TW201809697A - Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range - Google Patents

Abstract

Provided are a temperature control device for a press-bonding unit of an electronic component and a testing device using the same. The press-bonding unit has a movable arm capable of being driven by a driving source, and a press-bonding part is mounted on a head end of the movable arm. The temperature control device of the press-bonding unit is equipped with a temperature sensor and a cooling chip on the press-bonding part. A primary effect surface located on the lower part of the cooling chip is provided for temperature conduction to the electronic component. The secondary effect surface located on the upper part of the cooling chip is connected to at least one conducting member for temperature conduction, and the conducting member is inserted into a cooler capable of moving up and down. As a result, when the press-bonding part is employed to press and bond an electronic component to perform a testing operation, the position of the cooler can be adjusted according to the predetermined testing temperature range and the self-heat generated by the electronic component so as to control the temperature-reduction degree of the conducting member. Accordingly, the temperature difference between the secondary effect surface and the primary effect surface of the cooling chip is kept within a better range thereby effectively increasing the service life of the cooling chip.

Description

Temperature control device for crimping unit of electronic component and test equipment applied thereto

The invention particularly relates to an electronic device which can maintain the temperature difference between the secondary effect surface and the main effect surface of the refrigerated wafer in a better range when the electronic component performs a test operation, thereby effectively improving the life of the refrigerated wafer. The temperature control device of the crimping unit of the component and its applied test equipment.

Press, the test operations of electronic components are performed within the preset test temperature range. When the temperature of the electronic component is lower than the preset test temperature range, the crimping unit must heat the electronic component (such as high temperature test) When the temperature of the electronic component is higher than a preset test temperature range, the crimping unit must cool the electronic component (such as a low temperature test) to keep the temperature of the electronic component within the preset test temperature range. In order to make the crimping unit respond to the testing needs of different electronic components, and change the action of providing heating or cooling, a heating piece and a low-temperature air-blasting pipe were installed on the crimping unit earlier, and the electronic component was processed by the heating piece. In the heating operation, the low-temperature gas injection pipeline cools the electronic components. However, due to the cooling method of the low-temperature gas pipeline, a considerable amount of low-temperature gas is consumed. However, with the advancement of technology, refrigerated wafers are widely used for heating or cooling of the crimping unit.

Please refer to FIG. 1. The P-type and N-type electrothermal semiconductor materials 11 and 12 of the refrigerating wafer 10 are mainly Bismuth Telluric alloys. The electrothermal semiconductor materials 11 and 12 are welded and integrated by copper electrodes 13. The lower part is connected to the positive and negative electrodes of the DC power supply with copper electrodes 14, 15 respectively, and a ceramic substrate 16 with insulation and thermal conductivity is provided on the upper side as a secondary effect surface, with insulation and thermal conductivity. The ceramic substrate 17 is located at the bottom as the main effect surface. When the DC power is applied, the current flows from the P-type electrothermal semiconductor material 11 to the N-type semiconductor material 12 and the thermal energy flows from the bottom to the top. The main effect surface is a cooling surface for the heat absorption end, and the secondary effect surface for the upper ceramic substrate 16 is a heat release end. In order to increase the heat dissipation capacity of the secondary effect surface of the upper ceramic substrate 16, a heat dissipation fin 18 is installed above the ceramic substrate 16. On the contrary, if the current flows from the N-type electrothermal semiconductor material 12 into the P-type semiconductor material 11, the main effect surface of the lower ceramic substrate 17 is a heating surface generating heat, and the sub effect surface of the upper ceramic substrate 16 is cooling a heat absorbing end. The surface, that is, when the current direction is opposite, the heat release end and the heat absorption end are inverted.

Please refer to FIG. 2, which is a schematic diagram of the test unit 20 and the crimping unit 30 of the test equipment. The test unit 20 is provided with at least a test circuit board 21 having a test base 22, and the test circuit board 21 is built-in. The test program is a crimping unit 30 movable corresponding to the testing unit 20, which is provided with a moving arm 31 which can be driven by a driving source to move up and down, and a crimping block 32 is connected to the lower end of the moving arm 31, and the electronic component When performing the test operation, the moving arm 31 will be driven down by the driving source, so that the crimping block 32 is pressed against the surface of the electronic component 23, so that the electrical contact of the electronic component 23 is guaranteed to contact the Electrical contacts to perform test operations smoothly.

