JP2006162545A - Device handler unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device handler unit capable of controlling a device at a proper high temperature by measuring directly a temperature of the device to inspect precisely the device, in the device handler unit for bringing the device such as an IC into the high temperature to inspect an electric characteristic therein. <P>SOLUTION: This device handler unit is provided with a heater means for generating hot air in a chamber, a contact head for storing a suction pad for sucking the device and for guiding it along a vertical direction, an inspection means for inspecting the electric characteristic of the device at the high temperature, by moving the contact head and by mounting the device sucked with the suction pad on a device socket, and a heater control means for controlling the heater means, based on the temperature of the device mounted on the device socket. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a device handler apparatus, and more particularly to an IC handler used in an electrical property test process of semiconductor manufacturing, and relates to a device handler apparatus that measures the surface temperature of an IC (device) during a high temperature test and performs temperature control.

  A device handler apparatus for inspecting the electrical characteristics of a device composed of an IC such as QFP, BGA, and CSP in the prior art at a high temperature has a heater air blow 12 for blowing hot air into the chamber 11 as shown in FIG. The contact head 15 that accommodates the suction pad 14 that sucks the device 13 in a substantially central position and guides it in the vertical direction, and the contact head 15 is moved downward, and the device 13 that is sucked by the suction pad 14 is By placing the device on the device socket 16, a tester 17 for inspecting the electrical characteristics of the device 13 due to high temperature, a chamber temperature sensor 18 provided in the vicinity of the device socket 16, and the temperature from the chamber temperature sensor 18. Temperature controller 19 that controls heater air blow 12 based on It is largely constituted.

In the device handler apparatus having such a configuration, the device 13 which is an IC sucked by the contact head 15 is installed in a device socket 16 installed on a test board (not shown). Characteristic testing is performed. Thereafter, the device 13 is removed from the device socket 16 by the contact head 15. The removed device 13 is classified (non-defective product / defective product) according to the test result by a handler (not shown). By repeating this cycle, characteristic tests of ICs as devices are sequentially performed.
At this time, when the test is performed in a high temperature environment (when the test is performed at a high temperature, an IC in the vicinity of the characteristic failure can be screened), the high temperature environment is provided by the device handler device. .
The generation of the high temperature environment in the device handler apparatus circulates the air heated by the heater air blow 12 in the chamber 11 so that the temperature in the chamber 11 is increased. In the temperature control, a temperature controller 19 performs PID control from a chamber temperature sensor 18 installed in the chamber 11. Since the measurement temperature of the IC, which is a device, and the ambient temperature in the chamber 11 do not always coincide with each other, they are usually used with a temperature configuration in advance.

FIG. 4 shows an apparatus for measuring a plurality of devices at the same time. The specific configuration of the device handler apparatus shown in FIG. 3 includes two device sockets, and the heater box. It is the structure which blows out high temperature warm air from 12A.
In the apparatus having such a configuration, first, two unmeasured devices are received at the positions 1 and 2, and then the two devices are attracted by the contact heads at the positions 3 and 4, and each is connected to a device socket. And measure each device. Next, after the measurement is completed, the non-defective product and the defective product are sorted according to the measurement result at the positions 5 and 6, and then unloaded, and then the empty contact head at the positions 7 and 8 moves the next unmeasured device. Going to the positions 1 and 2 in order is carried out sequentially in preparation for acceptance.
Here, the method of measuring two devices at the same time has been described, but the number of measurements is not limited to two, and a plurality of devices are measured simultaneously by preparing device sockets or the like according to the number. be able to.

Japanese Unexamined Patent Publication No. 2004-177201 (pages 4 to 5 and FIG. 1)

  However, since the conventional method described in the prior art does not have a means for directly measuring the temperature of a device such as an IC, the actual temperature of the device under test is not known and calibration data is used. There is only. Temperature control is performed by changing the temperature of the circulating hot air using PID control using a temperature sensor installed in the chamber, so there is a problem that the control response speed is slow, and devices such as multiple ICs are measured simultaneously. In this case, since the direction of the high-temperature hot air is always directed from one direction, there is a problem that temperature variations of a plurality of devices to be measured occur.

  Therefore, a device handler that has a mechanism to increase and decrease the temperature in a characteristic test with high temperature applied to a device such as an IC, measures the temperature of the device being measured, and performs control to achieve a constant temperature. Has a problem that must be done.

  In order to solve the above problems, the device handler device of the present invention has the following configuration.

(1) The device handler device includes a heater unit that generates hot air in the chamber, a contact head that accommodates a suction pad that sucks the device and guides it in a vertical direction, and moves the contact head so that it is sucked by the suction pad. By placing the device being mounted on the device socket, the heater is controlled based on the temperature of the device placed on the device socket, and inspection means for inspecting the electrical characteristics of the device due to high temperature Heater control means.
(2) The device handler apparatus according to (1), characterized in that air blowing means for lowering the temperature of the device is provided in the vicinity of the device placed in the device socket.
(3) The device handler apparatus according to (2), wherein the air blowing means operates based on a temperature of a device placed on the device socket.
(4) The device handler apparatus according to (1) or (2), characterized in that warm air blowing means for increasing the temperature of the device is provided at a position in the vicinity of the device placed in the device socket.
(5) The device handler apparatus according to (4), wherein the hot air blowing means operates based on a temperature of a device placed on the device socket.

