TWI588501B - Temperature control device of electronic components testing and classification machine and its application temperature control method - Google Patents

Description

Temperature control device for electronic component test sorting machine and temperature control method thereof

In particular, the present invention provides a temperature control device for an electronic component test sorter that enables the first batch of electronic components to ensure that they are within a preset temperature range while performing a test operation, thereby effectively improving reliability. Temperature control method for application.

According to the current research and development and innovation, the work that must be completed by many large-scale electronic circuits has been completely replaced by integrated circuits (ICs), because ICs are multi-channel in the production process. Processing procedures, therefore, in order to ensure product quality, the manufacturer will perform circuit test operations after the IC is completed to detect whether the IC has been damaged during the manufacturing process, and then detect defective products.

When the IC performs the circuit test operation, it mainly connects the IC to the test machine, and the test program built in the test machine performs the test operation on the IC. However, in order to automate the test and test of the IC test, For the classification and receiving, the equipment manufacturer designed a test sorting machine. The test sorting machine mainly has a feeding device, a carrying device and a sorting and receiving device, and installs a test provided by the packaging tester in the test area. And the test sorting machine is provided with a central control unit, the central control unit is connected to the test machine, and the test machine provides the test result signal to the central control unit, and then the central control unit controls the automation of each device. Feeding, testing and sorting and receiving; that is, the testing and sorting machine produced by the equipment manufacturer is a hardware device, and the testing machine provided by the packaging and testing company is a software device, and the testing device of the software device is connected. Based on the test sorter, the test sorter can be based on the test provided by the test machine. Test result signals, automated feeding, testing and sorting and receiving operations, so the above mainly describes the difference between the test sorter and the test machine. As mentioned earlier, the test machine is provided by the tester. There are many test programs and test messages built into the test machine. Since this information involves many trade secrets, the test and test industry usually does not provide such information. The test sorting machine produced by the equipment manufacturer can cause the equipment manufacturer to produce the test sorting machine that meets the requirements of the packaging and testing industry as much as possible for the limited information, so that some mis-testing situations are still inevitable during the testing operation.

In terms of the test temperature of electronic components, different electronic components may be used in a high-temperature working environment or in a low-temperature working environment. Therefore, when performing test operations, the electronic components must be simulated in an actual working environment. The test is performed within a preset temperature range, and therefore the test sorter must be provided with a temperature control device to enable the electronic component to perform thermal or cold test operations within a preset temperature range. However, the electronic component can distinguish between the internal temperature (Tj) and the surface temperature (Tc). During the temperature control of the test operation, the tester uses the internal temperature (Tj) of the electronic component as the preset temperature range standard. The internal temperature (Tj) of the electronic component must be read through the electrical connection of the tester. When the tester's tester does not open the internal temperature (Tj) of the electronic component, the test classification produced by the equipment manufacturer. The machine can only read the surface temperature (Tc) of the electronic component by the temperature sensor of the temperature control device, and can estimate the internal temperature (Tj) according to the surface temperature (Tc) of the electronic component. In the preset temperature range, when the temperature of the test machine itself has a large temperature difference with the temperature of the electronic component to aggravate the heat conduction effect, the internal temperature (Tj) of the electronic component is often prevented from being preset. This situation is common in the testing of the first batch of electronic components in the temperature range.

