TW201319592A - Temperature regulation system for inspection machine - Google Patents

Abstract

A temperature regulation system for inspection machine, comprising: a test socket; a compressing device including a heat exchanger and a thermoelectric cooler (TEC); and a test head having a temperature sensor. The test head is configured at the front end of the compressing device such that, upon placing at least one device under test (DUT) onto the test socket, the test head applies a pressing force against one of the DUTs through downward pressure from the compressing device thereby allowing the temperature sensor to detect the surface temperature of the DUT to obtain a temperature signal, and then feeds such a temperature signal back to a control processing unit that processes the temperature signal to generate a linear control signal thus that, through the control of the linear control signal, the heat absorption and heat discharge functions of the TEC are enabled to further control the temperature of the DUT within a determined range.

Description

Temperature control system for detecting the machine

The invention relates to a temperature control system for detecting a machine, in particular to a temperature control system capable of effectively controlling the temperature of the component to be tested within a certain range when the electronic component performs the detecting operation.

Integral circuit components accumulate and miniaturize a large number of circuit components, and continue to improve the operation speed and product performance. In the past, the arithmetic processing work that must be completed by many large electronic circuits has been completely replaced by integrated circuit components. The proper rate of circuit components directly affects the performance, life and reliability of such electronic devices. Therefore, for integrated circuit manufacturing and packaging testers, in order to ensure product quality, electrical or real-world inspection operations are performed after each stage of the process. In order to detect whether the integrated circuit meets the user's specifications during the manufacturing process, the defective products can be detected and further classified through the automatic inspection machine. All kinds of products will eventually face heat dissipation problems. Once the heat generated by electronic calculation or illumination cannot be smoothly removed, the high temperature generated by the operation of the electronic device cannot be effectively cooled, which can reduce the life of the product, reduce the product efficiency, or Other peripheral related parts cause adverse effects; the weight will directly generate thermal run away, or even cause immediate danger, so the heat dissipation problem can not be ignored.

For this reason, it is common to use heat sink fins, fans, or even a cold chip, or a combination of the above devices to carry heat energy near the heat generating component and reduce the temperature in the vicinity of the heat generating component. However, the heat transfer between the contact surface of the heat generating component and the heat sink, from the contact surface to the metal fin, or between the air and the metal fin, is limited by the contact area or the conductive cross section. That is, if a large size heat sink or heat sink fin cannot be set in a narrow space, the heat dissipation efficiency will be greatly reduced. However, in contrast, electronic devices need to constantly adapt to the trend and gradually become lighter and thinner. How to ensure the heat dissipation efficiency when the space is greatly reduced, and the engineers who plan the internal space and circuit layout of the electronic device are quite troubled.

At present, the conventional technology generally performs hot and cold exchange by self-heating generated by a separate refrigeration device or a heat dissipating fin and the like, so that the integrated circuit components are maintained within the proper temperature range during the detection process; With the development of integrated circuit component technology, the temperature control accuracy and efficiency of the inspection work need to be improved. However, the above-mentioned refrigeration device cannot be effectively and effectively controlled with the temperature of the test. If there is a solution proposed by the manufacturer, please refer to the Taiwan Patent Notice. According to the specification and the drawings in the No. I342958, the cooling and temperature control device 1 is provided with a refrigerant chip 15 in the pressure fixture group under the lower pressure bar, and is protruded at the end of the lower pressure fixture group. a temperature sensor 11 for retractable contact electronic components (as shown in FIG. 1), the temperature sensor 11 senses the temperature of the electronic component, and transmits the temperature signal to the control unit 13 via the signal converter 12, After receiving the temperature signal, the control unit 13 performs an operation comparison with the database, and transmits the signal of the required current amount to the power supply 14 to open and close the output of the control power supply 14 to the cooling crystal. The current of 15; therefore, when the lower pressure bar is pressed to the electronic component for detection, the cold heat exchange between the cooling chip 15 and the electronic component for performing the self-heating operation can be performed, so that the detection operation can be accurately controlled to a small detection immediately. Within the temperature range.

