JP3424676B2 - Semiconductor device storage container and method of transporting the same - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for transporting a semiconductor storage container and a suction pad used for the same, and more particularly, to a semiconductor having a structure for transporting a storage container of a semiconductor package. The present invention relates to a storage container transfer device, a transfer method, and a suction pad used for the same. 2. Description of the Related Art A conventional semiconductor container transfer device (hereinafter, referred to as a "container container transfer device")
Semiconductor handler (hereinafter referred to as “handler”).
The transfer method of the tray) is roughly classified into a mechanical hand method and a suction hand method. As shown in FIG. 4, in the mechanical hand system, in order to separate the stacked trays 1, a notch provided at the outer end of the tray is gripped by a gripping hand, and each sheet is conveyed. It is. In the suction hand system, a tray is provided with a flat portion capable of sucking, and a suction device in which a suction pad is incorporated in the flat portion performs suction gripping and transport. FIG.
FIG. 2 is a sectional view of a suction pad system. The suspending force is determined by the pad diameter of the suction pad 7, and it is necessary to adjust the position of the suction pad 7 for each type of tray 1 or replace the entire hand. [0005] In such a mechanical hand system of the prior art, a notch for inserting the tip of the gripping hand into the outer end of the tray so that the stacked trays can be separated one by one. Parts. In addition, since the shapes and positions of the cutouts of the trays are different from each other, there is a problem that the work time for exchanging jigs at the time of switching types is increased, and the cost of manufacturing individual jigs is increased. On the other hand, in the conventional suction hand system, an opening is originally provided in an IC package storage section (hereinafter, referred to as an IC pocket) of a tray. The opening of the IC pocket is shielded. However, the position of the IC pocket that shields the opening may differ depending on the type of tray, so that it is necessary to change the jig when switching the type of IC, and there is a problem that the work time for changing the jig increases. Was. SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor package transfer apparatus and a suction pad used for the same, which can easily handle a tray transfer by such a handler without exchanging jigs and adjusting jigs by switching types. Is to do. According to the present invention, there is provided a method for transporting a semiconductor device storage container, wherein a plurality of storage sections for storing semiconductor devices are provided by using a transport device having a suction pad formed with a suction port. A method of transporting a semiconductor device storage container provided, wherein the storage unit includes a first storage unit having an opening at a bottom and an opening not provided at a bottom. A position including a second storage portion, wherein a plurality of the second storage portions are provided adjacent to each other, and the suction pad shields the plurality of storage portions and the suction port spans the plurality of storage portions. The semiconductor device housing container is sucked and transported by disposing the suction pad on the semiconductor device housing. Further, according to the method of transporting a semiconductor device storage container of the present invention, a semiconductor device having a plurality of storage sections for storing semiconductor devices is provided by using a transport device having a suction pad having a suction port. A method of transporting a semiconductor device storage container for transporting a device storage container, wherein, when transporting the semiconductor device storage container, the suction pad is arranged such that the suction pad extends over a plurality of the storage units. And [0013] By using the above-mentioned means, the tray can be sucked without sucking the flat portion of the tray. The suction pad can be closely attached without being affected by the surface shape of the IC pocket. The suspension force can be ensured by a suction pad capable of sealing one or a plurality of IC pockets. An embodiment according to the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a state where a suction hand 5 for sucking and conveying the tray 1 is sucking the tray 1. Reference numeral 3 denotes an opening of an IC pocket for checking whether or not the IC of the tray located below is stored when the trays are stacked, and for reducing the weight of the tray. The suction hand 5 comprises a suction pad 4 arranged so that a suction port is located at the center of a rectangular elastic body, and a spring 6 for pressing the suction pad 4. At this time, the suction pad 4 is connected to the IC of the tray.
