TW201641242A - Cutting device - Google Patents

Abstract

The present invention discloses a cutting device (1) capable of ejecting high-pressure water without using a high-capacity compressor for maintaining a high pressure, so that a good burrs-removing effect can be obtained. The cutting device (1) comprises a chuck table (4) for holding a plate-like workpiece (W), a [theta]-stage (14) for rotating the chuck table, and a cutting means (3) of using a cutting tool (31) to cut the plate-like workpiece, a cutting feeding means (15) for making the chuck table and the cutting means perform relatively cutting and feeding operations, a burrs-removing means (5) for removing burrs formed at a cutting groove (G) of the plate-like workpiece (W). The burrs-removing means has a burrs-removing nozzle (51) for ejecting high-pressure water on the upper surface of the plate-like workpiece. The chuck table is rotated at each specific angle to perform cutting and feeding operations on high pressure water ejected from the burr-removing nozzle.

Description

Cutting device

The present invention relates to a cutting device for cutting a plate-shaped workpiece using a cutting tool, and more particularly to a cutting device for cutting a package substrate using a cutting tool.

A plate-shaped workpiece such as a package substrate is formed by molding a resin on a substrate made of a resin substrate. The cutting groove after cutting such a plate-like workpiece by the cutting tool generates a burr. In order to remove the burrs, a cutting device having an injection nozzle for spraying high-pressure water onto the processed plate-shaped workpiece has been proposed (for example, see Patent Document 1). In the cutting apparatus described in Patent Document 1, the plurality of injection nozzles are arranged in a line, and the high-pressure water is sprayed onto the upper surface of the plate-like workpiece in a width larger than the longitudinal direction of the plate-like workpiece. In this state, by the relative movement of the plate-like workpiece and the spray nozzle, the high-pressure water is sprayed to the entire surface of the plate-like workpiece to remove the burrs.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-125667

However, the cutting device described in Patent Document 1 is configured to spray high-pressure water at a width larger than the width of the plate-like workpiece. Therefore, when the width of the plate-shaped workpiece is larger, it is necessary to increase the width of the injection nozzle or increase the size of the injection nozzle. Quantity. Therefore, it is difficult to maintain the pressure of the high-pressure water sprayed from the injection nozzle in a high state, and as a result of the pressure drop of the high-pressure water, there is a problem that the effect of good burrs cannot be obtained. In order to maintain the pressure of the high-pressure water, it is also considered to introduce a large-capacity compressor, but it is not preferable from the viewpoint of cost.

The present invention has been made in view of such a problem, and an object thereof is to provide a cutting device which can produce high-pressure water while maintaining a high pressure without using a large-capacity compressor, and can obtain an inexpensive constitution and a good effect of removing burrs. .

The cutting device of the present invention comprises: a disk mounting table for holding a plate-shaped workpiece; a disk mounting table rotating means for rotating the disk mounting table; and a cutting means for mounting the cutting tool Rotating, cutting the plate-shaped workpiece held by the pallet mounting table with a cutting tool; cutting the feeding means, causing the cutting table mounting table to cut and feed in the X direction; and indexing feeding means for cutting the cutting means Y-direction indexing feed; and burr removal means, which are maintained by cutting the pallet mounting table by means of cutting The cutting groove after the plate-shaped workpiece removes the burr formed on the plate-shaped workpiece, and the burr removing means includes a burr removing nozzle that is provided with a jet of high-pressure water sprayed toward the upper surface of the plate-shaped workpiece held by the disk mounting table. And a high-pressure water supply means for supplying high-pressure water to the burr removing nozzle, the cymbal mounting table rotating means comprising: a rotary driving portion for rotating the cymbal mounting table; and an angle command portion for rotating The driving unit rotates the disk mounting table at a specific angle, and the high-pressure water is sprayed from the burr removing nozzle, and is positioned at a specific angle commanded from the angle command unit by the cutting and feeding means by the cutting and feeding means. The cutting table is fed by cutting, and the burrs of the plate-like workpiece held by the tray mounting table can be removed.

According to this configuration, after the cutting groove is formed in the plate shape by the cutting tool, the plate-shaped workpiece is cut and fed against the burr removing nozzle for jetting the high-pressure water in accordance with each specific angle of the disk load. Accordingly, even if the size of the ejection opening is small with respect to the sheet-like workpiece, high-pressure water can be sprayed onto the entire upper surface of the plate-like workpiece. As a result, the burrs formed on the upper surface of the plate-like workpiece can be removed. Further, since it is not necessary to increase the size of the plate-shaped workpiece, the injection port can be increased, so that the high-pressure water can be sprayed without using a large-capacity compressor to maintain the high pressure. According to this, it is possible to obtain a good burr removal effect with an inexpensive constitution.

