CN107643777A - Environment temperature method of adjustment and device for circuit board experiment - Google Patents
Environment temperature method of adjustment and device for circuit board experiment Download PDFInfo
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- CN107643777A CN107643777A CN201610574043.XA CN201610574043A CN107643777A CN 107643777 A CN107643777 A CN 107643777A CN 201610574043 A CN201610574043 A CN 201610574043A CN 107643777 A CN107643777 A CN 107643777A
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Abstract
The present invention, which provides a kind of the environment temperature method of adjustment for circuit board experiment and device, wherein method, to be included：Temp probe is set on circuit boards；Circuit board is put into the shielded box of size adjustable, and shielded box is put into high-low temperature chamber；The temperature of high-low temperature chamber is adjusted to preset temperature；The measured value of monitoring temperature probe, to obtain Current Temperatures；By preset temperature compared with Current Temperatures, and the temperature of high-low temperature chamber is adjusted according to comparative result.The above method is small due to the size of the shielded box incubator that compares so as to see who is superior, interior temperature distribution difference is small, environment temperature precision can be improved, strengthen the reliability of circuit board environmental temperature experiment, and the temperature of circuit board can be monitored by temp probe, so as to adjust the temperature of shielded box by adjusting the temperature of high-low temperature chamber, the purpose of adjusting circuit board test ambient temperature is reached with this.
Description
Technical field
The present invention relates to field of circuit boards, more particularly to a kind of environment temperature method of adjustment and dress for circuit board experiment
Put.
Background technology
Electric vehicle motor controller product is before batch volume production, it is necessary to be carried out to electric machine controller circuit plate accurately high
Temperature experiment, at present, electric vehicle motor controller carries out thermocycling using high-low temperature test chamber, and this experiment is typically automobile
Industry has strictly for one of essential experiment of electronic product to the nominal environmental temperatures of electric machine controller circuit plate
Test requirements document.Because the volume of circuit board is relative to the small volume of high-low temperature chamber, the temperature acquisition probe cloth of high-low temperature chamber
Put in high-low temperature chamber corner, the temperature that huge high-low temperature chamber is presented is due to factors such as convection current, circuit board heatings, therefore it is carried
The temperature and the environment temperature of circuit board that temp probe is shown have certain deviation, therefore can influence the result of the test of humid test.
The content of the invention
The present invention provides a kind of environment temperature method of adjustment and device for circuit board experiment, to solve prior art
In when testing circuit board environment temperature there is deviation and cause the inaccurate technical problem of result of the test.
One aspect of the present invention provides a kind of environment temperature method of adjustment for circuit board experiment, including：
Temp probe is set on circuit boards；
Circuit board is put into the shielded box of size adjustable, and shielded box is put into high-low temperature chamber；
The temperature of high-low temperature chamber is adjusted to preset temperature；
The measured value of monitoring temperature probe, to obtain Current Temperatures；
By preset temperature compared with Current Temperatures, and the temperature of high-low temperature chamber is adjusted according to comparative result.
Further, circuit board is put into shielded box, and also included before shielded box is put into high-low temperature chamber,
Temp probe is set in shielded box.
Further, temp probe is set on circuit boards, specifically included：
It is uniformly arranged 2 to 4 temp probes on circuit boards, and with high temperature immobilization with adhesive tape.
Further, the measured value of monitoring temperature probe, to obtain Current Temperatures, is specifically included：
When temp probe has it is multiple when, average computation is weighted to the measured value of each temp probe, it is current to obtain
Temperature.
Further, by preset temperature compared with Current Temperatures, and the temperature according to comparative result to high-low temperature chamber
It is adjusted, specifically includes：
By preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, high-low temperature chamber is turned down
Temperature；
If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened.
Another aspect of the present invention provides a kind of environmental temperature adjusting device for circuit board experiment, including：
First temp probe setup module, for setting temp probe on circuit boards；
Circuit board placement module, high/low temperature is put into for circuit board to be put into the shielded box of size adjustable, and by shielded box
Case；
First temperature adjusting module, for the temperature of high-low temperature chamber to be adjusted into preset temperature；
Current Temperatures acquisition module, for the measured value of monitoring temperature probe, to obtain Current Temperatures；
Second temperature adjusting module, for by preset temperature compared with Current Temperatures, and according to comparative result to height
The temperature of cryogenic box is adjusted.
