JP2006125864A - Device handler system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device handler system for raising temperature of devices such as ICs and inspecting electrical properties capable of highly precise inspections by applying a hot blast to a device including a lowered suction pad for holding the devices by suction even when the suction pad is lowered for inspections. <P>SOLUTION: The device handler system is provided with: a heater means for generating a hot blast in a chamber; a device guide for housing the suction pad for holding the devices by suction in an approximate center position and guiding it in a vertical direction; and an inspection means for inspecting high-temperature electrical properties of the devices by moving the device guide downward, mounting the device held by the suction pad by suction to a device socket, and electrically connecting lead wires of the device to contacts of the device socket. The device guide is provided with an opening window for passing the hot blast from its lateral direction to its center. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a device handler device, and more specifically, in a device handler device that inspects electrical characteristics by raising a device made of an IC or the like to high temperature, hot air generated in a chamber is applied to an adsorption pad even at the time of inspection. The present invention relates to a device handler apparatus that suppresses temperature changes of a high-temperature device as much as possible.

  As shown in FIGS. 10 and 11, a device handler device for inspecting the electrical characteristics of a device composed of an IC such as QFP, BGA, CSP, etc. in the prior art by maintaining a high temperature is maintained at a predetermined temperature by a heater. The device 12 to be inspected in the chamber 11 is transported downward when inspecting, and when the inspection is completed, the transport device 13 for transporting upward and the device 12 also provided at the center bottom position of the chamber 11 are inspected. Device tester device 14 for the purpose.

  The transport device 13 includes a suction pad 16D that sucks the device 12 having the lead wire 15 at a substantially central position, and accommodates the suction pad 16D for allowing the device 12 to accurately suck the suction pad 16D at the central position. A device guide 17A made of resin, a projecting guide portion 18 for guiding the device 12 to the suction pad 16D with high precision at the tip of the device guide 17A, and a suction pad 16D The device 12 is maintained at a predetermined temperature, and includes a head heater 19 provided at the top position of the device guide 17A.

  As shown in FIGS. 12 and 13, the suction pad 16D is formed in a cylindrical shape with a tube structure, and a contact portion formed by projecting the circumferential end portion of the bottom portion with a vacuum portion 23 having a hollow center. 26 and an adsorbing portion 27B that is covered with the abutting portion 26 and formed on the depressed surface of the abutting portion 26. In the suction pad 16D having such a configuration, the device 12 is held in contact with the contact portion 26 by evacuating the vacuum portion 23.

  Returning to FIGS. 10 and 11, the device tester device 14 has a structure in which the lead wire 15 of the device 12 sucked by the suction pad 16 </ b> D of the transport device 13 is electrically connected to the contact 33 and inspected. A device socket 34 for mounting and engaging the device 12; a socket substrate 36 for mounting the device socket 34; and a contact received in the device socket 34 so as to be electrically connected to the lead wire 15 of the device 12. A structure including a child 33, a test lead wire 37 connected to a socket substrate 36 and connected to a tester (not shown), and a socket heater 38 for maintaining a constant temperature at the outer peripheral position of the device socket 34; It has become.

  Further, in the chamber 11, the contact between the device 12 sucked by the suction pad 16 </ b> D of the device tester device 14 and the device socket 34 of the device tester device 14, particularly the contactor 33 accommodated in the device socket 34. Heater means 21 for sending hot air is provided.

In the device handler device having such a configuration, in order to inspect the electrical characteristics of the device 12 in the high temperature state, the device guide 17A made of resin is used while the device 12 is held by the suction pad 16D, and the device tester device 14 is used. Wait above socket 34. The device 12 is heated by heat from the head heater 19 through the device guide 17A and the suction pad 16D, and is set to a desired temperature. On the other hand, the device socket 34 is heated by a socket heater 38, and hot air generated by the heater means 21 in the chamber 11 is applied to the contactor 33 accommodated in the device socket 34.
Thus, the contact 33 of the device socket 34 receives the hot air directly, so that it can be heated quickly and efficiently. The device socket 34 also uses a structure that receives the heat of the socket heater 38 via a plate.

