JP3276770B2 - Electronic component automatic mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on a printed circuit board by means of a suction nozzle for holding the electronic component by vacuum suction through a vacuum conduit communicating with a vacuum source and for removing dust on the way of the vacuum conduit. The present invention relates to an electronic component automatic mounting apparatus having the above filter.

[0002]

2. Description of the Related Art This kind of electronic component automatic mounting apparatus is disclosed in
Japanese Patent Application Laid-Open No. 3-174396 discloses a vacuum pump serving as a vacuum source after a dust removal filter is provided in a suction nozzle for sucking an electronic component and dust and other foreign substances sucked in during suction of the component are sucked into the nozzle. It is prevented from flowing into the side.

[0003]

However, in the above-mentioned prior art, when a certain amount of foreign matter accumulates, the vacuum line is reduced, and the vacuum pressure is reduced. Therefore, the filter must be replaced manually, which is troublesome. It is effective to increase the area of the filter in order to increase the time until the vacuum line is clogged and reduce the number of replacements.However, in this case, it is necessary to increase the volume of the space for storing the filter in the vacuum line. However, there is a disadvantage that it takes a long response time until the negative pressure of the suction nozzle becomes capable of sucking the electronic component after the valve is opened after the suction nozzle releases the electronic component and the negative pressure is cut off.

Accordingly, an object of the present invention is to reduce the frequency of manually replacing a dust removing filter provided in the middle of a vacuum pipe from a suction nozzle to a vacuum source.

[0005]

[0006]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an electronic component mounted on a printed circuit board by means of a suction nozzle for holding an electronic component by vacuum suction through a vacuum conduit communicating with a vacuum source. In an electronic component automatic mounting apparatus having a filter for dust removal on the way, a storage body having a plurality of the filters, and switching means for changing the position of the storage body and switching the filters are provided.

Further, according to the present invention, the electronic component is mounted on a printed circuit board by a suction nozzle for holding the electronic component by vacuum suction through a vacuum pipe communicating with a vacuum source, and a filter for dust removal is provided in the vacuum pipe. In the electronic component automatic mounting apparatus having a storage body having a plurality of the filters, the position of the storage body is changed with the movement of the suction nozzle by engaging with an engaging portion formed in the storage body. A switching means for switching a filter is provided.

[0008]

According to the structure of the first aspect, the switching means switches the filters by changing the position of the storage body having a plurality of filters.

According to the second aspect of the present invention, the switching means engages with the engaging portion formed on the storage body and changes the position of the storage body with the movement of the suction nozzle to switch the filter.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and 2, reference numeral 1 denotes a Y table that moves in the Y direction by rotation of a Y-axis motor 2, and 3 denotes a Y table that moves in the X direction on the Y table 1 by rotation of an X-axis motor 4. As a result, the printed circuit board 6 on which the chip-shaped electronic components 5 (hereinafter, referred to as chip components or components) are mounted is fixedly mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply stand drive motor, which rotates the ball screw 10 so that the supply stand 7 is connected to the linear guide 1 via a nut (not shown) which is fitted to the ball screw 10 and fixed to the supply stand 7.
2 to move in the X direction. Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 having a plurality of suction nozzles 14 are arranged at equal intervals in accordance with an intermittent pitch.

A suction station I is a stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 due to the intermittent rotation of the rotary table 13. 5 is adsorbed. 16 is a component 5 to which the suction nozzle 14 sucks.
This is a component recognition device which recognizes the positional shift of the component 5 by recognizing the lower surface of the component 5 with a camera in a predetermined visual field range and recognizing and processing the captured screen, and is provided in the recognition station II.

Next mounting head 1 of recognition station II
The stop position of the position 5 is the angle correction station III, and the angle in which the angular position for correcting the angular position deviation of the chip component 5 based on the recognition result of the recognition device 16 is added to the predetermined angle amount indicated in the mounting data (not shown). The head rotation device 17 rotates the mounting head 15 in the θ direction by an amount. The θ direction is a direction that rotates around the axis of the nozzle 14.

The next stop position after the angle correction station III is the mounting station IV, and the component 5 to which the suction nozzle 14 of the station IV sucks the substrate 6
Is mounted by lowering the mounting head 15. As shown in FIG. 3, a suction hole 18 is formed in the suction nozzle 14 in the axial direction so as to open on a component suction surface which is a lower end surface thereof, and can communicate with a vacuum chamber 19 in the head 15. That is, the suction hole 18 communicates with the vacuum chamber 19 when the nozzle 14 is lowered so that the chip component 5 can be sucked. When the suction hole 18 is raised with respect to the head 15, the suction hole 18 does not communicate with the vacuum chamber 19 and vacuum is applied. It is made so as not to leak.

