1342958 九、發明說明： 【發明所屬之技術領域】 本發明尤指其提供-種於電子元件執行檢測作 將其所產生之自熱作有效的冷熱交換，且可传雷不僅可 5持於預設的檢測溫度範_，進而確保產品檢 機壓接機構之致冷溫控裝置。 又丰之檢測 【先前技術】1342958 IX. Description of the invention: [Technical field to which the invention pertains] The present invention particularly provides a method for performing an automatic detection of an electronic component to perform an automatic heat exchange for self-heating generated by the electronic component, and the lightning can be transmitted not only to the preheating The detection temperature range is set to ensure the refrigeration temperature control device of the product inspection machine crimping mechanism. Detection of Fengfeng [Prior Art]
由於電子元件在生產過程巾驗過多道的加I 了確保產品品質，業者於電子元件製作完紐，均會 ^ 測作業，以制電子元件於製作過程巾，是否遭受損壞，進 測出不良品；電子元件的檢_業均係於預檢測 二 ^檢測’而的電子元件因本身魏有限，其於執行 業的過程中’本身s執行程式作制產生的自熱將相當有限 此仍然不會超出預設的檢測溫度範圍；然而隨著科技的進步， 子元件的功能不斷加強提昇，如此電子元件在執行檢測作業時， 將會快速的產生自熱，進而超出預設的檢測溫度範圍，因此必 於檢測機之下壓治具上裝設冷熱錢H，轉電子元件執行檢;則 作業所產生之自熱作冷熱交換，而使檢測作業能保持於 測溫度範_。 μ— 請參閱第1圖，其係本申請人先前申請之台灣發明專利 95103072號『檢測機壓接機構之致冷裝置』專利案，其係於檢 機壓接機構之壓接機構1〇之下壓桿1i頭端裝設下壓治具 ，並於該下壓治具12内裝設有一致冷晶片13 ,致冷晶片工3 之吸熱端連接於下壓治具12，而放熱端則具有散熱裝置14。 凊參閱第2圖，致冷晶片13其P型與N型之電熱半導體材 料131、132主要係絲（Bismuth)碎（Telluric)合金，電 熱半導體材料131、13 2—端以銅質電極13 3銲接連結一 體，另端則分別以銅質電極13 4、13 5連結於直流電源之正、 負極，另具備絕緣性與導熱性之陶瓷基板13 6、13 7則分別 1342958 5又於上、下方，而於直流電源通電時，電流由P型電熱半導體材 料1 3 1流入N型半導體材料13 2時，熱能由下方；^至上方， 而於下方吸熱端產生冷卻面，上方則為放熱端，為了增加放埶端 之散熱能力，另於放熱端之上方裝設散熱裝置i 4，藉由致冷晶 片13通電所產生的冷卻面，即可與熱源進行冷熱交換。反之， 若電流由N型電熱半導體材料13 2流入p型半導體材料131 時，於下方為放熱端，上方則為吸熱端產生冷卻面，亦即電流方 向相反時，放熱端與吸熱端為相反倒置。Since the electronic components in the production process are too much to ensure the quality of the products, the manufacturer will test the operation of the electronic components, and the electronic components will be damaged during the production process, and the defective products will be tested. The inspection of electronic components is based on pre-detection and detection. The electronic components are limited by themselves. In the process of executing the industry, the self-heating generated by the program itself is quite limited. Exceeding the preset detection temperature range; however, as the technology advances, the function of the sub-element is continuously enhanced, so that when the electronic component performs the inspection operation, it will quickly generate self-heating and exceed the preset detection temperature range. The hot and cold money H must be installed on the pressure fixture under the inspection machine, and the electronic components are subjected to inspection; the self-heating generated by the operation is used for cold and heat exchange, so that the detection operation can be maintained at the temperature measurement _. μ—Please refer to FIG. 1 , which is a patent application of the invention of Taiwan Patent No. 95103072, “Cryogenic Device for Testing Machine Crimping Mechanism”, which is applied to the crimping mechanism of the crimping mechanism of the inspection machine. The lower pressing rod 1i is provided with a lower pressing fixture, and the lower pressing fixture 12 is provided with a uniform cold chip 13 , and the heat absorbing end of the cooling wafer 3 is connected to the lower pressing fixture 12, and the heat releasing end is There is a heat sink 14 . Referring to Fig. 2, the P-type and N-type electrothermal semiconductor materials 131, 132 of the cold-formed