JP2014236145A - Thermal treatment apparatus and heating plate cooling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal treatment apparatus which cools a heating plate more efficiently, and to provide a heating plate cooling method.SOLUTION: A thermal treatment apparatus 1 includes: a heating plate 11 which heats a substrate W; a passive cooling plate 17 for receiving heat from the heating plate 11; an active cooling part 13 which is disposed at a position separated from the heating plate 11 and is used for receiving the heat from the passive cooling plate 17; a driving mechanism 18 which moves the heating plate 11 and the passive cooling plate 17 relate to each other for thermally connecting the heating plate 11 with the passive cooling plate 17 and moves the passive cooling plate 17 and the active cooling part 13 relative to each other for thermally connecting the passive cooling plate 17 with the active cooling part 13; and a heat conductive sheet 15 which closely contacts with both of the active cooling part 13 and the passive cooling plate 17 and thermally connects the active cooling part 13 with the passive cooling plate 17.

Description

  The present invention includes a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, etc. The present invention relates to a heat treatment apparatus and a heating plate cooling method for performing heat treatment on a substrate).

  Conventionally, as this type of apparatus, there is a heat treatment apparatus including a bake plate, an active cooling plate, a passive cooling plate, a thermal pad, and an air cylinder. The bake plate includes a heater layer. The bake plate can adsorb the substrate. The active cooling plate is installed below the bake plate. The passive cooling plate is provided between the bake plate and the cooling plate. The air cylinder raises and lowers the passive cooling plate. The thermal pad is installed on the upper surface of the bake plate. The bake plate and the passive cooling plate can be in close contact via a thermal pad.

  When cooling the bake plate, the air cylinder first brings the passive cooling plate into contact with the active cooling plate. Thereby, the passive cooling plate is cooled. Subsequently, the air cylinder raises the passive cooling plate. The passive cooling plate contacts the bake plate via the thermal pad and cools the bake plate. The thermal pad can improve the adhesion between the passive cooling plate and the bake plate, and can shorten the time required to cool the bake plate (hereinafter referred to as “cooling time”).

JP 2012-238690 A

  The bake plate described in the prior art document is a so-called heating plate. An object of this invention is to provide the heat processing apparatus and heating plate cooling method which can cool a heating plate more efficiently.

  The present inventor has analyzed in detail the change over time of the temperature of the heating plate when cooling the heating plate. As a result, it has been found that the temperature variation in the surface of the heating plate may increase depending on the cooling conditions. If the temperature variation in the surface of the heating plate increases, it becomes difficult to converge the entire temperature of the heating plate to the target temperature, and the cooling time becomes longer.

  Here, the cooling conditions include the actual temperature of the heating plate before cooling, the temperature at which the heating plate should be cooled (target temperature), and the like.

The present invention based on such knowledge has the following configuration.
That is, the present invention provides a heat treatment apparatus for performing heat treatment on a substrate, a heating plate for heating the substrate, a passive cooling plate for receiving heat from the heating plate, and a position separated from the heating plate. In order to thermally connect the active cooling unit for receiving heat and the heating plate and the passive cooling plate, the heating plate and the passive cooling plate are relatively moved to thermally move the passive cooling plate and the active cooling unit. A drive mechanism for moving the passive cooling plate and the active cooling portion relative to each other and the active cooling portion and the passive cooling plate are thermally connected in close contact with both the active cooling portion and the passive cooling plate. And a heat conductive material that can be used.

  [Operation / Effect] According to the heat treatment apparatus of the present invention, the heating plate heat-treats the substrate by heating the substrate. The drive mechanism can thermally connect the heating plate and the passive cooling plate by relatively moving the heating plate and the passive cooling plate. The drive mechanism can thermally connect the passive cooling plate and the active cooling unit by relatively moving the passive cooling plate and the active cooling unit.

  When the heating plate and the passive cooling plate are thermally connected, heat can be transferred from the heating plate to the passive cooling plate. That is, the heating plate can be cooled. When the passive cooling plate and the active cooling unit are thermally connected, heat can be transferred from the passive cooling plate to the active cooling unit. That is, the passive cooling plate can be cooled.

  Here, the passive cooling plate and the active cooling unit are thermally connected via a heat conductive material. When the drive mechanism relatively moves the passive cooling plate and the active cooling unit, the heat conducting material is in close contact with both the passive cooling plate and the active cooling unit. Thereby, the thermal resistance between a passive cooling plate and an active cooling part becomes small, and the dispersion | variation in the thermal resistance by a position can also be suppressed. That is, heat can smoothly move between the passive cooling plate and the active cooling unit. Therefore, the passive cooling plate can be efficiently cooled, and the temperature in the surface of the passive cooling plate can be suitably prevented from varying.

  Furthermore, since the heating plate is cooled by such a passive cooling plate, the heating plate can be efficiently cooled and the temperature in the surface of the heating plate can be suitably prevented from varying.

  Note that “thermally connecting” means connecting so that heat can be substantially transferred. Even when a plurality of objects are not in direct contact with each other, if the heat can move substantially between the objects, it corresponds to “thermal connection”.

  In the present invention, the heat conductive material is preferably elastically deformable. The heat conducting material elastically deforms following the surface shape of the passive cooling plate and the surface shape of the active cooling part. Therefore, the heat conducting material can be suitably adhered to the passive cooling plate and the active cooling unit, respectively.

  In the present invention, the active cooling part has a substantially flat metal heat transfer surface, the passive cooling plate has a substantially flat metal heat transfer surface, and the main material of the heat conducting material is resin or It is preferable that the heat conductive material is rubber and can be in close contact with the heat transfer surface of the active cooling unit and the heat transfer surface of the passive cooling plate at the same time. The passive cooling plate and the active cooling unit are in thermal surface contact with each other through the heat conductive material. Thereby, while being able to cool a passive cooling plate more efficiently, it can prevent more suitably that the temperature of a passive cooling plate varies. Further, the heat transfer surfaces of the active cooling part and the passive cooling plate are made of metal, respectively, whereas the main material of the heat conducting material is resin or rubber. For this reason, even if each heat-transfer surface of an active cooling part and a passive cooling plate has micro unevenness | corrugation, a heat conductive material can contact | adhere each heat-transfer surface suitably, respectively.

  In the present invention, each of the heating plate and the active cooling unit is fixed at a predetermined position, and the drive mechanism moves the passive cooling plate to approach and separate the passive cooling plate and the heating plate, and It is preferable to move the passive cooling plate closer to and away from the active cooling unit by moving the passive cooling plate. By moving only the passive cooling plate, the heating plate can be cooled and the passive cooling plate can be cooled. A heat treatment apparatus can be realized with such a simple structure with few moving parts.

  In the present invention, the heat conductive material is preferably at least one of a heat conductive sheet, a thermal pad, and a heat conductive grease. According to this, the heat conductive material can be suitably adhered to both the active cooling unit and the passive cooling plate.

  In the present invention, it is preferable to include an adsorption mechanism for adsorbing the heat conducting material to the active cooling section. Since the adsorption mechanism is provided, the heat conducting material can be more suitably adhered to the active cooling unit.

  Further, the present invention provides a cooling process of cooling the heating plate by thermally connecting the passive cooling plate to the heating plate without thermally connecting the passive cooling plate to the active cooling unit in the heating plate cooling method, The passive cooling plate is prepared by cooling the passive cooling plate by thermally connecting the passive cooling plate to the active cooling part without thermally connecting the passive cooling plate to the heating plate. In the heating plate cooling method, the preparation process is performed at least once before the cooling process, the cooling process is interrupted when the preparation process is performed, and the cooling process is resumed when the preparation process is completed.

