CN106405274B - Electronic element aging testing device - Google Patents
Electronic element aging testing device Download PDFInfo
- Publication number
- CN106405274B CN106405274B CN201610728507.8A CN201610728507A CN106405274B CN 106405274 B CN106405274 B CN 106405274B CN 201610728507 A CN201610728507 A CN 201610728507A CN 106405274 B CN106405274 B CN 106405274B
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- plate
- guide plate
- carrier plate
- burn
- mounting groove
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- 238000012360 testing method Methods 0.000 title claims abstract description 42
- 230000032683 aging Effects 0.000 title abstract description 24
- 230000007547 defect Effects 0.000 abstract description 5
- 230000002431 foraging effect Effects 0.000 abstract description 3
- 238000013459 approach Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Abstract
The invention relates to an electronic component aging test device, comprising: carrier plate and side deflector. By using the electronic element aging test device, the electronic element is not required to be welded on a PCB (printed circuit board) for aging test, the electronic element is only required to be placed in the mounting groove, the electronic element is respectively electrically connected with two end electrodes of the electronic element through the side conductive pins and the middle conductive plate, and then the electronic element is connected with an external power supply for current aging test, so that products are not damaged, all the products can be tested, the defects of the products are effectively eliminated, the electronic element aging test device is convenient and fast to use, stable and accurate, batch test can be realized, the working efficiency is improved, and the cost is reduced.
Description
Technical Field
The present invention relates to electronics in the field of the testing of components, in particular to an electronic element aging test device.
Background
With the development of electronic technology, the requirements on the stability and reliability of electronic components are also higher and higher, and especially the products applied in the aerospace industry. The defects and hidden dangers of the internal electrodes of the components can be exposed in advance through the high-temperature electrical aging test of the electronic component product, so that the finished product can withstand the test of time, and the electronic component product has important significance for improving the stability and reliability of the product. At present, an aging test directly welds an electronic element on a PCB, so that the appearance of a product is not only influenced, but also the tested product can only be discarded, so that only a sampling test is carried out, the performance of the batch of products can only be roughly evaluated by the test, the real purpose is not achieved, and the defects of the product cannot be effectively eliminated.
Disclosure of Invention
Accordingly, it is necessary to provide an electronic component burn-in test apparatus capable of performing burn-in test without damaging products without soldering electronic components on a PCB, in order to solve the problem that the burn-in test needs to solder electronic components on the PCB to damage products.
The specific technical scheme is as follows:
an electronic component burn-in apparatus comprising:
the mounting device comprises a carrier plate, wherein a mounting groove is formed in the carrier plate, a middle conductive plate used for being electrically connected with an electrode of an electronic element end is arranged on one side of the mounting groove, and a through hole is formed in the side wall of the mounting groove;
the side guide plate is positioned on one side of the carrier plate and can move relative to the carrier plate, a side conductive needle is fixedly arranged on the side guide plate, and one end of the side conductive needle can pass through the through hole and extend into the mounting groove to be electrically connected with the electrode at the other end of the electronic element.
In one embodiment, the side conductive pins are provided in plurality, and the side guide plates are fixedly arranged on the side guide plates at intervals.
In one embodiment, an upper guide plate capable of moving relative to the mounting groove is arranged above the mounting groove, and an upper conductive needle for electrically connecting with the middle electrode of the electronic element is fixedly arranged on the upper guide plate.
In one embodiment, the plurality of mounting grooves are arranged on the carrier plate at intervals side by side, the plurality of upper conductive pins are arranged on the upper guide plate at intervals side by side.
In one embodiment, the middle conductive plate divides the mounting groove into two columns, the number of the side guide plates is 2, the side guide plates are located at two sides of the carrier plate, the number of the upper guide plates is 2, and the upper guide plates are respectively located above one column of the mounting groove.
In one embodiment, the device further comprises a middle guide plate, the middle guide plate and the side face of the upper guide plate are arranged in a spaced and opposite mode, and a first adjusting piece is arranged on the upper guide plate and used for adjusting the upper guide plate to move relative to the middle guide plate.
In one embodiment, the side guide plate is connected with the carrier plate through an elastic piece, and a clamp is arranged on one surface of the side guide plate, which is far away from the carrier plate.
In one embodiment, elastic members are disposed in the side conductive pins and the upper conductive pins.
In one embodiment, the device further comprises a pressing component, the pressing component is abutted to one surface, away from the carrier plate, of the upper guide plate, and a second adjusting piece is arranged on the pressing component and used for adjusting the pressing component to move relative to the carrier plate, and the upper guide plate is elastically connected with the carrier plate.