When inspecting, as shown in FIG. 11, the head heater 19, the device guide 17 </ b> A, the suction pad 16 </ b> D, and the device 12 that form the transport device 13 move downward and stop at a position where the device 12 fits in the device socket 34. To do.
The device socket 34 is electrically connected to a tester (not shown), and makes electrical contact by pressing the contact 33 of the device socket 34 and the lead wire 15 of the device 12 at the tip of the guide portion 18.
When the electrical property inspection is completed, the head heater 19, the device guide 17A, the suction pad 16D, and the device 12 are moved upward again to the position shown in FIG.
Japanese Unexamined Patent Publication No. 2004-177201 (pages 4 to 5 and FIG. 1)

However, in the conventional method described in the prior art, when the device 12 such as an IC is brought into contact with the device socket 34, the hot air generated in the chamber 11 and applied to the contact 33 is blocked by the device guide 17A. End up. Therefore, the temperature of the device 12 decreases due to the movement of the outside air via the contactor 33. In order to prevent this, heat must be supplied from the head heater 19 and the socket heater 38 to the device 12.
However, since the device guide 17 is made of resin, the heat conduction response is poor, and the suction pad 16D often uses a metal, but has a public structure to suck the device 12 by drawing a vacuum. Since the heat transfer characteristics are inferior, it is difficult to keep the device 12 at a predetermined temperature by supplying heat from the head heater 19 via the suction pad 16D.

In addition, since the guide portion 18 of the device guide 17A needs to press the lead wire 15 of the device 12, the resin that is an insulator is used, so that the lost heat cannot be supplied promptly.
For this reason, the socket heater 38 is often used together. However, since the device socket 34 is made of an insulating resin except for the contactor 33, the heat conduction characteristic is poor and the lost heat is quickly supplied. In addition, there is a problem that the apparatus becomes complicated.

  Therefore, by supplying hot air efficiently, there is a problem that must be solved to prevent a temperature drop that occurs when the lead wire of the device is in contact with the device.

  In order to solve the above problems, the device handler device of the present invention has the following configuration.

(1) The device handler device includes a heater unit that generates hot air in the chamber, a device guide that accommodates a suction pad that sucks the device in a substantially central position and guides the device in a vertical direction, and moves the device guide downward. The device sucked by the suction pad is placed on the device socket, and the lead wire of the device and the contact of the device socket are electrically connected to inspect the electrical characteristics of the device due to high temperature. The device guide includes an opening window through which the hot air passes from the lateral direction toward the suction pad.
(2) The device handler apparatus according to (1), wherein the suction pad is provided with a fin that takes in hot air that has passed through the opening window from a lateral direction with respect to a suction portion that sucks the device.
(3) The suction pad is provided with a hot air vent hole on the circumference for taking in hot air that has passed through the opening window from a lateral direction with respect to the suction portion that sucks the device. Device handler device.
(4) The suction pad is characterized in that a suction part for sucking a device is formed in a cylindrical shape with a constricted tip part, and a fin for taking in hot air that has passed through the opening window is provided around the suction part (1) The device handler device described in 1.
(5) The suction pad is formed by radially forming suction grooves along the circumferential edge with respect to the suction part formed in a disk shape for sucking the device, and the heat conduction part is formed between the suction grooves. The device handler device according to any one of (1) to (4).
(6) The device handler apparatus according to (1), wherein a head heater is provided on the suction pad side to raise the temperature of the sucked device.
(7) The device handler device according to (1), further comprising a socket heater that heats the device socket on the device socket side.

  According to this proposal, when inspecting the electrical characteristics of a device at a high temperature, an opening window through which hot air passes is provided in the device guide, and fins or hot air vent holes are provided in the suction pad, so that the heater in the chamber is provided. Since the hot air generated by the means hits the fins, it is conventionally possible to prevent a temperature drop of the device due to the hot air being blocked by the device guide at the time of inspection.

  Next, an embodiment of a device handler device according to the present invention will be described below with reference to the drawings. In addition, the same code | symbol is attached | subjected and demonstrated to the same thing as what was demonstrated by the prior art.