Please refer to FIG. 3, the temperature control device of the crimping unit 30 is provided with a uniform cold chip 33 connected to the crimping block 32. The main effect surface of the cooling chip 33 located below is connected to conduct the temperature to the crimping block 32. The secondary effect surface of the cooling chip 33 located above is connected to the heat-conducting fin 34, and a temperature sensor 35 is convexly arranged on the lower end surface of the crimping block 32, and the temperature sensor 35 is connected to the signal by a line. To the signal converter 36, the signal converter 36 is further connected to the central control unit 40, which is connected to a power supply 37. The central control unit 40 can control the power supply 37 to output to the cooling chip 33. Current direction and current amount to control The degree of heating or cooling of the main effect surface below the cooling wafer 33. When the moving arm 31 drives the pressure contact block 32 to press the electronic component 23 to perform the test operation on the test base 22, the temperature sensor 35 contacts the surface of the electronic component 23 and transmits the temperature signal of the sensed electronic component 23 to the signal. Converter 36, the signal converter 36 converts the temperature signal and transmits it to the central control unit 40. After receiving the temperature signal, the central control unit 40 performs a comparison operation with a preset temperature range, and The obtained temperature difference value is converted into the current direction and current amount required for the cooling chip 33, and the required current direction and current amount are output from the power supply 37 to the cooling chip 33, so as to control the main effect below the cooling chip 33 Degree of surface heating or cooling. If the temperature sensor 35 detects that the temperature of the electronic component 23 to be measured is lower than the preset test temperature range, the central control unit 40 controls the cooling chip 33 of the temperature control device to operate, so that the main effect surface below is a heat generating end. The heating surface is conducted to the crimping block 32, and the electronic component 23 is heated by the conduction of the crimping block 32. If the temperature of the electronic component 23 to be measured is higher than the preset test temperature range by the temperature sensor 35, the central control unit 40 controls the cooling chip 33 of the temperature control device to operate in the reverse direction, so that the main effect surface below is The heat-absorbing end generates a cooling surface and conducts it to the crimping block 32, and cools and cools the electronic component 23 through the conduction of the crimping block 32. As for the heat-releasing end of the secondary effect surface above the cooling chip 33, the heat dissipation fins 34 are used to dissipate heat; Although the temperature control device using the cooling chip 33 can respond quickly in temperature control, the problem that the damage rate of the cooling chip 33 is too high has occurred so far, and the use efficiency of the cooling chip 33 is affected. The reason is that the characteristic of the cooling chip 33 is that the colder the heat absorbing end, the hotter the heat radiating end, so that the temperature difference between the heat absorbing end and the heat radiating end often causes an excessively large temperature difference, which in turn leads to an excessively high damage rate of the cooling wafer 33; for example, When the electronic component 23 performs a low-temperature test with a preset test temperature of -20 ° C, the main effect surface under the cooling chip 33 needs to generate a cooling surface of -20 ° C to conduct to the crimp block 32, but because the electronic component 23 itself is in the process of testing, It will generate self-heating (such as 120 ° C) and the temperature rises beyond the preset test temperature range of -20 ° C, so that the wafer is cooled. The main effect surface below 33 needs to generate a cooling surface lower than -20 ° C to suppress the self-heating of the electronic component 23 itself. In contrast, the heat dissipation end of the secondary effect surface above the cooling chip 33 will generate higher thermal energy. , Which causes the temperature difference between the secondary effect surface above the cooling chip 33 and the primary effect surface below to further expand. Although the secondary effect surface above the cooling chip 33 can use the heat dissipation fins 34 to dissipate heat, the heat dissipation fins 34 cannot follow The heat dissipation effect is changed according to the change of the temperature difference, which causes an excessively large temperature difference between the sub effect surface above and the main effect surface below the refrigerating wafer 33, which may easily cause damage to the refrigerating wafer 33. Furthermore, if the electronic component 23 performs a medium-high temperature test with a preset test temperature of 50 ° C, the main effect surface under the cooling chip 33 will generate a heating surface of 50 ° C to conduct to the crimping block 32, but because the electronic component 23 itself is During the test, self-heating (such as 120 ° C) is generated and the temperature rises beyond the preset test temperature range by 50 ° C, so that the main effect surface under the cooling chip 33 needs to be changed to generate a cooling surface to suppress the generation of the electronic component 23 itself. Self-heating, in contrast, the secondary effect surface above the cooling chip 33 will be converted into a heat-dissipating end to generate thermal energy, which causes the temperature difference between the secondary effect surface above the cooling chip 33 and the main effect surface below to widen. Although the upper side effect surface can be dissipated by the heat dissipation fin 34, the heat dissipation effect of the heat dissipation fin 34 cannot be changed with the change of the temperature difference, so that the upper side effect surface and the main side effect surface of the cooling chip 33 are still generated. An excessive temperature difference may easily cause damage to the cooling wafer 33.

