JP7030606B2 - Cutting equipment - Google Patents

Description

The present invention particularly relates to a cutting device having a function of processing scraps generated when cutting a workpiece.

For example, a package substrate called a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-led Package) substrate is cut by a cutting device to manufacture individual semiconductor device packages. As disclosed in Patent Document 1, a cutting device for cutting a package substrate along a cutting street includes a chuck table for holding a workpiece (package substrate) and a cutting means for cutting the workpiece. I have. The cutting means is provided with a cutting blade and a cutting water injection means for injecting cutting water onto the cutting blade, and at the time of cutting, the cutting blade and the package substrate are cooled by the injection of the cutting water. When the package substrate is set on the chuck table, the chuck table reciprocates to perform cutting of the package substrate.

At this time, due to the rotation direction of the cutting blade, cutting debris such as scraps of the package substrate and cutting water are scattered. In the case of a normal down cut, the cutting blade rotates in the forward movement direction of the chuck table, so that cutting chips and cutting water are scattered in the forward movement direction of the chuck table.

The cutting device described in Patent Documents 1 and 2 is provided with a scrap material processing device for treating the scrap material and cutting water scattered due to the cutting of the package substrate. In this scrap processing device, the scattered scraps and cutting water are received by the channel shape portion provided near the chuck table and flowed in the forward movement direction of the chuck table, and the scraps and cutting water are placed on the endless belt or the inclined guide plate. To drop. The offcuts that have fallen on the endless belt or the inclined guide plate are conveyed by the movement of the endless belt or the inclination of the inclined guide plate, and are dropped into the end material collection container and collected.

Japanese Unexamined Patent Publication No. 2002-239888 Japanese Unexamined Patent Publication No. 2015-5544

However, in the above-mentioned scrap material processing apparatus, there is a problem that the scrap material of the cutting chips stays in the middle on the endless belt or the inclined guide plate, and the scrap material is deposited at the portion.

The present invention has been made in view of such a problem, and one of the objects of the present invention is to provide a cutting apparatus capable of satisfactorily recovering cutting chips such as offcuts.

The cutting apparatus of one aspect of the present invention supplies cutting water to a holding means for holding a workpiece, a cutting means to which a cutting blade for cutting the workpiece held by the holding means is mounted, and a cutting blade. It is provided with a cutting water supply means, a machining feed means for machining and feeding the holding means in the X-axis direction, and an indexing feed means for indexing and feeding the cutting means in the Y-axis direction orthogonal to the X-axis direction, and is supplied to the cutting blade. It is a cutting device whose side where the cutting water scatters with the rotation of the cutting blade is the downstream side in the machining feed direction and the opposite side is the upstream side in the machining feed direction. The first side wall that was stretched and erected, the second side wall that was stretched and erected in the Y-axis direction from the first side wall to the cutting waste collection box, and the second side wall that was erected so as to be lowered toward the cutting waste collection box. The inside of the cutting waste guide housing, which is composed of the bottom wall and is arranged on the downstream side in the machining feed direction with respect to the holding means and receives the cutting water and cutting chips flowing to the downstream side after cutting. The cutting waste recovery box is provided with a cutting waste outflow means that allows the flowing cutting chips to flow out to the cutting waste collection box by running water, and the cutting waste recovery box receives the cutting water and cutting chips flowing from the cutting waste guide housing. Moreover, at least the bottom is formed so as to flow cutting water and catch the cutting chips, and the cutting chips are collected. It is composed of a rotary swinging part that reciprocates in the Y-axis direction to the first side wall side of the cutting waste guide housing and the cutting waste collection box side, and the flowing water from the water curtain is the cutting waste. When swinging to the first side wall side of the guide housing, a water reservoir is formed between the guide housing and the first side wall, and as the water curtain swings toward the cutting chip collection box side, the running water of the water curtain together with the water pool. By pushing the cutting chips that have fallen on the bottom wall, the cutting chips are discharged to the cutting waste collection box.

