TWI684019B - Crimping device of test device and test classification equipment for its application - Google Patents

Abstract

A crimping device for a testing device. The testing device is provided with a temperature working device between a moving arm and a crimping device. The crimping device is provided with a crimping piece and a sleeve. The crimping piece is provided on the bottom surface Pressing against the lower pressing part of the electronic component, the set is assembled under the crimping part, and a first set of openings are provided for passing through the lower pressing part of the crimping part, and the set is different from the first set At least one part of the closing hole is provided with at least one temperature control component which controls the temperature of the kit to maintain the preset operating temperature to prevent the high temperature of the crimper from being transmitted to the circuit board through the substrate and being damaged , So that the circuit board can accurately execute the test operation, to achieve the practical benefits of improving test quality and saving costs.

Description

Crimping device of test device and test classification equipment for its application

The invention provides a method for preventing the high temperature of the crimper from being transmitted through the substrate to the circuit board and being damaged To enable the circuit board to accurately perform the test operation, so as to improve the test quality and save cost.

Nowadays, electronic components may be in a high-temperature environment when they are actually used. To ensure the quality of electronic components, after the electronic components are manufactured, they use a test device to perform thermal testing on the electronic components to eliminate defective products; please refer to section 1, the electronic component testing device is equipped with a metal substrate 12 with an accommodating portion 121 under the machine 11 and a circuit board 13 at the bottom of the substrate 12, the bottom surface of the circuit board 13 is electrically connected to a testing machine 14, and the top surface is electrically connected to the test seat 15, the test seat 15 is placed in the accommodating portion 121 of the substrate 12 for receiving and testing electronic components The test device is also provided with a crimping mechanism above the test base 15, the crimping mechanism uses the movable arm 16 to drive the heater 17 and the crimper 18 for Z-direction displacement, and the heater 17 is a temperature-increasing crimper 18 , The crimper 18 is pressed against the electronic components in the test seat 15 by the lower pressure part 181, and the bottom surface of the crimper 18 and the bonding surface 182 located on the peripheral side of the lower pressure part 181 is placed on the top surface of the substrate 12 , So that the electronic components perform thermal testing in a simulated high-temperature test environment; however, the heater 17 is a temperature-increasing crimper 18 with a high temperature of 85 °C. In addition to making the lower pressure portion 181 of the crimper 18 have a high temperature of 85 °C, it also Make the bonding surface 182 of the crimper 18 have a high temperature of 85°C. When the bonding surface 182 of the crimper 18 is placed on the substrate 12, the 85°C high temperature will be conducted down to the circuit board 13 through the substrate 12, resulting in The circuit board 13 is damaged due to the high temperature, so that the electronic components in the test base 15 cannot be correctly thermally tested. Therefore, the electronic component is misjudged as a defective product. Not only must the circuit board 13 be replaced and the cost is increased, but also the electronic component cannot be guaranteed. Test quality.

The first object of the present invention is to provide a crimping device for a testing device. The testing device is provided with a temperature working device between a moving arm and a crimping device. The crimping device is provided with a crimping part and a sleeve. The crimping part is provided with a lower pressing part for pressing against the electronic component on the bottom surface, the kit is provided with a first set of fitting holes for passing through the lower pressing part of the crimping part, and the set is different from the first set At least one part of the hole is provided with at least one temperature control component which controls the temperature of the kit to keep the kit at a preset operating temperature to prevent the high temperature of the crimper from being transmitted to the circuit board through the substrate and being damaged. Make the circuit board accurately execute the test operation, and achieve the practical benefits of improving test quality and saving costs.

The second object of the present invention is to provide a crimper for a testing device, wherein at least one stop member is provided between the first set of fitting holes of the kit and the temperature control member to avoid fluid flow of the temperature control member To the pressing part, so that the pressing part presses against the electronic component at a preset temperature to perform the test operation.

