CN112305409A - Circuit board testing device and manufacturing method thereof - Google Patents
Circuit board testing device and manufacturing method thereof Download PDFInfo
- Publication number
- CN112305409A CN112305409A CN202011199896.2A CN202011199896A CN112305409A CN 112305409 A CN112305409 A CN 112305409A CN 202011199896 A CN202011199896 A CN 202011199896A CN 112305409 A CN112305409 A CN 112305409A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention provides a circuit board testing device and a manufacturing method thereof, and the circuit board testing device comprises a positioning plate, a connecting plate and a pressing plate, wherein the positioning plate is provided with a testing area in the middle, the positioning plate is provided with a plurality of positioning columns and a plurality of first positioning holes in the testing area, the connecting plate is positioned below the positioning plate, the connecting plate is provided with a connecting area and a switching area, the connecting area is positioned in the middle of the connecting plate and positioned below the testing area, the switching area is positioned at the periphery of the connecting area, the connecting plate is provided with a plurality of testing needles in the connecting area, the testing needles can penetrate through the first positioning holes, the connecting plate is provided with row needles in the switching area, the row needles are connected with the plurality of testing needles through copper-clad lines of the connecting plate, the pressing plate is positioned above the positioning plate. By utilizing the universal peripheral pin arrangement and the middle automatic test pin layout, the usability and the compatibility are improved, and the test efficiency is improved.
Description
Technical Field
The invention relates to the field of circuit board testing, in particular to a circuit board testing device and a manufacturing method thereof.
Background
At present, a common circuit board testing device mainly comprises a testing needle plate and a testing base, wherein a testing circuit is arranged on the testing needle plate, and the testing needle of the testing needle plate is contacted with a testing point of a circuit board by placing the circuit board on the testing needle plate, so that the related function detection of the circuit board is realized.
The design of the test needle plate and the layout of the test needle positions are designed according to the current circuit board to be tested, the CNC professional processing and drilling are carried out, a unique test box body is arranged, the cost is high, the connection of the circuits generally adopts wire connection, the circuit is complex and disordered and is not easy to maintain, meanwhile, the universality of the customized test device is poor, each circuit board to be tested basically corresponds to one test device, if the circuit board is changed in design and layout and the circuits, or the circuit boards of other series of products are replaced for testing, incompatibility of the test devices can be caused, the whole set of test devices need to be redesigned and manufactured, the cost is high, the manufacturing period is long, and the like.
Disclosure of Invention
The invention aims to provide a circuit board testing device with high universality and compatibility.
The second objective of the present invention is to provide a manufacturing method of the above circuit board testing device.
In order to achieve the first object of the invention, the invention provides a circuit board testing device, which comprises a positioning plate, a connecting plate and a pressing plate, wherein the positioning plate is provided with a testing area in the middle part, the positioning plate is provided with a plurality of positioning columns and a plurality of first positioning holes in the testing area, the plurality of first positioning holes penetrate through the positioning plate, the plurality of positioning columns are arranged on the upper surface of the positioning plate and are used for supporting a circuit board, the positioning plate can move towards the connecting plate, the connecting plate is positioned below the positioning plate, the connecting plate is provided with a connecting area and an adapter area, the connecting area is positioned in the middle part of the connecting plate and is positioned below the testing area, the adapter area is positioned at the periphery of the connecting area, the connecting plate is provided with a plurality of testing needles in the connecting area, the testing needles can penetrate through the first positioning holes, the connecting plate, the pressing plate is provided with a pressing area above the testing area, the pressing plate is provided with a plurality of pressing columns in the pressing area and is located on the lower surface of the pressing plate, and the pressing plate can move towards the positioning plate.
It can be seen from the above scheme that, by arranging a connection area in the middle of a connection board, the periphery of the connection area is a transition area, the transition area is fixedly provided with a standardized pin header, the connection area can be provided with a plurality of test pins in a customized manner, the pin header and the test pins are connected by copper-clad lines, so that the standardized pin header is connected with the customized test pins, after a circuit board to be tested is placed on a positioning board and positioned by positioning posts, the circuit board to be tested and the positioning board are moved downwards by the downward pressing of a lower pressing plate and the pressing posts, the test pins pass through a first positioning hole to be connected with a test position of the circuit board to be tested, so that corresponding tests can be completed by connecting the connection board through an external information processing device, when the circuit board to be tested is changed, the connection board is mainly changed, the design of the connection board mainly obtains test position information of the circuit board to be tested, and the connection of, by utilizing the universal peripheral pin header, the information processing device or the main control board at the rear stage of processing does not need to be rearranged, so that the usability and the compatibility are improved, and the testing efficiency is improved.
