TWM611776U - An automated test system using bridge connection - Google Patents

Abstract

The present invention discloses an automated test system using bridge connection, which is used to provide a test environment under preset temperature control conditions for electronic components, comprising: a carrier module and a testing platform for holding and connecting the carrier module when the carrier module is moved to a test position. The carrier module includes a first-type electrical connection pad, a second-type electrical connection pad, a slot, and a power control card movably plugged into the slot and used to provide power to the electronic component. The testing platform includes a first-type conductive unit and a second-type conductive unit that are provided for the first-type electrical connection pad and the second-type electrical connection pad to hold and connect correspondingly. In this way, the test system can be automated. The power supply can avoid the excessively long transmission path in the carrier module through the bridge connection method, and further reduce the construction cost of power supply.

Description

Bridge connection type automated test system

This creation is about a test system for electronic components, and more particularly about a bridge-connected automated test system that provides a test environment for electronic components under preset temperature control conditions.

In the manufacturing process of electronic components, various tests and inspections are required to ensure the stability of electronic components. Among them, electronic components are prone to generate high heat when operating, especially when the electronic components are fully loaded. These high heat may often cause the electronic components with poor physical fitness to produce errors when performing calculations.

Under the setting of the operating environment (for example: the preset temperature environment), through the test and inspection of the calculation of the electronic component, it is possible to show whether the electronic component is still in the preset operating environment based on the results of these calculations. It can perform correct calculations for the back end to determine whether the electronic component is defective.

However, the power supply conditions required by the electronic components are different, and the correct control of the power supply and the ambient temperature is critical to the correctness of the test results, which makes the construction cost of the test system too high.

One of the goals of this creation is to make the test system be automated.

Another purpose of this creation is to reduce the construction cost of the test system.

In order to achieve the above and other purposes, this creation proposes a bridge-connected automated test system, which is used to provide a test environment under preset temperature control conditions for electronic components. The automated test system includes a load-bearing module and a test bench. The load-bearing module is driven to move to a test position or an unloading position in the first axial direction. The load-bearing module includes: a first-type electrical connection pad, a second-type electrical connection pad, a slot, and a slot for the electronic component A test socket is provided, and a power control card movably plugged into the socket and used to provide power for the electronic component, the socket and the second-type electrical connection pad are arranged adjacent to the test socket And the second type electrical connection pad is coupled to the socket. The test bench is for the bearing module to bear against when moving to the test position, and includes a temperature control module and a main control module. The temperature control module is used to provide the preset temperature for the electronic component. In a test environment for controlling conditions, the main control module has a first-type conductive unit and a second-type conductive unit for the first-type electrical connection pad and the second-type electrical connection pad to abut correspondingly. Wherein, the electronic component and the operation signal required by the power control card are transmitted by the first-type conductive unit, and the input power required by the power control card is transmitted by the second-type conductive unit.

In an embodiment of the present creation, the carrying module includes a heat conduction block arranged on the electronic component, and the heat conduction block can provide the temperature control module when the carrying module is located at the test position Leaning against.

In an embodiment of the present invention, the main control module may have a driving board and a power regulating board, and a first-type base for fixing the first-type conductive unit is provided on the edge of one side of the driving board. A second-type base for fixing the second-type conductive unit is arranged on the side edge of one side of the power regulating board.

In an embodiment of the present invention, the carrying module may have a substrate for carrying the first-type electrical connection pad, the second-type electrical connection pad, the slot, and the test seat, and the substrate has a plurality of positioning holes Each of the first type base and the second type base has at least one positioning pin, and each positioning pin corresponds to a positioning hole.

In an embodiment of the present invention, there may be two positioning pins on each of the bases, the two positioning pins have different lengths and diameters, and the positioning pins with a shorter diameter have a longer length.

In an embodiment of the present creation, the drive board may be equipped with a power controller, the power controller is used to generate the control signal required by the power control card, and through the first type conductive unit and the second A type electrical connection pad is coupled to the socket, and the power controller controls the power control card to adjust a high voltage power transmitted from the second type conductive unit of the power regulation board through the second type electrical connection pad , So that the high-voltage power supply is adjusted to a low-voltage power supply as the power supply required by the electronic component.

In an embodiment of the present invention, the first-type conductive unit and the second-type conductive unit can each be an elastic conductive element.

In an embodiment of the present invention, the elastic conductive member may be a pogo pin.

According to this, the test system divided into the load-bearing module and the test bench not only allows the temperature control module to be independent of the load-bearing module, but also allows the control signal and power supply to be configured on the main control module. The electrical connection is provided to the load-bearing module through the bridge connection type to achieve automated testing. The swappability of the power control card also enables the load-bearing module to have power adjustability. Furthermore, it is also possible to shorten the power transmission path required to be provided on the carrier module, and it is not necessary to arrange a thicker conductive material on each carrier module to ensure the quality of power transmission. Therefore, the simplified power supply configuration also further reduces the construction cost of the test system.