The third object of the present invention is to provide a crimper for a testing device, wherein the kit is provided with at least one sensor to sense the temperature of the kit, and then the temperature control component is adjusted to further ensure the kit Maintain the preset operating temperature to achieve the practical benefit of improving the use efficiency.

The fourth object of the present invention is to provide a test classification device for a crimper using a test device, which includes a machine, a feeding device, a receiving device, a test device with a crimper, a conveying device and a central control device. The feeding device is arranged on the machine, and is provided with at least one feeding holder to hold the electronic components to be tested; the feeding device is arranged on the machine and is provided with at least one feeding holder, In order to support the tested electronic components; the test device of the present invention is configured on the machine, and is provided with a moving arm, a temperature operating device, a crimping device, a substrate, a circuit board and a test base to test the electronic components and temperature control pressure Connector; the conveying device is configured on the machine, and is equipped with at least one feeder to transfer electronic components; the central control device is used to control and integrate the actions of each device to perform automated operations to achieve improved operating efficiency Practical benefits.

In order to make your reviewer understand the invention further, a preferred embodiment is hereby given , And with the drawings, detailed as follows:

Please refer to Figures 2 and 3, the test device 20 of the present invention includes a moving arm 21, a temperature working device 22 and a crimper 23, and a floater can also be installed above the crimper 23 (not shown) , Use the float to make the crimper 23 float to prevent the pressure from damaging the electronic components; the moving arm 21 is driven by a drive source (not shown) for displacement in at least one direction, if the crimper 23 is to be executed simply During the operation of crimping electronic components, the movable arm 21 can be displaced in the Z direction. If the crimper 23 is to perform the operation of crimping and transferring electronic components, the movable arm 21 can be displaced in the X-Y-Z direction. In the embodiment, the movable arm 21 is displaced in the X-Y-Z direction to drive the temperature working device 22 and the crimper 23 to move synchronously.

The temperature working device 22 is installed under the movable arm 21 to maintain the preset test temperature by raising or lowering the crimping device 23. If the crimping device 23 performs a cold test operation, the temperature working device 22 can be a cooling chip to cool down The crimper 23 reaches the preset low temperature test temperature. If the crimper 23 performs the thermal test operation, the temperature operator 22 can be a cooling chip or a heating element to raise the crimper 23 to the preset high temperature test temperature. In the example, the temperature operating device 22 is a heating element and is located on the top surface of the crimper 23 to raise the temperature of the crimper 23 to the preset thermal measurement temperature.