In one embodiment, the device further comprises a bottom plate, the carrier plate is arranged on the bottom plate, and a buffer piece is arranged on one surface of the bottom plate, which is far away from the carrier plate; the bottom plate is provided with a positioning column, and the pressing component is provided with a positioning hole corresponding to the positioning column.
The beneficial effects of the invention are as follows:
the electronic element aging test device is used, electronic elements are not required to be welded on a PCB (printed circuit board) for aging test, the electronic elements are only required to be placed in the mounting groove, the side conductive pins and the middle conductive plate are respectively electrically connected with two end electrodes of the electronic elements for current test, the upper conductive pins are electrically connected with the middle electrodes of the electronic elements for voltage test, products are not damaged, therefore, all products can be tested, product defects are effectively eliminated, the electronic element aging test device is convenient and fast to use, stable and accurate, batch test can be realized, the working efficiency is improved, and the cost is reduced. The upper guide plate can adjust the position of the upper guide plate relative to the middle guide plate, so that the upper conductive needle and the middle electrode of the electronic element are positioned accurately, and the stability is improved.
Drawings
FIG. 1 is a side cross-sectional view of an electronic component burn-in apparatus according to an embodiment;
FIG. 2 is a schematic diagram of an exemplary embodiment of an electronic device burn-in apparatus;
fig. 3 is a schematic structural diagram of a carrier of an electronic device burn-in apparatus according to an embodiment.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "in communication with" another element, it can be directly in communication with the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
An electronic component burn-in apparatus according to an embodiment, as shown in fig. 1 and 2, includes a carrier plate 10 and a side guide plate 20.
One surface of the carrier plate 10 is provided with a mounting groove 11, see fig. 3, for fixing the electronic component. One side of the mounting groove 11 is provided with a middle conductive plate 12 for electrically connecting with the terminal electrode of the electronic element, and the side wall of the mounting groove 11 is provided with a through hole 13. Specifically, the conductive copper sheet on the middle conductive plate 12 is electrically connected with the terminal electrode of the electronic element, and is further provided with an interface for conveniently connecting an external power supply.
The side guide plate 20 is located at one side of the carrier plate 10 and is movable relative to the carrier plate 10. The side guide plate 20 is fixedly provided with a side conductive pin 21, and one end of the side conductive pin 21 can extend into the mounting groove 11 through the through hole 13 for being electrically connected with the other end electrode of the electronic element.
By using the electronic element aging test device, the electronic element is not required to be welded on a PCB (printed circuit board) for aging test, the electronic element is only required to be placed in the mounting groove 11, the side conductive pins 21 and the middle conductive plate 12 are respectively electrically connected with two end electrodes of the electronic element, the side conductive pins 21 and the middle conductive plate 12 are connected with an external power supply for current aging test, products are not damaged, and therefore all products can be tested, product defects are effectively eliminated, and the electronic element aging test device is convenient and quick to use.
Preferably, the side conductive pins 21 are fixed on the side guide plate 20 at intervals side by side, so that the current aging test can be performed on a plurality of electronic components at the same time, and the efficiency is improved.
Preferably, an upper guide plate 30 movable relative to the mounting groove 11 is provided above the mounting groove 11, and an upper conductive pin 31 for electrically connecting with the intermediate electrode of the electronic component is fixedly provided on the upper guide plate 30. The upper conductive needle 31 is electrically connected with the middle electrode, the upper conductive needle 31 is connected with an external power supply, and the side conductive needle 21 or the middle conductive plate 12 is connected with the external power supply, so that voltage aging test can be performed. And simultaneously, the upper conductive pins 31, the side conductive pins 21 and the middle conductive plate 12 are connected with an external power supply, so that the current aging test and the voltage aging test can be simultaneously performed. Further, an interface for conveniently connecting an external power supply is arranged on the upper guide plate 30, so that the upper conductive needle 31 can be conveniently electrified.
Preferably, the mounting grooves 11 are multiple and are arranged on the carrier plate 10 at intervals side by side, so that electronic components can be accurately placed, the upper conductive pins 31 are multiple and are fixedly arranged on the upper guide plate 30 at intervals side by side, and voltage aging tests can be performed on multiple electronic products at the same time.
Preferably, the middle conductive plate 12 divides the mounting groove 11 into two columns, the number of the side guide plates 20 is 2, and the upper guide plates 30 are two, located on both sides of the carrier plate 10, above one column of the mounting grooves 11, respectively. Therefore, the number of electronic elements which can be subjected to aging test at the same time is further increased, and the test efficiency is improved.