In view of this, the inventor then used his many years of research and development and production experience in related industries to conduct in-depth research on the current problems. After long-term research and trial work, he finally developed a side effect that not only can make the cooling chip The temperature difference between the surface and the main effect surface is maintained in a better range, thereby effectively improving the life of the refrigerated wafer and effectively improving the disadvantages of the prior art, which is the design purpose of the present invention.

An object of the present invention is to provide a temperature control device for a crimping unit of an electronic component. The crimping unit has a moving arm which can be driven by a driving source. The head end of the boom is provided with a crimping portion; wherein the temperature control device of the crimping unit is provided with a temperature sensor and a cooling chip on the crimping portion, and the main effect surface system of the cooling chip is located below The temperature is conducted to the electronic components, and the secondary effect surface of the refrigerating chip located above is connected to the at least one conductive member, and the conductive member is passed through a movable cooler; thereby, the cooler can be adjusted by using The temperature of the conductive member can be adjusted to keep the temperature difference between the secondary effect surface and the main effect surface of the cooling chip in a better range, thereby effectively improving the life of the cooling chip.

A second object of the present invention is to provide a testing device for applying a temperature control device of a crimping unit of the electronic component. The testing device includes a feeding unit, a receiving unit, a conveying unit, a testing unit, a crimping unit, and a central unit. A control unit, the feeding unit is used to contain at least one electronic component to be tested, the receiving unit is used to contain at least one electronic component to be tested, and the conveying unit is provided with at least one material moving device Device for transferring electronic components to be tested / completed. The test unit is provided with a test circuit board with a test stand to perform test operations on the electronic components and transmit the test results to the central control unit. There is a crimping unit for crimping electronic components. The crimping unit is also provided with a temperature control device to enable the electronic component to perform a test operation within a preset test temperature range. The central control unit controls the operation of each unit; thereby, When the crimping unit crimps the electronic component to perform the test operation, the temperature control device can adjust the position of the cooler according to the preset test temperature range and the self-heat generated by the electronic component, and obtain In order to regulate the degree of temperature reduction of the conductive member, the temperature difference between the secondary effect surface and the main effect surface of the refrigerated wafer can be maintained in a better range, thereby effectively improving the life of the refrigerated wafer.

Learning part:

10‧‧‧Refrigerated chip

11‧‧‧P-type electrothermal semiconductor material

12‧‧‧N-type electrothermal semiconductor material

13‧‧‧copper electrode

14‧‧‧copper electrode

15‧‧‧copper electrode

16‧‧‧ceramic substrate

17‧‧‧ceramic substrate

18‧‧‧ cooling fins

20‧‧‧Test unit

21‧‧‧test circuit board

22‧‧‧Test Block

23‧‧‧Electronic components

30‧‧‧Crimping unit

31‧‧‧ mobile arm

32‧‧‧ Crimp Block

33‧‧‧Refrigerated chip

34‧‧‧Cooling Fin

35‧‧‧Temperature sensor

36‧‧‧Signal Converter

37‧‧‧ Power Supply

40‧‧‧ Central Control Unit

Part of the invention:

60‧‧‧Crimping unit

61‧‧‧ Mobile arm

62‧‧‧ Crimping Department

621‧‧‧frame

622‧‧‧ Crimp Block

64‧‧‧Temperature sensor

65‧‧‧Refrigerated chip

66‧‧‧Signal Converter

67‧‧‧Power Supply

68‧‧‧Conductor

681‧‧‧ Link Block

682‧‧‧heater

69‧‧‧cooler

70‧‧‧ Central Control Unit

80‧‧‧test unit

81‧‧‧test circuit board

82‧‧‧Test Block

83‧‧‧Electronic components

90‧‧‧feeding unit

91‧‧‧ tray

100‧‧‧Receiving unit

101‧‧‧ tray

110‧‧‧conveying unit

111‧‧‧The first transfer device

1111‧‧‧The first feeder

112‧‧‧ delivery device

1121‧‧‧carriage

113‧‧‧Second material transfer device

1131‧‧‧second feeder

Figure 1: Schematic diagram of a conventional cooling wafer.

Figure 2: Schematic diagram of the test unit and crimping unit of the conventional test equipment.

