TW201809696A - Electronic component crimping device and test and classification equipment applying same capable of avoiding damages to the temperature control component caused by a downward pressure and a counteraction of a probe - Google Patents

Abstract

An electronic component crimping device comprises a mover, an operating mechanism and a temperature control mechanism. The mover is provided with a moving arm effecting at least one directional displacement, the operating mechanism is provided with at least one first linking member, wherein the movement of the first linking member is driven by the moving arm, and the first linking member is rigidly connected by at least one conducting member to at least one second linking member located below the first linking member, at least one operating component capable of performing a preset operation is provided below the second linking member, the temperature control mechanism is located above the second linking member of the operating mechanism and is provided with at least one temperature control component capable of adjusting the temperature of the operating component on the peripheral side of the conducting member. In this way, when performing an action of pressing an electronic component to contact with the probe of a testing seat, the downward pressure exerted by the moving arm upon the first linking member can be conducted to the operating component to press the electronic component by using the conducting member and the second linking member so as to prevent the temperature control component from being subjected to the downward pressure, which in turn prevents damages caused by double pressures from the downward pressure and counteraction of the probe, so as to provide practical benefits of an increased service life of the temperature control component and assurance of use efficiency.

Description

Electronic component crimping device and test classification equipment for its application

The present invention provides a moving arm to apply pressure to a first linkage member, which can be conducted to a working member by using a conductive member and a second linkage member to press down an electronic component, so as to prevent the temperature control member from being damaged by the downforce, thereby increasing the temperature. Electronic component crimping device to control the service life and ensure the performance.

At present, electronic components (such as ICs with solder balls) may be in a low temperature environment during actual use. To ensure the quality of electronic components, after the electronic components are manufactured, the electronic components must be cold-tested with test equipment. Defective products are eliminated; please refer to Figures 1 and 2. The test equipment is equipped with a circuit board 11 and a test base 12 which are electrically connected. The test base 12 is provided with a plurality of probes 121. For testing electronic components, due to the different types of electronic components, the number of solder balls configured varies from several to hundreds. Therefore, the number of probes 121 of the test base 12 is also based on the number of solder balls of the electronic component to be tested. Make a relative quantity configuration; however, in order to ensure that the solder balls of the electronic components actually contact the probe 121 of the test base 12, the test equipment is provided on the machine with a crimping device 13 which can press down the electronic components to perform the test operation. The device 13 is provided above the test base 12 with a moving arm 131 that can be displaced in the Z direction, and a lower pressing jig set is installed below the moving arm 131. The lower pressing jig set is connected to the moving arm by the upper plate 132 131, and A lower plate 133 is provided below the upper plate 132 for penetrating a lower pressing fixture 134 capable of pressing down electronic components. Above the lower pressing fixture 134 is mounted a refrigerated wafer holder 135 The cooling wafer 136 has a ceramic substrate, and one side is a cooling end and the other side is a cooling end according to the direction of the current. For example, during the cold measurement operation, the bottom surface of the cooling wafer 136 can be cooled. The top surface is the heat dissipation terminal. During the thermal measurement operation, the current direction is changed so that the bottom surface of the cooling chip 136 is the heat dissipation terminal and the top surface is the cooling terminal. That is, when the current direction is opposite, the heat dissipation terminal It is opposite to the cooling end; in this embodiment, the bottom surface of the cooling chip 136 is a cooling end. The contact fixture 134 can be brought into a low temperature state, and the top surface of the cooling chip 136 is a heat dissipation end. In order to increase the heat dissipation efficiency, the top surface of the cooling chip 136 is equipped with a cooling fin 1371. Radiator 137, the radiator 137 is rigidly connected to the upper plate 132; please refer to FIG. 3, when the electronic component 14 is pressed down, the industry will depend on the number of probes 121 of the test base 12 and the type of the electronic component 14. The amount of pressure under the pressing fixture 134 is set to ensure that all the solder balls 141 of the electronic component 14 actually contact the probe 121 of the test base 12. After the test base 12 has the electronic component 14 to be tested, the crimping The device 13 uses the moving arm 131 to drive the upper plate 132, the radiator 137, the cooling chip 136 and the pressing fixture 134 to move downward in the Z direction simultaneously, and transmits the preset lower pressure to the heat dissipation through the upper plate 132 The radiator 137 transmits the downforce to the cooling chip 136 through the radiator 137, and then transmits the downforce to the down-pressure fixture 134 through the refrigerating wafer 136, so that the down-pressure fixture 134 is pressed at a preset down pressure. The electronic component 14 to be tested, so that the solder ball 141 of the electronic component 14 does contact the test base 12 The probe 121, because the cooling chip 136 has cooled down the pressing fixture 134 to a preset cold measurement temperature, so that the electronic component 14 to be tested can perform a cold measurement operation in a simulated low temperature test environment; Although the fixture 134 can preset the lower pressure to receive the measured electronic component 14, the moving arm 131, the upper plate 132, the radiator 137, the cooling chip 136, and the pressing fixture 134 are rigidly connected to each other, resulting in movement. The preset pressing force of the arm 131 is transmitted to the pressing fixture 134 through the cooling chip 136, so that the top surface of the cooling chip 136 withstands this preset pressing force. If the number of probes 121 of the test base 12 is huge (For example, there are hundreds of probes), the preset downforce of the down-pressure fixture 134 will also increase accordingly. On the other hand, the top surface of the cooling chip 136 will bear a larger preset downforce. When the pressing fixture 134 is crimped to the electronic component 14, the probe 121 of the test base 12 generates a reaction force on the electronic component 14. The electronic component 14 transmits the reaction force to the cooling chip 136 through the pressing fixture 134. , Causing the bottom surface of the refrigerated wafer 136 to bear this reaction force, so the fixture is now pressed 134 When the electronic component 14 is crimped, the refrigerating chip 136 made of the ceramic brittle material is susceptible to cracking or pressure loss because the top and bottom surfaces are subjected to the dual pressure impact of downward pressure and upward reaction force, respectively. The problem further affects the use efficiency of the cooling chip 136, resulting in a lack of reducing the life of the cooling chip and increasing the device cost.

