JP2022013654A - Inspection device and inspection method - Google Patents

Abstract

To provide an inspection device and an inspection method, which suppress collapse of a stage.SOLUTION: An inspection device comprises: a probe card having a probe contacted to an inspected body; an upper module having a mounting part for mounting the inspected body; a movement mechanism that can move the upper module to a horizontal direction while supporting the upper module so as to be lifted; and a lifting mechanism that is provided to a lower side of the movement mechanism, and can push up the upper module toward the probe card. An axis of a point of action of a pressing force when pushing up the upper module by the lifting mechanism and an axis of a point of action of a loading received by the probe card are arranged at a common position.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to an inspection device and an inspection method.

A wafer on which an electronic device is formed or a carrier on which an electronic device is placed is placed on a stage, and a probe provided on a probe card is brought into contact with an electrode of the electronic device to improve the electrical characteristics of the electronic device. Inspection devices for inspection are known.

Patent Document 1 describes the substrate inspection interface of a substrate inspection apparatus having an inspection unit for inspecting the electrical characteristics of a semiconductor device formed on a substrate and a substrate inspection interface arranged above the inspection unit. In a substrate abutting device for a probe card that abuts the substrate on the probe card, a transfer mechanism that conveys the substrate together with a plate-shaped member to a position facing the probe card, and the substrate conveyed by the transfer mechanism are described. After moving toward the probe card together with the plate-shaped member to bring the plurality of electrodes of the semiconductor device provided on the substrate into contact with the plurality of probes provided on the probe card, the substrate is further attached to the plate. A contact mechanism that moves a predetermined amount toward the probe card together with the probe card, and a plurality of electrodes of the semiconductor device and a plurality of probes of the probe card by reducing the pressure in the space between the probe card and the plate-shaped member. To a probe card characterized by having a holding mechanism for holding the contact state with the probe card, and a desorption mechanism for separating the transport mechanism from the plate-shaped member after holding the contact state by the holding mechanism. The substrate abutting device of the above is disclosed.

Japanese Unexamined Patent Publication No. 2014-29916

By the way, when the probe is brought into contact with the outer peripheral portion of the wafer or carrier, an offset occurs between the center of gravity of the press load from the probe card and the center of the stage supporting the probe, which may cause the stage to fall.

In one aspect, the present disclosure provides an inspection device and an inspection method for suppressing the collapse of a stage.

In order to solve the above problems, according to one embodiment, a probe card having a probe that abuts on the inspected object, an upper module having a mounting portion on which the inspected object is placed, and the upper module are moved up and down. It is provided with a moving mechanism capable of supporting the upper module in a horizontal direction and capable of moving the upper module in a horizontal direction, and an elevating mechanism provided under the moving mechanism and capable of pushing the upper module toward the probe card. An inspection device is provided in which the axis of the action point of the pushing force when the elevating mechanism pushes up the upper module and the action point of the load received by the probe card are arranged at a common position.

According to one aspect, it is possible to provide an inspection device and an inspection method for suppressing the collapse of the stage.

The sectional schematic diagram explaining the structure of the inspection apparatus which concerns on 1st Embodiment. The schematic diagram explaining the movable connection mechanism. A flowchart showing an example of the operation of the inspection device. FIG. 6 is a schematic cross-sectional view after horizontal movement when inspecting an electronic device in a central portion of a carrier in the inspection device according to the first embodiment. The sectional schematic view at the time of inspection of the electronic device of the carrier central part in the inspection apparatus which concerns on 1st Embodiment. FIG. 6 is a schematic cross-sectional view after horizontal movement when inspecting an electronic device on the outer peripheral portion of a carrier in the inspection device according to the first embodiment. The schematic cross-sectional view at the time of inspection of the electronic device of the outer peripheral part of a carrier in the inspection apparatus which concerns on 1st Embodiment. FIG. 3 is a schematic cross-sectional view after horizontal movement when the probe is brought into contact with the central portion of the needle grinding plate in the inspection device according to the first embodiment. FIG. 3 is a schematic cross-sectional view when the probe is brought into contact with the central portion of the needle grinding plate in the inspection device according to the first embodiment. FIG. 3 is a schematic cross-sectional view after horizontal movement when the probe is brought into contact with the outer peripheral portion of the needle grinding plate in the inspection device according to the first embodiment. FIG. 3 is a schematic cross-sectional view when the probe is brought into contact with the outer peripheral portion of the needle grinding plate in the inspection device according to the first embodiment. Schematic diagram of a cross section at the time of inspection of an electronic device in the center of a carrier in the inspection device according to a reference example. The schematic cross-sectional view at the time of inspection of the electronic device of the outer peripheral part of a carrier in the inspection apparatus which concerns on a reference example. Schematic diagram of a cross section when the probe is brought into contact with the central portion of the needle grinding plate in the inspection device according to the reference example. Schematic diagram of a cross section when the probe is brought into contact with the outer peripheral portion of the needle grinding plate in the inspection device according to the reference example. FIG. 6 is a schematic cross-sectional view after horizontal movement when inspecting an electronic device at the center of a carrier in the inspection device according to the second embodiment. The schematic cross-sectional view at the time of inspection of the electronic device of the carrier central part in the inspection apparatus which concerns on 2nd Embodiment. The sectional schematic diagram explaining the structure of the inspection apparatus which concerns on 3rd Embodiment. The plan view explaining the structure of the inspection apparatus which concerns on 4th Embodiment. The sectional schematic diagram explaining the structure of the inspection apparatus which concerns on 4th Embodiment. An exploded perspective view of the inspection device according to the fourth embodiment. FIG. 6 is a schematic cross-sectional view at the time of inspection of the electronic device in the central portion of the carrier in the inspection apparatus according to the fourth embodiment.

Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same components may be designated by the same reference numerals and duplicate explanations may be omitted.

The inspection device 1 according to the first embodiment will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view illustrating the configuration of the inspection device 1 according to the first embodiment.

The inspection device 1 is a device that inspects the electrical characteristics of each of the plurality of electronic devices arranged on the carrier (inspected body) C. The carrier C includes a wafer, a glass substrate, a single chip, and the like.

The inspection device 1 has a probe chamber 2. A probe card 3 is arranged in the upper part of the probe chamber 2. The probe card 3 has a plurality of probes 4. A stage base 10 is provided in the lower part of the probe chamber 2. In the probe chamber 2, a Y stage 20, an X stage 30, an upper Z stage 40, a θ stage 41, a chuck 42, a lower camera 43, a needle polishing plate support stage 50, and a needle polishing plate 51 are provided.

The Y stage 20 moves the chuck 42 and the needle grinding plate 51 in the Y-axis direction. The Y stage 20 is mounted on the stage base 10 via the linear guide 21. The linear guide 21 has, for example, a guide rail provided on the upper surface of the stage base 10 and extending in the Y-axis direction, and a slider provided on the lower surface of the Y stage 20 and sliding along the guide rail. As a result, the Y stage 20 is configured to be movable in the Y direction.

The Y drive mechanism 22 drives the Y stage 20 in the Y direction. The Y drive mechanism 22 includes, for example, a motor and a rotary linear motion mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion motion. The operation of the motor of the Y drive mechanism 22 is controlled by the control device 80.

The detection unit 23 detects the Y-direction position of the Y stage 20, in other words, the Y-direction position of the chuck 42 and the needle grinding plate 51. The detection unit 23 is, for example, an encoder that detects the rotation of the motor of the Y drive mechanism 22, and the detection signal of the detection unit 23 is transmitted to the control device 80. The control device 80 calculates the position of the Y stage 20 in the Y direction based on the detection signal of the detection unit 23.

The Y stage 20 is formed in a frame shape and has an opening 25 penetrating in the Z-axis direction.

The X stage 30 moves the chuck 42 and the needle grinding plate 51 in the X-axis direction. The X stage 30 is mounted on the Y stage 20 via the linear guide 31. The linear guide 31 has, for example, a guide rail provided on the upper surface of the Y stage 20 and extending in the X-axis direction, and a slider provided on the lower surface of the X stage 30 and sliding along the guide rail. As a result, the X stage 30 is configured to be movable in the X direction.

The X drive mechanism 32 drives the X stage 30 in the X direction. The X drive mechanism 32 includes, for example, a motor and a rotary linear motion mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion motion. The operation of the motor of the X drive mechanism 32 is controlled by the control device 80.

The detection unit 33 detects the X-direction position of the X stage 30, in other words, the X-direction position of the chuck 42 and the needle grinding plate 51. The detection unit 33 is, for example, an encoder that detects the rotation of the motor of the X drive mechanism 32, and the detection signal of the detection unit 33 is transmitted to the control device 80. The control device 80 calculates the position of the X stage 30 in the X direction based on the detection signal of the detection unit 33.

The X stage 30 has two openings penetrating in the Z-axis direction. A guide 35 and a guide 36 are provided in the two openings, respectively.

The upper Z stage 40 is supported so that it can be inserted and removed in the Z-axis direction by restricting movement in the X-axis direction and the Y-axis direction by the guide 35. As a result, the upper Z stage 40 is configured to be movable in the vertical direction with respect to the X stage 30.

A θ stage 41, a chuck 42, and a lower camera 43 are provided on the upper Z stage 40. The θ stage 41 has a function of rotating the chuck 42 with the Z axis as the rotation axis. The θ drive mechanism (not shown) that rotates the θ stage 41 is controlled by the control device 80. The chuck 42 mounts the carrier C. The chuck 42 has a fixing mechanism (not shown) for fixing the carrier C to the chuck 42. This prevents the carrier C from being displaced relative to the chuck 42. The lower camera 43 is provided on the side surface of the chuck 42. It moves and rotates with the chuck 42.

The needle grinding plate support stage 50 is supported so that it can be inserted and removed in the Z-axis direction by restricting movement in the X-axis direction and the Y-axis direction by the guide 36. As a result, the needle grinding plate support stage 50 is configured to be movable in the vertical direction with respect to the X stage 30.

A needle polishing plate 51 is provided on the needle polishing plate support stage 50. The needle polishing plate 51 abuts the tip of the probe 4 and polishes the tip of the probe 4.