According to this configuration, a water reservoir can be formed by flowing water from the water curtain in the cutting waste guide housing, and the cutting chips can be washed away together with the water reservoir. As a result, it is possible to prevent the cutting chips from staying in the middle of the bottom plate of the cutting chips guide housing, and the cutting chips can be satisfactorily collected by the cutting waste collection box.

According to the present invention, since the cutting waste outflow means for flushing the cutting chips together with the water reservoir is provided, the cutting chips such as offcuts can be satisfactorily recovered.

It is a schematic perspective view of the cutting apparatus of embodiment. It is a partial schematic perspective view of a cutting device. It is a schematic plan view of a cutting chip outflow means. It is a partial vertical sectional view of FIG. 5A to 5D are operation explanatory views of the cutting chips outflow means.

Hereinafter, the cutting apparatus according to the present embodiment will be described with reference to the attached drawings. FIG. 1 is a schematic perspective view of a cutting device according to an embodiment.

As shown in FIG. 1, the cutting apparatus 1 intermittently cuts the cutting blade 41 into the package substrate P on the first chuck table (holding means) 11 and the second chuck table (holding means) 12. It is configured to be divided into individual devices D. The package substrate P shown in FIG. 1 is an example of a workpiece, for example, a CSP substrate or a QFN substrate. The package substrate P is partitioned by the cutting schedule lines L provided in a grid pattern on the surface thereof to form a plurality of regions, and the device D is formed in each region. Two device portions F on which a plurality of devices D are formed are formed on the package substrate P, and a surplus connecting member C is formed on the outside of the device portions F. As will be described later, the surplus connecting member C is disconnected in advance before the device unit F is divided into the individual devices D.

The cutting device 1 has a base 2 and a gate-shaped column 3 erected on the base 2. Further, the cutting device 1 includes a first chuck table 11 and a second chuck table 12 for holding the package substrate P, and a first machining feed means 13 and a second machining means 13 provided side by side in the Y-axis direction on the base 2. It is provided with a feeding means 14. On the upper surface of each of the chuck tables 11 and 12, a jig 16 having a plurality of suction ports corresponding to individual devices D of the package substrate P and escape grooves (not shown) through which the cutting blade 41 passes is mounted.

The first machining feed means 13 includes a pair of guide rails 18 arranged on the upper surface of the base 2 and parallel to the X-axis direction, and a motor-driven X-axis table 19 slidably installed on the pair of guide rails 18. have. On the X-axis table 19, the first chuck table 11 is rotatably supported by the θ table 20. A nut portion (not shown) is formed on the back surface side of the X-axis table 19, and a ball screw 22 is screwed into the nut portion. A drive motor 23 is connected to one end of the ball screw 22. The ball screw 22 is rotationally driven by the drive motor 23, and the first chuck table 11 is moved (machined) along the guide rail 18 in the X-axis direction.

The second machining feed means 14 has the same configuration as the first machining feed means 13 except that the target to be moved is changed to the second chuck table 12, and the second chuck table 12 is moved in the X-axis direction ( Processing feed). Therefore, each configuration of the second machining feed means 14 is designated by the same reference numeral as that of the first machining feed means 13, and the description thereof will be omitted.

The cutting device 1 further includes an indexing feeding means 30 provided in the column 3, and the indexing feeding means 30 indexes a pair of cutting means 40 above the chuck tables 11 and 12 in the Y-axis direction orthogonal to the X-axis direction. It feeds and moves up and down in the Z-axis direction.

The indexing feed means 30 includes a pair of guide rails 31 provided on the front surface of the column 3 and parallel to the Y-axis direction, and a pair of motor-driven Y-axis tables 32 slidably installed on the pair of guide rails 31. have. Further, the indexing feeding means 30 has a pair of guide rails 33 arranged in front of each Y-axis table 32 and parallel to the Z-axis direction, and a Z-axis table 34 slidably installed on each guide rail 33. is doing. A cutting means 40 is supported at the lower part of each Z-axis table 34 via an L-shaped bracket 34a.