According to a further scheme, the circuit board testing device further comprises a clamping device, the clamping device comprises a driving device and a driving plate, the driving plate is located above the pressing plate and drives the driving plate to move towards the positioning plate, a plurality of magnets are arranged on the lower surface of the driving plate, a plurality of metal blocks are arranged on the upper surface of the pressing plate, and one metal block is connected with one magnet.
Further, the drive plate is provided with a plurality of positioning holes in a lower surface thereof, a magnet is disposed in one of the positioning holes, and a metal block is disposed in one of the positioning holes.
It is from top to bottom visible, can improve the stability of circuit test through clamping device's setting, and because when changing the circuit board that awaits measuring, connecting plate and clamp plate all can do design and preparation conveniently, and the clamp plate then accessible metal block and the cooperation of magnet improve connection convenience and stability.
According to a further scheme, the circuit board testing device further comprises a calibration plate, the calibration plate is located between the positioning plate and the connecting plate, a second positioning hole is formed in the calibration plate in a penetrating mode, the testing needle penetrates through the second positioning hole, and the testing needle is in clearance fit with the second positioning hole.
The connecting plate is fixedly connected with the calibration plate through a supporting column; the calibration plate is fixedly provided with an elastic guide pillar, and the elastic free end of the elastic guide pillar is connected with the positioning plate.
From top to bottom, through the calibration plate that is located the middle part, then to the three point location of test needle formation welding point, second locating hole and first locating hole to and the cooperation through the elasticity guide pillar, thereby effectively improve and connect the accuracy, improve test stability.
According to a further scheme, the circuit board testing device further comprises a base, wherein an adapter plate is arranged in the base, the adapter plate is fixedly arranged on the inner side of the top surface of the base, a pin arranging socket is arranged on the adapter plate, a connecting plate is arranged on the outer side of the top surface of the base, and a pin is connected with the pin arranging socket.
According to a further scheme, the circuit board testing device further comprises a main control board, the main control board is arranged in the base, the base is provided with a display screen and keys, the main control board is connected with the adapter board, and the display screen and the keys are respectively connected with the main control board.
It is from top to bottom visible, be used for bearing the weight of the connecting plate through setting up the base, and set up the keysets in the inboard of base, conveniently change the connecting plate of design can conveniently be connected with the row's of keysets needle socket, because interface standard version, so can conveniently change design and connection, and can set up main control board, display screen and button, improve testing arrangement's convenient to use nature then, owing to also mainly change the test of connecting plate alright realization different circuit boards, improve the commonality.
In order to achieve the second object of the present invention, the present invention provides a method for manufacturing a circuit board testing device, wherein the circuit board testing device is the circuit board testing device of the above scheme;
the manufacturing method comprises a connecting plate manufacturing method, and the connecting plate manufacturing method comprises the following steps:
acquiring test position information of a test point of a circuit board to be tested;
acquiring the pin header position information of the pin header of the connecting plate;
generating a test pin welding position, a pin header welding position and a copper-clad line according to the test position information and the pin header position information, wherein the copper-clad line is connected with the test pin welding position and the pin header welding position;
the test needles are welded at the test needle welding positions, and the row needles are welded at the row needle welding positions.
According to the scheme, the test pin welding positions, the pin arranging welding positions and the copper-clad lines can be conveniently generated in automatic design software by acquiring the test position information and the pin arranging position information, different customized connecting plates can be conveniently manufactured with low cost when different circuit boards are tested, and then the circuit boards can be conveniently and easily manufactured to be tested.
According to a further scheme, the manufacturing method further comprises a manufacturing method of the positioning plate, and the manufacturing method of the positioning plate comprises the following steps:
acquiring test position information of a test point of a circuit board to be tested and matching position information of a matching hole of the circuit board to be tested;
a first positioning hole is arranged in a penetrating manner according to the test position information;
and a positioning column is arranged according to the matching position information.
