JP5581923B2 - Support for supporting semiconductor wafer and method for supporting semiconductor wafer using support - Google Patents

Description

  The technology disclosed in this specification relates to a support for supporting a semiconductor wafer.

  In recent years, semiconductor wafers have been made thinner to improve the performance of semiconductor devices. For example, in the field of power semiconductors, it is required to reduce the loss of the semiconductor device and improve the response speed. In order to meet this demand, the semiconductor device is manufactured using a thin semiconductor wafer.

JP 2004-281475 A

  Since a thin semiconductor wafer is easily bent, it is difficult to handle the semiconductor wafer when manufacturing a semiconductor device using the thin semiconductor wafer. For example, Patent Document 1 discloses a transport device that transports a semiconductor wafer. In this transport device, the semiconductor wafer may collide with an apparatus or fall due to bending of the semiconductor wafer during transport. The semiconductor wafer may be damaged. In addition, when a semiconductor wafer is installed in the processing apparatus, the position of the semiconductor wafer cannot be accurately controlled due to the bending of the semiconductor wafer, which may make processing difficult. As described above, when a semiconductor device is manufactured from a thin semiconductor wafer, various problems arise due to the bending of the semiconductor wafer. Therefore, in this specification, it is a support device that suppresses the bending of the semiconductor wafer, and the semiconductor wafer can be processed while the semiconductor wafer is attached to the support device, and the semiconductor wafer is prevented from being damaged. Provided is a support that can carry a semiconductor wafer.

The support disclosed in this specification supports a semiconductor wafer. This support has a frame and at least three movable parts. The at least three movable parts are provided on the frame, can move forward and backward in a direction toward the center of the inner hole of the frame, and are provided at equal angular intervals around the central axis of the inner hole. Each movable part has a pair of support parts arranged with a gap in the direction in which the central axis of the inner hole of the frame extends. When each movable part is moved to the center side of the inner hole, the diameter of the circle obtained by connecting the connection parts is larger than the diameter of the semiconductor wafer to be supported.

  Note that “possible to move forward and backward in the direction toward the center of the inner hole of the frame” means that the direction in which the movable part moves forward and backward has a directional component toward the center of the inner hole of the frame. Therefore, the movable part may move back and forth obliquely with respect to the direction toward the center of the inner hole. Further, the path along which the movable part moves forward and backward may be a straight line or a curved line. For example, the movable part may rotate.

  When the semiconductor wafer is supported by the support, each movable part is moved in a direction toward the center of the inner hole in a state where the semiconductor wafer is disposed within a range surrounded by the movable part. Thereby, the outer peripheral part of the semiconductor wafer is accommodated in the gap between the pair of support parts of each movable part, and the outer peripheral part of the semiconductor wafer is supported by the pair of support parts. Since at least three movable parts are provided, the outer peripheral part of the semiconductor wafer is supported at at least three places. Since each movable part is provided at equal angular intervals around the central axis of the inner hole, the semiconductor wafer is supported by each movable part with an equal load. Thereby, the bending of a semiconductor wafer can be suppressed. Therefore, by transporting the semiconductor wafer while attached to the support, the semiconductor wafer can be transported while preventing damage to the semiconductor wafer. Further, in this support tool, the inner hole of the frame is formed at a position corresponding to the position where the semiconductor wafer is attached. For this reason, when attached to a support, both the front surface and the back surface of the semiconductor wafer are exposed. Therefore, it is possible to process both the front surface and the back surface of the semiconductor wafer with the support attached. Since the bending of the semiconductor wafer is suppressed, the semiconductor wafer can be accurately processed.

  The support described above preferably extends around the inner hole of the frame body, and further has a drive ring that can rotate relative to the frame body around the inner hole of the frame body. In this case, it is preferable that each movable part moves forward and backward in conjunction with the rotation of the drive ring. When the drive ring is at the first angle, all the movable parts are located at the first position, and when the drive ring is at the second angle, all the movable parts are located in the inner hole of the frame body more than the first position. It is preferable to be located at the second position close to the center.