A vacuum line 20 extends from the vacuum chamber 19 and communicates via a solenoid valve 21 with a vacuum pump (not shown) as a vacuum source. The vacuum conduits 20 extending from each head 15 are united and communicate with a vacuum pump. On the way to the solenoid valve 21 of the vacuum conduit 20, there is provided a dust removal filter 22 for collecting foreign matter such as dust sucked by the suction nozzle 14 so as not to pass through the solenoid valve 21 side. The vacuum pump is protected from dust and the like. The solenoid valve 21 opens and closes the vacuum line 20 under the control of a CPU (not shown). When the suction nozzle 14 sucks the chip component 5 at the suction station I, the solenoid valve 21 is turned on to open the vacuum line 20 and generate a negative pressure. Then, when the head 15 reaches the mounting station IV and the suction nozzle 14 descends to mount the chip component 5, the nozzle 15 is turned off and the pipe 20 is turned off.
Is closed and the vacuum suction of the chip component 5 is released.

As shown in FIGS. 4 and 5, six filters 22 are provided in a cartridge 23 as a housing in a plane direction. That is, it is provided in the middle of a communication hole 25 formed at an equal angular interval on a concentric circle centered on a rotation support shaft 24 formed at the center of the cartridge 23 so as to cover the entire surface of the communication hole 25. Reference numeral 26 denotes six claw portions as engagement portions protruding from the outer periphery of the cartridge 23 corresponding to the positions of the communication holes 25. The cartridge 23 is detachably attached to a storage recess 28 provided on a projection 27 projecting from the rotary table 13 as shown in FIGS. 1 and 6, and is attached as shown in FIGS. In this state, the communication path 25 communicates with the vacuum pipe 20 penetrating through the projection 27. Reference numeral 29 denotes a packing which is in close contact with the surface of the cartridge 23 so that the vacuum pressure does not leak from the connecting portion between the communication hole 25 and the vacuum pipe 20. Glued.

Grooves 30 are formed on both sides of the recess 27 of the protrusion 27 so that the rotary support shaft 24 can penetrate therethrough and pass therethrough. The groove 30 is formed at the end of the groove 30. The support shaft 24 is rotatable, and switching is performed such that the rotation of the cartridge 23 causes the communication hole 25 to rotate and the other communication hole 25 to communicate with the vacuum conduit 20. Reference numeral 31 denotes a pressing spring that presses the concave portion 32 formed around the cartridge 23, and fixes the cartridge 23 at a position where one communication hole 25 communicates with the vacuum pipe 20 as shown in FIG.

In FIGS. 6 to 10, reference numeral 33 denotes a cylinder as an exchange means or a switching means provided at a filter switching station which is a predetermined station at which the rotary table 13 stops. The rod 34 that comes in and out protrudes from and contacts the side of the claw portion 26 of the cartridge 23 attached to the storage recess 28, so that it is not pulled in and hit. The cylinder 33 is omitted in FIGS. 1 and 2.

The operation of the above configuration will be described below. First, a cartridge 23 is attached to a storage recess 28 corresponding to each head 15, and a filter 22 is attached to each vacuum line 20. In this state, when the automatic operation key of the operation unit (not shown) is pressed,
Automatic operation of the electronic component automatic mounting device is performed. During this time, the rod 34 is retracted so as not to come into contact with the claw portion 26.

That is, the mounting head 15 is moved for each station by the rotation of the rotary table 13, and the suction station is moved.
At the session I, the suction nozzle 14 of the mounting head 15 stopped at the station is lowered by the lowering of the mounting head 15. With this lowering, the solenoid valve 21 corresponding to the head 15 is turned on and the suction hole 18 of the suction nozzle is turned on.
Further, the vacuum suction is started, and the chip component 5 is sucked and taken out from the desired component supply device 8 stopped by the movement of the supply table 7, and the mounting head 15 is raised.

Next, the head 15 is mounted on the rotary table 1.
3 to the next station by the intermittent rotation, the next mounting head 15 moves to the suction station I,
Similarly, a component suction operation is performed. Next, the suction nozzle 14 holding the chip component 5 by suction is recognized by the recognition station I.
When the head moves to the position I, the component recognizing device 16 recognizes the displacement of the chip component 5 with respect to the suction nozzle 14, and the head 15 is rotated by the driving of the head rotating device 18 at the next angle correction station III. The angular position shift recognized so as to become the mounting angle indicated by the mounting data (not shown) is corrected, and the angular position is positioned.

Next, in the mounting station IV, the XY table
The bull 3 is positioned at a position where the component 5 indicated in the mounting data is to be mounted, taking into account the correction based on the recognition result, and the mounting head 15 is lowered to mount the component 5. At this time, since the solenoid valve 21 is turned off and vacuum suction is cut off, the chip component 5 is mounted at a predetermined position on the printed circuit board 6 to which an adhesive has been applied in advance.

As described above, the chip components 5 are sequentially mounted. The suction nozzle 14 sucks dust or the like immediately before the chip component 5 is sucked.
The gas passes through the vacuum chamber 19 and the vacuum pipe 20 and is captured and accumulated by the filter 22 provided in the middle of the communication hole 25. In this way, when the operation is continued for a predetermined time, which is the replacement time stored in the RAM, which is a storage device (not shown), the CPU (not shown) determines that the filter 22 should be replaced, and the chip component 5 The automatic operation of mounting is interrupted and the switching operation of the filter 22 is performed.

