CN112775003A - Sorting equipment and temperature control device and crimping device thereof - Google Patents
Sorting equipment and temperature control device and crimping device thereof Download PDFInfo
- Publication number
- CN112775003A CN112775003A CN201911071347.4A CN201911071347A CN112775003A CN 112775003 A CN112775003 A CN 112775003A CN 201911071347 A CN201911071347 A CN 201911071347A CN 112775003 A CN112775003 A CN 112775003A
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- Prior art keywords
- temperature
- joint surface
- jig
- joint
- crimping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
Abstract
The invention provides a temperature control device which can be assembled on an electronic element classification device to control the temperature of an electronic element, and the temperature control device is provided with two jigs and a pressurizer, wherein the two jigs are respectively provided with a temperature controller, and the pressurizer is arranged on the two jigs and used for applying a joint pressure to the two jigs so as to enable the two jigs to be mutually contacted and mutually extruded, thereby improving the temperature conductivity between the two jigs.
Description
Technical Field
The invention relates to a temperature control device applied to electronic element testing and sorting equipment, in particular to a temperature control device capable of controlling the temperature of an electronic element in the testing and sorting process of the electronic element.
Background
Since electronic devices are being expanded to various devices, the quality and reliability of electronic components are challenged, and in order to ensure that electronic components sold in the market can operate normally in various environments, specified high-temperature and low-temperature environment operation tests need to be performed after the electronic components are produced, so as to eliminate defective products.
In the conventional electronic component testing and sorting apparatus, a tester is capable of controlling the temperature of an electronic component, for example, taiwan patent No. TWI403732, which is a tester capable of testing an electronic component by controlling the temperature by using a lower pressure head of a testing and sorting machine and maintaining the electronic component at a predetermined testing temperature.
Disclosure of Invention
Although the above-mentioned electronic component testing and sorting apparatus can control the temperature of the electronic component, when the predetermined testing temperature condition of the electronic component is severe, for example, when the electronic component needs to be tested under the extremely low temperature condition of-20 ℃ or even-40 ℃ to-60 ℃, two or even more groups of temperature controllers are required to be arranged in the lower pressure head to serially cool to achieve the low temperature target or distinguish different target temperatures of multiple stages for control, and if the temperature conduction efficiency between the temperature controllers is not good, the efficiency and accuracy of the serial cooling or temperature control will be reduced, and more energy sources will be required to be consumed to achieve the predetermined target temperature.
Therefore, one of the items of the present invention is to modify a crimping device or a temperature control device of an electronic component testing and sorting device, so as to improve the temperature conduction efficiency inside the crimping device or the temperature control device.
To achieve the above and other objects, the present invention provides a temperature control device suitable for controlling the temperature of an electronic device for performing a test operation, comprising:
the first tool is provided with a first joint surface and a first temperature controller, and the first temperature controller can change the temperature of the first joint surface;
the second tool is provided with a second joint surface and a temperature control surface, and the second tool is also provided with a second temperature controller which can change the temperature of the temperature control surface;
and the pressurizer is driven to provide joint pressure for at least one of the first joint surface and the second joint surface, so that one of the first joint surface and the second joint surface is contacted and pressed towards the other joint surface to reduce a contact surface gap, and the temperature conductivity between the first joint surface and the second joint surface is improved.
The temperature control device, wherein: one of the first fixture and the second fixture can move relative to the other one to make the first joint face contact with or separate from the second joint face, and the pressurizer provides the joint pressure when the first joint face contacts with the second joint face, so that one of the first joint face and the second joint face is pressed towards the other one.
The temperature control device, wherein: the pressurizer comprises an elastic membrane, the elastic membrane encloses a closed air chamber, and the closed air chamber is connected with an air pressure driving unit to apply the joint pressure to the first jig or the second jig.
The temperature control device, wherein: the pressurizer comprises a driving unit and a connecting piece, the driving unit is arranged on one of the first jig and the second jig, the connecting piece is arranged on the other one of the first jig and the second jig, and the driving unit can be driven to drive the connecting piece to move relative to the driving unit.
The temperature control device, wherein: the driving unit is a pneumatic cylinder or a motor screw group.
The temperature control device, wherein: at least one of the first and second fixtures comprises a conductive layer, the conductive layer is located between the first and second temperature controllers, and the conductive layer is a heat conducting sheet, a heat conducting adhesive or a soft interface heat conducting material.