Therefore, the first positioning hole and the positioning column of the positioning plate can be manufactured with low cost and easily according to the test position information and the matching position information of the circuit board to be tested.
In a further aspect, the manufacturing method further includes a method for manufacturing a press plate, the method for manufacturing a press plate includes:
acquiring device position information of a component of a circuit board to be tested;
generating idle position information according to the device position information;
and arranging a compression leg on the pressure plate according to the idle position information.
It is thus clear that, according to device positional information generation free position information, and set up the compression leg at the clamp plate according to free position information, make the compression leg correspond the free position of the circuit board that awaits measuring then for the compression leg can directly adjoin to panel, avoids the compression leg to press the circuit device, causes the unnecessary harm, also improves test stability.
Drawings
Fig. 1 is a structural view of a first embodiment of a circuit board testing apparatus of the present invention.
Fig. 2 is an exploded view of each function board in the first embodiment of the circuit board testing apparatus of the present invention.
Fig. 3 is a structural view of a connection board in the first embodiment of the circuit board testing apparatus of the present invention.
Fig. 4 is a system block diagram of the first embodiment of the circuit board testing device of the present invention.
Fig. 5 is a structural view of a connection board in a second embodiment of the circuit board testing device of the present invention.
The invention is further explained with reference to the drawings and the embodiments.
Detailed Description
Circuit board testing arrangement embodiment:
referring to fig. 1 to 4, the circuit board testing device includes a base 11, a positioning plate 22, a connecting plate 24, a pressing plate 21, a calibration plate 23 and a main control board, a display 12, a switch 14 and a key 13 are arranged on the front end face of the base 11, the connecting plate 24 is arranged on the outer side of the top face of the base 11, the calibration plate 23 is arranged above the connecting plate 24, the positioning plate 22 is arranged above the calibration plate 23, the pressing plate 21 is arranged above the positioning plate 22, an adapter plate 25, the connecting plate 24, the calibration plate 23, the positioning plate 22 and the pressing plate 21 can be made of resin PCB plates with the thickness of 2MM, and the size and the peripheral fixing holes and positioning column mounting holes of the plates are all unified and used as standard templates.
The connecting plate 24 is provided with joining region 241 and switching region 242, switching region 242 is located the periphery of joining region 241, the connecting plate 24 is provided with a plurality of test needle welding position at joining region 241, a test needle welding position welding sets up a test needle 243, test needle welding position and test needle 243 arrange according to the test point of the circuit board that awaits measuring, the connecting plate 24 is provided with three row needle 244 at switching region 242, three row needle 244 is located the periphery of test needle 243, the printing has the copper-clad circuit (not shown) on the connecting plate 24, row needle 244 is connected with a plurality of test needles 243 through the copper-clad circuit of connecting plate 24.
The locating plate 22 is provided with test area 221 in the middle part, the connecting region 241 is located the middle part of connecting plate 24 and is located the below of test area 221, the locating plate 22 is provided with a plurality of reference columns 223 and a plurality of first locating hole 222 in test area 221, a plurality of first locating holes 222 run through locating plate 22, the position of first locating hole 222 is corresponding with the position of test needle 243, the position of a plurality of reference columns 223 is corresponding with the position of the mating holes of the circuit board that awaits measuring, a plurality of reference columns 223 set up the upper surface at locating plate 22 and cooperate with the mating holes of the circuit board that awaits measuring, then the realization is used for supporting circuit board.
The calibration plate 23 is located between the positioning plate 22 and the connecting plate 24, the calibration plate 23 is provided with a plurality of second positioning holes 231 in a penetrating manner, the second positioning holes 231 correspond to the first positioning holes 222, the connecting plate 24 is fixedly connected with the calibration plate 23 through four supporting columns 245 on the periphery, the calibration plate 23 is fixedly provided with an elastic guide post 232, and the elastic free end of the elastic guide post 232 at the upper end is connected with the positioning plate 22.
The circuit board testing device further comprises a clamping device, the clamping device is arranged on the base 11, the clamping device comprises a driving device 151, a driving plate 152 and guide posts 153, the driving plate 152 is movably arranged on the guide posts 153, the driving plate 152 is located above the pressing plate 21, the driving device 151 adopts a clamp or a motor, gear and rack driving mode, and the driving device 151 can drive the driving plate 152 to move towards the positioning plate 22, the driving plate 152 is provided with a plurality of positioning holes in the lower surface, the positioning holes are located at the edge positions of the driving plate, a magnet is arranged in one positioning hole, and the magnets are located at the lower surface of the driving plate 152.