Further, said apparatus also includes,
Second temperature probe setup module, for setting temp probe in shielded box.
Further, the first temp probe setup module is specifically used for：
It is uniformly arranged 2 to 4 temp probes on circuit boards, and with high temperature immobilization with adhesive tape.
Further, Current Temperatures acquisition module is specifically used for：
When temp probe has it is multiple when, average computation is weighted to the measured value of each temp probe, it is current to obtain
Temperature.
Further, second temperature adjusting module is specifically used for：
By preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, high-low temperature chamber is turned down
Temperature；If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened.
Provided by the present invention for the environment temperature method of adjustment and device of circuit board experiment, by setting on circuit boards
Temp probe, and circuit board is placed on shielded box and then is put into high-low temperature chamber, because the size of shielded box compares so as to see who is superior incubator
Small, interior temperature distribution difference is small, it is possible to increase environment temperature precision, strengthen the reliability of circuit board environmental temperature experiment, and
And the temperature of circuit board can be monitored by temp probe, so as to adjust isolation by adjusting the temperature of high-low temperature chamber
The temperature of case, the purpose of adjusting circuit board test ambient temperature is reached with this.
Brief description of the drawings
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.Wherein：
Fig. 1 is the flow signal for the environment temperature method of adjustment for being used for circuit board experiment that the embodiment of the present invention one provides
Figure；
Fig. 2 is the flow signal for the environment temperature method of adjustment for being used for circuit board experiment that the embodiment of the present invention two provides
Figure；
Fig. 3 is the structural representation for the environmental temperature adjusting device for being used for circuit board experiment that the embodiment of the present invention three provides
Figure；
Fig. 4 is the structural representation for the environmental temperature adjusting device for being used for circuit board experiment that the embodiment of the present invention four provides
Figure.
In the accompanying drawings, identical part uses identical reference.Accompanying drawing is not drawn according to the ratio of reality.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
Embodiment one
Fig. 1 is the flow signal for the environment temperature method of adjustment for being used for circuit board experiment that the embodiment of the present invention one provides
Figure；As shown in figure 1, the present embodiment provides a kind of environment temperature method of adjustment for circuit board experiment, including：
Step 101, temp probe is set on circuit boards.Temp probe is used for observation circuit plate or circuit board ring nearby
The temperature in border.
Step 102, circuit board is put into the shielded box of size adjustable, and shielded box is put into high-low temperature chamber.Circuit board is done
During temperature rise test, it is necessary to it is closed it is airfast under the conditions of test, that is, simulate electric vehicle motor controller actual use operating mode,
Therefore the shielded box that size can be used can be adjusted seals to circuit board.
Step 103, the temperature of high-low temperature chamber is adjusted to preset temperature.Preferably, high-low temperature chamber selects small-sized high-low temperature chamber.
Because the actual environment temperature inside the environment temperature and shielded box of high-low temperature chamber has certain temperature difference, to cause shielded box environment
Temperature quickly obtains stabilization, from the high-low temperature chamber of small volume, smaller high-low temperature chamber, and high-low temperature chamber and shielded box internal environment
The time that temperature reaches equalized temperature is shorter, and is heated up using small-sized high-low temperature chamber and cooling rate is fast, small power consumption, operation side
Just.Preset temperature can be configured according to the operating ambient temperature of circuit board under test, and the temperature of high-low temperature chamber is adjusted into default temperature
Degree, it is consistent with high-low temperature chamber be increased to the internal temperature of shielded box by heat transfer.
Step 104, the measured value of monitoring temperature probe, to obtain Current Temperatures.Specifically, using PT100 temp probes
Temperature is measured, and is calculated according to measured value and obtains Current Temperatures.If temp probe only has one, then according to the temperature
Degree probe measured value calculate obtain Current Temperatures, if temp probe have it is multiple, then need first each survey to temp probe
Value is weighted average computation or averaged etc., that is, needs first to determine a typical value according to multiple measured values, uses
Current Temperatures are obtained in final calculate.Monitoring to temp probe can obtain according to prefixed time interval, such as every 30 seconds or 1
Minute obtains the monitor value of a temp probe, can be specifically configured according to actual conditions.
Step 105, by preset temperature compared with Current Temperatures, and the temperature of high-low temperature chamber is entered according to comparative result
Row adjustment.