In order to fully understand the purpose, features and effects of this creation, we will use the following specific examples and accompanying drawings to give a detailed description of this creation. The description is as follows:

In this article, the term "a" or "an" is used to describe a unit, component, structure, device, module, system, part or area, etc. This is just for the convenience of explanation and to provide a general meaning to the scope of this creation. Therefore, unless it is clearly stated otherwise, this description should be understood to include one or at least one, and the singular number also includes the plural number.

In this article, the term "including, including, having" or any other similar terminology described herein is not limited to the elements listed in this article, but may include the elements that are not explicitly listed but are the units, Components, structures, devices, modules, systems, parts or other elements that are usually inherent in the area.

In this article, the terms "first" or "second" and other similar ordinal numbers are used to distinguish or refer to the same or similar elements or structures, parts or regions, and do not necessarily imply these elements , Structure, location or region in the order of space. It should be understood that under certain circumstances or configurations, ordinal terms can be used interchangeably without affecting the implementation of this creation.

In the drawings illustrated in each embodiment, based on improving the clarity of the display of each element, avoiding being obscured by too many element symbols, the same elements in the same drawing are partially marked with element symbols only once.

Please refer to FIG. 1, which is a schematic diagram of an automated test system according to an embodiment of the present invention. The bridge-connected automated test system includes: a load-bearing module 100 and a test bench 200. The carrying module 100 can be driven to move between a testing position and an unloading position. This automated test system can be used to provide a test environment under preset temperature control conditions for electronic components. Wherein, the test position allows the carrying module 100 to abut the test bench 200 to complete the establishment of the electrical connection state (the electrical connection required when performing the test). The unloading position allows the carrying module 100 to cut off the electrical connection state with the test bench 200, so that the electronic components can be removed or the next batch of electronic components for testing can be replaced.

The abutting system allows the load-bearing module 100 to apply a certain degree of pressure to the test bench 200 when the load-bearing module 100 is located at the test position, which can further improve the stability of the electrical connection. In other embodiments, the abutment may also be a contact that can achieve electrical connection. FIG. 1 illustrates that two electronic components 300 under test are carried on a carrying module 100 at the same time.

The movement is relative. The load-bearing module 100 can be driven to move between the test position and the unloading position. It may also represent that the test bed 200 is actually moved, but for the test bed 200, it is a load bearing module. The module 100 moves between the testing position and the unloading position. The above and the following embodiments are described from the perspective of the test stand 200 (the test stand 200 does not move).

The load-bearing module 100 illustrated in FIG. 1 moves in a first axis L1 exemplified as a vertical direction. The carrying module 100 can be moved in the first axis L1 by the unilateral driver 10 shown in FIG. 1, so that the carrying module 100 can be positioned in the testing position or the unloading position. The state illustrated in FIG. 1 is that the carrying module 100 is driven upward, but has not yet reached the test position. The driver 10 is, for example, an elevating device that is fixed unilaterally with the carrying module 100, and may also be an elevating device that is fixed to the carrier module 100 on a polygonal side.

The carrying module 100 includes: a first-type electrical connection pad 111, a second-type electrical connection pad 112, a slot 120, a test socket 130, and a power control card 122. The aforementioned elements are, for example, arranged on a substrate 150, which is fixed to the driver 10, so that the substrate 150 is driven to move in the first axis L1.

The test socket 130 is used for setting the electronic component 300 to be tested. The test socket 130 is, for example, a socket or other connecting sockets for the electronic component 300 to be placed and provide electrical connections. The slot 120 provides the power control card 122 for plugging. The power control card 122 is used to perform a pre-regulation process on the power input to the electronic component 300, such as converting a high-voltage power supply to a low-voltage power supply. The power supply adjusted by the pre-regulation process is required for the operation of the electronic component 300 Power supply. The adjusted power supply may be, for example, the power required for supplying the electronic component 300 when operating in a full load mode, a half load mode, or other modes.

The power control card 122 can be movably plugged into the slot 120. Since the conversion components of the power supply are arranged on the power control card 122 instead of being soldered on the carrier module 100, this makes it difficult for these conversion components to process the heat generated during power conversion, which will not easily affect the test environment of the electronic component 300 , Thereby also reducing the factors that cause test errors and improving the accuracy of the test. The power control card 122 that can be movably plugged into the slot 120 can also be replaced correspondingly according to the type of the electronic component 300 under test, so that the test environment has higher adjustability, and can provide more diversified The test environment expands the testable range of the test system, and correspondingly reduces the cost of building the test system under each test item.

The socket 120 and the second-type electrical connection pad 112 can be arranged adjacent to the test socket 130, for example, around the test socket 130 or close to the test socket 130, and the second-type electrical connection pad 112 can be directly coupled to the socket 120, or the second-type electrical connection pad 112 is coupled to the socket 120 through a circuit on or inside the substrate 150. In addition, the socket 120 can also be directly coupled to the test socket 130, or the socket 120 can be coupled to the test socket 130 through a circuit on or inside the substrate 150. Since the socket 120 and the second-type electrical connection pad 112 are adjacent to the test base 130, the power transmission path required on the carrier module can be minimized, which greatly shortens or even avoids the setting of these power transmission paths. . Especially for electronic components that need to use a low-voltage and high-current power supply, this configuration can greatly save the use of thicker conductive materials on the load-bearing module. Therefore, the simplified power supply configuration also further reduces the construction cost of the test system.

The test bench 200 includes a main control module 210 and a temperature control module 220. The temperature control module 220 is used to provide a test environment under preset temperature control conditions for the electronic component 300 in the test position. The temperature control module 220 is, for example, an electric heating device or other devices that can generate heat, and can coordinate and control the temperature conditions of the test environment through a cooling system, for example. In the example of FIG. 1, the electronic component 300 is additionally provided with a heat-conducting block 140. When the carrying module 100 is located at the test position, the heat-conducting block 140 can be used to abut the temperature control module 220. In other implementation aspects, the heat conducting block 140 may not be provided, and the top of the electronic component 300 is against the temperature control module 220. The material of the heat conducting block 140 can be metal or other heat conducting materials.

The main control module 210 has a first type conductive unit 211 and a second type conductive unit 212. When the carrying module 100 is at the test position, the first-type conductive unit 211 is used to provide the first-type electrical connection pad 111 correspondingly abutting, and the second-type conductive unit 212 is used to provide the second-type electrical connection The pad 112 abuts correspondingly to form individual electrical connections. The operation signals required by the electronic component 300 and the power control card 122 are transmitted through the first type conductive unit 211, and the input power required by the power control card 122 is transmitted through the second type conductive unit 212.

FIG. 1 only takes one load-bearing module 100 and one test stand 200 as an example. The test system can be applied to a test cabinet or test rack composed of a plurality of load-bearing modules 100 and corresponding test stands 200 to achieve large Scale test.

Next, please refer to FIG. 2, which is a schematic diagram of the main control module of an embodiment of this creation. The main control module 210 has a driving board 214 and a power regulating board 213. A first-type base 2141 is provided on the end edge of one side of the driving board 214, and a second-type base 2131 is provided on the side edge of one side of the power regulating board 213. The respective bases (2131, 2141) are used to provide a fixed connection between the corresponding conductive unit (212, 211) and the driving board 214 or the power regulating board 213.

Please refer to FIG. 1 and FIG. 2 at the same time. The driving board 214 may be equipped with a power controller (not shown in FIG. 2). The power controller is used to generate control signals required by the power control card 122. The power controller is coupled to the first-type conductive unit 211 through a circuit on or inside the driving board 214. In addition, the first-type electrical connection pad 111 is coupled to the socket 120. Therefore, the power controller can control the power control card 122 to adjust the power input to the power control card 122 so that the power is adjusted to the working power required by the electronic component 300. The power input to the power control card 122 is the power transmitted from the second-type conductive unit 212 of the power regulating board 213 through the second-type electrical connection pad 112, for example, a high-voltage power supply. The power control card 122 can adjust the high-voltage power supply as a low-voltage power supply required by the electronic component 300.

Next, please refer to FIG. 3, which is a schematic diagram of the three-dimensional structure of an embodiment of the creation. FIG. 3 takes as an example the four groups of test positions on the carrying module 100. The carrier module 100 may include a substrate 150. For further improvement of the stability of the carrier module 100, the substrate 150 may also be matched with a bottom plate 155 as shown in FIG. 3, for example. The substrate 150 may have a plurality of positioning holes 151, and these positioning holes 151 are used to be positioned when the carrying module 100 enters the test position, that is, by the first type base 2141 and the second type base of the test bench 200 Each of the 2131 has at least one positioning pin 215, so that the load-bearing module 100 can be stably approached to the test bench 200 and reach the final test position.

In addition, adjacent positioning pins 215 can be arranged in a staggered arrangement on the base. The two positioning pins 215 on a base can be configured differently with different diameters and different lengths (not shown in Figure 3). The positioning pins with shorter diameters have longer lengths. In this way, for the same For large and small positioning holes, coarse positioning (using longer and thinner positioning pins) and fine positioning (using shorter and thicker positioning pins) can be distinguished during the alignment process, so that the electrical properties of the bridge connection can be distinguished. The connection is more accurate and stable, and it also avoids possible damage during the alignment process.

Further, the first-type conductive unit 211 and the second-type conductive unit 212 may be configured as elastic conductive members. Based on the elasticity of the conductive unit, it can further ensure the electrical connection within a certain stroke, so that the load-bearing module 100 has a certain degree of fault tolerance when it is driven against it. Wherein, the elastic conductive member may be, for example, a pogo pin as illustrated in FIG. 3.

In summary, the test system disclosed in the embodiment can be bridged electrical connection so that the control signal and power can be provided to the carrier module under the optimized configuration of the transmission path, in addition to achieving automated testing In addition, the configuration of the power supply can be simplified, thereby reducing the construction cost of the test system.

This creation has been disclosed in a preferred embodiment above, but those familiar with this technology should understand that this embodiment is only used to describe the creation, and should not be construed as limiting the scope of the creation. It should be noted that all changes and replacements equivalent to this embodiment should be included in the scope of this creation. Therefore, the scope of protection of this creation shall be subject to the scope of the patent application.

10: Drive 100: Carrying module 111: The first type of electrical connection pad 112: The second type electrical connection pad 120: Slot 122: power control card 130: Test Block 140: Thermal block 150: substrate 151: positioning hole 155: bottom plate 200: test bench 210: Main control module 211: The first type of conductive unit 212: second type conductive unit 213: Power regulation board 2131: Second type base 214: Driver board 2141: The first type pedestal 215: positioning pin 220: Temperature control module 300: electronic components L1: first axis

[Figure 1] is a schematic diagram of an automated test system according to an embodiment of this creation. [Figure 2] is a schematic diagram of the main control module of an embodiment of this authoring. [Figure 3] is a schematic diagram of the three-dimensional structure of an embodiment of this creation.

10: Drive

100: Carrying module

111: The first type of electrical connection pad

112: The second type electrical connection pad

120: Slot

122: power control card

130: Test Block

140: Thermal block

150: substrate

200: test bench

210: Main control module

211: The first type of conductive unit

212: second type conductive unit

220: Temperature control module

300: electronic components

L1: first axis

Claims (8)

A bridge connection type automated test system is used to provide a test environment under preset temperature control conditions for electronic components. The automated test system includes: A load-bearing module, which is driven to move to a test position or an unloading position in the first axis, includes: a first-type electrical connection pad, a second-type electrical connection pad, a slot, and a slot for the electronic component The test socket, and a power control card movably plugged into the socket and used to provide power to the electronic component, the socket and the second-type electrical connection pad are arranged adjacent to the test socket and the first The second type electrical connection pad is coupled to the socket; and A test bench for the bearing module to abut when moving to the test position, and includes a temperature control module and a main control module. The temperature control module is used to provide the preset for the electronic component In a temperature-controlled test environment, the main control module has a first-type conductive unit and a second-type conductive unit against which the first-type electrical connection pad and the second-type electrical connection pad correspondingly abut, wherein the electronic The component and the operation signal required by the power control card are transmitted by the first type conductive unit, and the input power required by the power control card is transmitted by the second type conductive unit. The automated test system according to claim 1, wherein the load-bearing module includes a heat-conducting block arranged on the electronic component, and the heat-conducting block provides the temperature control module when the load-bearing module is located at the test position Group of leaning. The automated test system according to claim 1, wherein the main control module has a driving board and a power regulating board, and a first type base for fixing the first type conductive unit is provided on an edge of one side of the driving board The base is provided with a second type base for fixing the second type conductive unit on the side edge of one side of the power regulating board. The automated test system according to claim 3, wherein the carrying module has a substrate for carrying the first-type electrical connection pad, the second-type electrical connection pad, the slot, and the test seat, and the substrate has a plurality of Positioning holes, the first type base and the second type base each have at least one positioning pin, and each positioning pin corresponds to a positioning hole. The automated test system according to claim 4, wherein there are two positioning pins on each of the bases, the two positioning pins have different lengths and diameters, and the positioning pins with a shorter diameter have a longer length. The automated test system of claim 3, wherein the drive board is equipped with a power controller, the power controller is used to generate the control signal required by the power control card, and the first type conductive unit And the first-type electrical connection pad is coupled to the slot, the power controller controls the power control card to adjust a second-type conductive unit transmitted from the second-type electrical connection pad of the power regulation board A high-voltage power supply, so that the high-voltage power supply is adjusted to a low-voltage power supply as the power supply required by the electronic component. The automated test system according to any one of claims 1 to 6, wherein the first-type conductive unit and the second-type conductive unit are each an elastic conductive member. The automated test system according to claim 7, wherein the elastic conductive member is a spring probe.

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