CN114296493A - Chip temperature adjusting method - Google Patents
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- CN114296493A CN114296493A CN202210238853.3A CN202210238853A CN114296493A CN 114296493 A CN114296493 A CN 114296493A CN 202210238853 A CN202210238853 A CN 202210238853A CN 114296493 A CN114296493 A CN 114296493A
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000012360 testing method Methods 0.000 claims abstract description 97
- 238000010438 heat treatment Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The application relates to the field of chip testing, and relates to a chip temperature adjusting method, which comprises the following steps: acquiring temperature data of a reference chip for multiple times by using a temperature sensor, wherein the reference chip is selected from chips to be tested in the same batch; when the temperature data of the reference chip is not in the preset temperature interval, determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test socket based on the temperature data of the reference chip and a preset temperature value; when the chip to be tested is tested, the first temperature adjusting unit is controlled to adjust the temperature of the adapter based on the first temperature compensation value, and the second temperature adjusting unit is controlled to adjust the temperature of the test seat based on the second temperature compensation value, so that the temperature of the chip to be tested is within a preset temperature interval. The invention improves the accuracy and efficiency of temperature regulation of the chip to be tested.
Description
Technical Field
The application relates to the field of chip testing, in particular to a chip temperature adjusting method.
Background
When testing a chip to be tested, the temperature of the chip to be tested needs to be adjusted to a preset testing temperature range, and then testing is performed.
In the prior art, patent No. 201610897767.8 proposes a temperature control device and a temperature control method for a test equipment adapter, the adapter has a moving arm driven by a driving source to move up and down, and a joint block is installed below the moving arm; wherein, the temperature control device of the jointer is provided with a heating plate and a temperature sensor on the joint block, and is also linked with a refrigeration chip above the heating plate, and a radiator is arranged above the refrigeration chip; when the joint block abuts against the electronic element to test, the electronic element can be heated to the test temperature by the heating sheet, and when the electronic element exceeds the test temperature, the cold end below the refrigeration chip can be used for quickly cooling the electronic element, so that the electronic element is kept in a preset test temperature range to test, and the test qualified rate of the product is further ensured. In the technical scheme, the temperature of the adapter is adjusted by utilizing the heating sheet and the refrigerating sheet, and the temperature sensor arranged on the adapter only obtains the surface temperature of the electronic element and is easily influenced by the change of the environmental temperature, so that the accuracy of the temperature adjusting method is low.
Disclosure of Invention
In view of the above, it is necessary to provide a chip temperature adjusting method.
The embodiment of the invention provides a chip temperature adjusting method, which is used for testing equipment, wherein the testing equipment comprises an adapter, a testing seat matched with the adapter, a testing bin matched with the adapter and the testing seat to form a chip for placing, a temperature sensor is arranged in the testing bin, the testing equipment also comprises a first temperature adjusting unit for adjusting the temperature of the adapter and a second temperature adjusting unit for adjusting the temperature of the testing seat, and the method comprises the following steps:
acquiring temperature data of a reference chip for multiple times by using the temperature sensor, wherein the reference chip is selected from chips to be tested in the same batch;
when the temperature data of the reference chip is not in a preset temperature interval, determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test socket based on the temperature data of the reference chip and a preset temperature value;
when a chip to be tested is tested, the first temperature adjusting unit is controlled to adjust the temperature of the adapter based on the first temperature compensation value, and the second temperature adjusting unit is controlled to adjust the temperature of the test seat based on the second temperature compensation value, so that the temperature of the chip to be tested is within a preset temperature range.
In an embodiment, the determining a first temperature compensation value for temperature adjustment of the bonder based on the temperature data of the reference chip and a preset temperature value includes:
obtaining a corresponding temperature data curve based on the temperature data of the reference chip;
obtaining an initial temperature value of the chip to be tested based on the temperature data curve;
and determining a first temperature compensation value based on the starting temperature value and a preset temperature value.
In an embodiment, the determining a first temperature compensation value based on the starting temperature value and a preset temperature value includes:
and determining the first temperature compensation value based on the difference value between the starting temperature value and a preset temperature value and a corresponding first proportional coefficient.