According to such a configuration, all the movable parts can be simultaneously moved to the center side of the inner hole of the frame body by simply rotating the drive ring from the first angle to the second angle.
Moreover, in the support tool mentioned above , the hole extended in the direction away from the center of an inner hole may be formed in the internal peripheral surface of a frame . Each movable part may be arranged in the hole . The support may further include a tension spring that biases each movable part in a direction away from the center of the inner hole.
Moreover, the support mentioned above may be comprised as follows. In other words, the support may further include a tension spring and a drive ring. A hole extending in a direction away from the center of the inner hole may be formed on the inner peripheral surface of the frame . The tension spring, the drive ring, and each movable part may be disposed in the hole . The drive ring may extend around the inner hole and be rotatable relative to the frame around the inner hole. The tension spring may urge each movable part in a direction away from the center of the inner hole. A plurality of cam portions may be formed on the inner peripheral surface of the drive ring. When the drive ring is rotated, each movable part may be moved to the center side of the inner hole by being pushed by each cam part, and held by the end face of each cam part.
The present specification also provides a method for supporting a semiconductor wafer using any of the above-described supports. This method includes a step of supporting a semiconductor wafer between a pair of support parts of each movable part by disposing the semiconductor wafer in the inner hole and moving each movable part in a direction toward the center of the inner hole. doing. The diameter of the circle obtained by connecting the connection portions when the semiconductor wafer is supported in the step is larger than the diameter of the semiconductor wafer.

The top view of the support tool 10 before attachment of a semiconductor wafer. The enlarged view of the movable part 30 and the drive ring 20. FIG. Sectional drawing of the support tool 10 in the III-III line of FIG. Explanatory drawing of the process of attaching the semiconductor wafer 70 to the support tool 10. FIG. FIG. 4 is a cross-sectional view corresponding to FIG. 3 of the support 10 after the semiconductor wafer 70 is attached. The top view of the support tool 10 after the semiconductor wafer 70 is attached. FIG. 3 is an explanatory diagram of a method for transporting a semiconductor wafer 70 attached to a support tool 10. Explanatory drawing of the processing method of the semiconductor wafer 70 attached to the support tool 10. FIG. Explanatory drawing of the processing method of the semiconductor wafer 70 attached to the support tool 10. FIG.

The features of the examples are listed below.
(Feature 1) The diameter of the inner hole of the frame is larger than the diameter of the semiconductor wafer. The length of the inner hole in the central axis direction is larger than the thickness of the semiconductor wafer.
(Feature 2) The movable part is provided on the inner peripheral surface of the inner hole of the frame.
(Feature 3) The support includes a mechanism for moving all the movable parts forward and backward simultaneously.
(Feature 4) When all the movable parts are moved to the center side of the inner hole, the diameter of the circle obtained by connecting the connection parts is larger than the diameter of the semiconductor wafer.
(Characteristic 5) The clearance gap between the support parts of all the movable parts exists in the same position in the axial direction of an inner hole. The width of the gap is larger than the thickness of the semiconductor wafer.

  FIG. 1: has shown the top view which looked at the support tool 10 which concerns on the Example from the upper side. As shown in FIG. 1, the support tool 10 includes a frame body 12, a drive ring 20, a drive gear 26, and eight movable parts 30.

  The frame body 12 is a plate-like member having a regular octagonal outer shape. A through hole 14 having a circular cross-sectional shape is formed at the center of the frame body 12.

  The drive ring 20 is installed in a space 17 (see FIG. 3) formed inside the frame body 12. The space 17 is formed on the entire circumference of the frame body 12. The drive ring 20 has a ring shape extending along the periphery of the through hole 14. The central axis of the drive ring 20 coincides with the central axis of the through hole 14. The drive ring 20 can rotate around the central axis of the through hole 14. A convex portion 12 a is formed on the inner surface on the outer peripheral side of the space 17. The radial position of the drive ring 20 with respect to the frame body 12 is positioned by the convex portion 12a so that the central axis of the drive ring 20 and the central axis of the through hole 14 coincide. A large number of teeth are formed on a part of the outer peripheral surface of the drive ring 20. Eight cam portions 22 are formed on the inner peripheral surface of the drive ring 20. The cam portions 22 are arranged at equal angular intervals (that is, intervals of 45 degrees) around the central axis of the through hole 14. As shown in FIG. 2, the side surface 22 a of the cam portion 22 is a tapered surface that is inclined with respect to the rotation direction of the drive ring 20.

