TW201946132A - Cutting device for effectively recycling cutting chips - Google Patents

Abstract

The present invention provides a cutting device for effectively recycling cutting chips, like edge materials, which comprises a cutting chip guiding shell (70) for receiving cutting water and cutting chips flowing from the chuck table (11, 12) holding a packaging substrate (P) after cutting; a cutting chip recycling box (71) for receiving cutting water and cutting chips flowing from the cutting chip guiding shell housing and recycling the cutting chips; and, a cutting chip outflow means (90) disposed in the cutting chip guiding shell for guiding the cutting chips flowing out to the cutting chip recycling box by flowing water. The cutting chip outflow means comprises a water curtain (91) and a rotary swinging portion (92) for rotating and swinging the flowing water from the water curtain back and forth along the Y-axis direction within the cutting chip guiding shell, and, after forming a puddle (W), pushes the cutting chips (CD) together with the puddle by the flowing water of water curtain, so as to enable the cutting chips to flow out to the cutting chip recycling box.

Description

Cutting device

The present invention particularly relates to a cutting device having a function of processing an end material generated when a workpiece is cut.

For example, a package substrate called a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded Package) substrate is used to cut each semiconductor element package using a cutting device. A dicing apparatus for cutting a package substrate along a dicing path, as disclosed in Patent Document 1, includes a chuck table holding a workpiece (package substrate), and a cutting means for cutting the workpiece. A cutting blade and a cutting water spraying means for spraying cutting water on the cutting blade are attached to the cutting means, and the cutting blade and the package substrate are cooled by spraying the cutting water during cutting. When the package substrate is set on the chuck table, the chuck table reciprocates to perform cutting of the package substrate.

At this time, cutting chips and cutting water such as end materials of the package substrate are scattered due to the rotation direction of the cutting blade. In the case of general downward cutting, the cutting blade rotates in the forward direction of the chuck table, so cutting chips and cutting water are scattered in the forward direction of the chuck table.

The cutting devices described in Patent Documents 1 and 2 are provided with an end material processing device that processes end materials scattered by cutting of the package substrate and cutting water. In this end material processing device, the scattered end material and cutting water are received by the channel shape portion provided near the chuck table, and flows into the direction of the chuck table, so that the end material and the cutting water fall to the endless belt. Or tilt the guide. The end material dropped on the endless belt or the inclined guide is transferred by the movement of the endless belt or the inclination of the inclined guide, and is recovered by being dropped on the end material collection container.

[Xizhi technical literature]
[Patent Literature]
[Patent Document 1] Japanese Patent Laid-Open No. 2002-239888
[Patent Document 2] Japanese Patent Laid-Open No. 2015-5544

[Problems to be Solved by the Invention]
However, in the above-mentioned end material processing apparatus, there is a problem that the end material of the cutting chips stays on the endless belt or the inclined guide plate, and the end material accumulates there.

The present invention has been made in view of this problem, and an object of the present invention is to provide a cutting device that can favorably recover cutting chips such as end materials.

[Technical means to solve the problem]
A cutting device according to one aspect of the present invention includes: holding means for holding a workpiece; cutting means provided with a cutting blade for cutting the workpiece held by the holding means; cutting water supply means for supplying cutting water to the cutting blade; Feeding means, the holding means is processed and fed in the X-axis direction; and indexing feeding means, the cutting means is indexed in the Y-axis direction orthogonal to the X-axis direction, and the cutting water supplied to the cutting blade is followed by The side where the cutting blades are scattered and scattered is regarded as the downstream side in the processing feed direction, and the opposite side is regarded as the upstream side in the processing feed direction. The cutting device includes a cutting chip recovery box, a cutting chip guide casing, and cutting. The chip outflow means includes a first side wall extending in the X-axis direction, a second side wall extending in the Y-axis direction from the first side wall, and a second side wall extending in the Y-axis direction. The bottom wall structure is inclined downward, and it is arranged on the downstream side of the processing feed direction relative to the holding means, and receives the cutting water and cutting chips flowing from the downstream side after cutting. The chip outflow means is arranged in the cutting chip guide casing, and the flowing cutting chips are made to flow out to the cutting chip recovery box. The cutting chip recovery box receives the cutting water and cutting chips flowing from the cutting chip guide casing, and at least the bottom is formed. The cutting chips are collected in order for the cutting water to flow and capture the cutting chips. The cutting chip outflow means includes a water curtain extending near the first side wall and extending in the X-axis direction, and the flowing water from the water curtain is guided on the first part of the cutting chip guide casing. The rotating and swinging portion that reciprocates and swings in the Y-axis direction between the side wall side and the cutting chip recovery box side. When the flowing water from the water curtain swings toward the first side wall side of the cutting chip guide casing, Water puddles are formed in between. As the water curtain swings to the side of the cutting chip recovery box, the flowing water of the water curtain is used to push the cutting chips that have fallen to the bottom wall together with the water puddles, so that the cutting chips flow out to the cutting chip recovery box.