In an embodiment, the determining the first temperature compensation value based on the difference between the starting temperature value and a preset temperature value and a corresponding first scaling factor includes:
setting the initial temperature value as T1If the preset temperature value is P, the difference value between the initial temperature value and the preset temperature value is X, and the first scaling factor is M, then X = P-T1The first temperature compensation value a satisfies the following relation:
A=X*M。
in an embodiment, the determining a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value includes:
obtaining a corresponding temperature data curve based on the temperature data of the reference chip;
based on the temperature data curve, obtaining an average temperature value after the temperature of the chip to be tested is stable;
and determining a second temperature compensation value based on the average temperature value and a preset temperature value.
In an embodiment, the determining the second temperature compensation value based on the average temperature value and a preset temperature value includes:
and determining the second temperature compensation value based on the difference value between the average temperature value and a preset temperature value and a corresponding second proportionality coefficient.
In an embodiment, the determining the second temperature compensation value based on the difference between the average temperature value and the preset temperature value and the corresponding second scaling factor includes:
setting the average temperature value as T2If the preset temperature value is P, the difference value between the average temperature value and the preset temperature value is Y, and the second proportionality coefficient is N, Y = P-T2If the first temperature compensation value B satisfies the following relation:
B=Y*N。
in one embodiment, the temperature sensor comprises a first temperature sensor arranged on the adapter and a second temperature sensor arranged on the test seat, wherein the first temperature sensor is used for acquiring first temperature data of the reference chip for a plurality of times, and the second temperature sensor is used for acquiring second temperature data of the reference chip for a plurality of times; the determining a first temperature compensation value for temperature adjustment of the bonder and a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value includes:
the method comprises the steps of firstly determining a first temperature compensation value based on first temperature data of a reference chip and a preset temperature value, and then determining a second temperature compensation value based on second temperature data of the reference chip and the preset temperature value.
In an embodiment, the determining the first temperature compensation value based on the first temperature data of the reference chip and a preset temperature value, and then determining the second temperature compensation value based on the second temperature data of the reference chip and a preset temperature value includes:
the splicer sucks the reference chip, acquires first temperature data of the reference chip for multiple times by using the first temperature sensor, and determines a first temperature compensation value based on the temperature data of the reference chip and a preset temperature value;
and after the reference chip is placed on the test seat by the adapter, the second temperature data of the reference chip is obtained for multiple times by using the second temperature sensor, and the second temperature compensation value is determined based on the second temperature data of the reference chip and a preset temperature value.
In one embodiment, the temperature sensor comprises a first temperature sensor arranged on the adapter and a second temperature sensor arranged on the test seat, wherein the first temperature sensor is used for acquiring first temperature data of the reference chip for a plurality of times, and the second temperature sensor is used for acquiring second temperature data of the reference chip for a plurality of times; the determining a first temperature compensation value for temperature adjustment of the bonder and a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value includes:
and determining the first temperature compensation value based on the first temperature data of the reference chip and a preset temperature value, and determining the second temperature compensation value based on the second temperature data of the reference chip and a preset temperature value.
In one embodiment, the temperature sensor includes a first temperature sensor disposed at the bonder and a second temperature sensor disposed at the test socket, the first temperature sensor is configured to acquire first temperature data of the reference chip a plurality of times, the second temperature sensor is configured to acquire second temperature data of the reference chip a plurality of times, and the determining a first temperature compensation value for temperature adjustment of the bonder and a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value includes:
the second temperature compensation value is determined based on the second temperature data of the reference chip and a preset temperature value, and then the first temperature compensation value is determined based on the first temperature data of the reference chip and the preset temperature value.
Compared with the prior art, when the chip to be tested is tested, the temperature of the adapter is adjusted based on the first temperature compensation value by controlling the first temperature adjusting unit, the temperature of the test seat is adjusted based on the second temperature compensation value by controlling the second temperature adjusting unit, the temperature of the adapter and the test seat is adjusted, the temperature of the environment where the chip to be tested is located is adjusted by the test seat in addition to the temperature of the chip to be tested by the adapter, and therefore the accuracy of temperature adjustment of the chip to be tested is improved.
The reference chip is selected from the chips to be tested in the same batch, and because the temperatures of the chips to be tested in the same batch are basically the same, a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test socket are determined based on the temperature data of the reference chip and a preset temperature value, and the first temperature compensation value and the second temperature compensation value are used as the temperature adjustment compensation value of the chips to be tested, so that the temperature adjustment compensation value of the chips to be tested does not need to be obtained again in each test, the temperature adjustment efficiency of the chips to be tested is improved, and the test efficiency of the chips to be tested is also improved.
