JP2009002960A - Testing device of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a testing device of an electronic component which is capable of correctly controlling the temperature of the electronic component and testing the component at a desired testing temperature. <P>SOLUTION: The device is equipped with a socket 20 which has connecting terminals 21 to which the electronic component 22 to be tested is connected removably, a pressing implement 24 which sucks the electronic component and presses it in the direction of the connecting terminals, Peltier elements 27a and 27b which cool the electronic component through the intermediary of the main body of the socket or the connecting terminals of the socket, a temperature sensor 28 which detects the temperature of the electronic component, and a control means which controls a cooling capacity brought about by the Peltier elements, according to the temperature detected by the temperature sensor. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component testing apparatus that tests an electronic component such as an IC chip at a predetermined temperature. More specifically, even if the electronic component self-heats during a test, the temperature of the electronic component is accurately controlled and desired. The present invention relates to an electronic component testing apparatus capable of testing an electronic component at a test temperature.

  In the manufacturing process of a semiconductor device or the like, a test apparatus for testing a part such as an IC chip manufactured finally is required. As one type of such a test apparatus, an apparatus for testing an IC chip under normal temperature or a temperature condition lower than normal temperature is known. This is because, as a characteristic of the IC chip, it is guaranteed that it operates well even at room temperature or low temperature.

  In such a test apparatus, the upper part of the test head is covered with a chamber, the inside is made a sealed space, and the IC chip is transported onto the test head, where the IC chip is pressed and connected to the test head, The test is performed at room temperature or low temperature within a certain temperature range. By such a test, the IC chip is well tested and at least divided into a good product and a defective product.

JP-A-1-243561

However, with the recent increase in the speed and integration of IC chips, self-heating during operation increases, and even during IC chip testing, even if the interior of the chamber is maintained at a constant temperature, It has become difficult to test IC chips at test temperatures. For example, some types of IC chips can generate as much as 30 watts of self-heating. When testing an IC chip having a large self-heating as described above, it is impossible to rapidly cool the IC chip due to the ambient temperature in the chamber, no matter how much the chamber is kept at a constant temperature. It has become difficult to test IC chips.

  The problem to be solved by the present invention is to provide an electronic component testing apparatus capable of accurately controlling the temperature of an electronic component and testing the electronic component at a desired test temperature even if the electronic component self-heats during testing. Is to provide.

  The present invention solves the above problems by the following means.

  The electronic component testing apparatus according to the invention includes a socket having a connection terminal to which an electronic component to be tested is detachably connected, a pressing tool that sucks and presses the electronic component in the direction of the connection terminal, and the socket body or the A Peltier element that cools the electronic component via the connection terminal of the socket, a temperature sensor that detects the temperature of the electronic component, and a control that controls the cooling capacity of the Peltier element according to the temperature detected by the temperature sensor And means.

  According to the above invention, even if the electronic component self-heats during the test, the temperature of the electronic component can be accurately controlled and the electronic component can be tested at a desired test temperature.

  Hereinafter, embodiments of the invention will be described with reference to the drawings.

  1 is a schematic overall view of an IC chip component testing apparatus according to an embodiment of the invention, FIG. 2 is a cross-sectional view of the main part of the IC chip component testing apparatus of FIG. 1, and FIG. 3 is a connection of the IC chip component testing apparatus of FIG. FIG. 4 is a fragmentary cross-sectional view showing the vicinity of a connection terminal of an IC chip component testing apparatus according to another embodiment of the invention.

<< First Embodiment >>
As shown in FIG. 1, an IC chip component testing apparatus 2 according to the present embodiment is an apparatus for testing an IC chip as a component to be tested at room temperature, low temperature, or high temperature. The main test apparatus is omitted. The handler 4 sequentially carries the IC chips to be tested to the IC socket provided in the test head, classifies the IC chips that have been tested according to the test results, and stores them in a predetermined tray.

  In the present embodiment, the handler 4 includes a chamber 6, and the upper part of the test head 10 is exposed to the test stage 8 in the chamber 6. The upper part of the test head 10 is shown in FIG. A socket 20 is mounted on the top of the test head 10. In the socket 20, the chip attachment / detachment opening of the socket 20 faces the inside of the chamber 6 so that the IC chips 22 to be tested conveyed by the suction head 24 are sequentially attached in a detachable manner.