With this configuration, a water hole can be formed in the cutting chip guide casing by the flowing water from the water curtain, and the cutting chip can be washed away together with the water hole. Thereby, the cutting chips can be prevented from staying in the middle of the bottom plate of the cutting chip guide case, and can be well recovered to the cutting chip recovery box.

[Inventive effect]
According to the present invention, since there is a cutting chip outflow means for washing away the cutting chips together with the puddle, the cutting chips such as the end material can be recovered well.

Hereinafter, the cutting device according to this embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic perspective view of a cutting device according to the embodiment.

As shown in FIG. 1, the cutting device 1 is configured to intermittently cut the cutting blade 41 into the package substrate P on the first chuck table (holding means) 11 and the second chuck table (holding means) 12, thereby dividing it into Each component D. The package substrate P shown in FIG. 1 is an example of a workpiece, and is, for example, a CSP substrate or a QFN substrate. The package substrate P is divided into a plurality of regions by a predetermined cutting line L provided in a grid shape on the front surface thereof, and elements D are formed in the respective regions. The package substrate P has two element portions F formed of a plurality of elements D, and a remaining connecting member C is formed outside the element portion F. As described later, before the element portion F is divided into the element D, the remaining connecting member C is cut off in advance.

The cutting device 1 includes a base 2 and a gate-type pillar 3 standing on the upper portion of the base 2. In addition, the cutting device 1 includes a first chuck table 11 and a second chuck table 12 that hold the substrate P, and first processing feed means 13 and second processing feed means that are arranged side by side on the base 2 in the Y-axis direction. 14. A jig 16 having a plurality of suction openings corresponding to the respective components D of the package substrate P and a retracting groove (not shown) of the cutting blade 41 is mounted on the upper surfaces of the chuck tables 11 and 12.

The first processing feed means 13 includes a pair of guide rails 18 arranged parallel to the X-axis direction on the upper surface of the base 2 and a motor-driven X-axis table 19 slidably provided on the pair of guide rails 18. On the X-axis table 19, the first chuck table 11 is rotatably supported by the θ table 20. A nut portion (not shown) is formed on the back side of the X-axis table 19, and the ball screw 22 is screwed to the nut portion. A drive motor 23 is connected to one end of the ball screw 22. When the ball screw 22 is rotationally driven by the drive motor 23, the first chuck table 11 moves along the guide rail 18 in the X-axis direction (processing feed).

In addition, the second processing feed means 14 has the same configuration as the first processing feed means 13 except that the moving object is changed to the second chuck table 12 and moves the second chuck table 12 in the X-axis direction. (Processing feed). Therefore, the components of the second processing feed means 14 are labeled with the same reference numerals as those of the first processing feed means 13 and description thereof will be omitted.

The cutting device 1 further includes indexing feeding means 30 provided on the pillar 3, and the indexing feeding means 30 places a pair of cutting means 40 above each chuck table 11 and 12 in a Y-axis direction orthogonal to the X-axis direction Indexing feed, and lifting in the Z-axis direction.