The temperature control device, wherein: the first temperature controller is a cooler, and the second temperature controller is a heater, a refrigeration chip or a cooler with lower power than the first temperature controller.
The temperature control device, wherein: the electronic component has a compressive fracture strength, and the bonding pressure is between 0.3 and 1 times, or between 0.5 and 1 times of the compressive fracture strength.
A sorting apparatus for providing test equipment for performing test sorting operations on electronic components, the test equipment for receiving the electronic components for testing, the sorting apparatus comprising:
the machine table is provided with a test area for arranging the test equipment;
the feeding device is arranged on the machine table and is provided with at least one feeding bearing device for accommodating the electronic element to be tested;
the receiving device is arranged on the machine table and is provided with at least one receiving and bearing device for containing tested electronic elements;
the crimping device is configured on the machine table and used for carrying out crimping operation on the electronic element contained in the test equipment;
the conveying device is arranged on the machine table and provided with at least one conveyor which conveys the electronic elements among at least two of the feeding device, the receiving device, the crimping device and the test area;
the temperature control device is arranged on at least one of the crimping device, the conveying device and the machine platform;
the central control device is connected to control and integrate the feeding device, the receiving device and the pressing device.
A crimping apparatus adapted to perform a crimping operation on an electronic component and control a temperature of the electronic component, the crimping apparatus comprising:
the first tool is provided with a first joint surface and a first temperature controller, and the first temperature controller can change the temperature of the first joint surface;
the second tool is provided with a second joint surface and a temperature control surface, and the second tool is also provided with a second temperature controller which can change the temperature of the temperature control surface;
the first jig is arranged between the crimping arm and the second jig, and the crimping arm can move along an operation direction to drive the first jig and the second jig to move so that the second jig is pressed against the electronic element;
when the second fixture is pressed against the electronic element, the crimping arm drives the first fixture to provide joint pressure for the first joint surface, so that the first joint surface is contacted and extruded towards the second joint surface to reduce a contact surface gap, and the temperature conductivity between the first joint surface and the second joint surface is improved.
The crimping apparatus described, wherein: the pressing arm comprises a body and a pusher, the pusher is arranged between the body and the first jig, the body can move along the operation direction to drive the pusher, the first jig and the second jig to move, and the pusher can push the first jig to provide the joint pressure for the first joint surface.
The crimping apparatus described, wherein: the second fixture is arranged on the first fixture and can move between a joint position and a release position relative to the first fixture along the operation direction, the first joint surface is contacted with the second joint surface when the second fixture is positioned at the joint position, and the first joint surface is separated from the second joint surface when the second fixture is positioned at the release position.
The crimping apparatus described, wherein: at least one of the first and second fixtures comprises a conductive layer, the conductive layer is located between the first and second temperature controllers, and the conductive layer is a heat conducting sheet, a heat conducting adhesive or a soft interface heat conducting material.
The crimping apparatus described, wherein: the first temperature controller is a cooler, and the second temperature controller is a heater, a refrigeration chip or a cooler with lower power than the first temperature controller.
The crimping apparatus described, wherein: the electronic component has a compressive fracture strength, and the bonding pressure is between 0.3 and 1 times, or between 0.5 and 1 times of the compressive fracture strength.
A sorting apparatus for providing test equipment for performing test sorting operations on electronic components, the test equipment for receiving the electronic components for testing, the sorting apparatus comprising:
the machine table is provided with a test area for arranging the test equipment;
the feeding device is arranged on the machine table and is provided with at least one feeding bearing device for accommodating the electronic element to be tested;
the receiving device is arranged on the machine table and is provided with at least one receiving and bearing device for containing tested electronic elements;
the crimping device is configured on the machine table to perform crimping operation on the electronic element accommodated in the test equipment;
the conveying device is arranged on the machine table and provided with at least one conveyor which conveys the electronic elements among at least two of the feeding device, the receiving device, the crimping device and the test area;
the central control device is connected to control and integrate the feeding device, the receiving device and the pressing device.
Therefore, the temperature control device and the crimping device provided by the invention can apply the joint pressure to the first jig and the second jig by using the pressurizer or the crimping arm, so as to improve the temperature conductivity between the first jig and the second jig, and obtain the use effects of reducing energy consumption and improving the temperature control accuracy.
