TWI737558B - Electronic device testing apparatus capable of autonomously compensating unflatness of contact surface between a test head and a device under test - Google Patents

Abstract

The present invention relates to an electronic component testing equipment capable of autonomously compensating the flatness of the contact interface between the test head and the object to be tested. The limit sliding module is mainly used to suppress the generation of errors, especially due to the pulling of the refrigerant pipeline of the temperature control unit The resulting deflection or displacement of the component, because the limit sliding module only allows displacement in a single direction, the deflection or displacement in other directions will be effectively suppressed. In addition, the multi-dimensional error absorbing module is used to absorb the processing errors or assembly errors of each component or component, thereby maintaining a good flatness of the contact interface between the test head and the DUT, so as to avoid uneven force or heat dissipation of the DUT Uneven situation occurs. Accordingly, under the premise of providing sufficient down pressure and temperature adjustment capabilities, the contact interface between the test head and the DUT can maintain excellent flatness.

Description

Electronic component testing equipment capable of autonomously compensating the flatness of the contact interface between the test head and the DUT

The present invention relates to an electronic component testing equipment capable of autonomously compensating for the flatness of the contact interface between a test head and a test piece, in particular to an electronic component testing equipment that performs pressure testing on electronic components and regulates their temperature.

During or after the manufacturing process of the wafer, the wafer is usually tested to ensure that the wafer can operate normally. Moreover, as the semiconductor manufacturing process continues to evolve, the internal integrated circuits of the chip have become more complex, and the chip's functions have become more and more powerful. However, the test time is getting longer and longer, and the heat generated by the wafer during the test is also increasing, so the test equipment is more important for the control of the test temperature of the wafer.

At present, high-end wafer inspection equipment is often equipped with a refrigerant circulating heat dissipation system, for example, a refrigerant evaporator is directly installed on the test head to effectively reduce the working temperature of the wafer during the test. However, the pipeline for circulating the refrigerant in the refrigerant circulation heat dissipation system needs to be specially equipped with insulation materials to reduce the heat absorption of the refrigerant due to direct contact with the atmosphere during the pipeline circulation, which affects the heat absorption effect of the refrigerant in the evaporator, and reduces On the other hand, after the low-temperature refrigerant pipeline is exposed to the atmosphere, there will be condensed water on the surface of the pipeline, and this condensed water may cause a short circuit of the test equipment or the DUT, so the outer surface of the pipeline is covered Insulation materials are absolutely necessary. However, due to the poor flexibility of the thermal insulation material and the frequent lifting or shifting of the test head, the refrigerant pipeline with thermal insulation material often pulls the test head, causing the test head or internal components to shift And skew, which greatly affects the flatness of the contact between the test head and the DUT.

On the other hand, the internal integrated circuit of the chip is becoming more and more complicated, and the number of chip contacts is becoming more and more amazing. However, the common testing method of the chip is pressure testing, that is, applying pressure on the top of the test piece to ensure that the bottom of the test piece The contact can completely touch the probe in the test socket (Socket). Taking the current graphics processing unit (GPU) of a general display card as an example, it also needs to exert a downforce of more than one hundred kilograms. However, in order to cope with such a large down force and its reaction force, the machine needs to be additionally equipped with a clamping mechanism, and coupled with components such as a temperature control system and a down force generating device, the entire test head has more and more mechanisms and components. It is complicated, and also has to consider the test base and the test substrate, which will seriously test the processing accuracy and assembly accuracy of each component. However, no matter how precise the processing capability and the assembly process are, it is always difficult to avoid small errors. However, even the smallest errors will affect the flatness of the contact between the test head and the DUT.

Furthermore, once the contact flatness between the test head and the DUT is not good, the most direct impact is the force and heat dissipation of the DUT; among them, when uneven force occurs, it may cause The contact of the device under test is in poor contact with the probe of the test base, and cannot be fully contacted, which will cause the test to fail; in addition, when uneven heat dissipation occurs, it will cause local high temperature of the device under test, which will affect the performance of the test. , In severe cases, the DUT will be damaged due to high temperature. It can be seen from this that a product with excellent temperature control capabilities, sufficient downforce, and good contact flatness between the test head and the DUT, is indeed highly anticipated by the industry.

