CN216209272U

CN216209272U - Multi-point contact microelectronic device testing equipment

Info

Publication number: CN216209272U
Application number: CN202122069269.3U
Authority: CN
Inventors: 姜鑫宇
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2022-04-05
Anticipated expiration: 2031-08-31

Abstract

The utility model relates to the technical field of microelectronics, in particular to a multi-point contact microelectronic device testing device, which comprises a testing body, wherein the testing body comprises a bottom plate, a tester is arranged at one end of the surface of the bottom plate, the end part of the tester is connected with a needle body through a plurality of wires, a carrier plate is arranged on the surface of the bottom plate, an adjusting component is arranged above the carrier plate, the adjusting component comprises a fixed plate, a plurality of sliding blocks are connected in the fixed plate in a sliding manner, the sliding blocks are connected with the surface of the needle body in a connecting manner, fixed rods are inserted at the end parts of the sliding blocks, a connecting plate is arranged at one end part of the fixed plate, and the connecting plate is connected with the surface of the carrier plate in a sliding manner. The plurality of pin bodies can be used for simultaneously carrying out power-on test of a plurality of point positions on the surface welding point of the circuit board, and the pin bodies can be adjusted to slide through the sliding block, so that the distance between the adjacent pin bodies can be changed, and the pin bodies can be conveniently matched with the welding point position on the surface of the current circuit board.

Description

Multi-point contact microelectronic device testing equipment

Technical Field

The utility model relates to the technical field of microelectronics, in particular to a multi-point contact microelectronic device testing device.

Background

Microelectronics is a new technology developed with integrated circuits, especially very large scale integrated circuits.

The present microelectronic technology includes a series of special technologies such as system circuit design, device physics, process technology, material preparation, automatic test, and packaging and assembling. For the test, that is, the surface of the circuit board is subjected to functional power-on test after production by using a test instrument, but the surface of the circuit board is subjected to single test by using the current test equipment only through a conductive needle, so that the high efficiency and accurate measurement of one-time multipoint are not achieved, and the measurement efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

It is an object of the present invention to provide a multi-contact microelectronic device testing apparatus to solve the problems set forth in the background art described above.

In order to achieve the purpose, the utility model provides a multi-point contact microelectronic device testing device which comprises a testing body, wherein the testing body comprises a bottom plate, a tester is installed at one end of the surface of the bottom plate, the end part of the tester is connected with a pin body through a plurality of wires, a carrier plate is arranged on the surface of the bottom plate, an adjusting component is arranged above the carrier plate and comprises a fixing plate, a plurality of sliding blocks are connected inside the fixing plate in a sliding mode, the sliding blocks are connected with the surface of the pin body in a connected mode, fixing rods are inserted into the end parts of the sliding blocks, a connecting plate is installed at one end part of the fixing plate, and the connecting plate is connected with the surface of the carrier plate in a sliding mode.

As a further improvement of the technical scheme, a transverse plate is arranged on the surface of the carrier plate and is oppositely arranged.

As a further improvement of the technical scheme, end grooves are symmetrically formed in the surface of the carrier plate and are in sliding connection with the transverse plate.

As a further improvement of the technical scheme, the surface of one transverse plate is provided with a plurality of inner cavities.

As a further improvement of the technical scheme, the fixing plate is hinged with the connecting plate, and a spring is arranged between the connecting plate and the fixing plate.

As a further improvement of the technical scheme, the outer surface of the connecting plate is inserted with a bottom block, the surface of the carrier plate is symmetrically provided with side grooves, and the end parts of the bottom block are in sliding connection with the side grooves.

As a further improvement of the technical scheme, an inner block is inserted into the surface of the connecting plate, and one end of the inner block protrudes out of the bottom block.

Compared with the prior art, the utility model has the beneficial effects that:

in this multi-point contact's microelectronic device test equipment, can carry out the circular telegram test of a plurality of positions to the surface welding point of circuit board simultaneously through a plurality of needle body, and through the regulation slip of slider, can make the interval between the adjacent needle body obtain changing to the needle body is enough to adapt to the welding point position on present circuit board surface.