Drawings
Fig. 1 is a schematic top view of a sorting apparatus according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a temperature control device according to a first embodiment of the present invention.
Fig. 3 is a schematic view illustrating a usage state of a temperature control device according to a first embodiment of the present invention.
Fig. 4 is a cross-sectional view of a first bonding surface and a second bonding surface of a temperature control device according to a first embodiment of the invention.
Fig. 5 is a schematic cross-sectional view of a first bonding surface and a second bonding surface of a temperature control device applying bonding pressure according to a first embodiment of the invention.
FIG. 6 is a schematic cross-sectional view of a temperature control device according to a second embodiment of the present invention.
FIG. 7 is a schematic cross-sectional view of a temperature control device according to a third embodiment of the present invention.
Fig. 8 is a schematic view illustrating a usage state of a temperature control device according to a third embodiment of the present invention.
FIG. 9 is a schematic cross-sectional view of a temperature control device according to a fourth embodiment of the present invention.
Description of reference numerals: a machine table 10; a work plane 11; a test zone 12; a drive unit 13; a supply device 20; a material receiving device 30; a conveying device 40; pick-and- place devices 41, 42; slide rail carrier groups 43, 44; a crimping device 50; a crimp arm 51; a frame body 511; a first jig 52; a first engagement surface 521; a housing 522; a cover 523; a flow passage 524; a conductive layer 525; a second jig 53; a second engagement surface 531; a temperature-controlled surface 532; a base 533; a second thermostat 534; pressing down the fixture 535; an elastic member 536; a guide rod 537; an elastic member 538; a conductive layer 539; a pressurizer 54; a driving unit 541; a coupler 542; an elastic membrane 543; an enclosed gas chamber 544; a pusher 55; a central control device 60; a test device 70; a tray 91; a tray 92; electronic components 99, 99'.
Detailed Description
The present embodiment discloses a pressing device, which can be assembled in a sorting apparatus for electronic components, and further cooperate with a testing apparatus to perform a testing and sorting operation on the electronic components. Referring to fig. 1, the electronic component sorting apparatus includes a machine 10, a feeding device 20, a receiving device 30, a conveying device 40, a pressing device 50, and a central control device 60, which can be configured and matched with a testing apparatus 70 to perform testing and sorting operations of electronic components together.
The machine 10 is, for example, a platform-type rack, and has a working plane 11 for mounting the feeding device 20, the receiving device 30, the conveying device 40 and the pressing device 50 thereon, conveying the electronic component 99 on the working plane 11, and performing a predetermined testing operation, wherein the machine 10 has a testing area 12 in the working plane 11, and the testing device 70 is mounted in the testing area 12 and below the testing area 12.
The feeding device 20 is disposed on the working plane 11 of the machine 10, and is used for disposing one or more trays 91 of electronic components, and accommodating one or more electronic components 99 to be tested in the tray 91. The material receiving device 30 is disposed on the working plane 11 of the machine 10, and is provided with at least one tray 92 capable of carrying tested electronic components, and the tested electronic components 99' are accommodated in the tray 92. The conveying device 40 is disposed on the working plane 11 of the machine 10 and has one or more feeders capable of conveying electronic components, specifically, the conveying device 40 includes pick-and- place units 41 and 42 capable of carrying electronic components and slide rail carrier sets 43 and 44 capable of carrying electronic components to move transversely, the pick-and- place units 41 and 42 respectively have slide rails capable of moving transversely and longitudinally, the pick-and-place unit 41 can pick up the electronic components 99 from the supply device 20, the electronic components 99 are placed on the slide rail carrier set 43, the slide rail carrier set 43 can transfer the electronic components to the side of the testing area 12 to wait for testing, the electronic components completing testing operation can be transferred from the side of the testing area 12 to the pick-and-place unit 42 by another slide rail carrier set 44, and the pick-and-place unit 42 can pick up the electronic components from the slide rail carrier set 44 and place the electronic components on the tray 92 of the conveying device 30. The press-bonding device 50 is disposed on the machine 10, the machine 10 further has a driving unit 13 extending longitudinally, and the press-bonding device 50 can be driven to move longitudinally, so that the press-bonding device 50 can move between the slide rail carrier groups 43 and 44 and the testing area 12, take the electronic component from the slide rail carrier group 43, move and press-bond the electronic component to the testing equipment 70 disposed in the testing area 12 for testing, and take, move and place the electronic component on the slide rail carrier group 44 after the testing is completed.