  [Operation / Effect] According to the heating plate cooling method of the present invention, the cooling process cools the heating plate without cooling the passive cooling plate. In the preparation process, the passive cooling plate is cooled without cooling the heating plate. This preparation process is executed once or more from the start to the end of the cooling process. During the preparation process, the cooling process is interrupted, so the heating plate cannot be cooled. However, when the cooling process is resumed, the heating plate can be efficiently cooled again. As a result, the cooling time required for cooling the heating plate can be shortened, and the overall cooling efficiency of the heating plate can be increased.

  In the present invention, when performing the cooling process, comprising a temperature decrease rate monitoring process for determining whether or not the temperature decrease rate that is the temperature decrease amount of the heating plate per unit time is below a threshold, When it is determined by the temperature decrease rate monitoring process that the temperature decrease rate is equal to or less than the threshold value, it is preferable to perform a preparation process. Since the temperature drop rate monitoring process is provided, the timing for interrupting the cooling process can be determined appropriately.

  Further, according to the present invention, in the heating plate cooling method, it is determined whether or not a temperature change width that is a difference between an initial temperature of the heating plate before cooling and a target temperature at which the heating plate should be cooled is equal to or less than a predetermined amount. Cooling condition determination process, cooling process for cooling the heating plate by thermally connecting the passive cooling plate to the heating plate without thermally connecting the passive cooling plate to the active cooling unit, and the passive cooling plate to the heating plate The passive cooling plate is thermally connected to the active cooling part without being thermally connected to the active cooling unit, and the passive cooling plate is cooled, and the temperature change width is equal to or less than a predetermined amount by the cooling condition determination process. If it is determined that the temperature change range is larger than the predetermined amount by prohibiting the preparation process from the start to the end of the cooling process. If it is done, it is allowed to perform the preparation process from the start to the end of the cooling process, and when the preparation process is performed from the start to the end of the cooling process, the cooling process is interrupted This is a heating plate cooling method.

  [Operation and Effect] According to the heating plate cooling method of the present invention, the cooling condition determination process determines the size of the temperature change width prior to the cooling process. Subsequently, the cooling process is started. The cooling process cools the heating plate without cooling the passive cooling plate. Here, when it is determined that the temperature change width is equal to or less than the predetermined amount, execution of the preparation process is prohibited. This completes the cooling process without interruption. On the other hand, when it is determined that the temperature change width is larger than the predetermined amount, the preparation process is allowed to be executed. In the preparation process, the passive cooling plate is cooled without cooling the heating plate. When the preparation process is performed, the cooling process is interrupted, and when the preparation process is completed, the cooling process is resumed. As described above, since the execution of the preparation process is limited according to the magnitude of the temperature change width, the entire heating plate can be operated regardless of whether the temperature change width is relatively large or relatively small. Cooling efficiency can be increased appropriately.

  In the present invention, when performing the cooling process, comprising a temperature decrease rate monitoring process for determining whether or not the temperature decrease rate that is the temperature decrease amount of the heating plate per unit time is below a threshold, The temperature decrease rate monitoring process is executed only when the temperature change width is determined to be equal to or less than the predetermined amount by the cooling condition determination process, and when the temperature decrease rate is determined to be equal to or less than the threshold by the temperature decrease rate monitoring process, It is preferable to carry out a preparation process. Since the temperature drop rate monitoring process is provided, the timing for performing the preparation process can be appropriately determined.

  In the present invention, there is provided a temperature monitoring process for determining whether or not the temperature of the heating plate is equal to or lower than a predetermined value. Is preferably terminated. Since the temperature monitoring process is provided, the timing for ending the cooling process can be suitably determined.

  In the present invention, it is preferable that in the preparation process, the active cooling unit and the passive cooling plate are thermally connected via a heat conductive material that is in close contact with both the active cooling unit and the passive cooling plate. In the preparation process, the heat conducting material is in close contact with both the passive cooling plate and the active cooling part. Thereby, heat can move smoothly between the passive cooling plate and the active cooling part. For this reason, a passive cooling plate can be cooled efficiently and it can prevent suitably that the temperature in the surface of a passive cooling plate varies. Furthermore, when the cooling process is restarted, the heating plate can be efficiently cooled, and the temperature in the surface of the heating plate can be suitably prevented from varying.

  The present specification also discloses an invention relating to the following heat treatment apparatus and heating plate cooling method.

  (1) Preferably, the passive cooling plate and the active cooling unit are thermally connected without directly contacting the passive cooling plate and the active cooling unit.

  According to the invention as described in said (1), all the heat which moves between a passive cooling plate and an active cooling part passes a heat conductive material. Therefore, the passive cooling plate can be cooled more appropriately.

  (2) Preferably, the drive mechanism thermally connects the heating plate and the passive cooling plate without thermally connecting the passive cooling plate to the active cooling unit.

  According to invention of said (2), since a passive cooling plate is not cooled at the time of cooling of a heating plate, a heating plate can be cooled suitably.

  (3) Preferably, the drive mechanism thermally connects the passive cooling plate and the active cooling unit without thermally connecting the passive cooling plate to the heating plate.

  According to invention of said (3), since a heating plate is not cooled at the time of cooling of a passive cooling plate, a passive cooling plate can be cooled suitably.

  (4) The heating plate and the passive cooling plate are respectively installed in a horizontal posture, the passive cooling plate is disposed below the heating plate, the active cooling unit is disposed below the passive cooling plate, and the passive cooling plate is passive It is preferable that the upper surface of the cooling plate can be thermally connected to the heating plate and the lower surface of the passive cooling plate can be thermally connected to the active cooling unit.

  According to the invention described in (4) above, a heat treatment apparatus can be realized with a simple structure. Further, since the heating plate, the passive cooling plate, and the active cooling unit are arranged in the vertical direction, the installation area of the heat treatment apparatus can be reduced.

  (5) It is preferable that the heating plate and the active cooling unit are respectively fixed at predetermined positions, and the drive mechanism moves the passive cooling plate in the vertical direction.

  According to the invention as described in said (5), the object which a drive mechanism moves is only a passive cooling plate. The direction in which the drive mechanism moves the passive cooling plate is only the vertical direction. Therefore, the structure of the drive mechanism can be simplified. Further, the cooling of the heating plate and the cooling of the passive cooling plate can be quickly switched.

  (6) When the passive cooling plate and the active cooling unit are thermally connected, it is preferable to compress and deform the heat conducting material by the passive cooling plate and the active cooling unit.

  According to invention of said (6), a heat conductive material can be closely stuck to a passive cooling plate and an active cooling part, respectively.

  (7) The predetermined value is preferably larger than the target temperature.

  According to the invention described in (7) above, the temperature of the heating plate is more efficiently converged to the target temperature by utilizing the fact that the temperature of the heating plate decreases due to inertia or the temperature of the heating plate overshoots. Can be made.

  According to the heat treatment apparatus and the heating plate cooling method according to the present invention, the heating plate can be efficiently cooled.