Specifically, by preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, height is turned down
The temperature of incubator；If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened, to cause the final temperature of shielded box
Reach preset temperature.After the internal temperature of shielded box reaches preset temperature, circuit board is powered, and circuit board carried out each
Functional test, test circuit plate in the environment of preset temperature whether can normal work, the high temperature to circuit board is completed with this
Test.Certainly, circuit board can be also powered before trip temperature adjustment is entered to shielded box, is reached in the internal temperature of shielded box pre-
If after temperature, high temperature test is carried out to circuit board.
The environment temperature method of adjustment for being used for circuit board experiment that the present embodiment provides, by setting temperature on circuit boards
Probe, and is placed on shielded box by circuit board and then is put into high-low temperature chamber, due to the size of shielded box compare so as to see who is superior incubator it is small and
Size adjustable, interior temperature distribution difference are small, it is possible to increase environment temperature precision, strengthen the reliable of circuit board environmental temperature experiment
Property, and the temperature of circuit board can be monitored by temp probe, so as to be adjusted by adjusting the temperature of high-low temperature chamber
The temperature of whole shielded box, the purpose of adjusting circuit board test ambient temperature is reached with this.
Embodiment two
The present embodiment is the supplementary notes carried out on the basis of above-described embodiment.
Fig. 2 is the flow signal for the environment temperature method of adjustment for being used for circuit board experiment that the embodiment of the present invention two provides
Figure；As shown in Fig. 2 the present embodiment provides a kind of environment temperature method of adjustment for circuit board experiment, including：
Step 201, it is uniformly arranged 2 to 4 temp probes on circuit boards, and with high temperature immobilization with adhesive tape.With 2 to 4 temperature
Spend the temperature of environment near probe monitors circuit board or circuit board.
Step 202, temp probe is set in shielded box.Specifically temp probe can be set on 6 faces of shielded box, or
Person sets temp probe at each angle of shielded box, further to correct the environment temperature of shielded box.
Step 203, circuit board is put into the shielded box of size adjustable, and shielded box is put into high-low temperature chamber.
Because the environment temperature of high-low temperature chamber can be floated to a certain extent, it is difficult to keep accurately steady temperature, and make
Circuit board is isolated with high-low temperature chamber with shielded box, one layer of " insulation " device is added equivalent to circuit board, make its be not easy with
The change of high-low temperature chamber temperature and change, and cause shielded box interior environment temperature change approach except its circuit board inside
Beyond device heating, just the air themperature only outside shielded box can be controlled to its interior environment temperature, then be wanted
The air themperature of shielded box is allowed to be easily controlled, it is necessary to using the box of small volume, therefore the shielded box that can be adjusted with size
Circuit board is isolated with high-low temperature chamber, and uses the box of small volume as far as possible, such a method improves circuit board perimeter
Ambient temperature-stable degree.I.e. the shielded box of size adjustable can reduce isolation according to the size of the size adjusting shielded box of circuit board
The inner space of case, make to be easier shielded box internal temperature control, and environment temperature is floated very little after equalized temperature.
Step 204, the temperature of high-low temperature chamber is adjusted to preset temperature.Preset temperature can be according to the building ring of circuit board under test
Border temperature is configured, and the temperature of high-low temperature chamber is adjusted into preset temperature, to make the internal temperature liter of shielded box by heat transfer
Height arrives consistent with high-low temperature chamber.
Step 205, when temp probe has it is multiple when, average computation is weighted to the measured value of each temp probe, with
Obtain Current Temperatures.
Specifically, the value after average computation is weighted to the measured value of each temp probe, for calculating current temperature
Degree, using average weighted computational methods so that identical measured value occurrence number is more, the shared proportion in final result
Bigger, the influence to result of calculation is bigger, more conforms to actual conditions.
Step 206, by preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, height is turned down
The temperature of cryogenic box；If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened.
Specifically, by preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, height is turned down
The temperature of incubator；If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened, to cause the final temperature of shielded box
Reach preset temperature.After the internal temperature of shielded box reaches preset temperature, circuit board is powered, and circuit board carried out each
Functional test, test circuit plate in the environment of preset temperature whether can normal work, the high temperature to circuit board is completed with this
Test.Certainly, circuit board can be also powered before trip temperature adjustment is entered to shielded box, is reached in the internal temperature of shielded box pre-
If after temperature, high temperature test is carried out to circuit board.