The stage base 10 has an opening 15 that penetrates in the Z-axis direction. A guide 61 is provided in the opening 15.

The lower Z stage 60 is supported by a guide 61 so as to be movable in the X-axis direction and the Y-axis direction and can be inserted and removed in the Z-axis direction. As a result, the lower Z stage 60 is configured to be movable in the vertical direction with respect to the stage base 10.

The Z drive mechanism 62 drives the lower Z stage 60 in the Z direction. The Z drive mechanism 62 includes, for example, a motor and a rotary linear motion mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion motion. The operation of the motor of the Z drive mechanism 62 is controlled by the control device 80.

Here, when the probe 4 is brought into contact with the carrier C or the needle grinding plate 51 mounted on the chuck 42, the position of the center of gravity of the press load of the probe card 3 and the position of the center of gravity of the press load of the lower Z stage 60 are on the same axis. (See FIGS. 5, 7, 9 and 11 described later). In other words, the axes of the action point of the pushing force when the lower Z stage 60 pushes up the upper Z stage 40 and the action point of the load received by the probe card 3 are arranged at a common position. Here, the fact that the axes are common means that they are coaxial (the axes match) and that they almost match (in the same direction). For example, the central axis of the probe card 3 and the central axis of the lower Z stage 60 are common. Further, the central axis of the probe card 3 and the central axis of the ball screw of the Z drive mechanism 62 are common.

The detection unit 63 is located at the X-direction position of the lower Z stage 60, in other words, the needle polishing plate 51 connected to the chuck 42 provided on the upper Z stage 40 connected to the lower Z stage 60 or the needle polishing plate support stage 50. Detects the Z-direction position of. The detection unit 63 is, for example, an encoder that detects the rotation of the motor of the Z drive mechanism 62, and the detection signal of the detection unit 63 is transmitted to the control device 80. The control device 80 calculates the Z direction position of the lower Z stage 60 based on the detection signal of the detection unit 63.

The load cell 64 detects the load received by the lower Z stage 60. The detection signal of the load cell 64 is input to the control device 80. Instead of the load cell 64, a torque sensor that detects the torque of the Z drive mechanism 62 may be used. Further, in the case of feedback control of the detected load, the control device 80 simultaneously performs the position control and the load control.

A movable connecting mechanism 71 is provided in the lower portion of the upper Z stage 40. The movable connection mechanism 71 releases the connection between the upper Z stage 40 and the lower Z stage 60 and the connection between the upper Z stage 40 and the lower Z stage 60, and the upper Z stage 40 can move and move on the stage base 10. It is configured so that it can be switched between the movable state and the movable state.

A movable connecting mechanism 72 is provided at the lower part of the needle grinding plate support stage 50. In the movable connection mechanism 72, the connection state in which the needle polishing plate support stage 50 and the lower Z stage 60 are connected and the connection between the needle polishing plate support stage 50 and the lower Z stage 60 are released, and the needle polishing plate support stage 50 is staged. It is configured to be able to switch between a movable state in which the base 10 is movable and movable.

FIG. 2 is a schematic diagram illustrating the movable connection mechanism 71. The movable connecting mechanism 71 includes a horizontal moving mechanism 701 and a connecting mechanism 702.

The horizontal movement mechanism 701 makes the upper Z stage 40 movable on the stage base 10. As the horizontal movement mechanism 701, for example, a free bearing, an air bearing, or a ball-type air bearing that can move in the plane direction can be used.

The connecting mechanism 702 detachably connects the upper Z stage 40 and the lower Z stage 60. As the connecting mechanism 702, for example, an electromagnet can be used. The coupling mechanism 702 is controlled by the control device 80.

Returning to FIG. 1, the control device 80 controls the operation of the inspection device 1. The control device 80 is input with the detection signals of the detection units 23, 33, 63 and the load cell 64. The control device 80 controls the Y drive mechanism 22, the X drive mechanism 32, the Z drive mechanism 62, the θ drive mechanism, and the movable coupling mechanisms 71 and 72.

Next, the operation of the inspection device 1 according to the first embodiment will be described with reference to FIG. FIG. 3 is a flowchart showing an example of the operation of the inspection device 1 according to the first embodiment.

In step S101, the control device 80 controls the Y drive mechanism 22 and the X drive mechanism 32 to move the chuck 42 (needle sharpening plate 51) to a predetermined position.

In step S102, the control device 80 controls the movable connecting mechanism 71 (72) to bring it into a connected state. As a result, the upper Z stage 40 (needle sharpening plate support stage 50) and the lower Z stage 60 are connected.

In step S103, the control device 80 controls the Z drive mechanism 62 to raise the lower Z stage 60. As a result, the probe 4 contacts the electrode of the electronic device arranged on the carrier C. The control device 80 detects the load at the time of contact in the load cell 64 and controls the Z drive mechanism 62 to control the contact load. Thereby, the tester (not shown) is connected to the electronic device via the probe 4.

In step S104, the control device 80 controls the tester to inspect the electrical characteristics of the electronic device.

In step S105, the control device 80 controls the Z drive mechanism 62 to lower the lower Z stage 60.