Referring to FIG. 1 , the test classification machine manufactured by the equipment manufacturer is provided with a pressing arm 21 that can be driven to be lifted and lowered by a driving source, and a cooling chip 22 is mounted at the head end of the pressing arm 21 in the heating mode. The current direction is such that the cooling wafer 22 The lower end of the heat generating end generates a hot surface, and the upper side is a heat absorbing end. The hot surface generated by energizing the cold wafer 22 can be exchanged with the electronic component 30 for cold and heat exchange; and the end of the pressing arm 21 is provided with a suction. A temperature sensor 24 is protruded from the mouth 23 and protruded from the end of the pressing arm 21 by the pushing of the spring 25, and the signal is connected to the signal converter 26 by a line, and the signal is converted. The device 26 is further coupled to a central control unit 27, which is coupled to a power supply 28 that controls the amount of current output to the cooled wafer 22 and adjusts the control of the cooled wafer 22 The output power is used to control the degree of heating of the cooling chip 22; a test socket 40 electrically connected to the electronic component 30, the test socket 40 is electrically connected to the testing machine 41 provided by the tester, the testing machine 41 The re-signal number is linked to the central control unit 27 of the test sorter, and the test machine 41 provides the test result signal to the central control unit 27, and the central control unit 27 controls the devices to automatically supply, test and sort the receipt. When the pressing arm 21 picks up and lowers the electronic component 30 to perform the testing operation on the test socket 40, the temperature sensor 24 can maintain contact with the surface of the electronic component 30 by the elastic force of the spring 25, and the electronic component is sensed. The surface temperature (Tc) signal of 30 is transmitted to the signal converter 26, and the signal converter 26 converts the temperature signal to the central control unit 27, and the central control unit 27 performs the temperature signal with the preset temperature range. The operation is compared, and the temperature difference obtained after the comparison operation is converted into the amount of current required to cool the wafer 22, and then the power supply 28 outputs the required amount of current to the cooled wafer 22, and the control is controlled to be cooled. The output power (P) of the wafer 22 is used to control the degree of heating of the cooled wafer 22. As described above, the sealer uses the internal temperature (Tj) of the electronic component 30 as a preset temperature range standard, and the internal temperature (Tj) of the electronic component 30 must be read by the tester 41 to obtain it. When the tester 41 of the tester does not open the internal temperature (Tj) of the electronic component 30, the tester made by the equipment manufacturer can only push the surface temperature (Tc) of the electronic component by the temperature sensor 24 to push Estimate its internal temperature (Tj) is within the preset temperature range, and this method is often misdetected in the test operation of the first batch of electronic components, for example, the preset temperature range is 130 ± 10 ° C, although The cold wafer 22 can heat the surface temperature (Tc) of the electronic component 30 within a temperature range of 130±10 ° C, but since the test machine 41 has its own temperature of about 15 to 25 ° C during the initial test, the electronic component The internal temperature (Tj) of 30 is thermally conducted to the test machine 41 through a large amount of heat through the test socket 40, thereby causing the internal temperature (Tj) of the electronic component 30 to be lower than the preset temperature range of 130 ± 10 ° C due to the interior of the electronic component 30. When the temperature (Tj) is lower than the preset temperature range, the test machine 41 sends a signal to the central control unit 27 as a defective product, and the electronic component 30 is placed in the defective product area. Actually, the electronic component 30 is actually disposed. It is not a true defective product, but the internal temperature (Tj) is lower than the preset temperature range due to heat conduction to the test machine 41, and such misdetection must be continued until the test machine 41 is heated to a considerable extent by heat conduction. After that, the subsequent electronic elements can be made The heat transfer is reduced, and the internal temperature (Tj) of the subsequent electronic components is also improved by approaching the surface temperature (Tc). Generally, after about 3 or 4 tests of the first batch of electronic components, this The situation of misdetection can be improved. Since the first three or four first batch electronic components are not really defective, the first three or four first batch electronic components are finally retested, thus affecting Test the test machine's test capacity.

In view of this, the inventor has been engaged in research and development and production experience of related industries for many years, and has conducted in-depth research on the problems currently faced. After long-term efforts and trials, he has finally developed an electronic component that can make the first batch. It is the design aim of the present invention to effectively improve the reliability when performing the test operation, thereby effectively avoiding the problem of retesting due to misdetection.

A first object of the present invention is to provide a temperature control device for an electronic component test sorting machine and a temperature control method thereof, wherein the temperature control device includes performing electronic components a first temperature control device for pre-heating means, and a second temperature control device for pre-warming the test socket, the first temperature control device pre-heating the surface temperature of the first batch of electronic components beyond a preset The temperature value is 10%~60%, and the second temperature control device pre-heats the test stand to exceed the preset temperature value by 10%~60%; thereby, when the first batch of electronic components are performing the test operation When the heat is transmitted to the test machine, the internal temperature of the electronic component cannot be controlled within a preset temperature range, thereby effectively improving the reliability of the first batch of electronic components to perform the test operation.