An object of the present invention is to provide a crimping device for electronic components, comprising a mover, an operating mechanism, and a temperature control mechanism. The mover is provided with a moving arm for displacement in at least one direction, and the operating mechanism is provided with at least one The first linkage member displaced by the moving arm is driven, and the first linkage member is rigidly connected to at least one second linkage member located below with at least one conductive member, and at least one executable preset is provided below the second linkage member. The operating temperature control mechanism is provided above the second linkage member of the operating mechanism and is located on the peripheral side of the conductive member. At least one temperature control can be used to regulate the temperature of the operating component. When testing the probe of the base, the moving arm applies the downward pressure of the first linkage component, and the conductive component and the second linkage component can be used to conduct to the working component to depress the electronic component to prevent the temperature control from being subjected to the downward pressure, thereby avoiding Due to the double pressure loss caused by the down pressure and the reaction force of the probe, the practical benefits of increasing the service life of the temperature control and ensuring the use efficiency are achieved.

The second object of the present invention is to provide a crimping device for electronic components, wherein the temperature control mechanism is provided with at least one driving source on the bottom surface of the first linkage member, and the driving source drives at least one radiator to perform Z-direction displacement, The control mechanism can use the driving source to drive the radiator to contact or disengage the top surface of the cooling chip according to the test operation requirements, so as to ensure the use efficiency of the cooling chip and achieve the practical benefit of improving the convenience of the operation.

A third object of the present invention is to provide a crimping device for electronic components, wherein when the cooling chip is deformed slightly due to long-term use, the driving source of the temperature control mechanism can make the radiator follow the deformation angle of the cooling chip. A floating tilt is placed on the top surface of the cooling chip to increase the contact area between the heat sink and the cooling chip, thereby achieving the practical benefit of improving heat dissipation efficiency.