wafer 13 are mainly made of a Bismuth alloy, and the electrothermal semiconductor material 131, 13-end is a copper electrode 13 3 The solder joints are integrated, and the other ends are connected to the positive and negative electrodes of the DC power supply by the copper electrodes 13 4 and 13 5 respectively, and the ceramic substrates 13 6 and 13 7 having the insulating and thermal conductivity are respectively 1342958 5 respectively. When the DC power source is energized, when the current flows from the P-type electrothermal semiconductor material 13 1 into the N-type semiconductor material 13 2 , the heat energy is from below; ^ to the upper side, and the cooling surface is generated at the lower end absorption end, and the heat release end is above. In order to increase the heat dissipation capability of the discharge end, a heat dissipating device i 4 is disposed above the heat release end, and the cooling surface generated by energizing the cooling chip 13 can be exchanged with the heat source for heat exchange. On the contrary, if the current flows from the N-type electrothermal semiconductor material 13 2 into the p-type semiconductor material 131, the lower side is the heat release end, and the upper side is the heat sink end to generate the cooling surface, that is, when the current direction is opposite, the heat release end and the heat absorption end are oppositely inverted. .
前述之致冷裝置雖可與電子元件執行檢測作業所產生之自熱 進行冷熱交^ ’以使電子元件的檢職鱗於職的檢測溫度範 圍内’但隨著電子元件技術的發展’檢測作業之檢測溫度範圍將 會被要求的更加精準控制於較小之範圍内，以使檢測作業萨致更 加之料度’而前述之致冷裝置因無法即時有效的將檢測^業之 檢測溫度範圍精準控制於較小之範圍内，所以仍必須加以改善。 -有鑑於此’本翻人遂以其多年從軸關行業的研發與製作 經驗，針對目前所面臨之問題深人研究，經過長期努力之研究虚 =拉創出-種致冷溫域置，贿電子元件的檢測溫i 粑圍精準控制於較小之範圍内，此即為本發明之設 【發明内容】 ” 土，，之主要目的係提供一種檢测機壓接機構之致冷溫控裝 ，，该壓接麟係具有-可由驅騎· 厂，具組，其中，下壓治具組内係“ 曰二兮』。下m组之端部凸設—可雜接觸電子元件之感 係可感，子元件之溫度，並將該溫度訊號= ϋΐ丨a# 片之輸出功率；藉此，當下壓桿下壓電子元件 生之二2 僅可彻致冷晶片與電子元件執行檢測作業所產 自…作冷熱交換，且藉由溫控裝置可使檢測作業即時精準控 資料康逸，、2制早70，控制單元於接收該溫度訊號後即與 “ΐί:運异比對’並傳輸控制訊號至電源供應器，而由電源 5 圍内’進而更加確保產品的檢測良率。 置，ί :-種檢測機壓接機構之致冷溫控裝 構上:、:於ίϊί;;ί=時應用於檢測 號傳輪至控制單元，控制單元於接收各i ΐίι 庫進仃運算比對，並傳輸控制訊號至各電源供 Π ’各別由魏供應H控制各致冷晶#之輸丨功率 ==的業精準控制於較小的檢測溫度範圍内，而 【實施方式】 於灶Μ審查委員對本發明有進-步之深人瞭解，兹例舉-較佳實施例，並配合圖式說明如后： 龍係於壓接機構2 0上設有-可由驅動 干1，於該下壓桿21頭端則設有-下壓治 ，其中，下壓治具組2 2内係裝設有致冷晶片2 3，於 ^冷模式時，電流方向係使致冷晶片2 3之下方吸熱端產生冷卻 ’上方則為放熱端’為了增加放熱端之散熱能力，另於放熱 之上方裝設散熱裝置3 0，藉由致冷晶片2 3通電所產生的$卻 面，即可無源進行冷熱錢；另於下壓治具組2 2之端部係凸 ，有-感溫器2 4，該感溫器2 4係藉由彈簧2 5的推頂而凸伸 出下壓治具組2 2之端部，並以線路將訊號連結至外部。 …請參閱第4圖，本發明之感溫n24係以線路連結至外部之 訊號轉換器2 6，訊號轉換器2 6再連結於控制單元2 7，护制 單元2 7係可與資料庫進行運算比對，並連結至一電源供^器 ^8，該電源供應器2 8係可控制輸出至致冷晶片2 3 量，而調整控制致冷晶片2 3之輸出功率，藉以控制致冷晶= 2 3之致冷程度，另設有一連結至致冷晶片2 3之顯示器^ 9， 可即時顯示致冷晶片2 3冷面之溫度。 請參閱第4、5圖，當下壓桿21下壓電子元件3 2進行檢 測時，感溫器2 4藉由彈簧2 5之彈力係可保持接觸於電子元件 3。1之表面，並將所感測到之溫度訊號傳輸至訊號轉換器2 6， =號轉換器2 6將溫度訊號轉換後再傳輸至控制單元2 7，控制 單元2 7於接收該溫度訊號後即進行運算，並將運算後所獲致之 溫差值與資料庫進行比對，由於（P) = (v) *⑴，因此在電壓 值（V)固定不變下，可以改變電流量（1)之方式來控制輸出功 率（P) ’故控制單元2 7與資料庫進行比對後，會將所需電流量 (I)之讯唬傳輸至電源供應器2 8，以控制電源供應器2 8輸 出至致冷晶片2 3之電流量（I)，而調整控制致冷晶片2 3之輸 出功率（P)，進而藉以控制致冷晶片2 3之致冷程度；本發明感 溫，24係可即時且連續的將電子元件之表面溫度訊號傳輸至^ 制單元2 7 ’使得控制單元2 7可隨時調整控制電源供應器2 § 輸出至致冷晶片2 3之電流量⑴’因此可不僅可利用致冷曰曰j 2 3與電子元件執行檢測作業所產生之自熱作冷熱交換，且藉由 溫控裝置可使檢測作業即時精準控制於更小的檢測溫度範圍内， 進而更加確保產品的檢測良率。 請參閱第6圖，本發明同時應用於檢測機之多組壓接機構時 、’其各下塵治具之端部係可分別裝設感溫器2 4，各感溫器2 4 並可將各電子元件之溫度訊號經由訊號轉換器2 6傳輸至控制單 元2 7，控制單元2 7於接收各溫度訊號後即進行運算並與資料 庫比對，再將各致冷晶片2 3所需電流量（I)之訊號傳輸至各電 源供應器2 8，而各別控制各致冷晶片2 3之輸出功率，進而使 多組之檢測作業均可即時精準控制於更小的檢測溫度範圍内，而 同時確保產品的檢測良率。 