TWI817183B - Pressing mechanism, testing apparatus, and handler - Google Patents

Abstract

The present invention reveals a pressing mechanism, including a fixation member, at least one moving member, and an adjusting structure. The fixation member has a first assembling portion. The moving member is movably disposed to the first assembling portion. The moving member has a pressing member for pressing on a bearing portion of an electronic component. The adjusting structure includes a first member disposed on the fixation member and a second member disposed on the moving member. The first member and the second member are constructed to cooperate with each other to make the moving member movable on the fixation member along a first direction. With the function performed by the adjusting structure, the moving member moves actively along the first direction to fit the necessary height position in pressing on the bearing portion according to the height of the bearing portion. Therefore, pressure exerted on the bearing portion of the electronic component is achieved firmly and reliably.

Description

Crimping mechanism, testing device and operating machine

The present invention provides a crimping mechanism that enables the crimping component of a moving tool to reliably crimp the pressure-bearing component of an electronic component to improve test quality.

Nowadays, some electronic components are designed according to functions, and multiple pressure-bearing components are configured and packaged on a substrate. The pressure-bearing components can be chips or other ICs. The heights and dimensions of the plurality of different types of chips or ICs vary. Please refer to FIG. 1 . The electronic component 11 is configured with a first chip 112 with a higher height and a larger area in the middle area of the top surface of the substrate 111 , and a lower height and smaller area are respectively disposed on both sides of the first chip 112 . The second chip 113 and the third chip 114, and the electronic component 11 are provided with a plurality of contacts 115 on the bottom surface of the substrate 111.

Please refer to Figure 2. After the electronic component 11 is manufactured, it must be tested to eliminate defective products. The testing device is provided with an electrically connected circuit board 13 and a test socket 14 on the machine 12. The test socket 14 has a plurality of probes. 141, for holding and testing the electronic component 11; in order to ensure that the contact point 115 of the electronic component 11 contacts the probe 141 of the test socket 14, the test device is equipped with a crimping mechanism above the test socket 14, and the crimping mechanism moves The carrier arm 151 drives the pressing fixture 152 to move in the first direction (such as the Z direction), so that the pressing fixture 152 presses the electronic component 11 with a preset pressing force, so that the contact point 115 of the electronic component 11 contacts the test seat 14 The probe 141 is used to perform electrical testing operations.

Since the first wafer 112 , the second wafer 113 and the third wafer 114 have height differences, when the transfer arm 151 drives the press-down jig 152 to press down the electronic component 11 , the press-down jig 152 can only be pressed to a position with a higher height. The tall first wafer 112 cannot be pressed to the lower second wafer 113 and third wafer 114, resulting in a gap A between the pressing jig 152 and the second wafer 113 and third wafer 114, resulting in electronic components 11 Easily cracked due to uneven stress.

In addition, because the pressure of the pressing jig 152 only presses the first chip 112 of the electronic component 11, the second chip 113 and the third chip 114 are unevenly stressed, so that some of the contacts 115 located below cannot effectively contact. The corresponding probe 141 affects the test quality.

Furthermore, in order to enable the press-down jig 152 to press-connect the first chip 112, the second chip 113 and the third chip 114 of the electronic component 11, some manufacturers replace the press-down jig with a plurality of molded levels of different heights. The tool uses a plurality of levels to press-bond the first wafer 112, the second wafer 113 and the third wafer 114 respectively. , since a plurality of steps with different heights are directly formed on the pressing fixture, once the manufacturer tests different batches and types of electronic components, the transfer arm 151 must be assembled, disassembled, and replaced according to the height of each chip of the electronic component. Pressing fixtures are not only cumbersome and time-consuming to assemble and disassemble, but also require manufacturers to purchase a large number of different types of pressing fixtures, thereby increasing installation costs.

