JPH07142561A - Wafer holder - Google Patents

Abstract

PURPOSE:To convey a wafer without contamination or chipping and also to efficiently convey and control a wafer even in the case of either batch processing or single wafer processing. CONSTITUTION:A wafer holder 10 has a frame body 11 formed in the shape of a ring having a larger circumference than that of a wafer 1 and having a larger thickness than at least that of the wafer 1. The frame body 11 has a holding part 13 extended from the inside of the frame body 11 nearly toward the center of the frame body 11 to detachably hold the circumferential edge of the wafer 1. In the holder 10, the wafer 1 is surely and stably held to the inside of the frame body 11 with the holding part 13, and the frame body 11 is used as a grasping part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer holder used in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art Conventionally, wafers are produced in large quantities in a small variety, and for example, a 6-inch wafer is produced.
Several tens of lots were produced with 25 sheets as one lot.
Then, the produced wafers are vertically placed on the wafer carrier by the number of one lot, and then, together with the wafer carrier, the carrier box 5 shown in FIGS.
It was stored in 0 and was transported or managed with the lid 51. An entry field 52 for entering a lot management code is provided on the upper surface of the lid 51 of the carrier box 50. By entering required management information in the entry field 52, the wafer 1 can be managed for each lot. It was being appreciated.

Further, when the wafers 1 are transferred between the wafer carrier and the semiconductor manufacturing apparatus, for example, a handling arm 53 having a substantially U-shape in plan view as shown in FIG. 11 is used, and the wafer is mounted on the handling arm 53. The method of placing and transporting the back side of No. 1 with the back side facing downward has been adopted.

[0004]

However, in the transfer of the wafer 1 using the above-mentioned handling arm 53, the handling arm 53 directly contacts the back surface of the wafer 1. For this reason, dust attached to the handling arm 53 adheres to the back surface of the wafer 1, and when a plurality of wafers 1 are vertically placed and processed, the dust is transferred to the surface of another adjacent wafer 1. It was sometimes polluted.

In addition, recently, the production form of the wafer 1 has tended to be many kinds and a small amount, and the size of the wafer 1 is 8 inches and 12 inches.
The diameter is increasing to inch. As a result, the number of wafers 1 in one lot greatly varies from several wafers to several tens of wafers, and there arises a problem that the efficiency decreases in the conventional transport and management of 50 carrier boxes each having a constant size and storage amount. Was there.

Further, as the wafers 1 are manufactured in high-mix low-volume production, batch transfer for each carrier box 50 is performed between semiconductor production processes, and single wafer transfer is performed within one process. However, as the size of the wafer 1 increases and the weight also increases, it becomes difficult to hold the wafer 1 by the above-mentioned handling arm 53, and in addition, during the batch transfer, the chipping of the wafer 1 due to the rubbing between the wafer carrier and the wafer 1 occurs. There were also problems such as increasing opportunities for The present invention has been made in view of the above problems, and it is possible to transfer wafers without causing contamination or chipping, and perform efficient transfer and management in both batch type and single wafer type. It is an object of the present invention to provide a wafer holding device capable of performing the above.

[0007]

In order to solve the above-mentioned problems, a wafer holding device of the present invention is a frame body having an inner portion larger than the outer periphery of the wafer and at least larger than the thickness of the wafer, and its frame. The holder is extended from the inside of the body toward the substantial center of the frame, and includes a holding portion for detachably holding the peripheral edge of the wafer. Further, in the above-mentioned invention device, the holding portion is composed of a pair of support pieces on the front end side thereof and a concave portion for fitting the peripheral edge of the wafer, and at least the support piece is flexible. It is made of a flexible material.

Further, in the above invention device, at least three holding portions are formed in the frame body. Further, in the above-mentioned invention device, the frame body is provided with an engaging protrusion on one side in a direction substantially orthogonal to the holding portion, and on the opposite side of the frame body from the engaging protrusion, A fitting insertion hole into which a fitting protrusion having the same shape as that of the fitting protrusion can be inserted is formed.