The indexing feeding means 30 includes a pair of guide rails 31 provided on the front surface of the pillar 3 and parallel to the Y-axis direction, and a pair of Y-axis tables 32 driven by a motor slidably provided on the pair of slide rails 31. The indexing feeding means 30 includes a pair of guide rails 33 arranged parallel to the Z-axis direction on the front surface of each Y-axis table 32, and a Z-axis table 34 slidably provided on each of the guide rails 33. An L-shaped bracket 34 a is supported at a lower portion of each Z-axis table 34 to support the cutting means 40.

Nut portions (not shown) are formed on the back side of each Y-axis table 32, and a ball screw 35 is screwed to these nut portions. A drive motor 36 is connected to one end of the ball screw 35. The ball screw 35 is rotationally driven by the drive motor 36, and the Z-axis table 34 and the cutting means 40 are moved along the guide rail 31 in the Y-axis direction (index feed). Further, an elevating mechanism 37 is provided between the Y-axis table 32 and each Z-axis table 34 to raise and lower the cutting means 40 along the guide rail 33 in the Z-axis direction.

The cutting means 40 is provided with a cutting blade 41 at the tip of a main shaft (not shown) that rotates about the Y axis. The cutting blade 41 is a resin blade made of a circular resin by fixing diamond abrasive grains with a resin bonding agent. The blade cover 42 covers the periphery of the cutting blade 41, and the blade cover 42 is provided with a spray nozzle (cutting water supply means) 43 that sprays and supplies cutting water toward the cutting blade 41. The dicing means 40 rotates the dicing blade 41 at a high speed, and cuts and processes the package substrate P held by the chuck tables 11 and 12 while spraying cutting water from a plurality of spray nozzles 43 to the cutting portion. The cutting area is cooled by cutting water, and the cutting chips generated during cutting are washed away.

FIG. 2 is a schematic perspective view of a part of the cutting device. As shown in FIG. 2, the first chuck table 11 and the second chuck table 12 are arranged in an opening formed in a water tank 50 (not shown in FIG. 1). The opening is surrounded by a bottom portion 51 forming the upper surface of the water tank 50, a pair of side walls 52 and 53 and an end wall 54 protruding upward from the bottom portion 51. The side wall 52 and the side wall 53 are wall portions spaced apart in the Y-axis direction and extending in the X-axis direction. The end wall 54 is a wall portion located on one end side (upstream side) in the X-axis direction of the bottom portion 51 and the side walls 52 and 53 and extending in the Y-axis direction. A first moving plate 55 that moves in the X-axis direction with the first chuck table 11 and a second moving plate 56 that moves in the X-axis direction with the second chuck table 12 are provided in the opening portion. A bellows cover 57 is provided between the first moving plate 55 and the end wall 54, and a bellows cover 58 is provided between the second moving plate 56 and the end wall 54.

Each processing feed means 13 and 14 (refer to FIG. 1) that moves the first chuck table 11 and the second chuck table 12 in the X-axis direction are arranged in a tank 50, a first moving plate 55, and a second moving plate 56. , Snake belly cover 57, 58 and other waterproof spaces covered (not shown).

The cutting device 1 includes a first plate-shaped cover 59 and a second plate-shaped cover 60 and allows cutting water, cutting chips, and the like to flow to the processing feed direction (X-axis direction) of the first chuck table 11 and the second chuck table 12. Downstream side. Here, the downstream side in the processing feed direction (X-axis direction) refers to the side where the cutting water supplied to the cutting blade 41 during cutting is scattered as the cutting blade 41 rotates. In addition, the direction opposite to the downstream side is the upstream side.

Within the opening, the first plate-shaped cover 59 and the second plate-shaped cover 60 are provided on the downstream side of the first chuck table 11 and the second chuck table 12 in the X-axis direction, that is, the first moving plate 55 and the second movement The downstream side of the plate 56. The first plate-shaped cover 59 has a pair of inclined surfaces 61 that gradually decrease toward the center of the Y-axis direction, and a pair of inclined surfaces 61 that gradually decrease from the upstream side to the downstream side between the pair of inclined surfaces 61 in the Y-axis direction. Centric inclined surface 62. Like the first plate-shaped cover 59, the second plate-shaped cover 60 has a pair of inclined surfaces 63 that gradually decrease toward the center of the Y-axis direction, and is located between the pair of inclined surfaces 63 in the Y-axis direction and The central inclined surface 64 that gradually decreases from the upstream side to the downstream side.