In the present embodiment, the pressing device 50 can be driven by the driving unit 13 to move longitudinally, so as to move the electronic component between the slide rail stage sets 43 and 44 and the testing area 12, but it is also feasible to omit the driving unit, directly transport the electronic component to the testing area by using the slide rail stage set, and lift the pressing device to pick and place the electronic component.
The central control device 60 is, for example, a chip, preferably a system on a chip, disposed on the machine 10, connected to the feeding device 20, the receiving device 30, the conveying device 40 and the pressing device 50, and preloaded with control logic to control and integrate the actions of the feeding device 20, the receiving device 30, the conveying device 40 and the pressing device 50 to perform an automated operation, so as to sequentially convey the electronic components accommodated by the feeding device 20 to the testing area 12 for testing by the testing device 70, and sequentially convey and accommodate the tested electronic components in the receiving device 30.
Referring to fig. 2, the crimping apparatus of the present invention includes a crimping arm 51 and a temperature control device, wherein the temperature control device includes a first jig 52, a second jig 53 and a presser 54.
The crimping arm 51 is a long straight rod, the temperature control device is disposed at the bottom end of the crimping arm 51, and the motor screw set is disposed at the top end of the crimping arm 51 and can drive the crimping arm 51 to move up and down along the operation direction, so as to drive the temperature control device to move up and down together, and to drive the crimping arm 51 to move up and down, for example, refer to the specific structure of the motor screw set described in the patent TWI635551 or TWI 618667.
The top of the first fixture 52 in the temperature control device is disposed on the press-connection arm 51, and the bottom of the first fixture 52 has a first joint surface 521, wherein the first fixture 52 includes a housing 522, a cover 523 and a first temperature controller, the cover 523 covers the top of the housing 522 and is connected between the press-connection arm 51 and the housing 522, the first joint surface 521 is located on the bottom surface of the housing 522, the first temperature controller is a cooler and includes a flow channel 524 penetrating the housing 522, so that a user can connect the flow channel 524 to a medium supply source, such as a pump or a compressor, which can supply fluid media, such as cold water or refrigerant, to the flow channel 524 to cool the first fixture 52, thereby changing the temperature of the first joint surface 521. In other possible embodiments of the present invention, the first thermostat may be changed to use hot water as the fluid medium, or the first thermostat may be changed to use other heaters or cooling wafers.
It should be further noted that changing the temperature of the first joint surface 521 means that the first joint surface 521 has a different temperature when the first temperature controller is provided than when the first temperature controller is not provided, and is not limited to the first temperature controller having the capability of actively heating or cooling, and if the flow channel 524 is omitted and a passive heat dissipation radiator or heat dissipation paint is used as the first temperature controller, the radiator or heat dissipation paint is disposed on the surface of the first fixture for heat dissipation, and the temperature of the first joint surface can still be reduced and changed, which all belong to the possible embodiments of the first temperature controller of the present invention.
The second fixture 53 is located under the first fixture 52, the top of the second fixture 53 has a second bonding surface 531, the second bonding surface 531 faces the first bonding surface 521 and can contact with the first bonding surface 521, the bottom of the second fixture 53 has a temperature control surface 532, the second fixture 53 includes a base 533, a second temperature controller 534 and a pressing fixture 535, the second bonding surface 531 is located on the top surface of the base 533, the second temperature controller 534 and the pressing fixture 535 are disposed on the base 533, the second temperature controller 534 is clamped between the base 533 and the pressing fixture 535, the second temperature controller 534 is, for example, a heater or a cooling wafer, or the second temperature controller 534 can be a cooler of the same or similar type as the first temperature controller, the temperature control surface 532 is located on the bottom surface of the pressing fixture 535, the pressing fixture 535 can take and release the electronic component by, for example, and the electronic component can be taken by the temperature control surface 532, thus, the second temperature controller 534 can heat or cool the pressing fixture 535, and change the temperature of the pressing fixture 535, thereby changing the temperature of the temperature control surface 532 to control the temperature of the electronic component. In addition to the above structure, if the base 533 is changed to be ring-shaped and surrounds the second thermostat, or the base 533 is directly omitted, and only the second thermostat is combined with the pressing fixture, the second joint surface is located on the top surface of the second thermostat, or the second thermostat is disposed on the bottom of the pressing fixture 535, which also belongs to a feasible embodiment of the present invention.