According to the present invention, the plate-shaped workpiece is cut to the burr removing nozzle for spraying high-pressure water according to each specific angle of the tray mounting table. By cutting the feed, it is possible to spray high-pressure water while maintaining a high pressure without using a large-capacity compressor, and it is possible to obtain a good burr removal effect with an inexpensive configuration.

W‧‧‧plate work

G‧‧‧Cutting trench

1‧‧‧Cutting device

14‧‧‧θ mounting table (rotary drive unit)

15‧‧‧Cutting feed means

20‧‧‧Divided feeding means

27‧‧‧ Angle Command Department

3‧‧‧ cutting means

31‧‧‧Cutting tools

32‧‧‧ shaft

33‧‧‧Tool cover

4‧‧‧挟盘台

5‧‧‧Mask removal means

50‧‧‧jet nozzle

51‧‧‧Mask removal nozzle

52‧‧‧High-pressure water supply means

53‧‧‧jet

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cutting apparatus according to this embodiment.

Fig. 2 is a side view of the cutting device according to the embodiment.

Fig. 3 is a schematic view when the ejection nozzle shown in Fig. 2 is viewed from an arrow A.

Fig. 4 is a side view showing the cutting operation of the cutting device according to the embodiment.

Fig. 5 is a table showing an operation mode of the disk mounting table in the burr removal operation of the cutting device according to the present embodiment.

Fig. 6 is a side view showing the burr removing operation of the cutting device according to the embodiment.

Fig. 7 is a top view showing an example of burr removal of the cutting device according to the present embodiment.

Fig. 8 is a top view showing an example of a burr removal operation of the cutting device according to the embodiment.

Fig. 9 is a top view showing an example of a burr removal operation of the cutting device according to the embodiment.

Fig. 10 is a top view showing an example of a burr removal operation of the cutting device according to the embodiment.

Fig. 11 is a top view showing an example of a burr removing operation of the cutting device according to the present embodiment.

Fig. 12 is a schematic view of an injection nozzle relating to a modification.

Hereinafter, the cutting device according to this embodiment will be described with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cutting apparatus according to this embodiment. Fig. 2 is a side view of the cutting device according to the embodiment. Fig. 3 is a schematic view when the ejection nozzle shown in Fig. 2 is viewed from an arrow A. Further, in the following, an example of the cutting device will be described, but the configuration of the cutting device according to the present embodiment is not limited thereto. When the plate-shaped workpiece can be cut, the cutting device can be made into any configuration. Furthermore, in Fig. 1, the size of the plate-like workpiece is exaggerated with respect to the tray mounting table.

As shown in FIG. 1 and FIG. 2, the cutting apparatus 1 is configured to relatively move the cutting tool 3 by the disk mounting table 4, and divide the plate-shaped workpiece W held by the disk mounting table 4 into individual wafers. . The plate-shaped workpiece W is composed of a package substrate provided in a plurality of (three in the present embodiment) resin projections 61 on the surface of the rectangular resin substrate 60 in the longitudinal direction. The resin substrate 60 is, for example, a PCB substrate. The plate-shaped workpiece W is divided into a plurality of device regions A1 for a semiconductor device in which a plurality of convex portions 61 are disposed and electrodes are disposed therein, and a remaining region A2 around the device region A1. Each device area A1 is divided into a plurality of areas by a grid-shaped dividing line L, and a semiconductor device is disposed in each area (no picture) Show).

In the plate-like workpiece W, the remaining area A2 is removed as an end material, and the device area A1 is divided into individual wafers along the dividing line L1. Further, the plate-shaped workpiece W is not limited to the substrate for the semiconductor device, and may be a metal substrate for the LED device. Furthermore, it is not limited to the substrate after the wafer is mounted, and may be a substrate before the wafer is mounted. The convex portion 61 of the plate-like workpiece W is formed of, for example, an epoxy resin or a polyoxyn resin. However, if the convex portion 61 can be formed on the resin substrate 60, it may be any resin.

A rectangular opening (not shown) extending in the X-axis direction (cutting direction) is formed on the upper surface of the casing 11. The opening portion is covered by the movable X-axis mounting table 12 and the bellows-shaped waterproof cover 13 at the same time as the disk mounting table 4. Below the waterproof cover 13, a ball screw type cutting feed means 15 (see Fig. 2) for moving the disk mounting table 4 in the X-axis direction is provided.

