JP2018062052A - Cutting method and cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting method by which dressing of a cutting blade can be performed at suitable timing.SOLUTION: A cutting method for cutting a work-piece by a cutting blade including plural abrasive grains and a bond material for combining the plural abrasive grains includes: a cutting step at which the work-piece is cut by the cutting blade along plural scheduled cutting lines set on the work-piece; a tip state detection step at which a state of a tip of the cutting blade is detected during the cutting step or after performance of the cutting step; a determination step at which whether dressing of the cutting blade is necessary or not is determined based on the detected state of the tip after performance of the tip state detection step; and a dressing step at which a dressing material is cut by the cutting blade and dressing of the cutting blade is performed in the case that it is determined at the determination step that dressing is necessary.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cutting method for cutting a workpiece such as a semiconductor wafer using a cutting blade including abrasive grains and a bonding material, and a cutting apparatus used in the cutting method.

  When cutting a plate-like workpiece typified by a semiconductor wafer, for example, a cutting device equipped with an annular cutting blade containing abrasive grains and a bonding material is used. The workpiece can be cut along this moving direction by moving the workpiece and the cutting blade relatively while rotating the cutting blade into the workpiece.

  With the progress of the cutting as described above, problems such as clogging of abrasive grains that appear on the cutting edge of the cutting blade and uneven wear that changes the shape of the cutting blade may occur. When clogging occurs, the cutting ability of the cutting blade decreases. On the other hand, when uneven wear occurs, the cutting blade meanders and tends to cause defects such as chipping (chips) in the workpiece.

  Therefore, when problems such as clogging or partial wear occur, dressing is performed by cutting the cutting blade into a dressboard (dressing material) to adjust the state of the cutting edge (see, for example, Patent Document 1). The timing of dressing is determined based on, for example, the experience of the operator.

JP 2000-49120 A

  However, since there are individual differences in the state of the cutting blade and the workpiece, the state of the state of the cutting edge of the cutting blade varies depending on the individual difference. For this reason, there is a problem that dressing cannot always be performed at an appropriate timing in the method relying solely on the experience of the operator.

  The present invention has been made in view of such problems, and an object thereof is to provide a cutting method capable of performing dressing of a cutting blade at an appropriate timing, and a cutting apparatus used in the cutting method. It is to be.

  According to one aspect of the present invention, there is provided a cutting method for cutting a workpiece with a cutting blade that includes a plurality of abrasive grains and a bonding material that bonds the plurality of abrasive grains, and the plurality of workpieces are set on the workpiece. A cutting step for cutting the workpiece with the cutting blade along a cutting scheduled line, and a cutting edge state detecting step for detecting the state of the cutting edge of the cutting blade during the cutting step or after the cutting step is performed And a step of determining whether dressing of the cutting blade is necessary based on the detected state of the cutting edge after performing the cutting edge state detecting step, and a case where it is determined that dressing is necessary in the determining step And a dressing step of dressing the cutting blade by cutting a dressing material with the cutting blade.

  In one aspect of the present invention, in the blade edge state detecting step, the state of the blade edge may be detected by a reflective optical sensor. Further, in the cutting edge state detection step, after the cutting edge of the cutting blade is imaged by an imaging unit to form a captured image, the captured image is binarized and the cutting edge of the cutting edge is binarized based on the binarized captured image. The state may be detected.

  According to one aspect of the present invention, a cutting means having a spindle on which a cutting blade including a plurality of abrasive grains and a bonding material that bonds the plurality of abrasive grains is mounted, and a workpiece to be cut by the cutting blade. A holding table for holding a workpiece, a cutting edge state detecting means for detecting a cutting edge state of the cutting blade, a sub table for holding a dressing material used for dressing the cutting blade, the holding table and the sub table; A moving means for moving the cutting means relative to the cutting means; and a control means for controlling the cutting means and the moving means. The control means detects the state of the blade edge detected by the blade edge state detecting means. A determination unit that determines whether dressing of the cutting blade is necessary based on the control unit, and the control unit and the movement when the determination unit determines that dressing of the cutting blade is necessary Cutting device comprising a dressing execution unit, a dressing the said cutting blade is cutting the dress material by controlling the stage said cutting blade is provided.

