KR102658945B1 - Cutting apparatus - Google Patents

Abstract

(Problem) To provide a cutting device that can efficiently recover cutting chips such as scrap materials.
(Solution) A cutting water guide casing (70) that receives cutting water and cutting chips that flow after cutting from the chuck tables (11, 12) that hold the package substrate (P), and a cutting water that flows in from the cutting chip guide casing. and a cutting waste recovery box 71 that receives the cutting waste and recovers the cutting waste, and a cutting waste outflow means ( 90) is provided. The cutting waste outflow means includes a water curtain 91 and a rotation swing portion 92 that rotates the water from the water curtain by reciprocating in the cutting waste guide casing in the Y-axis direction, forming a water flow W. Then, the cutting waste (CD) is pushed along with the water flow by the water curtain, causing the cutting waste to flow out into the cutting waste recovery box.

Description

Cutting Apparatus {CUTTING APPARATUS}

The present invention, in particular, relates to a cutting device having a function of processing scraps generated when cutting a workpiece.

For example, a package substrate called a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded Package) substrate is cut with a cutting device to manufacture individual semiconductor device packages. As disclosed in Patent Document 1, a cutting device for cutting a package substrate along a cutting street includes a chuck table for holding a workpiece (package substrate) and cutting means for cutting the workpiece. The cutting means is provided with a cutting water injection means for spraying cutting water onto the cutting blade and the cutting blade. During cutting, the cutting blade and the package substrate are cooled by the injection of cutting water. When the package substrate is set on the chuck table, the chuck table reciprocates to perform cutting of the package substrate.

At this time, due to the rotation direction of the cutting blade, cutting chips such as scrap materials of the package substrate and cutting water scatter. In the case of a normal down cut, the cutting blade rotates in the direction of movement of the chuck table, so cutting chips and cutting water are scattered in the direction of movement of the chuck table.

In the cutting devices described in Patent Documents 1 and 2, a scrap material processing device is provided to treat scattered scrap materials and cutting water resulting from cutting of a package substrate. In this scrap material processing device, scattered scrap materials and cutting water are caught by a channel-shaped portion formed near the chuck table and flowed in the direction of movement of the chuck table, and the scrap materials and cutting water are dropped onto an endless belt or inclined guide plate. I order it. The scrap material that has fallen on the endless belt or the inclined guide plate is conveyed by the movement of the endless belt or the inclination of the inclined guide plate, and falls into the scrap material collection container to be recovered.

Japanese Patent Publication No. 2002-239888 Japanese Patent Publication No. 2015-5544

However, in the scrap material processing device described above, there is a problem in that the scrap material stays halfway on the endless belt or the inclined guide plate, and the scrap material is deposited at that point.

The present invention was made in view of such problems, and one of its purposes is to provide a cutting device that can efficiently recover cutting chips such as scrap materials.

A cutting device of one aspect of the present invention includes a holding means for holding a workpiece, a cutting means equipped with a cutting blade for cutting the workpiece held by the holding means, and a cutting water supply means for supplying cutting water to the cutting blade. and a machining feed means for machining and feeding the holding means in the A cutting device in which the side that scatters with rotation is the downstream side of the machining feed direction, and the opposite side is the upstream side of the machining feed direction, comprising: a cutting waste recovery box; a first side wall formed by stretching in the X-axis direction; 1. It is composed of a second side wall formed by stretching from the side wall to the cutting waste recovery box in the Y-axis direction, and a bottom wall inclined to be lowered toward the cutting waste recovery box, and is disposed on the downstream side in the processing transfer direction with respect to the holding means. and a cutting waste guide casing that receives cutting water and cutting chips flowing downstream after cutting, and a cutting waste outflow means disposed within the cutting waste guide casing and allowing the flowing cutting chips to flow out into the cutting waste recovery box. The cutting waste recovery box is formed to receive cutting water and cutting chips flowing in from the cutting waste guide casing, and at least the bottom part is formed to let cutting water flow and catch cutting chips to collect cutting chips, and the cutting waste outflow means is provided. , a water curtain stretched in the It is composed of an eastern section, and when the water flowing from the water curtain swings toward the first side wall of the cutting waste guide casing, a water stream is formed between the first side wall, and as the water curtain swings toward the cutting chip recovery box side, the water flows. It is characterized in that the cutting chips are discharged into the cutting waste recovery box by pushing the cutting chips that have fallen on the floor wall together with the water flow by the flowing water of the curtain.