The main purpose of the present invention is to maintain excellent flatness of the contact interface between the test head and the test piece under the premise of providing sufficient down pressure and temperature adjustment capabilities.

In order to achieve the above objective, the present invention is an electronic component testing equipment capable of autonomously compensating the flatness of the contact interface between the test head and the test piece, which mainly includes lifting components, multi-dimensional error absorption modules, pressure generating devices, and limit sliding modules , Temperature control unit, test seat substrate, test seat and locking mechanism; wherein, the multi-dimensional error absorbing module includes a fixed part and a movable part, the fixed part is assembled on the lifting member, and the pressure generating device includes a fixed end and a pressure end , And the fixed end is coupled to the movable part of the multi-dimensional error absorbing module; the limit sliding module includes a first sliding unit and a second sliding unit, and the second sliding unit and the first sliding unit are coupled to each other and can oppose each other Lifting and sliding, and the first sliding unit is connected to the movable part of the multi-dimensional error absorbing module, and the second sliding unit is connected to the pressure end of the pressure generating device; the temperature control unit is coupled to the second sliding of the limit sliding module Unit; the test seat substrate, which is located below the temperature control unit; the test seat assembly is arranged on the test seat substrate, and corresponds to the temperature control unit, and the test seat is used to house the DUT; the locking mechanism includes at least one locking arm and At least one fixing pin, and one end of the locking arm is connected to the lifting member, and the fixing pin is assembled on the base plate of the test base; wherein the lowering of the lifting member makes the temperature control unit approach the test base, and the other end of the at least one locking arm At least one fixing pin is engaged and locked, and the pressure generating device applies pressure to the test piece through the temperature control unit.

Accordingly, the present invention uses the limit sliding module to suppress the occurrence of errors, especially the error caused by the pulling of the refrigerant pipeline, because the limit sliding module itself only allows displacement in a single direction (Z direction), that is, Only the lifting displacement is allowed, so the error caused by the mechanism's displacement or deflection in other directions caused by pulling the cooling medium pipeline insulation material can be effectively suppressed. In addition, the present invention uses the multi-dimensional error absorbing module to autonomously absorb the processing errors or assembly errors of each component or assembly, thereby maintaining a good flatness of the contact interface between the test head and the test piece, so as to avoid the stress of the test piece. Even or uneven heat dissipation occurs.

To further illustrate, the multi-dimensional error absorbing module of the present invention may further include a pressure-bearing steel ball and a plurality of pressure-bearing elastic members, and the pressure-bearing steel ball and a plurality of pressure-bearing elastic members may be arranged between the fixed member and the movable member, and the plurality of bearing members The pressure elastic members are equidistantly arranged on the four peripheries of the pressure-bearing steel ball. Accordingly, when an error or uneven force causes the movable part to be in a non-horizontal state, the coordinated action of the above-mentioned components can absorb the error and balance the force. In addition to allowing the contact of the test piece to completely contact the test seat Outside the probe, the test piece can be smoothly contacted with the temperature control unit to achieve uniform cooling, so that the temperature of the test piece meets the test specifications.

Furthermore, the movable part of the multi-dimensional error absorbing module of the present invention may include a movable plate and a vertical plate, and the pressure-bearing steel ball and a plurality of pressure-bearing elastic parts may be arranged between the fixed part and the movable plate, and the limit sliding The first sliding unit of the module can be arranged on the vertical board. In addition, the limit sliding module of the present invention may further include an L-shaped guide frame, which may include a vertical vertical board and a horizontal horizontal board; and the second sliding unit may be assembled on the vertical vertical board, and the horizontal horizontal board may Set between the pressure end of the pressure generating device and the temperature control unit. Accordingly, by arranging the first sliding unit of the limit sliding module on the vertical plate of the multi-dimensional error absorbing module, and the second sliding unit on the vertical vertical plate of the L-shaped guide frame, the limit The first and second sliding units of the sliding module are restricted to only move in a single direction for lifting.