  The drive gear 26 is a spur gear and meshes with the teeth on the outer peripheral surface of the drive ring 20. The drive gear 26 rotates about an axis parallel to the central axis of the through hole 14. The central portion of the lower surface of the drive gear 26 is exposed on the lower surface of the frame body 12. An engagement hole extending in the direction of the rotation axis of the drive gear 26 is formed in the exposed portion (that is, the central portion of the lower surface of the drive gear 26). The drive gear 26 can be rotated by inserting the driver shaft into the engagement hole and rotating the driver shaft. When the drive gear 26 rotates, the drive ring 20 meshing with the drive gear 26 rotates. As a result, the cam portion 22 of the drive ring 20 moves.

  FIG. 3 shows a cross-sectional view of the support 10 taken along line III-III in FIG. As shown in FIG. 3, a lateral hole 16 is formed in the inner peripheral surface 14 a of the through hole 14 of the frame body 12. The lateral hole 16 is connected to a space 17 in which the drive ring 20 is accommodated. Eight horizontal holes 16 are formed in the inner peripheral surface 14 a of the through hole 14. Each lateral hole 16 is formed at a position corresponding to the movable portion 30 in FIG.

  As shown in FIG. 3, the movable portion 30 is installed inside the lateral hole 16. The movable portion 30 is installed at a position adjacent to the drive ring 20 on the inner peripheral side. The movable portion 30 is installed so as to be movable in the radial direction of the through hole 14. As shown in FIG. 1, the movable portions 30 are arranged at equal angular intervals (that is, 45 ° intervals) around the central axis of the through-hole 14. Further, each movable portion 30 is arranged at the same position in the central axis direction of the through hole 14. As shown in FIG. 2, tension springs 38 are installed above and below the drive ring 20. One end of the tension spring 38 is fixed to the movable part 30. The other end of the tension spring 38 is fixed to the frame body 12. The movable part 30 is biased by the tension spring 38 so as to be accommodated in the lateral hole 16. The movable portion 30 includes a base portion 30a to which a tension spring 38 is connected, and protrusions 30b and 30c that protrude from the base portion 30a to the inner peripheral side. The base portion 30a is a connecting portion that connects the protruding portions 30b and 30c to each other. The protrusion 30b and the protrusion 30c are arranged with a gap 30d in the direction of the central axis of the through hole 14. It can be said that the recessed part 30d is formed between the protrusion part 30b and the protrusion part 30c. The recess 30 d extends in the circumferential direction of the through hole 14. As shown in FIG. 2, a tapered surface 30 e that is inclined with respect to the rotation direction of the drive ring 20 is formed on the side surface of the movable portion 30.

  Next, a method for attaching a semiconductor wafer to the support 10 will be described. When the semiconductor wafer is attached to the support 10, as shown in FIG. 4, the support 10 is fixed horizontally and the lifter 80 is inserted into the through hole 14 of the support 10. Further, the driver shaft 82 is inserted into the engagement hole of the drive gear 26. Next, the semiconductor wafer 70 is placed on the lifter 80 by the transfer robot. Next, the lifter 80 lowers the semiconductor wafer 70 until it is located at substantially the same height as the movable portion 30. Next, the drive gear 26 is rotated by the driver shaft 82, and the drive ring 20 is rotated counterclockwise from the state shown in FIG. Then, the taper surface 20 a of the drive ring 20 shown in FIG. 2 contacts the taper surface 30 e of the movable portion 30, and the movable portion 30 is pushed toward the central axis side of the through hole 14. For this reason, as shown in FIG. 5, the tension spring 38 extends and the movable part 30 moves to the central axis side. Then, the outer peripheral portion of the semiconductor wafer 70 is accommodated in the concave portion 30 d of the movable portion 30. As a result, the semiconductor wafer 70 is supported. As shown in FIG. 6, the semiconductor wafer 70 is supported by eight movable parts 30 arranged at equal angular intervals. Thereby, the semiconductor wafer 70 can be supported with equal load from all directions. Therefore, the bending of the semiconductor wafer 70 can be suppressed. In the state where the semiconductor wafer 70 is supported by the support 10 (the state shown in FIGS. 5 and 6), the movable portion 30 rides on the end surface 22 b of the cam portion 22. For this reason, even if the driver shaft 28 is removed from the engagement hole of the drive gear 26, the movable portion 30 is stably held at that position against the tensile force of the tension spring 38.