The presser 54 is disposed on the first jig 52 and the second jig 53 to drive the second jig 53 to move toward the first jig 52 to contact and press the first jig 52, so that the second bonding surface 531 contacts and presses the first bonding surface 521, and a bonding pressure is applied between the second bonding surface 531 and the first bonding surface 521 to reduce a contact surface gap between the second bonding surface 531 and the first bonding surface 521; more specifically, the presser 54 includes a driving unit 541 and a connecting unit 542, the driving unit 541 is, for example, a pneumatic cylinder or a motor screw set, and can be driven by air pressure or electricity to drive the connecting unit 542 to move, the driving unit 541 is disposed on the housing 522 of the first fixture, the connecting unit 542 is disposed on the base 533 of the second fixture, and when the connecting unit 542 moves, the second fixture 53 is driven to move close to or away from the first fixture 52, the driving unit 541 can continuously apply pressure to the first fixture 52 after the second joint surface 531 contacts the first joint surface 521, and apply joint pressure to the first joint surface 521 and the second joint surface 531. In other possible embodiments of the present invention, the driving unit may be disposed on the base instead of the housing, and the connecting member may be disposed on the housing.
Referring to fig. 3 to 5, the driving unit 541 can drive the connecting element 542 and the second fixture to move, so that the second joint surface 531 contacts with the first joint surface 521, and since the object surface is a rough, wavy and uneven surface on a microscopic scale, although the first joint surface 521 contacts with the second joint surface 531, there are many surface gaps therein, as shown in fig. 4, the surface gaps are like many small air chambers, and are blocked between the first joint surface 521 and the second joint surface 531, so that the temperature conductivity between the first joint surface 521 and the second joint surface 531 is not good, that is, the heat conductivity coefficient is low; after the driving unit 541 continues to apply pressure to the coupler 542 and the second jig, a joint pressure is applied between the first joint surface 521 and the second joint surface 531, so that the surfaces of the first joint surface 521 and the second joint surface 531 slightly deform on a micro scale, and the surface gap is squeezed to be reduced, as shown in fig. 5, the contact area between the first joint surface 521 and the second joint surface 531 on the micro scale is increased, and thus the temperature conductivity, that is, the heat conductivity coefficient, between the first joint surface 521 and the second joint surface 531 is increased.
Therefore, when the crimping device takes the electronic element and conducts a crimping test, the temperature of the electronic element can be controlled by the temperature control device. The temperature control device is connected with the temperature control surface in series through a first temperature controller, a first joint surface, a second temperature controller to form a heat flow path, the second jig is driven by the pressurizer to move to contact with the first jig, and joint pressure is provided for the first joint surface and the second joint surface, so that the temperature conductivity between the first joint surface and the second joint surface is improved; the first temperature controller can adopt a cooler with higher power, the first joint surface is cooled by media such as a refrigerant and the like, the second jig is cooled by means of temperature conduction between the first joint surface and the second joint surface, the second temperature controller can adopt a cooler or a refrigerating wafer with lower power, and the temperature difference between the connecting piece and the pressing jig is caused by the thermoelectric effect, so that the pressing jig is further cooled, the temperature control surface is cooled, and the temperature of the electronic element is controlled.
When the electronic device reaches the target temperature, if the electronic device needs to be controlled to another temperature, for example, the temperature of the tested low-temperature electronic device is raised back to avoid condensation, the second temperature controller may use a heater or a cooling wafer, and the second temperature controller is used to heat the pressing jig or control the temperature difference between the connecting member and the pressing jig to control the temperature control surface to another predetermined target temperature, at this time, the pressurizer may be controlled to release the bonding pressure to lower the temperature conductivity of the first bonding surface and the second bonding surface, or the second jig is controlled to move to separate the first bonding surface from the second bonding surface, the state shown in fig. 3 is restored to the state shown in fig. 2, and the temperature of the temperature control surface and the electronic device is controlled by the second temperature controller alone to reduce the low-temperature effect of the first jig.