Preferably, the device further comprises a middle guide plate 40, wherein the middle guide plate 40 is arranged opposite to the side surface of the upper guide plate 30 at intervals, the middle guide plate 40 and the upper guide plate 30 extend in the same direction, and the upper guide plate 30 is provided with a first adjusting piece 32 such as an adjusting screw for adjusting the movement of the upper guide plate 30 relative to the middle guide plate 40. Specifically, two first adjusting members 32 are disposed on each upper guide plate 30, and are respectively located at two ends of the upper guide plate 30. Therefore, by adjusting the movement of the upper guide plate 30 relative to the middle guide plate 40, the position of the upper conductive needle 31 can be finely adjusted, so that the upper conductive needle 31 and the middle electrode of the electronic element can be accurately positioned, and the stability and accuracy of the test can be improved.
Preferably, the side guide plate 20 is connected to the carrier plate 10 by an elastic member, and a clamp 22 such as a quick clamp is provided on a side of the side guide plate 20 away from the carrier plate 10. The side guide plate 20 can be conveniently close to the carrier plate 10 by clamping the clamp 22, so that the side conductive pins 21 are electrically connected with the end electrodes of the electronic component in the mounting groove 11 through the through holes 13, and when the clamp 22 is loosened, the side guide plate 20 can be separated from the carrier plate 10 by elastic action, so that the side conductive pins 21 are disconnected with the end electrodes of the electronic component. Specifically, a guide groove 23 is formed on a surface of the side guide plate 20 corresponding to the front direction of the carrier plate 10, a guide column 14 is arranged on the carrier plate 10, the guide column 14 extends into the guide groove 23, the carrier plate 10 is connected with the side guide plate 20 through a spring 24, and the spring 24 is sleeved on the guide column 14. Further, the side guide plate 20 is provided with a side conductive plate 25 electrically connected with the side conductive pins 21, and the side conductive plate 25 is provided with an interface for conveniently connecting an external power supply.
Preferably, elastic members such as springs are provided in the side conductive pins 21 and the upper conductive pins 31, so that each of the side conductive pins 21 and the upper conductive pins 31 is connected with the terminal electrode and the middle electrode of the corresponding electronic component more stably under the elastic action.
Preferably, the device further comprises a pressing component 50, the pressing component 50 is abutted against one surface of the upper guide plate 30 away from the carrier plate 10, a second adjusting piece 51 such as a butterfly screw is arranged on the pressing component 50, and is used for adjusting the pressing component 50 to move relative to the carrier plate 10, and the upper guide plate 30 is elastically connected with the carrier plate 10. By adjusting the pressing assembly 50 to approach the carrier plate 10 downwards, thereby pressing the upper guide plate 30 to approach the carrier plate 10, the upper conductive pins 31 are connected with the middle electrodes of the electronic components in the mounting grooves 11, and when the pressing assembly 50 is adjusted to be away from the carrier plate 10, the elastic action naturally causes the upper guide plate 30 to be away from the carrier plate 10, so that the upper conductive pins 31 are disconnected with the middle electrodes. Specifically, the pressing assembly 50 includes a pressing block 52 and a supporting plate 53, the pressing block 52 is T-shaped and abuts against a surface of the upper guide plate 30 away from the carrier plate 10, the supporting plate 53 is connected with a surface of the pressing block 52 away from the upper guide plate 30, and the second adjusting member 51 is disposed on the supporting plate 53.
Preferably, the device further comprises a bottom plate 60, the carrier plate 10 is arranged on the bottom plate 60, and a buffer element 61 such as a foot pad is arranged on one surface of the bottom plate 60 away from the carrier plate 10, and specifically, the number of the buffer elements 61 is four. The base plate 60 and the cushioning member 61 make the device more stable and less prone to rattle.
Preferably, the bottom plate 60 is provided with positioning posts 62, and the pressing assembly 50 is provided with positioning holes 54 corresponding to the positioning posts 62, specifically, 4 positioning posts 62. The positioning posts 62 penetrate the positioning holes 54 and act as guides to make the movement of the hold-down assembly 50 relative to the carrier plate 10 smoother.