The peripheral edge of the first moving plate 55 is provided with a standing wall portion 65 protruding upward, and the peripheral edge of the second moving plate 56 is provided with a standing wall portion 66 protruding upward. The standing wall portion 65 has an opening communicating to the central inclined surface 62 side of the first plate-shaped cover 59, and the standing wall portion 66 has an opening communicating to the central inclined surface 64 side of the second plate-shaped cover 60. When the package substrate P on the first chuck table 11 is cut, the cutting water containing the cutting chips flows from the first moving plate 55 to the first plate-shaped cover 59. When the package substrate P on the second chuck table 12 is cut, the cutting water containing the cutting chips flows from the second moving plate 56 to the second plate-shaped cover 60.

Each of the first plate-shaped cover 59 and the second plate-shaped cover 60 has a sliding portion (not shown) that can slide on a rail (not shown) that is laid on the bottom 51 of the water tank 50 on the inside. The first plate-shaped cover 59 and the second plate-shaped cover 60 are guided to move in the X-axis direction by the rail and the sliding portion. An end portion on the upstream side of the first plate-shaped cover 59 is connected to the first moving plate 55, and the first plate-shaped cover 59 moves in the X-axis direction together with the first chuck table 11 and the first moving plate 55. An end portion on the upstream side of the second plate-shaped cover 60 is connected to the second moving plate 56, and the second plate-shaped cover 60 moves in the X-axis direction together with the second chuck table 12 and the second moving plate 56. The downstream end portions of the first plate-shaped cover 59 and the second plate-shaped cover 60 are free ends that are not fixed to the water tank 50 and the like.

The first plate-shaped cover 59 and the second plate-shaped cover 60 pass the end material (cutting chips) or cutting water flowing from the upstream first moving plate 55 or the second moving plate 56 through the inclined surface 61 and the central inclined surface 62, respectively The inclined surface 63 and the central inclined surface 64 are guided to the downstream side and flow out from the free end.

The cutting device 1 includes a chip guide case 70 adjacent to the water tank 50 and a chip guide case 70 adjacent to the water tank 50 on the downstream side in the X-axis direction from the free end of the first plate-shaped cover 59 or the second plate-shaped cover 60. The cutting waste recovery box 71 that can be moved up and down at a position where the lower end of the cutting machine is connected.

The cutting chip guide case 70 includes a first side wall 73, a second side wall 74, and a bottom wall (chip cutting guide) 75. The first side wall 73 is provided on the opposite side of the cutting waste recovery box 71 in the Y-axis direction, and extends and stands on the downstream side in the X-axis direction from the water tank 50 side. The second side wall 74 extends from the first side wall 73 toward the cutting waste collection box 71 and extends in the Y-axis direction. The second side wall 74 is provided at both ends in the X-axis direction of the first side wall 73 (see FIG. 3). The bottom wall 75 is provided on the lower end sides of the first side wall 73 and the second side wall 74 and forms a slope portion that changes the height in the Z-axis direction along the Y-axis direction (see FIG. 4). The bottom wall 75 is inclined so as to gradually lower toward the cutting waste recovery box 71 in the Y-axis direction.

The cutting chip guide case 70 is disposed on the downstream side of the processing feed direction of the first chuck table 11 and the second chuck table 12 holding the package substrate P, so that after the package substrate P is cut, it flows to the downstream cutting side. Water and cuttings are received from above into the interior. Then, by the inclination of the bottom wall 75, the cutting water and cutting chips received into the cutting chip guide case 70 are guided to the cutting chip recovery box 71.

The cutting waste collection box 71 is formed in an open-topped container shape, and can receive cutting water and cutting waste guided into the cutting waste guide case 70. A mesh portion (none of which is not shown) is provided at the bottom of the cutting waste recovery box 71, and is formed to capture and recover an end material that cannot be caught by the mesh portion or a relatively large cutting waste. The cutting water that flows through the bottom of the cutting waste collection box 71 and passes through the mesh portion is discharged to the outside.

