TWI750984B - An automated test system using bridge connection - Google Patents

Abstract

The present invention discloses an automated test system using bridge connection, which is used to provide a test environment under preset temperature control conditions for electronic components, comprising: a carrier module and a testing platform for holding and connecting the carrier module when the carrier module is moved to a test position. The carrier module includes a first-type electrical connection pad, a second-type electrical connection pad, a slot, and a power control card movably plugged into the slot and used to provide power to the electronic component. The testing platform includes a first-type conductive unit and a second-type conductive unit that are provided for the first-type electrical connection pad and the second-type electrical connection pad to hold and connect correspondingly. In this way, the test system can be automated. The power supply can avoid the excessively long transmission path in the carrier module through the bridge connection method, and further reduce the construction cost of power supply.

Description

Bridge-connected automated test system

The present invention relates to a test system for electronic components, and more particularly, to a bridge-connected automatic test system for providing a test environment under preset temperature control conditions for electronic components.

In the manufacturing process of electronic components, various tests and inspections are required to ensure the stability of electronic components. Among them, the electronic components are prone to generate high heat during operation, especially when the electronic components are fully loaded. These high heats can often cause poor electronic components to perform their calculations incorrectly.

Under the setting of the operating environment (for example: the preset temperature environment), through the test and inspection on the operation of the electronic components, it can be shown whether the electronic components are still in the preset operating environment based on the calculation results. The correct operation can be performed, and then the back end can determine whether the electronic component is a defective product.

However, the power supply conditions required by the electronic components are different, and the correct control of the power supply and the ambient temperature is critical to the correctness of the test results, which makes the construction cost of the test system too high.

An object of the present invention is to enable the testing system to be automated.

Another object of the present invention is to reduce the construction cost of the test system.

In order to achieve the above object and other objects, the present invention provides a bridge-connected automated test system for providing a test environment under preset temperature control conditions for electronic components. The automated test system includes a load-bearing module and a test bench. The carrying module is driven to move to a test position or an unloading position along the first axis, and the carrying module includes: a first type electrical connection pad, a second type electrical connection pad, a slot for the electronic component A test socket is provided, and a power control card movably plugged into the slot and used to provide power for the electronic component, the socket and the second-type electrical connection pad are arranged adjacent to the test socket And the second-type electrical connection pad is coupled to the slot. The test bench is used for the bearing module to abut against when moving to the test position, and includes a temperature control module and a main control module, the temperature control module is used for providing the electronic component with the preset temperature A test environment with controlled conditions, the main control module has a first-type conductive unit and a second-type conductive unit for the first-type electrical connection pad and the second-type electrical connection pad to abut against correspondingly. Wherein, the operation signal required by the electronic component and the power control card is transmitted by the first-type conductive unit, and the input power required by the power control card is transmitted by the second-type conductive unit.

In one embodiment of the present invention, the carrying module includes a heat-conducting block arranged on the electronic component, and the heat-conducting block can provide the temperature control module when the carrying module is at the test position. against.

In an embodiment of the present invention, the main control module may have a driving board and a power supply adjusting board, and a first-type base for fixing the first-type conductive unit is disposed on an edge of a side surface of the driving board, A second-type base for fixing the second-type conductive unit is arranged on a side edge of one side of the power supply adjustment plate.

In one embodiment of the present invention, the carrying module may have a substrate for carrying the first-type electrical connection pad, the second-type electrical connection pad, the slot, and the test seat, and the substrate has a plurality of positioning holes , each of the first type base and the second type base has at least one positioning pin, and each positioning pin corresponds to a positioning hole.

In one embodiment of the present invention, there may be two positioning pins on each of the bases, the two positioning pins have different lengths and diameters, and the positioning pin with the shorter diameter has a longer length.

In an embodiment of the present invention, a power controller may be mounted on the driver board, and the power controller is used to generate the control signals required by the power control card, and uses the first type conductive unit and the second A type of electrical connection pad is coupled to the slot, and the power controller controls the power control card to adjust a high-voltage power source transmitted from the second-type conductive unit of the power conditioning board through the second-type electrical connection pad , so that the high-voltage power supply is regulated as a low-voltage power supply for the power supply required by the electronic components.

In an embodiment of the present invention, each of the first-type conductive unit and the second-type conductive unit may be an elastic conductive member.

In one embodiment of the present invention, the elastic conductive member may be a Pogo Pin.

According to this, the test system, which is divided into a load-bearing module and a test bench, not only allows the temperature control module to be independent of the load-bearing module, but also allows the supply of control signals and power to be configured on the main control module. Through the bridge connection type electrical connection, it is provided to the carrier module to achieve automated testing. The swappability of the power control card also enables the carrier module to have power adjustability. Further, the power transmission path required to be set on the carrying module can also be shortened, and there is no need to arrange thicker conductive materials on each carrying module in order to ensure the quality of power transmission. Therefore, the simplified power supply configuration further reduces the construction cost of the test system.