  The device handler apparatus of the present invention, as shown in FIG. 1, transports the device 12 for inspection into a chamber 11 maintained at a predetermined temperature by a heater, and transports it downward. The transport device 13 includes a transport device 13 and a device tester device 14 for inspecting the device 12 which is also provided at the center bottom position of the chamber 11.

  The transport device 13 includes a suction pad 16 that sucks the device 12 having the lead wire 15 at a substantially central position, and accommodates the suction pad 16 for the device 12 to accurately suck the suction pad 16 at the central position. A device guide 17 made of resin that guides the suction pad 16 in the vertical direction, and a guide formed at the tip of the device guide 17 to guide the device 12 so that the device 12 is sucked to the suction pad 16 with high accuracy. The unit 18 and the head heater 19 provided at the top position of the device guide 17 for maintaining the device 12 sucked by the suction pad 16 at a predetermined temperature are roughly constituted.

  The device guide 17 includes an opening window 20 that allows hot air to pass from the lateral direction toward the center. This open window 20 is passed through when the hot air from the heater means 21 provided in the chamber 11 is inspected, and the contact 33 of the device socket 22 belonging to the device 12 and the device tester device 14 including the suction pad 16 is raised. Keep temperature

As shown in FIGS. 3 and 4, the suction pad 16A of the first embodiment is formed in a cylindrical shape of a tube structure, and has a vacuum part 23 having a hollow center, and an externally provided at the lower position of the cylindrical shape. A fin 24 for taking in hot air, a contact portion 26 formed by projecting a circular end formed in a disk shape at the bottom of the vacuum portion 23, and a contact portion 26 so as to be provided at the center position A suction groove 28 formed along the circumferential edge of the suction portion 27 is formed radially, and a space between the suction grooves 28 is a heat conduction portion 29.
The fins are fins provided for the purpose of increasing the heat transfer area with a heat exchanger or the like.
In the suction pad 16A having such a configuration, the vacuum part 23 is evacuated to hold the device 12 in contact with the contact part 26, and the suction part 27 is dispersed in the radial suction grooves 28. Since the hot air received by the fins 24 can be transmitted to the heat conducting portion 29 by making the heat conducting portion 29, the temperature is maintained even when the device 12 is lowered to the inspection position. Is possible.

  As shown in FIGS. 5 and 6, the suction pad 16B of the second embodiment is formed in a cylindrical shape in which a suction portion 27A having a constricted tip portion is formed, and a vacuum portion 23A having a hollow center and a tip portion is formed. The fin 24 for taking in hot air from the outside provided at the lower position of the constricted cylindrical suction portion 27A and the contact formed by projecting the circular end formed in the disk shape at the bottom of the vacuum portion 23A The suction grooves 28 that are covered by the portion 26 and the contact portion 26 and are formed along the circumferential edge with respect to the suction portion 27A provided at the center position are formed radially, and the space between the suction grooves 28 is heated. The conductive portion 29 is configured.

  In the suction pad 16B having such a configuration, the vacuum part 23A is evacuated to hold the device 12 in contact with the contact part 26, and the constricted cylindrical suction part 27A is held in the radial suction groove 28. Since the heat conduction part 29 is dispersed between them, the hot air received by the fins 24 can be transmitted to the heat conduction part 29, so that the temperature is maintained even when the device 12 is lowered to the inspection position. It becomes possible to be in the state.

As shown in FIGS. 7 to 9, the suction pad 16C of the third embodiment is formed in a tube-shaped cylindrical shape, and is provided at a vacuum portion 23 having a hollow center and a cylindrical lower portion of the vacuum portion 23. The ventilation part 32 which provided the hot air ventilation hole 31 which takes in a hot air from a horizontal direction with respect to the adsorption | suction part 27 which adsorb | sucks the device 12 on the circumference, and the circumferential edge part formed in the disk shape of the bottom part of the vacuum part 23 A suction part 28 formed by projecting and a suction groove 28 that is covered with the contact part 26 and is radially formed along the circumferential edge with respect to the suction part 27 provided at the center position. The heat conduction part 29 is used between 28.
The ventilation part 32 is formed in a cylindrical shape having a central hole of a size through which the vacuum part 23 can penetrate, and has a configuration including a hot air ventilation hole 31 for taking in hot air over the circumference of the side surface.
In the suction pad 16C having such a configuration, the vacuum portion 23 is evacuated to hold the device 12 in contact with the contact portion 26, and the suction portion 27 is dispersed in the radial suction grooves 28. Since the hot air obtained from the hot air vent hole 31 can be transmitted to the heat conducting portion 29, the temperature is maintained even when the device 12 is lowered to the inspection position. It becomes possible to do.