、此外，本發明亦可應用於電子元件的預熱作業，而僅需將致 冷晶片之電流以相反方向輸入，使下方為放熱端並連接於下壓治 具組，而上方則為吸熱端的冷卻面，此即可針對不同需求作 據此，本發明於下壓治具組上裝設致冷晶片，不僅可^^致 冷晶片與電子元件執行檢測作業所產生之自熱作冷熱交換，且藉 1342958 由溫控裝置可使檢測作業即時精準控制於較小的檢測溫卢 進而確保產品的檢測良率，實為___深具實雜及進步^之設 计，然未見有相同之產品及刊物公開，從而允符發明 件，爰依法提出申請。 ° 【圖式簡單說明】 第1圖：係為申請第95103072號『檢測機壓接機構之致冷裝置 專利案壓接機構之示意圖。 7、』 第2圖··係為申請第95103072號『檢測機壓接機構之致冷裝置 專利案壓接機構之致冷晶片之示意圖。 』The aforementioned refrigeration device can perform hot and cold communication with the self-heat generated by the electronic component to perform the inspection operation, so that the electronic component is inspected within the detection temperature range of the job. However, with the development of electronic component technology, the detection operation The detection temperature range will be required to be more precisely controlled within a smaller range, so that the inspection operation will be more material'. The aforementioned refrigeration device cannot accurately and accurately detect the detection temperature range of the inspection industry. Controlled to a smaller extent, so it must still be improved. - In view of this, this is a long-term study of the problems faced by the company, and it has been researched for a long time. The detection temperature of the electronic component is precisely controlled within a small range, which is the invention of the present invention. The main purpose is to provide a cold temperature control device for the pressure crimping mechanism of the testing machine. , the crimping system has a - can be driven by the factory, with a group, in which the lower pressure fixture group is "曰二兮". The end of the lower m group is convexly--the sense of the contact electronic component can be sensed, the temperature of the sub-component, and the temperature signal = the output power of the ϋΐ丨a# piece; thereby, when the lower pressing bar presses the electronic component The second 2 can only be used to perform cold and heat exchange between the cold-wafer and electronic components. The temperature control device can make the inspection operation accurately and accurately control the data, and the control unit receives the data. After the temperature signal, it is compared with “ΐί: Operational Difference” and transmits the control signal to the power supply, and is surrounded by the power supply 5 to further ensure the detection yield of the product. ,, ί :- Detecting machine crimping mechanism The cold temperature control device is configured to: ,: ίϊί;; ί= is applied to the detection number to the control unit, and the control unit receives the comparison calculations of each i ΐίι library, and transmits the control signal to each power supply. Π 'Differently controlled by Wei supply H to control each of the cold crystals # 丨 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = Deeply understood, by way of example - the preferred embodiment, and with the diagram The description of the following is as follows: The dragon is provided on the crimping mechanism 20 - the drive can be driven 1 , and the lower end of the lower press lever 21 is provided with a lower press, wherein the lower press fixture 2 2 is attached A cooling chip 23 is provided. In the cooling mode, the current direction is such that the lower end of the heat sink end of the cooling chip 23 is cooled. The upper side is the heat releasing end. In order to increase the heat