  In the cutting method according to an aspect of the present invention, whether or not dressing is necessary by detecting the state of the cutting edge of the cutting blade during or after cutting of the workpiece, when it is determined that dressing is necessary, Since the dressing of the cutting blade is performed by cutting the dress material with the cutting blade, dressing of the cutting blade can be performed at an appropriate timing as compared with the conventional case.

  Further, a cutting device according to an aspect of the present invention includes a blade edge state detection unit that detects a state of a blade edge of a cutting blade, a sub-table that holds a dress material used for dressing the cutting blade, and a control unit. The control means includes a determination unit that determines whether or not dressing is necessary based on the state of the cutting edge, and a dressing execution unit that performs dressing of the cutting blade when the determination unit determines that dressing is necessary. Therefore, this cutting apparatus can be used for the cutting method described above.

It is a figure which shows the structural example of a cutting device typically. FIG. 2A is an enlarged perspective view of the blade edge state detection unit, and FIG. 2B is an enlarged front view of the blade edge state detection unit. It is a perspective view for demonstrating a cutting step. It is a front view for demonstrating a blade edge state detection step. 5 (A), 5 (B), 5 (C), and 5 (D) are diagrams schematically showing the contour of the cutting edge of the cutting blade detected in the cutting edge state detection step. It is a perspective view for demonstrating a dress step. It is the image (image after binarization) imaged in the blade edge state detection step which concerns on a modification.

  Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a diagram schematically illustrating a configuration example of a cutting apparatus according to the present embodiment. As shown in FIG. 1, the cutting device 2 includes a base 4 that supports each structure. On the upper surface of the base 4, a rectangular opening 4 a that is long in the X-axis direction (front-rear direction, processing feed direction) is formed. In this opening 4a, there are an X-axis moving table 6, an X-axis moving mechanism (moving means, not shown) for moving the X-axis moving table 6 in the X-axis direction, and a dustproof and splash-proof cover 8 that covers the X-axis moving mechanism. Is provided.

  The X-axis movement mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and an X-axis movement table 6 is slidably attached to the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 6, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 6 moves in the X-axis direction along the X-axis guide rail. A chuck table (holding table) 10 for holding the workpiece 11 is provided on the upper surface of the X-axis moving table 6.

  The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon, and the surface 11a (see FIG. 3) side is divided into a central device region and an extra peripheral region surrounding the device region. . The device region is further divided into a plurality of regions by cutting lines (streets) 13 (see FIG. 3) arranged in a lattice pattern, and devices 15 such as ICs and LEDs are formed in each region. .

  A tape 17 having a diameter larger than that of the workpiece 11 is attached (attached) to the back surface 11b (see FIG. 3) side of the workpiece 11. An annular frame 19 is fixed to the outer peripheral portion of the tape 17. That is, the workpiece 11 is supported on the frame 19 via the tape 17.

  In this embodiment, a disk-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11. However, the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate made of a material such as another semiconductor, ceramics, resin, or metal can be used as the workpiece 11. Similarly, the type, quantity, size, arrangement, etc. of the device 15 are not limited. Also, a workpiece or a substrate on which the device 15 is not formed may be used as the workpiece 11.

  The upper surface of the chuck table 10 is a holding surface 10 a that holds the workpiece 11. The holding surface 10a is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 10. Also. Around the chuck table 10, four clamps 12 for fixing a frame 19 that supports the workpiece 11 from four directions are provided.

  On the upper surface of the base 4, a gate-type support structure 16 that supports a cutting unit (cutting means) 14 for cutting the workpiece 11 is disposed so as to straddle the opening 4 a. A cutting unit moving mechanism (moving means) 18 for moving the cutting unit 14 in the Y-axis direction (left-right direction, index feed direction) and Z-axis direction (vertical direction) is provided on the upper front surface of the support structure 16.

  The cutting unit moving mechanism 18 includes a pair of Y-axis guide rails 20 arranged on the front surface of the support structure 16 and parallel to the Y-axis direction. A Y-axis moving plate 22 constituting the cutting unit moving mechanism 18 is slidably attached to the Y-axis guide rail 20. A nut portion (not shown) is provided on the back surface side (rear surface side) of the Y-axis moving plate 22, and a Y-axis ball screw 24 parallel to the Y-axis guide rail 20 is screwed to the nut portion. Yes.