The X-axis mounting table 12 is provided with a top-side rectangular disk mounting table 4 that is rotatable via the θ mounting table 14. The θ stage 14 functions as a rotation driving unit that rotationally drives the disk mounting table 4 with the center of the disk mounting table 4 as an axis. The tray mounting table 4 has a suction surface 41 that holds the sheet-like workpiece W. A plurality of concave portions 42 corresponding to the plurality of convex portions 61 of the plate-shaped workpiece W are formed on the suction surface 41 of the tray mounting table 4 in the longitudinal direction. Each of the recessed portions 42 of the cymbal mounting table 4 has a depth that matches the height of each of the convex portions 61 of the plate-like workpiece W, and is formed with each convex portion 61 capable of accommodating the plate-shaped workpiece W. A branch is formed around each recess 42 The support surface 43 supports the remaining area A2 around the convex portion 61 of the plate-like workpiece W.

Further, on the suction surface 41 of the cymbal mounting table 4, an entry groove 44 into which the cutting tool 31 enters the predetermined dividing line L of the plate-shaped workpiece W is formed. On the bottom surface (suction surface 41) of the concave portion 42 of the disk mounting table 4, a plurality of suction holes for sucking and holding the divided wafers W are formed in a region which is divided into a lattice shape by the entrance grooves 44. (No picture). Further, a plurality of suction holes (not shown) that suck and hold the remaining area A2 of the plate-shaped workpiece W are formed on the support surface 43 (the suction surface 41) around the concave portion 42. Each of the suction holes is connected to a suction source (not shown) through a flow path in the tray mounting table 4, respectively.

The tray mounting table 4 reciprocates between the receiving position at the center of the apparatus and the processing position of the cutting means 3. In addition, FIG. 1 shows a state in which the tray mounting table 4 stands by at the receiving position. In the casing 11, a pair of guide rails 16 which are parallel to the Y-axis direction are provided on the deep side of one of the corner portions adjacent to the receiving position. The pair of guide rails 16 position the plate-like workpiece W in the X-axis direction.

In the vicinity of the pair of guide rails 16, a first conveyance arm 17 that conveys the plate-shaped workpiece W between the guide rail 16 and the tray mounting table 4 is provided. The L-shaped arm portion 17a is rotated by the first transport arm 17 to transport the plate-shaped workpiece W. Further, a rotator type cleaning mechanism 18 is provided after the tray mounting table 4 at the receiving position. In the cleaning mechanism 18, after the washing water is sprayed toward the rotating rotating table 18a to wash the plate-shaped workpiece W, the drying gas is blown to dry the plate-shaped workpiece.

A support table 19 that supports the cutting means 3 is provided on the casing 11. The cutting means 3 is positioned above the disk mounting table 4 at the machining position, and is configured to cut the cutting tool 31 from the surface of the plate-shaped workpiece W to cut the plate-shaped workpiece W. The cutting means 3 mounts the cutting tool 31 that cuts the sheet-like workpiece W so as to be rotatable. The cutting means 3 is indexed and fed in the Y-axis direction by the index feeding means 20 so that the cutting means 3 and the disk mounting table 4 relatively move in the Y-axis direction. Further, the cutting means 3 is moved in the Z-axis direction by a lifting means (not shown). The index feeding means 20 and the lifting means are configured by, for example, a ball screw type moving mechanism.

The cutting means 3 is configured to mount the cutting tool 31 at the front end of the rotating shaft 32, and to provide the tool cover 33 so as to cover the outer circumference of the cutting tool 31. The cutting tool 31 is formed of, for example, a ring-shaped shower plate, and is formed by bonding a bonding material to an abrasive such as diamond. The cutter cover 33 is formed in a box shape that covers the upper half of the cutting tool 31. The cutter cover 33 is provided with a cutting water nozzle 34 that sprays cutting water toward the cutting portion. Here, the receiving position side is regarded as the front with respect to the processing position, and the processing position side is regarded as the rear with respect to the receiving position.

The cutting water nozzle 34 is formed in a slightly L shape extending rearward from the lower end of the cutter cover 33, and the front end of each cutting water nozzle 34 is positioned at a lower half of the cutting tool 31. A plurality of slits 35 are formed at the front end of the cutting water nozzle 34 (refer to FIG. 2). The cutting water is sprayed from the slit 35 toward the cutting plate 31. By supplying the cutting water to one side, the cutting tool 31 that is rotated at a high speed cuts into the plate-shaped workpiece W, and the plate-like workpiece W The dividing line is cut.