Drawings
FIG. 1 is a schematic diagram of the structure of a test apparatus in one embodiment;
FIG. 2 is a flow chart illustrating a method for adjusting chip temperature according to an embodiment;
FIG. 3 is a flow diagram illustrating a process for determining a first temperature compensation value according to one embodiment;
FIG. 4 is a graph illustrating initial temperature values in a temperature data curve according to an embodiment;
FIG. 5 is a flow diagram illustrating a process for determining a second temperature compensation value according to one embodiment;
FIG. 6 is a graph illustrating a stabilized average temperature value in a temperature data curve according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
The method provided by the embodiment of the application can be executed in the test equipment. FIG. 1 is a schematic structural diagram of a test apparatus in an embodiment of the present invention. As shown in fig. 1, the testing apparatus includes an adapter 101, a testing socket 102 disposed in cooperation with the adapter, a testing chamber 103 configured by the adapter and the testing socket to accommodate a chip, a temperature sensor (not shown) disposed in the testing chamber, a first temperature adjusting unit 104 for adjusting the temperature of the adapter, and a second temperature adjusting unit 105 for adjusting the temperature of the testing socket.
In one embodiment, the first temperature adjusting unit includes a heating rod provided at the adaptor and a low temperature flow passage for inputting a low temperature gas, and the second temperature adjusting unit includes a high temperature flow passage for inputting a high temperature or low temperature gas. The first temperature adjustment means and the second temperature adjustment means may adopt other temperature adjustment methods, and the present embodiment is not limited thereto.
In an embodiment, as shown in fig. 2, a chip temperature adjusting method is provided, which is described by taking the method as an example for being applied to the testing apparatus in fig. 1, and includes the following steps:
s201: and acquiring temperature data of the reference chip by using the temperature sensor for multiple times.
The reference chips are selected from chips to be tested in the same batch, and the temperatures of the chips to be tested in the same batch are basically the same.
S202: when the temperature data of the reference chip is not in the preset temperature interval, determining a first temperature compensation value for temperature adjustment of the adapter and a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and the preset temperature value.
When testing a chip to be tested, the temperature of the chip to be tested needs to be adjusted to a preset temperature interval. In this embodiment, a reference chip is used as a reference, and if the temperature of the reference chip is within a preset temperature range, the temperature of the chip to be tested is not adjusted; if the temperature of the reference chip is not within the preset temperature interval, a first temperature compensation value for adjusting the temperature of the bonder and a second temperature compensation value for adjusting the temperature of the test socket need to be determined, and the temperature of the reference chip can be adjusted within the preset temperature interval through the first temperature compensation value and the second temperature compensation value. It should be noted that the preset temperature interval may be set according to actual requirements.
S203: when the chip to be tested is tested, the first temperature adjusting unit is controlled to adjust the temperature of the adapter based on the first temperature compensation value, and the second temperature adjusting unit is controlled to adjust the temperature of the test seat based on the second temperature compensation value, so that the temperature of the chip to be tested is within a preset temperature interval.
The prior art only adjusts the temperature of the chip under test through the bonder. In this embodiment, when testing the chip that awaits measuring, control first temperature regulating unit and adjust the temperature of adapter and control second temperature regulating unit and adjust the temperature of test seat based on second temperature compensation value based on the temperature of first temperature compensation value, through carrying out temperature regulation to adapter and test seat two sides, outside the temperature regulation of utilizing the adapter to the chip that awaits measuring, still utilize the test seat to adjust the ambient temperature that awaits measuring chip place, ambient temperature more is close the actual temperature of the chip that awaits measuring, compare and only carry out temperature regulation through the adapter among the prior art, the rate of accuracy of the temperature regulation of the chip that awaits measuring is higher.
It should be further noted that, in the prior art, in each testing process, a temperature compensation value of the chip to be tested needs to be obtained, and then temperature adjustment is performed, so that the efficiency of temperature adjustment on the chip to be tested is low. In this embodiment, a reference chip is selected from the chips to be tested in the same batch, and since the temperatures of the chips to be tested in the same batch are substantially the same, a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test socket are determined based on the temperature data of the reference chip and a preset temperature value, and the first temperature compensation value and the second temperature compensation value are used as temperature adjustment compensation values of the chips to be tested, so that the temperature adjustment compensation values of the chips to be tested do not need to be obtained again in each test, thereby improving the temperature adjustment efficiency of the chips to be tested, and improving the test efficiency of the chips to be tested.
