JPH0521582A - Wafer holder - Google Patents
Wafer holderInfo
- Publication number
- JPH0521582A JPH0521582A JP3168563A JP16856391A JPH0521582A JP H0521582 A JPH0521582 A JP H0521582A JP 3168563 A JP3168563 A JP 3168563A JP 16856391 A JP16856391 A JP 16856391A JP H0521582 A JPH0521582 A JP H0521582A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holder
- outer frame
- diameter
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はウエハーホルダに関す
る。近年，シリコンウエハーは大口径化される傾向にあ
り，工場における半導体装置の量産ラインのあらゆる装
置が大口径ウエハー対応のものに変わりつつある。FIELD OF THE INVENTION This invention relates to wafer holders. In recent years, the diameter of silicon wafers has tended to increase, and all equipment in the mass production line of semiconductor devices in factories is changing to those for large diameter wafers.
【０００２】しかし，生産の柔軟性において，大口径ウ
エハー対応の装置により，これまでに使用されている，
より小さいサイズの各種のウエハーが取り扱えることが
望ましい。However, in terms of production flexibility, it has been used up to now by equipment for large diameter wafers,
It is desirable to be able to handle a variety of smaller sized wafers.
【０００３】[0003]
【従来の技術】従来，工場における半導体装置の製造で
は，製造ラインにより取り扱えるウエハーサイズが限定
されるのが一般である。したがって，ある工場の製造ラ
インは例えば６インチウエハーラインであり，ある工場
の製造ラインは例えば５インチウエハーラインであると
いった場合，お互いに異なるサイズのウエハーを融通し
あって製造を続けるということができず，製造装置の稼
働率の低下を来したり，手待ち時間の増加を来したりし
て不便であった。2. Description of the Related Art Conventionally, in the manufacture of semiconductor devices in factories, the wafer size that can be handled by a manufacturing line is generally limited. Therefore, when the manufacturing line of a certain factory is, for example, a 6-inch wafer line, and the manufacturing line of a certain factory is, for example, a 5-inch wafer line, it is possible to continue manufacturing by accommodating wafers of different sizes. However, it was inconvenient because the operating rate of the manufacturing equipment decreased and the waiting time increased.
【０００４】シリコンウエハーは大口径化される傾向に
あり，製造ラインのあらゆる装置が大口径ウエハー対応
のものに変わりつつある現状では，もし大口径ウエハー
対応の装置で，より小さいサイズのウエハーを取り扱え
れば極めて便利であり，生産性も向上する。Silicon wafers tend to have a large diameter, and under the present circumstances in which all devices on the manufacturing line are being changed to those for large diameter wafers, if the devices for large diameter wafers can handle wafers of smaller sizes. This would be extremely convenient and improve productivity.
【０００５】[0005]
【発明が解決しようとする課題】本発明は，上記の問題
に鑑み，大口径ウエハーを用いる製造ラインで，より小
さなサイズのウエハーを取り扱えるように工夫を施した
ウエハーホルダを提供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, the present invention has an object to provide a wafer holder devised so that a wafer of a smaller diameter can be handled in a manufacturing line using a large diameter wafer. To do.
【０００６】[0006]
【課題を解決するための手段】図１(a) , (b) は本発明
のウエハーホルダの平面図と断面図である。上記課題
は，被保持ウエハー４より径の大きいウエハーの外周に
等しい外周及び該被保持ウエハー４が収容可能な内周を
有するホルダ外枠１と, 該ホルダ外枠１の内周に固定さ
れた少なくとも３組のウエハー保持部を有し，各ウエハ
ー保持部は該被保持ウエハー４の端を支える爪３と, 該
爪３と該ホルダ外枠１を接続する金具２を有するウエハ
ーホルダによって解決される。1 (a) and 1 (b) are a plan view and a sectional view of a wafer holder of the present invention. The above problem is fixed to the holder outer frame 1 having an outer circumference equal to the outer circumference of a wafer having a diameter larger than that of the held wafer 4 and an inner circumference capable of accommodating the held wafer 4, and to the inner circumference of the holder outer frame 1. A wafer holder having at least three sets of wafer holders, each wafer holder having a claw 3 for supporting an end of the held wafer 4 and a metal fitting 2 for connecting the claw 3 and the holder outer frame 1 is solved. It
【０００７】また，前記ホルダ外枠１及び前記爪３は石
英製であるウエハーホルダによって解決される。Further, the holder outer frame 1 and the claws 3 are solved by a wafer holder made of quartz.