According to this configuration, a water stream is formed in the cutting waste guide casing by the flowing water from the water curtain, and the cutting waste can be made to flow along with the water flow. In this way, cutting chips can be prevented from remaining in the middle of the bottom plate in the cutting chip guide casing, and can be properly recovered in the cutting chip collection box.

According to the present invention, since there is a cutting waste outflow means that causes the cutting waste to flow along with the water flow, cutting waste such as scrap materials can be recovered satisfactorily.

1 is a schematic perspective view of a cutting device of an embodiment.
Figure 2 is a partial schematic perspective view of a cutting device.
Figure 3 is a schematic plan view of the cutting chip extraction means.
Figure 4 is a partial longitudinal cross-sectional view of Figure 3.
5A to 5D are diagrams explaining the operation of the cutting debris discharge means.

Hereinafter, with reference to the accompanying drawings, a cutting device according to this embodiment will be described. 1 is a schematic perspective view of a cutting device of an embodiment.

As shown in Fig. 1, the cutting device 1 applies a cutting blade 41 to the package substrate P on the first chuck table (holding means) 11 and the second chuck table (holding means) 12. It is configured to divide into individual devices (D) by intermittently cutting into them. The package substrate P shown in FIG. 1 is an example of a workpiece, for example, a CSP substrate or a QFN substrate. The package substrate P is divided into a plurality of regions by dividing the cutting line L formed in a lattice shape on its surface, and a device D is formed in each region. Two device portions (F) in which a plurality of devices (D) are formed are formed on the package substrate (P), and a surplus connecting member (C) is formed outside the device portion (F). As will be described later, before dividing the device portion F into individual devices D, the excess connecting member C is removed in advance.

The cutting device 1 has a base 2 and a door-shaped column 3 standing upright on the upper part of the base 2. In addition, the cutting device 1 includes a first chuck table 11 and a second chuck table 12 that hold the package substrate P, and first processing transfer means formed side by side in the Y-axis direction on the base 2. (13) and second processing transfer means (14). On the upper surface of each chuck table 11, 12, a jig 16 has a plurality of relief grooves (not shown) through which the suction ports and cutting blades 41 pass for each device D of the package substrate P. is equipped.

The first processing transfer means (13) includes a pair of guide rails (18) arranged on the upper surface of the base (2) parallel to the It has an X-axis table (19). On the X-axis table 19, the first chuck table 11 is rotatably supported by the θ table 20. A nut portion (not shown) is formed on the rear side of the X-axis table 19, and a ball screw 22 is screwed to this nut portion. A drive motor 23 is connected to one end of the ball screw 22. The ball screw 22 is rotationally driven by the drive motor 23, and the first chuck table 11 moves (processing transfer) in the X-axis direction along the guide rail 18.

In addition, the second machining transfer means 14 also has the same configuration as the first machining transfer means 13 except that the object to be moved is changed to the second chuck table 12. ) moves in the X-axis direction (processing feed). Therefore, each component of the second processing transfer means 14 is given the same reference numeral as that of the first processing transfer means 13, and description thereof is omitted.

The cutting device 1 is further provided with a cutting feed means 30 formed on the column 3, and the output feeding means 30 includes a pair of cutting means 40 above each of the chuck tables 11 and 12. ) is calculated and transported in the Y-axis direction, which is perpendicular to the X-axis direction, and is raised and lowered in the Z-axis direction.