A second transport arm 21 that transports the plate-shaped workpiece W between the guide rail 4 and the cleaning mechanism 18 is provided on the side surface 19a of the support base 19. The arm portion 21a of the second transport arm 21 extends obliquely, and the arm portion 21a moves in the Y-axis direction to transport the plate-shaped workpiece W. Further, the support base 19 is provided with a cantilever support portion 23 that supports the photographing portion 22 so as to straddle the movement path (X-axis direction) of the tray mounting table 4. The photographing unit 22 protrudes from below the cantilever support portion 23, and the photographing unit 22 photographs the sheet-like workpiece W. The photographing image formed by the photographing unit 22 is aligned by the cutting means 3 and the tray mounting table 4.

Further, the cutting device 1 is provided with a burr removing means 5 for removing the upper surface of the plate-like workpiece W. The burr removing means 5 has a plurality of burr removing nozzles 51 for jetting high-pressure water toward the sheet-like workpiece W, and a high-pressure water supply means 52 for supplying high-pressure water to the burr removing nozzles 51. In the present embodiment, a plurality of the above-described burr removing nozzles 51 are bundled to form one jetting nozzle 50, and the jetting nozzles 50 are disposed inside the cantilever supporting portion 23. The injection nozzle 50 is configured to be movable in the Z-axis direction by the elevation means 55 (see FIG. 2).

The burr removing nozzle 51 is formed in a cylindrical shape extending in the vertical direction. An injection port 53 for injecting high-pressure water toward the upper surface of the plate-like workpiece W is formed at the lower end of the burr removing nozzle 51. The injection port 53 communicates with a flow path (not shown) formed inside the burr removal nozzle 51, and the high pressure water supply means 52 is connected to the flow path via the valve 54. The high-pressure water supply means 52 supplies a fluid (high-pressure water) whose pressure is increased by a compressor (not shown). The nozzles 51 are removed to the respective burrs.

Here, the detailed configuration of the injection nozzle 50 will be described with reference to Fig. 3 . As shown in Fig. 3, the injection port 53 is formed at the center of the burr removing nozzle 51, and forms a slit having a long length in the Y-axis direction. The width of the injection port 53 in the Y-axis direction has a size equal to or larger than the radius of the burr removal nozzle 51 (one half of the pitch P to be described later). In the present embodiment, the seven burr removing nozzles 51 of the same shape are arranged in two rows in the direction orthogonal to the cutting feed direction (X-axis direction) (Y-axis direction), and the X-axis direction is followed. The side (upstream side) is arranged in parallel, and the front side (downstream side) in the X-axis direction is arranged in three. The outer peripheral surfaces of the burr removing nozzles 51 are in contact with each other. Here, the distance between the centers in the Y-axis direction of the adjacent burr removal nozzles 51 is shown as the pitch P.

The three burr removal nozzles 51 on the front side in the X-axis direction are offset by a half pitch with respect to the four burr removal nozzles 51 on the rear side in the X-axis direction. Accordingly, one end of the ejection opening 53 on the rear side in the X-axis direction and one end of the ejection opening 53 on the front side in the X-axis direction partially overlap in the X-axis direction. That is, the injection port 53 on the front side in the X-axis direction is positioned so as to bury the gap S between the end portion of the injection port 53 on the rear side in the X-axis direction and the end portion of the injection port 53 adjacent thereto. As a result, high-pressure water can be ejected in the range R (three-pitch + width of one injection port 53 (hereinafter, referred to as injection range R) indicated by a two-dot chain line. Further, high-pressure water formed by the plurality of injection ports 53 can be used. The injection range R is smaller than the width of the short side direction of the sheet-like workpiece W.