  A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 24. If the Y-axis ball screw 24 is rotated by the Y-axis pulse motor, the Y-axis moving plate 22 moves in the Y-axis direction along the Y-axis guide rail 20. A pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided on the surface (front surface) of the Y-axis moving plate 22. A Z-axis moving plate 28 is slidably attached to the Z-axis guide rail 26.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 28, and a Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is screwed into the nut portion. Yes. A Z-axis pulse motor 32 is connected to one end of the Z-axis ball screw 30. When the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide rail 26.

  A cutting unit 14 is provided below the Z-axis moving plate 28. The cutting unit 14 includes an annular cutting blade 36 attached to one end of a spindle 34 (see FIG. 4). The cutting blade 36 is formed by, for example, fixing a plurality of abrasive grains made of diamond or the like with a bond material (bonding material) such as resin or metal.

  A rotation drive source (not shown) such as a motor is connected to the other end side of the spindle 34, and the cutting blade 36 is rotated by the force of the rotation drive source transmitted through the spindle 34. A camera 38 for taking an image of the workpiece 11 and the like held on the chuck table 10 is installed at a position adjacent to the cutting unit 14.

  If the Y-axis moving plate 22 is moved in the Y-axis direction by the cutting unit moving mechanism 18, the cutting unit 14 and the camera 38 are moved in the Y-axis direction. Further, when the Z-axis moving plate 28 is moved in the Z-axis direction by the cutting unit moving mechanism 18, the cutting unit 14 and the camera 38 are moved in the Z-axis direction.

  A blade edge state detection unit (blade edge state detecting means) 40 for detecting the state of the blade edge (tip portion) of the cutting blade 36 is provided on the rear end side of the upper surface of the X-axis moving table 6. A sub-table 42 for holding a dressboard (dress material) 31 (see FIG. 6) used for dressing the cutting blade 36 is provided on the front end side of the upper surface of the X-axis moving table 6.

  The upper surface of the sub table 42 is a holding surface 42 a that holds the dress board 31. The holding surface 42a is connected to a suction source (not shown) through a flow path (not shown) formed inside the sub-table 42. In the present embodiment, the sub-table 42 that holds the dressboard 31 using the negative pressure of the suction source is illustrated, but a sub-table that fixes and holds the dressboard 31 with an arbitrary fixture is used. You can also.

  Components such as the X-axis moving mechanism, the chuck table 10, the cutting unit 14, the cutting unit moving mechanism 18, the camera 38, the blade edge state detecting unit 40, and the sub table 42 are connected to a control unit (control means) 44, respectively. Yes. The control unit 44 controls each of the above-described components according to the processing conditions of the workpiece 11, the detection result of the blade edge state detection unit 40, and the like.

  FIG. 2A is an enlarged perspective view of the blade edge state detection unit 40, and FIG. 2B is an enlarged front view of the blade edge state detection unit 40. In FIG. 2B, some components of the blade edge state detection unit 40 are omitted. As shown in FIGS. 2A and 2B, the blade edge state detection unit 40 has a support structure 52 on which each component is mounted. The support structure 52 includes a substantially rectangular parallelepiped base portion 52a and a detection portion 52b extending upward from the rear end side of the base portion 52a.

  A concave blade entry portion 52c for allowing the cutting edge of the cutting blade 36 to enter is formed on the upper end side of the detection portion 52b. The blade intrusion portion 52c has a pair of inner side surfaces that face each other in the Y-axis direction and a bottom surface that connects the lower ends of the pair of inner side surfaces. A reflective optical sensor is provided on each of the pair of inner side surfaces and the bottom surface. 54, 56, and 58 are provided. With the optical sensors 54, 56, and 58, the contour shape of the cutting edge of the cutting blade 36 inserted into the blade intrusion portion 52c can be obtained. That is, the shape of the cutting edge, the state of the abrasive grains, and the like can be confirmed.

  Two air supply nozzles 60 for supplying air to the optical sensors 54, 56, and 58 are provided on the upper surface of the base 52a exposed in front of the detection unit 54b. Further, two liquid supply nozzles 62 for supplying a liquid such as water to the optical sensors 54, 56, 58 are provided at positions adjacent to the air supply nozzle 60. The optical sensors 54, 56, and 58 are dried with air from the air supply nozzle 60 after being cleaned with the liquid from the liquid supply nozzle 62, for example.