A fourth object of the present invention is to provide a test classification device using an electronic component crimping device, which includes a machine, a feeding device, a receiving device, a testing device, a crimping device, a conveying device, and a central control device. The device is arranged on the machine platform, and is provided with at least one feeding holder for containing the electronic components to be tested. The receiving device is arranged on the machine platform, and is provided with at least one receiving container for the measured electronic components. The tester is arranged on the machine and is provided with at least one circuit board with a test stand to perform test operations on electronic components. The conveying device is arranged on the machine and is provided with at least one transfer Electronic component moving mechanism. The crimping device is arranged on at least one moving mechanism of a machine or a conveying device, and is provided with a mover, an operating mechanism and a temperature control mechanism. The test operation is performed by crimping electronic components. The central control device is used to control and integrate the operations of various devices to perform automated operations to achieve practical benefits of improving operation efficiency.

[Learning]

11‧‧‧Circuit Board

12‧‧‧Test Block

121‧‧‧ Probe

13‧‧‧ Crimping device

131‧‧‧ mobile arm

132‧‧‧ Upper plate

133‧‧‧ Lower plate

134‧‧‧Pressing down fixture

135‧‧‧Refrigerated wafer holder

136‧‧‧Refrigerated Chip

137‧‧‧ Radiator

1371‧‧‧Cooling Fin

14‧‧‧Electronic components

141‧‧‧ solder ball

〔this invention〕

20‧‧‧ Crimping device

21‧‧‧ Mover

211‧‧‧ mobile arm

22‧‧‧Operating agency

221‧‧‧The first linkage component

222‧‧‧Conductor

223‧‧‧Second linkage component

224‧‧‧Working parts

23‧‧‧Temperature Control Agency

231‧‧‧Refrigerated chip

232‧‧‧ Radiator

2321‧‧‧Heat fins

233‧‧‧Pressure cylinder

31‧‧‧machine

32‧‧‧test device

321‧‧‧circuit board

322‧‧‧Test Block

323‧‧‧Probe

33‧‧‧Electronic components

331‧‧‧ solder ball

40‧‧‧machine

50‧‧‧feeding device

51‧‧‧feeder

60‧‧‧Receiving device

61‧‧‧Receiving container

70‧‧‧test device

71‧‧‧Circuit Board

72‧‧‧Test Block

80‧‧‧ Conveying device

81‧‧‧The first relocation agency

82‧‧‧First loading stage

83‧‧‧Second loading stage

84‧‧‧Second Relocation Agency

85‧‧‧ the third relocation agency

86‧‧‧First discharge stage

87‧‧‧Second discharge stage

88‧‧‧Fourth Relocation Agency

90‧‧‧detection device

91‧‧‧first detector

92‧‧‧Second detector

Figure 1: Schematic diagram of a conventional test device and a crimping device.

Figure 2: Partial schematic diagram of a conventional crimping device.

Figure 3: Schematic diagram of the use of the conventional test device and crimping device.

FIG. 4 is a schematic view of a crimping device of the present invention.

Figure 5: Schematic diagram of the use of the crimping device of the invention (1).

Figure 6: Schematic diagram of the use of the crimping device of the invention (2).

FIG. 7 is a schematic diagram of another embodiment of the crimping device of the present invention.

FIG. 8 is a schematic diagram (1) of using another embodiment of the crimping device of the present invention.

Fig. 9 is a schematic diagram of another embodiment of the crimping device of the present invention (2).

FIG. 10 is a schematic diagram of the application of the crimping device of the present invention to a test classification device.