The pressing plate 21 is located above the positioning plate 22, the pressing plate 21 is installed on the lower surface of the driving plate 152, the pressing plate 21 is provided with a pressing and holding area above the testing area 221, the pressing plate 21 is provided with a plurality of pressing columns 212 and located on the lower surface of the pressing plate 21, the upper surface of the pressing plate 21 is provided with a plurality of metal blocks 211, the plurality of metal blocks 211 are located on the periphery, one metal block 211 is located in one positioning hole, and one metal block 211 is connected with one magnet.
With the driving of the driving board 152, the driving board 152 and the pressing board 21 are then made to move toward the positioning board 22, the circuit board 10 to be tested is placed on the positioning board 22, the pressing posts 212 of the pressing board 21 abut against the epoxy resin board of the circuit board 10 to be tested, the circuit board 10 to be tested and the positioning board 22 are then driven to move downward, the testing pins 243 pass through the second positioning holes 231 and the first positioning holes 222, the testing pins 243 are in clearance fit with the first positioning holes 222 and the second positioning holes 231, respectively, and the testing pins 243 are connected with the testing points of the circuit board 10 to be tested.
An adapter plate 25 is arranged in the base 11, the adapter plate 25 is fixedly arranged on the inner side of the top surface of the base 11, the adapter plate 25 is provided with three pin header sockets 251, the three pin header sockets 251 are located on the periphery, and the pins 244 are connected with the pin header sockets 251. The main control board is provided with processing module, storage module, power module, light module, sound module, display screen interface module and interface module, the button also is connected with the main control board, processing module is connected with the row needle socket, display screen interface module is connected with the display screen, interface module includes RS485, RS323, serial ports or USB interface etc. some test driver can be write into to storage module to be carried out by processing module, realize the connection of circuit board 10 that awaits measuring then.
The manufacturing method of the circuit board testing device comprises the following steps:
the manufacturing method comprises a connecting plate manufacturing method, a positioning plate manufacturing method, a pressing plate manufacturing method and a calibration plate manufacturing method.
The manufacturing method of the connecting plate comprises the following steps:
firstly, obtaining test position information of a test point of a circuit board to be tested through circuit board drawing software such as Protel, Powerpcb, EasyEDA and the like;
subsequently, pin header position information of the pin header 244 of the connecting plate 24 is acquired;
then, in circuit board drawing software, generating a test pin welding position and a pin header welding position according to the test position information and the pin header position information, and then generating a copper-clad circuit through an automatic wiring function, wherein the copper-clad circuit is connected to the test pin welding position and the pin header welding position;
then, manufacturing a connecting plate according to the design printing;
finally, a test pin 243 is welded at the test pin welding position, and a pin 244 is welded at the pin header welding position.
The manufacturing method of the positioning plate comprises the following steps:
similarly, test position information of the test point of the circuit board to be tested and matching position information of the matching hole of the circuit board to be tested are obtained through circuit board drawing software;
then, a perforation position is generated according to the test position information, a positioning plate can be manufactured by printing, and then a first positioning hole 222 can be arranged through the positioning plate by a hole rotating device;
then, a positioning column mounting position is generated according to the fitting position information, and a positioning column 223 is provided at the positioning column mounting position.
The manufacturing method of the pressing plate comprises the following steps:
acquiring device position information of a component of a circuit board to be tested through circuit board drawing software;
then, generating idle position information according to the device position information, and printing to form a pressing plate, wherein the idle position refers to a position where no device is arranged on the circuit board;
the pressing column 212 is provided on the pressing plate 21 based on the idle position information.
The manufacturing method of the calibration plate comprises the following steps:
obtaining test position information of a test point of a circuit board to be tested through circuit board drawing software;
subsequently, a perforation position is generated according to the test position information, and a positioning plate may be printed, and then a first positioning hole 231 may be provided through the positioning plate by a hole-rotating device.
After the functional boards are manufactured, the connecting plate, the calibration plate, the positioning plate and the pressing plate can be installed, so that the circuit board testing device can be manufactured.