In order to fully understand the purpose, features and effects of the present invention, hereby, the present invention is described in detail by the following specific embodiments and in conjunction with the accompanying drawings, and the description is as follows:

As used herein, the terms "a" or "an" are described to describe a unit, component, structure, device, module, system, portion or region, or the like. This is done only for convenience of description and to provide a general sense of the scope of the invention. Accordingly, unless it is clear that it is meant otherwise, such descriptions should be read to include one or at least one, and the singular also includes the plural.

In this text, the terms "comprising, including, having" or any other similar terms described are not meant to be limited to the elements listed herein, but may include elements that are not explicitly listed but are the stated elements, Other elements usually inherent in a component, structure, device, module, system, location or area.

In this document, words like "first" or "second" described in ordinal numbers are used to distinguish or refer to the same or similar elements or structures, parts or regions, and do not necessarily imply such elements , the spatial order of structures, parts or regions. It should be understood that under certain circumstances or configurations, ordinal words may be used interchangeably without affecting the practice of the invention.

In the drawings exemplified in each embodiment, in order to improve the display clarity of each element and avoid being obscured by too many element symbols, some of the same elements in the same drawing are marked with the element symbols only once.

Please refer to FIG. 1 , which is a schematic diagram of an automated testing system according to an embodiment of the present invention. The bridge-connected automated test system includes: a bearing module 100 and a test bench 200 . The carrier module 100 can be driven to move between a testing position and an unloading position. This automated test system can be used to provide a test environment under preset temperature control conditions for electronic components. The test position allows the carrier module 100 to abut against the test bench 200, thereby completing the establishment of an electrical connection state (electrical connection required for performing the test). The unloading position allows the carrier module 100 to cut off the electrical connection state with the test bench 200 , so that the electronic components can be removed or replaced with the next batch of electronic components for testing.

The abutting system allows the bearing module 100 to exert a certain degree of pressure on the test table 200 when the bearing module 100 is located at the test position, which can further improve the stability of the electrical connection. In other embodiments, the abutting can also be a contact that can achieve electrical connection. FIG. 1 illustrates simultaneously carrying two electronic components 300 under test on a carrying module 100 .

The above-mentioned movement is relative, and the carrying module 100 can be driven to move between the test position and the unloading position. The module 100 is moved between the test position and the unload position. The above and the following embodiments are described in terms of the angle of the test table 200 (the test table 200 does not move).

The carrier module 100 illustrated in FIG. 1 moves in a first axis L1 , illustrated as a vertical direction. The carrier module 100 can be moved in the first axial direction L1 by, for example, the unilateral driver 10 shown in FIG. 1 , so that the carrier module 100 can be positioned at the test position or the unloading position. The state illustrated in FIG. 1 is that the carrier module 100 is driven upward, but has not yet reached the test position. The driver 10 is, for example, a lifting device fixed to the carrying module 100 unilaterally, and can also be a lifting device fixed to the carrying module 100 at multiple sides.

The carrier module 100 includes: a first-type electrical connection pad 111 , a second-type electrical connection pad 112 , a slot 120 , a test seat 130 , and a power control card 122 . The aforementioned elements are, for example, arranged on a base plate 150, which is fixed to the driver 10, so that the base plate 150 is driven to move in the first axial direction L1.

The test seat 130 is used for the setting of the electronic component 300 under test. For example, the test seat 130 is a socket or other connecting seat for placing the electronic component 300 and providing electrical connection. The slot 120 provides insertion of the power control card 122 . The power control card 122 is used to perform a pre-conditioning procedure on the power input to the electronic component 300 , such as converting a high-voltage power supply into a low-voltage power supply, and the power adjusted by the pre-conditioning procedure is required for the operation of the electronic component 300 power supply. The regulated power supply may be, for example, the power supply required for the operation of the electronic device 300 in a full-load mode, a half-load mode, or other modes.

The power control card 122 can be movably inserted into the slot 120 . Since the conversion elements of the power supply are arranged on the power control card 122 instead of being welded on the carrier module 100 , the heat generated by these conversion elements during power conversion is not easy to affect the test environment of the electronic element 300 . , thereby reducing the factors that cause test errors and improving the accuracy of the test. The power control card 122 that can be movably inserted into the slot 120 can also be replaced according to the type of the electronic component 300 to be tested, so that the test environment has high adjustability and can provide more diverse The test environment expands the testable range of the test system, and correspondingly reduces the construction cost of the test system under each test item.