In order to make your reviewing committee further understand the present invention, a preferred embodiment will be given in conjunction with the drawings, which will be described in detail as follows: Please refer to FIG. 4. The crimping device 20 of the present invention includes a mover 21 and an operating mechanism. 22 and temperature control mechanism 23, the mover 21 is provided with a moving arm 211 that is displaced in at least one direction. In this embodiment, the moving arm 211 is displaced in the XYZ direction to drive the operating mechanism 22 and the temperature control mechanism. 23 synchronous displacement; the operating mechanism 22 is provided with at least a first linkage member 221 driven and displaced by the moving arm 211 of the mover 21, and further, the first linkage member 221 may be an independent plate or a top plate of a frame or The bottom plate of the floating mechanism. In this embodiment, the first linking member 221 is an independent plate and is connected to the moving arm 211 of the mover 21, and can be displaced by the moving arm 211 with movement in the XYZ direction. At least one conductive member 222 is provided below the first linking member 221, and at least one second linking member 223 is connected with the conductive member 222. At least one working member 224 is provided below the second linking member 223. The working member 224 is To electronics The component performs a preset operation. Furthermore, the conductive member 222 may be a pillar or a support plate. The two interlocking parts 223 and the operating part 224 may be independent components or integrally formed, for example, the second interlocking part 223 may be a refrigerated wafer holder, an operating member holder, a heating member holder with a heating member, or a working member. In another part of 224, the working member 224 may be a pressure transfer tool for transferring and crimping electronic components, or a crimping tool for simply crimping electronic components. In this embodiment, it is connected to the first linkage member 221. A plurality of conductive members 222 are arranged below. Each conductive member 222 is a pillar and is arranged in the Z direction. The first end is connected to the bottom of the first linking member 221, and the second end is connected to the second linking member 223. Below the second linking member 223 is a working member 224 that can be a pressure transfer tool for transferring and pressing electronic components; the temperature control mechanism 23 is located on the second linking member 223 of the operating mechanism 22 and is located At least one temperature control is provided on the peripheral side of the conductive member 222 to regulate the temperature of the working member 224. There is no connection between the temperature control and the first linkage member 221. Furthermore, the temperature control may be a cooling chip or Heating parts and temperature control mechanism In this embodiment, the temperature control mechanism 23 is configured with a temperature control for the cooling wafer 231, and the cooling wafer 231 is equipped with a cooling wafer or heating element. It is placed on the top surface of the second linkage member 223 of the operating mechanism 22 and on the peripheral side of the conductive member 222. There is no connection between the cooling wafer 231 and the first linkage member 221. The bottom surface of the cooling wafer 231 is The top of the cooling end is a heat dissipation end, which can cool the operating part 224 to a preset low temperature. In addition, in order to increase the heat dissipation efficiency, at least one heat sink is mounted above the cooling chip 231. The heat sink can be a gas A cold radiator, a water-cooled radiator, or a refrigerant radiator, in this embodiment, is mounted on the top surface of the refrigeration chip 231 with a heat sink fin 2321 and a refrigerant radiator 232. The radiator 232 and the first radiator There is also no connection between the interlocking members 221.

Referring to FIG. 5, the crimping device 20 of the present invention is applied to a test classification device having a machine 31 and a test device 32. The test device 32 is mounted on the machine 31 and is provided with a circuit board 321 and an electrical connection. The test base 322 is provided with a plurality of probes 323 inside the test base 322, and supports and tests the electronic components. During the cold measurement operation of the electronic components, the operating parts 224 of the operating mechanism 22 of the crimping device 20 have been The electronic component 33 of the plurality of solder balls 331 is sucked. The moving arm 211 of the mover 21 drives the operating mechanism 22, the temperature control mechanism 23 and the electronic component 33 to move in the XY direction above the test seat 322 of the testing device 32. The pair of solder balls 331 of the test electronic component 33 is located in the test base 3 22 of the probe 323.