Returning to Fig. 1, at the corner of the casing 11, an input means 24 for receiving an instruction to each part of the apparatus is provided. Furthermore, above the support table 19 A monitor 25 is disposed on the surface. The monitor 25 indicates an image photographed by the photographing unit 22, processing conditions of the sheet-like workpiece W, and the like. Further, the cutting device 1 is provided with a control means 26 for coordinating the respective parts of the control device. The control means 26 is constituted by a processor or a memory that performs various processes. The memory system is composed of one or a plurality of memory media such as a ROM (Read Only Memory) or a RAM (Random Access Memory) depending on the application. Further, the control means 26 has an angle command portion 27 that issues a command to the θ stage 14 to rotate the disk mounting table 4 at a specific angle. The control means 26 stores an operation mode of the disk mounting table 4 which will be described later in Fig. 5. The angle command unit 27 issues a command to the θ stage 14 in accordance with the operation mode shown in Fig. 5. Accordingly, the θ mounting table 14 receives the command from the angle command unit 27 to rotate the disk mounting table 4 at a specific angle. In the present embodiment, the θ mounting table 14 and the angle command unit 27 constitute a disk mounting table rotating means.

In the cutting apparatus 1 configured as described above, after the sheet-like workpiece W is sucked and held by the tray mounting table 4, the cutting means 3 is positioned at a specific position. Further, the cutting tool 31 is rotated at a high speed, and the plate-shaped workpiece is cut and fed to form a cutting groove in the plate-shaped workpiece W. After the cutting process, the sheet-like workpiece W is cut and fed to the burr removing nozzle 51 that sprays the high-pressure water while changing the angle of the tray mounting table 4. As a result, high pressure water is sprayed on the entire upper surface of the plate-like workpiece W, and the burrs formed on the upper surface of the plate-shaped workpiece W are removed.

Hereinafter, the cutting operation of the cutting device according to the present embodiment will be described with reference to Fig. 4 . Indicates the cut associated with this embodiment Side view of the cutting action of the cutting device.

As shown in FIG. 4, first, the sheet-like workpiece W is placed on the tray mounting table 4 with the surface side on which the plurality of convex portions 61 are formed facing downward. At this time, the convex portions 61 of the plate-shaped workpiece W are housed in the respective concave portions 42 of the tray mounting table 4, the device region A1 is in contact with the bottom surface of the concave portion 42, and the remaining region A2 is in contact with the support surface 43. Further, the sheet-like workpiece W is sucked and held by the tray mounting table 4 (suction surface 41) by the negative pressure generated at the suction surface 41.

In this state, the disk mounting table 4 is rotated by the θ mounting table 14, and the cutting feed direction (X-axis direction) of the cutting feed means 15 is aligned in parallel with the dividing line L of the plate-shaped workpiece W. Further, the cutting means 3 is moved in the Y-axis direction by the index feeding means 20, and the position of the cutting means 3 is adjusted so that the cutting tool 31 is positioned on the dividing line L of the sheet-like workpiece W.

Next, the cutting means 3 is moved in the Z-axis direction by the elevating means 3 (not shown), and the cutting tool 31 is lowered to the height at which the plate-shaped workpiece W can be completely cut. In addition, the high-pressure water is sprayed from the burr removing nozzle 51 toward the plate-shaped workpiece W, and the cutting wheel 31 is moved in the X-axis direction (cutting feed). The cutting tool 31 intrudes into the inlet groove 44 and cuts the plate-shaped workpiece W along the dividing line L. According to this, the cutting work G along the dividing line L is formed in the plate-like workpiece W. At this time, in the edge portion of the cutting groove G (resin substrate 60), a burr (not shown) which is wound up in the rotation direction of the cutting plate 31 is generated.

When the cutting of the predetermined dividing line L of one row is completed, the cutting means 3 is moved in the Y-axis direction by the index feeding means 20 (refer to FIG. 1), and the cutting tool 31 is positioned on the adjacent dividing line L. Further, the cutting process is performed along the new division planned line L. When the cutting process is completed for all the planned dividing lines L in one direction, the cutting process of the dividing line L in the other direction orthogonal to the dividing line L in one direction is performed. In this way, when all the predetermined dividing lines L of the plate-shaped workpiece W are cut, the cutting groove G is formed in the plate-shaped workpiece W, and the burrs are formed in the cutting groove G.

Hereinafter, a method of removing a burr according to the present embodiment will be described with reference to Figs. 5 to 11 . Fig. 5 is a table showing an operation mode of the disk mounting table in the burr removal operation of the cutting device according to the present embodiment. Fig. 6 is a side view showing the burr removing operation of the cutting device according to the embodiment. 7 to 11 are top views of an example of a burr removing operation of the cutting device according to the present embodiment.