The output transfer means 30 includes a pair of guide rails 31 formed on the front of the column 3 and parallel to the Y-axis direction, and slideably installed on the pair of guide rails 31. It has a pair of motor-driven Y-axis tables (32). In addition, the output transfer means 30 includes a pair of guide rails 33 parallel to the Z-axis direction disposed on the front of each Y-axis table 32, and a Z slideably installed on each guide rail 33. It has an axis table (34). At the lower part of each Z-axis table 34, the cutting means 40 is supported via an L-shaped bracket 34a.

Nut portions (not shown) are formed on the rear side of each Y-axis table 32, and ball screws 35 are screwed to these nut portions. A drive motor 36 is connected to one end of the ball screw 35. The ball screw 35 is driven to rotate by the drive motor 36, and the Z-axis table 34 and the cutting means 40 move (output feed) in the Y-axis direction along the guide rail 31. In addition, between the Y-axis table 32 and each Z-axis table 34, a lifting means 37 is disposed to raise and lower the cutting means 40 in the Z-axis direction along the guide rail 33.

The cutting means 40 has a cutting blade 41 mounted on the tip of a spindle (not shown) rotating around the Y axis. The cutting blade 41 is composed of a resin blade formed by hardening diamond abrasive grains with a resin bond and forming a circular shape. The cutting blade 41 is surrounded by a blade cover 42, and the blade cover 42 is equipped with a spray nozzle (cutting water supply means) 43 that sprays and supplies cutting water toward the cutting blade 41. It is formed. The cutting means 40 rotates the cutting blade 41 at high speed and sprays cutting water onto the cutting portion from the plurality of spray nozzles 43 while cutting the package substrate P held on each of the chuck tables 11 and 12. Cut and process. The cutting water cools the cutting point and washes away cutting debris generated during cutting.

Figure 2 is a partial schematic perspective view of the cutting device. As shown in Fig. 2, the first chuck table 11 and the second chuck table 12 are arranged within an opening formed on the water case 50 (not shown in Fig. 1). The opening is formed by a bottom 51 that forms the upper surface of the water case 50, a pair of side walls 52, 53, and an end wall 54 that protrude upward from the bottom 51. surrounded. The side walls 52 and 53 are wall portions spaced apart in the Y-axis direction and extending in the X-axis direction. The end wall 54 is a wall portion located on one end (upstream side) of the bottom portion 51 and the side walls 52 and 53 in the X-axis direction and extending in the Y-axis direction. Within the opening, a first moving plate 55 moves in the X-axis direction together with the first chuck table 11, and a second moving plate 56 moves in the X-axis direction together with the second chuck table 12. This is formed. A bellows cover 57 is formed between the first moving plate 55 and the end wall 54, and a bellows cover 58 is formed between the second moving plate 56 and the end wall 54.

Each processing transfer means 13, 14 (see FIG. 1) for moving the first chuck table 11 and the second chuck table 12 in the X-axis direction includes a water case 50 and a first moving plate 55. ), the second moving plate 56, the bellows covers 57, 58, etc., are disposed in a waterproof space (not shown).

The cutting device 1 includes a first plate-shaped cover 59 that allows cutting water, cutting chips, etc. to flow out to the downstream side of the machining feed direction (X-axis direction) of the first chuck table 11 and the second chuck table 12. It is provided with a second plate-shaped cover (60). Here, the downstream side of the machining feed direction (X-axis direction) refers to the side where the cutting water supplied to the cutting blade 41 during cutting scatters as the cutting blade 41 rotates. Additionally, the direction opposite to the downstream side is the upstream side.

Within the opening, the first plate-shaped cover 59 and the second plate-shaped cover 60 are on the downstream side of the first chuck table 11 and the second chuck table 12 in the X-axis direction, and have a first moving plate ( 55) and is formed on the downstream side of the second moving plate 56. The first plate-shaped cover 59 is located between a pair of inclined surfaces 61 that gradually lower toward the center of the Y-axis direction and the pair of inclined surfaces 61 in the Y-axis direction, and extends from the upstream side to the downstream side. It has a central slope 62 that gradually descends. Like the first plate-shaped cover 59, the second plate-shaped cover 60 has a pair of inclined surfaces 63 that gradually lower toward the center of the Y-axis direction, and a pair of inclined surfaces 63 in the Y-axis direction. It has a central slope 64 that is located in between and gradually decreases from the upstream side to the downstream side.