One object of the present invention is to provide a crimping mechanism, which includes a fixed device, at least one moving device and an adjustment structure. The fixed device is provided with a first assembly part, and the moving device is removably assembled on the first assembly part of the fixed device, and At least one crimping component is provided for crimping the pressure-bearing component of the electronic component. The adjustment structure is provided with a first component and a second component that cooperate with each other on the fixing tool and the moving tool, so that the moving tool can perform the third step on the fixing tool. Displacement in one direction; according to the height of the pressure-bearing component of the electronic component, the moving tool uses the adjustment structure to perform an active first-directional displacement on the fixture, and pre-adjusts the crimping height position of the crimping component so that it can be used during the test operation. The crimping parts of the moving tool can accurately crimp the pressure-bearing parts of electronic components to perform effectiveness testing, thereby improving test quality.

The second object of the present invention is to provide a crimping mechanism in which the first assembly part of the fixture can be used as a crimping surface and is equipped with at least one moving tool of the crimping component, according to a plurality of pressure-bearing components of different heights of electronic components. , use the adjustment structure to pre-adjust the crimping height position of the crimping component of the movable tool, so that the first assembly part of the fixture can match the crimping component of the movable tool to reliably crimp multiple pressure-bearing components of different heights, so that the electronic components can be evenly It prevents cracking due to force, thereby improving the yield of electronic components.

The third object of the present invention is to provide a crimping mechanism, the fixture of which is used to assemble a plurality of moving tools with crimping parts. According to the plurality of pressure-bearing parts of different heights of electronic components, the adjustment structure is used to pre-adjust the plurality of moving tools. The crimping height position of the crimping parts is to facilitate the crimping parts of multiple moving tools to accurately crimp multiple pressure-bearing parts of different heights, so that the electronic components can be evenly stressed to prevent cracks. , thereby improving the yield of electronic components.

The fourth object of the present invention is to provide a crimping mechanism. The moving tool includes a body and a joint. The joint has a crimping component. An angle conversion unit is provided between the body and the joint. The angle conversion unit allows the joint to bear pressure as it changes. The angle of the top surface of the component is adjusted by the angle swing, so that the crimping component of the joint completely fits the top surface of the pressure-bearing component, so that the joint of the moving tool exerts even force to press the pressure-bearing component of the electronic component, thereby improving the test quality. .

The fifth object of the present invention is to provide a crimping mechanism in which the crimping part of the moving tool is provided with at least one buffer. When the crimping part of the moving tool presses down the pressure-bearing part of the electronic component, the moving tool uses the buffering part to bear the pressure. The pressure components are pressed against each other to act as a buffer to prevent the pressure-bearing components from being damaged, thus improving the yield rate of electronic components.

The sixth object of the present invention is to provide a testing device, including at least one tester and the crimping mechanism of the present invention. The at least one tester is provided with an electrically connected transmission component and a circuit board for testing electronic components. The crimping mechanism of the present invention A pressure-bearing component installed above the tester for crimping the electronic components on the tester.

The seventh object of the present invention is to provide a working machine, which includes a machine platform, a feeding device, a receiving device, a testing device, a conveying device and a central control device. The feeding device is arranged on the machine platform and is provided with at least one feeding container. Container for accommodating at least one electronic component to be tested; a receiving device is arranged on the machine platform, and is provided with at least one receiving container for accommodating at least one electronic component under test; the testing device is arranged on the machine platform, It is also provided with at least one tester and a crimping mechanism of the present invention. At least one tester is used for testing electronic components. The crimping mechanism of the present invention is used for crimping electronic components on the tester. The conveying device is arranged on the machine platform and is provided with At least one conveyor is used to transport electronic components; the central control device is used to control and integrate the actions of each device to perform automated operations.

In order to enable the review committee to have a further understanding of the present invention, a preferred embodiment is cited together with the drawings, and the details are as follows:

Please refer to Figure 3. The first embodiment of the crimping mechanism of the present invention includes a fixing device 21, at least one moving device and an adjustment structure.