In the present embodiment, as described in Fig. 3, the plurality of burr removing nozzles 51 are bundled to form one jetting nozzle 50, and the plate-shaped workpiece W is formed to a specific width (the range R shown in Fig. 3). The surface is sprayed with high pressure water. As described above, the injection range R of the high-pressure water formed by the plurality of injection ports 53 is smaller than the width of the plate-shaped workpiece W. Therefore, even if the plate-shaped workpiece W is subjected to the cutting feed of the injection nozzle 50 in a state where the high-pressure water is injected from the injection port 53, the high-pressure water cannot be sprayed on the entire upper surface of the plate-shaped workpiece W.

Therefore, in the present embodiment, the plate-like workpiece W is After the reciprocating cutting is performed several times in the same direction, the disk mounting table 4 is rotated by a specific angle by the command from the angle command unit 27, and the cutting feed is re-executed. Therefore, it is possible to eject high-pressure water in a region where high-pressure water cannot be sprayed on the plate-shaped workpiece W in the previous cutting feed. According to this, by adjusting the disk mounting table 4 to various angles, the plate-shaped workpiece W can be cut and fed to the injection nozzle 50 in accordance with each angle, and the plate can be applied regardless of the injection range R of the injection nozzle 50. The entire upper surface of the workpiece W is sprayed with high-pressure water. As a result, the burrs formed on the upper surface of the plate-like workpiece W by the cutting process can be removed.

In the present embodiment, the entire upper system of the plate-shaped workpiece W refers to the entire device region A1 in which a semiconductor device or the like is formed, and is a portion that does not include the remaining region A2. As described above, the remaining area A2 is removed as the end material after the division, so that there is no problem even if the burrs of the remaining area A2 are not removed. Further, the configuration is not limited to this, and even if the rotation angle of the tray mounting table 4 is adjusted, high pressure water may be sprayed on the entire remaining area A2.

First, an operation mode of the pallet mounting table 4 in the burr operation will be described. As shown in FIG. 5, in the present embodiment, the operation modes from No. 1 to No. 6 are previously stored in the control means 26. The "angle" in the table indicates the angle of the plate-like workpiece W in the longitudinal direction of the cutting feed direction (X-axis direction) (the tray mounting table 4). The "step angle" in the table refers to the feed angle of the tray mounting table 4. The "number of returns" in the table indicates the number of times the cutting feed is returned in each angle.

In the operation mode of No. 1, the angle of the tray mounting table 4 The advancement of 2° is performed every time in the range of 0° to 14°, and the round-trip cutting feed is performed at each angle. In the operation mode of No. 2, the angle of the disk mounting table 4 is advanced by -2° in the range of -2° to -14°, and the four-round cutting feed is performed at each angle. In the operation mode of No. 3, the angle of the disk mounting table 4 is advanced by 2° in the range of 182° to 194°, and the four-round cutting feed is performed at each angle. In the operation mode of No. 4, the angle of the disk mounting table 4 is advanced by -2° in the range of 178° to 166°, and the four-round cutting feed is performed at each angle. In the operation mode of No. 5, the angle of the disk mounting table 4 is rotated to 52°, and the round-trip cutting feed is performed at the angle. In the operation mode of No. 6, the angle of the tray mounting table 4 is rotated to -52°, and the round-trip cutting feed is performed at the angle.

In the present embodiment, the angle of the tray mounting table 4 is adjusted in the order of No. 1 to No. 6, and the plate-shaped workpiece W (the tray mounting table 4) cuts the injection nozzle 50 at each angle. give. Hereinafter, each operation mode up to the burr removal operation and No. 1 to No. 6 will be described with reference to FIGS. 6 to 11 . Further, in FIGS. 7 to 11, for the sake of convenience of explanation, the injection region T indicates the region where the high-pressure water is sprayed, As shown in FIG. 6 and FIG. 7, in the operation mode of No. 1, the disk mounting table 4 is rotated so that the angle between the longitudinal direction of the plate-shaped workpiece W and the cutting feed direction becomes 0°. Further, the index feeding means 20 (refer to FIG. 1) is moved to the Y-axis direction so that the center of the injection range R of the injection nozzle 50 (the plurality of burr removal nozzles 51) in the Y-axis direction and the plate-like workpiece The center of the short side of W (the Y-axis direction) is the same. The spray nozzle 50 is lowered by the lifting means 55, and is close to the injection port 53. There is a little gap between the end and the upper surface of the plate-like workpiece W.

