adjusted to various angle, and make plate workpiece W relative to spray according to each angle
Penetrate nozzle 50 cutting feed, from regardless of whether the spray regime R of injection nozzle 50 how, can be to plate workpiece
The whole upper surface injection water under high pressure of W.It is as a result, it is possible to remove due to machining upper at plate workpiece W
The burr that surface is formed.
In the present embodiment, the whole upper surface of plate workpiece W refers to be formed with the whole of semiconductor device etc.
Device area A1, and do not include remaining area A2.As remaining area A2 as it has been described above, refer to after singulation
The removed part as end material, the burr the most not removing remaining area A2 does not haves problem yet.It addition,
It is not limited to this structure, it is also possible to by the way of whole remaining area A2 is also sprayed water under high pressure, adjusts chuck table
The anglec of rotation of 4.
First, the action pattern of chuck table 4 in burr action is described.As it is shown in figure 5, in the present embodiment,
The action pattern of No.1 to No.6 is all pre-stored within control unit 26." angle " in table represents plate workpiece W
Length direction (chuck table 4) relative to the angle of cutting feed direction (X-direction)." step angle in table
Degree " represent chuck table 4 feeding angle." coming and going number of times " in table represents that coming and going of the cutting feed of each angle is secondary
Number.
In the action pattern of No.1, the angle in chuck table 4 is to be fed according to every 2 ° in the range of 0 °~14 °,
And implement to come and go the cutting feed of 4 times in each angle.In the action pattern of No.2, in the angle of chuck table 4
For being fed according to every-2 ° in the range of-2 °~-14 °, and implement to come and go the cutting feed of 4 times in each angle.?
In the action pattern of No.3, the angle in chuck table 4 is to be fed according to every 2 ° in the range of 182 °~194 °, and
And the cutting feed of 4 times is implemented to come and go in each angle.In the action pattern of NO.4, the angle in chuck table 4 is
It is fed according to every-2 ° in the range of 178 °~166 °, and implements to come and go the cutting feed of 4 times in each angle.?
In the action pattern of No.5, the angle of chuck table 4 rotates to be 52 °, implements to come and go the cutting feed of 4 times in this angle.
In the action pattern of No.6, the angle of chuck table 4 rotates to be-52 °, implements to come and go the cutting of 4 times in this angle
Feeding.
In the present embodiment, according to the angle from the order adjustment chuck table 4 of No.1 to No.6, at each angle
Plate workpiece W (chuck table 4) is made to be cut feeding relative to injection nozzle 50.Hereinafter, with reference to Fig. 6 extremely
Figure 11, illustrates each action pattern of deburring action and No.1 to No.6.It addition, in Fig. 7 to Figure 11, for
It is easy to explanation, is represented the region of injected water under high pressure by jeting area T.
As shown in Figure 6 and Figure 7, in the action pattern of No.1 so that the length direction of plate workpiece W with cut
Cut the mode that direction of feed angulation is 0 ° so that chuck table 4 rotates.And, so that injection nozzle 50
The center of the Y direction of the spray regime R of (multiple deburring nozzle 51) and the short side direction (Y of plate workpiece W
Direction of principal axis) the consistent mode in center, make chuck table 4 in Y-axis by index feed unit 20 (with reference to Fig. 1)
Side moves up.Injection nozzle 50 is declined by lifting unit 55, the end of jet 53 close to and tabular
The spaced apart minim gap of the upper surface of workpiece W.
And, while spraying water under high pressure from jet 53 to spray regime R, plate workpiece W (chuck table 4)
It is cut feeding relative to injection nozzle 50.Thus, the upper surface at plate workpiece W can be according to jeting area T
Injected water under high pressure.It addition, this cutting feed is come and gone enforcement 4 times at 0 °.Additionally, during deburring action
Cutting feed speed for example, 200mm/sec, is adjusted to suitably to remove the journey of the burr being formed at cutting slot G
Degree.Additionally, be as noted previously, as the end upper surface close to plate workpiece W of jet 53, therefore at height
Setting-out impacts in the period before the upper surface of plate workpiece W, it is possible to the pressure reducing water under high pressure reduces.Its knot
Really, it is possible to remove flash removed well.