The fixture 21 can be a base body, a plate body or a frame body, and is not limited to this embodiment, as long as it is used for assembling a mobile device. The fixture 21 is provided with a first assembly part 211 at one end. The first assembly part 211 can be a flat surface or a stepped surface. Furthermore, according to the operation requirements, the first assembly part 211 can be used for assembly, or the first assembly part 211 One part of the area is used for assembly and another part of the area is used for crimping; for example, the first assembly part 211 is used for assembly and can be used to assemble at least one moving tool; for example, another part of the first assembling part 211 is used for crimping and can be used for crimping. The end surface of the other part of the area is used as a crimping surface for crimping the pressure-bearing parts corresponding to the electronic components; further, according to the operation requirements, the fixture 21 can be provided with at least one air extraction part in the other part of the area. (not shown in the figure), the air extraction part is connected to the crimping surface for picking up and moving electronic components. , it’s okay. In this embodiment, one end of the fixture 21 facing the tester (not shown) serves as the first assembly portion 211 , and the first assembly portion 211 is a flat surface for assembling at least one moving device.

In addition, the fixture 21 can be assembled on a carrier and configured as a fixed configuration or a movable configuration. The carrier can be a rack, a transfer arm or a robotic arm, etc.; for example, the carrier is a rack, and the fixture 21 can be configured as a fixed type. configured to allow the electronic components to move relative to the fixture 21; for example, the carrier is a transfer arm, and the fixture 21 is movable configured to allow the fixture 21 to move relative to the electronic components; of course, the fixture 21 and the electronic components The two components can also be movable relative to each other. In this embodiment, the fixture 21 is provided with a second assembly part 212 at the other end away from the first assembly part 211. The second assembly part 212 is connected to a carrier that is a transfer arm 23. The transfer arm 23 drives the fixture 21 Make a displacement in at least one direction.

Depending on the operation requirements, a floating structure (not shown) or a temperature control structure (not shown) can be installed between the transfer arm 23 and the fixture 21 so that the fixture 21 has a floating function or the fixture 21 can be temperature-controlled. .

At least one movable tool is removably assembled on the fixture 21 and is provided with at least one crimping component for crimping at least one pressure-bearing component (such as a chip or IC) of the electronic component (not shown); further , the moving tool is provided with at least one body, and uses the first end of the body as a crimping component. According to the operation requirements, the mobile tool is equipped with at least one air extraction part (not shown in the figure). The air extraction part is connected to the crimping component, so that the mobile tool has the function of transferring and crimping electronic components. Also, the mobile tool has The quantity and assembly position can be configured according to the operation requirements.

According to the operation requirements, the pressing part of the moving tool is equipped with at least one buffer member. The buffering part is a soft component (such as an indium chip, a cushion or an air bag). When the pressing part of the moving tool presses down the pressure-bearing part of the electronic component, it moves. The device uses a buffer member to bear the reaction force of the pressure-bearing component and act as a buffer to prevent the pressure-bearing component from being damaged, thereby improving the yield rate of the electronic component.

In this embodiment, at least one moving tool includes a plurality of moving tools. The plurality of moving tools are a first moving tool 22A, a second moving tool 22B, and a third moving tool 22C. The first moving tool 22A is assembled on the third moving tool of the fixed tool 21 . The middle area of an assembly part 211 is provided with a first body 221A. The first moving tool 22A uses the first body 221A toward the first end of the tester as the first crimping component 222A; the second moving tool 22B is assembled on the fixed The first assembly part 211 of the tool 21 is located on one side of the first moving tool 22A. The second moving tool 22B is provided with a second body 221B, and the second body 221B faces the first end of the tester as the second pressure. Connecting component 222B; the third moving tool 22C is assembled on the first assembly part 211 of the fixture 21 and is located on the other side of the first moving tool 22A. The third moving tool 22C is provided with a third body 221C and uses the third body 221C faces the first end of the tester as the third crimping part 222C; therefore, the first moving tool 22A, the second moving tool 22B and the third moving tool 22C use the first crimping part 222A and the second crimping part respectively. 222B and the third crimping component 222C are used for crimping the pressure-bearing components corresponding to the electronic components.