In one embodiment, as shown in fig. 3, determining a first temperature compensation value for temperature adjustment of the bonder based on the temperature data of the reference chip and a preset temperature value includes the following steps:
s301: based on the temperature data of the reference chip, a corresponding temperature data curve is obtained.
The acquired temperature data is discrete data and cannot be directly analyzed, so that the temperature data is subjected to smoothing algorithm processing to have curve characteristics, and a temperature data curve is obtained.
S302: and obtaining the initial temperature value of the chip to be tested based on the temperature data curve.
S303: and determining a first temperature compensation value based on the initial temperature value and a preset temperature value.
And determining a first temperature compensation value based on the difference value between the initial temperature value and the preset temperature value and the corresponding first proportional coefficient. Wherein the first scaling factor is set according to actual adjustment requirements.
Specifically, as shown in fig. 4, the initial temperature value is T1The preset temperature value is P, the difference value between the initial temperature value and the preset temperature value is X, and the first proportion systemNumber M, then X = P-T1The first temperature compensation value a satisfies the following relation:
A=X*M。
and multiplying the difference value of the initial temperature value and the preset temperature value by a first proportional coefficient to determine a first temperature compensation value, and adjusting the temperature of the adapter by using the first temperature compensation value.
In one embodiment, as shown in fig. 5, determining the second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and the preset temperature value includes the following steps:
s401: obtaining a corresponding temperature data curve based on the temperature data of the reference chip;
the acquired temperature data is discrete data and cannot be directly analyzed, so that the temperature data is subjected to smoothing algorithm processing to have curve characteristics, and a temperature data curve is obtained.
S402: based on the temperature data curve, obtaining an average temperature value after the temperature of the chip to be tested is stable;
s403: and determining a second temperature compensation value based on the average temperature value and a preset temperature value.
And determining a second temperature compensation value based on the difference value between the average temperature value and the preset temperature value and the corresponding second proportionality coefficient. And the second proportionality coefficient is set according to the actual regulation requirement, and the sum of the second proportionality coefficient and the first proportionality coefficient is 1.
Specifically, as shown in fig. 6, the average temperature value after the temperature of the chip to be tested is stable is set as T2If the preset temperature value is P, the difference value between the average temperature value and the preset temperature value is Y, and the second proportionality coefficient is N, Y = P-T2Then, the first temperature compensation value B satisfies the following relation:
B=Y*N。
and multiplying the difference value of the average temperature value and the preset temperature value by a second proportionality coefficient to determine a second temperature compensation value, and adjusting the temperature of the test seat by using the second temperature compensation value.
In one embodiment, the temperature sensor includes a first temperature sensor disposed at the bonder for acquiring a first temperature data of the reference chip a plurality of times and a second temperature sensor disposed at the test socket for acquiring a second temperature data of the reference chip a plurality of times. The method for determining the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test socket based on the temperature data of the reference chip and the preset temperature value comprises the following steps: the method comprises the steps of determining a first temperature compensation value based on first temperature data of a reference chip and a preset temperature value, and then determining a second temperature compensation value based on second temperature data of the reference chip and the preset temperature value.
Specifically, the splicer absorbs the reference chip, a first temperature sensor is used for obtaining first temperature data of the reference chip for multiple times in the absorption process, a first temperature compensation value is determined based on the temperature data of the reference chip and a preset temperature value, and the temperature of the splicer is adjusted by the first temperature compensation value. The method for determining the first temperature compensation value has been described in the above embodiments, and is not described herein again. After the reference chip is placed on the test seat by the adapter, the second temperature data of the reference chip is obtained for multiple times by using the second temperature sensor, a second temperature compensation value is determined based on the second temperature data of the reference chip and a preset temperature value, and the temperature of the test seat is adjusted by using the second temperature compensation value. The method for determining the second temperature compensation value has been described in the above embodiments, and is not described herein again.
In the above embodiment, the bonder adjusts the temperature of the bonder by using the first temperature compensation value in the process of absorbing the reference chip, and adjusts the temperature of the test socket by using the second temperature compensation value after the chip is placed in the test bin. Secondly, utilize first temperature compensation value to carry out preliminary adjustment to the temperature of adapter earlier, utilize the second temperature compensation value to carry out fine adjustment to the temperature of test seat again to temperature regulation is more accurate.