After a direction (0 °) implements the cutting feed of round 4 times, chuck table 4 is made to rotate 2 °, with above-mentioned
Similarly implement to come and go the cutting feed of 4 times.Repeat this action till the angle of chuck table 4 becomes 14 °,
It is as a result, it is possible to according to the jeting area T shown in Fig. 8, spray water under high pressure to the upper surface of plate workpiece W.
Then, the action pattern of No.2 is implemented.In the action pattern of No.2, the angle of chuck table 4 rotates to-2 °,
While injection water under high pressure, again carry out coming and going the cutting feed of 4 times.And, by implementing to come and go 4 according to every-2 °
Secondary cutting feed and until becoming-14 °, thus according to the jeting area T shown in Fig. 9, upper to plate workpiece W
Surface injection water under high pressure.
Then, the action pattern of No.3 is implemented.In the action pattern of No.3, the angle of chuck table 4 rotates extremely
182 °, while injection water under high pressure, again carry out coming and going the cutting feed of 4 times.And, by according to every 2 ° of enforcements
Come and go the cutting feed of 4 times until becoming 194 °, thus according to jeting area T in the same manner as Fig. 8, to plate workpiece
The upper surface injection water under high pressure of W.
Then, the action pattern of No.4 is implemented.In the action pattern of No.4, the angle of chuck table 4 rotates extremely
178 °, the most again carry out coming and going the cutting feed of 4 times at injection water under high pressure.And, by according to every-2 ° of enforcements
Come and go the cutting feed of 4 times until becoming 166 °, thus according to jeting area T in the same manner as Fig. 9, to plate workpiece
The upper surface injection water under high pressure of W.
Then, the action pattern of No.5 and No.6 is implemented.In the action pattern of No.5, as shown in Figure 10, card
The angle of dish platform 4 rotates to 52 °, carries out coming and going the cutting feed of 4 times while injection water under high pressure.Hereafter, exist
In the action pattern of No.6, as shown in figure 11, the angle of chuck table 4 rotates to-52 °, is spraying the same of water under high pressure
Shi Jinhang comes and goes the cutting feed of 4 times.Thus, the upper table in all device area A1, to plate workpiece W
Face injection water under high pressure, it is possible to removed the burr of the upper surface being formed at plate workpiece W by machining.
As it has been described above, according to the topping machanism 1 of present embodiment, by cutting tool 31 at plate workpiece W
All segmentation preset lines L on all define cutting slot G after, according to each predetermined angular of chuck table 4 so that
Plate workpiece W is cut feeding relative to the deburring nozzle 51 of injection water under high pressure.Thus, from jet 53
In the case of the width of the spray regime R of injection is less than the width of plate workpiece W, it is possible to whole to plate workpiece W
Individual upper surface (the cutting slot G formed on all device area A1) injection water under high pressure.I.e., no matter plate workpiece
The width of W how, the whole upper surface of plate workpiece W can be sprayed water under high pressure.It is as a result, it is possible to remove
It is formed at the burr of the upper surface of plate workpiece W.Additionally, due to increase without the size according to plate workpiece W
Jet 53, therefore can spray water under high pressure when not using jumbo compressor and maintain high pressure.Cause
This, be obtained in that good deburring effect by cheap structure.
It addition, the invention is not restricted to above-mentioned embodiment, it is possible to carry out various change and implement.At above-mentioned embodiment
In, the size and shape illustrated in accompanying drawing etc. is not limited to this, can in the range of the effect playing the present invention suitably
Change.As long as additionally, just without departing from the range of the object of the invention can suitably changing and implement.
Such as, in the above-described embodiment, 7 deburring nozzles 51 are concentrated to be configured to injection nozzle 50, but
It is not limited to this structure.Quantity for deburring nozzle 51 is not specially limited, can be by less quantity (example
Such as 5,6) constitute.Constitute also by 2 row in the case of change quantity, and the deburring nozzle of different lines
51 arrange in the way of the half pitch that staggers.For example, it is possible to by the jet in Y direction with Rack
Single injection nozzle 50 (deburring nozzle 51) constitute, and now there is multiple jet 53, jet 53
Constituted by 2 row, and the jet 53 of different lines staggers half pitch.
Additionally, in the above-described embodiment, jet 53 is configured to be formed by the seam longer in Y direction,
But it is not limited to this structure.Jet 53 such as can also be formed as circle or elliptical shape.