Fig. 3: Schematic diagram of the temperature control device of the conventional crimping unit.

FIG. 4 is a schematic diagram of a crimping unit of the present invention.

FIG. 5 is a schematic diagram of a test unit and a crimping unit of the present invention.

Fig. 6: Schematic diagram of the temperature control device of the crimping unit of the present invention (1).

Fig. 7: Schematic diagram of the temperature control device of the crimping unit of the present invention (2).

Fig. 8: Schematic diagram of the temperature control device of the crimping unit of the present invention (3).

FIG. 9 is a schematic diagram of another embodiment of the temperature control device of the crimping unit of the present invention.

Figure 10: Schematic diagram of the test equipment of the present invention.

In order to make your reviewing committee further understand the present invention, the preferred embodiment will be described in detail with reference to the drawings as follows: Please refer to FIG. 4. The crimping unit 60 of the electronic component of the present invention has a drive source The driven moving arm 61 is provided with a crimping portion 62 for pressing down the electronic component at the head end of the moving arm 61. In this embodiment, the crimping portion 62 is provided with a frame base connected to the moving arm 61. 621, and a crimping block 622 located below the frame base 621; wherein the temperature control device of the crimping unit 60 is mounted on the crimping portion 62 with a temperature sensor 64 and a cooling chip 65, and the cooling chip The 65 series can be installed on the end surface of the crimping portion 62 to directly crimp the electronic component and transmit the temperature, and the temperature sensor 64 extends and protrudes from the end surface of the cooling chip 65 to sense the temperature of the electronic component; Or, the cooling chip 65 may be installed in the crimping portion 62, and the electronic component is crimped through the crimping portion 62 to conduct the temperature, and the temperature sensor 64 is extended and protruding to the end surface of the crimping portion 62, so that Measure the temperature of the electronic component; in this embodiment, the cooling chip 65 is installed in the frame base 621 of the crimping portion 62, The electronic component is crimped through the crimping block 622 of the crimping portion 62 and the temperature is transmitted, and the temperature sensor 64 is extended and extended to protrude from the end surface of the crimping block 622; the temperature sensor 64 is connected to the center by a line The control unit 70, in this embodiment, the temperature sensor 64 is connected to the signal converter 66 by a line, and the signal converter 66 is further connected to the central control unit 7 0, the central control unit 70 is connected to a power supply 67, and the central control unit 70 controls the direction and amount of current output by the power supply 67 to the cooling chip 65, so as to control the heating of the cooling chip 65 Or the degree of cooling; the main effect surface on which the cooling chip 65 is located below is connected to conduct heat to the electronic component, and the side effect surface on which the cooling chip 65 is located above is connected to conduct heat to at least one conductive member 68. In this embodiment, The main effect surface of the cooling chip 65 below is connected and guided to the frame base 621, and the main effect surface of the cooling chip 65 below is guided to the pressure contact block 622 through the frame base 621. The secondary effect surface 65 located on the upper side is connected to the temperature conducting to a plurality of conductive members 68, and the plurality of conductive members 68 are connected to the secondary effect surface on the refrigerating chip 65 located on the upper side by a connection seat 681, and the connection can be used. The seat 681 guides the secondary effect surface of the cooling chip 65 above to the plurality of conductive members 68, and the plurality of conductive members 68 are penetrated inside a movable cooler 69, so that the cooler 69 The heat transfer of the plurality of conductive members 68 can be changed The conduction distance or the heat exchange area in the cooler 69 adjusts the degree of cooling of the side effect surface of the refrigerating chip 65 located above. In this embodiment, the cooler 69 can move up and down, and rise away from or The falling is close to the side effect surface of the cooling chip 65. When the cooler 69 rises away from or drops close to the side effect surface of the cooling chip 65, the heat conduction distance of the plurality of conductive members 68 may be changed or cooled. The heat exchange area in the cooler 69 adjusts the degree of cooling of the side effect surface of the cooling chip 65 located above. In this embodiment, the cooler 69 is connected to a cold source supplier (not shown), and The cooler 69 can be maintained at a low temperature of -20 ° C. In addition, the cooler 69 is driven by a lifter (not shown) for lifting, and the lifter is controlled by the central control unit 70 for lifting operation. There are many types and are known techniques, so I won't go into details here; when the cooler 69 is controlled by the central control unit 70 to move up and down and away from the side effect surface of the cooling chip 65 located above, the plurality of conductive members 68 will With longer heat conduction Or from a smaller heat exchange area 69 and the cooler for cold and hot, The side effect surface on which the cooling chip 65 is located above is reduced to a small degree; in contrast, when the cooler 69 is controlled by the central control unit 70 to move up and down to approach the side effect surface on the cooling chip 65, The plurality of conductive members 68 will perform cold and heat exchange with the cooler 69 with a short heat conduction distance or with a large heat exchange area, so that the side effect surface of the refrigerating chip 65 located above will cool down to a greater extent.