dissipation capability of the heat releasing end, the heat is disposed above the heat releasing end. The heat dissipating device 30 can passively carry out the hot and cold money by the surface of the cooling chip 23, and the end portion of the lowering jig group 2 2 is convex and has a temperature sensor 2 4 The temperature sensor 24 is protruded from the end of the lower pressing fixture group 2 by the pushing of the spring 25, and the signal is connected to the outside by the line. Referring to Figure 4, the present invention The temperature sensing n24 is connected to the external signal converter 2, and the signal converter 26 is connected to the control unit 27. The protection unit 27 is operatively compared with the database and connected to a power supply. The power supply 28 can control the output to the amount of the cooled wafer 2, and adjust the output power of the controlled cooling chip 2 to control Cold crystal = 2 3 cooling degree, and a display connected to the cooling chip 23 can display the temperature of the cold surface of the cooled wafer 23. Please refer to Figures 4 and 5, when the lower pressing rod 21 When the electronic component 3 2 is pressed down, the temperature sensor 24 can maintain contact with the surface of the electronic component 3.1 by the elastic force of the spring 25, and transmit the sensed temperature signal to the signal converter 2 6 The == converter 26 converts the temperature signal to the control unit 2, and the control unit 27 performs the operation after receiving the temperature signal, and compares the temperature difference obtained after the operation with the database. Since (P) = (v) *(1), the output power (P) can be controlled by changing the current amount (1) when the voltage value (V) is fixed. Therefore, the control unit 27 compares with the database. After that, the signal of the required current amount (I) is transmitted to the power supply 2 8 to control the amount of current (I) output from the power supply 28 to the cooled wafer 23, and the controlled cooling chip is adjusted. The output power (P) of 2 3, thereby controlling the degree of refrigeration of the cooled wafer 23; the temperature sensing of the present invention, 24 The surface temperature signal of the electronic component can be instantaneously and continuously transmitted to the control unit 2 7 ' so that the control unit 27 can adjust the amount of current (1) of the control power supply 2 § output to the cooled wafer 2 3 at any time. The cold heat 曰曰 j 2 3 can be used for performing hot and cold exchange with the self-heating generated by the electronic component, and the temperature control device can accurately and accurately control the detection operation within a smaller detection temperature range, thereby further ensuring the product. The detection yield. Referring to FIG. 6 , when the invention is applied to a plurality of sets of crimping mechanisms of the testing machine at the same time, the end of each of the dust-removing jigs can be respectively provided with a temperature sensor 24, and each temperature sensor 24 can be The temperature signals of the electronic components are transmitted to the control unit 2 via the signal converter 26, and the control unit 27 performs operations after comparing the temperature signals and compares