An upwardly protruding standing wall portion 65 is formed on the peripheral edge of the first moving plate 55, and an upwardly protruding standing wall portion 66 is formed on the peripheral edge of the second moving plate 56. The standing wall portion 65 has an opening communicating toward the central inclined surface 62 of the first plate-shaped cover 59, and the standing wall portion 66 has an opening communicating toward the central inclined surface 64 of the second plate-shaped cover 60. I have it. When cutting the package substrate P on the first chuck table 11, cutting water containing cutting chips flows from the first moving plate 55 onto the first plate-shaped cover 59. When cutting the package substrate P on the second chuck table 12, cutting water containing cutting chips flows from the second moving plate 56 onto the second plate-shaped cover 60.

Inside each of the first plate-shaped cover 59 and the second plate-shaped cover 60, a sliding portion capable of sliding relative to a rail (not shown) provided on the bottom 51 of the water case 50. (not shown) is formed. The first plate-shaped cover 59 and the second plate-shaped cover 60 are guided to be movable in the X-axis direction by the rail and the sliding portion. The upstream end of the first plate-shaped cover 59 is connected to the first moving plate 55, and the first plate-shaped cover 59 is connected to the first chuck table 11 and the first moving plate 55. ) and moves in the X-axis direction. The upstream end of the second plate-shaped cover 60 is connected to the second moving plate 56, and the second plate-shaped cover 60 is positioned together with the second chuck table 12 and the second moving plate 56. moves in the axial direction. The downstream ends of each of the first plate-shaped cover 59 and the second plate-shaped cover 60 are free ends that are not fixed to the water case 50 or the like.

The first plate-shaped cover 59 and the second plate-shaped cover 60 each direct scrap material (cutting chips) or cutting water flowing in from the first moving plate 55 or the second moving plate 56 on the upstream side to the inclined surface. It is guided downstream through (61) and the central slope (62), slope (63) and central slope (64) and discharged from the free end.

The cutting device 1 includes a cutting waste guide casing 70 adjacent to the water case 50 on the downstream side of the free end of the first plate-shaped cover 59 or the second plate-shaped cover 60 in the X-axis direction. , a cutting waste recovery box 71 that can move up and down in a continuous position is provided at the lower end of the cutting waste guide casing 70.

The cutting chip guide casing 70 is provided with a first side wall 73, a second side wall 74, and a bottom wall (cutting chip guide plate) 75. The first side wall 73 is formed on the side opposite to the cutting waste collection box 71 in the Y-axis direction, and is formed by extending from the water case 50 side toward the downstream side in the X-axis direction. The second side wall 74 is formed by stretching from the first side wall 73 to the cutting waste collection box 71 in the Y-axis direction. The second side wall 74 is formed on both ends of the first side wall 73 in the X-axis direction (see Fig. 3). The bottom wall 75 is formed on the lower end side of the first side wall 73 and the second side wall 74, and is formed as a slope portion that changes the height in the Z-axis direction along the Y-axis direction (see Fig. 4). . The bottom wall 75 is inclined so as to be sequentially lowered in the Y-axis direction toward the chip collection box.

Since the cutting waste guide casing 70 is disposed and formed on the downstream side in the machining feed direction of the first chuck table 11 and the second chuck table 12 that hold the package substrate P, the cutting of the package substrate P Cutting water and cutting chips that later flow downstream are received inside from above. Then, the cutting water and cutting chips received in the cutting waste guide casing 70 are guided toward the cutting waste recovery box 71 by the inclination of the bottom wall 75.