  In the state shown in FIG. 4, the center of the semiconductor wafer 70 and the center of the through hole 14 may be misaligned. In this case, when the movable portion 30 is moved to the center side thereafter, the base portion 30a of a part of the movable portion 30 (that is, the bottom surface of the recess 30d) first comes into contact with the outer peripheral surface of the semiconductor wafer 70, and the movable portion 30 The misalignment is corrected by the unit 30. As a result, the center of the semiconductor wafer 70 and the center of the through hole 14 can be substantially matched. Therefore, the semiconductor wafer 70 can be accurately positioned with respect to the frame 12 and the semiconductor wafer 70 can be fixed to the support 10.

  Further, in the state where the movable part 30 is located on the most central side, the diameter of a circle obtained by connecting the bottom surfaces of the recesses 30 d of each movable part 30 is slightly larger than the diameter of the semiconductor wafer 70. Therefore, when the movable part 30 is moved toward the semiconductor wafer 70, the semiconductor wafer 70 is not compressed in the radial direction by the movable part 30. This prevents the semiconductor wafer 70 from being fixed to the support 10 in a state where stress is applied.

  When the semiconductor wafer 70 supported by the support 10 is transferred, the semiconductor wafer 70 can be transferred such that the frame 12 is in contact with the device without the semiconductor wafer 70 being in contact with the device. As a result, it is possible to prevent the semiconductor wafer 70 from being damaged and foreign matters from adhering to the semiconductor wafer 70. For example, as shown in FIG. 7, the semiconductor wafer 70 can be conveyed by a roller conveyor so that the frame 12 is in contact with the roller 90.

  Even when supported by the support 10, both the upper and lower surfaces of the semiconductor wafer 70 are exposed to the outside. Therefore, the upper and lower surfaces of the semiconductor wafer 70 can be processed while being supported by the support 10. For example, as shown in FIG. 8, a CVD method can be performed. In FIG. 8, a film is grown on the surface of the semiconductor wafer 70 by supplying a source gas from the diffuser nozzle 92 to the surface of the semiconductor wafer 70 while the semiconductor wafer 70 is supported by the support 10. In addition, as shown in FIG. 9, a metal film or the like can be formed by sputtering. In FIG. 9, in a state where the semiconductor wafer 70 is supported by the support 10, the semiconductor wafer 70 is placed on the stage 94 and sputtering is performed using the target 96, thereby growing a metal layer on the surface of the semiconductor wafer 70. ing. In this method, since the semiconductor wafer 70 can be directly heated or cooled by the stage 94, sputtering can be performed as in the conventional case. As described above, the semiconductor wafer 70 can be processed while being attached to the support 10. For this reason, the semiconductor wafer 70 can be flowed to the manufacturing process of a semiconductor device, with the support 10 attached. Therefore, according to the support 10, it is possible to process the semiconductor wafer 70 in the same manner as in the past while suppressing the bending of the semiconductor wafer 70. As described above, the bending of the semiconductor wafer 70 is suppressed by being supported by the support 10. Further, since the frame 12 has high rigidity, the position of the semiconductor wafer 70 can be accurately controlled when the semiconductor wafer 70 is installed in the processing apparatus. Therefore, the semiconductor wafer 70 can be processed accurately.