The environment temperature method of adjustment for being used for circuit board experiment that the present embodiment provides, by setting temperature on circuit boards
Probe, and is placed on shielded box by circuit board and then is put into high-low temperature chamber, due to the size of shielded box compare so as to see who is superior incubator it is small and
Size adjustable, interior temperature distribution difference are small, it is possible to increase environment temperature precision, strengthen the reliable of circuit board environmental temperature experiment
Property, and the temperature of circuit board can be monitored by temp probe, so as to be adjusted by adjusting the temperature of high-low temperature chamber
The temperature of whole shielded box, the purpose of adjusting circuit board test ambient temperature is reached with this.
Embodiment three
The present embodiment is device embodiment, for performing the method in above-described embodiment one.
Fig. 3 is the structural representation for the environmental temperature adjusting device for being used for circuit board experiment that the embodiment of the present invention three provides
Figure；As shown in figure 3, the present embodiment provides a kind of environmental temperature adjusting device for circuit board experiment, including the first temperature is visited
Head setup module 301, circuit board placement module 302, the first temperature adjusting module 303, Current Temperatures acquisition module 304 and second
Temperature adjusting module 305.
Wherein, the first temp probe setup module 301, for setting temp probe on circuit boards；
Circuit board placement module 302, height is put into for circuit board to be put into the shielded box of size adjustable, and by shielded box
Incubator；
First temperature adjusting module 303, for the temperature of high-low temperature chamber to be adjusted into preset temperature；
Current Temperatures acquisition module 304, for the measured value of monitoring temperature probe, to obtain Current Temperatures；
Second temperature adjusting module 305, for by preset temperature compared with Current Temperatures, and according to comparative result pair
The temperature of high-low temperature chamber is adjusted.
The present embodiment be with one corresponding device embodiment of embodiment of the method, for details, reference can be made to the description in embodiment one,
It will not be repeated here.
Example IV
The present embodiment is the supplementary notes carried out on the basis of embodiment three, for performing the side in above-described embodiment two
Method.
Fig. 4 is the structural representation for the biochip process units that the embodiment of the present invention four provides；As shown in figure 4, this reality
Apply example and a kind of environmental temperature adjusting device for circuit board experiment, including the first temp probe setup module 301, circuit are provided
Plate placement module 302, the first temperature adjusting module 303, Current Temperatures acquisition module 304, second temperature adjusting module 305 and
Two temp probe setup modules 306.
Wherein, second temperature probe setup module 306, for setting temp probe in shielded box.
Further, the first temp probe setup module 301 is specifically used for：
It is uniformly arranged 2 to 4 temp probes on circuit boards, and with high temperature immobilization with adhesive tape.
Further, Current Temperatures acquisition module 304 is specifically used for：
When temp probe has it is multiple when, average computation is weighted to the measured value of each temp probe, it is current to obtain
Temperature.
Further, second temperature adjusting module 305 is specifically used for：
By preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, high-low temperature chamber is turned down
Temperature；If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened.
The present embodiment be with two corresponding device embodiment of embodiment of the method, for details, reference can be made to the description in embodiment two,
It will not be repeated here.
Although by reference to preferred embodiment, invention has been described, is not departing from the situation of the scope of the present invention
Under, various improvement can be carried out to it and part therein can be replaced with equivalent.Especially, as long as being rushed in the absence of structure
Prominent, the every technical characteristic being previously mentioned in each embodiment can combine in any way.The invention is not limited in text
Disclosed in specific embodiment, but all technical schemes including falling within the scope of the appended claims.
Claims (10)
- A kind of 1. environment temperature method of adjustment for circuit board experiment, it is characterised in that including：Temp probe is set on circuit boards；Circuit board is put into the shielded box of size adjustable, and shielded box is put into high-low temperature chamber；The temperature of high-low temperature chamber is adjusted to preset temperature；The measured value of monitoring temperature probe, to obtain Current Temperatures；By preset temperature compared with Current Temperatures, and the temperature of high-low temperature chamber is adjusted according to comparative result.
- 2. the environment temperature method of adjustment according to claim 1 for circuit board experiment, it is characterised in that by circuit board Shielded box is put into, and is also included before shielded box is put into high-low temperature chamber,Temp probe is set in shielded box.
- 3. the environment temperature method of adjustment according to claim 1 for circuit board experiment, it is characterised in that in circuit board Upper setting temp probe, is specifically included：It is uniformly arranged 2 to 4 temp probes on circuit boards, and with high temperature immobilization with adhesive tape.