Then, the plate-shaped workpiece W (the tray mounting table 4) is cut and fed to the injection nozzle 50 while the high-pressure water is sprayed from the injection port 53 in the injection range R. Accordingly, only a portion of the injection region T is sprayed with high-pressure water on the upper surface of the plate-like workpiece W. Moreover, the cutting feed is carried out at 0°. Further, the cutting feed speed at the time of the burr removing operation is, for example, 200 mm/sec, and is adjusted so that the burrs formed in the cutting groove G can be appropriately removed. Further, as described above, since the front end of the injection port 53 is close to the upper surface of the plate-shaped workpiece W, the pressure drop of the high-pressure water can be reduced during the period in which the high-pressure water collides with the upper surface of the plate-shaped workpiece W. As a result, the burrs can be removed well.

In one direction (0°), when the cutting feed 4 is returned, the disk mounting table 4 is rotated by only 2°, and the cutting feed is performed in the same manner as described above. The angle at which the operation is repeated to the tray mounting table 4 is 14°, and as a result, high pressure water is sprayed onto the upper surface of the plate-like workpiece W only in the portion of the injection region T shown in FIG.

Next, the No. 2 operation mode is implemented. In the operation mode of No. 2, the angle of the disk mounting table 4 is rotated to -2°, and the cutting feed of the four return is performed again while the high pressure water is being sprayed. Further, by performing a round-trip cutting feed of -2° to -14° each time, only the portion of the injection region T shown in Fig. 9 is sprayed with high-pressure water onto the plate-like workpiece W.

Next, the operation mode of No. 3 is implemented. In the operation mode of No. 3, the angle of the tray mounting table 4 is rotated to 182°, one The cutting feed of 4 back is performed again while spraying the high pressure water. Further, by performing the cutting feed of 2 round trips of 2° up to 194° each time, as in Fig. 8, only the portion of the injection region T, high-pressure water is sprayed onto the upper surface of the sheet-like workpiece W.

Next, the operation mode of No. 4 is implemented. In the operation mode of No. 4, the angle of the disk mounting table 4 is rotated to 178°, and the cutting feed of the four return is performed again while the high pressure water is being sprayed. Further, by performing the cutting feed of -2 round trips of -2° up to 166° each time, as in Fig. 9, only the portion of the injection region T, high-pressure water is sprayed onto the upper surface of the sheet-like workpiece W.

Further, the operation modes of No. 5 and No. 6 are implemented. In the operation mode of the No. 5, as shown in Fig. 10, the angle of the disk mounting table 4 is rotated to 52°, and the cutting feed of the four return is performed again while the high pressure water is being sprayed. Then, in the operation mode of No. 6, as shown in Fig. 11, the angle of the disk mounting table 4 is rotated to -52°, and the cutting feed of the four return is performed again while spraying the high-pressure water. By the above, in all the device areas A1, high-pressure water is sprayed onto the upper surface of the sheet-like workpiece W, and the burrs formed on the upper surface of the sheet-like workpiece W by the dicing process can be removed.

As described above, when the cutting device 1 according to the present embodiment is used, the cutting tool G is formed on all the dividing lines L of the plate-shaped workpiece W by the cutting tool 31. At each specific angle, the sheet-like workpiece W is cut and fed to the burr removing nozzle 51 that sprays high-pressure water. According to this, even from the injection port 53 to the plate shape When the width of the injection range R of the width injection of W is small, high pressure water may be sprayed on the entire upper surface of the plate-shaped workpiece W (the cutting groove G formed in all the device regions A1). That is, irrespective of the width of the sheet-like workpiece W, high-pressure water can be sprayed on the entire upper surface of the sheet-like workpiece W. As a result, the burrs formed on the upper surface of the plate-like workpiece W can be removed. Further, since it is not necessary to increase the size of the plate-shaped workpiece W to increase the injection port 53, the high-pressure water can be sprayed while maintaining the high pressure without using a large-capacity compressor. According to this, it is possible to obtain a good burr removal effect with an inexpensive constitution.

Further, the present invention is not limited to the above-described embodiments, and various modifications can be made thereto. In the above-described embodiment, the size, shape, and the like shown on the attached surface are not limited thereto, and can be appropriately changed within the range in which the effects of the present invention are exerted. Further, it can be carried out as appropriate without departing from the scope of the invention.

For example, in the above-described embodiment, the configuration is such that the injection nozzles 50 that bundle the seven burr removing nozzles 51 are bundled, but the configuration is not limited thereto. The number of the burr removing nozzles 51 is not particularly limited, and may be configured in a small number (for example, five or six). Even when the number is changed, it is composed of two rows, and the different burr removing nozzles 51 are arranged with a half pitch. For example, the single injection nozzle 50 (burr removal nozzle 51) having an injection port having a specific width in the Y-axis direction may be configured, but the plurality of injection ports 53 may be provided, and the injection port 53 may be formed in two rows, and the injection may be different. Port 53 is offset by a half pitch.