【０００８】[0008]
【作用】本発明では，ウエハーホルダの外周を被保持ウ
エハー４より径の大きいウエハーの外周に等しくしてい
る。ウエハーホルダの外周を大口径ウエハーを用いる製
造ラインで流すウエハーの外周に等しくしておくことに
より，そこに保持された径の小さいウエハーをあたかも
大口径ウエハーであるかのように見なして流すことがで
きるから，生産の融通性が高くなる。In the present invention, the outer circumference of the wafer holder is made equal to the outer circumference of the wafer having a diameter larger than that of the held wafer 4. By making the outer circumference of the wafer holder equal to the outer circumference of a wafer to be flown in a manufacturing line using a large-diameter wafer, it is possible to treat a wafer with a small diameter held therein as if it were a large-diameter wafer. As a result, production flexibility is increased.
【０００９】ウエハー保持部は被保持ウエハー４の端を
支える爪３と, 爪３とホルダ外枠１を接続する金具２を
有するから，保持しようとするウエハーのサイズに応じ
て爪３と金具２の長さを選択すれば各種のサイズのウエ
ハーに対応できる。Since the wafer holding portion has the claws 3 for supporting the end of the held wafer 4 and the metal fittings 2 for connecting the claws 3 and the holder outer frame 1, the claws 3 and the metal fittings 2 are provided according to the size of the wafer to be held. By selecting the length of, it is possible to support wafers of various sizes.
【００１０】金具２を例えばばねにして，爪３を被保持
ウエハーの端に押しつけるような構造にすれば，ウエハ
ーの挿入が簡単でしかも確実に保持できる。ウエハー保
持部を３組以上設ければ，安定に保持できる。If the metal fitting 2 is, for example, a spring and the claw 3 is pressed against the end of the held wafer, the wafer can be inserted easily and securely. If three or more sets of wafer holding parts are provided, they can be held stably.
【００１１】また，半導体装置の製造工程では高温を必
要とする工程があり，ウエハーの汚染は極力避けねばな
らない。ホルダ外枠１と爪３を石英製にすることによっ
て，それらに対処することができる。Further, in the manufacturing process of the semiconductor device, there is a process requiring high temperature, and the contamination of the wafer should be avoided as much as possible. These can be dealt with by making the holder outer frame 1 and the claws 3 from quartz.
【００１２】[0012]
【実施例】図１は本発明のウエハーホルダの平面図と断
面図であり，(a) は平面図，(b)はＡ−Ａ断面図であ
り，１はホルダ外枠，２はねじ，３は爪，４はウエハ
ー，５はオリエンテーションフラットを表す。1 is a plan view and a sectional view of a wafer holder of the present invention, (a) is a plan view and (b) is an AA sectional view, 1 is a holder outer frame, 2 is a screw, 3 is a nail, 4 is a wafer, and 5 is an orientation flat.
【００１３】一例として，６インチウエハーラインで４
インチウエハーを取り扱う場合について述べる。ホルダ
外枠１は石英製で，その外周は６インチウエハーに等し
く，外径ｄ1 は150 mm, 内径ｄ2 は140 mmである。ホル
ダ外枠の断面は５mm×５mmである。As an example, 4 in a 6 inch wafer line
The case of handling inch wafers will be described. The holder outer frame 1 is made of quartz, and the outer circumference thereof is equal to that of a 6-inch wafer, and the outer diameter d 1 is 150 mm and the inner diameter d 2 is 140 mm. The cross section of the holder outer frame is 5 mm x 5 mm.