  An IC socket 20 provided in the test head 10 is connected to a test main device (not shown) through a cable, and an IC chip 22 detachably attached to the IC socket 20 is connected to the test main device through a cable. The IC chip 22 is tested by a test signal from the test main device. Details of the IC socket 20 will be described later.

  As shown in FIG. 1, the handler 4 has an IC storage unit 30 for storing IC chips to be tested from now on and classifying and storing tested IC chips. The IC storage unit 30 includes a loader tray 32A on which an IC chip to be tested is mounted, classification trays 32B to 32E on which tested IC chips are classified and mounted, an empty tray 32F, and an optional tray. 32G is arranged. These trays 32 </ b> A to 32 </ b> G are arranged at predetermined intervals along the X-axis direction, and are stacked in the Z-axis direction (height direction).

  The IC chip mounted on the loader tray 32 </ b> A is transported onto a soak stage 36 inside the chamber 6 using the first XY transport device 34 mounted on the handler 4. Further, the tested IC chips tested by the test head 10 are finally classified and mounted on the classification trays 32B to 32E of the IC storage unit 30 using the second XY transport device 35. Among the trays 32B to 32E for classification, for example, the tray 32C is a non-defective product tray, and the other trays are defective products or trays for retesting.

  When the classification trays 32B to 32E are filled with the tested IC chips, the empty tray 32F is transported and stacked thereon and used as a classification tray. The option tray 32G is used for other purposes.

  The inside of the chamber 6 has a sealed structure, except that the IC chip delivery portion is configured to be openable by a shutter or the like. For example, the chamber 6 is in a high temperature from room temperature to about 160 ° C. or from room temperature to about −60 ° C. Sustainable. The interior of the chamber 6 is divided into a soak stage 36, a test stage 8, and an outlet stage 40.

  A turntable 38 is disposed on the soak stage 36. On the surface of the turntable 38, recesses 42 for temporarily accommodating IC chips are arranged at a predetermined pitch along the circumferential direction. In the present embodiment, two rows of recesses 42 are formed in the radial direction of the turntable 38, and the two rows of recesses 42 are arranged at a predetermined pitch along the circumferential direction. The turntable 38 rotates clockwise. The IC chip mounted in the recess 42 of the turntable 38 at the mounting position 44 by the first XY transport device 34 is subjected to thermal stress (low temperature or low temperature) until the temperature condition to be tested while the turntable 38 is indexed in the rotation direction. High temperature).

  At the take-out position 46 which is about 240 degrees in the rotation direction from the mounting position 44 with respect to the rotation center of the turntable 38, the turntable 38 is mounted on one of the three contact arms 48 on the turntable 38. A certain suction head is located, and at that position, the IC chip can be taken out from the recess 42 by the suction head. The three contact arms 48 are mounted at substantially equal intervals in the circumferential direction with respect to the rotation shaft 50, and can be indexed by 120 degrees in the clockwise rotation direction around the rotation shaft 50. The index feed is to stop after a predetermined angle of rotation and then repeat the predetermined angle of rotation. When the index of the contact arm 48 is fed, the time during which the arm 48 is stopped is the time obtained by adding the time for attaching / detaching the IC chip to / from the socket when the IC chip is mounted on the socket on the test head 10 and being tested. It corresponds to. The stop time of the index feed is the same as the stop time of the index feed in the turntable 38, and the turntable 38 and the contact arm 48 rotate so as to feed the index synchronously.

  In this embodiment, one suction head among the three contact arms 48 is positioned on the take-out position 46 of the soak stage 36, and the suction heads of the other contact arms 48 are positioned on the contact head 10 of the test stage 8. Further, the suction head of another contact arm 48 is positioned on the entrance 52 of the exit stage 40.

  The IC chip mounted in the concave portion 42 of the turntable 38 at the mounting position 44 of the turntable 38 is applied with a predetermined thermal stress while being index-fed from the mounting position 44 to the removal position 46. , It is sucked by the suction head of the contact arm 48. The IC chip sucked by the suction head is placed on the test head 10 by the index feed of the contact arm 48 in the clockwise direction. At that position, as shown in FIG. 2, the IC chip 22 sucked and held by the suction head 24 is mounted on the socket 20 and a test is performed.