1A and 1B are side views showing a schematic configuration of a heat treatment apparatus according to the first embodiment. 1 is a plan view showing a schematic configuration of a heat treatment apparatus according to Example 1. FIG. 3 is a flowchart illustrating a procedure for cooling the heating plate in the first embodiment. It is a graph which shows the time-dependent change of the temperature of a heating plate. It is a side view which shows schematic structure of the heat processing apparatus which concerns on a comparative example. It is a graph which shows the time-dependent change of the temperature of the heating plate in a comparative example. 6 is a cross-sectional view illustrating a schematic configuration of a heat treatment apparatus according to Embodiment 2. FIG. 10 is a flowchart illustrating a procedure for cooling a heating plate in the second embodiment. 10 is a flowchart illustrating a procedure for cooling a heating plate according to a third embodiment.

Embodiment 1 of the present invention will be described below with reference to the drawings.
1A and 1B are side views showing a schematic configuration of a heat treatment apparatus according to the first embodiment. FIG. 1A shows the case where the passive cooling plate 17 is in the preparation position, and FIG. 1B shows the case where the passive cooling plate 17 is in the cooling position. FIG. 2 is a plan view illustrating a schematic configuration of the heat treatment apparatus according to the first embodiment. In FIG. 2, the drive mechanism 18 and the like are omitted.

  In the following description, “substrate” means a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, and a magneto-optical disk. And the like (hereinafter simply referred to as a substrate).

  The heat treatment apparatus 1 includes a heating plate 11, an active cooling unit 13, a heat conductive sheet 15, a passive cooling plate 17, and a drive mechanism 18.

  The heating plate 11 heats the substrate W. The outer shape of the heating plate 11 is a disk shape having a slightly larger diameter than the substrate W. The heating plate 11 is fixed at a predetermined position in a horizontal posture. The heating plate 11 has an upper surface A1 and a lower surface A2. Each of the upper surface A1 and the lower surface A2 is substantially flat. The substrate W is placed on the upper surface A1. The upper surface A1 is a heat transfer surface for the heating plate 11 to apply heat to the substrate W. The lower surface A2 is a heat transfer surface for the heating plate 11 to transfer heat to the passive cooling plate 17.

  The heating plate 11 includes a heater (not shown). As the heater generates heat, the heating plate 11 itself can be actively heated.

  The active cooling unit 13 is disposed at a position away from the heating plate 11. In the present embodiment, the active cooling unit 13 is disposed below the heating plate 11. The active cooling unit 13 is also fixedly installed. In FIG. 2, the heating plate 11 and the active cooling unit 13 overlap with each other so that the active cooling unit 13 does not appear. The active cooling unit 13 has a substantially flat upper surface B. The upper surface B is a heat transfer surface for the active cooling unit 13 to receive heat from the passive cooling plate 17. The upper surface B is made of metal.

  The active cooling unit 13 has a water-cooled or air-cooled heat exchanger (not shown). The active cooling unit 13 itself can actively lower the temperature.

  The heat conductive sheet 15 is placed on the upper surface B of the active cooling unit 13. The back surface C2 of the heat conductive sheet 15 is in direct surface contact with the upper surface B. The surface of the heat conductive sheet 15 opposite to the back surface C2 is referred to as a front surface C1. The thickness of the heat conductive sheet 15 is smaller than the dimensions of the front surface C1 and the back surface C2. That is, the heat conductive sheet 15 has a flat shape (sheet shape).

  The heat conductive sheet 15 is excellent in heat conductivity (high heat conductivity). The heat conductive sheet 15 is also called a heat dissipation sheet. The main material of the heat conductive sheet 15 is preferably resin (including synthetic resin) or rubber. For example, the heat conductive sheet 15 may be comprised only from resin or rubber | gum. For example, the heat conductive sheet 15 may be comprised with the material in which the additive and filler were mix | blended with the synthetic resin, rubber | gum, etc. Examples of the additive and filler include aluminum oxide, zinc oxide, boron nitride, graphite, silver, ceramic, diamond, and the like.

  The heat conductive sheet 15 can be elastically deformed. The heat conductive sheet 15 has a smaller elastic coefficient than the upper surface B (metal) of the active cooling unit 13 and is relatively flexible. The front surface C1 and the back surface C2 of the heat conductive sheet 15 can be locally deformed. In other words, the front surface C1 and the back surface C2 of the heat conductive sheet 15 can be partially compressed and deformed in the thickness direction.

  The heat conductive sheet 15 corresponds to the heat conductive material in the present invention.

  The passive cooling plate 17 receives heat (thermal energy) from the heating plate 11 and passes the heat to the active cooling unit 13. The passive cooling plate 17 is made of metal. As a metal, it is preferable that it is a metal with favorable heat conductivity, such as copper and aluminum.

  The passive cooling plate 17 is installed below the heating plate 11 and above the active cooling unit 13. In FIG. 2, the heating plate 11 and the passive cooling plate 17 overlap with each other so that the passive cooling plate 17 does not appear. The passive cooling plate 17 has a disk shape having substantially the same diameter as the heating plate 11. The passive cooling plate 17 is installed in a horizontal posture.

  The passive cooling plate 17 has an upper surface D1 and a lower surface D2. Each of the upper surface D1 and the lower surface D2 is substantially flat. The upper surface D1 of the passive cooling plate 17 is opposed to the lower surface A2 of the heat treatment plate 11. The lower surface D <b> 2 of the passive cooling plate 17 faces the surface C <b> 1 of the heat conductive sheet 15. The upper surface D <b> 1 is a heat transfer surface for the passive cooling plate 17 to receive heat from the heating plate 11. The lower surface D <b> 2 is a heat transfer surface for the passive cooling plate 17 to transfer heat to the active cooling unit 13.

  The drive mechanism 18 moves the passive cooling plate 17 in the vertical direction. Thereby, the passive cooling plate 17 and the heating plate 11 approach or separate. Moreover, the passive cooling plate 17 and the active cooling part 13 approach or leave | separate. And the passive cooling plate 17 moves to the preparation position shown to Fig.1 (a), and the cooling position shown to FIG.1 (b).

  When the passive cooling plate 17 is located at the preparation position, the passive cooling plate 17 and the active cooling unit 13 are not in direct contact with each other and are indirectly connected through the heat conductive sheet 15. The heat conductive sheet 15 is in close contact with the passive cooling plate 17 and the active cooling unit 13. Heat can be substantially transferred between the passive cooling plate 17 and the active cooling unit 13 via the heat conductive sheet 15. That is, the passive cooling plate 17 and the active cooling unit 13 are thermally connected.

  When the passive cooling plate 17 and the active cooling unit 13 are thermally connected, it is preferable to compress and deform the heat conductive sheet 15 by the passive cooling plate 17 and the active cooling unit 13. When the heat conductive sheet 15 is compressed and deformed, the heat conductive sheet 15 may be pressed using the weight of the passive cooling plate 17.

  When the passive cooling plate 17 is located at the cooling position, the passive cooling plate 17 and the heating plate 11 are in direct contact. Thereby, the heating plate 11 and the passive cooling plate 17 are thermally connected.

  When the passive cooling plate 17 and the active cooling unit 13 are thermally connected, the passive cooling plate 17 and the heating plate 11 are not thermally connected (insulated). Further, when the passive cooling plate 17 and the heating plate 11 are thermally connected, the passive cooling plate 17 and the active cooling unit 13 are not thermally connected.

  An example of the driving mechanism 18 is an air cylinder.