The crimper 23 is assembled under the temperature working device 22, and includes a crimping member 231 and a sleeve 232. The crimping member 231 is provided with at least one pressing part 2311 pressed against the electronic component on the bottom surface. When the connector 23 is to simply perform the operation of crimping the electronic component, the pressing portion 2311 may be a pressure block, and if the crimping device 23 is to perform the operation of crimping and transferring the electronic component, the pressing portion 2311 has a suction nozzle In this embodiment, the crimping member 231 is provided with a suction nozzle 2312 at the lower pressing portion 2311 to pick up and place electronic components, and then the crimping member 231 is heated to a preset thermal measurement temperature of 85°C via a temperature working device 22, In order to facilitate the thermal measurement operation; the set 232 is provided with a first set of closing holes 2321 for the pressure part 2311 to pass through the crimping member 231, and at least one part is provided in at least one part different from the first set of closing holes 2321 The temperature control component is made of a temperature control kit 232. If the kit 232 is made of non-insulated material, use the temperature control device to reduce the temperature of the kit 232 to avoid passing the high temperature of the crimping member 231 through the substrate (not shown) (Shown) to the circuit board (not shown) and damaged, if the sleeve 232 is made of thermal insulation material, the temperature control component is used to avoid the high temperature accumulation in the sleeve 232 and affect the preset thermal measurement of the lower pressure portion 2311 Temperature, further, the aforementioned at least one part different from the first sleeve hole 2321 can be the inner or top or bottom surface of the thickness of the sleeve 232, and the temperature control member can be a temperature-controlled flow channel with a fluid or refrigeration Wafer or heat dissipation material, for example, the temperature control component is a temperature control flow channel with fluid, the temperature control flow channel can be provided with at least a first-class channel section in the sleeve 232, or the sleeve 232 and the crimping member 231 are provided with communication A plurality of flow channel sections, or at least a first-level channel section between the sleeve 232 and the crimping member 231, regardless of any of the foregoing methods, can reduce the temperature of the crimping member 231 to the circuit board 25 and avoid the sleeve 232 Excessive heat accumulation; Furthermore, if the temperature control component is a temperature control flow channel, at least one stop component may be provided between the temperature control flow channel and the first set of closing holes 2321, the stop component may be a temperature control flow channel The thickness part between the first set of hole 2321 or an independent component to prevent the fluid of the temperature control flow channel from flowing to the first set of hole 2321, and the temperature control flow channel can be equipped with at least one fluid delivery tube (such as gas Input tube) or for external fluid to flow in; in this embodiment, the sleeve 232 is made of heat-insulating material, and a tube body portion 2322 with a second sleeve closing hole 2323 is protruded on the bottom surface, the second sleeve The closing hole 2323 is on the same axis as the first set of closing holes 2321, so that the lower part 2311 of the lower part of the pressing part 2311 is protruded from the second set of closing holes 2323 through the pressing part 231 The set 232 reduces the heat dissipation of the lower pressure part 2311, so that the lower pressure part 2311 of the crimping member 231 maintains a preset thermal measurement temperature of 85° C. to perform the thermal measurement operation; The preset thermal measurement temperature of the pressure part 2311. In the first embodiment, the temperature control part of the sleeve 232 is a temperature control flow channel with fluid The temperature-controlled flow channel is provided with a plurality of fluid ports 2324 recessed on the top surface of the jacket 232, and the plurality of fluid ports 2324 are connected to the outside of the jacket 232 for the inflow and outflow of the fluid for the gas. The fluid port 2324 is connected to the flow channel section 2325 for gas flow. The flow channel section 2325 is generally ring-shaped. In addition, a flow expansion space 2326 is provided between the flow channel section 2325 and the fluid port 2324 to increase the gas The cold and heat exchange area of the sleeve 232, because the flow channel section 2325 does not communicate with the first sleeve hole 2321, and the thickness portion between the flow channel section 2325 and the first sleeve hole 2321 can be used to form a stop member 2327 to avoid gas Flow to the lower pressure part 2311, when the sleeve 232 is fitted and assembled on the bottom surface of the crimping member 231, the crimping member 231 is used to cover the top surfaces of the plurality of fluid ports 2324 and the flow channel section 2325, Each fluid port 2324 flows into the flow channel section 2325, and then flows out from other fluid ports 2324, so that the gas in the flow channel section 2325 and the sleeve 232 are subjected to a cold and heat exchange. Furthermore, the crimper 23 is attached to the sleeve 232 is provided with at least one sensor 233 to sense the temperature of the kit 232, and transmit the sensing data to the central control device (not shown), and then adjust the temperature control component to further ensure the kit 232 Maintain the preset operating temperature.

Please refer to FIG. 4, the test device 20 of the present invention further includes a substrate 24 and a circuit board 25 , Test base 26 and testing machine 27; the base plate 24 is assembled on the bottom of a machine 30 with a port 31, the base plate 24 is made of metal, and is provided with at least one accommodating portion 241, the accommodating portion 241 is in communication Through the opening 31 of the machine 30, the base plate 24 can be directly locked to the machine 30, or can be movably mounted on the connecting plate of the machine 30. In this embodiment, the machine 30 is assembled at the hole 31 A connecting plate 32 is provided for assembling the substrate 24, and a part of the area of the top surface of the substrate 24 and the accommodating portion 241 are exposed at the opening 31.