In one embodiment, the temperature sensor includes a first temperature sensor disposed at the bonder for acquiring a first temperature data of the reference chip a plurality of times and a second temperature sensor disposed at the test socket for acquiring a second temperature data of the reference chip a plurality of times. The method for determining the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test socket based on the temperature data of the reference chip and the preset temperature value comprises the following steps: and determining a first temperature compensation value based on the first temperature data of the reference chip and a preset temperature value, and determining a second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value.
In the above embodiment, the adapter is configured to obtain the first temperature data after placing the reference chip in the test socket, and the test socket obtains the second temperature data at the same time. The temperature of the adapter and the temperature of the test socket are respectively adjusted by utilizing the first temperature compensation value and the second temperature compensation value, so that the adjusting time is short.
In one embodiment, the temperature sensor includes a first temperature sensor disposed at the bonder for acquiring a first temperature data of the reference chip a plurality of times and a second temperature sensor disposed at the test socket for acquiring a second temperature data of the reference chip a plurality of times. The method for determining the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test socket based on the temperature data of the reference chip and the preset temperature value comprises the following steps: the second temperature compensation value is determined based on the second temperature data of the reference chip and a preset temperature value, and then the first temperature compensation value is determined based on the first temperature data of the reference chip and the preset temperature value.
In the above embodiment, the reference chip is placed in the test chamber by the robot arm, the test socket obtains the second temperature data to determine the second temperature compensation value, the temperature of the test socket is adjusted by using the second temperature compensation value, then the bonder is pressed down to obtain the first temperature data to determine the first temperature compensation value, and the temperature of the bonder is adjusted by using the first temperature compensation value. Since the temperature of the bonder is not adjusted in the process of placing the reference chip, the adjustment efficiency is low in comparison, but the temperature of the reference chip can still be accurately adjusted.
It should be understood that, although the steps in the above-described flowcharts are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a part of the steps of the above-mentioned flowcharts may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of performing the steps or the stages is not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a part of the steps or the stages in other steps.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A chip temperature adjusting method is used for testing equipment, the testing equipment comprises an adapter, a testing seat matched with the adapter, a testing bin used for placing a chip and formed by matching the adapter and the testing seat, a temperature sensor is arranged in the testing bin, the chip temperature adjusting method further comprises a first temperature adjusting unit used for adjusting the temperature of the adapter and a second temperature adjusting unit used for adjusting the temperature of the testing seat, and the chip temperature adjusting method is characterized by comprising the following steps:
acquiring temperature data of a reference chip for multiple times by using the temperature sensor, wherein the reference chip is selected from chips to be tested in the same batch;
when the temperature data of the reference chip is not in a preset temperature interval, determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test socket based on the temperature data of the reference chip and a preset temperature value;
when a chip to be tested is tested, the first temperature adjusting unit is controlled to adjust the temperature of the adapter based on the first temperature compensation value, and the second temperature adjusting unit is controlled to adjust the temperature of the test seat based on the second temperature compensation value, so that the temperature of the chip to be tested is within a preset temperature range.
2. The method of claim 1, wherein determining a first temperature compensation value for temperature adjustment of the bonder based on the temperature data of the reference chip and a preset temperature value comprises:
obtaining a corresponding temperature data curve based on the temperature data of the reference chip;
obtaining an initial temperature value of the chip to be tested based on the temperature data curve;
and determining a first temperature compensation value based on the starting temperature value and a preset temperature value.
3. The method of claim 2, wherein determining a first temperature compensation value based on the starting temperature value and a preset temperature value comprises:
and determining the first temperature compensation value based on the difference value between the starting temperature value and a preset temperature value and a corresponding first proportional coefficient.
4. The method of claim 3, wherein determining the first temperature compensation value based on the difference between the starting temperature value and a preset temperature value and a corresponding first scaling factor comprises:
setting the initial temperature value as T1If the preset temperature value is P, the difference value between the initial temperature value and the preset temperature value is X, and the first scaling factor is M, then X = P-T1The first temperature compensation value a satisfies the following relation:
A=X*M。
5. the method of claim 1, wherein determining a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value comprises:
obtaining a corresponding temperature data curve based on the temperature data of the reference chip;
based on the temperature data curve, obtaining an average temperature value after the temperature of the chip to be tested is stable;
and determining a second temperature compensation value based on the average temperature value and a preset temperature value.
6. The method of claim 5, wherein determining a second temperature compensation value based on the average temperature value and a preset temperature value comprises:
and determining the second temperature compensation value based on the difference value between the average temperature value and a preset temperature value and a corresponding second proportionality coefficient.