  Next, operation | movement of the heat processing apparatus 1 which concerns on an Example is demonstrated. Below, the process which heats the board | substrate W is demonstrated first, and the process which cools the heating plate 11 is demonstrated after that.

<Operation of heating the substrate W>
The drive mechanism 18 separates the passive cooling plate 17 from the heating plate 11. At this time, the passive cooling plate 17 may be moved to the preparation position.

  The substrate W is placed on the upper surface A1 of the heating plate 11. The heater included in the heating plate 11 generates heat. The heat generated by the heater is transmitted from the upper surface A1 of the heating plate 11 to the substrate W. In this way, the substrate W is heated.

<Operation of cooling the heating plate 11>
Please refer to FIG. 3 and FIG. FIG. 3 is a flowchart showing a procedure for cooling the heating plate 11. 4 (a) and 4 (b) are graphs showing changes over time in the temperature of the heating plate 11, respectively. 4A and 4B, the horizontal axis is time, and the vertical axis is the temperature of the heating plate 11. 4A and 4B show the temperatures at positions e1 to e6 (see FIG. 1) on the upper surface A1 of the heating plate 11, respectively. FIGS. 4A and 4B are graphs showing the same measurement results except that the range of the vertical axis is different.

<Step S1> Cooling process: time t1 to time t2
The drive mechanism 18 moves the passive cooling plate 17 to the cooling position at time t1. The passive cooling plate 17 is thermally connected to the heating plate 11. Heat is transferred from the heating plate 11 to the passive cooling plate 17. The passive cooling plate 17 receives the heat of the heating plate 11. In this way, the heating plate 11 is cooled by the passive cooling plate 17. In this cooling process, the active cooling unit 13 does not cool the passive cooling plate 17. Time t1 is the time when the cooling process starts.

<Step S2> Preparation process: Time t2 to Time t3
The drive mechanism 18 moves the passive cooling plate 17 from the cooling position to the preparation position at time t2. The heat conductive sheet 15 is in close contact with not only the active cooling unit 13 but also the passive cooling plate 17 and thermally connects the active cooling unit 13 and the passive cooling plate 17. Heat is transferred from the passive cooling plate 17 to the active cooling unit 13 through the heat conductive sheet 15. The passive cooling plate 17 transfers heat to the active cooling unit 13. In this way, the passive cooling plate 17 is cooled by the active cooling unit 13. In this preparation process, the heating plate 11 is not cooled by the passive cooling plate 17.

  Here, since the entire lower surface D2 of the passive cooling plate 17 is in close contact with the heat conductive sheet 15, the thermal resistance between the passive cooling plate 17 and the active cooling unit 13 is small, and the thermal resistance varies depending on the position. Is also suppressed. Therefore, the lower surface D2 of the passive cooling plate 17 is equally cooled, and temperature variations on the lower surface D2 are suppressed. As a result, the temperature on the upper surface D1 of the passive cooling plate 17 also drops substantially uniformly.

  Time t2 is a time at which the cooling process is interrupted. As shown in FIG. 4, the temperature of the heating plate 11 decreases relatively slowly in the period from time t2 to time t3 as compared to the period from time t1 to time t2.

<Step S3> Cooling process: time t3 to time t4
The drive mechanism 18 moves the passive cooling plate 17 from the preparation position to the cooling position at time t3. The heating plate 11 is cooled again by the passive cooling plate 17. Time t3 is the time when the cooling process is resumed. As shown in FIG. 4, the temperature of the heating plate 11 decreases relatively steeply in the period from time t3 to time t4 as compared to the period from time t2 to time t3.

  As described above, since the temperature variation on the upper surface D1 of the passive cooling plate 17 is small, the lower surface A2 of the heating plate 11 is equally cooled, and the temperature on the lower surface A2 of the heating plate 11 is less likely to vary. As a result, the temperature on the upper surface A1 of the heating plate 11 also drops substantially uniformly. Time t3 is the time when the cooling process is resumed.

<Step S4> Preparation process: Time t4 to Time t5
The drive mechanism 18 moves the passive cooling plate 17 from the cooling position to the preparation position at time t4. The passive cooling plate 17 is cooled again by the active cooling unit 13. Time t4 is a time at which the cooling process is interrupted.

<Step S5> Cooling process: Time t5 to Time t6
The drive mechanism 18 moves the passive cooling plate 17 from the preparation position to the cooling position at time t5. The heating plate 11 is cooled again by the passive cooling plate 17. Time t5 is the time when the cooling process is resumed.

  When the temperature of the heating plate 11 converges to the target temperature, the cooling process is terminated. Time t6 is the time when the cooling process ends. As shown in FIG. 4, each temperature of the heating plate 11 at time t6 converges to a target temperature (for example, 80 [° C.]).

  Here, this Example 1 is compared with a comparative example. FIG. 5 is a side view showing a schematic configuration of the heat treatment apparatus 101 according to the comparative example.

  As shown in FIG. 5, the heat treatment apparatus 101 according to the comparative example is an apparatus in which the heat conductive sheet 15 is omitted from the heat treatment apparatus 1 of the present embodiment. That is, the heat treatment apparatus 101 includes a heating plate 111, an active cooling unit 113, a passive cooling plate 117, and a drive mechanism 118. As shown in FIG. 5, when the passive cooling plate 117 is located at the preparation position, the passive cooling plate 117 is in direct contact with the active cooling unit 113.

  FIGS. 6A and 6B are graphs showing changes over time in the temperature of the heating plate 111 in the comparative example. 6A and 6B, the horizontal axis is time, and the vertical axis is temperature. 6A and 6B show the respective temperatures at six positions on the upper surface A1 of the heating plate 111, as in FIG.

  As shown in the figure, in the comparative example, the interval between the curves at each temperature is relatively large, whereas in Example 1, the interval between the curves at each temperature is relatively small. In other words, the variation in temperature depending on the position is smaller in Example 1 than in the comparative example. Further, the period from time t11 to time t16 in the comparative example is relatively long, whereas the period from time t1 to time t6 in the first embodiment is relatively short. That is, according to Example 1, compared with the comparative example, the entire heating plate 11 can be converged to the target temperature in a shorter time. That is, the time required for cooling the heating plate 11 can be shortened.

  As described above, according to the first embodiment, since the active cooling unit 13 and the passive cooling plate 17 are thermally connected by the heat conductive sheet 15, the passive cooling plate 17 can be efficiently cooled. And since the heating plate 11 is cooled by such a passive cooling plate 17, the heating plate 11 can be cooled efficiently.

  Moreover, it can suppress suitably that the temperature in in-plane D1 and D2 of the passive cooling plate 17 by the heat conductive sheet 15 varies. And since the heating plate 11 is cooled by such a passive cooling plate 17, it can suppress suitably that the temperature in in-plane A1, A2 of the heating plate 11 varies. As a result, the entire heating plate 11 can be quickly converged to the target temperature.

  In addition, since the heat conductive sheet 15 can be elastically deformed, the heat conductive sheet 15 can be in close contact with the active cooling unit 13 without any gap even if there are minute irregularities on the upper surface B of the active cooling unit 13. Similarly, the heat conductive sheet 15 can be suitably adhered to the passive cooling plate 17. Therefore, the passive cooling plate 17 can be cooled more efficiently, and the heating plate 11 can be cooled more efficiently. Furthermore, the upper surface B of the active cooling unit 13 and the lower surface D2 of the passive cooling plate 17 can be formed of metal without any trouble.