Drawings

FIG. 1 is a schematic view of the overall structure of embodiment 1 of the present invention;

FIG. 2 is a schematic view of the structure of a test body in embodiment 1 of the present invention;

fig. 3 is a schematic view of a carrier structure in embodiment 1 of the present invention;

fig. 4 is a schematic structural diagram of an adjusting assembly in embodiment 1 of the present invention.

The various reference numbers in the figures mean:

100. a test body;

110. a base plate; 111. a tester; 112. a needle body; 113. a carrier plate; 1131. a chute; 1132. a side groove; 1133. a transverse plate; 1134. an end slot; 1135. an inner cavity; 114. an adjustment assembly; 1141. a fixing plate; 1142. a slider; 1143. fixing the rod; 1144. an end bar; 1145. a connecting plate; 11451. a spring; 11452. a bottom block; 11453. and (4) inner blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Example 1

Referring to fig. 1-4, the present embodiment provides a testing apparatus for a multi-point contact microelectronic device, including a testing body 100, the testing body 100 includes a bottom plate 110, a tester 111 is installed at one end of the surface of the bottom plate 110, an end of the tester 111 is connected to a pin 112 through a plurality of wires, a carrier plate 113 is disposed on the surface of the bottom plate 110, an adjusting assembly 114 is disposed above the carrier plate 113, the adjusting assembly 114 includes a fixing plate 1141, a plurality of sliders 1142 are slidably connected to the inside of the fixing plate 1141, the sliders 1142 are connected to the surface of the pin 112, fixing rods 1143 are respectively inserted into end portions of the sliders 1142, a connecting plate 1145 is installed at one end portion of the fixing plate 1141, and the connecting plate 1145 is slidably connected to the surface of the carrier plate 113.

In this embodiment, the surface of the carrier 113 is provided with the sliding slot 1131, that is, the connecting plate 1145 can slide along the inside of the sliding slot 1131, that is, when the circuit board needs to be tested, the tester 111 is firstly opened, the circuit board is then placed on the surface of the carrier 113, then the adjusting slider 1142 slides along the inside of the fixing plate 1141, so that the position of the slider 1142 connected to the pin 112 corresponds to the welding point on the surface of the adjacent circuit board, at this time, the fixing rod 1143 can be inserted into the internal fixing slider of the slider 1142 along the fixing plate 1141, that is, the position of the pin 112 is fixed, that is, the bottom of the pin 112 can contact with the welding point on the surface of the circuit board, and the end rod 4 is installed at one end of the fixing plate 1141, that the connecting plate 1145 slides along the inside of the sliding slot 1131 by the pushing of the end rod 1144, that the pin 112 inside the fixing plate 1141 can simultaneously contact with the welding point of the circuit board for conducting the power-on test, reached the effect of once only forming a large amount of test point positions, simultaneously, can change between the adjacent solder joint position of circuit board to adjacent needle body 112's position through slider 1142 for the surface welding point test of the multiple circuit board of position adaptation of needle body 112 reaches comparatively convenient test effect, and wherein tester 111's theory of operation is: the control unit applies a constant and high-precision current to an external load to be tested by controlling the constant current source, and then processes the obtained data to obtain a power-on effect test; in this device, can carry out the circular telegram test of a plurality of positions to the surface welding point of circuit board simultaneously through a plurality of needle body 112, and through the regulation slip of slider 1142, can make the interval between the adjacent needle body 112 obtain changing to needle body 112 is enough to be adapted to the welding point position on present circuit board surface.

In order to improve the adaptation practicality of diaphragm 1133, the surface of support plate 113 is equipped with diaphragm 1133, and diaphragm 1133 is relative setting, wherein through arranging the circuit board between diaphragm 1133 in, can effectually make the tip of circuit board obtain spacingly, prevents that the in-process circuit board at the test from producing unexpected vibrations, reduces the effect of test.

Further, end grooves 1134 are symmetrically formed in the surface of the carrier plate 113, the end grooves 1134 are slidably connected with the transverse plate 1133, wherein the transverse plate 1133 is in an "N" shaped structure, that is, the transverse plate 1133 can slide along the inside of the end grooves 1134, so that the transverse plate 1133 can be adjusted and changed at different positions in the end grooves 1134, and the size of the transverse plate 1133 further adapts to the side end of the circuit board.