Additionally, in the above-described embodiment, the width of the Y direction being configured to jet 53 has deburring nozzle
The size more than radius of 51, but it is not limited to this structure.For example, it is also possible to be formed as the structure shown in Figure 12.
Figure 12 is the schematic diagram of the injection nozzle of variation.The injection nozzle 50 of variation and the difference of present embodiment
Being, the width of the Y direction of jet 53 is less than the radius of deburring nozzle 51.In this case, injection
The width of mouth 53 diminishes, it is possible to promote the pressure of water under high pressure further, improves deburring effect.Additionally, from injection
Water under high pressure bores when impacting on plate workpiece W of mouth 53 injection can go above the bore of jet 53, punching
Hit shape a little and become generally elliptical shape.Now, the pressure of the middle body of shock point becomes the highest, shock point
Central part branch impacts burr such that it is able to make burr come off from plate workpiece W and effectively remove it.
The jeting area of water under high pressure can be made to diminish it addition, the width of jet 53 diminishes, as shown in figure 12, Y direction
Spray regime R can be intermittently formed.But, as described in Figure 5, according to the action pattern of No.1 to No.4, often
When the angle making chuck table 4 circle round subtly 2 ° time all repeat deburring (cutting feed) such that it is able to institute
The cutting slot G being formed on device area A1 having sprays water under high pressure.
Additionally, in the above-described embodiment, it is configured to by making cutting tool 31 in the cutting feed with chuck table 4
The so-called downward cutting that identical side, direction rotates up and cuts, to form cutting slot G, but is not limited to this
Structure.Can also rotate by making the cutting tool 31 in the reverse direction in the cutting feed direction with chuck table 4 and cut
The upwards cutting cut, forms cutting slot G.
Probability is utilized in industry
As it has been described above, the present invention can spray high pressure when not using jumbo compressor and maintain high pressure
Water, has the effect that can be obtained good deburring effect by cheap structure, by cutting tool cutting envelope
Fill in the topping machanism of substrate especially useful.
Claims (1)
1. a topping machanism, it has: chuck table, it keeps plate workpiece;Chuck table rotary unit, it makes
This chuck table rotates;Cutting unit, it, can install this cutting tool in the way of rotating, passes through cutting tool
The plate workpiece that cutting is kept by this chuck table;Cutting feed unit, it makes this chuck table cut in the X direction
Cut feeding;Index feed unit, it makes this cutting unit carry out index feed in the Y direction;And deburring list
Unit, its burr being formed at plate workpiece from cutting slot removal, this cutting slot is to utilize this cutting unit to this chuck
The plate workpiece that platform keeps carries out cutting and being formed,
This deburring unit has: deburring nozzle, and it has the upper surface spray of the plate workpiece kept to this chuck table
Penetrate the jet of water under high pressure;And water under high pressure feed unit, it is to this deburring nozzle supply water under high pressure,
This chuck table rotary unit has: rotary driving part, and it makes this chuck table rotate;And angle command portion,
It makes this chuck table rotate with the angle of regulation by this rotary driving part,
Spray water under high pressure from this deburring nozzle, make to utilize this chuck table rotary unit and quilt by this cutting feed unit
This chuck table of the angle of regulation being positioned to be specified by this angle command portion carries out cutting feed such that it is able to remove
The burr formed on the plate workpiece that this chuck table keeps.