A second object of the present invention is to provide a temperature control device for an electronic component test sorting machine and a temperature control method thereof, which are mainly for enabling the first batch of electronic components to ensure that the internal temperature thereof is in advance when performing a test operation. Within the temperature range set, to avoid the need to re-test due to mis-testing, to achieve the benefits of effectively improving test capacity.

Conventional part:

21‧‧‧Press arm

22‧‧‧Cold wafer

23‧‧‧ nozzle

24‧‧‧temperature sensor

25‧‧‧ Spring

26‧‧‧Signal Converter

27‧‧‧Central Control Unit

28‧‧‧Power supply

30‧‧‧Electronic components

40‧‧‧ test seat

41‧‧‧Testing machine

Part of the invention:

50‧‧‧Feeding device

51‧‧‧Tray

60‧‧‧ receiving device

61‧‧‧Tray

70‧‧‧Conveyor

71‧‧‧First Transfer Mechanism

711‧‧‧First mover

72‧‧‧Reloading agency

721‧‧‧First feeding stage

722‧‧‧Second feed stage

723‧‧‧First receiving platform

724‧‧‧Second receiving platform

725‧‧‧First press arm

726‧‧‧second press arm

727‧‧ ‧ nozzle

728‧‧‧ nozzle

73‧‧‧Second transfer mechanism

731‧‧‧Second shifter

80‧‧‧Testing device

81‧‧‧Test circuit board

82‧‧‧ test seat

90‧‧‧Preheating plate

91‧‧‧Chilled wafer

92‧‧‧temperature sensor

921‧‧ ‧ spring

93‧‧‧Signal Converter

94‧‧‧Power supply

95‧‧‧Closed room

96‧‧‧temperature fluid supply line

100‧‧‧Central Control Unit

110‧‧‧Tester

120‧‧‧Electronic components

Figure 1: Schematic diagram of the temperature control architecture of the conventional electronic component test classification machine.

Figure 2: Schematic diagram of the configuration of the electronic component test sorter of the present invention.

Figure 3: Schematic diagram of the temperature control architecture of the electronic component test sorter of the present invention.

Figure 4: Schematic diagram of the temperature control process of the electronic component test sorting machine of the present invention.

Figure 5: Schematic diagram of the temperature control operation of the electronic component test sorter of the present invention (1).

Figure 6: Schematic diagram of the temperature control operation of the electronic component test sorter of the present invention (2).

Figure 7: Schematic diagram of the temperature control operation of the electronic component test sorter of the present invention (3).