The circuit board 25 is assembled under the substrate 24, and is equipped with an electrically connected test seat 26 at a position corresponding to the accommodating portion 241 of the substrate 24. The test seat 26 has at least one probe and is embedded in the substrate The accommodating part 241 of the 24 is exposed to the opening 31 of the machine 30 for moving electronic components to perform test operations. The test machine 27 is electrically connected to the bottom of the circuit board 25 to output the test signal to the circuit Board 25, while testing electronic components.

Please refer to Figures 5 and 6. When performing thermal testing of electronic components, the testing device 20 uses the suction nozzle 2312 of the crimper 23 to attract the electronic component 41 to be tested, and then the moving arm 21 drives the temperature operating device 22 and The crimper 23 is displaced in the Y-Z direction, so that the suction nozzle 2312 of the crimper 23 moves the electronic component 41 to be tested into the test socket 26, and presses the pressing portion 2311 against the electronic component 41 in the test socket 26 A bonding surface 2328 with a bottom of 232 and located on the periphery of the tube body portion 2322 is placed on the top surface of the substrate 24. The electronic component 41 is electrically connected to the circuit board 25 and the test machine 27 via the probe of the test base 26, due to temperature operation The temperature of the crimping part 23 to 85 ℃ of the crimping part 23 of the pressure-increasing device 23 is thermally measured. When the pressure part 2311 of the crimping part 231 presses against the electronic component 41, the electronic component 41 can simulate the high-temperature test environment at 85℃ The thermal test operation is performed in the middle; although the set 232 can reduce the high temperature of the crimping member 231 and be transmitted to the substrate 24 through the bonding surface 2328, in order to avoid the excessive heat accumulation of the set 232 and indeed prevent the circuit board 25 from being damaged, due to the set 232 The fluid port 2324 is connected to the outside, and the external air on the 23rd side of the crimper flows into the expansion space 2326 through the plurality of fluid ports 2324, and then flows into the flow channel section 2325 from the plurality of expansion spaces 2326, through the flow Gas flow in section 2325 and expansion space 2326 To make the gas and the set 232 exchange heat and cold, and then the gas is discharged through other fluid ports 2324, thereby effectively reducing the temperature of the set 232 to 65 ℃, and then use the sensor 233 to monitor the temperature of the set 232 in real time, and Sensing data is transmitted to the central control device (not shown) to quickly adjust the temperature of the kit 232; therefore, not only can the kit 232 be prevented from excessive heat accumulation, but also to prevent the circuit board 25 from being damaged and achieve improved test quality And cost-effective practical benefits.

Please refer to FIG. 7, which is the second embodiment of the crimper 23 of the present application. The difference from the first embodiment is that the crimper 23 is provided with at least one between the sleeve 232 and the crimping member 231. Spacer ribs 234 to raise a space between the sleeve 232 and the crimping member 231, this space forms a temperature control component which is a temperature control flow channel 235, the temperature control flow channel 235 can be used for external air flow , In order to prevent the kit 232 from excessive heat accumulation and high temperature conduction to the circuit board and damage.

Please refer to FIG. 8, which is the third embodiment of the crimper 23 of the present application. The difference from the first embodiment is that when the sleeve 232 of the crimper 23 is made of non-insulation material, the crimping The device is coated with a temperature control component that can be a heat dissipation material at a position (such as the top surface) of the sleeve 232 that is different from the first sleeve hole 2321. The heat dissipation material is a heat dissipation paint 236, and the heat dissipation paint 236 is used in the sleeve 232 A heat insulation layer is formed on the top surface to block the high temperature of the crimper 23 from being transmitted to the circuit board through the substrate, thereby preventing the sleeve 232 from excessively accumulating heat and transmitting the high temperature to the circuit board to be damaged.