7. The method of claim 6, wherein determining the second temperature compensation value based on the difference between the average temperature value and a preset temperature value and a corresponding second scaling factor comprises:
setting the average temperature valueIs T2If the preset temperature value is P, the difference value between the average temperature value and the preset temperature value is Y, and the second proportionality coefficient is N, Y = P-T2If the first temperature compensation value B satisfies the following relation:
B=Y*N。
8. the method of any of claims 1-7, wherein the temperature sensors include a first temperature sensor disposed at the adapter for obtaining a plurality of times first temperature data of the reference chip and a second temperature sensor disposed at the test socket for obtaining a plurality of times second temperature data of the reference chip; the determining a first temperature compensation value for temperature adjustment of the bonder and a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value includes:
the method comprises the steps of firstly determining a first temperature compensation value based on first temperature data of a reference chip and a preset temperature value, and then determining a second temperature compensation value based on second temperature data of the reference chip and the preset temperature value.
9. The method of claim 8, wherein determining the first temperature compensation value based on the first temperature data of the reference chip and a predetermined temperature value, and determining the second temperature compensation value based on the second temperature data of the reference chip and a predetermined temperature value comprises:
the splicer sucks the reference chip, acquires first temperature data of the reference chip for multiple times by using the first temperature sensor, and determines a first temperature compensation value based on the temperature data of the reference chip and a preset temperature value;
and after the reference chip is placed on the test seat by the adapter, the second temperature data of the reference chip is obtained for multiple times by using the second temperature sensor, and the second temperature compensation value is determined based on the second temperature data of the reference chip and a preset temperature value.
10. The method of any of claims 1-7, wherein the temperature sensors include a first temperature sensor disposed at the adapter for obtaining a plurality of times first temperature data of the reference chip and a second temperature sensor disposed at the test socket for obtaining a plurality of times second temperature data of the reference chip; the determining a first temperature compensation value for temperature adjustment of the bonder and a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value includes:
and determining the first temperature compensation value based on the first temperature data of the reference chip and a preset temperature value, and determining the second temperature compensation value based on the second temperature data of the reference chip and a preset temperature value.
11. The method of any one of claims 1-7, wherein the temperature sensors include a first temperature sensor disposed at the bonder and a second temperature sensor disposed at the test socket, the first temperature sensor being configured to obtain first temperature data of the reference chip a plurality of times, the second temperature sensor being configured to obtain second temperature data of the reference chip a plurality of times, and wherein determining a first temperature compensation value for temperature adjustment of the bonder and a second temperature compensation value for temperature adjustment of the test socket based on the temperature data of the reference chip and a preset temperature value comprises:
the second temperature compensation value is determined based on the second temperature data of the reference chip and a preset temperature value, and then the first temperature compensation value is determined based on the first temperature data of the reference chip and the preset temperature value.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210238853.3A CN114296493B (en) | 2022-03-11 | 2022-03-11 | Chip temperature adjusting method |
| KR1020237035830A KR20230156429A (en) | 2022-03-11 | 2022-07-29 | How to control chip temperature |
| PCT/CN2022/108887 WO2023168893A1 (en) | 2022-03-11 | 2022-07-29 | Chip temperature regulating method |
| JP2023564565A JP2024516166A (en) | 2022-03-11 | 2022-07-29 | Chip temperature adjustment method |
| TW111136941A TW202336445A (en) | 2022-03-11 | 2022-09-29 | Method for adjusting temperature of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210238853.3A CN114296493B (en) | 2022-03-11 | 2022-03-11 | Chip temperature adjusting method |
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| CN114296493A true CN114296493A (en) | 2022-04-08 |
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| JP (1) | JP2024516166A (en) |
| KR (1) | KR20230156429A (en) |
| CN (1) | CN114296493B (en) |
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| WO (1) | WO2023168893A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023168893A1 (en) * | 2022-03-11 | 2023-09-14 | 杭州长川科技股份有限公司 | Chip temperature regulating method |
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- 2022-07-29 JP JP2023564565A patent/JP2024516166A/en active Pending
- 2022-07-29 WO PCT/CN2022/108887 patent/WO2023168893A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2023168893A1 (en) | 2023-09-14 |
| TW202336445A (en) | 2023-09-16 |
| KR20230156429A (en) | 2023-11-14 |
| JP2024516166A (en) | 2024-04-12 |
| CN114296493B (en) | 2022-08-09 |
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