In order to make the reviewer further understand the present invention, the preferred embodiment and the drawings are described in detail as follows: Please refer to Figures 2 and 3, the electronic component test sorting machine of the present invention comprises a feeding device. 50, the receiving device 60, the conveying device 70, the testing device 80, the temperature control device and the central control unit 100, the feeding device 50 is arranged on the machine In the present embodiment, the feeding device 50 is provided with at least one tray 51 for holding the electronic component to be tested; the receiving device 60 is disposed on the machine table. In the present embodiment, a plurality of trays 61 capable of holding different levels of electronic components are provided; the test device 80 is provided with a test circuit board having a test socket 82. 81. The test stand 82 has a probe and is electrically connected to the test machine 110 provided by the tester. The transport device 70 is disposed on the machine and is provided with at least one shifting mechanism of the shifter. In the present embodiment, the transport device 70 includes a first transfer mechanism 71, a transfer mechanism 72, and a second transfer mechanism 73. The first transfer mechanism 71 is provided with at least one The first shifter 711 is configured to transfer the electronic component to be tested between the feeding device 50 and the transfer mechanism 72, and the second transfer mechanism 73 is provided with at least one second shifter 731 for reprinting The electronic component is transferred between the mechanism 72 and the receiving device 60, and the transfer mechanism 72 is tested. Two sides of the device 80 are respectively provided with a first feeding stage 721, a second feeding stage 722, a first receiving stage 723 and a second receiving stage 724 for the first moving mechanism 71 and The second transfer mechanism 73 carries the electronic components to be tested/completed, and the electronic components to be tested on the first supply carrier 721 and the second supply carrier 722 are reprinted on the test block 82, and The electronic components that are completed in the test socket 82 are transferred to the first receiving stage 723 and the second receiving stage 724, and the first pressing arm 725 and the second pressing arm 726 are respectively disposed at the front and rear of the testing seat 82. The first pressing arm 725 and the second pressing arm 726 are respectively provided with the suction nozzles 727 and 728 for picking up and transferring electronic components. When the electronic components are transferred into the test socket 82, the electronic components can be pressed down. The electronic component ensures electrical connection to the probe in the test socket 82, and causes the test machine 110 to perform a test operation on the electronic component using its built-in test program, and transmits the test result to the central control unit 100, which is controlled by the central control unit. 100 controls the operation of each device according to the test result, because the electronic component tests the movement of the sorting machine Process known as learning technology, and It is not the focus of this case, so it will not be described; the temperature control device includes a first temperature control device for pre-warming electronic components, and a second temperature control device for pre-warming the test socket 82. A temperature control device pre-temperatures the electronic component with a first temperature generator and a temperature sensor, and the first temperature generator can be a pre-warm disk 90 disposed on the machine, so that the electronic component to be tested is placed The temperature is pre-warmed on the preheating plate 90 before the test socket 82. The first temperature generator may be a heater disposed on the first feeding stage 721 and the second feeding stage 722 to make the first supply The material stage 721 and the second supply stage 722 pre-warm the electronic components to be tested during the reloading process, and the first temperature generators may be disposed on the first pressing arm 725 and the second pressing arm 726. The heater causes the first pressing arm 725 and the second pressing arm 726 to pre-warm the electronic component to be tested during the reloading. In the present embodiment, the first pressing arm 725 is taken as an example, and the second pressing arm 726 is used as an example. The same as the first pressing arm 725), the first temperature generator is a cooling chip 91 disposed on the first pressing arm 725 (such as the third The temperature sensor 92 is disposed under the first pressure-receiving arm 725, and the temperature sensor 92 can protrude from the end of the first pressure-receiving arm 725 by pushing the spring 921. To sense the surface temperature of the electronic component, the temperature sensor 92 further connects the signal to the signal converter 93, and the signal converter 93 is connected to the central control unit 100, and the central control unit 100 is coupled to a power supply. 94, the power supply 94 is capable of controlling the amount of current output to the cooling chip 91, and adjusting the output power of the controlled cooling chip 91 to control the degree of cold and heat of the cooling chip 91; and the second temperature control device The second temperature generator pre-temperatures the test socket 82. The second temperature generator can be a heater disposed on the test socket 82, and the test socket 82 is pre-warmed before being placed in the electronic component. The generator may be a heater disposed on the first pressure-receiving arm 725 to press the probe in the test socket 82 with the heater on the first pressure-receiving arm 725 before the test socket 82 is placed in the electronic component. And the test seat 82 is pre-warmed, and the second temperature generator may be set in the test The test chamber is closed for 82 weeks, and the closed chamber 95 is closed. The chamber 95 is connected to the temperature fluid supply line 96, and the test socket 82 is pre-warmed by injecting a temperature fluid (as shown in Fig. 3) before being placed in the electronic component.

Please refer to Figures 4 and 5 for the preset temperature range of 130±10 °C for electronic components to perform test operations. Since the test machine 110 itself is only about 15~25°C during the initial test, in order to avoid the first A batch of electronic components will conduct a large amount of heat through the test socket 82 to the testing machine 110, causing the internal temperature (Tj) of the first batch of electronic components to be lower than a preset temperature range of 130±10 ° C. Therefore, the present invention is first The test stand 82 performs a pre-warming method to pre-warm the test stand 82 to a preset temperature value of 10% to 60%. In the embodiment, the pre-heating means of the test stand 82 is controlled by the central control unit 100. The second temperature generator of the second temperature control device turns on the temperature fluid supply line 96 to inject the temperature fluid into the closed chamber 95 to preheat the test socket 82 to a preset temperature value of 10% to 60%.