That is, the cylinder 33 operates and the rod 34
Project from the position of FIG. 7 to FIG.
Starts intermittent rotation. Then, first, the side of the claw 26 located at the outermost diameter portion when viewed from the center of rotation of the rotary table 13 at the projecting portion stopped at the filter switching station abuts against the side of the rod 34 to rotate the rotary table 13. As shown in FIG. 9, the projection is rotated counterclockwise around the rotation support shaft 24 against the urging force of the holding spring 31 so as to contact the cartridge 23 of the holding spring 31 as shown in FIG. It rotates to a position beyond a mountain portion between the recess 32 and the adjacent recess 32. In this manner, the filter 2 is further rotated by the elastic force of the holding spring 31, and as shown in FIG.
2 moves, and the filter 22 at the next position B moves to the vacuum line 2
The switching is completed by setting the position to zero.

This operation is performed for each cartridge 23 corresponding to each head 15, and the replacement of the filter 22 is automatically performed. In this way, the replacement of the filter 22 is automatically performed, but when the switching of the filter 22 is completed for the cartridges 23 corresponding to all the heads 15, the automatic operation of component mounting is automatically restarted.

If the filter switching station is changed to any one of the stations while the head 15 moves from the mounting station IV to the suction station I, the solenoid valve 21 is turned off. Then, the switching operation of the filter 22 can be performed without stopping the automatic operation while the automatic operation of the mounting operation of the chip component 5 is being performed. In this case, if the rotation speed of the rotary table 13 in the normal automatic operation of component mounting is too fast for the switching, the switching operation may be performed by reducing the speed to an appropriate speed for the switching. Component mounting can be performed without any trouble even if it is delayed.

In this manner, the automatic operation is continued, and the six filters 22 provided in the cartridge 23 are used, and the last filter 22 is to be replaced (determined by the operation time and the like). , The automatic operation is stopped, and the abnormality is notified. Next, the operator determines that the cartridge 23 should be replaced, and determines the cartridge 23 corresponding to each head 15.
Replace manually.

That is, the cartridge 23 in the state of FIG. 5 is first moved upward in FIG. 5 against the urging force of the spring 31 (the rotation support shaft 24 moves along the groove 30), and further to the left. Pull out and remove as shown in FIG. Next, a new cartridge 23 is attached from the state shown in FIG. 12 to the state shown in FIG. This operation is performed for all cartridges 15 of the head 15.
Perform step 3 on.

Next, the automatic operation may be started. In this embodiment, the switching timing of the filter 22 is stored in a RAM (not shown) and is automatically performed in accordance with the timing. However, a key for the filter switching is prepared and the key is pressed by pressing the key. The above-described filter switching operation may be performed. The pressing of this key may be performed by pressing a touch panel switch formed on the CRT. The pressing of the key may be received when the automatic operation is stopped, or may be received during the automatic operation, and the switching operation of the filter 22 may be performed while performing the automatic operation of component mounting as described above. .

[0030]

As described above, according to the present invention, the switching means
Filter is automatically switched by changing the position of the container
Therefore, the frequency of replacing the filter manually is reduced. The automatic replacement of the filter is carried out in easy <br/> single configuration if to perform the exchange of the filter by utilizing the movement of the suction nozzle by operation of only the engagement of the switching means.

[Brief description of the drawings]

FIG. 1 is a side view showing a vacuum path of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 2 is a plan view of the mounting device.

FIG. 3 is an enlarged side sectional view of a mounting head.

FIG. 4 is a side sectional view showing a state where the cartridge is mounted.

FIG. 5 is a plan view showing a state where the cartridge is attached.

FIG. 6 is a plan view showing a state where the cartridge is attached to the rotary table.

FIG. 7 is a plan view showing a filter switching operation.

FIG. 8 is a plan view showing a filter switching operation.

FIG. 9 is a plan view showing a switching operation of a filter.

FIG. 10 is a plan view showing a filter switching operation.

FIG. 11 is a plan view showing a cartridge replacement operation.

FIG. 12 is a plan view illustrating a cartridge replacement operation.

[Explanation of symbols]

 Reference Signs List 5 Chip-shaped electronic component (electronic component) 6 Printed circuit board 14 Suction nozzle 20 Vacuum conduit 22 Filter 23 Cartridge (housing) 26 Claw portion (engaging portion) 33 Cylinder (exchange means) (switching means)

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-174396 (JP, A) JP-A-63-3491 (JP, A) JP-A-2-185327 (JP, A) 203579 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. An electronic component having an electronic component mounted on a printed circuit board by a suction nozzle for holding the electronic component by vacuum suction through a vacuum conduit communicating with a vacuum source, and having a filter for removing dust in the middle of the vacuum conduit. An automatic mounting device, comprising: a housing having a plurality of filters; and a switching means for changing the position of the housing and switching the filters. 2. An electronic component having an electronic component mounted on a printed circuit board by a suction nozzle for holding the electronic component by vacuum suction through a vacuum conduit communicating with a vacuum source and having a filter for removing dust in the middle of the vacuum conduit. In the automatic mounting device, the storage unit having a plurality of the filters, and the filter is switched by changing the position of the storage unit along with the movement of the suction nozzle by engaging with an engaging portion formed in the storage unit. An electronic component automatic mounting device comprising a switching means.