  A cover 66 having a rectangular parallelepiped outer shape is attached to the rear end surface of the support structure 52 via a connector 64 made of a hinge or the like. The inside of the cover 66 is a cavity. Therefore, for example, the detection unit 52b, the air supply nozzle 60, the liquid supply nozzle 62, and the like can be accommodated inside the cover 66 by rotating the cover 66 around the connector 64 to the closed position.

  On the other hand, when the state of the cutting edge of the cutting blade 36 is detected by the cutting edge state detection unit 40, the cover 66 is rotated to the open position shown in FIG. 2A to detect the detection unit 52b, the air supply nozzle 60, the liquid. The supply nozzle 62 and the like are exposed. As a result, the cutting blade 36 is allowed to enter the blade entry portion 52c, and the state of the cutting edge of the cutting blade 46 can be detected. The cutting edge state detection unit 40 is also used when detecting the position (height) of the cutting edge of the cutting blade 46.

  Next, the cutting method of this embodiment performed using the cutting apparatus 2 mentioned above is demonstrated. In the cutting method of this embodiment, first, the cutting step which cuts the to-be-processed object 11 using the cutting device 2 is performed. FIG. 3 is a perspective view for explaining a cutting step.

  In the cutting step, first, the tape 17 affixed to the back surface 11b side of the workpiece 11 is brought into contact with the holding surface 10a of the chuck table 10 to apply a negative pressure of the suction source. At the same time, the frame 19 is fixed by a plurality of clamps 12. Thereby, the workpiece 11 is held by the chuck table 10 and the clamp 12 with the surface 11a side exposed upward.

  Next, the chuck table 10 is rotated to align the target cutting scheduled line 13 with the X-axis direction of the cutting apparatus 2. Further, the chuck table 10 and the cutting unit 14 are relatively moved so that the position of the cutting blade 36 is aligned with the extension of the target cutting line 13.

  Then, the cutting edge of the cutting blade 36 is lowered to a position at an arbitrary height lower than the surface 11 a of the workpiece 11, and chucked in the X-axis direction parallel to the target cutting line 13 while rotating the cutting blade 36. The table 10 is moved. As a result, the cutting blade 36 is cut along the target cutting line 13, and the groove 21 having an arbitrary depth can be formed on the surface 11 a side of the workpiece 11 (half cut).

  When this procedure is repeated and, for example, the grooves 21 are formed along all the scheduled cutting lines 13, the cutting step is completed. In the present embodiment, the groove 21 having an arbitrary depth is formed on the surface 11 a side of the workpiece 11, but the groove may be formed on the back surface 11 b side of the workpiece 11. Further, the workpiece 11 may be completely cut (full cut).

  In the processing method of the present embodiment, the cutting edge state detection step of detecting the state of the cutting edge of the cutting blade 36 at any timing during the cutting step described above (during execution) or after completion of the cutting step (after execution). I do. FIG. 4 is a front view for explaining the blade edge state detecting step.

  In the cutting edge state detection step, first, the rotation of the cutting blade 36 is stopped, and the cutting unit 14 and the cutting edge state detection unit 40 are relatively moved so that the position of the cutting blade 36 matches the position of the cutting edge state detection unit 40. . Next, the cutting unit 14 is lowered, and the cutting edge of the cutting blade 36 is allowed to enter the blade entry part 52c of the cutting edge state detection unit 40 as shown in FIG.

  Then, the reflection type optical sensors 54, 56 and 58 are operated to detect the contour of the cutting edge of the cutting blade 36. Information on the contour of the cutting edge obtained by the optical sensors 54, 56, and 58 is sent to the determination unit 44 a of the control unit 44. 5 (A), 5 (B), 5 (C), and 5 (D) are diagrams schematically showing the contour of the cutting edge of the cutting blade 36 detected in the cutting edge state detection step.

  The timing of performing the cutting edge state detection step includes, for example, the type of the workpiece 11 and the cutting blade 36, the operating time of the cutting device 2, the number of processed workpieces 11, the number of processed cutting scheduled lines 13, It is set according to etc. However, as described above, there is no limitation on the timing for performing the blade edge state detection step. The timing of the cutting edge state detection step is stored in a timing storage unit (not shown) of the control unit 44, for example.

