SG10201505703PA - Transfer unit - Google Patents

Transfer unit

Info

Publication number
SG10201505703PA
SG10201505703PA SG10201505703PA SG10201505703PA SG10201505703PA SG 10201505703P A SG10201505703P A SG 10201505703PA SG 10201505703P A SG10201505703P A SG 10201505703PA SG 10201505703P A SG10201505703P A SG 10201505703PA SG 10201505703P A SG10201505703P A SG 10201505703PA
Authority
SG
Singapore
Prior art keywords
transfer unit
transfer
unit
Prior art date
Application number
SG10201505703PA
Inventor
Onishi Kenta
Mantoku Kimitake
Okada Shigefumi
Urabe Hiroyuki
Watanabe Yuki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201505703PA publication Critical patent/SG10201505703PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
SG10201505703PA 2014-08-14 2015-07-22 Transfer unit SG10201505703PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014165074A JP6305272B2 (en) 2014-08-14 2014-08-14 Transport device

Publications (1)

Publication Number Publication Date
SG10201505703PA true SG10201505703PA (en) 2016-03-30

Family

ID=55302690

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201505703PA SG10201505703PA (en) 2014-08-14 2015-07-22 Transfer unit

Country Status (7)

Country Link
US (1) US9390958B2 (en)
JP (1) JP6305272B2 (en)
KR (1) KR102374913B1 (en)
CN (1) CN105374721A (en)
MY (1) MY175830A (en)
SG (1) SG10201505703PA (en)
TW (1) TWI649155B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017180602A (en) * 2016-03-29 2017-10-05 株式会社ディスコ Movable body feeding mechanism and processing device
US10373858B2 (en) * 2016-04-06 2019-08-06 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal
CN107785299A (en) * 2016-08-30 2018-03-09 上海微电子装备（集团）股份有限公司 A kind of silicon chip pick device
US9975255B1 (en) * 2016-12-15 2018-05-22 Jabil Inc. Apparatus, system and method for providing a conformable vacuum cup for an end effector
US10930542B2 (en) * 2018-02-15 2021-02-23 Applied Materials, Inc. Apparatus for handling various sized substrates
JP7202131B2 (en) * 2018-10-10 2023-01-11 株式会社ディスコ Transfer device and transfer method for plate-shaped work
JP7240414B2 (en) * 2018-12-07 2023-03-15 川崎重工業株式会社 Substrate transfer device and its operation method
JP7256685B2 (en) * 2019-05-16 2023-04-12 株式会社ディスコ Grinding equipment
JP7324667B2 (en) 2019-09-20 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment

Family Cites Families (26)

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US3720433A (en) * 1970-09-29 1973-03-13 Us Navy Manipulator apparatus for gripping submerged objects
JPH0511991Y2 (en) * 1987-04-22 1993-03-25
US4773687A (en) * 1987-05-22 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Wafer handler
USH1373H (en) * 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
JP2920454B2 (en) * 1993-06-10 1999-07-19 東京エレクトロン株式会社 Processing equipment
JPH07122888A (en) * 1993-10-25 1995-05-12 Nec Corp Transfer jig for semiconductor device
JP3797571B2 (en) * 1996-12-03 2006-07-19 Ｓｍｃ株式会社 Work suction device
US5937993A (en) * 1997-01-14 1999-08-17 Tamarac Scientific Co., Inc. Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure
JP3850951B2 (en) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
US6322116B1 (en) * 1999-07-23 2001-11-27 Asm America, Inc. Non-contact end effector
JP2001179672A (en) * 1999-12-21 2001-07-03 Mitsubishi Electric Corp Robot hand
JP2001213516A (en) * 2000-02-02 2001-08-07 Seiko Epson Corp Device and method for conveying electro-optical panel and method of manufacturing electro-optical device
JP3906089B2 (en) * 2002-02-04 2007-04-18 中村留精密工業株式会社 Adsorption pad structure for board material conveyance
ATE362653T1 (en) 2002-03-12 2007-06-15 Hamamatsu Photonics Kk METHOD FOR SEPARATING SUBSTRATES
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
JP2004153157A (en) * 2002-10-31 2004-05-27 Seiko Epson Corp Vacuum pincette and semiconductor wafer carrying method
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
JP2006013088A (en) * 2004-06-25 2006-01-12 Shinano Kenshi Co Ltd Substrate sucking and carrying device and marking device
JP5041504B2 (en) * 2005-01-06 2012-10-03 ローム株式会社 Semiconductor substrate transfer apparatus and semiconductor substrate transfer method
US7669903B2 (en) * 2007-10-11 2010-03-02 Crossing Automation, Inc. Ultra low contact area end effector
CN201102246Y (en) * 2007-11-16 2008-08-20 沈阳芯源微电子设备有限公司 Convection arm
JP2011253918A (en) * 2010-06-02 2011-12-15 Sumitomo Heavy Ind Ltd Sucking jig, suction method and substrate processing apparatus
JP2012131622A (en) * 2010-12-22 2012-07-12 Kyocera Corp Plate material suction device and plate material suction method
JP6186124B2 (en) * 2012-12-14 2017-08-23 東京応化工業株式会社 Transfer arm, transfer device, and transfer method
US8864202B1 (en) * 2013-04-12 2014-10-21 Varian Semiconductor Equipment Associates, Inc. Spring retained end effector contact pad
JP5861676B2 (en) * 2013-07-08 2016-02-16 株式会社安川電機 Adsorption structure, robot hand and robot

Also Published As

Publication number Publication date
KR102374913B1 (en) 2022-03-16
TW201618899A (en) 2016-06-01
JP6305272B2 (en) 2018-04-04
US9390958B2 (en) 2016-07-12
MY175830A (en) 2020-07-12
CN105374721A (en) 2016-03-02
TWI649155B (en) 2019-02-01
KR20160021030A (en) 2016-02-24
US20160049326A1 (en) 2016-02-18
JP2016042500A (en) 2016-03-31

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