Referring to FIGS. 4 and 6, after the test socket 82 starts to be pre-warmed, the present invention then pre-warms the first batch of electronic components 120 to pre-temperature the surface temperature of the first batch of electronic components 120. The preset temperature value is 10% to 60%. In this embodiment, the pre-heating means of the first batch of electronic components 120 is performed before the first batch of electronic components 120 are placed in the test socket 82. The control unit 100 controls the first temperature generator of the first temperature control device to pre-warm the first batch of electronic components 120, and the central control unit 100 controls the first crimping arm 725 to reload the first batch of electronic components 120. At the same time, the cooling chip 91 is simultaneously activated to heat the first batch of electronic components 120, because the temperature sensor 92 senses the surface temperature of the first batch of electronic components 120, and transmits the sensing signals to the signal converter. 93 is transmitted to the central control unit 100, and the central control unit 100 controls the amount of current output from the power supply 94 to the chilled wafer 91, and adjusts the output power of the control chilled wafer 91, thereby controlling the chilled wafer 91 to heat the first batch. The surface temperature of the sub-electronic component 120 is super Predetermined temperature value of 10 to 60% (about 160 ℃).

Referring to FIGS. 4 and 7, after the first pressing arm 725 places the pre-warmed first batch of electronic components 120 into the test socket 82, the first batch of electronic components 120 is about to exceed the preset temperature. The value of thermal energy is conducted to the test socket 82 and the testing machine 110; thereby, the second temperature generator of the second temperature control device has pre-warmed the test socket 82, and the first temperature generator of the first temperature control device Also transferring a portion of the thermal energy of the first batch of electronic components 120 to the test socket 82, thereby not only allowing the test socket 82 and the tester 110 to heat up to a preset temperature range of 130 ± 10 ° C that is close to the electronic component performing the test operation, and The internal temperature of the first batch of electronic components 120 can be controlled within a preset temperature range of 130±10° C., so that the first batch of electronic components 120 can perform test operations within a preset temperature range, thereby effectively improving The first batch of electronic components 120 performs the reliability of the test operation, thereby avoiding the situation of being retested due to misdetection, thereby achieving the benefit of effectively improving the test capacity. According to the present invention, when the first batch of electronic components completes the test operation and the test block 82 and the test machine 110 are heated up to a preset temperature range of 130 ± 10 ° C which is close to the electronic component performing the test operation, the central control unit 100 Controlling the amount of current of the power supply 94 of the first temperature control device, and adjusting the output power of the cooled wafer 91, thereby controlling the temperature of the surface of the electronic component of the subsequent batch of the cooled wafer 91 to a preset temperature range of 130±10 °C, since the test socket 82 and the test machine 110 have warmed up to a preset temperature range of 130±10 ° C which is close to the electronic component performing the test operation, the thermal energy of the electronic components of the subsequent batch is not transmitted to the test in a large amount. The block 82 and the test machine 110, and in turn the electronic components of the subsequent batch, can perform test operations approaching a surface temperature of a preset temperature range of 130 ± 10 °C.

In summary, the temperature control device of the test sorting machine of the present invention can not only pre-warm the electronic component and the test stand separately, so that the first batch of electronic components can ensure the preset temperature range when performing the test operation. Internally, and controlled by the central control unit, the electronic components of the subsequent batch can also be maintained within a preset temperature range. In order to effectively improve the test capacity, it is a practical and progressive design. However, the same products and publications are not disclosed, so that the requirements for invention patent applications are allowed, and the application is filed according to law.