Preferably, the pressure generating device of the present invention may include a first pressure generating module and a second pressure generating module, and the first pressure generating module may be coupled to the movable part of the multi-dimensional error absorbing module. And the second pressure generating module can be interposed between the first pressure generating module and the temperature control unit. Therefore, the first and second pressure generating modules of the present invention can apply the same or different downforces to the same and/or different objects to meet various test specifications.

Furthermore, the upper surface of the DUT can include the wafer pressure area and the circuit board pressure area; the temperature control unit can include an evaporator and a crimping block, and the upper surface of the evaporator can be connected to the second pressure generating module , And the crimping block can be connected to the lower surface of the evaporator and used to press the wafer pressure area of the test piece. In addition, the second pressure generating module may include an outer frame cover, a pressing piston and a crimping plate, the outer frame cover may be connected to the first pressure generating module, and the pressing piston may be arranged in the outer frame cover, and the pressing plate The outer frame cover can be connected, the crimping board can include bumps and openings, the crimping block of the temperature control unit passes through the opening of the crimping board, and the bumps can be used to press the pressure-bearing area of the circuit board for receiving the test piece. In other words, the down force generated by the first pressure generating module can not only be directly applied to the second pressure generating module, but also can be applied to the pressure-bearing area of the circuit board of the device under test through the outer frame cover; The force of the pressure-bearing area of the chip comes from the second pressure generating module and the first pressure generating module.

Furthermore, the pressing piston of the second pressure generating module of the present invention can be connected to the horizontal plate of the L-shaped guide frame of the limit sliding module, and the pressing piston includes a first air passage, and the horizontal plate can be It includes a second venting channel, and the first venting channel and the second venting channel can be communicated with each other and connected to an air pressure source. In other words, in the present invention, the horizontal horizontal plate of the L-shaped guide frame of the limit sliding module can be used as the air guide passage for the pressing piston of the second pressure generating module, and when the positive pressure air flow of the air pressure source is passed, In addition to the second pressure generating module generating downward pressure through the pressing piston, the pressing piston will directly drive the horizontal plate of the L-shaped guide frame of the limit sliding module to shift, so the first and second pressure generating modules are also A single direction lifting displacement can be formed by the guide of the limit sliding module.

Moreover, the first pressure generating module of the present invention may include a body, a pressure diaphragm, and a pressure member. The body includes a hollow chamber, and the pressure diaphragm may be disposed in the hollow chamber and divide the hollow chamber into the first cavity. Chamber and the second chamber, and one end of the pressure member is accommodated in the second chamber, and the other end of the pressure member is connected to the second pressure generating module; therefore, when the first chamber is filled with a fluid, the pressure diaphragm When contacting one end of the pressing member, the other end of the pressing member applies a force to the second pressure generating module. Among them, because the pressure transmission interface (pressure diaphragm) between the pressure member and the pressure fluid has characteristics such as flexibility and elasticity, the pressure member can adapt to the angle of the pressure surface of the object and adjust it adaptively. The orientation of the pressing member itself and the direction in which the pressure is applied can make the applied pressure uniformly act on the pressure surface of the object in a positive force. Moreover, when the applied pressure is cancelled, the pressing diaphragm and the pressing member can be reset immediately, without error residue.

More preferably, the locking arm of the locking mechanism of the present invention may include an actuator and a sliding member; when the locking arm engages the fixing pin, the actuator can drive the sliding member to slide in a specific direction and fasten the fixing pin. Accordingly, the present invention mainly separates the slider and the locking pin on the lower indenter and the test seat substrate; and when the lower indenter and the test seat substrate are to be locked, the slider is driven by the actuator to tighten the locking pin, so that The two cannot be separated from each other; for the same reason, when the lower indenter and the test seat substrate are to be separated from each other, it is only necessary to release the locking pin by driving the sliding member through the actuator.

Before being described in detail in this embodiment, the electronic component testing equipment of the present invention that can autonomously compensate for the flatness of the contact interface between the test head and the object under test Symbol to indicate. Furthermore, the drawings of the present invention are only for illustrative purposes, and they are not necessarily drawn to scale, and all details are not necessarily presented in the drawings.