According to this proposal, when inspecting the electrical characteristics of a device at a high temperature, the temperature of the device mounted in the device socket can be directly measured, and the hot air is controlled based on this temperature. Thus, variation with respect to the target temperature elapsed time can be kept to a minimum.
In the case of an apparatus that measures a plurality of devices at the same time, the temperature variation can be made uniform by measuring the temperature of each device and controlling the hot air.

  Next, an embodiment of a device handler device according to the present invention will be described below with reference to the drawings. In addition, the same code | symbol is attached | subjected and demonstrated to the same thing as what was demonstrated by the prior art.

As shown in FIG. 1, the device handler apparatus of the first embodiment of the present invention has a heater air blow 12 constituting heater means for blowing hot air into a chamber 11 and a suction pad 14 for adsorbing a device 13 at a substantially central position. The contact head 15 accommodated in the position and guided in the vertical direction, the contact head 15 is moved downward, and the device 13 sucked by the suction pad 14 is placed on the device socket 16, so that the device 13 A tester 17 for inspecting electrical characteristics due to high temperature, a chamber temperature sensor 18 provided near the device socket 16, and a temperature controller 19 for controlling the heater air blow 12 based on the temperature from the chamber temperature sensor 18. And the temperature of the device 13 placed in the device socket 16 is measured. Detected by the device temperature sensor 20, the air blowing nozzle 21 constituting the air blowing means for blowing the air to the device 13 placed on the device socket 16 to lower the temperature of the device 13, and the chamber measurement sensor 18. The temperature controller 19 is generally controlled based on the temperature, and the controller 22 is configured to control air generated from the air blowing nozzle 21 based on the temperature detected by the device temperature sensor 20.
The device temperature temperature sensor 20 has a structure that is embedded in the vicinity of the surface of the device 13 that contacts the device 13 of the contact head 15.

  In the device handler apparatus having such a configuration, as in the apparatus described in the prior art, the device 13 which is an IC sucked by the contact head 15 is installed in the device socket 16 installed on a test board (not shown). Then, an electrical characteristic test of the device 13 is performed by the tester 17. Thereafter, the device 13 is removed from the device socket 16 by the contact head 15. The removed device 13 is classified (non-defective product / defective product) according to the test result by a handler (not shown). By repeating this cycle, characteristic tests of ICs as devices are sequentially performed.

Now, when performing this characteristic test, the device temperature sensor 20 directly measures the temperature of the device 13 mounted on the device socket 16 to determine whether the temperature of the device 13 is an appropriate temperature. Judgment can be made. If the temperature measured by the contact head 15 is equal to or higher than a preset temperature or is equal to or higher than a preset temperature, the control unit 22 drives the air blowing nozzle 21 installed near the device 13. Then, the temperature of the device 13 is lowered by blowing air toward the device 13 placed on the device socket 16.
When the temperature of the device 13 reaches a preset temperature, the air blowing nozzle 21 is stopped and heat is supplied to the device 13 at a high temperature by hot air from the heater air blow 12 provided by the chamber 11. .
The temperature setting conditions regarding the start / stop of the air blowing from the air blowing nozzle 21 can be individually set according to the type of the device 13, and the work is selected from the product conditions registered in advance before starting the test. Optimal temperature control can be performed regardless of the type.

  Next, a device handler apparatus according to a second embodiment of the present invention will be described below with reference to FIG.

The device handler apparatus of the second embodiment has a configuration in which, in addition to the device handler apparatus of the first embodiment, hot air blowing means for raising the temperature of the device is provided in the vicinity of the device mounted on the device socket. As shown in FIG. 2, the heater air blow 12 constituting the heater means for blowing hot air into the chamber 11 and the suction pad 14 for adsorbing the device 13 are accommodated in a substantially central position, and the vertical direction The contact head 15 for guiding the device 13 and the contact head 15 are moved downward, and the device 13 sucked by the suction pad 14 is placed on the device socket 16 to inspect the electrical characteristics of the device 13 due to high temperature. And a chamber temperature sensor 18 provided in the vicinity of the device socket 16. The temperature controller 19 that controls the heater air blow 12 based on the temperature from the chamber temperature sensor 18, the device temperature sensor 20 that measures the temperature of the device 13 mounted on the device socket 16, and the device socket 16 Air is blown against the device 13 placed on the device 13 mounted on the air blowing nozzle 21 that constitutes an air blowing means that blows air against the device 13 that is placed to lower the temperature of the device 13. The temperature controller 19 is controlled based on the temperature detected by the chamber temperature sensor 18 and the temperature detected by the device temperature sensor 20 based on the temperature detected by the chamber temperature sensor 20 and the temperature of the hot air spray nozzle 23 that constitutes the temperature of the device 13. Generated from the air blowing nozzle 21 A control unit 22 for controlling the hot air generated from the hot air blowing nozzle 23 as well as control, are largely constituted by.
The device temperature temperature sensor 20 has a structure that is embedded in the vicinity of the surface of the device 13 that contacts the device 13 of the contact head 15.