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JP2015032800A JP6486711B2 (en) | 2015-02-23 | 2015-02-23 | Cutting equipment |
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KR (1) | KR102365979B1 (en) |
CN (1) | CN105904029B (en) |
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CN113257713A (en) * | 2021-05-11 | 2021-08-13 | 苏州日月新半导体有限公司 | Integrated circuit deburring device, integrated circuit deburring auxiliary device and integrated circuit deburring method |
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JP6965126B2 (en) * | 2017-11-28 | 2021-11-10 | 株式会社ディスコ | Processing method of work piece |
CN108941772A (en) * | 2018-07-16 | 2018-12-07 | 钱浩 | A kind of metal cutter with dust suction shockproof function |
JP2020088262A (en) * | 2018-11-29 | 2020-06-04 | 株式会社ディスコ | Division method of package substrate |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63209806A (en) * | 1987-02-27 | 1988-08-31 | 株式会社日立製作所 | Dicing device |
JP2002305174A (en) * | 2001-04-06 | 2002-10-18 | Seiko Epson Corp | Method for cleaning semiconductor wafer |
JP2003168659A (en) * | 2001-12-04 | 2003-06-13 | Tokyo Seimitsu Co Ltd | Singularization apparatus having high-pressure cleaning nozzle |
JP2007042742A (en) * | 2005-08-01 | 2007-02-15 | Dainippon Screen Mfg Co Ltd | Substrate cleaning method and device |
CN1962211A (en) * | 2005-11-07 | 2007-05-16 | 株式会社迪斯科 | Substrate cutting device |
JP2008060284A (en) * | 2006-08-31 | 2008-03-13 | Matsushita Electric Ind Co Ltd | Method and device for cleaning semiconductor substrate |
CN201994267U (en) * | 2010-12-31 | 2011-09-28 | 上海新阳半导体材料股份有限公司 | Spray nozzle header for high-pressure water spray device |
JP2015005543A (en) * | 2013-06-19 | 2015-01-08 | 株式会社ディスコ | Processing method for package substrate and cutting device used in execution of the method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090024408A (en) * | 2007-09-04 | 2009-03-09 | 삼성전자주식회사 | Appratus for sawing a wafer having a nozzle eliminating a metal burr in a scribe lane, method of sawing the wafer and semiconductor package fabricated thereby the same |
JP2010123823A (en) * | 2008-11-21 | 2010-06-03 | Disco Abrasive Syst Ltd | Cutting device |
JP2014123590A (en) * | 2012-12-20 | 2014-07-03 | Disco Abrasive Syst Ltd | Cleaning apparatus |
JP2014143322A (en) * | 2013-01-24 | 2014-08-07 | Disco Abrasive Syst Ltd | Cleaning device and cleaning method |
-
2015
- 2015-02-23 JP JP2015032800A patent/JP6486711B2/en active Active
-
2016
- 2016-01-08 TW TW105100546A patent/TWI675730B/en active
- 2016-02-15 KR KR1020160017238A patent/KR102365979B1/en active IP Right Grant
- 2016-02-17 CN CN201610088193.XA patent/CN105904029B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63209806A (en) * | 1987-02-27 | 1988-08-31 | 株式会社日立製作所 | Dicing device |
JP2002305174A (en) * | 2001-04-06 | 2002-10-18 | Seiko Epson Corp | Method for cleaning semiconductor wafer |
JP2003168659A (en) * | 2001-12-04 | 2003-06-13 | Tokyo Seimitsu Co Ltd | Singularization apparatus having high-pressure cleaning nozzle |
JP2007042742A (en) * | 2005-08-01 | 2007-02-15 | Dainippon Screen Mfg Co Ltd | Substrate cleaning method and device |
CN1962211A (en) * | 2005-11-07 | 2007-05-16 | 株式会社迪斯科 | Substrate cutting device |
JP2008060284A (en) * | 2006-08-31 | 2008-03-13 | Matsushita Electric Ind Co Ltd | Method and device for cleaning semiconductor substrate |
CN201994267U (en) * | 2010-12-31 | 2011-09-28 | 上海新阳半导体材料股份有限公司 | Spray nozzle header for high-pressure water spray device |
JP2015005543A (en) * | 2013-06-19 | 2015-01-08 | 株式会社ディスコ | Processing method for package substrate and cutting device used in execution of the method |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113257713A (en) * | 2021-05-11 | 2021-08-13 | 苏州日月新半导体有限公司 | Integrated circuit deburring device, integrated circuit deburring auxiliary device and integrated circuit deburring method |
CN113257713B (en) * | 2021-05-11 | 2024-05-17 | 日月新半导体(苏州)有限公司 | Integrated circuit deburring device, integrated circuit deburring auxiliary device and integrated circuit deburring method |
Also Published As
Publication number | Publication date |
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JP6486711B2 (en) | 2019-03-20 |
KR102365979B1 (en) | 2022-02-22 |
TW201641242A (en) | 2016-12-01 |
CN105904029B (en) | 2019-08-16 |
KR20160102889A (en) | 2016-08-31 |
JP2016157723A (en) | 2016-09-01 |
TWI675730B (en) | 2019-11-01 |
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