Please refer to FIG. 6. The moving arm 211 of the mover 21 drives the operating mechanism 22, the temperature control mechanism 23, and the electronic component 33 to move downward in the Z direction, so that the solder ball 331 of the electronic component 33 to be tested contacts the test base 322. Needle 323, since the bottom surface of the cooling chip 231 is a cooling end, the low temperature can be transmitted to the working component 224 through the second linkage member 223, and then the low temperature is transmitted to the electronic component 33 to be tested through the working component 224, so that the The electronic component 33 performs a cold test operation in a preset low temperature environment, and the cooling end of the cooling chip 231 uses a heat sink 232 with a heat dissipation fin 2321 to assist heat dissipation; however, the solder ball 331 of the electronic component 33 to be tested is indeed effective The probe 323 contacting the test base 322, and the moving arm 211 of the mover 21 will drive the working part 224 of the operating mechanism 22 to apply a predetermined lower pressure to the electronic component 33 to be tested. The component 222 and the second linking member 223 are assembled by rigid connection. The moving arm 211 can use the first linking member 221 to transmit the down force to the conductive member 222. Since the cooling chip 231 and the first linking member 221 are not connected and assembled, avoid The top surface of the cooling chip 231 receives the downward pressure transmitted by the first linkage member 221. Therefore, the operating mechanism 22 uses the conductive member 222 to transmit the downward pressure to the second linkage member 223, which in turn transmits the downward pressure to the second linkage member 223. The operating component 224 causes the operating component 224 to receive the electronic component 33 under test at a preset pressure. At this time, the probe 323 of the test base 322 generates a reaction force to the electronic component 33 to be measured. Although this reaction force is It will be transmitted to the cooling chip 231 through the electronic component 33, the operating component 224 and the second linkage member 223 to be tested. However, the top surface of the cooling chip 231 is not subjected to the downforce, and only the bottom surface thereof is subjected to a reaction force, which can prevent the The cooling chip 231 is subject to cracking or pressure loss due to the upward and downward pressure of the downward and downward pressure and the upward reaction force, so as to effectively ensure the use of the cooling chip 231 and improve the use of the cooling chip. Life and use efficiency of reducing device costs.

Please refer to FIG. 7, which is another embodiment of the crimping device 20 of the present invention. The mover 21 of the crimping device 20 is provided with a moving arm 211 for displacement in the XYZ direction to drive the operating mechanism 22 and the temperature control mechanism 23. Synchronous displacement; the operating mechanism 22 is provided with a first linkage member 221 driven and displaced by the moving arm 211 of the mover 21, and a plurality of conductive members 222 are arranged below the first linkage member 221, and each conductive member 222 is a pillar It is arranged in the Z direction. The first end is connected to the bottom of the first linking member 221, and the second end is connected to the second linking member 223. Below the second linking member 223, a pressure transfer tool is installed. A working part 224 is used to transfer and press down the electronic components. The temperature control mechanism 23 is located on the top surface of the second linkage part 223 and is located on the peripheral side of the conductive member 222. A cooling chip 231 is provided. The bottom surface is a cooling end, and the top surface is a heat dissipation end, so that the operating component 224 can be cooled to a preset temperature. The temperature control mechanism 23 is also equipped with a driving source below the first linking component 221 to connect the driving radiator. 232 is displaced in the Z direction to contact or disengage the cooling chip 231. In this embodiment, the driving source is a pressure cylinder 233, and the piston rod is connected to the radiator 232.

Please refer to FIG. 8. Since the cooling chip 231 will be slightly deformed after long-term use, when the pressure cylinder 233 of the temperature control mechanism 23 drives the radiator 232 to make a downward displacement in the Z direction to contact the cooling chip 231, heat dissipation can be achieved. The radiator 232 is slightly tilted according to the deformation angle of the cooling chip 231 to effectively increase the contact area between the radiator 232 and the cooling chip 231, thereby ensuring the heat dissipation performance of the radiator 232; When the moving arm 211 drives the operating mechanism 22, the temperature control mechanism 23, and the electronic component 33 to move downward in the Z direction, the moving arm 211 can use the first linkage member 221, the conductive member 222, and the second linkage member 223 to transmit the downforce to The operating part 224 allows the operating part 224 to receive the tested electronic component 33 with a preset down force, so that the solder ball 331 of the electronic component 33 to be tested actually contacts the probe 323 of the test base 322. Compressed gas, the piston rod can be properly retracted, so that the non-rigid connection between the first linkage member 221 and the radiator 232 is assembled, so that the cooling chip 231 only receives the contact pressure of the pressure cylinder 233 and will not undergo movement Arm 211 preset Pressure shock; when the electronic component 33 to be tested is crimped to the probe 323 of the test base 322, the probe 323 of the test base 322 generates a reaction force to the electronic component 33 to be tested, although this reaction force passes through the The electronic component 33, the operating component 224, and the second linkage component 223 are conducted to the cooling chip 231. Since the top surface of the cooling chip 231 does not bear the preset down pressure of the moving arm 211, the cooling chip 231 can be effectively prevented from being damaged. In order to ensure the use efficiency of the cooling chip 231, the use efficiency of improving the life of the cooling chip and reducing the device cost is achieved.