The cutting waste collection box 71 is formed as a container with an open top that can receive cutting water and cutting waste that are guided and introduced into the cutting waste guide casing 70. A mesh part (not shown) is formed at the bottom of the cutting waste recovery box 71, so that stuck pieces or relatively large cutting chips can be caught and recovered without passing through the mesh part. The cutting water that flows through the bottom of the cutting waste recovery box 71 and passes through the mesh portion is discharged to the outside.

Next, returning to FIG. 1, an example of operation of the cutting device 1 will be described. The package substrate P is transported to the first chuck table 11 and the second chuck table 12, respectively. In addition, below, the case where the first chuck table 11 and the second chuck table 12 operate in the same manner will be described on the first chuck table 11 side.

In the jig 16 placed on the first chuck table 11, the transported package substrate P is held by suction. Subsequently, the cutting blade 41 of the cutting means 40 is rotated and lowered until it contacts the package substrate P, and the first chuck table 11 is moved downstream in the X-axis direction. In the package substrate P, first, two boundaries between the device portion F and the excess connecting member C are cut by the rotating cutting blade 41.

After that, the cutting blade 41 is driven in the Y-axis direction by driving the cutting conveying means 30, and the other two boundaries between the device portion F and the excess connecting member C are similarly cut. Next, after rotating the first chuck table 11 by 90 degrees, the two boundaries of the device D and the excess connecting member C are similarly cut, and the excess connecting member C is removed. After that, cutting is performed along all the intended cutting lines (L) facing the X-axis direction. After this cutting, the first chuck table 11 is rotated by 90 degrees, so that the cutting line L, which was facing the Y-axis direction, is turned towards the X-axis direction, and the same operation as above is repeated. As a result, the package substrate P is cut along all the cutting lines L facing the X-axis direction, and the device portion F is divided into individual devices D.

During cutting of the package substrate P, the cutting means 40 always supplies cutting water toward the cutting blade 41 through the spray nozzle 43. The supplied cutting water and the cutting chips contained therein are scattered downstream in the machining feed direction (X-axis direction) as the cutting blade 41 rotates, and each moving plate 55, 56 and each plate-shaped cover 59 , 60) falls. Then, it is guided to the first plate-shaped cover 59 or the second plate-shaped cover 60 and flows downstream in the X-axis direction, and the cutting chips are guided from the free end of the first plate-shaped cover 59 or the second plate-shaped cover 60 It flows into the casing (70).

The cutting chips flowing out into the cutting waste guide casing 70 include cutting chips of the package substrate (P), bonding materials such as bond materials, abrasive grains dropped from the grinding wheel, and excess connecting members (C) that serve as single materials. do. In the case of cutting chips, the size and weight of the surplus connecting member C, which becomes the single material, becomes very large (for example, several cm in size), etc., due to the inclination of the bottom wall 75 of the cutting waste guide casing 70. In some cases, it becomes difficult to flow and accumulates. Therefore, the cutting device 1 is provided with cutting waste discharge means 90 (see Fig. 2) for reliably discharging cutting waste from the cutting waste guide casing 70. Hereinafter, this cutting waste discharge means 90 will be described.

As shown in FIG. 2, the cutting waste outflow means 90 is inside the cutting waste guiding casing 70, and is a position where the cutting chips flowing from the first plate-shaped cover 59 and the second plate-shaped cover 60 fall. It is arranged and formed in .

FIG. 3 is a schematic plan view of a cutting chip outflow means, and FIG. 4 is a view of a part of FIG. 3 viewed in longitudinal section. As shown in FIGS. 3 and 4, the cutting waste outflow means 90 rotates the water curtain 91 and a normal water curtain (water curtain forming portion) 91 extending in the X-axis direction. ) and is provided with a rotational swing part (92).