Nut portions (not shown) are formed on the back surface side of each Y-axis table 32, and a ball screw 35 is screwed into these nut portions. A drive motor 36 is connected to one end of the ball screw 35. The ball screw 35 is rotationally driven by the drive motor 36, and the Z-axis table 34 and the cutting means 40 are moved (indexed and fed) along the guide rail 31 in the Y-axis direction. Further, between the Y-axis table 32 and each Z-axis table 34, an elevating means 37 for raising and lowering the cutting means 40 in the Z-axis direction is arranged along the guide rail 33.

In the cutting means 40, a cutting blade 41 is attached to the tip of a spindle (not shown) that rotates around the Y axis. The cutting blade 41 is composed of a resin blade in which diamond abrasive grains are hardened with a resin bond to form a circle. The periphery of the cutting blade 41 is covered with a blade cover 42, and the blade cover 42 is provided with an injection nozzle (cutting water supply means) 43 for injecting and supplying cutting water toward the cutting blade 41. The cutting means 40 rotates the cutting blade 41 at a high speed, and while injecting cutting water from a plurality of injection nozzles 43 into the cutting portion, the package substrate P held on the chuck tables 11 and 12 is cut. The cutting water cools the cutting location and flushes away the cutting debris generated during cutting.

FIG. 2 is a partial schematic perspective view of the cutting device. As shown in FIG. 2, the first chuck table 11 and the second chuck table 12 are arranged in an opening formed on the water case 50 (not shown in FIG. 1). The opening is surrounded by a bottom portion 51 that forms the upper surface of the water case 50, and a pair of side walls 52, 53 and end walls 54 that project upward from the bottom portion 51. The side wall 52 and the side wall 53 are wall portions that are separated from each other in the Y-axis direction and extend in the X-axis direction. The end wall 54 is a wall portion located on one end side (upstream side) of the bottom portion 51 and the side walls 52 and 53 in the X-axis direction and extending in the Y-axis direction. In the opening, a first moving plate 55 that moves in the X-axis direction together with the first chuck table 11 and a second moving plate 56 that moves in the X-axis direction together with the second chuck table 12 are provided. A bellows cover 57 is provided between the first moving plate 55 and the end wall 54, and a bellows cover 58 is provided between the second moving plate 56 and the end wall 54.

The processing feed means 13 and 14 (see FIG. 1) for moving the first chuck table 11 and the second chuck table 12 in the X-axis direction include a water case 50, a first moving plate 55, a second moving plate 56, and a bellows cover. It is arranged in a waterproof space (not shown) covered with 57, 58 and the like.

The cutting device 1 has a first plate-shaped cover 59 and a second plate-shaped cover that allow cutting water, cutting chips, and the like to flow out to the downstream side in the machining feed direction (X-axis direction) of the first chuck table 11 and the second chuck table 12. It has 60. Here, the downstream side in the machining feed direction (X-axis direction) refers to the side where the cutting water supplied to the cutting blade 41 at the time of cutting scatters with the rotation of the cutting blade 41. Further, the direction facing the opposite side to the downstream side is the upstream side.

In the opening, the first plate-shaped cover 59 and the second plate-shaped cover 60 are on the downstream side of the first chuck table 11 and the second chuck table 12 in the X-axis direction, and are the first moving plate 55 and the second moving plate 55. It is provided on the downstream side of the plate 56. The first plate-shaped cover 59 is located between the pair of inclined surfaces 61 gradually lowering toward the center in the Y-axis direction and the pair of inclined surfaces 61 in the Y-axis direction, and gradually decreases from the upstream side to the downstream side. It has a central inclined surface 62 which is lowered. Similar to the first plate-shaped cover 59, the second plate-shaped cover 60 is located between the pair of inclined surfaces 63 that gradually decrease toward the center in the Y-axis direction and the pair of inclined surfaces 63 in the Y-axis direction. It has a central inclined surface 64 that is located and gradually decreases from the upstream side to the downstream side.