Please refer to FIG. 5, which is a schematic diagram of the test unit 80 and the crimping unit 60 of the test equipment. The test unit 80 is provided with at least a test circuit board 81 with a test base 82, which is used to house electronics. Component 83 to perform a test operation on the electronic component 83; a test program for performing the test operation may be built in a test circuit board 81 which transmits the test result to the central control unit 70 or performs a test operation The test program is built in a test machine (not shown), and the test machine transmits the test results to the central control unit 70. In this embodiment, the test base 82 is a test program pair built in the test circuit board 81 The electronic component 83 performs a test operation and transmits the test result to the central control unit 70. When the crimping unit 60 of the present invention performs the test operation on the electronic component 83, the moving arm 61 will be driven down by the driving source, so that The crimping portion 62 is crimped to the surface of the electronic component 83, so that the electrical contact of the electronic component 83 is ensured to contact the electrical contact of the test base 82, so that the test operation can be performed smoothly.

Please refer to FIG. 6. If a high temperature test with a preset test temperature range of 100 ° C. ± 10 ° C. is taken as an example, when the crimping portion 62 of the crimping unit 60 is crimped to the surface of the electronic component 83 by the crimping block 622. The temperature sensor 64 transmits the sensed temperature signal of the electronic component 83 to the signal converter 66. The signal converter 66 converts the temperature signal and then transmits it to the central control unit 70. The central control unit 70 receives the temperature signal after receiving the temperature signal. That is, a comparison operation is performed with a preset test temperature range, and the temperature difference obtained after the comparison operation is converted into a current direction and an amount of current required for the cooling chip 65, and then the power supply 67 outputs the required current Direction and amount of current to the cooling chip 6 5 to control the degree of heating or cooling of the main effect surface below the cooling chip 65. Since the initial temperature of the electronic component 83 is lower than the preset test temperature range of 100 ° C ± 10 ° C, the central control unit 70 will control the power supply 67 to output the required current direction and current amount to the cooling chip 65, so that the The cooling wafer 65 is operated, so that the main effect surface under the cooling wafer 65 is a heating surface to generate a heating surface, and is transmitted to the crimping block 622, and the electronic component 83 is heated by the conduction of the crimping block 622. When the electronic component 83 is heated to a preset test temperature range of 100 ° C ± 10 ° C, the electronic component 83 starts to perform the test operation. However, during the execution of the test operation, the electronic component 83 itself generates heat (such as 120). ℃) and the temperature rises beyond the preset test temperature range of 100 ° C ± 10 ° C. Since the electronic component 83 exceeds the preset test temperature range only slightly, the power supply 67 will change the direction and amount of current required for the output to The cold chip 65 is operated with low power, so that the main effect surface below is a heat-absorbing end to generate a cooling surface, and is transmitted to the crimping block 622, and the conduction of the crimping block 622 suppresses the self-heating of the electronic component 83 To cool the electronic component 83 to a preset test temperature range of 100 ° C ± 10 ° C. Because the cooling chip 65 is operated with low power, the main effect surface below is a cooling surface for the heat absorption end. In contrast, the side effect surface of the cooling chip 65 located at the upper side is converted to a heat radiation end with a small power and generates a slightly high temperature. The heating surface, at this time, the cooler 69 is controlled by the central control unit 70 to move upward and away from the position (A) of the side effect surface above the refrigerating chip 65. The plurality of conductive members 68 is a longer heat conduction distance or The small heat exchange area exchanges cold and heat with the cooler 69, so that the side effect surface of the cooling chip 65 located above is reduced to a small degree, the side effect surface of the cooling chip 65 located above and the main surface located below The temperature difference on the effect surface can be kept in a better range, thereby effectively improving the life of the refrigerated wafer.