The adjustment structure is provided with a first component and a second component that cooperate with each other on the fixed device 21 and at least one moving device, so that the moving device can be actively adjusted to displace in the first direction (such as the Z direction) on the fixed device 21 and change the movement. The crimping height position of the crimping component of the tool ensures that the crimping component can indeed crimp the pressure-bearing component of the electronic component for effectiveness testing. Furthermore, the first component and the second component of the adjustment structure can be external threads and internal threads that cooperate with each other, or gears and racks, or detents and slots, etc., which are not limited to this embodiment; for example, the adjustment structure is fixed on The tool 21 has an accommodating hole, and a first component that is a latch member (such as a retractable bead) is provided in the accommodating hole, and a plurality of second components that are latching grooves are provided on the outer annular surface of the moving tool. The moving tool moves in the first direction in the accommodating hole, and uses a plurality of slots to selectively lock on the locking member of the fixing tool 21 , not only can the moving tool be assembled on the fixing tool 21, but also the crimping height position of the crimping component can be adjusted.

In this embodiment, the adjustment structure is provided with a plurality of first accommodating holes 213A, second accommodating holes 213B and a third accommodating hole 213B opened along the first direction (such as the Z direction) on the first assembly part 211 of the fixture 21 . hole 213C, and a first component that is a first internal thread 214A is provided in the first receiving hole 213A, a first component that is a second internal thread 214B is provided in the second receiving hole 213B, and a first component that is a second internal thread 214B is provided in the third receiving hole 213A. The hole 213C is provided with the first component of the third internal thread 214C; and the first body 221A of the first moving tool 22A is provided with the second component of the first external thread 223A, and the first external thread 223A is used for threading. Engage the first internal thread 214A, so that the first moving tool 22A is assembled on the fixture 21 and can be displaced in the first direction. The first crimping part 222A of the first moving tool 22A protrudes from the first assembly part of the fixture 21 211 below; the adjustment structure is provided with the second component of the second external thread 223B on the second body 221B of the second moving tool 22B. The second external thread 223B is used for screwing the second internal thread 214B, so that the second moving tool 22B It is assembled on the fixture 21 and can be displaced along the first direction. The second pressing part 222B of the second moving tool 22B protrudes below the first assembly part 211 of the fixture 21; the adjustment structure is on the third moving tool 22C. The third body 221C is provided with a second component that is a third external thread 223C. The third external thread 223C is used for screwing the third internal thread 214C, so that the third moving tool 22C is assembled on the fixture 21 and can be displaced along the first direction. , the third pressing part 222C of the third moving tool 22C protrudes below the first assembly part 211 of the fixing tool 21 .

Please refer to Figures 4 and 5. The crimping mechanism of the present invention is applied to the test device 20. The test device 20 includes at least one tester and the crimping mechanism of the present invention. The at least one tester is provided with at least one transmission component and a circuit board that are electrically connected. , for testing electronic components; the crimping mechanism of the present invention is assembled above the tester , for pressing the pressure-bearing parts of the electronic components on the tester; in this embodiment, the test device 20 is configured with a circuit board 24 and a test socket 25 that are electrically connected to the machine 30. The test socket 25 has a plurality of probes. The transmission member of the pin 26 is used to hold and test the electronic component 40; the bottom surface of the electronic component 40 is provided with a plurality of contacts 41, and a higher-height first chip 42 is packaged in the middle of the top surface. The pressure-bearing component, the position of the first wafer 42 is relative to the first moving tool 22A. The electronic component 40 is also provided with a lower-height second pressure-bearing component for the second wafer 43 on one side of the first wafer 42. The position of the wafer 43 is relative to the second moving tool 22B, and a third pressure-bearing member with a lower height is provided on the other side of the first wafer 42 and is the third wafer 44. The position of the third wafer 44 is relative to the third wafer 42. Mobile tool 22C.

Depending on the operation requirements, the testing device 20 further includes at least one testing chamber (not shown) for the tester to perform testing operations in the testing chamber.

Depending on the operating requirements, the testing device 20 further includes at least one temperature control unit (not shown). The temperature control unit is provided with at least one temperature control for temperature-controlling the electronic components so that the electronic components can be tested under simulated ambient temperatures for future use. Operation; further, the temperature control can be a heating element, a cooling chip or a fluid-containing base, and the temperature control can be configured on the fixed device 21 or the movable device.

Depending on the work requirements, during thermal testing, a blower can be installed in the test room to blow hot air to heat the interior of the test room.

Depending on the operation requirements, the testing device 20 further includes at least one pre-warming tray for pre-warming the electronic components to be tested.