Referring to fig. 5 and comparing fig. 4, fig. 5 is a diagram of a connection board in actual use, the position of a test pin 343 of the connection board 34 in the second embodiment of the circuit board testing apparatus is changed, the test position information and the pin header position information of a new circuit board to be tested are obtained by referring to the above-mentioned connection board manufacturing method, the pin header position information is not changed, a copper-clad wire is generated by an automatic wiring function, the copper-clad wire is connected to the test pin soldering position and the pin header soldering position, after the connection board 34 is manufactured by printing, the test pin 343 and the pin header 344 are soldered at corresponding positions, and then a positioning board and a calibration board are manufactured at corresponding positions according to the above-mentioned method.
The test device has the technical characteristics that the adapter plate of the universal standardized interface is established and fixed on the base or the test box body for repeated use. And establishing a universal test pin connecting plate and a test pin calibration plate, wherein the middle area of the standard motherboard is a working area of test pin layout of different circuit boards to be tested. The above-mentioned each board of present case adopts the resin PCB board, and when designing the layout circuit board, as long as will await measuring the test point file of circuit board, paste in the mother board file through software processing can, simple manufacture, the circuit is clean and tidy, easy to maintain practices thrift the cost, improves the ageing.
The periphery of the adapter plate 25 and the periphery of the test pin connecting plate 24 are provided with plug pins, the pin positions correspond to each other one by one, the pin positions are distributed and cured to be standard according to test function parameters, and the adapter plate 25 can be provided with a common power supply module, a voltage detection module, a signal input/output interface, a display interface, other module interfaces and the like, and is standard and universal. The test pin module and the pressing plate 21 form a kit, each tested circuit board corresponds to one kit, and when the test pin module of the kit is used, the test pin module of the kit is only required to be inserted into the adapter plate of the universal test rack. The length of four copper columns 245 is calculated and determined according to the length of the test needle, which can ensure that the deviation of the test needle is within 0.2MM, the positioning plate 22 in the test needle module is also provided with a test needle hole in the middle area of the mother board PCB document, which is generally 0.5MM larger than the diameter of the test needle, and is supported by four elastic telescopic elastic guide columns 232, the elastic guide columns 232 are positioned on the connecting plate 24, the positioning plate 22 moves downwards to expose the needle point when the calibration plate 23 is tested, meanwhile, the positioning device of the circuit board to be tested is arranged on the plate, the pressing plate 21 is arranged in the middle area of the mother board, a plurality of plastic pressing columns are arranged according to the component vacancy area of the circuit board to be tested and are positioned on the lower surface of the pressing plate, the pressing plate 21 is fixed on the pushing mechanism of the base 11, when testing, the pressing plate 21 moves upwards and downwards, the plastic pressing columns push the circuit board to be tested, thereby achieving the test of the function and the parameter of the circuit board to be tested.
In addition, the calibration plate, the positioning plate and the pressing plate can be conveniently manufactured according to the method, and finally the calibration plate, the positioning plate and the pressing plate are assembled on the base and the clamping device for use.
Claims (10)
1. Circuit board testing arrangement, its characterized in that includes:
the positioning plate is provided with a testing area in the middle part and is provided with a plurality of positioning columns and a plurality of first positioning holes, the first positioning holes penetrate through the positioning plate, and the positioning columns are arranged on the upper surface of the positioning plate and are used for supporting a circuit board;
the connecting plate is positioned below the positioning plate, the positioning plate can move towards the connecting plate, the connecting plate is provided with a connecting area and a transfer area, the connecting area is positioned in the middle of the connecting plate and below the testing area, the transfer area is positioned on the periphery of the connecting area, the connecting plate is provided with a plurality of testing needles in the connecting area, the testing needles can penetrate through the first positioning holes, the connecting plate is provided with row needles in the transfer area, and the row needles are connected with the plurality of testing needles through copper-coated circuits of the connecting plate;
the pressing plate is located above the positioning plate, a pressing area is arranged above the testing area, a plurality of pressing columns are arranged in the pressing area and located on the lower surface of the pressing plate, and the pressing plate can move towards the positioning plate.
2. The circuit board testing device according to claim 1, wherein:
the circuit board testing device further comprises a clamping device, the clamping device comprises a driving device and a driving plate, the driving plate is located above the pressing plate, the driving device drives the driving plate to move towards the positioning plate, a plurality of magnets are arranged on the lower surface of the driving plate, a plurality of metal blocks are arranged on the upper surface of the pressing plate, and one metal block is connected with one magnet.