  After the cutting edge state detection step, a determination step is performed to determine whether dressing of the cutting blade 36 is necessary based on the detected state of the cutting edge. The determination unit 44a is configured to change the contour 36b of the cutting blade 36 corresponding to the abrasive grain from the contour 36a of the cutting blade 36 corresponding to the bonding material based on the information on the contour of the cutting edge sent from the optical sensors 54, 56, and 58, for example. The distance d1 to the tip (that is, the protruding amount of the abrasive grains) is calculated.

  As shown in FIG. 5A, for example, when the average value of the calculated plurality of distances d1 is equal to or larger than a predetermined threshold (or larger than the threshold), the determination unit 44a determines the state of the cutting edge of the cutting blade 36. Is normal and no dressing is required. On the other hand, as shown in FIG. 5B, for example, when the average value of the calculated plurality of distances d1 is less than a predetermined threshold (or less than the threshold), the determination unit 44a It is determined that the blade tip is clogged and that dressing is necessary.

  The threshold value used as a reference for this determination can be set based on, for example, the average particle size (or maximum particle size) of abrasive grains contained in the cutting blade 36. Specifically, a value of 1/5 to 1/2 of the average particle diameter may be set as the threshold value. However, there is no particular limitation on the threshold setting method.

  The determination unit 44a calculates, for example, a distance d2 between the center position in the width direction of the contour 36a and the lowest point of the contour 36a based on the contour information of the cutting edge sent from the optical sensors 54, 56, and 58. To do. For example, when the calculated distance d2 is less than a predetermined threshold (or less than or equal to the threshold), the determination unit 44a determines that the state of the cutting edge of the cutting blade 36 is normal and dressing is not necessary.

  On the other hand, as shown in FIG. 5C or FIG. 5D, for example, when the calculated distance d2 is greater than or equal to a predetermined threshold value (or exceeds the threshold value), the determination unit 44a includes the cutting blade 36. It is determined that there is uneven wear on the blade edge and dressing is necessary. The threshold value used as a reference for this determination can be set based on, for example, the width of the cutting blade 36 in a normal state, the value of the curvature radius of the cutting edge, or the like. Specifically, a value that is 1/30 to 1/10 of the width of the cutting blade 36 may be set as the threshold value. However, there is no particular limitation on the threshold setting method.

  In this determination step, the degree of wear of the cutting blade 36 can also be determined. For example, when the height of the lowest point of the contour 36a is less than a predetermined threshold (or less than the threshold), the determination unit 44a has not yet consumed the cutting blade 36 and needs to replace the cutting blade 36 yet. Judge that there is no.

  On the other hand, for example, when the height of the lowest point of the contour 36a is greater than or equal to a predetermined threshold value (or exceeds the threshold value), the determination unit 44a determines that the cutting blade 36 is completely consumed and the cutting blade 36 is Determine that it needs to be replaced. When it is determined that the cutting blade 36 needs to be replaced, for example, an exchange step for replacing the cutting blade 36 with another new cutting blade may be performed.

  When it is determined in the above-described determination step that dressing is not necessary, the workpiece 11 can be cut as it is. On the other hand, when it is determined in the determination step that dressing is necessary, a dressing step for dressing the cutting blade 36 is performed. Specifically, the dressing execution part 44b of the control unit 44 issues an instruction to each part of the cutting device 2, and causes the cutting blade 36 to cut the dress board 31.

  FIG. 6 is a perspective view for explaining the dressing step. As shown in FIG. 6, the cutting edge 36 of the cutting blade 36 can be adjusted by cutting the rotated cutting blade 36 into the dress board 31 to form the groove 31a. After the dressing is finished, the workpiece 11 can be cut again.

  As described above, in the cutting method of the present embodiment, the state of the cutting edge of the cutting blade 36 is detected during or after cutting the workpiece 11 to determine whether dressing is necessary, and it is determined that dressing is necessary. In this case, since the dressing board (dressing material) 31 is cut by the cutting blade 36 and the cutting blade 36 is dressed, the dressing of the cutting blade 36 can be performed at an appropriate timing as compared with the conventional case.