Next, referring back to FIG. 1, an example of the operation of the cutting device 1 will be described. The package substrate P is transferred to the first chuck table 11 and the second chuck table 12, respectively. In the following, when the first chuck table 11 and the second chuck table 12 operate in the same manner, the first chuck table 11 side will be described.

The jig 16 mounted on the first chuck table 11 sucks and holds the transported package substrate P. Next, the cutting blade 41 of the cutting means 40 is lowered to contact the package substrate P while rotating, and the first chuck table 11 is moved downstream in the X-axis direction. The package substrate P first cuts a boundary between the two element portions F and the remaining connecting members C by the rotating cutting blade 41.

Thereafter, the cutting blade 41 is indexed in the Y-axis direction by the driving of the indexing feeding means 30, and the boundary between the other two element portions F and the remaining connection member C is similarly cut. Next, after the first chuck table 11 is rotated 90 degrees, the boundary between the two element portions F and the remaining connecting member C is cut out in the same manner, and the remaining connecting member C is removed. After that, cutting is performed along all the planned cutting lines L toward the X-axis direction. After the cutting, the first chuck table 11 is rotated 90 degrees so that the planned cutting line L in the Y-axis direction is oriented in the X-axis direction, and the same operations as described above are repeated. Thereby, cutting is performed along all the planned cutting lines L toward the X-axis direction of the package substrate P, and the element portion F is divided into individual elements D.

During the cutting of the package substrate P, the cutting means 40 supplies cutting water to the cutting blade 41 at any time through the spray nozzle 43. The supplied cutting water and the cutting chips contained therein are scattered to the processing feed direction (X-axis direction) downstream side as the cutting blade 41 rotates, and fall to each of the moving plates 55 and 56 or the plate-shaped covers 59 and 60. Then, it is guided by the first plate-shaped cover 59 or the second plate-shaped cover 60 to the downstream side in the X-axis direction, and flows from the free end of the first plate-shaped cover 59 or the second plate-shaped cover 60 to the cutting chip guide. Case 70 side.

The cutting chips flowing out of the cutting chip guide case 70 include a bonding material such as a cutting chip or a bonding material of the package substrate P, abrasive grains falling off the grindstone, and a remaining connecting member C serving as an end material. As for the cutting chips, the remaining connecting member C serving as an end material may have a very large size and weight (for example, several cm in size), and the reason is that the cutting wall guides the bottom wall 75 of the housing 70 to be inclined by the cutting chips. It is also difficult to flow and cause accumulation. Therefore, the cutting device 1 is provided with the cutting chip outflow means 90 (refer FIG. 2) in the cutting chip guide case 70, and discharges cutting chips reliably. Hereinafter, the cutting chip outflow means 90 will be described.

As shown in FIG. 2, the cutting chip outflow means 90 is disposed inside the cutting chip guide case 70, that is, the position where the flowing cutting chips fall from the first plate-shaped cover 59 and the second plate-shaped cover 60.

FIG. 3 is a schematic plan view of the cutting chip outflow means, and FIG. 4 is a partial vertical cross-sectional view of FIG. 3. As shown in FIGS. 3 and 4, the cutting chip outflow device 90 includes a cylindrical water curtain (water curtain forming portion) 91 extending in the X-axis direction, and a rotary swing portion 92 that rotates the water curtain 91.

The water curtain 91 is provided to connect the second side walls 74 (not shown in FIG. 4) of the cutting chip guide case 70, and is arranged near the first side wall 73 in the cutting chip guide case 70. The water curtain 91 is supplied with water for flowing cutting chips from a supply source. A plurality of ejection outlets 91a are formed at a predetermined interval on the lower surface side of the water curtain 91, and water is ejected from each of the ejection outlets 91a, and the flowing water under the water curtain 91 is formed into a curtain shape extending in the X-axis direction.

The rotation swing portion 92 is provided on at least one end side of the water curtain 91. The rotary swing portion 92 includes a drive motor and the like, and is configured to enable the water curtain 91 to rotate around an axis so as to reciprocate within a predetermined angle range. With this rotation, the curtain-shaped flowing water from the water curtain 91 reciprocates and swings in the Y-axis direction, and as shown by the dotted arrow in FIG. Between 71 sides, flowing water moves back and forth in the Y-axis direction.