725‧‧‧First press arm

726‧‧‧second press arm

727‧‧ ‧ nozzle

728‧‧‧ nozzle

81‧‧‧Test circuit board

82‧‧‧ test seat

91‧‧‧Chilled wafer

92‧‧‧temperature sensor

93‧‧‧Signal Converter

94‧‧‧Power supply

95‧‧‧Closed room

96‧‧‧temperature fluid supply line

100‧‧‧Central Control Unit

110‧‧‧Tester

120‧‧‧Electronic components

Claims (10)

A temperature control device for an electronic component test sorting machine, the electronic component test sorting machine is provided with a feeding device, a receiving device, a conveying device, a testing device, a temperature control device and a central control unit, and the testing device is provided with a test The test circuit board of the seat is electrically connected to the test machine provided by the tester, and the temperature control device comprises: a first temperature control device: the first temperature generator and the temperature sensor are to be tested The electronic component performs a pre-warming method, the first temperature generator pre-warms the electronic component to be tested, and the temperature sensor senses a surface temperature of the electronic component to be tested, and the signal is connected to the central control unit; The second temperature control device: pre-warming the test stand with the second temperature generator before the test seat of the test device is not placed in the electronic component. The temperature control device of the electronic component test sorting machine according to claim 1, wherein the transport device is provided with at least one press arm, and the press arm is provided with the pick-and-place electronic component to be tested. And the electronic component to be tested is pressed down in the test socket to electrically connect the electronic component to be tested to the test socket, and the tester uses the built-in test program to test the electronic component. The electronic component performs a test operation and transmits the test result to the central control unit. The temperature control device of the electronic component test classification machine according to the second aspect of the patent application, wherein the first temperature generator of the first temperature control device is a heater disposed on the pressure arm, so that the pressure is obtained The arm preheats the electronic component to be tested when the transfer is taken up. The temperature control device for an electronic component test sorting machine according to claim 3, wherein the first temperature generator is a refrigerant chip, and the central control unit Then connected to a power supply, the power supply can control the amount of current output to the refrigerating chip, and adjust and control the output power of the refrigerating chip. The temperature control device of the electronic component test sorting machine according to the first aspect of the patent application, wherein the first temperature generator of the first temperature control device is a preheating disk disposed on the machine, so that the test is to be performed The electronic component is pre-warmed on the pre-warm disk before being placed in the test stand. The temperature control device of the electronic component test classification machine according to the second aspect of the patent application, wherein the second temperature generator of the second temperature control device is a heater disposed on the pressure arm, so that the pressure is obtained The heater of the arm pre-warms the test stand. The temperature control device of the electronic component test sorting machine according to claim 1, wherein the second temperature generator of the second temperature control device is a closed chamber disposed in the test stand. The closed chamber is coupled to the temperature fluid supply line such that the temperature fluid supply line is pre-warmed by injecting the temperature fluid into the test socket. The temperature control device of the electronic component test sorting machine according to the first aspect of the invention, wherein the second temperature generator of the second temperature control device is a heater disposed in the test stand, so that the heater pair The test stand is pre-warmed. A temperature control method for a temperature control device for an electronic component test sorting machine according to claim 1, wherein the first batch of electronic components to be tested performs a test operation within a preset temperature range, the temperature The control method includes: a test stand pre-heating means: the second temperature generator of the second temperature control device is configured to pre-war the test stand before the electronic component is placed to exceed a preset temperature value by 10%. ~60%; electronic component pre-heating means: pre-warming the first batch of electronic components to be tested with the first temperature generator of the first temperature control device, and using the sense The temperature sensor senses a surface temperature of the first batch of electronic components to be tested, the temperature sensor signal is coupled to the central control unit, and the central control unit controls the first temperature generator of the first temperature control device, The surface temperature of the first batch of electronic components to be tested is preheated to exceed a preset temperature value by 10% to 60%. According to the temperature control method of claim 9, wherein the central control unit controls the first temperature generator of the first temperature control device after the first batch of the electronic component to be tested completes the test operation. The output power is reduced, thereby controlling the first temperature generator to pre-warm the surface temperature of the electronic component to be tested in the subsequent batch to a preset temperature range to perform a test operation.