Please refer to Figures 2, 3, and 9, the crimper 23 of the test device 20 of the present invention is applied to the test classification equipment, which includes the machine 30, the feeding device 50, the receiving device 60, and the crimper 23 of the present invention The testing device 20, the conveying device 70 and the central control device (not shown in the figure); the feeding device 50 is configured on the machine 30, and is provided with at least one feeding receiver 51 to hold the electronic device to be tested Components; the receiving device 60 is configured on the machine 30, and is provided with at least one receiving receiver 61, to receive the electronic components tested; the test device 20 of the present invention is configured on the machine 30, and set There are moving arm 21, temperature working device 22, crimper 23, substrate 24, circuit board 25 and test base 26 to test electronic components and temperature-controlled crimper 23. In this embodiment, the test device 20 is provided The two moving arms 21 and 21A in the Y-Z direction are used to drive the two temperature working devices 22 and 22A and the two crimpers 23 and 23A respectively. The base plate 24 is assembled on the machine 30 and the circuit board 25 is assembled. The substrate 24 is electrically connected to the test base 26; the conveying device 70 is arranged on the machine 30, and is provided with at least one feeder to transfer electronic components. In this embodiment, a working X- The first material shifter 71 in the Y-Z direction is displaced to take out the electronic components to be tested from the material supply holder 51 of the material supply device 50 and transfer it to the first material loading stage 72 and the second material loading carrier Taiwan 73 , The first feed carrier 72 and the second feed carrier 73 carry the electronic components to be tested to the refueling position for the test device 20's second crimper 23, 23A to take the material, the second crimper 23, 23A respectively transfers and presses the electronic components to be tested on the test base 26 to perform the test operation, and prevents the high temperature from being transmitted to the circuit board 25 through the substrate 24, so that the circuit board 25 accurately performs the test operation. The connectors 23 and 23A transfer the measured electronic components of the test base 26 to the first discharge stage 74 and the second discharge stage 75, and the first discharge stage 74 and the second discharge stage 75 carry out The tested electronic components, the second feeder 76 of the conveyor 70 takes out the tested electronic components at the first discharge carrier 74 and the second discharge carrier 75, and according to the test results, the measured electronic components It is transported to the receiving device 61 of the receiving device 60 to be sorted and collected; the central control device is used to control and integrate the actions of each device to perform automated operations to achieve the practical benefits of improving operating efficiency.

[Xizhi]

11‧‧‧machine

12‧‧‧ substrate

121‧‧‧Accommodation Department

13. Circuit board

14‧‧‧ Testing machine

15‧‧‧Test Block

16‧‧‧Mobile arm

17. Heater

18‧‧‧Crimper

181‧‧‧ Lower pressure section

182‧‧‧Fit surface

[this invention]