  The IC chip 22 that has been mounted on the socket 20 on the test head 10 and has been tested is again attracted to the suction head 24, and the contact arm 48 shown in FIG. Located at the top of the entrance 52. At that position, the tested IC chip is slid to the outlet position 54 by the outlet shifter in the direction of arrow A. At the exit position of the exit stage 40, the IC chip disposed on the exit shifter is returned from a low temperature or a high temperature to a normal temperature, which is a temperature at the time of the test. In the case of a low-temperature test, by returning the IC chip to the room temperature at the outlet stage 40, it is possible to effectively prevent dew condensation on the IC chip immediately after being taken out from the chamber 6.

  The IC chip placed on the exit shifter at the exit position 54 of the exit stage 40 is returned to room temperature and then shifted in the direction of arrow B by the exit arm (not shown) and placed at the receiving position 56. Moved to a certain exit turn. The exit turn rotates in the direction of arrow C and can reciprocate between the receiving position 56 and the discharge position 58. The suction head of the second XY transport device 35 is configured to be movable at the discharge position 58 of the exit turn, and the transport device 35 converts the tested IC chip placed at the discharge position by the exit turn into the test result. Based on the classification trays 32B to 32E.

  In the component testing apparatus 2 according to the present embodiment, the heat exchange device 60 for the soak stage is disposed on the ceiling of the soak stage 36 in the chamber 6 of the handler 4, and the test stage is disposed on the side wall of the test stage 8. A heat exchanging device 62 is disposed. These heat exchange devices 60 and 62 have a cooling device using liquid nitrogen or the like as a refrigerant and a blower that circulates cold air in the chamber if the test device 2 can perform a low temperature test. When the test device can perform a high temperature test, the heat exchange devices 60 and 62 include a heating device and a blower. When the test apparatus can perform a low temperature test and a high temperature test, these heat exchange devices 60 and 62 have a cooling device, a heating device, and a blower device, and are used by switching between the cooling device and the heating device. . These heat exchange devices 60 and 62 are controlled by a temperature control device 70. Output signals from the temperature sensor 72 arranged on the test stage 8, the temperature sensor 74 arranged on the soak stage 36, and other sensors are input to the temperature control device 70, and output signals from these sensors are used. Thus, the heat exchange amount (output) of the heat exchange devices 60 and 62 can be controlled.

  In the following description, the case where the test apparatus 2 is a test apparatus capable of both a high temperature test and a low temperature test, and a case where a low temperature test is mainly performed using the apparatus will be described. As shown in FIG. 2, in the test stage 8, a bottom portion of the chamber 6 made of a heat insulating material and a part of the main base 80 that holds the chamber 6 are cut out and held on the test head 10 there. The socket 20 is attached.

  The socket 20 is held by a socket guide 82. The socket guide 82 is attached to the base ring 88. The base ring 88 is attached to the fixed base 90 and constitutes a chamber opening 92. The fixed base 90 has a heat insulating property similar to the chamber 6 and is detachably fixed to the bottom openings of the chamber 6 and the main base 80.

  A low temperature socket adapter 98 is connected to the back surface of the socket 20 (outside the chamber), and is electrically connected to the terminals of the socket 20. The adapter 98 is fixed to a substantially central surface of the wiring board 100 to make electrical connection between the terminal of the socket 20 and the wiring board 100. A test head 10 is mounted on the lower surface of the wiring board 100. The wiring board 100 is also called a performance board.

  The test head 10 receives a drive signal from a test main device (not shown) and transmits the test drive signal to the IC chip 22 mounted on the socket 20 via the wiring board 100 and the adapter 98.

  In the present embodiment, as shown in FIG. 2, a heating board 106 having an opening in the center is provided on the back surface (outside of the chamber) of the fixed base 90 via a mounting plate 150 that also serves as a heat insulating material and a sealing member. It is fixed with bolts. The heating board 106 is also called a HIFIX heater, and is obtained by sandwiching a sheet heating element 108 such as a rubber heater with an aluminum plate or the like. A first seal member 112 is mounted in advance on the lower surface of the heating board 106. The first seal member 112 is made of a resilient sheet such as a silicon sponge rubber sheet.

  In this embodiment, when connecting and fixing the socket adapter 98 attached to the approximate center of the wiring board 100 as a test board to the socket 20, the outer peripheral surface of the wiring board 100 is the lower surface of the heating board 106. The wiring board 100a is directly heated by the heating board 106 via the first seal member 112.