  Returning to FIGS. 1 and 2, the device tester device 14 constitutes an inspection means that inspects the lead wires 15 of the device 12 sucked by the suction pads 16 of the transport device 13 by electrically connecting to the contacts 33. The device socket 34 for mounting and engaging the device 12, the socket substrate 36 for mounting the device socket 34, and the device socket 34 received in contact with the lead wire 15 of the device 12. A contact 33, a test lead wire 37 connected to a socket board 36 and connected to a tester (not shown), and a socket heater 38 for maintaining a constant temperature at the outer peripheral position of the device socket 34. It has a structure.

  In the chamber 11, there is provided heater means 21 for sending hot air between the device 12 sucked by the suction pad 16 of the device tester device 14 and the device socket 34 of the device tester device 14.

In the device handler apparatus having such a configuration, in order to inspect the electrical characteristics of the device 12 at a high temperature, the device tester apparatus 14 is accommodated in a state where the device 12 is housed in a resin device guide 17 and held by the suction pad 16. Waits above the device socket 34. The device 12 is heated by the heat from the head heater 19 through the device guide 17 and the suction pad 16, and is set to a desired temperature. On the other hand, the device socket 34 is heated by a socket heater 38, and hot air generated by the heater means 21 in the chamber 11 is applied to the contactor 33 accommodated in the device socket 34.
Thus, the contact 33 of the device socket 34 receives the hot air directly, so that it can be heated quickly and efficiently. The device socket 34 also uses a structure that receives the heat of the socket heater 38 via a plate.
When inspecting, as shown in FIG. 2, the head heater 19 that forms the transport device 13, the device guide 17 having the opening window 20, the suction pad 16, and the device 12 move downward, and the device socket 34 receives the device 12. Stop at the position where the
The device socket 34 is electrically connected to a tester (not shown), and makes electrical contact by pressing the contact 33 of the device socket 34 and the lead wire 15 of the device 12 at the tip of the guide portion 18.
The device guide 17 is provided with at least one or more opening windows 20, and the hot air sent by the heater means 21 in the chamber 11 passes through the opening windows 20, and the first to first openings provided in the device guide 17. The suction pad 16A, 16B, 16C according to the third embodiment is efficiently hit.
Furthermore, the structure of the suction part 27 (see FIGS. 3 to 9) of the suction pad 16 is a suction pad provided with fins (suction pads 16A and 16B of the first and second embodiments) 24 that efficiently absorb hot air. Is provided with a heat conduction part 29 for efficiently transferring heat absorbed by the suction pad provided with the hot air vent hole (suction pad 16C of the third embodiment) 31 to the device 12 such as an IC and the heat conduction area with the suction force Therefore, the temperature by the hot air can be quickly transmitted to the device. .
When the electrical characteristic inspection is finished, the head heater 19, the device guide 17, the suction pad 16, and the device 12 move upward again to the position shown in FIG.

In this way, by providing the opening window 20 in the device guide 17, the heater means in the chamber 11 even if the device 12 sucked by the suction pad 16 held by the device guide 17 fits in the device socket 22. The hot air sent at 21 passes through the opening window 20 of the device guide 17 and is blown to the entire surface of the device 12 and suction pads with fins (or suction pads 16C with hot air vents) 16A, 16B. Therefore, even if there is a movement of the heat generated through the lead wire 15 of the device 12, heat can be immediately supplied from the hot air, so that the temperature of the device 12 can be kept constant without causing a temperature drop. .
In the present invention, the position of the temperature sensor, the control method, the type and position of the fan are not limited to those described in the embodiments.
As described above, since the hot air can be directly applied to the device 12 and the finned suction pad (or the suction pad 16C with hot air vent) 16A, 16B, the socket heater 38 can be made unnecessary. The effect of simplifying the apparatus and reducing the cost is brought about.