Please refer to Fig. 9. During the thermal measurement of the electronic component 33, the The current direction of the cold chip 231 changes the cooling end of the bottom surface to a cooling end, and the cooling end of the top surface to a cooling end. The temperature control mechanism 23 controls the piston rod of the pressure cylinder 233 to drive the radiator 232 to move upward in the Z direction. Displacement to disengage the cooling chip 231, so that the cooling chip 231 can effectively conduct high temperature to the working part 224, thereby saving energy and cost; when the moving arm 211 of the mover 21 drives the working mechanism 22, the temperature control mechanism 23 and the electronic component 33 as When the Z direction is displaced downward, the moving arm 211 uses the first linking member 221, the conductive member 222, and the second linking member 223 to transmit the down force to the working member 224, so as to prevent the refrigerated wafer 231 from being subjected to the presetting of the moving arm 211. Pressure, and then the operating part 224 presses the electronic component 33 under test with a preset pressure, so that the solder ball 331 of the electronic component 33 to be tested effectively contacts the probe 323 of the test base 322, and the probe 323 of the test base 322 Although the reaction force is transmitted to the cooling chip 231 through the electronic component 33, the operating member 224, and the second linkage member 223, the top surface of the cooling chip 231 does not bear the pressure under the moving arm 211, which can effectively prevent the cooling chip 2 31 pressure loss, thereby ensuring the use efficiency of the cooling chip 231, and achieving the use efficiency of improving the service life of the cooling chip and reducing the device cost.

Please refer to FIG. 4 and FIG. 10, which are schematic diagrams of the application of the crimping device 20 of the present invention to an electronic component test and classification device. The test and classification device is provided with a feeding device 50, a receiving device 60, and a testing device on the machine 40. 70. Conveying device 80 and central control device (not shown); the crimping device 20 of the present invention can be assembled on the machine table 40, using the following pressing electronic components, or it can be assembled on the conveying device 80 for transferring and lowering Press the electronic components, the test classification equipment further includes a detection device 90, the detection device 90 is provided with at least one detector for detecting the electronic components of the conveying device 80 to move into the testing device 70; the supply The device 50 is assembled on the machine 40, and is provided with at least one feeding holder 51 which is a feeding tray for accommodating at least one electronic component to be tested. The receiving device 60 is assembled on the machine 40, and There is at least one receiving device 61 which is a receiving tray for receiving at least one measured electronic component. The testing device 70 is assembled on the machine table 40 and is provided with a circuit board 71 electrically connected to the device and The test stand 72 is used to perform test operations on electronic components; the conveying device 80 is It is arranged on the machine table 40 and is provided with at least one moving mechanism to transfer electronic components. In this embodiment, a first moving mechanism 81 is configured to be taken out of the feeding holder 51 of the feeding device 50 for waiting. The measured electronic components are transferred to the first loading stage 82 and the second loading stage 83, the first loading stage 82 and the first loading stage 82, respectively. The second loading stage 83 is used to carry the electronic components to be tested to the testing device 70, and the conveying device 80 is further provided with a second moving mechanism 84 and a third moving mechanism 85 at the testing device 70, and respectively at the second The moving mechanism 84 and the third moving mechanism 85 are provided with the crimping device 20 of the present invention for transferring and crimping electronic components, and the detection device 90 is provided between the second moving mechanism 84 and the testing device 70. A first detector 91 that can be a CCD, and a second detector 92 that can be a CCD is provided between the third transfer mechanism 85 and the test device 70. The second transfer mechanism 84 and the third transfer mechanism 85 are respectively used. The crimping device 20 transfers the electronic components to be tested on the first feeding stage 82 and the second feeding stage 83 to the first detector 91 and the second detector 92 for detecting the electronic components. For the placement position, the second transfer mechanism 84 and the third transfer mechanism 85 respectively use the crimping device 20 to transfer the electronic component to be tested to the test device 70 to perform the test operation, and the measured electronics at the test device 70 Components are transferred to the first discharge stage 86 and the second discharge stage 87, and the first discharge stage 86 and the second The loading platform 87 is used to carry out the measured electronic components. The conveying device 80 is also provided with a fourth moving mechanism 88. The fourth moving mechanism 88 is mounted on the first discharge platform 86 and the second discharge platform 87. Take out the measured electronic components, and transport the measured electronic components to the receiving device 61 of the receiving device 60 according to the test results. The central control device is used to control and integrate the operation of each device. In order to perform automated operations and achieve practical benefits of improving operational efficiency.