  A radial drying passage 110 is formed in the heating board 106, and a dry gas can be enclosed in a first sealed space 118 formed between the socket guide 82 and the wiring board 100. As the dry gas to be enclosed in the first sealed space 118, for example, dry air having a dew point temperature lower than the internal temperature of the chamber 6 is used. For example, when the inside of the chamber 6 is about −55 ° C., it is preferable that the dew point temperature of the dry air enclosed in the first sealed space 118a through the drying passage 110 is about −60 ° C. The temperature of the dry air is, for example, about room temperature.

  As shown in FIG. 3, in the present embodiment, a connection terminal 21 that is elastically deformable in the vertical direction is attached to the socket 20, and the lower end of the connection terminal 21 is connected to the wiring board 100. . At the upper end of the connection terminal 21, a contact portion 21 a that is electrically connected by pressing the terminal 22 a of the IC chip 22 is formed.

  In this embodiment, the suction head 24 also serves as a pressing tool, and when testing the IC chip 22, the IC chip 22 sucked in the vacuum suction hole 25 is pressed in the direction of the connection terminal 21, and the terminal 22a and the connection terminal are pressed. The electrical connection with the contact part 21a of 21 is ensured.

  At the lower end of the suction head 24, a pressing pad 26 that is in contact with the upper surface of the terminal 22 a of the IC chip 22 and presses the terminal 22 a against the contact portion 21 a of the connection terminal 21 is mounted. The pressing pad 26 is made of an insulating member such as a synthetic resin.

  A cooling device 27 is embedded in the suction head 24 positioned around the lower end of the vacuum suction hole 25 to contact the IC chip 27 directly or indirectly through an insulating member and cool it. The cooling device 27 is composed of, for example, a Peltier element, a vortex tube, a heat pipe, a heat exchanger for cooling, and the like. The Peltier element is an element that can be cooled by energization. The vortex tube is a cooling device that can be cooled by sending compressed air. A heat pipe is a device that absorbs heat by using fluid movement inside the pipe. Examples of the heat exchange unit include a passage for circulating a refrigerant such as liquid nitrogen, a passage for circulating a coolant from the refrigeration cycle, and the like. When a Peltier element or a heat pipe is used as the cooling device 27, the position opposite to the cooling side is the heat dissipating part, so that the cooling fins 29 are connected to the cooling device 27 as shown in FIG. You may do it. In addition, when the suction head 24 itself is excellent in heat conductivity, the outer peripheral surface of the suction head may be processed into a concavo-convex shape to form a heat radiation fin. The cooling device 27 may be other cooling devices other than those described above.

  A temperature sensor 28 is disposed in the vicinity of the cooling device 27, and the temperature of the IC chip 22 cooled by the cooling device 27 can be directly or indirectly measured. Although it does not specifically limit as the temperature sensor 28, Thermocouples, such as a platinum sensor, and another temperature sensor can be used. The temperature signal measured by the temperature sensor 28 is input by the control device, and the cooling output by the cooling device 27 is controlled so as to cancel the self-heating of the IC chip 22 during the test, so that the IC chip 22 is always at a predetermined temperature. Control to be maintained.

  In such an IC chip component testing apparatus 2 according to the present embodiment, even if the IC chip 22 self-heats during the test, the cooling device 27 cools the IC chip 22. Canceling, the IC chip 22 can be tested at a predetermined low temperature as specified.

  In the electronic component testing apparatus according to the present embodiment, the heating board 106 is attached around the chamber opening 92a of the chamber 6 whose interior is cooled to a temperature below room temperature, and the wiring board 100a is directly heated by heat transfer. It is configured to do. For this reason, the wiring board 100 located on the back surface of the socket 20 is heated to a temperature equal to or higher than the dew point of the atmospheric gas. For this reason, it is possible to effectively prevent the occurrence of condensation on the wiring board 100 on the back surface of the socket.

  In addition, since the IC test apparatus according to the present embodiment does not employ a heat insulating structure such as a special spacing frame, the manufacturing cost is also reduced. In addition, since the distance between the wiring board 100 and the socket 20 is extremely close, the electrical path (wiring cable, etc.) from the socket 20 to the wiring board 100a can be shortened, making it difficult for noise to enter and improving the reliability of the test. To do.

  Furthermore, in the IC test apparatus according to the present embodiment, the wiring board 100 is brought into contact with the heating board 106 so as to form the first sealed space 118 on the wiring board side of the socket guide 82, and the first sealed space 118 is dried. By forming the drying passage 110 for feeding the gas in the heating board 106, the first sealed space 118 is filled with the dry gas. As a result, condensation on the back surface of the socket guide 82 can be more effectively prevented.