  For devices to be inspected at high temperatures, the hot air sent by the heater means in the chamber is directly applied to the suction pad to keep the device itself at a high temperature, so that the electrical characteristics can be maintained in a state without high temperature heat change. Provide a device handler device that can be inspected.

In the device handler apparatus of this invention, it is explanatory drawing of the state waiting in the upward direction before test | inspecting. It is explanatory drawing which shows the state which can be lowered | hung and inspected for an inspection similarly. FIG. 3 is a schematic cross-sectional view of the suction pad of the first embodiment. It is explanatory drawing which shows the adsorption | suction part which adsorb | sucks the device of the suction pad of 1st Example similarly. FIG. 6 is a schematic cross-sectional view of the suction pad of the second embodiment. It is explanatory drawing which shows the adsorption | suction part which adsorb | sucks the device of the suction pad of 2nd Example similarly. FIG. 6 is a schematic cross-sectional view of the suction pad of the third embodiment. It is a top view of the ventilation part which takes in the hot air provided in the suction pad of 3rd Example as the same. It is explanatory drawing which shows the adsorption | suction part which adsorb | sucks the device of the suction pad of 3rd Example similarly. It is explanatory drawing which showed the state waiting in the upward direction before test | inspecting in the device handler apparatus in a prior art. It is explanatory drawing which shows the state which can be lowered | hung and inspected in order to inspect in the device handler apparatus in a prior art. It is a schematic sectional drawing of the suction pad in a prior art. It is explanatory drawing which shows the adsorption | suction part which adsorb | sucks the device of the suction pad in a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Chamber 12 Device 13 Conveyance apparatus 14 Device tester apparatus 15 Lead wire 16 Adsorption pad 16A Adsorption pad 16B Adsorption pad 16C Adsorption pad 17 Device guide 18 Guide part 19 Head heater 20 Opening window 21 Heater means 22 Device socket 23 Vacuum part 23A Vacuum part 24 Fin 26 Contact part 27 Adsorption part 27A Adsorption part 28 Adsorption groove 29 Thermal conduction part 31 Hot air ventilation hole 32 Ventilation part 33 Contact 34 Device socket 36 Socket substrate 37 Test lead wire 38 Socket heater.

Claims (7)

Heater means for generating hot air in the chamber;
A device guide that guides the suction pad that sucks the device in a substantially central position and guides it vertically,
The device guide is moved downward, and the device sucked by the suction pad is placed on the device socket, whereby the lead wire of the device and the contact of the device socket are electrically connected. An inspection means for inspecting electrical characteristics due to high temperature of
A device handler device comprising:
The device handler device includes an opening window through which the hot air passes from the lateral direction toward the suction pad.   The device handler apparatus according to claim 1, wherein the suction pad includes a fin that takes in hot air that has passed through the opening window from a lateral direction with respect to a suction portion that sucks the device.   2. The device handler device according to claim 1, wherein the suction pad is provided with a hot air vent hole on a circumference for taking in hot air that has passed through the opening window from a lateral direction with respect to a suction portion that sucks a device. .   2. The suction pad according to claim 1, wherein a suction part that sucks the device is formed in a cylindrical shape with a constricted tip portion, and a fin that takes in hot air that has passed through the opening window is provided around the suction part. Device handler device.   The suction pad is characterized in that suction grooves along the circumferential edge are formed radially with respect to the suction part formed in a disk shape for sucking the device, and a heat conduction part is formed between the suction grooves. The device handler apparatus according to claim 1.   The device handler according to claim 1, further comprising a head heater on a side of the suction pad that raises the device being sucked to a high temperature. The device handler device according to claim 1, further comprising a socket heater that heats the device socket to the device socket side.

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