  Further, when the passive cooling plate 17 and the active cooling unit 13 are thermally connected, the heat conductive sheet 15 is compressed and deformed by the passive cooling plate 17 and the active cooling unit 13. For this reason, the heat conductive sheet 15 can be suitably adhered to the passive cooling plate 17 and the active cooling unit 13, respectively.

  The passive cooling plate 17 and the heat conductive sheet 15 are in surface contact. Further, the heat conductive sheet 15 and the active cooling unit 13 are in surface contact. Therefore, the passive cooling plate 17 can be cooled more efficiently. Moreover, it can suppress suitably that temperature varies within the surface of the passive cooling plate 17.

  In addition, the preparation process is executed once or more from time t1 when the cooling process is started to time t6 when the cooling process is ended. Since the cooling process is interrupted when the preparation process is executed, the heating plate 11 cannot be cooled. However, the heating plate 11 can be efficiently cooled again in the cooling process after the restart. As a result, the time required for cooling the heating plate 11 can be shortened. That is, the overall cooling efficiency of the heating plate 11 can be increased.

  Moreover, since the heating plate 11, the passive cooling plate 17, and the active cooling unit 13 are arranged so as to be lined up and down, the installation area of the heat treatment apparatus 1 can be reduced. Further, the heating plate 11 and the passive cooling plate 17 are installed in a horizontal posture, the upper surface D1 of the passive cooling plate 17 can be thermally connected to the heating plate 11, and the lower surface D2 of the passive cooling plate 17 is actively cooled. It can be thermally connected to the section 13. For this reason, the attitude | position of the passive cooling plate 17 is constant with a horizontal attitude | position, and the mechanism for changing the attitude | position of the passive cooling plate 17 is not required. Therefore, the structure of the heat treatment apparatus 1 can be simplified.

  Moreover, the heating plate 11 and the active cooling unit 13 are each fixed at a predetermined position, and only the passive cooling plate 17 is moved by the drive mechanism 18. Thus, since there are few movable parts, the structure of the drive mechanism 18 can be simplified.

  Furthermore, the moving direction of the passive cooling plate 17 is only the vertical direction. Therefore, the drive mechanism 18 can be further simplified. Further, the cooling of the heating plate 11 and the cooling of the passive cooling plate 17 can be switched easily and smoothly.

  Embodiment 2 of the present invention will be described below with reference to the drawings. FIG. 7 is a cross-sectional view illustrating a schematic configuration of the heat treatment apparatus 2 according to the second embodiment. In addition, below, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol about the same structure as Example 2. FIG.

  The heating plate 11 includes a front side plate 21, a back side plate 22, a support member 23, a heater 25, a temperature sensor 27, and an internal passage F.

  Both the front side plate 21 and the back side plate 22 are made of metal. As the metal, for example, copper or aluminum is preferable. The front side plate 21 and the back side plate 22 correspond to the plate body of the heating plate 11.

  The support member 23 directly supports the substrate W, and forms a slight gap (space) G between the upper surface A1 of the heating plate 11 and the substrate W. Heat is transferred from the heating plate 11 to the substrate W through the gap G. The support member 23 is fixed to the front side plate 21. The support member 23 has, for example, a spherical shape. The upper surface A <b> 1 of the heating plate 11 is formed by the upper surface of the front plate 21 and the support member 23. Incidentally, the lower surface A <b> 2 of the heating plate 11 is formed by the back side plate 22.

  The heater 25 is installed between the front plate 21 and the back plate 22 and generates heat. Heat of the heater 25 is transmitted to the substrate W by the front plate 21.

  In the present embodiment, the heater 25 includes a plurality of divided heaters 25a. A divided heater 25a is disposed in each of a plurality of zones that divide the heating plate 11. Each divided heater 25a can generate heat independently. Thereby, the heating plate 11 can be heated independently for each zone. Examples of the divided heater 25a include a mica heater and a thermoelectric module.

  The temperature sensor 27 measures the temperature of the front plate 21. The temperature sensor 27 is embedded in the front side plate 21.

  The internal passage F is formed in the front side plate 21. One end of the internal passage F opens to the upper surface A1 of the heating plate 11 (specifically, the upper surface of the front plate 21). The other end of the internal passage F is connected to a suction mechanism 41 described later. By discharging the gas from the gap G through the internal passage F, the substrate W can be adsorbed on the upper surface A1 of the heating plate 11.

  The active cooling unit 13 includes an active cooling unit main body 31, a temperature sensor 33, an external pipe 35, a flow rate adjustment valve 37, a flow path H, and an internal passage I.

  The active cooling unit main body 31 is made of metal. As the metal, for example, copper or aluminum is preferable. The upper surface B of the active cooling unit 13 is formed on the active cooling unit main body 31.

  The temperature sensor 33 measures the temperature of the active cooling unit main body 31. The temperature sensor 33 is embedded in the active cooling unit main body 31.

  The flow path H is formed inside the active cooling section main body 31. A heat medium such as cooling water flows through the flow path H. The heat medium exchanges heat with the active cooling unit main body 31.

  The external pipe 35 is installed outside the active cooling unit main body 31 and is connected to the flow path H in communication. The external pipe 35 supplies the heat medium to the flow path H and discharges the heat medium from the flow path H.

  The flow rate adjustment valve 37 adjusts the flow rate of the heat medium flowing through the flow path H. Thereby, the temperature of the active cooling part main body 31 is adjusted. The flow rate adjustment valve 37 is attached in the middle of the external pipe 35.

  The internal passage I is also formed inside the active cooling unit main body 31. One end of the internal passage I is open to the upper surface B of the active cooling unit 13. The other end of the internal passage I is connected to a suction mechanism 41 described later. By making the internal passage I have a negative pressure, the heat conductive sheet 15 is adsorbed on the upper surface B of the active cooling unit 13.

  The passive cooling plate 17 includes an internal passage J. The internal passage J is formed inside the passive cooling plate 17. One end of the internal passage J opens to the upper surface D1 of the passive cooling plate 17. The other end of the internal passage J is connected to a suction mechanism 41, which will be described later.

  Furthermore, the heat treatment apparatus 2 according to the second embodiment includes a heat conductive sheet 39, an adsorption mechanism 41, and a control unit 51.

  The heat conductive sheet 39 is placed on the upper surface D1 of the passive cooling plate 17. The heat conductive sheet 39 is substantially equal to or larger than the upper surface D1 of the passive cooling plate 17. Like the heat conductive sheet 15, the heat conductive sheet 39 is excellent in heat conductivity and elastically deformable. As a material of the heat conductive sheet 39, what was illustrated as a material of the heat conductive sheet 15 is preferable. The material of the heat conductive sheet 39 may be the same as that of the heat conductive sheet 15 or may be different.

  The adsorption mechanism 41 includes discharge pipes 42, 43, 44, a common pipe 45, a vacuum suction source 46, and pressure adjustment valves 47, 48, 49.

  One end of the discharge pipe 42 is connected to the internal passage F. One end of the discharge pipe 43 is connected to the internal passage I in communication. One end of the discharge pipe 44 is connected to the internal passage J. The other ends of the discharge pipes 42 to 44 are all connected to the common pipe 45 in communication. The common tube 45 is connected in communication with a vacuum suction source 46. The vacuum suction source 46 sucks and discharges gas. The vacuum suction source 46 is, for example, a vacuum utility provided in a clean room. Pressure regulating valves 47, 48, and 49 are provided in the middle of the discharge pipes 42, 43, and 44, respectively. Each of the pressure adjusting valves 47 to 49 adjusts the pressure (negative pressure) in the internal passages F, I, and J, respectively.