20‧‧‧Test device

21, 21A‧‧‧Moving arm

22、22A‧‧‧Temperature working device

23, 23A‧‧‧Crimper

231‧‧‧crimping parts

2311‧‧‧Lower pressure section

2312 ‧‧‧ nozzle

232‧‧‧Set

2321‧‧‧The first set of closing holes

2322‧‧‧Body

2323‧‧‧Second set of closing holes

2324‧‧‧fluid port

2325 ‧‧‧ channel section

2326‧‧‧Expansion space

2327‧‧‧stop parts

2328‧‧‧Fit surface

233‧‧‧Sensor

234‧‧‧Spacer rib

235‧‧‧Temperature-controlled runner

236‧‧‧ Thermal paint

24‧‧‧ substrate

241‧‧‧Accommodation Department

25‧‧‧ circuit board

26‧‧‧Test Block

27‧‧‧Test machine

30‧‧‧machine

31‧‧‧port

32 connecting plate

41‧‧‧Electronic components

50‧‧‧Feeding device

51‧‧‧ Feeding support

60‧‧‧Receiving device

61.‧‧‧receiving receiver

70‧‧‧Conveying device

7.1‧‧‧First material shifter

72‧‧‧First loading stage

73‧‧‧Second loading table

74‧‧‧First discharge stage

75‧‧‧Second discharge platform

76 second feeder

Figure 1: Schematic diagram of the use of conventional test equipment. Figure 2: A schematic diagram of the first embodiment of the crimper of the testing device of the present invention. Figure 3: Top view of the kit of the present invention. Figure 4: Schematic diagram of the test device of the present invention. Figure 5: Schematic diagram of the use of the crimper of the present invention. Figure 6: Partial schematic view of the use of the crimper of the present invention. Figure 7: A schematic diagram of a second embodiment of the crimper of the present invention. Figure 8: A schematic diagram of a third embodiment of the crimper of the present invention. Figure 9: Schematic diagram of the test device of the present invention applied to test classification equipment.

20‧‧‧Test device

21‧‧‧Moving arm

22‧‧‧Temperature operating device

23‧‧‧Crimper

231‧‧‧Crimp fittings

2311‧‧‧Pressing Department

2312‧‧‧Nozzle

232‧‧‧Set

2322‧‧‧Body

2324‧‧‧fluid port

2325‧‧‧stream section

2326‧‧‧Expansion space

2328‧‧‧Fit surface

233‧‧‧sensor

24‧‧‧ substrate

25‧‧‧ circuit board

26‧‧‧Test Block

27‧‧‧Test machine

41‧‧‧Electronic components

Claims (10)

A crimping device for a testing device is provided for assembling in a testing device. The testing device includes a moving arm and the crimping device. The testing device also has a temperature working device disposed between the moving arm and the crimping device. The connector includes: a crimping piece and a sleeve, the crimping piece is provided with at least one lower pressing portion for pressing against the electronic component on the bottom surface, the sleeve is provided with at least a first sleeve closing hole, and the lower pressing portion is penetrated In the first set of fitting holes, the set is provided with at least one temperature control component, the temperature control member is configured to be separated from the first set of fitting holes, and the temperature control component is to temperature-control the temperature of the set to a preset operating temperature. The crimper of the test device according to item 1 of the scope of the patent application, wherein the temperature control part of the crimper is a temperature-controlled flow channel with fluid. The crimper of the test device according to item 2 of the patent application scope, wherein the temperature-controlled flow channel is provided with a plurality of fluid ports on the top surface of the kit, and the plurality of fluid ports are used for inflow and outflow of fluid , The plurality of fluid ports are connected to at least one flow channel section for fluid flow. According to the crimper of the test device described in item 3 of the patent application scope, a flow expansion space is provided between the flow passage section of the temperature-controlled flow passage and the fluid port. The crimping device of the test device according to item 2 of the patent application scope, wherein the crimping device is provided with at least one spacing rib between the set and the crimping member, with the rack raised at least one space as Temperature control flow channel. The crimper of the test device according to item 1 of the patent application scope, wherein the temperature control part of the crimper is a cooling chip. The crimper of the test device according to item 1 of the patent application scope, wherein the temperature control part of the crimper is a heat dissipation material. According to the crimping device of the test device described in any one of the items 1 to 7 of the patent scope, Wherein, the kit is provided with at least one sensor to sense the temperature of the kit. The crimping device of the test device according to any one of items 1 to 7 of the patent application scope, wherein the set is provided with a tube body portion with a second set of fitting holes on the bottom surface, and the lower pressing portion is penetrated The second set of closing holes. A test classification device for a crimper using a test device, including: a machine; a feeding device: the machine is assembled on the machine and is provided with at least one feeding holder to accommodate electronic components to be tested; Device: It is assembled on the machine and equipped with at least one receiving receiver to accommodate the tested electronic components; Test Device: It is equipped on the machine and equipped with a moving arm The crimping device mentioned above; the conveying device: it is assembled on the machine and equipped with at least one material shifter to transfer the electronic components; the central control device: it is used to control and integrate the actions of each device to perform automated operations .

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