Although the above method can control the detection temperature range to a small range, but continuously adjust the output power to control the refrigerating wafer, it is necessary to repeatedly start and close the refrigerating wafer, which will continue because In the case of unstable output power, the life of the cooled wafer is shortened, so it will be a very unstable factor for semiconductor manufacturers that need continuous testing, and the cooling chip is not expected. The damage situation will also cause serious cost losses to the manufacturer.

Therefore, if a linear control signal can be used to regulate the refrigeration device, and the ON/OFF control method is not needed to control the refrigeration device, the service life of the refrigeration device can be prolonged, which should be an optimal solution.

The object of the present invention is to provide a temperature control system for detecting a machine, which is capable of detecting the surface temperature of the device to be tested and generating a linear control signal when a pressing device is pressed against a device to be tested. The temperature of the device to be tested is controlled within a set range by the heat absorption and the heat release of the cooled wafer.

A further object of the present invention is to provide a better performance of the temperature control of the surface of the device to be tested by the temperature control of the cooled wafer through the linear control signal, and to prevent the cold wafer from being conventionally activated/closed. Control is easy to damage.

An environmental temperature control system for detecting a machine for achieving the above object includes a test stand, a pressurizing device having a heat exchanger and a refrigerant chip, and a test head having a temperature sensor, the test head The device is disposed at the front end of the pressing device, and when at least one component to be tested is placed in the test socket, is pressed down by the pressing device, so that the test head is pressed against one of the components to be tested, so that the temperature sensor detects The surface temperature of the device to be tested obtains a temperature signal, and the temperature signal is fed back to a control processing unit for processing to generate a linear control signal, so that the current of the input cooling chip is under the linear control signal. The heat absorption and exotherm of the cold wafer control the temperature of the device to be tested within a set range.

More specifically, the control processing unit comprises at least a controller and an amplifier, wherein the controller receives the feedback temperature signal and generates a linear control signal by the amplifier.

More specifically, the linear control signal is a set of pulse width modulation signals.

More specifically, the control processing unit further has a proportional integral derivative controller, so that the temperature sensor can detect the surface temperature of the device to be tested through the temperature sensor to obtain a temperature signal that can be compared with the set range; The range is set by a control device, and the control device is also configured to receive a temperature signal obtained by the temperature sensor detecting the surface temperature of the component to be tested.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Please refer to FIG. 2 , which is a structural diagram of an ambient temperature control system for detecting a machine. The ambient temperature control system 2 for detecting a machine includes a test seat 21 and a a pressurizing device 22 having a heat exchanger 221 and a cooling fin 222, and a test head 223 having a temperature sensor 2230 disposed at the front end of the pressurizing device 22, so that at least one component to be tested is placed When placed in the test stand 21, the pressurizing device 22 can be pressed down, so that the test head 223 is pressed against one of the components to be tested, so that the temperature sensor detects the surface temperature of the device to be tested to obtain a temperature. The signal Ts is fed back to the control processing unit 23 for arithmetic processing.

Since the component to be tested is placed on the test stand 21 by means of automatic transfer, the test stand 21 is not tightly coupled at this time, and the pressing force of the pressurizing device 22 and the test head 223 need to be aligned to start the test. The component begins to test; and the temperature sensor 2230 placed at the front end of the test head 223 will simultaneously contact the surface of the component to be tested to instantly detect the temperature of the region to be tested. The temperature sensor 2230 is in the form of contact induction feedback, and is directly fixed to the test head or is set to be a pin (Probe Pin) by an elastic member.