【００１４】４インチウエハー４の径ｄW は100 mmで，
その端は３箇所で保持される。ウエハー保持部はオリエ
ンテーションフラット５に１組，その両側に約 120度の
開きをもって１組づつ配置する。爪３は石英製で，爪３
とホルダ外枠１の内周はねじ２で接続する。The diameter d W of the 4-inch wafer 4 is 100 mm,
Its ends are held in three places. One set of wafer holders is placed on the orientation flat 5, and one set is placed on each side of the flat with an opening of about 120 degrees. The nail 3 is made of quartz, and the nail 3
And the inner circumference of the holder outer frame 1 are connected with a screw 2.
【００１５】このように４インチウエハー４を保持した
ウエハーホルダを６インチウエハーラインに設置して，
製造工程に流す。ウエハーホルダは高温処理に耐える耐
熱性と，さらにウエハーを汚染しないことが要求され
る。この観点からホルダ外枠１と爪３は石英製とする。The wafer holder holding the 4-inch wafer 4 is installed on the 6-inch wafer line,
Discharge to the manufacturing process. Wafer holders are required to withstand heat at high temperatures and not to contaminate the wafer. From this viewpoint, the holder outer frame 1 and the claws 3 are made of quartz.
【００１６】ホルダ外枠１の外周と内周の径の差，ｄ1
−ｄ2 ，を１cm程度にしておき，爪３とねじ２は各種の
長さのものを予め準備しておくことにより，ホルダ外枠
１の外周と等しい外周を持つウエハーより１インチ以下
の径を持つ各種のウエハーを取り扱うことができる。The difference between the outer and inner diameters of the holder outer frame 1, d 1
-D 2 is set to about 1 cm, and the claw 3 and the screw 2 having various lengths are prepared in advance, so that the diameter is 1 inch or less than the wafer having the outer circumference equal to the outer circumference of the holder outer frame 1. Can handle various wafers with
【００１７】なお，金具２はねじを用いる他にばねを使
用してもよい。The metal fitting 2 may use a spring instead of a screw.
【００１８】[0018]
【発明の効果】以上説明したように，本発明によれば，
大口径ウエハーを取り扱う製造ラインで，より小さなサ
イズのウエハーを取り扱えるので，生産の柔軟性が上が
り，工場間でのウエハーの融通性が上がる。As described above, according to the present invention,
A manufacturing line that handles large-diameter wafers can handle smaller size wafers, increasing production flexibility and increasing wafer flexibility between factories.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明のウエハーホルダの平面図と断面図で，
(a) は平面図，(b) はＡ−Ａ断面図である。FIG. 1 is a plan view and a sectional view of a wafer holder of the present invention,
(a) is a plan view and (b) is a sectional view taken along line AA.
１はホルダ外枠 ２は金具であってねじ ３は爪 ４はウエハーであって被保持ウエハー ５はオリエンテーションフラット 1 is the outer frame of the holder 2 is a metal fitting and a screw 3 is a nail 4 is a wafer, which is a held wafer 5 is an orientation flat
Claims (2)
ハーの外周に等しい外周及び該被保持ウエハー(4) が収
容可能な内周を有するホルダ外枠(1) と, 該ホルダ外枠
(1) の内周に固定された少なくとも３組のウエハー保持
部を有し，各ウエハー保持部は該被保持ウエハー(4) の
端を支える爪(3) と, 該爪(3) と該ホルダ外枠(1) を接
続する金具(2) を有することを特徴とするウエハーホル
ダ。1. A holder outer frame (1) having an outer circumference equal to the outer circumference of a wafer having a diameter larger than that of the held wafer (4) and an inner circumference capable of accommodating the held wafer (4), and the holder outer frame.