Next, with reference to FIG. 5, a description will be given of a method for causing the cutting chips to flow out by the cutting chip outflowing means 90. 5A to 5D are operation manual diagrams of cutting chip outflow means.

Here, the flowing water from the water curtain 91 that reciprocates will be described from a state where it is ejected at an angle shown in FIG. 5A and is moved toward the first side wall 73 side. In the state of FIG. 5A, the flowing water from the water curtain 91 passes directly below the water curtain 91 and swings toward the first side wall 73 side. The sprayed water is sandwiched between the flowing water and the first side wall 73 at this time, and a puddle W is formed between them.

In this state, the flowing water from the water curtain 91 further advances to the first side wall 73 and oscillates until the first side wall 73 is directly ejected. With the oscillating flowing water, the puddle W is lifted along the first side wall 73. Then, when it is lifted to a predetermined height, as shown in FIG. 5B, the puddle W penetrates the flowing water from the water curtain 91 from above and falls downward by its own weight. At the timing of the fall, the swing direction of the water curtain 91 is switched, and the flowing water from the water curtain 91 is moved to the cutting waste recovery box 71 side.

In this way, as the swing direction of the water curtain 91 is switched, as shown in FIG. 5C, the puddle W on the bottom wall 75 is pushed toward the cutting waste collection box 71 side by the moving water of the water curtain 91. Then, as shown in FIG. 5D, as the puddle W is pushed, the cutting chips CD on the bottom wall 75 are also pushed together with the puddle W and flow out to the cutting chip recovery box 71. Then, when the flowing water of the water curtain 91 reaches the front of the cutting waste collection box 71, the swing direction of the water curtain 91 is cut to the first side wall 73 side.

In this way, as shown in FIGS. 5A to 5D, the flowing water from the water curtain 91 moves back and forth, so that the cutting chips CD can be repeatedly pushed out by the water hole W. Furthermore, the distance LG (refer to FIG. 5A) in the Y-axis direction between the first side wall 73 and the water curtain 91 and the flow rate of the flowing water from the water curtain 91 are set in advance so that the above-mentioned puddle W can be formed and pushed out.

According to this embodiment, even if, for example, the size and weight of the cutting chips CD are increased, or the number is increased, it is possible to use the cutting chip outflow means 90 to form a puddle W and flush the cutting chips CD with the puddle W. Thereby, when the cutting chips CD flow on the inclined bottom wall 75, it is possible to prevent the cutting chips CD from staying in the middle and to be recovered in the cutting chip recovery box 71 satisfactorily, and to prevent the cutting chips CD from being accumulated on the bottom wall 75.

Although the cutting device 1 of the above embodiment uses the package substrate P as a cutting target, there is no limitation on the material of the processing workpiece or the types of components formed on the workpiece. For example, in addition to the package substrate, various workpieces such as a semiconductor element wafer, an optical element wafer, a semiconductor substrate, an inorganic material substrate, an oxide wafer, a green ceramic substrate, and a piezoelectric substrate can be used. The semiconductor element wafer may be a silicon wafer or a compound semiconductor wafer after the element is formed. The optical element wafer may be a sapphire wafer or a silicon carbide wafer after the element is formed. In addition, as the semiconductor substrate, silicon or gallium arsenide can be used, and as the inorganic material substrate, sapphire, ceramic, and glass can be used. Further, as the oxide wafer, lithium tantalate or lithium niobate can be used after the element is formed or before the element is formed.

In the above-mentioned embodiment, although the cutting chip outflow means 90 is provided with one main body, it may be provided for each of the chuck tables 11 and 12 and the like, and a plurality of them may be arranged in parallel in the Y-axis direction. In this case, the plurality of water curtains 91 can be synchronized to rotate and swing in the same direction. In addition, in the Y-axis direction, which is the flow direction of the cutting chips CD in the cutting chip guide housing 70, the timing of the swing can be set so that the puddle W formed by the water curtain 91 on the upstream side reaches the center of the bottom wall 75, and then uses The flowing water of the water curtain 91 on the downstream side is washed away.