By utilizing the device, the temperature control device can provide a larger-power cooling effect by virtue of the first temperature controller, and then the second temperature controller is used for carrying out slight temperature control, the temperature conductivity is improved between the first joint surface and the second joint surface by virtue of the joint pressure, the temperature of the first temperature controller can be ensured to be really and efficiently conducted to the temperature control surface by virtue of the heat flow path, and the temperature control device is really, efficiently and accurately formed.
In the above embodiment, the first jig and the second jig are connected by the presser to be separable from each other, but if the second jig is arranged on the first jig and the first bonding surface and the second bonding surface are not separable, the presser can still be used to apply bonding pressure between the first bonding surface and the second bonding surface, so as to improve the temperature conductivity between the first bonding surface and the second bonding surface, which has similar use effects to those of the above embodiment.
Referring to fig. 6, a second embodiment of the present invention further discloses a crimping apparatus, which has a structure substantially the same as that of the first embodiment, but the bottom end of the crimping arm 51 has a frame 511, the second fixture 53 is fixed on the frame 511, the first fixture 52 is located above the second fixture 53, the second fixture 53 further includes one or more elastic members 536, the elastic members 536 protrude upwards from the second engaging surface 531 and abut against the first engaging surface 521 of the first fixture, and the elastic members 536 provide an elastic force to separate the first engaging surface 521 from the second engaging surface in a normal state; the pressurizer is disposed between the first fixture 52 and the frame 511, and includes an elastic membrane 543, the periphery of the elastic membrane 543 is attached to the frame 511 or the first fixture 52 to form a closed air chamber 544, and the air pressure driving unit can be connected to expand the closed air chamber 544 to prop between the frame 511 and the first fixture 52, so as to push and move the first fixture 52 downward, such that the first joint surface 521 contacts and presses the second joint surface 531, and a joint pressure is provided between the first joint surface 521 and the second joint surface 531, thereby obtaining a similar effect as the first embodiment.
In the second embodiment, the second fixture includes the elastic element 536, which can provide elastic force to separate the first fixture from the second fixture, but it is also feasible to omit the elastic element 536, bond the elastic membrane to the first fixture 52, and drive the closed air chamber 544 to contract by air pressure, so as to move the first fixture 52 upward.
Referring to fig. 7, a third embodiment of the present invention further discloses a pressing apparatus, which has a structure substantially the same as that of the first embodiment, except that the presser 54 is omitted, the pressing arm 51 further includes a body and a pusher 55, the pusher 55 is connected between the body of the pressing arm 51 and the first jig 52, specifically, the pusher 55 is, for example, a pneumatic cylinder and a push rod thereof, an expandable air bag or an elastic membrane as described in the second embodiment, the second jig further includes one or more guide rods 537 and an elastic member 538, the guide rods 537 extend upward from the base 533 and slidably penetrate through the first jig 52, so that the second jig 53 can move relative to the first jig 52, and the elastic member 538 is clamped between the housing and the base 533, so that the second jig 53 is separated from the first jig 52 in a normal state.
Referring to fig. 7 and 8, when the pressing device takes the electronic component 99 and presses the electronic component to the testing equipment 70, the pressing arm 51 drives the first jig 52 and the second jig 53 to move downward and press against the electronic component 99 and the testing equipment 70, so that the second jig 53 is pressed against by the electronic component 99 and moves relative to the first jig 52, the second bonding surface contacts with the first bonding surface, and then the pushing device 55 is started to further provide a bonding pressure to push the first jig 52 downward, so that the bonding pressure can be applied between the first bonding surface and the second bonding surface, thereby obtaining a similar use effect as the first embodiment.
In the third embodiment, the elastic member 538 can provide an elastic force to the second fixture 53 to separate the second fixture 53 from the first fixture 52 in a normal state, but it is also possible to omit the elastic member 538 and use the self-weight of the second fixture 53 to make the second fixture 53 move downward under the influence of gravity to separate from the first fixture 52.
In the third embodiment, the pushing device 55 can provide the engaging pressure to the first fixture 52, but if the pushing device 55 is omitted, the pressing arm body or the motor screw set of the pressing arm can provide the engaging pressure to the first fixture when the pressing arm 51 moves up and down, the engaging pressure is not inevitable.