In step S106, the control device 80 controls the movable connection mechanism 71 (72) to release the connection. As a result, the connection between the upper Z stage 40 (needle sharpening plate support stage 50) and the lower Z stage 60 is released. Further, the upper Z stage 40 (needle sharpening plate support stage 50) is in a state of being movable in the horizontal direction.

Hereinafter, steps S101 to S106 are repeated for each electronic device.

Next, the stress in each state of the inspection device 1 according to the first embodiment will be described with reference to FIGS. 4 to 11.

FIG. 4 is a schematic cross-sectional view after horizontal movement when inspecting the electronic device in the central portion of the carrier C in the inspection device 1 according to the first embodiment. FIG. 5 is a schematic cross-sectional view at the time of inspection of the electronic device in the central portion of the carrier C in the inspection device 1 according to the first embodiment.

As shown in FIG. 4, the Y stage 20 and the X stage 30 are moved so that the electronic device at the center of the carrier C is placed under the probe 4. Next, the upper Z stage 40 and the lower Z stage 60 are connected with the movable connecting mechanism 72 in the connected state. As shown in FIG. 5, the Z drive mechanism 62 is driven to raise the chuck 42 and press the probe 4 against the carrier C. At this time, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism 62 are indicated by black arrows. Since the position of the press load center of gravity of the probe card 3 and the position of the press load center of gravity of the Z drive mechanism 62 are arranged on the same axis, it is possible to prevent the upper Z stage 40 from tilting.

FIG. 6 is a schematic cross-sectional view after horizontal movement when inspecting an electronic device on the outer peripheral portion of the carrier C in the inspection device 1 according to the first embodiment. FIG. 7 is a schematic cross-sectional view at the time of inspection of the electronic device on the outer peripheral portion of the carrier C in the inspection device 1 according to the first embodiment.

As shown in FIG. 6, the Y stage 20 and the X stage 30 are moved so that the electronic device on the outer periphery of the carrier C is placed under the probe 4. Next, the upper Z stage 40 and the lower Z stage 60 are connected with the movable connecting mechanism 72 in the connected state. As shown in FIG. 7, the Z drive mechanism 62 is driven to raise the chuck 42 and press the probe 4 against the carrier C. At this time, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism 62 are indicated by black arrows. Since the position of the press load center of gravity of the probe card 3 and the position of the press load center of gravity of the Z drive mechanism 62 are arranged on the same axis, it is possible to prevent the upper Z stage 40 from tilting.

FIG. 8 is a schematic cross-sectional view after horizontal movement when the probe 4 is brought into contact with the central portion of the needle grinding plate 51 in the inspection device 1 according to the first embodiment. FIG. 9 is a schematic cross-sectional view when the probe 4 is brought into contact with the central portion of the needle grinding plate 51 in the inspection device 1 according to the first embodiment.

As shown in FIG. 8, the Y stage 20 and the X stage 30 are moved so that the central portion of the needle grinding plate 51 is placed under the probe 4. Next, the needle grinding plate support stage 50 and the lower Z stage 60 are connected with the movable connecting mechanism 72 in the connected state. As shown in FIG. 9, the Z drive mechanism 62 is driven to raise the needle polishing plate 51, and the probe 4 is pressed against the needle polishing plate 51. At this time, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism 62 are indicated by black arrows. Since the position of the press load center of gravity of the probe card 3 and the position of the press load center of gravity of the Z drive mechanism 62 are arranged on the same axis, it is possible to prevent the needle grinding plate support stage 50 from tilting.

FIG. 10 is a schematic cross-sectional view after horizontal movement when the probe 4 is brought into contact with the outer peripheral portion of the needle grinding plate 51 in the inspection device 1 according to the first embodiment. FIG. 11 is a schematic cross-sectional view when the probe 4 is brought into contact with the outer peripheral portion of the needle grinding plate 51 in the inspection device 1 according to the first embodiment.

As shown in FIG. 10, the Y stage 20 and the X stage 30 are moved so that the outer peripheral portion of the needle grinding plate 51 is arranged under the probe 4. Next, the needle grinding plate support stage 50 and the lower Z stage 60 are connected with the movable connecting mechanism 72 in the connected state. As shown in FIG. 11, the Z drive mechanism 62 is driven to raise the needle polishing plate 51, and the probe 4 is pressed against the needle polishing plate 51. At this time, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism 62 are indicated by black arrows. Since the position of the press load center of gravity of the probe card 3 and the position of the press load center of gravity of the Z drive mechanism 62 are arranged on the same axis, it is possible to prevent the needle grinding plate support stage 50 from tilting.

Here, an example of the inspection device 1C according to the reference example will be described. FIG. 12 is a schematic cross-sectional view at the time of inspection of the electronic device in the central portion of the carrier C in the inspection device 1C according to the reference example. FIG. 13 is a schematic cross-sectional view at the time of inspection of the electronic device on the outer peripheral portion of the carrier C in the inspection device 1C according to the reference example. FIG. 14 is a schematic cross-sectional view when the probe 4 is brought into contact with the central portion of the needle grinding plate 51C in the inspection device 1C according to the reference example. FIG. 15 is a schematic cross-sectional view when the probe 4 is brought into contact with the outer peripheral portion of the needle grinding plate 51C in the inspection device 1C according to the reference example. Further, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism 62 are indicated by black arrows.