3. The circuit board testing device according to claim 2, wherein:
the driving plate is provided with a plurality of positioning holes on the lower surface, one magnet is arranged in one positioning hole, and one metal block is positioned in one positioning hole.
4. The circuit board testing device according to claim 1, wherein:
the circuit board testing device further comprises a calibration plate, the calibration plate is located between the positioning plate and the connecting plate, a second positioning hole penetrates through the calibration plate, the testing needle penetrates through the second positioning hole, and the testing needle is in clearance fit with the second positioning hole.
5. The circuit board testing device according to claim 4, wherein:
the connecting plate is fixedly connected with the calibration plate through a support column;
the calibration plate is fixedly provided with an elastic guide pillar, and the elastic free end of the elastic guide pillar is connected with the positioning plate.
6. The circuit board testing device according to any one of claims 1 to 5, wherein:
the circuit board testing device further comprises a base, wherein an adapter plate is arranged in the base, the adapter plate is fixedly arranged on the inner side of the top surface of the base, a pin arranging socket is arranged on the adapter plate, the connecting plate is arranged on the outer side of the top surface of the base, and the pin arranging is connected with the pin arranging socket.
7. The circuit board testing device according to claim 6, wherein:
the circuit board testing device further comprises a main control board, the main control board is arranged in the base, the base is provided with a display screen and keys, the main control board is connected with the adapter board, and the display screen and the keys are respectively connected with the main control board.
8. A method of manufacturing a circuit board testing device, characterized in that the circuit board testing device is the circuit board testing device according to any one of claims 1 to 7;
the manufacturing method comprises a connecting plate manufacturing method, and the connecting plate manufacturing method comprises the following steps:
acquiring test position information of a test point of a circuit board to be tested;
acquiring the pin header position information of the pin header of the connecting plate;
generating a test pin welding position, a pin header welding position and a copper-clad line according to the test position information and the pin header position information, wherein the copper-clad line is connected with the test pin welding position and the pin header welding position;
the test needle welding position welding is provided with the test needle the row needle welding position welding is provided with row needle.
9. The method of manufacturing according to claim 8, wherein:
the manufacturing method further comprises a manufacturing method of the positioning plate, and the manufacturing method of the positioning plate comprises the following steps:
acquiring test position information of a test point of a circuit board to be tested and matching position information of a matching hole of the circuit board to be tested;
a first positioning hole penetrates through the test position information;
and a positioning column is arranged according to the matching position information.
10. The method of manufacturing according to claim 8, wherein:
the manufacturing method further comprises a pressing plate manufacturing method, and the pressing plate manufacturing method comprises the following steps:
acquiring device position information of a component of a circuit board to be tested;
generating idle position information according to the device position information;
and arranging a compression leg on the pressure plate according to the idle position information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011199896.2A CN112305409A (en) | 2020-10-30 | 2020-10-30 | Circuit board testing device and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011199896.2A CN112305409A (en) | 2020-10-30 | 2020-10-30 | Circuit board testing device and manufacturing method thereof |
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| CN112305409A true CN112305409A (en) | 2021-02-02 |
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| CN202011199896.2A Pending CN112305409A (en) | 2020-10-30 | 2020-10-30 | Circuit board testing device and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114355144A (en) * | 2022-01-05 | 2022-04-15 | 忱芯电子(苏州)有限公司 | Signal loop connecting device and system of silicon carbide double-pulse automatic testing equipment and manufacturing method |
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| CN106569119A (en) * | 2016-10-17 | 2017-04-19 | 苏州润弘安创自动化科技有限公司 | High-precision automatic ultrathin flexible circuit board ICT test fixture and working method thereof |
| CN209821251U (en) * | 2019-04-24 | 2019-12-20 | 上海安路信息科技有限公司 | Chip testing device |
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| CN114355144A (en) * | 2022-01-05 | 2022-04-15 | 忱芯电子(苏州)有限公司 | Signal loop connecting device and system of silicon carbide double-pulse automatic testing equipment and manufacturing method |
| CN114355144B (en) * | 2022-01-05 | 2024-02-09 | 忱芯电子(苏州)有限公司 | Signal loop connecting device, system and manufacturing method of silicon carbide double-pulse automatic test equipment |
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