[0009]

According to the present invention, since one wafer is securely held inside the frame of one holding device, and the frame is used as a gripping portion, the wafer is kept clean. Sheets are conveyed and managed in the state without chipping. Further, the holding portion is composed of a pair of support pieces and a concave portion, and at least the support piece is formed of a flexible material, so that the wafer can be pressed into the concave portion from any direction by pressing the wafer from any direction. The peripheral edge is easily fitted. Further, since at least three holding portions are formed, the wafer is securely and stably held inside the frame body. Further, by providing the frame with the engagement protrusions and the insertion holes, it is possible to engage the required number of holding devices, and it is possible to carry, manage and process the required number of wafers in one lot.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a wafer holding device according to the present invention will be described below with reference to the drawings. 1 is a plan view of a first example of a wafer holding apparatus of the present invention, and FIG. 2 is a sectional view taken along line XX ₁ in FIG. This wafer holding device 10
11 is a frame body, and the inside of the frame body 11 is formed, for example, in an annular shape larger than the outer periphery of the wafer 1 held by the holding device 10. The frame body 11 is formed to have a thickness that is at least larger than the thickness of the wafer 1. Further, the frame 11 is provided with an entry field 12 for entering management information of the wafer 1.

On the other hand, inside the frame body 11, at least three holding portions 13 for detachably holding the peripheral edge of the wafer 1 are provided. Each of the holding portions 13 extends from the inside of the frame body 11 toward substantially the center of the frame body 11. In this embodiment, the holding portions 13 are arranged at, for example, three positions on the inner circumference of the frame body 11. It is arranged. Further, one of the three holding portions 13 is formed to be slightly longer than the other two for holding the orientation flat 1a of the wafer 1.

Further, the holding portion 13 is formed, for example, as shown in FIG. 3, so that the tip side thereof holds the peripheral edge of the wafer 1. That is, the tip side of the holding portion 13 is, for example, vertically branched, and is constituted by a pair of support pieces 13a and a recess 13b formed between the support pieces 13a for fitting the peripheral edge of the wafer 1. Further, among the holding portions 13, at least a pair of support pieces 13a is made of a flexible material,
The wafer 1 is configured to be easily supported by fitting the peripheral edge of the wafer 1 into the recess 13b and pressing the wafer 1 from above or below.

For example, as shown in FIG. 3A, the holding portion 1
The tip side of 3 is formed in a substantially V-shaped cross section, and in a state where the wafer 1 is not supported, the pair of support pieces 13a is formed so that the recess 13b faces slightly upward so that the peripheral edge of the wafer 1 can be easily fitted. . When the wafer 1 whose peripheral edge is fitted in the concave portion 13b is pressed downward, the pair of support pieces 13a rotate about their roots to support the peripheral edge of the wafer 1 from above and below. It is formed to be stable at.

When such a holding device 10 is used, first, the peripheral edge of the wafer 1 is fitted into the concave portions 13b of the holding portions 13, respectively. At this time, the orientation flat 1a of the wafer 1 is fitted into the concave portion 13b of the holding portion 13 formed to be slightly longer than the others. As described above, since the frame body 11 has a ring shape larger than the outer circumference of the wafer 1, the wafer 1 is arranged at a position corresponding to the inside of the frame body 11 in this state. Then, the wafer 1 is pressed downward. Then, as described above, the peripheral edge of the wafer 1 is supported by the support piece 13a, and
The wafer 1 is easily held inside the frame 11.

At this time, since at least three holding portions 13 are provided, the wafer 1 is reliably and stably supported without moving during transfer. Also, at least the support piece 1
Since 3a is formed of a flexible material, the generation of dust due to rubbing when supporting the wafer 1 can be reduced. Further, since the frame body 11 is formed to have a thickness larger than that of the wafer 1, the wafer 1 is arranged between the upper surface and the lower surface of the frame body 11 in a state where the frame body 11 is placed horizontally, and the wafer 1 has only a peripheral edge. Instead, both surfaces are protected by the frame 11.