A vertical wall portion 65 projecting upward is provided on the peripheral edge of the first moving plate 55, and a vertical wall portion 66 projecting upward is provided on the peripheral edge of the second moving plate 56. The vertical wall portion 65 has an opening communicating with the central inclined surface 62 side of the first plate-shaped cover 59, and the vertical wall portion 66 has an opening communicating with the central inclined surface 64 side of the second plate-shaped cover 60. When cutting the package substrate P on the first chuck table 11, cutting water containing cutting chips flows from the first moving plate 55 onto the first plate-shaped cover 59. When cutting the package substrate P on the second chuck table 12, cutting water containing cutting chips flows from the second moving plate 56 onto the second plate-shaped cover 60.

Inside each of the first plate-shaped cover 59 and the second plate-shaped cover 60, a sliding portion (not shown) slidable with respect to a rail (not shown) laid on the bottom 51 of the water case 50. Is formed. The first plate-shaped cover 59 and the second plate-shaped cover 60 are guided so as to be movable in the X-axis direction by the rail and the sliding portion. The upstream end of the first plate-shaped cover 59 is connected to the first moving plate 55, and the first plate-shaped cover 59 moves in the X-axis direction together with the first chuck table 11 and the first moving plate 55. The upstream end of the second plate-shaped cover 60 is connected to the second moving plate 56, and the second plate-shaped cover 60 moves in the X-axis direction together with the second chuck table 12 and the second moving plate 56. The downstream ends of the first plate-shaped cover 59 and the second plate-shaped cover 60 are free ends that are not fixed to the water case 50 or the like.

The first plate-shaped cover 59 and the second plate-shaped cover 60 receive the scraps (cutting debris) and cutting water flowing from the first moving plate 55 and the second moving plate 56 on the upstream side into the inclined surface 61 and the center, respectively. It is guided to the downstream side through the inclined surface 62, the inclined surface 63 and the central inclined surface 64, and flows out from the free end.

The cutting device 1 includes a cutting waste guide housing 70 adjacent to the water case 50 and a cutting waste guide housing on the downstream side in the X-axis direction from the free ends of the first plate-shaped cover 59 and the second plate-shaped cover 60. A cutting waste collection box 71 that can be moved up and down at a continuous position at the lower end of the 70 is provided.

The cutting chip guide housing 70 includes a first side wall 73, a second side wall 74, and a bottom wall (cutting waste guide plate) 75. The first side wall 73 is provided on the side opposite to the cutting chip collection box 71 in the Y-axis direction, and extends from the water case 50 side to the downstream side in the X-axis direction and stands upright. The second side wall 74 extends from the first side wall 73 to the cutting chip collection box 71 in the Y-axis direction and stands upright. The second side wall 74 is provided on both ends of the first side wall 73 in the X-axis direction (see FIG. 3). The bottom wall 75 is provided on the lower end side of the first side wall 73 and the second side wall 74, and is formed as a slope portion that changes the height in the Z-axis direction along the Y-axis direction (see FIG. 4). The bottom wall 75 is inclined so as to be gradually lowered toward the cutting chip collection box in the Y-axis direction.

Since the cutting chip guide housing 70 is arranged on the downstream side in the machining feed direction of the first chuck table 11 and the second chuck table 12 that hold the package substrate P, it flows to the downstream side after cutting the package substrate P. Receives cutting water and cutting chips from above to the inside. Then, the cutting water and cutting chips received in the cutting waste guide housing 70 are guided toward the cutting waste recovery box 71 by the inclination of the bottom wall 75.

The cutting waste collection box 71 is formed in the shape of an open-top container that can receive cutting water and cutting chips that are guided by the cutting waste guide housing 70 and flow in. A mesh portion (not shown) is provided at the bottom of the cutting chip recovery box 71, and is formed so that scraps and relatively large cutting chips caught without passing through the mesh portion can be caught and collected. .. The cutting water that flows through the bottom of the cutting chip recovery box 71 and passes through the mesh portion is discharged to the outside.