20‧‧‧ Crimping device

21‧‧‧ Mover

211‧‧‧ mobile arm

22‧‧‧Operating agency

221‧‧‧The first linkage component

222‧‧‧Conductor

223‧‧‧Second linkage component

224‧‧‧Working parts

23‧‧‧Temperature Control Agency

231‧‧‧Refrigerated chip

232‧‧‧ Radiator

2321‧‧‧Heat fins

Claims (10)

An electronic component crimping device includes: a mover: a moving arm configured to be displaced in at least one direction; an operating mechanism: a at least a first linking member connected to the moving arm; and a lower link is provided below the first linking member There is at least one conductive member, the conductive member is connected to at least one second linking member, and the second linking member is provided with at least one working member, which performs a preset operation on at least one electronic component; a temperature control mechanism: Above the second linkage member of the operating mechanism and at the periphery of the conductive member is provided at least one temperature control capable of regulating the temperature of the operating member. The electronic component crimping device according to item 1 of the scope of the patent application, wherein the conductive member of the operating mechanism is a pillar or a support plate. The electronic component crimping device according to item 1 of the scope of the patent application, wherein the second linkage part of the operating mechanism may be a heating element holder or a refrigerated wafer holder or another part of the operating member or a working member holder. . According to the electronic component crimping device according to item 1 of the scope of the patent application, the operating part of the operating mechanism may be a pressure transfer tool for transferring and crimping electronic components, or a crimping tool for simply crimping electronic components. The electronic component crimping device according to item 1 of the scope of the patent application, wherein the temperature control device of the temperature control mechanism is a cooling chip. The electronic component crimping device according to item 1 of the scope of the patent application, wherein the temperature control mechanism is equipped with at least one heat sink above the temperature control. The electronic component crimping device according to item 6 of the scope of the patent application, wherein the temperature control mechanism is equipped with a driving source below the first linkage component to drive and drive the heat sink for Z-direction displacement to contact or Disengage the temperature control. According to the electronic component crimping device described in item 7 of the scope of patent application, wherein the driving source of the temperature control mechanism is a pressure cylinder. According to the electronic component crimping device according to item 7 of the scope of the patent application, wherein the temperature control of the temperature control mechanism and the first linkage member are non-rigidly connected. A test classification device using an electronic component crimping device, including: a machine; a feeding device: arranged on the machine and provided with at least one feeding holder for containing at least one electronic component to be tested ; Receiving device: It is arranged on the machine and is provided with at least one receiving device for accommodating at least one measured electronic component. Test device: It is arranged on the machine and is provided with electricity. The circuit board and test stand are connected to test the electronic component. The conveying device is arranged on the machine and is provided with at least one moving mechanism to move the electronic component. At least one The electronic component crimping device mentioned above is arranged on the moving mechanism of the machine or the conveying device to crimp the electronic component; the central control device is used to control and integrate the actions of various devices to perform automated operations.