First of all, the embodiment presented in the following description with the drawings does not fully disclose the entire electronic component testing equipment, including the Pick & Place device, the shuttle component, the discharging and feeding component, and the related electronic control. Components and cooling system components such as expansion valves and condensers are not shown in the following embodiments.

Please refer to FIGS. 1 to 4 at the same time. FIG. 1 is a perspective view of a preferred embodiment of the present invention, and FIG. 2 is a perspective view of a preferred embodiment of the present invention with the lifting driver and refrigerant pipeline removed. FIG. 3 is shown in FIG. 2 Shows an exploded view of the lower indenter, and Figure 4 is a cross-sectional view of the AA line shown in Figure 2. As shown in these figures, the electronic component testing equipment of this embodiment that can autonomously compensate for the flatness of the contact interface between the test head 1 and the test piece C, wherein the test head 1 mainly includes a lifting member 2, a multi-dimensional error absorption Module 3, a limit sliding module 4, a pressure generating device 5, a temperature control unit 6 and a locking mechanism 8.

In this embodiment, the lifting member 2 is a lifting arm, which is connected to a lifting driving module 21 composed of a motor and a screw, and the lifting driving module 21 can drive the lifting member 2 for lifting displacement. Furthermore, the multi-dimensional error absorbing module 3 includes a fixed part 31, a movable part 32, a pressure-bearing steel ball 33, and four pressure-bearing elastic parts 34. The lower surface of the member 2; and the movable piece 32 is an L-shaped metal plate, which includes a movable plate 321 and a vertical plate 322. In addition, the pressure-bearing steel ball 33 is arranged between the fixed part 31 and the movable part 32 and corresponds to the centroid position of the two plates; and the four pressure-bearing elastic parts 34 are springs respectively, which are respectively arranged equidistantly on the pressure-bearing steel balls. 33 of the fourth ring week.

In addition, regarding the pressure generating device 5, it has a fixed end 53 and a pressure end 54, and the fixed end 53 is coupled to the movable part 32 of the multi-dimensional error absorbing module 3. The pressure generating device 5 of this embodiment includes a first pressure generating module 51 and a second pressure generating module 52, wherein the first pressure generating module 51 is coupled to the movable part 32 of the multi-dimensional error absorbing module 3 , And the second pressure generating module 52 is located between the first pressure generating module 51 and the temperature control unit 6.

4, the first pressure generating module 51 of this embodiment includes a body 511, a pressure diaphragm 512, and a pressure member 513. The body 511 includes a hollow chamber 514, and the pressure diaphragm 512 can be The hollow chamber 514 is composed of silicone and arranged in the hollow chamber 514. The pressure diaphragm 512 separates the hollow chamber 514 into a first chamber 515 and a second chamber 516. One end of the pressing member 513 is accommodated in the second chamber 516, and the other end protrudes out of the body 511 and is connected to the second pressure generating module 52. Accordingly, when the first chamber 515 is connected to an air pressure source GS and is filled with a fluid through the air pressure source GS, so that the pressing diaphragm 512 expands and contacts one end of the pressing member 513, the other of the pressing member 513 One end applies a force to the second pressure generating module 52.

On the other hand, the second pressure generating module 52 of this embodiment includes an outer frame cover 521, a pressing piston 522, and a crimping plate 523. The upper end of the outer frame cover 521 is coupled to the first pressure generating module. 51 of the pressing member 513, and the pressing piston 522 is arranged in the outer frame cover 521, and the pressing piston 522 and the outer frame cover 521 form an air chamber B, and the other end of the pressing piston 522 far away from the air chamber B The temperature control unit 6 is connected; the temperature control unit 6 is also accommodated in the outer frame cover 521, and the crimping plate 523 is connected to the lower opening of the outer frame cover 521.