Please refer to FIG. 7. If the preset test temperature range is 50 ° C ± 10 ° C, the temperature sensor 64 is used as an example. When the crimping block 622 of the crimping unit 60 is crimped to the surface of the electronic component 83, the temperature sensor 64 Will sense the temperature information of the electronic component 83 The signal is transmitted to the signal converter 66. The signal converter 66 converts the temperature signal and then transmits it to the central control unit 70. After receiving the temperature signal, the central control unit 70 performs a comparison operation with a preset test temperature range, and The temperature difference obtained after the comparison operation is converted into the current direction and current amount required for the cooling chip 65, and the required current direction and current amount are output from the power supply 67 to the cooling chip 65, thereby controlling the cooling The degree of heating or cooling of the main effect surface below the wafer 65. Since the initial temperature of the electronic component 83 is lower than the preset test temperature range of 50 ° C ± 10 ° C, the central control unit 70 will control the power supply 67 to output the required current direction and current amount to the cooling chip 65, so that The cooling chip 65 operates to generate a heating surface on the lower main effect surface as a heat release end, and conducts the heating surface to the crimping block 622, and heats the electronic component 83 through the conduction of the crimping block 622. When the electronic component 83 is heated to a preset test temperature range of 50 ° C ± 10 ° C, the electronic component 83 starts to perform a test operation. However, during the execution of the test operation, the electronic component 83 itself generates heat (such as 120). ℃) and the temperature rises beyond the preset test temperature range of 50 ° C ± 10 ° C. Because the amplitude of the electronic component 83 exceeds the preset test temperature range, the power supply 67 will change the direction and amount of current required for output to refrigeration Wafer 65, the refrigerating wafer 65 is operated at a medium power so that the main effect surface below is a heat-absorbing end to generate a cooling surface, and is transmitted to the crimping block 622, and the conduction of the crimping block 622 suppresses the self-heating of the electronic component 83. The electronic component 83 is cooled down to a preset test temperature range of 50 ° C ± 10 ° C. Since the cooling chip 65 is operated with medium power, the main effect surface below is a cooling surface for the heat-absorbing end. In contrast, the secondary effect surface located above the cooling chip 65 is converted to a heat-dissipating end with medium power and generates a higher temperature. The heating surface, at this time, the cooler 69 is controlled by the central control unit 70 to lower and move closer to the position of the secondary effect surface (B) above the refrigerating wafer 65. The plurality of conductive members 68 is a short heat conduction distance or The larger heat exchange area exchanges heat with the cooler 69, so that the side effect surface of the refrigerated wafer 65 located above is cooled down to a greater extent. The temperature difference on the main effect surface below can be kept in a better range, thereby effectively improving the life of the refrigerated wafer.

Please refer to FIG. 8. If a low temperature test with a preset test temperature range of -20 ° C ± 10 ° C is taken as an example, when the crimping block 622 of the crimping unit 60 is crimped to the surface of the electronic component 83, the temperature sensor 64 The temperature signal of the sensed electronic component 83 is transmitted to the signal converter 66. The signal converter 66 converts the temperature signal and then transmits it to the central control unit 70. After receiving the temperature signal, the central control unit 70 communicates with the preset temperature signal. Perform a comparison operation on the test temperature range, and convert the temperature difference obtained after the comparison operation into the current direction and current amount required for the cooling chip 65, and then the power supply 67 outputs the required current direction and current amount to The cooling chip 65 is used to control the degree of heating or cooling of the main effect surface below the cooling chip 65. Since the initial temperature of the electronic component 83 is higher than the preset test temperature range of -20 ° C ± 10 ° C, the central control unit 70 will control the power supply 67 to output the required current direction and current amount to the cooling chip 65, and The cooling chip 65 is actuated to generate a cooling surface on the lower main effect surface as a heat-absorbing end, which is conducted to the crimping block 622, and the electronic component 83 is cooled by the conduction of the crimping block 622. When the electronic component 83 cools down to a preset test temperature range of -20 ° C ± 10 ° C, the electronic component 83 starts to perform the test operation. However, during the execution of the test operation, the electronic component 83 itself generates heat (such as 120 ° C) and the temperature rises beyond the preset test temperature range of -20 ° C ± 10 ° C. Since the electronic component 83 greatly exceeds the preset test temperature range, the power supply 67 will change the direction and amount of current required for output to The cooling chip 65 causes the cooling chip 65 to operate with high power to generate a cooling surface on the lower main effect surface as a heat absorption end, and transmits the cooling surface to the crimping block 622, and suppresses the self-assembly of the electronic component 83 through the conduction of the crimping block 622 The heat reduces the electronic component 83 to a preset test temperature range of -20 ° C ± 10 ° C. Because the cooling chip 65 is operated with high power, the main effect surface below is a cooling surface for the heat-absorbing end. On the contrary, the side effect surface of the cooling chip 65 located at the upper side is converted to a heat-emitting end with high power and produced. The extremely high temperature heating surface is generated. At this time, the cooler 69 is controlled by the central control unit 70 to lower and move close to the position (C) of the side effect surface above the refrigerating wafer 65. The plurality of conductive members 68 conduct heat with extremely short heat. The distance or exchange of heat and cold with the cooler 69 is based on a large heat exchange area, so that the side effect surface of the cooling chip 65 located above is greatly reduced in temperature. The temperature difference of the main effect surface below can be maintained in a better range, thereby effectively improving the life of the refrigerated wafer.