  Further, the cutting apparatus 2 of the present embodiment includes a cutting edge state detection unit (cutting edge state detection means) 40 that detects the state of the cutting edge of the cutting blade 36 and a sub-table that holds a dressboard 31 used for dressing the cutting blade 36. 42 and a control unit (control means) 44. The control unit 44 determines whether dressing is necessary based on the state of the cutting edge, and the determination unit 44a determines that dressing is necessary. In this case, the cutting device 2 can be used in the above-described cutting method.

  In the above embodiment, the blade edge state detection unit 40 including the reflection type optical sensors 54, 56, and 58 is used. However, other blade edge state detection units may be used. For example, the state of the cutting edge of the cutting blade 36 can also be detected using a cutting edge state detection unit including a camera (imaging means, not shown) having an image sensor such as a CCD image sensor or a CMOS image sensor.

  In this case, it is preferable to capture an image of the cutting edge of the cutting blade 36 with a camera to form an image (captured image), binarize the image, and detect the state of the cutting edge based on the binarized image. FIG. 7 is an image (image after binarization) captured in the cutting edge state detection step according to the modification. In the image after binarization, for example, since the outline of the abrasive grains becomes white, the protruding amount of the abrasive grains can be easily calculated.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 2 Cutting device 4 Base 4a Opening 6 X-axis movement table 8 Dust-proof drip-proof cover 10 Chuck table 10a Holding surface 12 Clamp 14 Cutting unit (processing means)
16 Support structure 18 Cutting unit moving mechanism (moving means)
20 Y-axis guide rail 22 Y-axis moving plate 24 Y-axis ball screw 26 Z-axis guide rail 28 Z-axis moving plate 30 Z-axis ball screw 32 Z-axis pulse motor 34 Spindle 36 Cutting blade 36a, 36b Contour 38 Camera 40 Cutting edge state detection unit ( Cutting edge state detection means)
42 Sub-table 42a Holding surface 44 Control unit (control means)
44a determination unit 44b dressing execution unit 52 support structure 52a base 52b detection unit 52c blade intrusion unit 54, 56, 58 optical sensor 60 air supply nozzle 62 liquid supply nozzle 64 connector 66 cover 11 work piece 11a surface 11b back surface 13 cutting schedule Line (street)
15 Device 17 Tape 19 Frame 21 Groove 31 Dressboard
31a Groove

Claims (4)

A cutting method of cutting a workpiece with a cutting blade including a plurality of abrasive grains and a bond material that bonds the plurality of abrasive grains,
A cutting step of cutting the workpiece with the cutting blade along a plurality of scheduled cutting lines set on the workpiece;
A cutting edge state detecting step for detecting a cutting edge state of the cutting blade during the cutting step or after the cutting step is performed;
A determination step of determining whether or not dressing of the cutting blade is necessary based on the detected state of the cutting edge after performing the cutting edge state detection step;
A dressing method comprising: a dressing step of performing dressing on the cutting blade by cutting a dressing material with the cutting blade when it is determined in the determination step that dressing is necessary.   The cutting method according to claim 1, wherein in the cutting edge state detecting step, the state of the cutting edge is detected by a reflection type optical sensor.   In the cutting edge state detection step, after the cutting edge of the cutting blade is imaged by an imaging unit to form a captured image, the captured image is binarized, and the state of the cutting edge is determined based on the binarized captured image. The cutting method according to claim 1, wherein the cutting method is detected. A cutting means having a spindle on which a cutting blade including a plurality of abrasive grains and a bonding material that bonds the plurality of abrasive grains is mounted;
A holding table for holding a workpiece to be cut by the cutting blade;
Cutting edge state detecting means for detecting the state of the cutting edge of the cutting blade;
A sub-table for holding a dressing material used for dressing the cutting blade;
Moving means for moving the holding table and the sub-table relative to the cutting means;
Control means for controlling the cutting means and the moving means,
The control means includes
A determination unit that determines whether dressing of the cutting blade is necessary based on the state of the cutting edge detected by the cutting edge state detection unit;
A dressing execution unit for performing dressing of the cutting blade by controlling the control means and the moving means to cause the cutting blade to cut the dressing material when the determination unit determines that dressing of the cutting blade is necessary And a cutting device characterized by comprising: