CN114355144A - Signal loop connecting device and system of silicon carbide double-pulse automatic testing equipment and manufacturing method - Google Patents
Signal loop connecting device and system of silicon carbide double-pulse automatic testing equipment and manufacturing method Download PDFInfo
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- CN114355144A CN114355144A CN202210011130.XA CN202210011130A CN114355144A CN 114355144 A CN114355144 A CN 114355144A CN 202210011130 A CN202210011130 A CN 202210011130A CN 114355144 A CN114355144 A CN 114355144A
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- 238000012360 testing method Methods 0.000 title claims abstract description 53
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 34
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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Abstract
The device comprises a drive board, wherein a plurality of thimbles which are used for being in one-to-one corresponding contact with signal pins on an HPD module are arranged on the drive board; the thimble and the signal pin are arranged on the driving plate, a positioning plate is arranged on one side of the driving plate, a plurality of through holes used for the thimble and the signal pin to insert are formed in the positioning plate, and the through holes are formed in one side, close to the driving plate, of the positioning plate to one side, far away from the driving plate, of the positioning plate. When the HPD module is driven to locating plate one side, in a plurality of signal needles inserted corresponding through-hole simultaneously to receive the restriction of corresponding through-hole to move along fixed route, until with the contact of corresponding thimble, accomplish the intercommunication of signal drive circuit, this application has the effect that signal drive circuit is miscellaneous low, test performance is good and the automatic correction signal needle.
Description
Technical Field
The invention relates to the field of silicon carbide double-pulse testing equipment, in particular to a signal loop connecting device, a signal loop connecting system and a signal loop manufacturing method of silicon carbide double-pulse automatic testing equipment.
Background
Silicon carbide is an inorganic substance and has the advantages of stable chemical property, high thermal conductivity, small thermal expansion coefficient and the like, silicon carbide has at least 70 crystal forms, and silicon carbide wafers are commonly used for manufacturing power devices such as diodes due to the advantages of silicon carbide, so that the power devices have the advantages of high ultimate working temperature, high critical breakdown electric field strength, high thermal conductivity and the like. Due to the wide use of power devices, silicon carbide wafers also have good market prospects.
Before a power device made of a silicon carbide wafer leaves a factory, a silicon carbide test platform is required to be used for testing, and in the related art, double-pulse automatic test equipment is generally used for testing. In the test process, the noise in the test loop is an important index for measuring the test performance, and the good low-noise loop is convenient for ensuring the test performance.
The test loop mainly comprises a test main loop and a signal driving loop, and the sense of clutter in the current test main loop is controlled to a certain extent. However, due to the design of the HPD module itself, the signal pin is much longer and longer. When the HPD module is connected with the drive plate, not only a plurality of signal pins are ensured to be simultaneously contacted with the drive plate, but also a plurality of signal pins are ensured to be accurately contacted with the drive plate, so that in the related art, the connection between the signal pins of the HPD module and the drive plate is realized by adopting a line connection mode.
Specifically, one end of the twisted pair is connected with a signal pin of the HPD module, and then the other end of the twisted pair is fixed in a connecting device. When the HPD module and the driving plate need to be connected, the driving plate is contacted with the connecting device. Because the structure of the connecting device is flexibly and variously arranged, the signal pin is more easily contacted with the driving plate accurately and simultaneously. However, the inventors have found that, since the wire connection pattern lengthens the connection path, the noise in the signal driving circuit is increased, so that the test performance is degraded.
Disclosure of Invention
In order to help reduce the noise in the signal driving loop, the invention provides a signal loop connecting device, a signal loop connecting system and a manufacturing method of silicon carbide double-pulse automatic testing equipment.
In a first aspect, the application provides a signal loop connecting device of silicon carbide double-pulse automatic test equipment, which adopts the following technical scheme:
a signal loop connecting device of silicon carbide double-pulse automatic test equipment comprises a drive board, wherein a plurality of thimbles which are used for being in one-to-one corresponding contact with signal pins on an HPD module are arranged on the drive board;
a positioning plate is arranged on one side of the driving plate, a plurality of through holes for the insertion of the thimble and the signal pin are formed in the positioning plate, and the through holes are formed from one side, close to the driving plate, of the positioning plate to one side, far away from the driving plate, of the positioning plate;
the thimble and the corresponding signal pin are inserted into the same through hole and are connected with a signal driving circuit after being contacted.
By adopting the technical scheme, when the signal driving circuit needs to be communicated, the HPD module is driven to one side of the positioning plate, the signal pins on the HPD module are all inserted into the corresponding through holes, the ejector pins on the driving plate are all positioned in the corresponding through holes, and the signal pins are in contact with the corresponding ejector pins. The locating plate all has spacing and guide effect to thimble and signal needle, is convenient for make a plurality of signal needles simultaneously and accurate with the contact of corresponding thimble to intercommunication signal drive circuit. The thimble on locating plate and the drive plate is used to replace the line connection in the correlation technique, which can ensure the accuracy of HPD module and drive plate, and is convenient to shorten the connection path length of the signal driving loop, which is helpful to reduce the noise in the signal driving loop.
Optionally, a plurality of positioning holes are formed in one side, away from the driving plate, of the positioning plate; each positioning hole corresponds to one through hole and is communicated with the corresponding through hole;
the aperture of one side, close to the driving plate, of the positioning hole is larger than the diameter of the signal pin, and the aperture of the positioning hole is gradually increased along the direction far away from the driving plate.
By adopting the technical scheme, the aperture of one end, close to the HPD module, of the positioning hole is larger than that of one end, close to the driving plate, of the positioning hole, so that when the signal pin is inserted into the positioning hole, if the signal pin has a certain inclination angle, the signal pin can still enter the positioning hole and can be limited by the positioning hole, and when the signal pin enters the through hole, the signal pin is corrected and straightened and returns to a correct position, and therefore the signal pins can be in full contact with corresponding ejector pins accurately and simultaneously.
Optionally, the driving plate is attached to and fixedly connected with the positioning plate, and one end of the thimble close to the positioning plate is inserted into the corresponding through hole.
Through adopting above-mentioned technical scheme, the drive plate is laminated with the locating plate, is convenient for reduce the clearance between drive plate and the locating plate to help shortening signal drive circuit's path length, reduce the miscellaneous sense. The driving plate is fixedly connected with the positioning plate, so that the ejector pins in the through holes are not easy to move, the signal pins and the corresponding ejector pins can be accurately and fully contacted, and therefore the signal pins can be accurately and fully contacted with the corresponding ejector pins.
Optionally, an end surface area of one end of the thimble in the through hole is larger than an end surface area of the corresponding contact of the signal pin, and a groove for inserting the corresponding signal pin is formed in the end surface of the thimble at the end of the through hole.
By adopting the technical scheme, the end face of one end of the ejector pin is provided with the groove, so that the contact area between the ejector pin and the signal pin is increased conveniently, and the connection stability of the signal driving circuit is ensured.
Optionally, a plurality of thimbles corresponding to the same HPD module are in a group, and a plurality of groups of thimbles corresponding to different HPD modules are arranged on the drive board.
By adopting the technical scheme, the signal loop connecting device can be suitable for different HPD modules, and the applicability of the signal loop connecting device is improved.
In a second aspect, the application provides a signal loop connection system of silicon carbide double-pulse automatic test equipment, which adopts the following technical scheme:
a signal loop connecting system of silicon carbide double-pulse automatic test equipment comprises an HPD module, a bearing module and the signal loop connecting device;
the HPD module is provided with a plurality of signal pins, and a main loop in the HPD module is electrically connected with the bearing module;
a through groove is formed in the bearing module; the signal loop connecting device is inserted into the through groove, and a positioning plate of the signal loop connecting device is connected with the bearing module.
By adopting the technical scheme, the groove formed in the bearing module is used for inserting the signal loop connecting device, the positioning plate is connected with the bearing module, and the driving plate is connected with the positioning plate, so that the bearing module, the positioning plate and the driving plate are integrally arranged. When the HPD module is connected, the connection path is shortened, and meanwhile, the accurate and stable connection of the drive board and the HPD module is ensured.
Optionally, the driving plate of the signal loop connecting device is connected to one side of the positioning plate away from the HPD module;
the bearing module is provided with a connecting hole;
the positioning plate is provided with a fixing hole, and the bearing module and the positioning plate are connected with a bolt or a positioning pin of the fixing hole through the connecting hole.
Through adopting above-mentioned technical scheme, locating plate and the module that bears utilize bolt or locating pin fixed connection, convenient and fast, connection stability is convenient for obtain guaranteeing.
Optionally, one end of a thimble on the driving plate extends into the through hole of the positioning plate, and the other end of the thimble extends to one side of the driving plate away from the positioning plate;
one end of the thimble, which is positioned in the through hole, is close to the side face of one side of the bearing module, which is close to the HPD module.
By adopting the technical scheme, when the signal pin is inserted into the through hole and is contacted with the corresponding thimble, the distance between one end of the signal pin contacted with the thimble and the side surface of the carrying module close to one side of the HPD module is shorter, the length of a path is convenient to shorten, and the reduction of the sense of impurities is facilitated.
In a third aspect, the present application provides a method for manufacturing a signal loop connection system of silicon carbide double-pulse automated testing equipment, which adopts the following technical scheme:
a method of making a signal loop connection system for silicon carbide dipulse automated test equipment, comprising:
manufacturing a positioning plate with a corresponding size based on the size of the driving plate;
corresponding grooves are formed in the bearing module based on the size of the positioning plate;
inserting the positioning plate into the through groove, and connecting the positioning plate and the bearing module;
moving the HPD module to one side of the positioning plate, and punching a through hole on the positioning plate according to the position of a signal pin on the HPD module;
driving the HPD module to a test position;
and connecting the driving plate to one side of the positioning plate, which is far away from the HPD module, and welding a thimble on the driving plate according to the position of the signal pin.
By adopting the technical scheme, the path of the signal driving circuit is convenient to ensure to be short, and the reduction of the noise of the signal driving circuit is facilitated.
Optionally, before drilling the through hole on the positioning plate according to the position of the signal pin on the HPD module, the method further includes:
and one side of the positioning plate, which is close to the HPD module, is provided with a positioning hole, the aperture of one side of the positioning hole, which is far away from the HPD module, is larger than the diameter of the signal needle on the HPD module, and the aperture of the positioning hole is gradually increased along the direction close to the HPD module.
Through adopting above-mentioned technical scheme, the locating hole can be corrected the crooked signal needle that produces, guarantees that a plurality of signal needles homoenergetic and the accurate contact of thimble that corresponds, and a plurality of signal needles contact with the thimble that corresponds simultaneously.
In conclusion, the positioning plate and the ejector pins which are used for being in contact with the signal pins are arranged on the driving plate, so that the HPD module and the driving plate can be simultaneously and accurately contacted without using conducting wires, the path length of a signal driving loop is shortened, and the noise is reduced.
Through the integration setting with drive plate, locating plate and carrier module, help guaranteeing that the signal needle is accurate insert the through-hole that corresponds in, insert appointed infiltration, a plurality of signal needles contact with the thimble that corresponds simultaneously, are convenient for improve test quality.
The locating hole is convenient for rectify the signal needle that produces the skew, makes the signal needle that is non-vertical or horizontal state because of the machining precision still can insert in the through-hole with other signal needle synchronization, is convenient for guarantee the connection quality of signal drive return circuit.
Drawings
Fig. 1 is an exploded view of a signal loop connection system of a silicon carbide double-pulse automated test equipment according to the present embodiment.
Fig. 2 is a top view of a signal loop connection system of the silicon carbide double-pulse automatic test equipment of the embodiment.
Fig. 3 is a cross-sectional view a-a of fig. 2.
Fig. 4 is an enlarged view of a portion a in fig. 3.
Fig. 5 is a flowchart of a method for manufacturing a signal loop connection system of silicon carbide double-pulse automated test equipment according to the embodiment.
Description of reference numerals:
1. a signal loop connection device; 11. a drive plate; 111. a thimble; 1111. a groove; 12. positioning a plate; 121. a through hole; 122. positioning holes; 123. a fixing hole; 2. an HPD module; 21. a signal pin; 3. a carrier module; 31. a through groove; 32. and connecting the holes.
Detailed Description
The embodiment of the application discloses a signal loop connecting system of silicon carbide double-pulse automatic test equipment, which comprises a signal loop connecting device 1, an HPD module 2 and a bearing module 3, wherein the HPD module 2 is provided with a plurality of signal pins 21, the bearing module 3 is integrally in a plate-shaped structure and embedded with an existing circuit structure, and the bearing module 3 is electrically connected with a main loop in the HPD module 2; the electrical connection may be a circuit connection in the form of a PCB board, or a line connection in the form of a twisted pair. Since the electrical connection between the HPD module 2 and the carrier module 3 is preset, the electrical circuit between the HPD module 2 and the carrier module 3 is already open. Therefore, after the HPD module 2 is signal-connected to the signal loop connection device 1, the signal driving loop is turned on. Since the position of the carrier module 3 and the position of the HPD module 2 are relatively fixed during testing, the path length of the signal driving loop is mainly determined by the signal connection length between the carrier module 3 and the signal loop connection device 1. That is, the closer the distance between the carrier module 3 and the signal loop connecting device 1 is, the shorter the path is, and the lower the noise of the signal driving loop is.
In order to shorten the connection path of the signal driving circuit, referring to fig. 1, a through slot 31 is opened in the carrier module 3, the signal circuit connection device 1 is inserted into the through slot 31, and the positioning plate 12 of the signal circuit connection device 1 is connected with the carrier module 3. Specifically, referring to fig. 2, in the present embodiment, the driving board 11 of the signal loop connecting device 1 is connected to a side of the positioning board 12 away from the HPD module 2, and the carrying module 3 is provided with a plurality of connecting holes 32. The central axis of the connecting hole 32 is a straight line, and the connecting hole 32 is opened along the thickness direction of the carrier module 3, that is, the connecting hole 32 is opened from the side of the carrier module 3 close to the driving board 11 to the side of the carrier module 3 away from the positioning board 12.
The positioning plate 12 is provided with a fixing hole 123, the fixing hole 123 corresponds to the connecting hole 32, and the bearing module 3 and the positioning plate 12 are connected with a bolt or a positioning pin of the fixing hole 123 through the connecting hole 32. It is understood that when the positioning plate 12 and the bearing module 3 are connected by using bolts, the fixing holes 123 are threaded holes adapted to the bolts; when the connection pin is used for connection, the positioning pin is in interference fit with the fixing hole 123 or the connection hole 32.
Referring to fig. 2, 3 and 4, the driving plate 11 is provided with a plurality of pins 111 contacting the signal pins 21 in a one-to-one correspondence manner, and the positioning plate 12 is provided with a plurality of through holes 121 for inserting the signal pins 21 and/or the pins 111. It should be noted that the thimble 111 and the signal pin 21 are made of conductive material, such as copper. After the positioning plate 12 is connected with the carrying module 3, one end of the thimble 111 on the driving plate 11 extends into the through hole 121 of the positioning plate 12, and the other end extends to a side of the driving plate 11 away from the positioning plate 12. In order to shorten the signal path, in the present embodiment, one end of the thimble 111 located in the through hole 121 is close to the side of the carrier module 3 close to the HPD module 2. Compared with fig. 3, the lower surface of the carrying module 3 is close to the side surface of the HPD module 2, so that the signal path can be shortened to 15mm, the noise in the signal driving loop is reduced, and the testing quality is improved.
The signal circuit connection device 1 will be described in detail below with reference to the above-described system.
The embodiment of the application also discloses a signal loop connecting device of silicon carbide double-pulse automatic test equipment, which refers to fig. 1 and comprises a drive board 11 and a positioning board 12, wherein the drive board 11 is provided with a plurality of thimbles 111 which are used for being in one-to-one corresponding contact with the signal pins 21 on the HPD module 2. The drive plate 11 is located on one side of the locating plate 12, and in particular, the drive plate 11 is located on the side of the locating plate 12 away from the HPD module 2 during testing. Referring to fig. 3, the positioning plate 12 is provided with a plurality of through holes 121 for inserting the thimble 111 and the signal pin 21. It should be noted that only one thimble 111 and one signal pin 21 are inserted into each through hole 121, and the thimbles 111 and the signal pins 21 inserted into the same through hole 121 are regarded as corresponding to each other. Since the signal pin 21 of the HPD module 2 is fixed in position, the opening position of the through hole 121 of the positioning plate 12 and the welding position of the thimble 111 of the driving plate 11 are known. The through hole 121 is opened from a side of the positioning plate 12 close to the driving plate 11 to a side of the positioning plate 12 far from the driving plate 11, as shown in fig. 3. During testing, the cylinder is used to drive the HPD module 2 to move towards the direction close to the positioning plate 12, so that the signal pins 21 are inserted into the corresponding through holes 121 and are in contact with the corresponding ejector pins 111, and then the signal driving circuit is communicated.
In the present embodiment, in order to make the signal circuit connection device 1 suitable for different models of HPD modules 2, a plurality of ejector pins 111 corresponding to the same HPD module 2 are grouped into one group, and a plurality of groups of ejector pins 111 corresponding to different HPD modules 2 are provided on the drive board 11.
Referring to fig. 3, a plurality of positioning holes 122 are formed in a side of the positioning plate 12 away from the driving plate 11, and each positioning hole 122 corresponds to and communicates with one through hole 121. The aperture of the positioning hole 122 on the side close to the driving board 11 is larger than the diameter of the signal pin 21, and the aperture of the positioning hole 122 gradually increases along the direction away from the driving board 11, specifically, the aperture of the positioning hole 122 refers to the diameter. For easy understanding, referring to fig. 3, the aperture of the positioning hole 122 gradually increases from top to bottom, and the aperture of the upper end of the positioning hole 122 is slightly larger than the diameter of the signal pin 21.
In the manufacturing and welding of the signal pins 21, due to the precision problem, the signal pins 21 in a non-completely vertical state are likely to appear in the plurality of signal pins 21 on the same HPD module 2, and if the signal pins 21 are directly contacted with the corresponding ejector pins 111, it is difficult to ensure that the plurality of signal pins 21 are simultaneously and accurately contacted with the corresponding ejector pins 111. In the embodiment, once the slightly inclined signal pin 21 passes through the positioning hole 122, due to the limitation of the shape of the positioning hole 122, the inclined signal pin 21 contacts the hole wall of the positioning hole 122, and the signal pin 21 is forced to rebound under the counter supporting force, returns to the correct position again, and is inserted into the through hole 121 to be in the vertical state, so that the HPD module 2 can be ensured to be simultaneously and accurately contacted with the thimble 111 on the driving board 11 when being lifted to the testing position.
Referring to fig. 3, the driving plate 11 is attached to and fixedly connected with the positioning plate 12, the fixing connection may be glue joint, welding, or pressing, and one end of the thimble 111 close to the positioning plate 12 is inserted into the corresponding through hole 121. The driving plate 11 and the positioning plate 12 are brought into contact with each other, so that the signal path is shortened.
The area of the end surface of the thimble 111 located at one end of the through hole 121 is larger than the area of the end surface correspondingly contacted with the signal pin 21, and the end surface of the thimble 111 located at one end of the through hole 121 is provided with a groove 1111 for inserting the signal pin 21, so that the contact area and the contact stability of the thimble 111 and the signal pin 21 are increased.
The implementation principle of the signal loop connecting device of the silicon carbide double-pulse automatic test equipment in the embodiment of the application is as follows: set up thimble 111 on drive plate 11, through the through-hole 121 of seting up on locating plate 12, carry on spacingly and direction to thimble 111 and the signal needle 21 on the HPD module 2, be convenient for when the test, a plurality of signal needles 21 can accurately contact with the thimble 111 that corresponds simultaneously. Because the drive board 11 and the HPD module 2 do not need to be connected by using a lead, a signal path is shortened, and the noise in a signal drive loop is reduced conveniently.
The embodiment of the application also discloses a method for manufacturing the signal loop connecting system of the silicon carbide double-pulse automatic test equipment. Referring to fig. 5, includes:
and S100, manufacturing a positioning plate 12 with a corresponding size based on the size of the driving plate 11.
The length of the positioning plate 12 is not less than the length of the driving plate 11, and the width of the positioning plate 12 is not less than the width of the driving plate 11. It should be noted that the size of the drive plate 11 cannot be smaller than the size of the HPD module 2.
And S200, arranging a corresponding through groove 31 on the bearing module 3 based on the size of the positioning plate 12.
Namely, the area and the shape of the cross section of the through groove 31 are matched with the cross section of the positioning plate 12.
And S300, inserting the positioning plate 12 into the through groove 31, and connecting the positioning plate 12 and the bearing module 3.
The connection mode can be through bolt or locating pin connection, also can be glued joint or welding.
S400, moving the HPD module 2 to one side of the positioning plate 12, and forming a positioning hole 122 on one side of the positioning plate 12 close to the HPD module 2.
The number of the positioning holes 122 is the same as the number of the signal pins 21 on the HPD module 2, or is more than the number of the signal pins 21 on the HPD module 2, but at least a plurality of positioning holes 122 should correspond to the positions of the signal pins 21 on the same HPD module 2, so that the signal pins 21 can be inserted during testing. The aperture of the positioning hole 122 on the side away from the HPD module 2 is larger than the diameter of the signal pin 21 on the HPD module 2, and the aperture of the positioning hole 122 gradually increases in the direction approaching the HPD module 2.
And S500, drilling a through hole 121 in the positioning plate 12 according to the position of the signal pin 21 on the HPD module 2.
It is understood that the positions of the positioning holes 122 correspond to the positions of the signal pins 21, and therefore, when the through holes 121 are opened, the through holes 121 can be opened according to the positions of the positioning holes 122, each through hole 121 is correspondingly communicated with one positioning hole 122, and the central axes are collinear.
S600, driving the HPD module 2 to a test position.
The test position refers to the last positioning position of the HPD module 2 during testing.
And S700, connecting the driving plate 11 to one side of the positioning plate 12 far away from the HPD module 2, and welding the thimble 111 on the driving plate 11 according to the position of the signal pin 21.
When the thimble 111 is soldered, one end of the thimble 111 is inserted into the corresponding through hole 121 and contacts the signal pin 21 in the through hole 121.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (10)
1. A signal loop connecting device of silicon carbide double-pulse automatic test equipment is characterized by comprising a driving board (11), wherein a plurality of ejector pins (111) which are used for being in one-to-one corresponding contact with signal pins (21) on an HPD module (2) are arranged on the driving board (11);
a positioning plate (12) is arranged on one side of the driving plate (11), a plurality of through holes (121) for the thimble (111) and the signal pin (21) to insert are formed in the positioning plate (12), and the through holes (121) are formed from one side, close to the driving plate (11), of the positioning plate (12) to one side, far away from the driving plate (11), of the positioning plate (12);
the thimble (111) and the corresponding signal needle (21) are inserted into the same through hole (121) and are contacted with each other, and then are communicated with a signal driving circuit.
2. The signal loop connecting device of silicon carbide double-pulse automatic test equipment according to claim 1, wherein: a plurality of positioning holes (122) are formed in one side, away from the driving plate (11), of the positioning plate (12); each positioning hole (122) corresponds to one through hole (121) and is communicated with the corresponding through hole (121);
the aperture of one side, close to the driving plate (11), of the positioning hole (122) is larger than the diameter of the signal pin (21), and the aperture of the positioning hole (122) is gradually increased along the direction far away from the driving plate (11).