with the data library, and then supplies the respective cold-rolled wafers 2 3 The signal of the electric current (I) is transmitted to each of the power supply terminals 2, and the output power of each of the refrigerating wafers 2 is controlled separately, so that the detection operations of the plurality of groups can be accurately and accurately controlled within a smaller detection temperature range. While ensuring the detection yield of the product. In addition, the present invention can also be applied to the preheating operation of the electronic component, and only the current of the cooling chip needs to be input in the opposite direction, so that the lower side is the heat releasing end and is connected to the lower pressing fixture group, and the upper side is the heat absorption end. Cooling surface, which can be used according to different requirements, the present invention is provided with a cooling chip on the lower pressing fixture group, which can not only cool the heat exchange between the cold wafer and the electronic component to perform the self-heating operation. And by 1342958, the temperature control device can make the inspection operation accurately and accurately control the small detection temperature and thus ensure the detection yield of the product. It is ___ deep and complicated and the design of the improvement ^, but there is no identical The products and publications are made public, so that the inventions are allowed, and the application is filed according to law. ° [Simple description of the drawing] Fig. 1 is a schematic diagram of the crimping mechanism of the patent application of the refrigeration device of the measuring machine crimping mechanism No. 95103072. 7. Fig. 2 is a schematic diagram of the cold chip of the patented crimping mechanism of the refrigeration device of the pressure measuring device of the No. 95103072. 』
第3圖：本發明壓接機構之示意圖。 第4圖：本發明壓接機構致冷溫控裝置之架構圖。 第5圖：本發明壓接機構致冷溫控裝置之控制流程圖。 第6圖：本發明應用於多組壓接機構致冷溫控裝置之控制流程圖。 【主要元件符號說明】 習式部份： 10:壓接機構 11 :下壓桿 1 2 :下壓治具 13:致冷晶片 13 1:半導體材料 13 2.半導體材料 13 3 :電極 13 4 :電極 13 5 :電極 13 6 :陶瓷基板 13 7:陶瓷基板 14:散熱裝置 本發明部份： 2 0 :壓接機構 2 1 :下壓桿 2 2 :下壓治具組 2 3 :致冷晶片 24 :感溫器 2 5 :彈簧 2 6 :訊號轉換器 2 7 :控制單元 28 .電源供應β 2 9 :顯示器 3 0 :散熱裝置 3 1 :電子元件Figure 3: Schematic diagram of the crimping mechanism of the present invention. Figure 4: Schematic diagram of the refrigeration temperature control device of the crimping mechanism of the present invention. Fig. 5 is a flow chart showing the control of the refrigeration temperature control device of the crimping mechanism of the present invention. Figure 6: Control flow chart of the invention applied to the cooling and temperature control device of the plurality of sets of crimping mechanisms. [Explanation of main component symbols] Conventional part: 10: Crimp mechanism 11: Lower press bar 1 2: Lower press jig 13: Refrigerant wafer 13 1: Semiconductor material 13 2. Semiconductor material 13 3 : Electrode 13 4 : Electrode 13 5 : Electrode 13 6 : Ceramic substrate 13 7 : Ceramic substrate 14 : Heat sink device Part of the invention: 20 0 : Crimp mechanism 2 1 : Lower press bar 2 2 : Lower press fixture set 2 3 : Cooling wafer 24: Thermostat 2 5 : Spring 2 6 : Signal converter 2 7 : Control unit 28 . Power supply β 2 9 : Display 3 0 : Heat sink 3 1 : Electronic components