Furthermore, in the above embodiment, the injection port 53 is provided The configuration is formed by a slit having a long length in the Y-axis direction, but is not limited to this configuration. The ejection opening 53 may be formed, for example, in a circular or elliptical shape.

In the above-described embodiment, the width of the ejection opening 53 in the Y-axis direction has a size equal to or larger than the radius of the burr removing nozzle 51, but the configuration is not limited thereto. For example, it may be configured as shown in FIG. Fig. 12 is a schematic view of an injection nozzle relating to a modification. The spray nozzle 50 according to the modification is different from the present embodiment in that the width of the injection port 53 in the Y-axis direction is smaller than the radius of the burr removal nozzle 51. At this time, by the width of the ejection opening 53 becoming smaller, the pressure of the high-pressure water can be further increased, and the burr removal effect can be improved. Further, when the high-pressure water sprayed from the injection port 53 collides with the plate-shaped workpiece W, the diameter of the injection port 53 is increased in diameter, and the shape of the dot is slightly elliptical. At this time, the central portion of the dot becomes the highest pressure, and the central portion of the dot collides with the burr, whereby the burr can be detached from the laminar workpiece W and effectively removed. Further, as the width of the injection port 53 is reduced, the injection area of the high-pressure water is narrowed, and as shown in FIG. 12, the injection range R in the Y-axis direction is intermittently formed. However, as illustrated in Fig. 5, by the operation pattern from No. 1 to No. 4, the angle of the disk mounting table 4 is subdivided by 2° each time, and the burr removal (cutting feed) is repeated. High pressure water can be sprayed to the cutting grooves G formed in all the device regions A1.

In the above-described embodiment, the cutting groove 31 is formed so as to be cut in the same direction as the cutting feed direction of the disk mounting table 4, and the cutting groove G is formed. It is not limited to this configuration. Even by rotating the cutting tool 31 to The cutting feed direction of the disk mounting table 4 is reversed in the cutting direction, and the cutting groove G may be formed.

[Industrial use possibility]

As described above, the present invention has the effect of ejecting high-pressure water without maintaining a high-pressure compressor without using a large-capacity compressor, and achieving a good burr removal effect with an inexpensive configuration, particularly for cutting a package substrate with a cutting tool. Effective on the cutting device.

W‧‧‧plate work

G‧‧‧Cutting trench

4‧‧‧挟盘台

14‧‧‧θ mounting table (rotary drive unit)

15‧‧‧Cutting feed means

27‧‧‧ Angle Command Department

41‧‧‧Attraction

42‧‧‧ recess

43‧‧‧Support surface

44‧‧‧ Entering the ditch

5‧‧‧Mask removal means

50‧‧‧jet nozzle

51‧‧‧Mask removal nozzle

52‧‧‧High-pressure water supply means

53‧‧‧jet

54‧‧‧ valve

55‧‧‧ Lifting means

60‧‧‧Resin substrate

61‧‧‧ convex

A1‧‧‧ device area

A2‧‧‧ remaining area

Claims (1)

A cutting device comprising: a disk mounting table for holding a plate-shaped workpiece; a disk mounting table rotating means for rotating the disk mounting table; and a cutting means for mounting the cutting tool Rotating, cutting a plate-shaped workpiece held by the disk mounting table by a cutting tool; cutting the feeding means, causing the disk mounting table to cut and feed in the X direction; and indexing feeding means The cutting means is indexed in the Y direction; and the burr removing means is formed on the plate-shaped workpiece by removing the cutting groove after cutting the plate-shaped workpiece held by the disk mounting table by the cutting means. The burr removing means includes: a burr removing nozzle having an ejection port for injecting high-pressure water onto a plate-shaped workpiece held by the tray mounting table; and a high-pressure water supply means for supplying a high voltage to the burr removing nozzle Water, the disk mounting table rotating means includes: a rotation driving portion for rotating the disk mounting table; and an angle command portion for causing the angle driving portion to be at a specific angle The disk mounting table rotates, and the high-pressure water is sprayed from the burr, and the cutting table is used to position the disk mounting table at a specific angle commanded from the angle command unit by using the disk mounting table rotating means. The cutting feed is performed, and the burr formed by the plate-shaped workpiece held by the tray mounting table can be removed.