3. The signal loop connecting device of silicon carbide double-pulse automatic test equipment according to claim 1, wherein: the driving plate (11) is attached to and fixedly connected with the positioning plate (12), and one end, close to the positioning plate (12), of the thimble (111) is inserted into the corresponding through hole (121).
4. The signal loop connecting device of silicon carbide double-pulse automatic test equipment according to claim 3, wherein: thimble (111) are located the terminal surface area of one end is greater than in through-hole (121) signal needle (21) correspond the terminal surface area of contact, thimble (111) are located the terminal surface of one end is seted up and is used for supplying to correspond in through-hole (121) signal needle (21) male recess (1111).
5. The signal loop connecting device of silicon carbide double-pulse automatic test equipment according to any one of claims 1 to 4, wherein: the plurality of thimbles (111) corresponding to the same HPD module (2) form a group, and a plurality of groups of thimbles (111) corresponding to different HPD modules (2) are arranged on the drive plate (11).
6. The utility model provides a signal return circuit connected system of automatic test equipment of carborundum dipulse which characterized in that: comprising an HPD module (2), a carrier module (3) and a signal loop connection device (1) according to any one of claims 1 to 5;
a plurality of signal pins (21) are arranged on the HPD module (2), and a main loop in the HPD module (2) is electrically connected with the bearing module (3);
a through groove (31) is arranged in the bearing module (3); the signal loop connecting device (1) is inserted into the through groove (31), and the positioning plate (12) of the signal loop connecting device (1) is connected with the bearing module (3).
7. The signal loop connection system of silicon carbide double-pulse automatic test equipment according to claim 6, wherein: the driving plate (11) of the signal loop connecting device (1) is connected with one side, away from the HPD module (2), of the positioning plate (12);
the bearing module (3) is provided with a connecting hole (32);
the positioning plate (12) is provided with a fixing hole (123), and the bearing module (3) is connected with the positioning plate (12) through a bolt or a positioning pin penetrating through the connecting hole (32) and the fixing hole (123).
8. The signal loop connection system of silicon carbide double-pulse automatic test equipment according to claim 6 or 7, wherein: one end of a thimble (111) on the driving plate (11) extends into a through hole (121) of the positioning plate (12), and the other end of the thimble extends to one side of the driving plate (11) far away from the positioning plate (12);
one end of the ejector pin (111) located in the through hole (121) is close to the side face of the carrying module (3) close to one side of the HPD module (2).
9. A method of making a signal loop connection system for silicon carbide double pulse automated test equipment as claimed in any one of claims 6 to 8, comprising:
manufacturing a positioning plate (12) with a corresponding size based on the size of the driving plate (11);
corresponding through grooves (31) are formed in the bearing module (3) based on the size of the positioning plate (12);
inserting the positioning plate (12) into the through slot (31) and connecting the positioning plate (12) and the carrying module (3);
moving an HPD module (2) to one side of the positioning plate (12), and punching a through hole (121) on the positioning plate (12) according to the position of a signal pin (21) on the HPD module (2);
driving the HPD module (2) to a test position;
and connecting the driving plate (11) to one side of the positioning plate (12) far away from the HPD module (2), and welding an ejector pin (111) on the driving plate (11) according to the position of the signal pin (21).
10. A method according to claim 1, further comprising, before said perforating a hole (121) in said positioning plate (12) according to the position of the signal pin (21) on said HPD module (2):
one side, close to the HPD module (2), of the positioning plate (12) is provided with a positioning hole (122), the diameter of the positioning hole (122) on the side far away from the HPD module (2) is larger than the diameter of the signal pin (21) on the HPD module (2), and the diameter of the positioning hole (122) is gradually increased along the direction close to the HPD module (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210011130.XA CN114355144B (en) | 2022-01-05 | 2022-01-05 | Signal loop connecting device, system and manufacturing method of silicon carbide double-pulse automatic test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN114355144B (en) | 2024-02-09 |
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