The control processing unit 23 includes a controller 231, an amplifier 232, and a proportional integral derivative controller 233. The controller 231 can receive the temperature signal Ts fed back by the temperature sensor 2230, and then pass through The proportional integral derivative controller 233 compares the temperature signal Ts with the temperature range set by the control device (not shown), and then provides the amplifier 232 with a stable linear control signal Tp (eg, pulse). The wave width modulation signal), and the current input to the cooling chip 222 is controlled by the amplifier 232 and the linear control signal Tp, so that the current I of the input cooling chip 222 is adjusted, and the cooling wafer 222 can be adjusted. The endothermic and exothermic temperatures of the device under test are controlled within a set range. The temperature is controlled in the set range, and the current I to be input to the cooling chip can be adjusted by the temperature signal Ts of the feedback, and the current value is adjusted, positive and negative, and the like.

In addition, the control device can be used to receive a temperature signal obtained by the temperature sensor detecting the surface temperature of the device to be tested.

In addition, when the temperature sensor of the test head 223 is pressed against the device to be tested, the temperature signal of the surface temperature of the device to be tested can be continuously transmitted to the control processing unit 23, and after the processing operation, The linear control signal is output to instantly control the operating temperature of the chilled wafer 222. Therefore, the present invention can instantly fine-tune the operating state of the chilled wafer 222 in response to the surface temperature of the component to be tested.

The temperature control system for detecting the machine provided by the invention has the following advantages when compared with other conventional technologies:

1. The invention has an independent closed loop temperature control system on each test unit, so only a target temperature range needs to be set, and the proportional integration between the actual temperature of the system and the target temperature difference fed back by the temperature sensor can be performed. Differential control is provided to enable the present invention to be maintained quickly and stably within a target temperature range.

2. The control processing unit of the present invention is capable of providing a stable linear control signal output to reduce the impact of the constant switching of the cooled wafer to extend the life of the cooled wafer.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

1. . . Cooling temperature control device

11. . . Thermostat

12. . . Signal converter

13. . . control unit

14. . . Power Supplier

15. . . Cooling chip

2. . . Temperature control system

twenty one. . . Test stand

twenty two. . . Pressurizing device

221. . . Heat exchanger

222. . . Cooling chip

223. . . Test head

2230. . . Temperature sensor

twenty three. . . Control processing unit

231. . . Controller

232. . . Amplifier

233. . . Proportional integral derivative controller

Figure 1 is a temperature control architecture diagram of a conventional refrigeration temperature control device;

FIG. 2 is a structural diagram of a temperature control system for detecting a machine according to the present invention.

2. . . Ambient temperature control system

twenty one. . . Test stand

twenty two. . . Pressurizing device

221. . . Heat exchanger

222. . . Cooling chip

223. . . Test head

2230. . . Temperature sensor

twenty three. . . Control processing unit

231. . . Controller

232. . . Amplifier

233. . . Proportional integral derivative controller

Claims (5)

A temperature control system for detecting a machine includes a test stand, a pressurizing device having a heat exchanger and a refrigerating chip, and a test head having a temperature sensor, the test head being disposed in the pressurizing device The front end, when at least one component to be tested is placed in the test socket, is pressed by the pressing device, so that the test head is pressed against one of the components to be tested; and the test head is forced by the test head Immediately, the temperature sensor detects the surface temperature of the component to be tested to obtain a temperature signal, and the temperature signal is fed back to a control processing unit for performing an arithmetic process to generate a linear control signal, so that the current of the input cooling chip is Under the linear control signal, the temperature of the device to be tested is controlled within a set range by the heat absorption and exotherm of the refrigerant chip. A temperature control system for detecting a machine according to claim 1, wherein the control processing unit comprises at least a controller and an amplifier, and the controller receives the feedback temperature signal, and the amplifier receives the temperature signal A linear control signal is generated. A temperature control system for detecting a machine according to claim 1 or 2, wherein the linear control signal is a set of pulse width modulation signals. A temperature control system for detecting a machine according to claim 1, wherein the control processing unit further has a proportional integral derivative controller for detecting a surface temperature of the device to be tested through the temperature sensor. A temperature signal can be compared to the set range. A temperature control system for detecting a machine according to claim 4, wherein the setting range is set by a control device, and the control device is further configured to receive the temperature sensor to detect a surface of the component to be tested. The temperature gives a temperature signal.