  When the internal passage F is set to a negative pressure, the substrate W is attracted to the upper surface A1 of the heating plate 11. When the internal passage I is set to a negative pressure, the heat conductive sheet 15 is adsorbed on the upper surface B of the active cooling unit 13. When the internal passage J is set to a negative pressure, the heat conductive sheet 39 is adsorbed on the upper surface D1 of the passive cooling plate 17.

  The control unit 51 is electrically connected to the drive mechanism 18, the heater 25 (the divided heater 25 a), the temperature sensors 27 and 33, the flow rate adjustment valve 37, the vacuum suction source 46, and the pressure adjustment valves 47 to 49. The control unit 51 monitors the temperatures of the heating plate 11 and the active cooling unit 13 based on the detection results of the temperature sensors 27 and 33. The control unit 51 controls the drive mechanism 18, the heater 25, the flow rate adjustment valve 37, the vacuum suction source 46, and the pressure adjustment valves 47 to 49. The control unit 51 refers to a preset processing recipe or the like. The processing recipe and the like include information on a threshold Ra, a predetermined amount k, and a predetermined value, which will be described later, in addition to a target temperature at which the heating plate 11 should be cooled.

  The control unit 51 is a storage medium such as a central processing unit (CPU) that executes various types of processing, a RAM (Random-Access Memory) that is a work area for arithmetic processing, and a fixed disk that stores various types of information such as processing recipes. Etc. are realized.

  Next, operation | movement of the heat processing apparatus 2 which concerns on an Example is demonstrated. Below, the process which heats the board | substrate W is demonstrated first, and the process which cools the heating plate 11 is demonstrated after that.

<Operation of heating the substrate W>
The controller 51 controls the drive mechanism 18 to separate the passive cooling plate 17 from the heating plate 11. When the substrate W is placed on the upper surface A1 of the heating plate 11 by a transport mechanism (not shown), the control unit 51 controls the vacuum suction source 46 and the pressure adjustment valve 47 to reduce the internal passage F and the gap G. Pressure. As a result, the substrate W is attracted to the upper surface A1 of the heating plate 11.

  The controller 51 controls the heater 25 to raise the temperature of the heating plate 11. Thereby, the substrate W is subjected to heat treatment.

  When the predetermined time has elapsed, the control unit 51 controls the vacuum suction source 46 and the pressure adjustment valve 47 to release the adsorption of the substrate W. Thereafter, a transport mechanism (not shown) takes the substrate W from the heating plate 11.

<Operation of cooling the heating plate 11>
Please refer to FIG. FIG. 8 is a flowchart showing a procedure for cooling the heating plate 11. In the flowchart of FIG. 8, the steps related to the start, interruption, restart and end of the cooling process are clearly shown.

  During the operation of cooling the heating plate 11, the control unit 51 controls the vacuum suction source 46 and the pressure adjustment valves 48 and 49 to adsorb the heat conductive sheet 15 to the active cooling unit 13 and performs passive cooling. It is assumed that the heat conductive sheet 39 is adsorbed on the plate 17.

<Step S11> Preparation Process The control unit 51 controls the drive mechanism 18 to position the passive cooling plate 17 at the preparation position. Further, the control unit 51 controls the flow rate adjustment valve 37 based on the detection result of the temperature sensor 33 to adjust the temperature of the active cooling unit main body 31. Thereby, the passive cooling plate 17 is cooled to a predetermined temperature.

<Step S12> Start of Cooling Process The drive mechanism 18 moves the passive cooling plate 17 from the preparation position to the cooling position. The heating plate 11 is started to be cooled by the passive cooling plate 17.

<Step S13> Has Tp reached a predetermined value?
The control unit 51 specifies a predetermined value with reference to a processing recipe or the like. Further, the control unit 51 monitors the temperature Tp of the heating plate 11 (hereinafter referred to as “plate temperature”) based on the detection result of the temperature sensor 27. Then, it is determined whether or not the plate temperature Tp has reached a predetermined value. Here, the predetermined value is preferably larger than the target temperature. Examples of the predetermined value include a value obtained by adding 1 to the target temperature.

  As a result of the determination, if it is determined that the plate temperature Tp has reached a predetermined value, the process proceeds to step S18, and if not, the process proceeds to step S14. Step S13 corresponds to a temperature monitoring process in the present invention.

<Step S14> ΔT ≦ Ra?
The control unit 51 specifies the threshold value Ra with reference to a processing recipe or the like. Further, the controller 51 monitors the temperature decrease rate ΔT, which is the amount of decrease in the plate temperature Tp per unit time, based on the detection result of the temperature sensor 27. Then, it is determined whether the temperature decrease rate ΔT is equal to or less than the threshold value Ra. An example of the threshold Ra is 1 [° C./sec]. However, the value of the threshold Ra is not limited to this, and can be appropriately selected and changed.

  As a result of the determination, if it is determined that the temperature decrease rate ΔT is equal to or less than the threshold value Ra, the process proceeds to step S15, and if not, the process returns to step S13. Step S14 corresponds to the temperature decrease rate monitoring process in the present invention.

<Step S15> Interruption of Cooling Process The drive mechanism 18 moves the passive cooling plate 17 away from the cooling position. This disconnects the thermal connection between the heating plate 11 and the passive cooling plate 17 and interrupts the cooling process.

<Step S16> Preparation Process The drive mechanism 18 positions the passive cooling plate 17 at the preparation position. Thereby, the passive cooling plate 17 and the active cooling unit 13 are thermally connected via the heat conductive sheet 15, and the passive cooling plate 17 is cooled by the active cooling unit 13.

<Step S17> Resumption of Cooling Process The drive mechanism 18 returns the passive cooling plate 17 from the preparation position to the cooling position. Thereby, cooling of the heating plate 11 is restarted. Then, the process returns to step S13.

<Step S18> End of Cooling Process The drive mechanism 18 moves the passive cooling plate 17 away from the cooling position. This completes the cooling process.

  When the predetermined value is different from the target temperature, the temperature of the heating plate 11 (plate temperature Tp) has not yet converged to the target temperature when the cooling process is finished. For this reason, after finishing the cooling process, the controller 51 continues to monitor the plate temperature Tp until the plate temperature Tp converges to the target temperature. At this time, the heater 25 may be appropriately heated to adjust the plate temperature Tp.

  As described above, according to the second embodiment, since step S14 (temperature decrease rate monitoring process) is provided, it is possible to appropriately determine the timing for performing the preparation process. Furthermore, the number of times of performing the preparation process can be easily increased to two or more as necessary. In addition, when it is not necessary to execute the preparation process, the cooling process can be ended without performing the preparation process once after starting the cooling process.

  Moreover, since step S13 (temperature monitoring process) is provided, the timing which complete | finishes a cooling process can be determined suitably.

  Moreover, the predetermined value used for determination of step S13 is a value larger than target temperature. For this reason, the temperature of the heating plate 11 can be more efficiently converged to the target temperature by utilizing the fact that the temperature of the heating plate 11 is reduced by inertia and the temperature of the heating plate 11 is overshooted.

  Since the heat treatment apparatus 1 includes the adsorption mechanism 41, the heat conductive sheet 15 can be more closely attached to the active cooling unit 13.