  In the above-described embodiment, the radial position of the drive ring 20 with respect to the frame body 12 is positioned by the convex portion 12 a formed on the inner surface on the outer peripheral side of the space 17. However, a roller that rotates according to the rotation of the drive ring 20 may be provided instead of the convex portion 12a. According to the roller, the drive ring 20 can be supported so as to be smoothly rotatable, and the radial position of the drive ring 20 can be positioned.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

DESCRIPTION OF SYMBOLS 10: Support tool 12: Frame 14: Through-hole 20: Drive ring 22: Convex part 26: Drive gear 30: Movable part 30a: Base part 30b: Protrusion part 30c: Protrusion part 30d: Concave part 38: Tension spring 70: Semiconductor wafer

Claims (8)

A support for supporting a semiconductor wafer,
A frame,
At least three movable parts provided in the frame body, capable of moving back and forth in a direction toward the center of the inner hole of the frame body, and provided at equal angular intervals around the central axis of the inner hole;
Have
Each movable part has a pair of support parts arranged with a gap in the direction in which the central axis of the inner hole extends, and a connection part that connects the pair of support parts to each other,
A support tool characterized in that when each movable part is moved to the center side of the inner hole, the diameter of a circle obtained by connecting the respective connection parts is larger than the diameter of the semiconductor wafer to be supported. It further extends around the inner hole, and further has a drive ring that can rotate relative to the frame around the inner hole.
In conjunction with the rotation of the drive ring, each movable part moves forward and backward,
When the drive ring is at the first angle, all the movable parts are in the first position,
When the drive ring is at the second angle, all the movable parts are located at the second position closer to the center of the inner hole than the first position.
The support according to claim 1. A hole extending in the direction away from the center of the inner hole is formed on the inner peripheral surface of the frame ,
Each moving part is arranged in the hole ,
The support according to claim 1, further comprising a tension spring that urges each movable portion in a direction away from the center of the inner hole. A tension spring and a drive ring;
A hole extending in the direction away from the center of the inner hole is formed on the inner peripheral surface of the frame ,
The tension spring, the drive ring and each movable part are arranged in the hole ,
A drive ring extends around the inner bore and is rotatable relative to the frame around the inner bore;
A tension spring urges each moving part away from the center of the inner hole,
A plurality of cam portions are formed on the inner peripheral surface of the drive ring,
2. The support according to claim 1, wherein when the drive ring is rotated, each movable portion is moved to the center side of the inner hole by being pushed by each cam portion, and is held by an end surface of each cam portion. Ingredients. A method for supporting a semiconductor wafer using a support,
The support is
A frame,
At least three movable parts provided in the frame body, capable of moving back and forth in a direction toward the center of the inner hole of the frame body, and provided at equal angular intervals around the central axis of the inner hole;
Have
Each movable part has a pair of support parts arranged with a gap in the direction in which the central axis of the inner hole extends, and a connection part that connects the pair of support parts to each other,
The method includes a step of supporting a semiconductor wafer between a pair of support portions of each movable portion by disposing the semiconductor wafer in the inner bore and moving each movable portion in a direction toward the center of the inner bore. And
A method in which a diameter of a circle obtained by connecting each connection portion when the semiconductor wafer is supported in the step is larger than a diameter of the semiconductor wafer. The support device extends around the inner hole, and further includes a drive ring that can rotate relative to the frame around the inner hole.
In conjunction with the rotation of the drive ring, each movable part moves forward and backward,
When the drive ring is at the first angle, all the movable parts are in the first position,
When the drive ring is at the second angle, all the movable parts are located at the second position closer to the center of the inner hole than the first position.
6. The method of claim 5, wherein: A hole extending in the direction away from the center of the inner hole is formed on the inner peripheral surface of the frame ,
Each moving part is arranged in the hole ,
The method according to claim 5 or 6, wherein the support further includes a tension spring that biases each movable part in a direction away from the center of the inner hole. The support further comprises a tension spring and a drive ring;
A hole extending in the direction away from the center of the inner hole is formed on the inner peripheral surface of the frame ,
The tension spring, the drive ring and each movable part are arranged in the hole ,
A drive ring extends around the inner bore and is rotatable relative to the frame around the inner bore;
A tension spring urges each moving part away from the center of the inner hole,
A plurality of cam portions are formed on the inner peripheral surface of the drive ring,
6. The method according to claim 5, wherein when the drive ring is rotated, each movable portion is moved to the center side of the inner hole by being pushed by each cam portion, and is held by the end face of each cam portion. .

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