Secondly, a plurality of inner cavities 1135 are formed on the surface of one of the transverse plates 1133, wherein the inner cavities 1135 are tapered, so that a tip of the needle body 112 can be inserted into the inner cavities 1135 to be protected after the needle body 112 is tested, thereby preventing the needle body 112 from being damaged.

In order to improve the adaptability between the fixing plate 1141 and the connecting plate 1145, the fixing plate 1141 is hinged to the connecting plate 1145, a spring 11451 is installed between the connecting plate 1145 and the fixing plate 1141, wherein, the spring 11451 is obliquely arranged, the fixing plate 1141 can be turned upwards through the end rod 1144, namely, the needle body 112 lifts up one end distance, the connecting plate 1145 slides along the chute 1131, when the position of the needle body 112 reaches the testing position, the end rod 1144 passes below, the fixing plate 1141 is placed and reset through the elastic stretching of the spring 11451, namely, the needle body 112 can be tested at the contact point position, after the test is finished, the fixing plate 1141 can be lifted up again, the cycle is reciprocal, and the needle body 112 is effectively prevented from being damaged due to forced contact with the welding point when sliding.

Simultaneously, the surface of connecting plate 1145 is pegged graft and is had end block 11452, side channel 1132 has been seted up to the surface symmetry of support plate 113, the tip and the side channel 1132 sliding connection of end block 11452, can make the position of connecting plate 1145 obtain adjusting and changing, the position altitude variation of fixed plate 1141 that makes one end connect, the contact of needle body 112 and circuit board surface changes promptly, but obtain the size of needle body 112 adaptation different thickness circuit boards, and can be synchronous through end block 11452 along the inside slip of side channel 1132, reach the slide test effect of connecting plate 1145.

Finally, the surface of the connecting plate 1145 is inserted with the inner block 11453, one end of the inner block 11453 protrudes out of the bottom block 11452, wherein the surface of the connecting plate 1145 is provided with a plurality of fixing ports, that is, after the connecting plate 1145 slides up and down along the inside of the bottom block 11452 for adjustment, the inner block 11453 can be inserted into the inside of the connecting plate 1145 through the bottom block 11452 for fixing, that is, the position of the connecting plate 1145 is fixed.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A multi-contact microelectronic device testing apparatus comprising a test body (100), characterized in that: the testing body (100) comprises a bottom plate (110), a tester (111) is installed at one end of the surface of the bottom plate (110), the end portion of the tester (111) is connected with a needle body (112) through a plurality of wires, a carrier plate (113) is arranged on the surface of the bottom plate (110), an adjusting component (114) is arranged above the carrier plate (113), the adjusting component (114) comprises a fixing plate (1141), a plurality of sliding blocks (1142) are slidably connected inside the fixing plate (1141), the sliding blocks (1142) are installed on the surface of the needle body (112), fixing rods (1143) are inserted into the end portion of each sliding block (1142), a connecting plate (1145) is installed at one end portion of the fixing plate (1141), and the connecting plate (1145) is connected with the surface of the carrier plate (113) in a sliding mode.

2. The multi-contact microelectronic device testing apparatus of claim 1, wherein: the surface of carrier plate (113) is equipped with diaphragm (1133), diaphragm (1133) are relative setting.

3. The multi-contact microelectronic device testing apparatus of claim 2, wherein: end grooves (1134) are symmetrically formed in the surface of the carrier plate (113), and the end grooves (1134) are in sliding connection with the transverse plate (1133).

4. The multi-contact microelectronic device testing apparatus of claim 3, wherein: the surface of one of the transverse plates (1133) is provided with a plurality of inner cavities (1135).

5. The multi-contact microelectronic device testing apparatus of claim 1, wherein: the fixing plate (1141) is hinged to the connecting plate (1145), and a spring (11451) is installed between the connecting plate (1145) and the fixing plate (1141).

6. The multi-contact microelectronic device testing apparatus of claim 5, wherein: the outer surface of the connecting plate (1145) is spliced with a bottom block (11452), the surface of the carrier plate (113) is symmetrically provided with side grooves (1132), and the end part of the bottom block (11452) is in sliding connection with the side grooves (1132).

7. The multi-contact microelectronic device testing apparatus of claim 6, wherein: an inner block (11453) is inserted into the surface of the connecting plate (1145), and one end of the inner block (11453) protrudes out of the bottom block (11452).