<< Second Embodiment >>
As shown in FIG. 4, in the second embodiment of the present invention, the cooling device 27a or 27b is mounted on the socket 20 side without mounting the cooling device on the suction head 24a side. Although the arrangement position of the cooling device 27a or 27b is not particularly limited, for example, as shown in FIG. 4, it is arranged between the socket 20 and the socket adapter 98 or at the lower end position of the connection terminal 21.

  When the cooling device 27 a is disposed between the socket 20 and the socket adapter 98, it is preferable to form a gap in order to prevent a short circuit with the connection terminal 21. In this case, the cooling device 27a can cool the IC chip 22 via the socket 20, cancel the self-heating of the IC chip 22, and test the IC chip 22 at a low temperature as specified.

  In the case where the cooling device 27b is arranged at the lower end position of the connection terminal 21, in order to prevent a short circuit with the connection terminal 21, the cooling device 27b is provided at the lower end portion of the connection terminal 21 via an insulating member 29 such as plastic. Install. In this case, the cooling device 27b cools the IC chip 22 via the insulating member 29 and the connection terminal 21, cancels the self-heating of the IC chip 22, and tests the IC chip 22 at a low temperature as specified. can do.

  The cooling devices 27a and 27b are configured by the same cooling device as the cooling device 27 described above. When the cooling device 27a or 27b itself has an insulating property, the cooling device 27a or 27b may be brought into direct contact with the connection terminal 21. The cooling device 27a or 27b may be provided with radiating fins 29a or 29b if necessary for cooling.

<< Other Embodiments >>
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

  For example, a component to be tested by the electronic component testing apparatus according to the present invention is not limited to an IC chip, and may be other electronic components.

  In the above-described embodiment, the IC chip component testing apparatus 2 that mainly performs a low temperature test has been described. However, a room temperature test of an electronic component may be performed using the apparatus of the present invention. In that case, it can be expected that the test chamber 6 and the temperature control device mounted therein are unnecessary. Even if the test chamber 6 and the internal temperature control device are not provided, the chamber 6 and the internal temperature control device are not required if the IC chip 22 can be controlled to a predetermined normal temperature only by the cooling devices 27, 27a and / or 27b. Become.

  However, when a low temperature test of the IC chip 22 is performed, if only the IC chip 22 is maintained at a low temperature, condensation may be a problem. Therefore, the test chamber 6 is used to cover the periphery of the test stage 8, It is preferable to maintain the ambient atmosphere temperature inside the chamber 6 at a constant low temperature.

  Further, even when a high temperature test is performed on the IC chip 22, the present invention is effective from the viewpoint of controlling so that the temperature of the IC chip 22 does not rise above a predetermined temperature.

1 is a schematic overall view of an IC chip component testing apparatus according to an embodiment of the invention. It is principal part sectional drawing of an IC chip component test apparatus. It is principal part sectional drawing which shows the connection terminal vicinity of an IC chip component test apparatus. It is principal part sectional drawing which shows the connection terminal vicinity of the IC chip component test apparatus which concerns on other embodiment of invention.

Explanation of symbols

2 ... Electronic component test apparatus 4 ... Handler 6 ... Chamber 8 ... Test stage 10 ... Test head 20 ... Socket 21 ... Connection terminal 21a ... Contact part 22 ... IC chip (electronic component)
24 ... Suction head 25 ... Vacuum suction hole 26 ... Press pads 27, 27a, 27b ... Cooling device 28 ... Temperature sensor 29 ... Insulating member 30 ... IC storage portions 32A to 32G ... Tray 34 ... First XY transport device 35 ... Second XY transport Apparatus 36 ... Soak stage 38 ... Turntable 40 ... Exit stage 48 ... Contact arm

Claims (2)

A socket having a connection terminal to which an electronic component to be tested is detachably connected;
A pressing tool that sucks the electronic component and presses it toward the connection terminal;
A Peltier element for cooling the electronic component via the socket body or the connection terminal of the socket;
A temperature sensor for detecting the temperature of the electronic component;
And a control means for controlling the cooling capacity of the Peltier element in accordance with the temperature detected by the temperature sensor. The electronic component test apparatus according to claim 1,
An electronic component testing apparatus comprising: a heating board for heating a wiring board electrically connected to the connection terminal.

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