IC that is in contact with the upper surface around pocket 2 and is shielded
The suction hand 5 is moved to a position where the pocket 2 is sealed, and the tray is sucked. FIG. 2 is a bird's-eye view of the tray 1. An opening 3 like an IC pocket 2 is provided for confirming whether or not the IC of the tray located below is stored when the trays are stacked, and for reducing the weight of the trays. A partially shielded IC pocket 2 is provided. The position of the shielded IC pocket 2 differs depending on the type. In the semiconductor package transport device according to the present invention, the shielded IC pocket 2 is placed around the shielded IC pocket 2 as shown in FIG. The upper surface of the tray contacts the suction pad 4 so that the suction port of the suction pad can be placed at a position where the shielded IC pocket 2 can be sucked. At this time, as the suction pad 4, a soft elastic material which can be brought into close contact with the tray 1 by a pressing force of a spring 7 of the suction hand 5 for sucking and conveying the tray 1 is used. As the soft elastic body, for example, a silicone sponge or soft silicone rubber may be used. The size of the suction pad 4 is suitably large enough to seal the largest IC pocket size A among various types of trays. The reason is that the suction pad according to the present invention obtains the suction force from the number of shielded IC pockets and its internal volume while the conventional suction pad obtains the suction force from its suction area, and therefore the IC pocket size This is because it is necessary to have a size capable of sealing the largest A. For example, in the case of an IC package having a side of 40 mm, the size A of the suction pad 4 is approximately 55 mm because the IC pocket size A is approximately 45 mm. The thickness of the silicon sponge is
The thickness is preferably about 10 mm because it depends on the pressing force of the spring 6 and the elasticity of the silicon sponge. When the dimension B between adjacent IC pockets is small and there is no suction area enough to obtain a hanging force capable of sucking and conveying the tray 1, for example, the dimension B between adjacent IC pockets is reduced to about 5 mm. Then, as shown in FIG. 5, the suction pad is arranged so as to spread over a plurality of IC pockets. At this time, the suction diameter C of the suction pad 4
About 8 mm is suitable. According to the suction pad of the present invention, even a tray having a complicated surface shape such as a tray can obtain a large suction force regardless of the suction diameter. Further, when changing the type, mechanical adjustment and jig replacement can be eliminated only by changing the position setting of the robot. For this reason, in the handler adopting the suction pad according to the present invention, it is possible to reduce the operation time at the time of product type switching. Further, even when the size between adjacent IC pockets is small and there is no suction area enough to obtain a suspending force capable of sucking and transporting the tray 1, a suction pad is provided in a plurality of IC pockets as shown in FIG. Further, since the IC pockets are arranged so as to adsorb, a large adsorbing force can be obtained from the surface area of the plurality of IC pockets.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a state in which a suction hand 5 that suctions and conveys a tray 1 suctions a tray 1 in one embodiment of the present invention. FIG. 2 is a bird's-eye view of a tray. FIG. 3 is a sectional view of a conventional suction pad system. FIG. 4 is a bird's-eye view of a conventional mechanical hand system. FIG. 5 is a schematic view showing an embodiment of the present invention, in which the size of a space between adjacent IC pockets is small and there is no suction area enough to obtain a hanging force capable of sucking and conveying the tray, It is sectional drawing which showed the place which adsorb | sucks a tray. [Description of Symbols] 1 ... Tray 2 ... Shielded IC pocket 3 ... IC pocket opening 4, 7 ... Suction pad 5 ... Suction hand 6 ... Spring

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B25J 15/06 B65D 85/00 H01L 21/68 H05K 13/02

Claims (1)

(57) Claims 1. A semiconductor device storage container provided with a plurality of storage units for storing semiconductor devices is transferred using a transfer device having a suction pad having a suction port. A method of transporting a semiconductor device storage container, wherein the storage section includes a first storage section having an opening at a bottom, and a second storage section having no opening at a bottom, and A plurality of second storage portions are provided adjacent to each other, and the suction pad shields the plurality of storage portions, and the suction pad is disposed at a position where the suction port straddles the plurality of storage portions. A method of transporting a semiconductor device storage container, wherein the storage container is sucked and transferred.