In the inspection device 1C according to the reference example, a Z drive mechanism (not shown) is provided on the X stage 30, and the Z stage 40C moves up and down with respect to the X stage 30. Further, the needle grinding plate 51C is fixed to the Z stage 40C via the beam structure portion 52C.

As shown in FIG. 12, when inspecting the electronic device in the central portion of the carrier C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged coaxially. Therefore, it is possible to prevent the Z stage 40C from tilting.

On the other hand, as shown in FIG. 13, when inspecting the electronic device on the outer peripheral portion of the carrier C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, the Z stage 40C is tilted.

Further, as shown in FIG. 14, when the probe 4 is brought into contact with the central portion of the needle grinding plate 51C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, the beam structure portion 52C is bent, and the needle grinding plate 51C is tilted.

Further, as shown in FIG. 15, when the probe 4 is brought into contact with the outer peripheral portion of the needle grinding plate 51C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, the beam structure portion 52C is further bent, and the inclination of the needle grinding plate 51C is further increased.

As described above, according to the inspection device 1 according to the first embodiment, the probe card 3 is not only when the probe 4 is brought into contact with the central portion of the carrier C but also when the probe 4 is brought into contact with the outer peripheral portion of the carrier C. The position of the center of gravity of the press load and the position of the center of gravity of the press load of the Z drive mechanism 62 (lower Z stage 60) can always be kept on the same axis (see FIGS. 5 and 7). As a result, even if the contact load is increased, the upper Z stage 40 can be prevented from collapsing.

Further, according to the inspection device 1 according to the first embodiment, it is possible to prevent the needle grinding plate 51 from collapsing (see FIGS. 9 and 11). Further, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by one Z drive mechanism 62, the cost of the inspection device 1 can be reduced without providing a separate drive mechanism.

Next, the inspection device 1A according to the second embodiment will be described with reference to FIGS. 16 and 17. FIG. 16 is a schematic cross-sectional view after horizontal movement when inspecting the electronic device in the central portion of the carrier C in the inspection device 1A according to the second embodiment. FIG. 17 is a schematic cross-sectional view at the time of inspection of the electronic device in the central portion of the carrier C in the inspection device 1A according to the second embodiment.

The inspection device 1A according to the second embodiment has a movable connection mechanism 73 and a movable mechanism 74 instead of the movable connection mechanisms 71 and 72, as compared with the inspection device 1 according to the first embodiment. Other configurations are the same, and duplicate explanations will be omitted.

A movable connecting mechanism 73 is provided on the upper portion of the lower Z stage 60. The movable connecting mechanism 73 connects the upper Z stage 40 or the needle polishing plate support stage 50 and the lower Z stage 60 with the upper Z stage 40 or the needle polishing plate support stage 50 and the lower Z stage 60. It is configured so that it can be released and switched between a movable state in which the upper Z stage 40 or the needle grinding plate support stage 50 is movable on the lower Z stage 60. The movable connecting mechanism 73 includes a horizontal moving mechanism and a connecting mechanism. The horizontal movement mechanism makes the upper Z stage 40 or the needle grinding plate support stage 50 movable on the lower Z stage 60. As the horizontal movement mechanism, for example, a free bearing, an air bearing, or a ball-type air bearing that can move in the plane direction can be used. The connecting mechanism detachably connects the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60. As the connecting mechanism, for example, an electromagnet can be used. The coupling mechanism is controlled by the control device 80.

A movable mechanism 74 is provided on the upper part of the stage base 10. The movable mechanism 74 has a horizontal moving mechanism. The horizontal movement mechanism makes the upper Z stage 40 or the needle grinding plate support stage 50 movable on the stage base 10. As the horizontal movement mechanism, for example, a free bearing, an air bearing, or a ball-type air bearing that can move in the plane direction can be used.

As described above, according to the inspection device 1A according to the second embodiment, the position of the center of gravity of the press load of the probe card 3 and the press of the Z drive mechanism 62 (lower Z stage 60) are the same as those of the inspection device 1 according to the first embodiment. The position of the center of gravity of the load can always be kept on the same axis. As a result, even if the contact load is increased, the upper Z stage 40 can be prevented from collapsing. In addition, it is possible to prevent the needle grinding plate 51 from falling over. Further, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by one Z drive mechanism 62, the cost of the inspection device 1 can be reduced without providing a separate drive mechanism.

Next, the inspection device 1B according to the third embodiment will be described with reference to FIG. FIG. 18 is a schematic cross-sectional view illustrating the configuration of the inspection device 1B according to the third embodiment.

The inspection device 1B according to the third embodiment has a movable connection mechanism 75 instead of the movable connection mechanisms 71 and 72 as compared with the inspection device 1 according to the first embodiment. Other configurations are the same, and duplicate explanations will be omitted. Further, the upper Z stage 40 and the needle grinding plate support stage 50 are configured to be suspended on the X stage 30 when lowered. As a result, the upper Z stage 40 and the needle grinding plate support stage 50 are configured to be non-contact with the stage base 10. Other configurations are the same, and duplicate explanations will be omitted.