Since the staff can know the height dimensions of the first chip 42 , the second chip 43 and the third chip 44 of the electronic component 40 in advance, they can set the transfer arm 23 to drive the fixture 21 and the first moving tool 22A. , the displacement value of the second moving tool 22B and the third moving tool 22C in the Z direction, and setting the down force value of the first moving tool 22A, the second moving tool 22B, and the third moving tool 22C; in other words, the staff electronically The different height dimensions of the first chip 42, the second chip 43 and the third chip 44 of the component 40 can be actively adjusted in advance to the assembly height of the first moving tool 22A, the second moving tool 22B and the third moving tool 22C. That is, the pressing height positions of the first pressing member 222A, the second pressing member 222B, and the third pressing member 222C can be adjusted in advance.

Taking the adjustment of the second moving tool 22B as an example, since the height of the second chip 43 of the electronic component 40 is low, the staff uses the adjustment structure to actively adjust the second moving tool 22B. During the adjustment, the second moving tool 22B can be directly rotated. Tool 22B, the second moving tool 22B uses the second external thread 223B to move downward in the Z direction along the second internal thread 214B in the fixture 21, and adjusts the second crimping component 222B to change from the initial height position L1 to the crimping height. The position L2 is in order to adapt to the height of the opposite second wafer 43; however, the first component and the second component of the adjustment structure are rigidly matched with each other to ensure that the second crimping component 222B is located at the crimping height position to ensure that the opposite crimping component is pressed. The second chip 43; and so on, the staff can use the adjustment structure to actively adjust the assembly height of the first moving tool 22A, the second moving tool 22B, and the third moving tool 22C in advance; after the adjustment is completed, the press-fitting The transfer arm 23 of the mechanism drives the fixed device 21 and the first moving device 22A The second moving tool 22B and the third moving tool 22C simultaneously move downward in the Z direction because the staff has pre-adjusted the pressing heights of the first crimping component 222A, the second crimping component 222B and the third crimping component 222C. position, that is, the first crimping part 222A, the second crimping part 222B, and the third crimping part 222C of the first moving tool 22A, the second moving tool 22B, and the third moving tool 22C can synchronize and reliably press the electronic components. The first chip 42, the second chip 43 and the third chip 44 of 40 enable the first chip 42, the second chip 43 and the third chip 44 of the electronic component 40 to evenly bear force and prevent cracking, and make the electronic component 40 The plurality of contacts 41 electrically contacts the probe 26 of the test socket 25 to perform the validity test operation, thereby improving the electronic component yield and test quality.

Therefore, when the testing device 20 tests electronic components of different batches or types, workers do not need to spend time and effort in assembling and disassembling multiple moving tools, but can use the adjustment mechanism to actively and directly adjust the assembly of multiple moving tools according to operational needs. The height not only improves the convenience of use, but also saves component costs.

Please refer to Figures 6 and 7. The second embodiment of the crimping mechanism of the present invention has the same general structure as the first embodiment. The difference between the second embodiment and the first embodiment is that the moving tool is provided with at least one body, and the body is assembled At least one joint is provided with at least one crimping component; further, the joint can be fixedly or movablely assembled on the body; further, an angle conversion unit is provided between the main body of the moving tool and the joint to convert the angle The unit is used for the angular swing of the joint part to adjust the fitting angle of the crimping part; further, the angle conversion unit is provided with a pendulum bearing component and a swing part that cooperate with each other on the body and the joint part to allow the joint part to oscillate; or The angle conversion unit is provided with at least one pressure-bearing member between the body and the joint member for the joint member to press against and perform angular swing.

In this embodiment, taking the first moving tool 22A as an example, its first body 221A is equipped with a first joint member 224A, and one end of the first joint member 224A facing the tester (not shown) serves as the first crimping component 2241A. , for crimping the pressure-bearing parts of electronic components; the first moving tool 22A is provided with a first buffer member 225A that is an indium piece on the first crimping part 2241A of the first joint part 224A; and the angle conversion unit is on the first One end of the first body 221A of the moving tool 22A is provided with a swing member that is the first ball 2211A, and the first joint member 224A is provided with a swing member that can assemble the first ball 2211A and is the first ball socket 2242A, so that the first ball socket 2242A can be assembled. A joint member 224A swings at an appropriate angle to adjust the fitting angle of the first crimping component 2241A.