It should be further noted that the joint pressure provided by the press arm or the pusher not only acts on the first joint surface and the second joint surface, but also may be transmitted downward to act on the electronic component, in order to prevent the joint pressure from damaging the electronic component, a stopper may be disposed around the electronic component or around the test area to block the second fixture, or the joint pressure may be controlled to be smaller than the compressive failure strength of the electronic component, preferably, the joint pressure is between 0.3 and 1 times of the compressive failure strength of the electronic component, and preferably, the joint pressure is between 0.5 and 1 times of the compressive failure strength of the electronic component.
Referring to fig. 9, a fourth embodiment of the present invention further discloses a pressing apparatus, which can be configured to be inherited from any one of the first to third embodiments or a combination thereof, wherein each of the first jig 52 and the second jig 53 includes a conductive layer 525, 539, the conductive layer 525 of the first jig is disposed on the bottom surface of the housing 522, the first bonding surface 521 is disposed on the bottom surface of the conductive layer 525 of the first jig, the conductive layer 539 of the second jig is disposed on the top surface of the base 533, and the second bonding surface 531 is disposed on the top surface of the conductive layer 539 of the second jig, specifically, the conductive layers 525, 539 of the first jig and the second jig are, for example, a heat conductive sheet, a heat conductive glue, or an interface soft heat conductive material, wherein the heat conductive sheet is a sheet body with a better temperature conductivity, such as a copper sheet or a graphite sheet, the interface soft heat conductive material is a heat conductive material with a better elasticity or ductility, when the first bonding surface 521 is in contact with the second bonding surface 531 and is pressed by the bonding pressure, the temperature conductivity between the first jig and the second jig can be further improved by the conductive layers 525 and 539, and the function similar to that of the first embodiment can be achieved.
In the fourth embodiment, the first and second jigs have conductive layers, but only one of the first and second jigs has a conductive layer.
In this embodiment, the conveying device 40 conveys the electronic component from the supply device 20 to the pressing device 50, and after the electronic component is tested, the electronic component is conveyed from the pressing device to the receiving device 30.
However, it is possible to install the temperature control device in the temporary stage or the slide stage set to control the temperature of the electronic component before or after the pressure bonding and the test are performed, or to install the temperature control device in any two or all of the pressure bonding device, the temporary stage, and the slide stage set.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (16)
1. A temperature control device suitable for controlling the temperature of an electronic component for performing a test operation, the temperature control device comprising:
the first tool is provided with a first joint surface and a first temperature controller, and the first temperature controller can change the temperature of the first joint surface;
the second tool is provided with a second joint surface and a temperature control surface, and the second tool is also provided with a second temperature controller which can change the temperature of the temperature control surface;
and the pressurizer is driven to provide joint pressure for at least one of the first joint surface and the second joint surface, so that one of the first joint surface and the second joint surface is contacted and pressed towards the other joint surface to reduce a contact surface gap, and the temperature conductivity between the first joint surface and the second joint surface is improved.
2. The temperature control device according to claim 1, characterized in that: one of the first fixture and the second fixture can move relative to the other one to make the first joint face contact with or separate from the second joint face, and the pressurizer provides the joint pressure when the first joint face contacts with the second joint face, so that one of the first joint face and the second joint face is pressed towards the other one.
3. The temperature control device according to claim 2, characterized in that: the pressurizer comprises an elastic membrane, the elastic membrane encloses a closed air chamber, and the closed air chamber is connected with an air pressure driving unit to apply the joint pressure to the first jig or the second jig.
4. The temperature control device according to claim 2, characterized in that: the pressurizer comprises a driving unit and a connecting piece, the driving unit is arranged on one of the first jig and the second jig, the connecting piece is arranged on the other one of the first jig and the second jig, and the driving unit can be driven to drive the connecting piece to move relative to the driving unit.
5. The temperature control device according to claim 4, wherein: the driving unit is a pneumatic cylinder or a motor screw group.
6. The temperature control device according to claim 1, characterized in that: at least one of the first and second fixtures comprises a conductive layer, the conductive layer is located between the first and second temperature controllers, and the conductive layer is a heat conducting sheet, a heat conducting adhesive or a soft interface heat conducting material.
7. The temperature control device according to claim 1, characterized in that: the first temperature controller is a cooler, and the second temperature controller is a heater, a refrigeration chip or a cooler with lower power than the first temperature controller.
8. The temperature control device according to claim 1, characterized in that: the electronic component has a compressive fracture strength, and the bonding pressure is between 0.3 and 1 times, or between 0.5 and 1 times of the compressive fracture strength.