In the holding device 10 for holding the wafer 1 as described above, the frame body 11 is used as a grip portion, and the wafer 1 held inside the frame body 11 does not come into direct contact with a handling arm or the like. Single-wafer transportation and management.
That is, the wafer 1 is transferred and managed individually while maintaining the cleanliness. Therefore, if this holding device 10 is used, chipping and contamination of the wafer 1 during transfer can be reliably prevented.

Further, in this embodiment, one of the three holders 13 is used for holding the orientation flat 1a of the wafer 1. Therefore, by using the holding device 10, the orientation flat 1a can be easily positioned. Becomes Further, in this embodiment, since the frame 11 is provided with the entry column 12 for entering the management information of the wafer 1, it is possible to manage the information for each wafer 1 individually. This is particularly effective in recent years when the wafer 1 has a large diameter and a large amount of information tends to be incorporated in one wafer 1.

FIG. 4 is a plan view showing another example of the wafer holding apparatus of the present invention, and FIG. 5 is a sectional view taken along line YY ₁ in FIG. This holding device 20 differs from the above-described embodiment in that the frame 11 has a frame 11 of another holding device 20.
And a locking protrusion 24 for locking the
That is, the fitting insertion holes 25 into which the engagement protrusions 24 having the same shape as that of FIG.

That is, the engaging protrusion 24 is provided on one side in a direction substantially orthogonal to the holding portion 13 of the frame body 11. In this embodiment, the engaging protrusions 24 are provided on the upper surface of the frame body 11 in a state where the frame body 11 is placed horizontally, for example, and are arranged at positions corresponding to the three holding portions 13, respectively. The engaging protrusion 24 may be formed integrally with the frame body 11 or may be formed separately from the frame body 11 and attached to the frame body 11.

Further, the fitting insertion hole 25 is used for the engaging protrusion 2 of the frame body 11.
It is formed on the side opposite to 4. In this embodiment, for example, the fitting insertion holes 25 are formed on the lower surface of the frame body 11 in a state where the frame body 11 is placed horizontally, and three fitting insertion holes 25 are provided at positions corresponding to the engaging protrusions 24. In addition, the fitting insertion hole 25 is formed, for example, in such a size that the entire engaging protrusion 24 is fitted and inserted.

In this holding device 20, it is possible to use the holding device 20 by itself as in the above-mentioned embodiment, and the frame 11
A plurality of holding devices 2 are inserted by inserting the respective engaging protrusions 24 of the above into the respective fitting holes 25 of the frame 11 of the other holding device 20.
It is possible to tie 0 continuously. At this time, the engaging protrusion 2 at a position corresponding to the holding portion 13 for the orientation flat 1a.
If the positions of 4 are aligned, a plurality of wafers 1 are arranged in one direction. Therefore, if such a holding device 20 is used, the required number of wafers 1
It becomes possible to collectively transport and manage as a lot.

FIG. 6 is a schematic view showing an example of use of such a holding device 20, showing a case where a plurality of holding devices 20 constitute a cassette case for transportation.
When the cassette case for transportation is configured, as described above, the engaging protrusions 24 of the frame body 11 are fitted into the fitting insertion holes 25 of the frame body 11 of the other holding device 20 to make a plurality of insertion holes. The holding device 20 is attached vertically. Then, the plurality of holding devices 20 are attached to the first side plate 26 so that the plurality of holding devices 20 thus attached can be more stably transported.
The holding spring 30 is sandwiched between the first side plate 26 and the second side plate 28, and the holding spring 30 is attached between the first side plate 26 and the second side plate 28.