  In the device handler apparatus having such a configuration, as in the apparatus described in the prior art, the device 13 which is an IC sucked by the contact head 15 is installed in the device socket 16 installed on a test board (not shown). Then, an electrical characteristic test of the device 13 is performed by the tester 17. Thereafter, the device 13 is removed from the device socket 16 by the contact head 15. The removed device 13 is classified (non-defective product / defective product) according to the test result by a handler (not shown). By repeating this cycle, the characteristic test of the IC which is the device 13 is sequentially performed.

Now, when performing this characteristic test, the device temperature sensor 20 directly measures the temperature of the device 13 mounted on the device socket 16 to determine whether the temperature of the device 13 is an appropriate temperature. to decide. If the temperature measured by the contact head 15 is equal to or higher than a preset temperature, or is equal to or higher than a preset temperature, the air blowing nozzle 21 installed in the vicinity of the device 13 by the control unit 22. And the temperature of the device 13 is lowered by blowing air toward the device 13 placed on the device socket 16. When the temperature of the device 13 falls below a certain level, the air blowing nozzle 21 is stopped, and heat is supplied to the device 13 at a high temperature by hot air from the heater air blow 12 provided by the chamber 11.
The temperature setting conditions regarding the start / stop of the air blowing from the air blowing nozzle 21 can be individually set according to the type of the device 13, and the work is selected from the product conditions registered in advance before starting the test. Optimal temperature control can be performed regardless of the type.

  Further, when the characteristic test is performed, when the temperature of the device 13 mounted on the device socket 16 is directly measured by the device temperature sensor 20 by the device temperature sensor 20, the temperature is determined from a preset temperature. If the temperature is lower or lower than the preset temperature, the hot air blowing nozzle 23 is driven, and the hot air is blown directly on the device 13 to increase the temperature of the device 13 and set in advance. When the temperature reaches the specified temperature, the controller 22 controls the hot air from the hot air blowing nozzle 23 to stop.

  The temperature setting condition regarding the start / stop of the hot air from the hot air blowing nozzle 23 is the same as the air blowing control from the air blowing nozzle 21. Individual settings can be made for each type of device 13, and work can be selected from the product conditions registered in advance before the start of the test, and optimum temperature control can be performed regardless of the type of device 13.

  In this way, when the temperature of the device 13 for maintaining the temperature of the device 13 at a preset temperature is high, the air blowing nozzle 21 is driven to lower the temperature of the device 13, and the temperature of the device 13 is increased. When the temperature is lower than a preset temperature, the temperature of the device 13 is always maintained near the preset temperature by controlling the temperature of the device 13 to be increased by driving the hot air blowing nozzle 23. Therefore, the device 13 can be measured at a high temperature while minimizing temperature variation.

  For a device to be inspected at a high temperature, directly measure the temperature of the device and determine whether the measured temperature is higher or lower than the preset temperature. Provided is a device handler device that can be sprayed to lower the temperature, and if it is low, warm air is blown directly to raise the temperature to always inspect the electrical characteristics with little temperature variation.

It is explanatory drawing which showed schematically the device handler apparatus of 1st Example of this invention. It is explanatory drawing which showed schematically the device handler apparatus of 2nd Example of this invention. It is explanatory drawing which showed schematically the device handler apparatus in a prior art. It is explanatory drawing which showed schematically the device handler apparatus for measuring a several device simultaneously.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Chamber 12 Heater air blow 13 Device 14 Adsorption pad 15 Contact head 16 Device socket 17 Tester 18 Chamber temperature sensor 19 Temperature controller 20 Device temperature sensor 21 Air blowing nozzle 22 Control part 23 Hot air blowing nozzle

Claims (5)

Heater means for generating hot air in the chamber;
A contact head that houses a suction pad that sucks the device and guides it in the vertical direction;
Inspecting means for inspecting the electrical characteristics of the device due to high temperature by moving the contact head and placing the device adsorbed by the adsorption pad on a device socket;
Heater control means for controlling the heater means based on the temperature of the device placed in the device socket;
A device handler device comprising:   2. The device handler apparatus according to claim 1, wherein air blowing means for lowering the temperature of the device is provided at a position near the device placed on the device socket.   The device handler according to claim 2, wherein the air blowing means operates based on a temperature of a device placed on the device socket.   The device handler apparatus according to claim 1, wherein warm air blowing means for increasing a temperature of the device is provided in a vicinity of the device placed on the device socket. The device handler apparatus according to claim 4, wherein the hot air blowing unit operates based on a temperature of a device mounted on the device socket.

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