In addition, the limit sliding module 4 includes a first sliding unit 41 and a second sliding unit 42. The second sliding unit 42 and the first sliding unit 41 are coupled to each other and can move up and down relative to each other. The unit 41 is connected to the movable part 32 of the multi-dimensional error absorbing module 3, and the second sliding unit 42 is connected to the pressing end 54 of the pressure generating device 5. To further illustrate, the limit sliding module 4 of this embodiment further includes an L-shaped guide frame 43, which is composed of a vertical vertical plate 431 and a horizontal horizontal plate 432; and the second sliding unit 42 of this embodiment is a The sliding block is assembled on the vertical vertical plate 431; in addition, the first sliding unit 41 of this embodiment is a sliding rail, which is assembled on the vertical plate 322 of the movable member 32.

Furthermore, as shown in FIGS. 3 and 4, the pressing piston 522 of the second pressure generating module 52 of this embodiment is connected to the horizontal plate 432 of the L-shaped guide frame 43 of the limit sliding module 4. The above two are integrally formed, and the pressing piston 522 includes a first vent channel CH1, the horizontal plate 432 includes a second vent channel CH2, and the first vent channel CH1 and the second vent channel CH2 are in communication with each other and are connected to A gas pressure source GS. Accordingly, when the air pressure source GS provides air flow, and the air flow is filled into the air chamber B through the second air passage CH2 and the first air passage CH1, the air flow forms air pressure in the air chamber B, and the air pressure will drive the pressure piston At 522, a force is generated and applied to the temperature control unit 6.

In addition, regarding the temperature control unit 6, the temperature control unit 6 of this embodiment adopts a refrigerant circulating cooling system, so the temperature control unit 6 shown in the figure includes an evaporator 611 and a crimping block 612, in which the evaporator 611 is The upper surface is connected to the horizontal horizontal plate 432, and the crimping block 612 is connected to the lower surface of the evaporator 611.

Please also refer to FIG. 5. FIG. 5 is a perspective view of a crimping plate and a device to be tested according to a preferred embodiment of the present invention. The upper surface of the DUT C in this embodiment includes a chip bearing area C1 (commonly known as Bare Die in the industry) and a circuit board bearing area C2. In addition, the crimping plate 523 of this embodiment has an opening 525 in the center, and the lower surface is provided with four protrusions 524 surrounding the four sides of the opening 525, and the crimping block 612 of the temperature control unit 61 passes through The opening 525 of the crimping plate 523 is used to press the chip pressure-bearing area C1 of the test piece C, and the four-sided bumps 524 are used to press the circuit board pressure-bearing area C2 of the test piece C.

In addition, please also refer to FIG. 6, which is an exploded view of the locking mechanism 8 and the test base substrate 7 of a preferred embodiment of the present invention. As shown in the figure, the test seat substrate 7 is arranged under the crimping plate 523 and the crimping block 612, and the test seat 9 is assembled on the test seat substrate 7 and is used to house the test piece C. As for, the locking mechanism 8 of this embodiment includes two locking arms 81 and two fixing pins 82. One end of the two locking arms 81 is connected to the two side end surfaces of the fixing member 31, and is separately provided in the multi-dimensional error absorbing module 3. The two corresponding sides of the device 5 and the temperature control unit 6, and one end of the two fixing pins 82 is connected to the test base substrate 7 and is also separately arranged on the two sides of the test base 9.

Moreover, each locking arm 81 of this embodiment includes an actuator 811 and a sliding member 812; in this embodiment, the actuator 811 is a small pneumatic cylinder, and the sliding member 812 is provided with a narrowing groove 813 . Therefore, when the locking arm 81 engages the fixing pin 82 and the fixing pin 82 is inserted into the narrowing groove 813, the actuator 811 is controlled to drive the sliding member 812 to slide in a specific direction, so that the narrowing groove 813 fastens the fixing pin 82. In order to lock the two so as not to separate from each other.

Please refer to FIG. 7, which is a cross-sectional view of the BB line shown in FIG. The operation mode of this embodiment will be briefly described below. First, the lifting drive module 21 (see FIG. 1) drives the lifting member 2 to descend, so that the crimping plate 523 and the crimping block 612 contact the test piece C in the test base 9. At this time, the locking arm 81 also simultaneously engages the fixing pin 82. Then, the locking mechanism 8 is actuated, that is, the actuator 811 is controlled to drive the sliding member 812 to allow the sliding member 812 to fasten the fixing pin 82. Moreover, the first pressure generating module 51 and the second pressure generating module 52 are respectively connected to the air pressure source GS to actuate to generate down pressure (see FIG. 4), wherein the first pressure generating module 51 generates the first down pressure F ₁ , The second pressure generating module 52 generates a second down force F ₂ .