The socket 120 and the second-type electrical connection pads 112 can be disposed adjacent to the test socket 130, for example, around the test socket 130 or close to the test socket 130, and the second-type electrical connection pads 112 can be directly coupled to the socket 120 , or the second-type electrical connection pad 112 is coupled to the socket 120 through a circuit on or inside the substrate 150 . In addition, the socket 120 can also be directly coupled to the test socket 130 , or the socket 120 can be coupled to the test socket 130 through a circuit on or inside the substrate 150 . Since the sockets 120 and the second-type electrical connection pads 112 are both adjacent to the test seat 130, the power transmission paths required to be set on the carrier module can be minimized, and the setting of these power transmission paths can be greatly shortened or even avoided. . Especially for electronic components that need to use low-voltage and high-current power supplies, such a configuration can greatly save the use of thicker conductive materials on the carrier module. Therefore, the simplified power supply configuration further reduces the construction cost of the test system.

The test bench 200 includes a main control module 210 and a temperature control module 220 . The temperature control module 220 is used to provide a test environment under a preset temperature control condition for the electronic component 300 in the test position. The temperature control module 220 is, for example, an electric heating device or other devices capable of generating thermal energy, and can coordinate and control the temperature conditions of the test environment, for example, through a cooling system. In the example of FIG. 1 , a thermally conductive block 140 is further disposed on the electronic component 300 , and the thermally conductive block 140 can be used to abut against the temperature control module 220 when the carrier module 100 is in the test position. In other implementations, the thermally conductive block 140 may not be provided, and the top of the electronic component 300 may abut against the temperature control module 220 . The thermally conductive block 140 can be made of metal or other thermally conductive materials.

The main control module 210 has a first-type conductive unit 211 and a second-type conductive unit 212 . When the carrier module 100 is in the test position, the first-type conductive unit 211 is used for providing the first-type electrical connection pads 111 to abut against correspondingly, and the second-type conductive unit 212 is used for providing the second-type electrical connection The pads 112 are correspondingly abutted to form individual electrical connections. The operation signals required by the electronic components 300 and the power control card 122 are transmitted through the first-type conductive unit 211 , and the input power required by the power control card 122 is transmitted through the second-type conductive unit 212 .

FIG. 1 only takes one carrier module 100 and one test bench 200 as an example, the test system can be applied to a test cabinet or a test rack composed of a plurality of carrier modules 100 and corresponding test benches 200 to achieve large scale test.

Next, please refer to FIG. 2 , which is a schematic diagram of a main control module according to an embodiment of the present invention. The main control module 210 has a driving board 214 and a power adjusting board 213 . A first-type base 2141 is provided on an edge of one side of the driving board 214 , and a second-type base 2131 is provided on a side edge of one side of the power adjustment board 213 . Each of the bases ( 2131 , 2141 ) is used to provide a fixed connection between the corresponding conductive units ( 212 , 211 ) and the driving board 214 or the power adjustment board 213 .

Please refer to FIG. 1 and FIG. 2 at the same time, a power controller (not shown in FIG. 2 ) may be mounted on the driving board 214 . The power controller is used to generate control signals required by the power control card 122 . The power controller is coupled to the first-type conductive unit 211 through the circuit on or inside the driving board 214 . In addition, the first-type electrical connection pad 111 is coupled to the socket 120 . Therefore, the power controller can control the power control card 122 to adjust the power input to the power control card 122 , so that the power is adjusted to the working power required by the electronic component 300 . The power input to the power control card 122 is the power transmitted from the second-type conductive unit 212 of the power-regulating board 213 through the second-type electrical connection pads 112 , such as a high-voltage power supply. The power control card 122 enables the high voltage power supply to be regulated as a low voltage power supply required by the electronic component 300 .

Next, please refer to FIG. 3 , which is a schematic three-dimensional structure diagram of an embodiment of the present invention. FIG. 3 is an example of having four sets of test positions on the carrier module 100 . The carrier module 100 may include a substrate 150 , wherein, to further improve the stability of the carrier module 100 , the substrate 150 may be matched with, for example, a bottom plate 155 as shown in FIG. 3 . The substrate 150 may have a plurality of positioning holes 151 , and these positioning holes 151 are used for positioning when the carrier module 100 enters the test position, that is, through the first type base 2141 and the second type base of the test table 200 . At least one positioning pin 215 provided in each of 2131 enables the carrier module 100 to be stably approached to the test table 200 and to reach the final test position.

In addition, the adjacent positioning pins 215 can be arranged in a staggered manner on the base. Among the two positioning pins 215 on a base, they can be configured differently with different diameters and different lengths (not shown in FIG. 3 ), and the positioning pins with shorter diameters have longer lengths, so that for the same For large and small positioning holes, coarse positioning (using a longer and thinner positioning pin) and fine positioning (using a shorter and thicker positioning pin) can be distinguished during the alignment process, so that the electrical properties of the bridge connection can be distinguished. The connection is more accurate and stable, and it also avoids possible damage during the alignment process.