Next, returning to FIG. 1, an operation example of the cutting device 1 will be described. The package substrate P is conveyed to the first chuck table 11 and the second chuck table 12, respectively. In the following, when the first chuck table 11 and the second chuck table 12 operate in the same manner, the first chuck table 11 side will be described.

In the jig 16 placed on the first chuck table 11, the conveyed package substrate P is sucked and held. Subsequently, the cutting blade 41 of the cutting means 40 is rotated and lowered until it comes into contact with the package substrate P, and the first chuck table 11 is moved downstream in the X-axis direction. In the package substrate P, first, two boundaries between the device portion F and the surplus connecting member C are cut by the rotating cutting blade 41.

After that, the cutting blade 41 is indexed and fed in the Y-axis direction by driving the indexing and feeding means 30, and the other two boundaries between the device portion F and the surplus connecting member C are similarly cut. Next, after rotating the first chuck table 11 by 90 degrees, the two boundaries between the device D and the surplus connecting member C are similarly cut, and the surplus connecting member C is removed. After that, cutting is performed along all scheduled cutting lines L oriented in the X-axis direction. After such cutting, by rotating the first chuck table 11 by 90 degrees, the planned cutting line L that was oriented in the Y-axis direction is directed in the X-axis direction, and the same operation as described above is repeated. As a result, the package substrate P is cut along all the scheduled cutting lines L oriented in the X-axis direction, and the device portion F is divided into individual devices D.

During cutting of the package substrate P, the cutting means 40 always supplies cutting water toward the cutting blade 41 by the injection nozzle 43. The supplied cutting water and the cutting debris contained therein scatter toward the downstream side in the machining feed direction (X-axis direction) as the cutting blade 41 rotates, and the moving plates 55 and 56 and the plate-shaped covers 59 and 60 are scattered. Fall into. Then, it is guided by the first plate-shaped cover 59 and the second plate-shaped cover 60 and flows to the downstream side in the X-axis direction, and the cutting waste guide housing is provided from the free end of the first plate-shaped cover 59 and the second plate-shaped cover 60. It flows to the 70 side.

The cutting chips flowing out to the cutting chips guide housing 70 include bonding materials such as chips and bond materials of the package substrate P, abrasive grains that have fallen off from the grindstone, and surplus connecting member C as scraps. .. In the case of cutting chips, the size and weight of the surplus connecting member C, which is a scrap material, becomes very large (for example, the size is several cm), and therefore, due to the inclination of the bottom wall 75 of the cutting chips guide housing 70. It may become difficult to flow and accumulate. Therefore, the cutting device 1 is provided with a cutting waste outflow means 90 (see FIG. 2) for reliably discharging the cutting waste in the cutting waste guide housing 70. Hereinafter, the cutting chip outflow means 90 will be described.

As shown in FIG. 2, the cutting waste outflow means 90 is arranged inside the cutting waste guide housing 70 at a position where the cutting chips flowing from the first plate-shaped cover 59 and the second plate-shaped cover 60 fall. Has been done.

FIG. 3 is a schematic plan view of the cutting chips outflow means, and FIG. 4 is a vertical cross-sectional view of a part of FIG. As shown in FIGS. 3 and 4, the cutting chips outflow means 90 includes a cylindrical water curtain (water curtain forming portion) 91 extending in the X-axis direction and a rotary swing portion 92 for rotating the water curtain 91. It is equipped with.

The water curtain 91 is provided so as to connect between the second side walls 74 (not shown in FIG. 4) of the cutting waste guide housing 70, and is in the vicinity of the first side wall 73 in the cutting waste guide housing 70. It is arranged in. The water curtain 91 is supplied with water for flowing out the cutting chips CD from a supply source (not shown). A plurality of spouts 91a are formed on the lower surface side of the water curtain 91 at predetermined intervals, and by ejecting water from each spout 91a, the flowing water below the water curtain 91 is formed in a curtain shape extending in the X-axis direction. Will be done.