Please refer to FIG. 9, after the electronic component 83 completes the test, the crimping block 622 of the crimping unit 60 will rise away from and press against the surface of the electronic component 83. At this time, it is no longer necessary to consider the self-heat generated by the electronic component 83 However, when the test is temporarily stopped in order to exchange materials, the temperature difference between the secondary effect surface of the cooling chip 65 above and the main effect surface below can be kept in a better range, and there will be Two cases are considered and explained. The first one is to test the temperature of the crimping block 622 to keep it at a low temperature when the test is temporarily stopped. The effect surface is still a cooling surface for the heat-absorbing end, and the sub-effect surface for the cooling chip 65 located above is still a heating surface for the heat-release end. At this time, the cooler 69 can still be controlled and operated by the central control unit 70 to make the complex number Each conductive member 68 exchanges heat and cold with the cooler 69, so that the temperature difference between the secondary effect surface of the refrigerated wafer 65 above and the main effect surface below is kept in a better range; the second type is as originally Measured at high temperature In the test environment, when the test is temporarily stopped, in order to keep the crimping block 622 still at a high temperature, the main effect surface under the cooling chip 65 is still a heating surface that generates heat, and the cooling chip 65 The secondary effect surface located above is a heat-absorbing end to generate a cooling surface. If the temperature difference between the secondary effect surface located above the cooling wafer 65 and the primary effect surface located below is too large, the cooler 69 cannot cause the The secondary effect surface located above the cold chip 65 is heated up to reduce the temperature difference from the main effect surface. Therefore, the present invention is applied to the connecting seat 681 of the plurality of conductive members 68. A heater 682 may be added, and the heater 682 heats the plurality of conductive members 68 and heats the side effect surface of the cooling chip 65 located above, so that the side of the cooling chip 65 located above The temperature difference between the effect surface and the main effect surface located below is kept in a better range.

Referring to FIG. 10, the test equipment of the present invention includes a feeding unit 90, a receiving unit 100, a conveying unit 110, at least one testing unit 80, a crimping unit 60, and a central control unit (not shown). The feeding unit 90 is configured on the machine platform to accommodate at least one electronic component to be tested. In this embodiment, the feeding unit 90 is configured with at least one tray 91 for containing the electronic component to be tested. The unit 100 is configured on the machine platform to accommodate at least one completed electronic component. In this embodiment, a plurality of trays 101 capable of containing different grades of completed electronic components are provided; the test unit 80 is provided There is a test circuit board 81 with a test base 82 to perform test operations on electronic components and transmit the test results to a central control unit. The central control unit controls various devices to act according to the test results, and to ensure that the electronic components remain electrically connected At the test base 82, a crimping unit 60 for crimping electronic components is provided on the machine so that the electronic component is electrically connected to the test base 82, wherein the crimping unit 60 is provided with a temperature control device according to the present invention. (As (As shown in Fig. 4), so that the electronic component performs a test operation within a preset test temperature range; the conveying unit 110 is arranged on the machine and is provided with at least one transfer device with a transfer device for transferring In this embodiment, the conveying unit 110 includes a first material conveying device 111, a conveying device 112, and a second material conveying device 113. The first material conveying device 111 is provided with at least one first The transfer device 1111 is used to transfer the electronic components to be tested / completed between the feeding unit 90, the receiving unit 100, and the carrying device 112. The carrying device 112 is provided with at least one carrier 1121 for The electronic components to be tested / completed are carried between the first material transfer device 111 and the second material transfer device 113. The second material transfer device 113 is provided with at least a second material transfer device 1131 for the test unit. 8 The electronic components to be tested / completed are transferred between 0 and the carrying device 112.