Taking the first movable tool 22A to press the first wafer 42 as an example, if the top surface of the first wafer 42 is tilted due to process factors such as packaging or soldering, when the first movable tool 22A presses the first wafer 42 When on the top surface, the first moving tool 22A uses the angle conversion unit to provide a first ball 2211A and a first ball socket 2242A that cooperate with each other between the first body 221A and the first joint member 224A, so that the first joint member 224A moves along with the first joint member 224A. The angle of the top surface of the chip 42 is adjusted by using the first ball socket 2242A along the first ball 2211A of the first body 221A to make an angular swing adjustment, so that the first crimping component 2241A of the first joint member 224A is also tilted and completely arranged. The top surface of the first chip 42 is pressed closely and evenly, so that the first chip 42 is more evenly stressed to perform the test operation, thereby improving the test quality.

Please refer to Figure 8. The third embodiment of the crimping mechanism of the present invention includes a fixed device 21, at least one moving device and an adjusting structure. The difference between the third embodiment and the first embodiment is that the adjusting structure is between the fixed device 21 and the moving device. The tools are provided with a first component and a second component that cooperate with each other. The first component and the second component are gears and racks that cooperate with each other. In this embodiment, taking the first moving tool 22A as an example, the structure is adjusted on the fixed tool. The first receiving hole 213A of 21 is configured as a first component of the first gear 215A. The first gear 215A can be driven to rotate by a driving source (such as a motor). The adjustment structure is relative to the first body 221A of the first moving tool 22A. A row of second components is provided on one side of the gear 215A, which is the first rack 226A. The first rack 226A meshes with the first gear 215A, so that the first moving tool 22A is assembled on the fixture 21 and can be displaced in the first direction; in addition, One end of the first body 221A of the first moving tool 22A can be formed into a step block with a larger size area, and the side of the step block facing the tester can be used as the first crimping component 222A, or the first body 221A can be assembled with a larger size area. It is also possible to use a first connecting member to expand the pressing area of the first pressing component 222A. Therefore, when adjusting the crimping height position of the first crimping component 222A of the first moving tool 22A, the adjustment structure uses the driving source to drive the first gear 215A to rotate, and the first gear 215A drives the meshed first rack 226A to operate Z The first rack 226A causes the first moving tool 22A to synchronously move in the Z direction, thereby adjusting the crimping height position of the first crimping component 222A.

Please refer to Figure 9. The fourth embodiment of the crimping mechanism of the present invention includes a fixture 21, at least one moving device and an adjustment structure. The difference between the fourth embodiment and the first embodiment lies in the first assembly part of the fixture 21. A part of the area of 211 can be used as the first crimping surface 2111, and is equipped with a plurality of movable tools with crimping parts (such as the second movable tool 22B and the third movable tool 22C), according to the pressure of a plurality of different heights of the electronic components. components, the pressing height position of the first pressing surface 2111 of the fixture 21 can be different or the same as the pressing height of the second pressing component 222B of the second moving tool 22B and the third pressing component 222C of the third moving tool 22C. The adjusting structure is used to adjust the crimping height position of the second crimping component 222B and the third crimping component 222C so that the first crimping surface 2111 of the fixture 21 and the second crimping component of the second moving tool 22B 222B and the third crimping component 222C of the third moving tool 22C can reliably crimp a plurality of pressure-bearing components of different heights, so that the electronic components are evenly stressed, thereby improving the yield of the electronic components.