A movable connecting mechanism 75 is provided on the upper portion of the lower Z stage 60. The movable connecting mechanism 75 connects the upper Z stage 40 or the needle polishing plate support stage 50 and the lower Z stage 60 with the upper Z stage 40 or the needle polishing plate support stage 50 and the lower Z stage 60. It is configured so that it can be released and switched between a movable state in which the upper Z stage 40 or the needle grinding plate support stage 50 is movable on the lower Z stage 60. The movable connecting mechanism 75 has an O-ring provided on the upper surface of the lower Z stage 60 and an intake / exhaust mechanism for sucking and exhausting the space surrounded by the O-ring. The intake / exhaust mechanism connects the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 by vacuum suction by sucking air from the space surrounded by the O-ring. Further, the intake / exhaust mechanism releases the connection between the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 by supplying air into the space surrounded by the O-ring. Further, the upper Z stage 40 or the needle grinding plate support stage 50 rises from the lower Z stage 60 due to the supplied air. As a result, the upper Z stage 40 and the needle grinding plate support stage 50 can be moved in the horizontal direction.

The O-ring can also be used as a cushion that absorbs the impact when the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 come into contact with each other. Thereby, the impact at the time of connecting the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 can be suppressed.

As described above, according to the inspection device 1B according to the third embodiment, the position of the center of gravity of the press load of the probe card 3 and the press of the Z drive mechanism 62 (lower Z stage 60) are the same as those of the inspection device 1 according to the first embodiment. The position of the center of gravity of the load can always be kept on the same axis. As a result, even if the contact load is increased, the upper Z stage 40 can be prevented from collapsing. In addition, it is possible to prevent the needle grinding plate 51 from falling over. Further, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by one Z drive mechanism 62, the cost of the inspection device 1 can be reduced without providing a separate drive mechanism.

Next, the inspection device 1D according to the fourth embodiment will be described with reference to FIGS. 19 to 22. FIG. 19 is a plan view illustrating the configuration of the inspection device 1D according to the fourth embodiment. FIG. 20 is a schematic cross-sectional view illustrating the configuration of the inspection device 1D according to the fourth embodiment. FIG. 21 is an exploded perspective view of the inspection device 1D according to the fourth embodiment. FIG. 22 is a schematic cross-sectional view at the time of inspection of the electronic device in the central portion of the carrier C in the inspection device 1D according to the fourth embodiment. In FIG. 21, the moving direction of each part is indicated by an arrow.

The inspection device 1D is a device that inspects the electrical characteristics of each of the plurality of electronic devices arranged on the carrier (inspected body) C. The carrier C includes a wafer, a glass substrate, a single chip, and the like.

The inspection device 1D has a probe chamber 2. A probe card 3 is arranged in the upper part of the probe chamber 2. The probe card 3 has a plurality of probes 4. A stage base 10 is provided in the lower part of the probe chamber 2. In the probe chamber 2, a Y stage 20A, an X stage 30A, an upper Z stage 40A, a θ stage 41, a chuck 42, and a lower camera 43 are provided. Further, in the probe chamber 2, a Y stage 20B, an X stage 30B, an upper Z stage 40B, and a needle grinding plate 51 are provided.

The Y stage 20A moves the chuck 42 in the Y-axis direction. The Y stage 20A is mounted on the stage base 10 via the linear guide 21. The linear guide 21 has, for example, a guide rail provided on the upper surface of the stage base 10 and extending in the Y-axis direction, and a slider provided on the lower surface of the Y stage 20A and sliding along the guide rail. As a result, the Y stage 20A is configured to be movable in the Y direction.

The Y drive mechanism 22A drives the Y stage 20A in the Y direction. The Y drive mechanism 22A includes, for example, a motor and a rotary linear motion mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion motion. The operation of the motor of the Y drive mechanism 22A is controlled by the control device 80.

The detection unit 23A detects the Y-direction position of the Y stage 20A, in other words, the Y-direction position of the chuck 42. The detection unit 23A is, for example, an encoder that detects the rotation of the motor of the Y drive mechanism 22A, and the detection signal of the detection unit 23A is transmitted to the control device 80. The control device 80 calculates the position of the Y stage 20A in the Y direction based on the detection signal of the detection unit 23A.

The Y stage 20A has an opening that penetrates in the Z-axis direction. A guide 26A is provided at the opening.

The upper Z stage 40A has a protruding portion 45A that projects downward. The protrusion 45A of the upper Z stage 40A is inserted into the guide 26A. The upper Z stage 40A is supported by the guide 26A so as to be movable in the X-axis direction and the Y-axis direction and can be inserted and removed in the Z-axis direction. As a result, the upper Z stage 40A is configured to be movable in the vertical direction with respect to the Y stage 20A. The upper Z stage 40A has a protruding portion 45A that projects downward. Further, on the upper surface of the Y stage 20A, a stopper 46A that comes into contact with the upper Z stage 40A when the upper Z stage 40A descends is provided.