In summary, the temperature control device of the crimping unit of the present invention can adjust the position of the cooler according to the preset test temperature range and the self-heat generated by the electronic components, so that the side effect surface and the main effect of the cooling chip The surface temperature difference is kept in a better range, thereby effectively improving the life of the refrigerated wafer. According to this, the present invention is a practical and progressive design, but the same products and publications have not been disclosed, which allows the invention patent application requirements to be met, and the application is submitted according to law.

60‧‧‧Crimping unit

61‧‧‧ Mobile arm

62‧‧‧ Crimping Department

621‧‧‧frame

622‧‧‧ Crimp Block

64‧‧‧Temperature sensor

65‧‧‧Refrigerated chip

66‧‧‧Signal Converter

67‧‧‧Power Supply

68‧‧‧Conductor

69‧‧‧cooler

70‧‧‧ Central Control Unit

81‧‧‧test circuit board

82‧‧‧Test Block

83‧‧‧Electronic components

Claims (10)

A temperature control device for a crimping unit of an electronic component. The crimping unit is provided with a moving arm driven by a driving source, and a crimping part is installed at the end of the moving arm. The temperature control device includes: a central control Unit; temperature sensor: installed in the crimping part to sense the temperature of the electronic component and connect the signal to the central control unit with a line; refrigeration chip: installed in the crimping part so that The main effect surface of the cooling chip located below guides the temperature to the electronic component; power supply: the central control unit controls the direction and amount of current output by the power supply to the cooling chip; at least one conductive member: The secondary effect surface provided above the refrigerating chip is connected, so that the secondary effect surface above the refrigerating chip is connected to conduct heat to the conductive member; the cooler is for the at least one conductive member to pass through, The cooler is controlled and moved by the central control unit, so that the cooler changes the heat conduction distance of the conductive member or the heat exchange area in the cooler, and adjusts the degree of cooling of the secondary effect surface located above the cooling chip The temperature control device for a crimping unit of an electronic component according to item 1 of the scope of the patent application, wherein the refrigerating chip is mounted on an end surface of the crimping portion to directly crimp the electronic component and conduct temperature, The temperature sensor extends and extends beyond the end surface of the cooling chip to sense the temperature of the electronic component. The temperature control device for the crimping unit of the electronic component according to item 1 of the scope of the patent application, wherein the crimping portion is provided with a frame base connected to the moving arm and a crimping unit located below the frame base. Piece. Temperature control of the crimping unit of electronic components according to item 3 of the scope of patent application The cooling chip is installed in the frame of the crimping portion, and the electronic component and the conductive temperature are crimped through the crimping block of the crimping portion, and the temperature sensor is extended and protruded. The end surface of the crimping block is pressed to sense the temperature of the electronic component. The temperature control device for the crimping unit of the electronic component according to item 1 of the scope of the patent application, wherein the temperature sensor of the temperature control device is connected to the signal converter by a line, and the signal converter is further connected to the signal converter. Central control unit. The temperature control device of the crimping unit of the electronic component according to item 1 of the scope of the patent application, wherein the temperature control device is provided with a plurality of conductive members, and the plurality of conductive members are connected to the connector with a connection base. The cold chip is located on the secondary effect surface above, and the connection seat guides the cold effect chip on the secondary effect surface to the plurality of conductive members. The temperature control device of the crimping unit of the electronic component according to item 1 of the scope of the patent application, wherein the cooler of the temperature control device is driven by a lifter, and the lifter is controlled by the central control unit. Raising the cooler away from or falling close to the side effect surface of the refrigerated wafer above. The temperature control device of the crimping unit of the electronic component according to item 1 of the scope of the patent application, wherein the cooler of the temperature control device is connected to the cold source supplier to keep the cooler at a low temperature state. The temperature control device for the crimping unit of the electronic component according to item 1 of the scope of the patent application, wherein the conductive member is provided with a heater, and the conductive member is heated by the heater so that the refrigerated wafer is located above The side effect surface is heating up. A testing device includes: a feeding unit: arranged on a machine platform to accommodate at least one electronic component to be tested; a receiving unit: arranged on a machine platform to accommodate at least one completed electronic component Component; Conveying unit: It is arranged on the machine and is provided with at least one transfer device with a transfer device for transferring the electronic component; Test unit: It is provided with a test circuit board with a test base for receiving the electronic component to perform a test operation on the electronic component; crimping unit: It is provided on the machine for crimping the electronic component. An electronic component, the crimping unit is provided with a moving arm driven by a driving source, a crimping part is installed at the head end of the moving arm, and the crimping unit is provided with a temperature control according to item 1 of the scope of patent application The device enables the electronic component to perform a test operation within a preset test temperature range.