  Since the heat treatment apparatus 1 includes the heat conductive sheet 39, heat can be smoothly moved between the heating plate 11 and the passive cooling plate 17. For this reason, the heating plate 11 can be cooled more efficiently. Moreover, it can prevent more suitably that plate temperature Tp in the surface of the heating plate 11 varies.

  Further, the adsorption mechanism 41 further adsorbs the heat conductive sheet 39 to the passive cooling plate 17. Therefore, the heat conductive sheet 39 can be suitably adhered to the passive cooling plate 17. Therefore, the heating plate 11 can be cooled more efficiently and more uniformly.

  Further, the suction mechanism 41 further causes the heating plate 11 to suck the substrate W placed on the heating plate 11. Thereby, the heating plate 11 can efficiently heat-treat the substrate W.

  Moreover, since the adsorption | suction mechanism 41 adsorb | sucks each of the heat conductive sheets 15 and 39 and the board | substrate W by the common vacuum suction source 46, it can simplify an apparatus structure.

  Next, Embodiment 3 of the present invention will be described with reference to the drawings. In addition, since the structure of the heat processing apparatus which concerns on Example 3 is the same as Example 2, the description is abbreviate | omitted. Below, the operation | movement which cools the heating plate 11 in the heat processing apparatus 2 which concerns on Example 3 is demonstrated.

  Please refer to FIG. FIG. 9 is a flowchart showing a procedure for cooling the heating plate 11. In addition, about the same step S as Example 2, the same code | symbol is attached | subjected and it demonstrates easily.

<Step S11> Preparation Process The passive cooling plate 17 is cooled by the active cooling unit 13.

<Step S21> WT ≦ k?
Based on the detection result of the temperature sensor 27, the control unit 51 obtains the temperature of the heating plate 11 (plate temperature Tp) before cooling. In this specification, the plate temperature Tp before cooling is particularly called “initial temperature Tp0”. The initial temperature Tp0 may be the plate temperature Tp at the time of starting the cooling process. The control unit 51 obtains the target temperature and the predetermined amount k with reference to the processing recipe and the like. The target temperature and the predetermined amount k are set in advance. Then, it is determined whether or not a temperature change width WT that is a difference between the initial temperature Tp0 and the target temperature is equal to or less than a predetermined amount k. An example of the predetermined amount k is 50 [° C.].

  As a result, if it is determined that the temperature change width WT is equal to or less than the predetermined amount k, the process proceeds to step S22. Otherwise, the process proceeds to step S12.

  Step S21 corresponds to a cooling condition determination process in the present invention.

<Steps S22 and S23>
Start the cooling process. The control unit 51 monitors the plate temperature Tp based on the detection result of the temperature sensor 27. Then, it is determined whether or not the plate temperature Tp has reached a predetermined value. As a result, if it is determined that the plate temperature Tp has reached a predetermined value, the process proceeds to step S18. Otherwise, step S23 is performed again. Thus, step S23 is repeated until the plate temperature Tp reaches a predetermined value, and the plate temperature Tp is monitored.

<Steps S12 to S17>
Start the cooling process. During the period from the start of the cooling process until the plate temperature Tp reaches a predetermined value, the cooling process is interrupted and the preparation process is performed each time the temperature decrease rate ΔT becomes equal to or less than the threshold value Ra. When the plate temperature Tp reaches a predetermined value, the process proceeds to step S18.

<Step S18> End of Cooling Process The cooling process is ended.

  Thus, according to the third embodiment, since step S21 (cooling condition determination process) is provided, the size of the temperature change width WT can be determined before starting the cooling process.

  When it is determined that the temperature change width WT is equal to or less than the predetermined amount k, execution of the preparation process is prohibited during a period from when the cooling process starts to when it ends. Specifically, after starting the cooling process, the cooling process is continued until the cooling process is completed without interrupting the cooling process.

  On the other hand, when it is determined that the temperature change width WT is larger than the predetermined amount k, the preparation process is allowed to be performed in the period from the start of the cooling process to the end of the cooling process. In this embodiment, the cooling process is interrupted and the preparation process is interrupted based on the temperature decrease rate ΔT of the heating plate 11.

  Thus, if the temperature change width WT is relatively small, the preparation process is prohibited during the cooling process, and if not, the preparation process is performed during the cooling process. Is acceptable. As a result, the overall cooling efficiency of the heating plate 11 can be appropriately increased regardless of whether the temperature change width WT is relatively small or relatively large.

  Even if it is allowed to perform the preparation process, as a result, there is a possibility that the preparation process is not performed once in the period from the start to the end of the cooling process.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In each of Examples 1 to 3 described above, the heat conductive sheet 15 is exemplified as the heat conductive material, but the present invention is not limited thereto. The heat conductive material may be constituted by at least one of the heat conductive sheet 15, the thermal pad, and the heat conductive grease.

  (2) In each of the first to third embodiments described above, the heat conductive sheet 15 is disposed on the upper surface B of the active cooling unit 13, but is not limited thereto. For example, the heat conductive sheet 15 may be disposed on the lower surface D <b> 2 of the passive cooling plate 17. Also according to this modified example, when the driving mechanism 18 moves the passive cooling plate 17 to the preparation position, the heat conductive sheet 15 can be suitably adhered to both the passive cooling plate 17 and the active cooling unit 13.

  (3) In each Example 2 and 3 mentioned above, although the heat conductive sheet 15 was made to adsorb | suck to the active cooling part 13, it is not restricted to this. For example, the mounting structure of the heat conductive sheet 15 can be changed as appropriate. For example, the heat conductive sheet 15 may be fixed to the upper surface B of the active cooling unit 13 with an adhesive or a fastening member. Alternatively, the heat conductive sheet 15 may simply be placed on the upper surface B of the active cooling unit 13 without fixing the heat conductive sheet 15 to the active cooling unit 13. The structure for attaching the heat conductive sheet 39 to the passive cooling plate 17 can be similarly changed.

  (4) In each of the above-described Examples 2 and 3, the predetermined value is larger than the target temperature, but is not limited thereto. That is, the predetermined value may be the same value as the target temperature at which the heating plate 11 should be cooled, or the predetermined value may be lower than the target temperature.

  Thus, the time when the cooling process ends and the time when the plate temperature converges to the target temperature may be the same or different. In other words, the period from the start to the end of the cooling process may be the same as or different from the cooling time required to cool the heating plate 11. The time when the cooling process ends is the end of the cooling process executed to cool the heating plate 11 to the target temperature of 1, and in the second and third embodiments, the time when the plate temperature Tp reaches a predetermined value. . In the second and third embodiments, the cooling process may be performed continuously (continuously) from the start to the end of the cooling process, or intermittent (intermittent) during the period from the start to the end of the cooling process. May be executed.

  (5) In each of the first to third embodiments described above, the drive mechanism 18 moves only the passive cooling plate 17, but is not limited thereto. That is, the drive mechanism 18 may thermally connect the heating plate 11 and the passive cooling plate 17 by moving at least one of the heating plate 11 and the passive cooling plate 17. In addition, the drive mechanism 18 may thermally connect the passive cooling plate 17 and the active cooling unit 13 by moving at least one of the passive cooling plate 17 and the active cooling unit 13.