The rotary swing portion 92 is provided on at least one end side of the water curtain 91. The rotary swing portion 92 includes a drive motor and the like, and is configured to be rotatable so as to reciprocate around the water curtain 91 within a predetermined angle range. Due to this rotation, the curtain-shaped flowing water from the water curtain 91 is rotationally swung in the Y-axis direction in a reciprocating manner, and as shown by the dotted line arrow in FIG. The running water reciprocates in the Y-axis direction to and from the cutting chip recovery box 71 side.

Subsequently, a procedure for causing the cutting chips to flow out by the cutting chips outflow means 90 will be described with reference to FIG. 5A to 5D are operation explanatory views of the cutting chips outflow means.

Here, the description of the flowing water from the reciprocating water curtain 91 will be started from the state of moving to the first side wall 73 side while ejecting at the angle shown in FIG. 5A. In the state of FIG. 5A, the flowing water from the water curtain 91 passes directly under the water curtain 91 and then swings toward the first side wall 73 side. At this time, the ejected water is sandwiched between the flowing water being ejected and the first side wall 73, and a water reservoir W is formed between them.

From this state, the flowing water from the water curtain 91 is further advanced to the side of the first side wall 73, and is shaken until it is directly ejected to the first side wall 73. Lifted along 73. Then, when the water is lifted to a predetermined height, as shown in FIG. 5B, the water reservoir W penetrates the flowing water from the water curtain 91 from above to below due to its own weight and falls. At the timing of this fall, the swing direction of the water curtain 91 is switched, and the flowing water from the water curtain 91 is moved to the cutting waste collection box 71 side.

As the swing direction of the water curtain 91 is switched in this way, as shown in FIG. 5C, the water reservoir W on the bottom wall 75 is pushed toward the cutting waste collection box 71 by the movement of the flowing water of the water curtain 91. become. Then, as shown in FIG. 5D, as the water reservoir W is pushed, the cutting chip CD on the bottom wall 75 is also pushed together with the water reservoir W, and can be discharged to the cutting waste recovery box 71. After that, when the flowing water of the water curtain 91 reaches the front of the cutting chip collection box 71, the swing direction of the water curtain 91 is switched to the side of the first side wall 73.

In this way, the flowing water from the water curtain 91 shown in FIGS. 5A to 5D reciprocates, so that the cutting chips CD are repeatedly extruded by the water reservoir W. The distance LG (see FIG. 5A) between the first side wall 73 and the water curtain 91 in the Y-axis direction and the flow rate of the flowing water from the water curtain 91 can be pushed out by forming the water reservoir W as described above. Is preset to.

According to such an embodiment, for example, even if the size and weight of the cutting waste CD become large or large, the cutting waste outflow means 90 forms a water reservoir W, and the cutting waste CD is formed together with the water reservoir W. Can be washed away. As a result, when the cutting chips CD flows on the inclined bottom wall 75, the cutting chips CD can be satisfactorily collected in the cutting chips collection box 71 by suppressing the staying in the middle, and the cutting chips CD accumulates on the bottom wall 75. Can be satisfactorily prevented.

The cutting device 1 of the above embodiment targets the package substrate P for cutting, but the material of the work piece to be machined, the type of device formed on the work piece, and the like are not limited. For example, as the workpiece, various workpieces such as semiconductor device wafers, optical device wafers, semiconductor substrates, inorganic material substrates, oxide wafers, raw ceramic substrates, and piezoelectric substrates may be used in addition to the package substrates. As the semiconductor device wafer, a silicon wafer after device formation or a compound semiconductor wafer may be used. As the optical device wafer, a sapphire wafer or a silicon carbide wafer after device formation may be used. Further, silicon, gallium arsenide or the like may be used as the semiconductor substrate, and sapphire, ceramics, glass or the like may be used as the inorganic material substrate. Further, as the oxide wafer, lithium tantalate or lithium niobate after device formation or before device formation may be used.