That is, the first side plate 26 has, on one surface thereof, a protrusion 27 sized to fit in the fitting hole 25 of the frame 11.
Is provided and is arranged along the frame body 11 in a state in which the protrusion 27 is fitted into the fitting insertion hole 25 of the frame body 11 of the outermost holding device 20 of the plurality of holding devices 20 in the vertical installation state. To be done. Further, the second side plate 28 has a hole 29 for inserting the engaging protrusion 24 of the frame body 11 formed on one surface thereof.
The engaging protrusion 24 of the frame 11 on the side opposite to the side plate 26 of the hole 2
It is arranged along the frame body 11 in a state of being inserted into the frame 9.

The holding spring 30 is formed, for example, by bending both ends of the holding spring 30 inward, and extends over the first side plate 26 and the second side plate 28, respectively.
Moreover, it can be attached to the top and bottom respectively. And by this, the engagement state of the first side plate 26, the plurality of holding devices 20, and the second side plate 28 is reliably maintained.

As described above, according to the holding apparatus 20 of this embodiment, it is possible to configure, carry and manage a cassette case for carrying when a required number of wafers 1 are set as one lot. Therefore, it is possible to handle both batch transfer and single-wafer transfer, and it is possible to dramatically improve the transfer and management efficiency as compared with a conventional carrier box with a fixed storage amount. Also, one holding device 2
Since one wafer 1 is held at 0, the cassette case can be configured, transported, and managed while the cleanliness of the wafer 1 is maintained.

FIG. 7 is a plan view showing another example of the wafer holding apparatus of the present invention, and FIG. 8 is a sectional view taken along line ZZ ₁ in FIG. The holding device 30 differs from the holding device 20 of FIG. 4 in that the engaging protrusion 44 provided on the frame 11 is formed longer than the engaging protrusion 24 of the holding device 20.
In addition, the fitting insertion hole 45 is formed in a size into which the tip end portion of the engaging protrusion 44 is fitted and inserted. That is, the attachment stem 44
Is formed to have a predetermined length so that a predetermined gap is formed between the adjacent holding devices 30 when the plurality of holding devices 30 are engaged with each other.

Then, similarly to the above-mentioned embodiment, it is provided on one side in a direction substantially orthogonal to the holding portion 13 of the frame body 11. 7 and 8 show the case where the engaging protrusions 44 are arranged at positions corresponding to, for example, the three holding portions 13 as in the above embodiment. In addition, the engaging protrusion 44 is the frame 11
In either case, it may be formed integrally with the frame body 11 or may be formed separately from the frame body 11 and attached to the frame body 11. Further, the fitting insertion holes 45 are formed on the side of the frame 11 opposite to the engaging protrusions 44, and three fitting insertion holes 45 are provided at positions corresponding to the engaging protrusions 44. Further, unlike the above-described embodiment, the fitting insertion hole 45 is formed in such a size that the tip end portion of the engaging projection 44 is fitted therein.

In this holding device 40, the tips of the engaging protrusions 44 of the frame 11 are fitted into the fitting holes 45 of the frame 11 of the other holding device 40, whereby a plurality of holding devices 40 are inserted.
Can be fastened at predetermined intervals. Therefore, if such a holding device 40 is used, the required number of wafers 1
It is possible to perform the same processing on each wafer 1 at a time in the state of collecting the above.

FIG. 9 is a schematic view showing a usage example of such a holding device 40, and shows a case where a cleaning jig is constituted by a plurality of holding devices 40. When configuring the cleaning jig, a plurality of engaging projections 44 of the frame body 11 are inserted into the respective fitting insertion holes 45 of the frame body 11 of the other holding device 40 as described above, and a plurality of them are formed. The holding device 40 is attached vertically with a predetermined interval. Then, the plurality of holding devices 40 are sandwiched between the third side plate 31 and the fourth side plate 33 from both sides so that the plurality of holding devices 40 thus engaged can be more stably engaged. The holding spring 30 is attached across the third side plate 31 and the fourth side plate 33.