Please refer to Figures 3 to 5 and 10, which are schematic diagrams of the crimping mechanism and testing device 20 of the present invention applied to a working machine. The working machine includes a machine table 30, a feeding device 50, a receiving device 60, a testing device 20, a conveying device 70 and Central control device (not shown in the figure); in this embodiment, the operating machine is a testing operating machine; the feeding device 50 is configured on the machine platform 30 and is provided with at least one feeding holder 51 to accommodate the materials to be tested Electronic components; the receiving device 60 is disposed on the machine 30 and is provided with at least one receiving holder 61 for accommodating the tested electronic components; the testing device 20 is disposed on the machine 30 and includes at least one tester and Invention of the crimping mechanism , at least one tester performs testing operations on electronic components. The crimping mechanism of the present invention includes a fixture 21, at least one moving tool and an adjustment structure for crimping electronic components. In this embodiment, the first side of the machine 30 A plurality of test devices 20 are arranged opposite each other on the second side. The tester of each test device 20 includes an electrically connected circuit board 24 and a transmission component. The transmission component in this embodiment is a probe 26 and is assembled on a test socket 25 , for testing electronic components, the crimping mechanism is arranged above the test seat 25, and is provided with a first moving tool 22A, a second moving tool 22B and a third moving tool 22C for crimping electronic components; the conveying device 70 is configured The machine 30 is provided with at least one conveyor for conveying electronic components. In this embodiment, the conveying device 70 is provided with a first conveyor 71, a second conveyor 72 and a third conveyor 73. The first conveyor The device 71 moves in the X-Y-Z direction to take out the electronic components to be tested from the feeding device 50, and transfers them to the second conveyor 72. The third conveyor 73 is placed in the second conveyor 72 and the test seat 25 of the testing device 20 for exchange. Test electronic components and tested electronic components. The test seat 25 performs electrical testing operations on the electronic components to be tested. The crimping mechanism uses the transfer arm 23 to drive the fixture 21, the first moving tool 22A, the second moving tool 22B and the third moving tool. Tool 22C moves downward in the Z direction , so that the first moving tool 22A, the second moving tool 22B and the third moving tool 22C are evenly attached and press down the electronic components on the test seat 25 to perform the testing operation; the first conveyor 71 then takes out the tested components from the second conveyor 72 electronic components, and according to the test results, the tested electronic components are transferred to the collection holder 61 of the collection device 60 and stored in categories; the central control device is used to control and integrate the actions of each device to perform automated operations to achieve Practical benefits of improving work efficiency.

[custom] 11: Electronic components 111:Substrate 112:First chip 113:Second chip 114:Third chip 115:Contact 12:Machine 13:Circuit board 14:Test seat 141:Probe 151:Transfer arm 152: Press down the fixture A: Spacing [Invention] 20:Test device 21: Fixture 211:First Assembly Department 2111: First crimping surface 212:Second Assembly Department 213A: First accommodation hole 213B: Second receiving hole 213C: Third receiving hole 214A: First internal thread 214B: Second internal thread 214C: Third internal thread 215A: First gear 22A:First mobile device 221A:First body 2211A:First Sphere 222A: First crimping component 223A: First external thread 22B: Second mobile device 221B:Second body 222B: Second crimping component 223B: Second external thread 22C:Third mobile device 221C:The third body 222C: Third crimping component 223C: Third external thread 224A: First joint 2241A: First crimping part 2242A:The first ball socket 225A: First buffer member 226A: First rack 23:Transfer arm 24:Circuit board 25:Test seat 26:Probe 30:Machine 40: Electronic components 41:Contact 42:First chip 43:Second chip 44:Third chip L1: initial height position L2: crimping height position 50: Feeding device 51: Feed holder 60: Receiving device 61: Material receiving device 70:Conveying device 71: First conveyor 72: Second conveyor 73:Third conveyor

Figure 1: Schematic diagram of a conventional electronic component. Figure 2: Schematic diagram of the use of conventional test equipment. Figure 3: Schematic diagram of the first embodiment of the crimping mechanism of the present invention. Figure 4: Schematic diagram (1) of the use of the first embodiment of the crimping mechanism of the present invention. Figure 5: Schematic diagram (2) of the use of the first embodiment of the crimping mechanism of the present invention. Figure 6: Schematic diagram of the second embodiment of the crimping mechanism of the present invention. Figure 7: Schematic diagram of the use of the second embodiment of the crimping mechanism of the present invention. Figure 8: Schematic diagram of the third embodiment of the crimping mechanism of the present invention. Figure 9: Schematic diagram of the fourth embodiment of the crimping mechanism of the present invention. Figure 10: Schematic diagram of the crimping mechanism of the present invention applied to a working machine.