The X stage 30A moves the chuck 42 in the X-axis direction. The X stage 30A is mounted on the upper Z stage 40A via the linear guide 31A. The linear guide 31A has, for example, a guide rail provided on the lower surface of the X stage 30A and extending in the X-axis direction, and a slider provided on the upper surface of the upper Z stage 40A and sliding along the guide rail. As a result, the X stage 30A is configured to be movable in the X direction. Further, the slider of the linear guide 31A is preferably arranged symmetrically in the X-axis direction from the central axis of the lower Z stage 60 when viewed sideways in the Y-axis direction (see FIG. 20).

The X drive mechanism 32A drives the X stage 30A in the X direction. The X drive mechanism 32A includes, for example, a motor and a rotary linear motion mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion motion. The operation of the motor of the X drive mechanism 32A is controlled by the control device 80.

The detection unit 33A detects the position of the X stage 30A in the X direction, in other words, the position of the chuck 42 in the X direction. The detection unit 33A is, for example, an encoder that detects the rotation of the motor of the X drive mechanism 32A, and the detection signal of the detection unit 33A is transmitted to the control device 80A. The control device 80 calculates the position of the X stage 30A in the X direction based on the detection signal of the detection unit 33A.

A θ stage 41, a chuck 42, and a lower camera 43 are provided on the X stage 30A. The θ stage 41 has a function of rotating the chuck 42 with the Z axis as the rotation axis. The θ drive mechanism 44A that rotates the θ stage 41 is controlled by the control device 80. The chuck 42 mounts the carrier C. The chuck 42 has a fixing mechanism (not shown) for fixing the carrier C to the chuck 42. This prevents the carrier C from being displaced relative to the chuck 42. The lower camera 43 is provided on the side surface of the chuck 42. It moves and rotates with the chuck 42.

The Y stage 20B moves the needle grinding plate 51 in the Y-axis direction. The upper Z stage 40B is configured to be movable in the vertical direction with respect to the Y stage 20B. The X stage 30B moves the needle grinding plate 51 in the X-axis direction. Further, the configurations of the Y stage 20B, the upper Z stage 40B, and the X stage 30B have the same configurations as the Y stage 20A, the upper Z stage 40A, and the X stage 30A, and overlapping description will be omitted.

A needle grinding plate 51 is provided on the X stage 30B. The needle polishing plate 51 abuts the tip of the probe 4 and polishes the tip of the probe 4. Further, it has a function of rotating the needle grinding plate 51 with the Z axis as the rotation axis. The θ drive mechanism 44B that rotates the needle grinding plate 51 is controlled by the control device 80.

The stage base 10 has an opening 15 that penetrates in the Z-axis direction. A guide 61 is provided in the opening 15.

The lower Z stage 60 is supported by a guide 61 so as to be movable in the X-axis direction and the Y-axis direction and can be inserted and removed in the Z-axis direction. As a result, the lower Z stage 60 is configured to be movable in the vertical direction with respect to the stage base 10.

The Z drive mechanism 62 drives the lower Z stage 60 in the Z direction. The Z drive mechanism 62 includes, for example, a motor and a rotary linear motion mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion motion. The operation of the motor of the Z drive mechanism 62 is controlled by the control device 80.

Here, when the probe 4 is brought into contact with the carrier C or the needle grinding plate 51 mounted on the chuck 42, the position of the center of gravity of the press load of the probe card 3 and the position of the center of gravity of the press load of the lower Z stage 60 are on the same axis. (See FIG. 22). In other words, the axes of the action point of the pushing force when the lower Z stage 60 pushes up the upper Z stage 40A and the action point of the load received by the probe card 3 are arranged at a common position. Here, the fact that the axes are common means that they are coaxial (the axes match) and that they almost match (in the same direction). For example, the central axis of the probe card 3 and the central axis of the lower Z stage 60 are common. Further, the central axis of the probe card 3 and the central axis of the ball screw of the Z drive mechanism 62 are common.

The detection unit 63 is located at the X-direction position of the lower Z stage 60, in other words, the needle polishing plate 51 connected to the chuck 42 provided on the upper Z stage 40A connected to the lower Z stage 60 or the needle polishing plate support stage 50. Detects the Z-direction position of. The detection unit 63 is, for example, an encoder that detects the rotation of the motor of the Z drive mechanism 62, and the detection signal of the detection unit 63 is transmitted to the control device 80. The control device 80 calculates the Z direction position of the lower Z stage 60 based on the detection signal of the detection unit 63.

The load cell 64 detects the load received by the lower Z stage 60. The detection signal of the load cell 64 is input to the control device 80. Instead of the load cell 64, a torque sensor that detects the torque of the Z drive mechanism 62 may be used. Further, in the case of feedback control of the detected load, the control device 80 simultaneously performs the position control and the load control.

A movable connecting mechanism 75 is provided in the lower portion of the upper Z stage 40A. The movable connection mechanism 75 releases the connection between the upper Z stage 40A and the lower Z stage 60 and the connection between the upper Z stage 40A and the lower Z stage 60, and the upper Z stage 40A can move and move on the stage base 10. It is configured so that it can be switched between the movable state and the movable state.