The water curtain 91 is formed to connect the second side wall 74 (not shown in FIG. 4) of the cutting waste guiding casing 70, and also the first side wall 73 in the cutting waste guiding casing 70. ) is arranged in the vicinity of . The water curtain 91 is supplied with water for flowing out cutting chips (CD) from a supply source (not shown). On the lower surface of the water curtain 91, a plurality of jets 91a are formed at predetermined intervals, and water is ejected from each jet 91a, so that the flowing water below the water curtain 91 forms a curtain shape extending in the X-axis direction. is formed by

The rotation swing portion 92 is formed on at least one end side of the water curtain 91. The rotation swing unit 92 includes a drive motor, etc., and is configured to be rotatable so as to reciprocate the water curtain 91 around the axis in a predetermined angle range. Due to this rotation, the flowing water on the curtain from the water curtain 91 rotates and swings in the Y-axis direction, and as indicated by the dotted arrow in FIG. 4, the first side wall 73 of the cutting waste guide casing 70 ) side and the cutting waste recovery box (71) side, the running water moves back and forth in the Y-axis direction.

Next, the method of making cutting chips flow out by the cutting waste outflow means 90 will be described with reference to FIG. 5 . 5A to 5D are diagrams explaining the operation of the cutting debris discharge means.

Here, the description begins with the state in which the flowing water from the reciprocating water curtain 91 moves toward the first side wall 73 while spouting at an angle shown in FIG. 5A. In the state shown in FIG. 5A, the flowing water from the water curtain 91 passes directly under the water curtain 91 and then swings toward the first side wall 73. At this time, the ejected water is caught between the ejecting flowing water and the first side wall 73, and a water flow W is formed between them.

From this state, the flowing water from the water curtain 91 is further advanced toward the first side wall 73 and is oscillated until it is ejected directly onto the first side wall 73, and the water flow W is controlled by the oscillated running water. 1 is lifted along the side wall (73). Then, when lifted to a predetermined height, as shown in FIG. 5B, the water stream W passes through the flowing water from the water curtain 91 from above to below due to its own weight and falls. At the timing of this fall, the direction of rotation of the water curtain 91 changes, causing the flowing water from the water curtain 91 to move toward the cutting waste recovery box 71.

As the direction of movement of the water curtain 91 is completely changed in this way, as shown in FIG. 5C, the water flow W on the bottom wall 75 is caused by the movement of the water flow of the water curtain 91 to the cutting waste recovery box ( 71) is pushed to the side. And, as shown in FIG. 5D, as the water flow W is pushed, the cutting chips CD on the bottom wall 75 are also pushed along with the water flow W, and can flow out into the cutting waste recovery box 71. there is. Afterwards, when the flowing water of the water curtain 91 reaches right in front of the cutting waste recovery box 71, the swing direction of the water curtain 91 changes to the first side wall 73 side.

In this way, the flowing water from the water curtain 91 shown in FIGS. 5A to 5D moves back and forth, so that the cutting chips CD are repeatedly extruded by the water flow W. In addition, the distance LG in the Y-axis direction between the first side wall 73 and the water curtain 91 (see Fig. 5A) and the flow rate of the water from the water curtain 91 form the water flow W as described above. It is preset so that it can be pushed out.

According to this embodiment, for example, even if the size and weight of the cutting waste (CD) becomes large or large, a water stream (W) is formed by the cutting waste outflow means (90), and the water flow (W) and Together, cutting chips (CD) can flow away. As a result, when the cutting chips (CD) flow on the inclined bottom wall 75, they are suppressed from remaining on the way and can be recovered well in the cutting chips recovery box 71, thereby preventing the cutting chips (CD) from flowing on the bottom wall 75. It is possible to effectively prevent deposition.

Although the cutting device 1 of the above embodiment uses the package substrate P as the object of cutting, the material of the workpiece to be processed, the type of device formed on the workpiece, etc. are not limited. For example, in addition to package substrates, various works such as semiconductor device wafers, optical device wafers, semiconductor substrates, inorganic material substrates, oxide wafers, raw ceramic substrates, and piezoelectric substrates may be used as the workpiece. As the semiconductor device wafer, a silicon wafer or a compound semiconductor wafer after device formation may be used. As the optical device wafer, a sapphire wafer or silicon carbide wafer after device formation may be used. Additionally, silicon, gallium arsenide, etc. may be used as the semiconductor substrate, and sapphire, ceramics, glass, etc. may be used as the inorganic material substrate. Additionally, as the oxide wafer, lithium tantalate or lithium niobate may be used after device formation or before device formation.