In using the electronic component burn-in apparatus, the electronic component is placed in the mounting groove 11, and the intermediate conductive plate 12 is electrically connected to one end electrode of the electronic component in the mounting groove 11. After the placement, the clamp 22 is clamped, the side guide plate 20 is pushed to approach the carrier plate 10, the side conductive pins 21 are electrically connected with the other end electrode of the electronic component in the corresponding mounting groove 11, and the middle conductive plate 12 and the side conductive pins 21 are connected with an external power supply, so that the current aging test can be performed. The position of the upper conductive needle 31 can be finely adjusted by adjusting the first adjusting piece 32 according to the requirement, so that the upper conductive needle 31 is aligned with the middle electrode of the electronic component, and the electronic component with different specifications can be adapted. The second adjusting piece 51 is adjusted to enable the pressing component 50 to be downward close to the carrier plate 10, so that the pressing guide plate 30 is downward close to the carrier plate 10, the upper conductive needle 31 is connected with the middle electrode of the electronic component in the mounting groove 11, the upper conductive needle 31 is connected with an external power supply, and the side conductive needle 21 or the middle conductive plate 12 is connected with the external power supply, so that voltage aging test can be performed. And simultaneously, the upper conductive pins 31, the side conductive pins 21 and the middle conductive plate 12 are connected with an external power supply, so that the current aging test and the voltage aging test can be simultaneously performed.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. An electronic component burn-in apparatus, comprising:
the mounting device comprises a carrier plate, wherein a mounting groove is formed in the carrier plate, a middle conductive plate used for being electrically connected with an electrode of an electronic element end is arranged on one side of the mounting groove, and a through hole is formed in the side wall of the mounting groove;
the side guide plate is positioned on one side of the carrier plate and can move relative to the carrier plate, a side conductive needle is fixedly arranged on the side guide plate, and one end of the side conductive needle can pass through the through hole and extend into the mounting groove to be electrically connected with the electrode at the other end of the electronic element;
an upper guide plate capable of moving relative to the mounting groove is arranged above the mounting groove, and an upper conductive needle used for being electrically connected with the middle electrode of the electronic element is fixedly arranged on the upper guide plate.
2. The device for burn-in of electronic components of claim 1 wherein said plurality of side conductive pins are disposed in said side guide plate in a side-by-side spaced relationship.
3. The device for burn-in testing of electronic components of claim 1, wherein said side guide plate is provided with a side conductive plate electrically connected to said side conductive pins, said side conductive plate being provided with an interface for facilitating connection to an external power source.
4. The device for burn-in of electronic components of claim 1 wherein said plurality of mounting slots are spaced apart side by side on said carrier plate and said plurality of upper conductive pins are spaced apart side by side and secured to said upper guide plate.
5. The electronic component burn-in apparatus of claim 1, wherein said middle conductive plate divides said mounting groove into two rows, said side guide plates are 2 in number and located on both sides of said carrier plate, and said upper guide plates are 2 in number and located above one row of said mounting grooves, respectively.
6. The electronic component burn-in apparatus of claim 1 further comprising an intermediate guide plate disposed in spaced opposition to a side of said upper guide plate, said upper guide plate having a first adjustment member for adjusting movement of said upper guide plate relative to said intermediate guide plate.
7. The device for burn-in of electronic components of claim 1 wherein said side guide plate is connected to said carrier plate by an elastic element, and wherein a clamp is provided on a side of said side guide plate remote from said carrier plate.
8. The electronic component burn-in apparatus of claim 1, wherein elastic elements are provided in said side conductive pins and said upper conductive pins.
9. The device for burn-in testing of electronic components of claim 1, further comprising a pressing assembly, wherein the pressing assembly abuts against a surface of the upper guide plate, which is far away from the carrier plate, and a second adjusting member is disposed on the pressing assembly, and is used for adjusting the pressing assembly to move relative to the carrier plate, and the upper guide plate is elastically connected with the carrier plate.
10. The device for burn-in of electronic components of claim 9 further comprising a base plate, said carrier plate being disposed on said base plate, a buffer being disposed on a side of said base plate remote from said carrier plate; the bottom plate is provided with a positioning column, and the pressing component is provided with a positioning hole corresponding to the positioning column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610728507.8A CN106405274B (en) | 2016-08-25 | 2016-08-25 | Electronic element aging testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610728507.8A CN106405274B (en) | 2016-08-25 | 2016-08-25 | Electronic element aging testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106405274A CN106405274A (en) | 2017-02-15 |
| CN106405274B true CN106405274B (en) | 2023-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610728507.8A Active CN106405274B (en) | 2016-08-25 | 2016-08-25 | Electronic element aging testing device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102447833B1 (en) * | 2018-02-09 | 2022-09-27 | 주성엔지니어링(주) | Electric power interface |
| CN108529174A (en) * | 2018-03-12 | 2018-09-14 | 武汉普赛斯电子技术有限公司 | A kind of COC agings and test fixture |
| CN109596968A (en) * | 2018-11-09 | 2019-04-09 | 天津航空机电有限公司 | It is a kind of for debugging the tool of multiple groups little module simultaneously |
| CN109444618A (en) * | 2018-12-28 | 2019-03-08 | 苏州比雷艾斯电子科技有限公司 | A kind of electronic component Current Voltage ageing tester and method |
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| JPH08160075A (en) * | 1994-12-09 | 1996-06-21 | Nhk Spring Co Ltd | Conductive contact unit |
| KR20000005901A (en) * | 1998-06-05 | 2000-01-25 | 가야시마 고조 | Carrier board for testing ic device |
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| CN106405274A (en) | 2017-02-15 |
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