Further, in the above embodiment, the cutting chip outflow means 90 is used as one body, but a plurality of cutting chips outflow means 90 may be arranged side by side in the Y-axis direction, such as being installed for each of the chuck tables 11 and 12, respectively. In this case, a plurality of water curtains 91 may be rotated and swung in the same direction in synchronization with each other. Further, in the Y-axis direction, which is the flow direction of the cutting chips CD in the cutting chips guide housing 70, the water reservoir W formed by the water curtain 91 on the upstream side reaches the center of the bottom wall 75, and then the downstream side. The timing of the swing may be set so as to be washed away by the running water of the water curtain 91.

Further, although the cutting device 1 is configured to include two cutting means 40, the cutting means 40 may be provided with one or three or more.

Moreover, although the embodiment of the present invention has been described, as another embodiment of the present invention, the above-described embodiment and modifications may be combined in whole or in part.

Further, the embodiment of the present invention is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea of the present invention. Further, if the technical idea of the present invention can be realized in another way by the advancement of the technology or another technology derived from the technology, it may be carried out by the method. Therefore, the scope of claims covers all embodiments that may be included within the scope of the technical idea of the present invention.

As described above, the present invention is useful for a cutting device that receives and collects cutting chips together with cutting water.

1 Cutting device 11 1st chuck table (holding means)
12 Second chuck table (holding means)
13 1st machining feed means 14 2nd machining feed means 30 Indexing feed means 40 Cutting means 41 Cutting blade 43 Injection nozzle (cutting water supply means)
59 1st plate-shaped cover 60 2nd plate-shaped cover 70 Cutting waste guide housing 71 Cutting waste collection box 73 1st side wall 74 2nd side wall 75 Bottom wall 80 Cutting waste outflow means 91 Water curtain 92 Rotating rocking part CD Cutting chips P Package substrate (workpiece)
W water reservoir

Claims (1)

A holding means for holding a work piece, a cutting means on which a cutting blade for cutting a work piece held by the holding means is mounted, a cutting water supply means for supplying cutting water to the cutting blade, and the holding. The cutting water supplied to the cutting blade is provided with a machining feed means for machining and feeding the means in the X-axis direction and an indexing feed means for indexing and feeding the cutting means in the Y-axis direction orthogonal to the X-axis direction. A cutting device in which the side that scatters with the rotation of the cutting blade is the downstream side in the machining feed direction, and the opposite side is the upstream side in the machining feed direction.
A cutting chip recovery box, a first side wall extending in the X-axis direction and erected, and a second side wall extending in the Y-axis direction from the first side wall to the cutting chip recovery box. The cutting water, which is composed of a bottom wall inclined so as to be lowered toward the cutting waste collection box, is arranged on the downstream side in the machining feed direction with respect to the holding means, and flows to the downstream side after cutting. A cutting scrap guide housing that accepts cutting chips and
It is provided with a cutting waste outflow means, which is arranged in the cutting waste guide housing and causes the flowing cutting waste to flow out to the cutting waste collection box by running water.
The cutting waste recovery box is formed so as to receive cutting water and cutting chips flowing from the cutting waste guide housing and at least the bottom thereof allows the cutting water to flow and catch the cutting chips, and collects the cutting chips.
The cutting chips outflow means has a water curtain extending in the X-axis direction in the vicinity of the first side wall, and water flowing from the water curtain on the first side wall side of the cutting waste guide housing and collecting the cutting chips. It is composed of a rotary swing part that swings back and forth in the Y-axis direction on the box side.
When the flowing water from the water curtain swings toward the first side wall of the cutting waste guide housing, a water reservoir is formed between the water curtain and the first side wall, and the water curtain is on the cutting waste collection box side. A cutting apparatus characterized in that the cutting chips are discharged to the cutting chips collection box by pushing the cutting chips that have fallen on the bottom wall together with the water reservoir by the running water of the water curtain as the cutting chips oscillate.

Images