9. A sorting apparatus for providing test equipment for performing test sorting operations on electronic components, the test equipment for receiving the electronic components for testing, the sorting apparatus comprising:
the machine table is provided with a test area for arranging the test equipment;
the feeding device is arranged on the machine table and is provided with at least one feeding bearing device for accommodating the electronic element to be tested;
the receiving device is arranged on the machine table and is provided with at least one receiving and bearing device for containing tested electronic elements;
the crimping device is configured on the machine table and used for carrying out crimping operation on the electronic element contained in the test equipment;
the conveying device is arranged on the machine table and provided with at least one conveyor which conveys the electronic elements among at least two of the feeding device, the receiving device, the crimping device and the test area;
the temperature control device of any one of claims 1 to 8, disposed on at least one of the pressing device, the conveying device and the machine;
the central control device is connected to control and integrate the feeding device, the receiving device and the pressing device.
10. A crimping apparatus adapted to perform a crimping operation on an electronic component and control a temperature of the electronic component, the crimping apparatus comprising:
the first tool is provided with a first joint surface and a first temperature controller, and the first temperature controller can change the temperature of the first joint surface;
the second tool is provided with a second joint surface and a temperature control surface, and the second tool is also provided with a second temperature controller which can change the temperature of the temperature control surface;
the first jig is arranged between the crimping arm and the second jig, and the crimping arm can move along an operation direction to drive the first jig and the second jig to move so that the second jig is pressed against the electronic element;
when the second fixture is pressed against the electronic element, the crimping arm drives the first fixture to provide joint pressure for the first joint surface, so that the first joint surface is contacted and extruded towards the second joint surface to reduce a contact surface gap, and the temperature conductivity between the first joint surface and the second joint surface is improved.
11. The crimping device of claim 10, wherein: the pressing arm comprises a body and a pusher, the pusher is arranged between the body and the first jig, the body can move along the operation direction to drive the pusher, the first jig and the second jig to move, and the pusher can push the first jig to provide the joint pressure for the first joint surface.
12. The crimping device of claim 10, wherein: the second fixture is arranged on the first fixture and can move between a joint position and a release position relative to the first fixture along the operation direction, the first joint surface is contacted with the second joint surface when the second fixture is positioned at the joint position, and the first joint surface is separated from the second joint surface when the second fixture is positioned at the release position.
13. The crimping device of claim 10, wherein: at least one of the first and second fixtures comprises a conductive layer, the conductive layer is located between the first and second temperature controllers, and the conductive layer is a heat conducting sheet, a heat conducting adhesive or a soft interface heat conducting material.
14. The crimping device of claim 10, wherein: the first temperature controller is a cooler, and the second temperature controller is a heater, a refrigeration chip or a cooler with lower power than the first temperature controller.
15. The crimping device of claim 10, wherein: the electronic component has a compressive fracture strength, and the bonding pressure is between 0.3 and 1 times, or between 0.5 and 1 times of the compressive fracture strength.
16. A sorting apparatus for providing test equipment for performing test sorting operations on electronic components, the test equipment for receiving the electronic components for testing, the sorting apparatus comprising:
the machine table is provided with a test area for arranging the test equipment;
the feeding device is arranged on the machine table and is provided with at least one feeding bearing device for accommodating the electronic element to be tested;
the receiving device is arranged on the machine table and is provided with at least one receiving and bearing device for containing tested electronic elements;
the bonding apparatus of any one of claims 10 to 15, configured to perform a bonding operation on an electronic component accommodated in the testing device;
the conveying device is arranged on the machine table and provided with at least one conveyor which conveys the electronic elements among at least two of the feeding device, the receiving device, the crimping device and the test area;
the central control device is connected to control and integrate the feeding device, the receiving device and the pressing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911071347.4A CN112775003A (en) | 2019-11-05 | 2019-11-05 | Sorting equipment and temperature control device and crimping device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911071347.4A CN112775003A (en) | 2019-11-05 | 2019-11-05 | Sorting equipment and temperature control device and crimping device thereof |
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| CN112775003A true CN112775003A (en) | 2021-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911071347.4A Pending CN112775003A (en) | 2019-11-05 | 2019-11-05 | Sorting equipment and temperature control device and crimping device thereof |
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| CN (1) | CN112775003A (en) |
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Application publication date: 20210511 |