  (6) In each of the first to third embodiments described above, the layout of the heating plate 11 and the active cooling unit 13 is illustrated, but the arrangement thereof can be changed as appropriate. For example, in each of the first to third embodiments, the heating plate 11 and the active cooling unit 13 are arranged so as to line up and down, but the present invention is not limited thereto. For example, the arrangement may be such that the heating plate 11 and the active cooling unit 13 are aligned in the lateral direction. Moreover, in each Example 1 thru | or 3, although the heating plate 11 and the active cooling part 13 were arrange | positioned so that it might overlap by planar view, it is not restricted to this. That is, the arrangement may be changed so that the two do not overlap in plan view. In this case, the heating plate 11 and the active cooling unit 13 may be further arranged so as to overlap in front view or side view. The moving direction of the passive cooling plate 17 by the drive mechanism 18 can be appropriately changed according to the change in the arrangement described above.

  (7) In each of the embodiments 2 and 3 described above, the adsorption mechanism 41 has a function of adsorbing the heat conductive sheet 15 to the active cooling unit 13, a function of adsorbing the heat conductive sheet 39 to the passive cooling plate 17, and the substrate W. However, the present invention is not limited to this. For example, at least one of the three functions described above may be omitted.

  (8) In each of the embodiments 2 and 3 described above, the suction mechanism 41 has realized the three functions described in the above (6) by the same vacuum suction source 46, but is not limited thereto. For example, each function may be realized by different vacuum suction sources.

  (9) In each of the above-described Examples 2 and 3, the heating plate 11 includes the plurality of divided heaters 25a and can raise the temperature for each zone, but is not limited thereto. You may change to the heating plate which heats up the whole surface of a heating plate uniformly. Further, the divided heater 25a may be changed to a heater that uniformly raises the temperature in the entire surface of the heating plate 11.

  (10) In each of the first to third embodiments described above, the outer shape of the substrate W is circular, but is not limited thereto. The present invention can be preferably applied even to a substrate having a rectangular outer shape.

  (11) In the second and third embodiments described above, the plate body of the heating plate 11 is configured by the front side plate 21 and the back side plate 22, but is not limited thereto. For example, the back side plate 22 may be omitted.

  (12) All or some of the configurations in the first to third embodiments and the modified embodiments described above may be appropriately combined.

DESCRIPTION OF SYMBOLS 1, 2 ... Heat processing apparatus 11 ... Heating plate 13 ... Active cooling part 15 ... Thermal conduction sheet 17 ... Passive cooling plate 18 ... Drive mechanism 41 ... Adsorption mechanism 51 ... Control part Ra ... Threshold k ... Predetermined amount (DELTA) T ... Temperature reduction rate Tp … Plate temperature WT… Temperature change width W… Substrate

Claims (12)

In a heat treatment apparatus for performing heat treatment on a substrate,
A heating plate for heating the substrate;
A passive cooling plate for receiving heat from the heating plate;
An active cooling section disposed remotely from the heating plate for receiving heat from the passive cooling plate;
The heating plate and the passive cooling plate are relatively moved to thermally connect the heating plate and the passive cooling plate, and the passive cooling plate and the active cooling unit are thermally moved to thermally connect the passive cooling plate and the active cooling unit. A drive mechanism for relatively moving the cooling unit;
A heat-conducting material capable of thermally connecting the active cooling part and the passive cooling plate in close contact with both the active cooling part and the passive cooling plate;
A heat treatment apparatus comprising: The heat treatment apparatus according to claim 1,
The heat conductive material is a heat treatment apparatus that can be elastically deformed. The heat treatment apparatus according to claim 1 or 2,
The active cooling part has a substantially flat metal heat transfer surface,
The passive cooling plate has a substantially flat metal heat transfer surface,
The main material of the heat conduction material is resin or rubber,
A heat treatment apparatus in which the heat conductive material can be in close contact with the heat transfer surface of the active cooling unit and the heat transfer surface of the passive cooling plate at the same time. In the heat processing apparatus in any one of Claim 1 to 3,
The heating plate and the active cooling part are each fixed in place,
The drive mechanism moves the passive cooling plate closer to and away from the passive cooling plate and moves the passive cooling plate closer to and away from the active cooling unit. Heat treatment equipment. In the heat processing apparatus in any one of Claim 1 to 4,
The heat treatment apparatus is a heat treatment apparatus in which the heat conduction material is at least one of a heat conduction sheet, a thermal pad, and a heat conduction grease. In the heat processing apparatus in any one of Claim 1 to 5,
Heat treatment device equipped with an adsorption mechanism that adsorbs the heat conducting material to the active cooling section. In the heating plate cooling method,
A cooling process for cooling the heating plate by thermally connecting the passive cooling plate to the heating plate without thermally connecting the passive cooling plate to the active cooling unit;
A preparatory process for cooling the passive cooling plate by thermally connecting the passive cooling plate to the active cooling section without thermally connecting the passive cooling plate to the heating plate;
With
Perform at least one preparation process between the start and end of the cooling process,
A heating plate cooling method that interrupts the cooling process when the preparation process is in progress and restarts the cooling process when the preparation process is completed. In the heating plate cooling method of Claim 7,
A temperature decrease rate monitoring process for determining whether or not the temperature decrease rate, which is the amount of temperature decrease of the heating plate per unit time, is equal to or less than a threshold when performing the cooling process;
With
A heating plate cooling method that performs a preparation process when it is determined by the temperature decrease rate monitoring process that the temperature decrease rate is equal to or less than a threshold value. In the heating plate cooling method,
A cooling condition determination process for determining whether or not the temperature change width, which is the difference between the initial temperature of the heating plate before cooling and the target temperature at which the heating plate should be cooled, is a predetermined amount or less;
A cooling process for cooling the heating plate by thermally connecting the passive cooling plate to the heating plate without thermally connecting the passive cooling plate to the active cooling unit;
A preparatory process for cooling the passive cooling plate by thermally connecting the passive cooling plate to the active cooling section without thermally connecting the passive cooling plate to the heating plate;
With
If it is determined by the cooling condition determination process that the temperature change width is equal to or less than the predetermined amount, it is prohibited to perform the preparation process between the start and end of the cooling process,
When it is determined by the cooling condition determination process that the temperature change width is larger than the predetermined amount, it is allowed to perform a preparation process between the start of the cooling process and the end thereof,
A heating plate cooling method in which the cooling process is interrupted when the preparation process is performed between the start and end of the cooling process. In the heating plate cooling method of Claim 9,
A temperature decrease rate monitoring process for determining whether or not the temperature decrease rate, which is the amount of temperature decrease of the heating plate per unit time, is equal to or less than a threshold when performing the cooling process;
With
The temperature decrease rate monitoring process is executed only when the temperature change width is determined to be equal to or less than the predetermined amount by the cooling condition determination process,
A heating plate cooling method that performs a preparation process when it is determined by the temperature decrease rate monitoring process that the temperature decrease rate is equal to or less than a threshold value. In the heating plate cooling method in any one of Claims 7 to 10,
A temperature monitoring process for determining whether the temperature of the heating plate is equal to or lower than a predetermined value,
The method for cooling a heating plate, wherein the cooling process is terminated when the temperature monitoring process determines that the temperature of the heating plate is equal to or lower than a predetermined value. In the heating plate cooling method in any one of Claims 7-11,
The preparation process is a heating plate cooling method in which the active cooling unit and the passive cooling plate are thermally connected through a heat conductive material that is in close contact with both the active cooling unit and the passive cooling plate.

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