The internal force distribution of the overall mechanism is further explained. The first down _{force F 1} will be split into a first force component F ₁₁ and a second force component F _{12. The} first force component F ₁₁ will pass through the outer frame cover 521 and the pressure The transfer of the connecting plate 523 is applied to the pressure-bearing area C2 of the circuit board of the device under test C through the bumps 524. On the other hand, the second component force F ₁₂ is applied to the second pressure generating module 52 and accumulates the second down force F ₂ , which is applied to the wafer pressure area C1 of the test piece C through the crimping block 612. However, the reaction force generated by the down force is applied to the entire test base substrate 7, the locking mechanism 8 and the test base 9, and the framework formed by these components will achieve an internal force balance. Furthermore, taking this embodiment as an example, the first component force F _{11 applied to the pressure-receiving area C2 of the circuit board is 80 kgf, and the second downward force F 2} and the second component force F ₁₂ applied to the pressure-receiving area C1 of the chip The sum is 50kgf, so the down force applied to the entire DUT C will be as high as 130kgf.

In summary, this embodiment adopts the following three mechanisms to ensure a good flatness of the contact interface between the crimping block 612 and the test piece C, including: (1). The multi-dimensional error absorbing module 3 of the present invention has a pressure-bearing steel ball 33 and a plurality of pressure-bearing elastic members 34 between the fixed part 31 and the movable part 32, so when the movable part 32 receives an uneven deviation When shifting stress, for example, due to component processing error or assembly error, when the pressure generating device 5 exerts a downward pressure on the offset stress, the coordinated action of the above-mentioned components can autonomously absorb the processing error or assembly error of each component or component. Maintain good flatness of the contact interface between the crimping block 612 and the test piece C to avoid uneven force or uneven heat dissipation of the test piece C; and when the downward pressure is canceled, the pressure-bearing elastic member 34 can again Reset the movable part 32 for the next pressure test; (2). The present invention uses the limit sliding module 4 to suppress the occurrence of errors, especially due to the pulling of the refrigerant pipeline, which causes the displacement or deflection of the components, resulting in contact between the crimping block 612 and the test piece C The flatness error of the interface; however, because the limit sliding module 4 of the present invention itself only allows displacement in a single direction (Z direction), that is, only allows lifting displacement, the deflection or swing caused by the pulling of the refrigerant pipe The displacement error will be effectively suppressed; and (3). The present invention can fill the first chamber 515 of the first pressure generating module 51 with fluid, and contact the pressure member 513 through the pressure diaphragm 512, so that the pressure diaphragm 512 transmits the fluid pressure to the pressure Pressure piece 513; Among them, because the pressure transmission interface (pressure diaphragm 512) between the pressure piece 513 and the pressure fluid has the characteristics of flexibility and elasticity, the pressure piece 513 can conform to the pressure surface of the test piece C The angle of the pressure-applying member 513 itself and the direction of the pressure applied can be adjusted adaptively, so that the applied pressure can be uniformly acted on the pressure-receiving surface of the test piece C in a positive force. superior. Moreover, when the applied pressure is canceled, the pressing diaphragm 512 and the pressing member 513 can be reset immediately, without residual error.