Further, the first-type conductive unit 211 and the second-type conductive unit 212 may be configured as elastic conductive members. Based on the elastic capability of the conductive unit, it can further ensure the electrical connection within a certain stroke, so that when the bearing module 100 is driven to abut against, it has a certain degree of fault tolerance. Wherein, the elastic conductive member may be, for example, a Pogo Pin as shown in FIG. 3 .

To sum up, the test system disclosed in the embodiments can provide the control signal and power to the carrier module under the optimized configuration of the transmission path through the bridge-connected electrical connection, in addition to achieving automated testing In addition, the configuration of the power supply can be simplified, thereby reducing the construction cost of the test system.

The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be considered to be included within the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.

10: Drive 100: Bearing module 111: Type 1 electrical connection pad 112: The second type of electrical connection pad 120: Slot 122: Power control card 130: Test seat 140: Thermal block 150: Substrate 151: Positioning hole 155: Bottom plate 200: Test Bench 210: Master control module 211: Type 1 Conductive Unit 212: The second type of conductive unit 213: Power conditioning board 2131: The second type of base 214: Driver board 2141: Type 1 Pedestal 215: Locating pin 220: temperature control module 300: Electronic Components L1: The first axis

[FIG. 1] is a schematic diagram of an automated testing system according to an embodiment of the present invention. 2 is a schematic diagram of a main control module according to an embodiment of the present invention. [FIG. 3] is a schematic three-dimensional structure diagram of an embodiment of the present invention.

10: Drive

100: Bearing module

111: Type 1 electrical connection pad

112: The second type of electrical connection pad

120: Slot

122: Power control card

130: Test seat

140: Thermal block

150: Substrate

200: Test Bench

210: Master control module

211: Type 1 Conductive Unit

212: The second type of conductive unit

220: temperature control module

300: Electronic Components

L1: the first axis

Claims (8)

A bridge-connected automated test system is used to provide a test environment under preset temperature control conditions for electronic components, and the automated test system includes: A carrying module, which is driven to move to a test position or an unloading position in the first axis, includes: a first-type electrical connection pad, a second-type electrical connection pad, a slot, a A test seat, and a power control card movably plugged into the slot and used to provide power for the electronic component, the slot and the second-type electrical connection pad are arranged adjacent to the test seat and the first Type 2 electrical connection pads are coupled to the socket; and a test stand, for the bearing module to abut against when moving to the test position, including a temperature control module and a main control module, the temperature control module is used to provide the electronic component with the preset A test environment for temperature control conditions, the main control module has a first-type conductive unit and a second-type conductive unit for the first-type electrical connection pad and the second-type electrical connection pad to abut against correspondingly, wherein the electronic The operation signals required by the components and the power control card are transmitted by the first type conductive unit, and the input power required by the power control card is transmitted by the second type conductive unit. The automated testing system as claimed in claim 1, wherein the carrier module includes a heat-conducting block for disposing on the electronic component, and the thermal-conducting block provides the temperature-control module when the carrier module is located at the test position group against. The automated testing system as claimed in claim 1, wherein the main control module has a driving board and a power conditioning board, and a first-type base for fixing the first-type conductive unit is disposed on an edge of a side surface of the driving board a seat, and a second-type base for fixing the second-type conductive unit is arranged on the side edge of one side of the power supply adjustment plate. The automated testing system as claimed in claim 3, wherein the carrier module has a substrate for carrying the first-type electrical connection pad, the second-type electrical connection pad, the slot, and the test seat, and the substrate has a plurality of For positioning holes, the first-type base and the second-type base each have at least one positioning pin, and each positioning pin corresponds to a positioning hole. The automated testing system according to claim 4, wherein there are two positioning pins on each of the bases, the two positioning pins have different lengths and diameters, and the positioning pin with a shorter diameter has a longer length. The automatic test system according to claim 3, wherein the driver board is equipped with a power controller, and the power controller is used to generate the control signals required by the power control card, and the first type conductive unit is used for generating the control signals. and the first-type electrical connection pad is coupled to the slot, the power controller controls the power control card to adjust a power supply control card from the second-type conductive unit of the power-regulating board through the second-type electrical connection pad to transmit a A high voltage power supply, so that the high voltage power supply is regulated to a low voltage power supply as the power supply required by the electronic components. The automated testing system according to any one of claims 1 to 6, wherein each of the first-type conductive unit and the second-type conductive unit is an elastic conductive element. The automated testing system of claim 7, wherein the elastic conductive member is a spring probe.

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