The third side plate 31 has a frame 1 on one surface thereof.
The projection 32 has a size that fits in the first insertion hole 45. Then, the plurality of holding devices 40 in the vertically placed state are arranged along the frame body 11 in a state where the protrusion 32 is fitted into the fitting hole 45 of the frame body 11 of the outermost holding device 40. Further, the fourth side plate 33 is formed with a hole portion 34 on one surface for inserting the engaging protrusion 44 of the frame body 11. Then, the engaging protrusion 44 of the frame body 11 on the side opposite to the third side plate 31
Is inserted into the hole 34 and is arranged along the frame 11.

Further, the holding spring 30 is constructed in the same manner as in the above-mentioned embodiment, and is attached to the third side plate 31 and the fourth side plate 33, respectively, and is attached vertically. The holding spring 30 ensures that the engagement state of the third side plate 31, the plurality of holding devices 40, and the fourth side plate 33 is maintained. As described above, according to the holding device 40 of this embodiment, since the plurality of holding devices 40 can be attached to each other at a predetermined interval, a plurality of wafers 1 can be transferred and managed, and at the same time, a special wafer can be transferred. Processing such as cleaning can be performed at once without using a jig or the like. In this example,
The engaging protrusions 24 and 44 and the fitting insertion holes 25 and 45 are respectively 3
Although the case of providing three is described, it goes without saying that the invention is not limited to this.

[0032]

As described above, according to the present invention, 1
Since one wafer is securely held inside the frame of one holding device and the frame can be used as a grip portion, chipping is caused while maintaining the cleanliness of the wafer. It can be transported and managed without a single sheet. Further, by forming at least the support piece of the holding portion with a flexible material, the wafer can be easily held by the holding portion while maintaining the cleanliness.

Further, since at least three holding portions are formed, the wafer is securely and stably held inside the frame body, so that chipping of the wafer during transportation can be surely prevented. You can Further, by providing the frame with the engaging protrusion and the insertion hole, the required number of holding devices can be attached, and the required number of wafers can be
It becomes possible to transport, manage and process as a lot. Therefore, if the holding device of the present invention is used, chipping and contamination of the wafer during transfer can be reliably prevented. Further, it is possible to handle both batch transfer and single-wafer transfer, and it is possible to dramatically improve the transfer and management efficiency.

[Brief description of drawings]

FIG. 1 is a plan view of a first example of a wafer holding device of the present invention.

2 is a X-X ₁ line sectional view in FIG.

FIG. 3 is an enlarged view of an example of a holding unit.

FIG. 4 is a plan view of a second example of the wafer holding device of the present invention.

5 is a sectional view taken along line YY ₁ in FIG.

FIG. 6 is a schematic diagram showing an example of use of the holding device of the second example.

FIG. 7 is a plan view of a third example of the present invention.

8 is a sectional view taken along line ZZ ₁ in FIG.

FIG. 9 is a schematic diagram showing an example of use of the holding device of the third example.

FIG. 10 is a diagram illustrating a conventional stored state of wafers.

FIG. 11 is an explanatory diagram showing conventional wafer transfer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer 10, 20, 40 Holding device 11 Frame body 13 Holding part 13a Support piece 13b Recessed part 24, 44 Engagement protrusion 25, 45 Fitting hole

Claims (4)

[Claims] 1. A wafer having a thickness larger than the outer circumference of the wafer and at least larger than the thickness of the wafer, and the wafer extending from the inside of the frame toward the substantial center of the wafer. A holding device for holding the peripheral edge of the wafer detachably. 2. The holding portion is formed by a pair of support pieces on the front end side thereof and a recess for fitting the peripheral edge of the wafer, and the support piece is at least flexible. The wafer holding device according to claim 1, wherein the wafer holding device is formed of the above material. 3. The holding portion has at least 3 parts on the frame body.
3. The wafer holding device according to claim 1 or 2, wherein the wafer holding device is formed of three layers. 4. The engaging protrusion is provided on the frame body on one side in a direction substantially orthogonal to the holding portion, and the engaging protrusion is provided on the opposite side of the frame body from the engaging protrusion. 4. The wafer holding device according to claim 1, wherein the engaging protrusion having the same shape as the attaching protrusion is formed with a fitting insertion hole.