Here, the case where the lower Z stage 60 pushes up the upper Z stage 40A has been described as an example, but the same applies to the case where the lower Z stage 60 pushes up the upper Z stage 40B. That is, when the lower Z stage 60 pushes up the upper Z stage 40B, the Y stage 20A is retracted from above the lower Z stage 60, and the Y stage 20B is moved so as to be located above the lower Z stage 60. In this case, the movable connecting mechanism 75 releases the connection between the upper Z stage 40B and the lower Z stage 60 and the connection between the upper Z stage 40B and the lower Z stage 60, and the upper Z stage 40B is on the stage base 10. It is configured to be able to switch between a movable state and a movable state.

As described above, according to the inspection device 1D according to the fourth embodiment, the probe card 3 is not only when the probe 4 is brought into contact with the central portion of the carrier C but also when the probe 4 is brought into contact with the outer peripheral portion of the carrier C. The position of the center of gravity of the press load and the position of the center of gravity of the press load of the Z drive mechanism 62 (lower Z stage 60) can always be kept on the same axis (see FIG. 22). This makes it possible to prevent the upper Z stage 40A from collapsing even if the contact load is increased.

Further, since the slider of the linear guide 31A is provided on the upper surface of the upper Z stage 40A and is arranged symmetrically in the X-axis direction from the central axis of the lower Z stage 60, when the upper Z stage 40A is pushed up, the X stage 30A Can be prevented from falling over.

Further, according to the inspection device 1D according to the fourth embodiment, it is possible to prevent the needle grinding plate 51 from collapsing. Further, since the upper Z stage 40A supporting the chuck 42 and the upper Z stage 40B supporting the needle grinding plate 51 can be raised and lowered by one Z drive mechanism 62, the inspection device 1D can be moved up and down without individually providing a drive mechanism. The cost can be reduced.

Although the inspection devices 1, 1A to 1D have been described above, the present disclosure is not limited to the above-described embodiment and the like, and various modifications and variations are made within the scope of the gist of the present disclosure described in the claims. Improvement is possible.

1 Inspection device 2 Probe chamber 3 Probe card 4 Probe 10 Stage base 15 Opening 20 Y stage 21 Linear guide 22 Y drive mechanism 23 Detection unit 25 Opening 30 X stage 31 Linear guide 32 X drive mechanism 33 Detection unit 35, 36 Guide 40 Upper Z stage (upper module)
42 Chuck (mounting part)
50 Needle-grinding plate support stage 51 Needle-grinding plate 60 Lower Z stage 61 Guide 62 Z drive mechanism 63 Detection unit 64 Load cell 71-73 Movable connection mechanism 74 Movable mechanism 75 Movable connection mechanism 80 Control device C Carrier (inspected object)

Claims (8)

A probe card with a probe that comes into contact with the object to be inspected,
An upper module having a mounting portion on which the object to be inspected is mounted, and
With a moving mechanism that supports the upper module so that it can be raised and lowered and that can move the upper module in the horizontal direction.
It is provided with an elevating mechanism provided under the moving mechanism and capable of pushing the upper module toward the probe card.
The axis of the pushing force when the elevating mechanism pushes up the upper module and the action point of the load received by the probe card are arranged at a common position.
Inspection equipment. Further provided with a connecting mechanism for detachably connecting the upper module and the elevating mechanism.
The inspection device according to claim 1. The connecting mechanism is connected by magnetic adsorption.
The inspection device according to claim 2. The connecting mechanism is connected by vacuum suction.
The inspection device according to claim 2. The moving mechanism is
The first stage, which can move in the first direction with respect to the base plate,
It has a second stage that can move in a second direction different from the first direction with respect to the first stage.
The upper module is supported on the second stage so as to be able to move up and down.
The first stage has an opening.
The inspection device according to any one of claims 1 to 4. The moving mechanism is
The first stage, which can move in the first direction with respect to the base plate,
It has a second stage that can move in a second direction different from the first direction with respect to the upper module.
The upper module is supported on the first stage so as to be able to move up and down.
The first stage has an opening.
The inspection device according to any one of claims 1 to 4. Further equipped with a needle polishing plate support stage to support the needle polishing plate,
The moving mechanism supports the needle grind plate support stage so as to be able to move up and down independently of the upper module.
The elevating mechanism pushes the needle grinding plate support stage toward the probe card.
The inspection device according to any one of claims 1 to 6. A probe card with a probe that comes into contact with the object to be inspected,
An upper module having a mounting portion on which the object to be inspected is mounted, and
With a moving mechanism that supports the upper module so that it can be raised and lowered and that can move the upper module in the horizontal direction.
An elevating mechanism provided below the moving mechanism and capable of pushing up the upper module toward the probe card.
It is an inspection method of an inspection device provided with a control unit.
The control unit
A step of controlling the movement mechanism to move the inspected object,
The point of action of the pushing force when the elevating mechanism is controlled to bring the inspected object into contact with the probe and the elevating mechanism pushes up the upper module is coaxial with the point of action of the load received by the probe card. With steps placed on,
Inspection method of inspection equipment.

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