- 4. the environment temperature method of adjustment according to claim 1 for circuit board experiment, it is characterised in that monitoring temperature The measured value of probe, to obtain Current Temperatures, specifically include：When temp probe has it is multiple when, average computation is weighted to the measured value of each temp probe, to obtain Current Temperatures.
- 5. the environment temperature method of adjustment according to claim 1 for circuit board experiment, it is characterised in that by default temperature Degree is adjusted compared with Current Temperatures, and according to comparative result to the temperature of high-low temperature chamber, is specifically included：By preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, the temperature of high-low temperature chamber is turned down；If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened.
- A kind of 6. environmental temperature adjusting device for circuit board experiment, it is characterised in that including：First temp probe setup module, for setting temp probe on circuit boards；Circuit board placement module, high-low temperature chamber is put into for circuit board to be put into the shielded box of size adjustable, and by shielded box；First temperature adjusting module, for the temperature of high-low temperature chamber to be adjusted into preset temperature；Current Temperatures acquisition module, for the measured value of monitoring temperature probe, to obtain Current Temperatures；Second temperature adjusting module, for by preset temperature compared with Current Temperatures, and according to comparative result to high/low temperature The temperature of case is adjusted.
- 7. the environmental temperature adjusting device according to claim 6 for circuit board experiment, it is characterised in that also include,Second temperature probe setup module, for setting temp probe in shielded box.
- 8. the environmental temperature adjusting device according to claim 6 for circuit board experiment, it is characterised in that the first temperature Probe setup module is specifically used for：It is uniformly arranged 2 to 4 temp probes on circuit boards, and with high temperature immobilization with adhesive tape.
- 9. the environmental temperature adjusting device according to claim 6 for circuit board experiment, it is characterised in that Current Temperatures Acquisition module is specifically used for：When temp probe has it is multiple when, average computation is weighted to the measured value of each temp probe, to obtain Current Temperatures.
- 10. the environmental temperature adjusting device according to claim 6 for circuit board experiment, it is characterised in that the second temperature Degree adjusting module is specifically used for：By preset temperature compared with Current Temperatures, if Current Temperatures are higher than preset temperature, the temperature of high-low temperature chamber is turned down；If Current Temperatures are lower than preset temperature, the temperature of high-low temperature chamber is heightened.
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| CN201610574043.XA CN107643777B (en) | 2016-07-20 | 2016-07-20 | Environmental temperature adjusting method and device for circuit board test |
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| CN201610574043.XA CN107643777B (en) | 2016-07-20 | 2016-07-20 | Environmental temperature adjusting method and device for circuit board test |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108761236A (en) * | 2018-05-28 | 2018-11-06 | 北京智芯微电子科技有限公司 | Performance Test System and test method of the RFID tag under high/low temperature condition |
| CN109596973A (en) * | 2018-12-29 | 2019-04-09 | 北京智芯微电子科技有限公司 | The test method of chip parameter under different temperatures |
| CN111339623A (en) * | 2018-11-30 | 2020-06-26 | 中车时代电动汽车股份有限公司 | Power module temperature estimation method |
| CN112098814A (en) * | 2020-11-04 | 2020-12-18 | 上海菲莱测试技术有限公司 | Method and device for improving chip test temperature control precision |
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| CN107643777B (en) | 2020-12-04 |
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Address after: 412007 fifty-seven zone, chestnut rain Industrial Park, national hi tech Development Zone, Hunan, Zhuzhou Patentee after: Zhongche Times Electric Vehicle Co.,Ltd. Address before: 412007 fifty-seven zone, chestnut rain Industrial Park, national hi tech Development Zone, Hunan, Zhuzhou Patentee before: HUNAN CRRC TIMES ELECTRIC VEHICLE Co.,Ltd. |
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Effective date of registration: 20210709 Address after: 410000 Hunan Changsha Yuelu District bachelor road 336 Huigu science and Technology Industrial Park C-4 to C-8 detection workshop 3-102, - 103, 105, 106 Patentee after: Changsha CRRC Zhiyu New Energy Technology Co.,Ltd. Address before: 412007 fifty-seven zone, chestnut rain Industrial Park, national hi tech Development Zone, Hunan, Zhuzhou Patentee before: Zhongche Times Electric Vehicle Co.,Ltd. |