It has at least three sets of wafer holders fixed to the inner circumference of (1), and each wafer holder has a claw (3) for supporting the end of the held wafer (4), the claw (3) and A wafer holder having a metal fitting (2) for connecting the holder outer frame (1).
英製であることを特徴とする請求項１記載のウエハーホ
ルダ。2. The wafer holder according to claim 1, wherein the holder outer frame (1) and the claw (3) are made of quartz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3168563A JPH0521582A (en) | 1991-07-10 | 1991-07-10 | Wafer holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3168563A JPH0521582A (en) | 1991-07-10 | 1991-07-10 | Wafer holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0521582A true JPH0521582A (en) | 1993-01-29 |
Family
ID=15870356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3168563A Withdrawn JPH0521582A (en) | 1991-07-10 | 1991-07-10 | Wafer holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521582A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100221651B1 (en) * | 1996-05-10 | 1999-09-15 | 윤종용 | Wafer fixing jig |
| EP1136887A2 (en) * | 2000-03-16 | 2001-09-26 | Asm Lithography B.V. | Substrate holder for lithographic apparatus |
| JP2009272464A (en) * | 2008-05-08 | 2009-11-19 | Techno Fine:Kk | Sample holding mechanism |
| JP2012060006A (en) * | 2010-09-10 | 2012-03-22 | Toyota Motor Corp | Semiconductor wafer support |
-
1991
- 1991-07-10 JP JP3168563A patent/JPH0521582A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100221651B1 (en) * | 1996-05-10 | 1999-09-15 | 윤종용 | Wafer fixing jig |
| EP1136887A2 (en) * | 2000-03-16 | 2001-09-26 | Asm Lithography B.V. | Substrate holder for lithographic apparatus |
| EP1136887A3 (en) * | 2000-03-16 | 2003-06-18 | ASML Netherlands B.V. | Substrate holder for lithographic apparatus |
| JP2009272464A (en) * | 2008-05-08 | 2009-11-19 | Techno Fine:Kk | Sample holding mechanism |
| JP2012060006A (en) * | 2010-09-10 | 2012-03-22 | Toyota Motor Corp | Semiconductor wafer support |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7121414B2 (en) | Semiconductor cassette reducer | |
| US6086127A (en) | Method of making a carrier for at least one wafer | |
| US7717481B2 (en) | High temperature robot end effector | |
| US20050110292A1 (en) | Ceramic end effector for micro circuit manufacturing | |
| US8382180B2 (en) | Advanced FI blade for high temperature extraction | |
| JPH0521582A (en) | Wafer holder | |
| JP2004022571A (en) | Wafer supporting tool and semiconductor device manufacturing method using the same | |
| JPH06151550A (en) | Wafer fork | |
| US20040100110A1 (en) | Ceramic end effector for micro circuit manufacturing | |
| US9478697B2 (en) | Reusable substrate carrier | |
| JPS58108735A (en) | Basket for vertical type reaction tube | |
| US20050133073A1 (en) | Substrate carrier for receiving and retaining in position a planar element | |
| JP3693470B2 (en) | Manufacturing method and manufacturing apparatus for silicon wafer with protective film | |
| JPH07142561A (en) | Wafer holder | |
| JPS59191327A (en) | Heat-treatment jig | |
| JP7347071B2 (en) | Board fixing device and board fixing method | |
| JP3063116B2 (en) | Chemical vapor deposition method | |
| JPS6139544A (en) | Wafer holder | |
| JPS6038018B2 (en) | Reduced pressure heat treatment furnace for semiconductor wafers | |
| JPH01283942A (en) | Semiconductor-substrate holding tool | |
| KR200169512Y1 (en) | Wafer boat for semiconductor deposition apparatus | |
| JPS60109219A (en) | Gas-phase reaction device | |
| JPH04158507A (en) | Semiconductor device substrate and its handling | |
| JPS624336A (en) | Wafer boat transporting jig | |
| JPH11186179A (en) | Wafer accommodating tube and wafer transferring method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981008 |