In addition, although the cutting device 1 is configured to have two cutting means 40, the cutting means 40 may be provided with one or three or more.

In addition, although the embodiment of the present invention has been described, the above-mentioned embodiment and modified examples may be combined in whole or in part as another embodiment of the present invention.

In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and various changes, substitutions, and modifications can be made as long as they do not deviate from the gist of the technical idea of the present invention. Further, by means of technological progress or another technique derived, as long as the technical idea of the present invention can be realized by other methods, this method can be used for implementation. Therefore, the scope of patent application covers all embodiments that can be included within the scope of the technical idea of the present invention.

[Industrial availability]
As described above, the present invention is useful for a cutting device that receives cutting water and cutting chips and recovers them.

1‧‧‧ cutting device

11‧‧‧The first chuck table (holding means)

12‧‧‧The second chuck table (holding means)

13‧‧‧ the first processing feed means

14‧‧‧ 2nd processing feed means

30‧‧‧ indexing feeding means

40‧‧‧ cutting means

41‧‧‧ cutting blade

43‧‧‧ Nozzle (cutting water supply means)

59‧‧‧The first plate cover

60‧‧‧The second plate cover

70‧‧‧Cutting guide housing

71‧‧‧Cutting Chip Recovery Box

73‧‧‧ 1st side wall

74‧‧‧ 2nd side wall

75‧‧‧ bottom wall

80‧‧‧ Cutting outflow means

91‧‧‧Water curtain

92‧‧‧Rotating swing section

CD‧‧‧Cutting Chips

P‧‧‧Packaging substrate (workpiece)

W‧‧‧ puddle

FIG. 1 is a schematic perspective view of a cutting device according to the embodiment.

FIG. 2 is a schematic perspective view of a part of the cutting device.

Fig. 3 is a schematic plan view of a cutting chip outflow means.

FIG. 4 is a partial longitudinal sectional view of FIG. 3.

5A to 5D of FIG. 5 are operation explanatory diagrams of the cutting chip outflow means.

Claims (1)

A cutting device having: Holding means A cutting means provided with a cutting blade for cutting a workpiece held by the holding means; A cutting water supply means for supplying cutting water to the cutting blade; A processing feed means for processing the holding means in the X-axis direction; and Indexing feeding means, which feeds the cutting means in the Y-axis direction orthogonal to the X-axis direction, A side where the cutting water supplied to the cutting blade scatters as the cutting blade rotates is taken as a downstream side in the processing feed direction, and an opposite side is taken as an upstream side in the processing feed direction, The cutting device includes a cutting chip recovery box, a cutting chip guide case, and a cutting chip outflow means. The cutting chip guide case includes a first side wall extending in the X-axis direction, and cutting from the first side wall to the cutting. The second side wall of the chip recovery box extending in the Y-axis direction and the bottom wall inclined toward the chip recovery box are configured to be disposed downstream of the processing feed direction with respect to the holding means. And after receiving the cutting water and cutting chips flowing down to the downstream side, The cutting chip outflow means is arranged in the cutting chip guide casing, and the flowing cutting chips are made to flow out to the cutting chip recovery box by using flowing water. The cutting chip recovery box receives cutting water and cutting chips flowing in from the cutting chip guide casing, and at least the bottom part is formed so that the cutting water flows and captures the cutting chips to recover the cutting chips. The cutting chip outflow means includes a water curtain extending near the first side wall and extending in the X-axis direction, and flowing water from the water curtain on the first side wall side of the cutting chip guide casing and the cutting chip recovery box. It is constituted by a rotating and swinging part that reciprocates and swings between the sides in the Y-axis direction, When the flowing water from the water curtain swings to the first side wall side of the cutting chip guide casing, a water puddle is formed between the first wall and the water curtain, and the water is used as the water screen swings toward the cutting chip recovery box side. The flowing water of the curtain pushes the cutting chips falling to the bottom wall together with the puddles, thereby allowing the cutting chips to flow out to the cutting chip recovery box.