Through actual measurement, this embodiment has an excellent effect compared to the conventional technology without any error elimination measures. Please refer to the following table. Among them, set 6 temperature measurement points (Indx 0 ~ 5) on the test piece C. As can be seen from the table below, using the equipment of this embodiment, the temperature at the highest temperature on the test piece C is 63.3°C, and the lowest temperature The temperature is 55.6℃, so the maximum temperature difference is only 7.7℃. On the other hand, using conventional equipment, the temperature at the highest temperature on the test piece C is 64.4°C, and the temperature at the lowest temperature is 40.9.6°C, so the maximum temperature difference is as high as 23.5°C. Indx 0 Indx 1 Indx 2 Indx 3 Indx 4 Indx 5 ΔT This embodiment 55.9°C 55.6°C 59°C 57°C 55.8°C 63.3°C 7.7°C Known technology 64.4°C 62.7 ℃ 44.6°C 46.9°C 45.7°C 40.9°C 23.5°C

In addition, in order to prove that the equipment provided by the present invention can effectively improve the flatness of the contact interface between the test head 1 (especially the crimping block 612 and the bump 524) and the test piece C, especially the use of pressure sensitive paper For pressure measurement, please refer to Figs. 8A to 8D. Figs. 8A to 8D are photos of the pressure measurement using pressure sensitive paper in the prior art and this embodiment. Among them, Figure 8A and Figure 8B show the results of the pressure test of the conventional technology. The lighter color part is caused by less force, and the blank part is not under pressure at all. On the other hand, FIG. 8C and FIG. 8D show the pressure test results of this embodiment. From the two photos, it can be seen that the color density on the surface of the test piece C is fairly uniform, which means that the force is fairly uniform. It has been proved that the present invention has an excellent effect in improving the flatness of the contact interface between the test head 1 (especially the crimping block 612 and the bump 524) and the test piece C.

The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in the present invention should be subject to the scope of the patent application, rather than being limited to the above-mentioned embodiments.

1: Test head 2: Lifting member 3: Multi-dimensional error absorption module 4: Limit sliding module 5: Pressure generating device 6: Temperature control unit 7: Test base board 8: Locking mechanism 9: Test seat 21: Lifting drive module 31: fixed parts 32: movable parts 33: Pressure-bearing steel ball 34: Pressure-bearing elastic parts 41: The first sliding unit 42: second sliding unit 43: L-shaped guide frame 51: The first pressure generation module 52: The second pressure generation module 53: fixed end 54: pressure end 81: lock arm 82: fixed pin 321: Activity Board 322: Vertical Board 431: vertical riser 432: Horizontal Lying Board 511: body 512: Pressure Diaphragm 513: Pressure Piece 514: Hollow Chamber 515: first chamber 516: second chamber 521: Outer Frame Cover 522: Pressure Piston 523: crimping plate 524: bump 525: open 611: Evaporator 612: Crimp Block 811: Actuator 812: Sliding Parts 813: Necking B: Air chamber C: DUT C1: chip bearing area C2: Circuit board pressure area CH1: The first ventilation channel CH2: Second ventilation channel GS: Air pressure source

Figure 1 is a perspective view of a preferred embodiment of the present invention. Figure 2 is a perspective view of a preferred embodiment of the present invention with the lifting driver and refrigerant pipeline removed. Fig. 3 is an exploded view of the lower indenter shown in Fig. 2. Fig. 4 is a cross-sectional view of the line A-A shown in Fig. 2. Fig. 5 is a perspective view of a crimping plate and a test piece of a preferred embodiment of the present invention. Fig. 6 is an exploded view of the locking mechanism and the test base substrate of a preferred embodiment of the present invention. Fig. 7 is a cross-sectional view of the line B-B shown in Fig. 2. 8A to 8D are photographs of pressure measurement performed by pressure sensitive paper in the prior art and this embodiment, respectively.

1: Test head

2: Lifting member

3: Multi-dimensional error absorption module

4: Limit sliding module

5: Pressure generating device

7: Test base board

8: Locking mechanism

21: Lifting drive module

81: lock arm

82: fixed pin

C: DUT

Claims (10)