In addition, in the above embodiment, the cutting waste discharge means 90 is formed as a single piece, but a plurality of cutting chips discharge means 90 may be arranged side by side in the Y-axis direction, such as being installed separately for each chuck table 11 and 12. In this case, the plurality of water curtains 91 may be synchronized and rotated in the same direction. In addition, in the Y-axis direction, which is the flow direction of the cutting chips (CD) in the cutting waste guide casing 70, the water flow W formed by the water curtain 91 on the upstream side flows to the center of the bottom wall 75. After arrival, the timing of the fluctuation may be set so that it flows by the flowing water of the water curtain 91 on the downstream side.

In addition, the cutting device 1 is configured to include two cutting means 40, but the number of cutting means 40 may be one, or three or more may be provided.

In addition, although the embodiment of the present invention has been described, as another embodiment of the present invention, the above-mentioned embodiment and modification examples may be combined in whole or in part.

In addition, the embodiments of the present invention are not limited to the above-described embodiments and modified examples, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in a different way due to technological progress or other derived technologies, it may be implemented using that method. Accordingly, the scope of the patent claims covers all embodiments that can be included within the scope of the technical idea of the present invention.

As explained above, the present invention is useful for a cutting device that receives and recovers cutting chips together with cutting water.

1: cutting device
11: First chuck table (maintenance means)
12: Second chuck table (maintenance means)
13: first processing transport means
14: second processing transport means
30: output transport means
40: cutting means
41: cutting blade
43: Spray nozzle (cutting water supply means)
59: first plate cover
60: second plate cover
70: Cutting debris guide casing
71: Cutting chips recovery box
73: first side wall
74: second side wall
75: bottom wall
80: Cutting debris outflow means
91: Water Curtain
92: Rotation swing unit
CD: cutting chips
P: Package substrate (workpiece)
W: water flow

Claims (1)

A holding means for holding a workpiece, a cutting means equipped with a cutting blade for cutting the workpiece held by the holding means, a cutting water supply means for supplying cutting water to the cutting blade, and the holding means for It is provided with a machining feed means for machining and feeding in a direction and a calculating feed means for conveying the cutting means to a calculated position in the Y-axis direction orthogonal to the X-axis direction, wherein the cutting means supplied to the cutting blade A cutting device in which the side that scatters with the rotation of is the downstream side of the machining feed direction, and the opposite side is the upstream side of the machining feed direction,
A cutting waste recovery box, a first side wall formed by stretching in the A cutting waste guide casing, which consists of a bottom wall inclined to be lowered toward the holding means, is disposed on the downstream side in the machining feed direction with respect to the holding means, and receives cutting water and cutting chips flowing into the downstream side after cutting,
It is provided with a cutting waste outflow means disposed within the cutting waste guide casing and causing the flowing cutting chips to flow out into the cutting waste recovery box by running water,
The cutting waste recovery box is formed to receive cutting water and cutting chips flowing in from the cutting waste guide casing, and at least the bottom portion is formed to allow cutting water to flow and catch cutting chips, and collect the cutting chips,
The cutting waste outflow means includes a water curtain extended in the It consists of a rotary swing unit that rotates by reciprocating in the axial direction,
When the water flow from the water curtain swings toward the first side wall of the cutting waste guide casing, a water flow is formed between the first side wall, and as the water curtain swings toward the cutting chip recovery box side, the water curtain A cutting device characterized in that it pushes the cutting chips that have fallen on the bottom wall together with the water flow by running water, thereby causing the cutting chips to flow out into the chip recovery box.