21: Fixture

22A:First mobile device

222A: First crimping component

22B: Second mobile device

222B: Second crimping component

22C:Third mobile device

222C: Third crimping component

23:Transfer arm

25:Test seat

26:Probe

40: Electronic components

41:Contact

42:First chip

43:Second chip

44:Third chip

Claims (17)

A crimping mechanism, including: a fixture; a plurality of movable tools: removably assembled on the fixture, and the plurality of movable tools are provided with a plurality of crimping parts for crimping a plurality of pressure-bearing parts of electronic components; Adjustment structure: The fixture is provided with a plurality of accommodation holes for accommodating the plurality of moving tools, and a mutual rigid cooperation transmission is provided between the plurality of accommodation holes of the fixture and the plurality of moving tools. The first component and the second component are used to pre-drive at least one of the first component or at least one of the second component, so that the second component of at least one moving tool moves along the first component on the fixture. Displace in one direction, change and adjust and ensure that the crimping component of the moving tool is at the preset crimping height position, so that the crimping component can indeed crimp the pressure-bearing component of the electronic component for effective testing. The crimping mechanism according to claim 1, wherein the fixing device is provided with a first assembly portion for assembling the plurality of moving devices. The crimping mechanism according to claim 2, wherein the fixture is provided with a second assembly part, and the second assembly part is used to connect a carrier for fixed configuration or movable configuration. The crimping mechanism of claim 2, wherein at least a part of the first assembly portion of the fixture serves as a crimping surface, and the crimping surface is used for crimping at least another pressure-bearing component of the electronic component. . The crimping mechanism as claimed in claim 1, wherein the plurality of moving tools are each provided with a body, and the first end of the body serves as the crimping component. The crimping mechanism of claim 1, wherein at least one of the moving tools is provided with a body, the body is equipped with at least one joint, and the joint is provided with at least one of the crimping components. The crimping mechanism as described in claim 6, wherein an angle conversion unit is provided between the body of the moving tool and the joint member, and the angle conversion unit is used for the angular swing of the joint member to adjust the adhesion of the crimping component. combined angle. The crimping mechanism as claimed in claim 7, wherein the angle conversion unit is provided with a pendulum-bearing component and a swinging component that cooperate with each other on the body and the joint member. The crimping mechanism according to claim 8, wherein the swing-bearing component and the swinging component of the angle conversion unit are ball sockets and spheres that match each other. The crimping mechanism of claim 7, wherein the angle conversion unit is provided with at least one pressure-bearing member between the body and the joint member for the joint member to press against and perform angular swing. The crimping mechanism as described in claim 1, wherein the adjustment structure is provided with the first component that is an internal thread in the receiving hole of the fixture, and is provided with the internal thread in the moving tool and is This second component is externally threaded. The crimping mechanism as claimed in claim 1, wherein the adjustment structure is provided with the first component that is a gear in the accommodation hole of the fixture, and the moving device is provided with a rack that engages the gear. the second component. The crimping mechanism according to any one of claims 1 to 12, wherein the crimping component of the moving tool is equipped with at least one buffer member. A testing device, including: at least one tester: equipped with electrically connected transmission components and circuit boards for testing electronic components; At least one crimping mechanism as described in claim 1: located above the tester for crimping the pressure-bearing component of the electronic component on the tester. The testing device as claimed in claim 14 further includes a testing chamber for the tester to perform testing operations in the testing chamber. The test device as claimed in claim 14 further includes a temperature control unit, the temperature control unit is provided with at least one temperature control for temperature control of electronic components. A working machine, including: a machine platform; a feeding device: configured on the machine platform, and provided with at least one feeding container for accommodating at least one electronic component to be tested; a receiving device: configured on the machine platform , and is provided with at least one receiving container for accommodating at least one tested electronic component; at least one testing device as described in claim 14: configured on the machine for testing electronic components; the conveying device: It is configured on the machine and is provided with at least one conveyor for conveying electronic components; a central control device: to control and integrate the actions of each device to perform automated operations.

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