An electronic component testing equipment capable of autonomously compensating the flatness of the contact interface between the test head and the test piece, including: A lifting member; A multi-dimensional error absorbing module, which includes a fixed part and a movable part, and the fixed part is assembled on the lifting member; A pressure generating device, which includes a fixed end and a pressure end, the fixed end is coupled to the movable part of the multi-dimensional error absorbing module; A limit sliding module, which includes a first sliding unit and a second sliding unit. The second sliding unit and the first sliding unit are coupled to each other and capable of lifting and sliding relative to each other. The first sliding unit is connected to the For the movable part of the multi-dimensional error absorbing module, the second sliding unit is connected to the pressing end of the pressure generating device; A temperature control unit, which is coupled to the second sliding unit of the limit sliding module; A test base substrate, which is located under the temperature control unit; A test seat, which is assembled on the substrate of the test seat and corresponds to the temperature control unit, and the test seat is used for accommodating the DUT; and A locking mechanism, comprising at least one locking arm and at least one fixing pin, one end of the at least one locking arm is connected to the lifting member, and the at least one fixing pin is assembled on the substrate of the test base; Wherein, the lifting member descends to make the temperature control unit approach the test seat, the other end of the at least one locking arm engages and locks the at least one fixing pin, and the pressure generating device applies a pressure to the waiting device through the temperature control unit. Test piece. For example, the electronic component testing equipment of claim 1, wherein the multi-dimensional error absorbing module further includes a pressure-bearing steel ball and a plurality of pressure-bearing elastic members, and the pressure-bearing steel ball and the plurality of pressure-bearing elastic members are arranged between the fixing member and the Between the movable parts, and the plurality of pressure-bearing elastic parts are equidistantly arranged on the four peripheries of the pressure-bearing steel ball. For example, the electronic component testing equipment of claim 2, wherein the movable part of the multi-dimensional error absorbing module includes a movable plate and a vertical plate, and the pressure-bearing steel ball and the plurality of pressure-bearing elastic parts are arranged between the fixed part and the Between the movable plates, the first sliding unit of the limit sliding module is arranged on the vertical plate. For example, the electronic component testing equipment of claim 1, wherein the limit sliding module further includes an L-shaped guide frame, which includes a vertical vertical plate and a horizontal horizontal plate; the second sliding unit is assembled in the vertical vertical The horizontal board is arranged between the pressure end of the pressure generating device and the temperature control unit. For example, the electronic component testing equipment of claim 4, wherein the pressure generating device includes a first pressure generating module and a second pressure generating module, and the first pressure generating module is coupled to the multi-dimensional error absorbing module For the movable part of the group, the second pressure generating module is between the first pressure generating module and the temperature control unit. For example, the electronic component testing equipment of claim 5, wherein the upper surface of the test piece includes a wafer pressure area and a circuit board pressure area; the temperature control unit includes an evaporator and a crimping block, the evaporator The upper surface is connected to the second pressure generating module, and the crimping block is connected to the lower surface of the evaporator and is used for crimping the wafer pressure-bearing area of the DUT. For example, the electronic component testing equipment of claim 6, wherein the second pressure generating module includes an outer frame cover, a pressing piston and a crimping plate, the outer frame cover is connected to the first pressure generating module, the The pressing piston is arranged in the outer frame cover, the crimping plate is connected to the outer frame cover, the crimping plate includes a protrusion and an opening, and the crimping block of the temperature control unit passes through the crimping plate The opening and the bump are used for crimping the pressure-bearing area of the circuit board of the DUT. For example, the electronic component testing equipment of claim 7, wherein the pressing piston of the second pressure generating module is connected to the horizontal plate of the L-shaped guide frame of the limit sliding module, and the pressing piston includes A first ventilation channel, the horizontal horizontal board includes a second ventilation channel, the first ventilation channel and the second ventilation channel are communicated with each other and connected to an air pressure source. For example, the electronic component testing equipment of claim 5, wherein the first pressure generating module includes a body, a pressure diaphragm, and a pressure member, the body includes a hollow chamber, and the pressure diaphragm is disposed in the hollow cavity And divide the hollow chamber into a first chamber and a second chamber, one end of the pressure member is accommodated in the second chamber, and the other end of the pressure member is connected to the second pressure generating Module; when the first chamber is filled with a fluid so that the pressure diaphragm contacts one end of the pressure member, the other end of the pressure member applies a force to the second pressure generating module. For example, the electronic component inspection device of claim 1, wherein the at least one locking arm includes an actuator and a sliding member; when the at least one locking arm engages the at least one fixing pin, the actuator drives the sliding member and Slide in a specific direction and tighten the fixing pin.

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