TW202411671A - Temperature control mechanism, processing apparatus, and processing machine - Google Patents

Abstract

The temperature control mechanism of the present invention includes a supporter, a cooling control unit, and a heating control unit. The supporter takes the cooling control unit to move along at least one direction. The cooling control unit has a pressing member and a cooling controller. The pressing member is arranged at a side of the cooling controller for pressing the electronic component. The heating control unit has at least one heating controller which is arranged at another side of the cooling controller. During the testing process in cooling condition, the cooling controller cools the pressing member down directly so as to improve the transmission efficiency. Thus, the pressing member can be cooled down quickly. During the testing process in heating condition, the heating controller can prevent the heat loss and heats the pressing member via the cooling controller.

Description

Temperature control mechanism, operating device and operating machine

The present invention provides a temperature control mechanism that can improve cooling efficiency and save energy costs.

Nowadays, electronic components will be used in low or high temperature environments. To ensure the quality of the electronic components before they leave the factory, they must be subjected to cold or hot testing in the testing equipment to eliminate defective products. ; Please refer to Figure 1. The test device is provided with an electrically connected circuit board 11 and a test seat 12 for testing electronic components. A transfer arm 13 capable of displacement in the Z direction is arranged above the test seat 12. The transfer arm 13 is equipped with a body 14 with a flow channel 141. The flow channel 141 is for the flow of low-temperature water. A heating element 15 is installed at the bottom of the body 14. A crimping tool 16 is arranged at the bottom of the heating element 15 for crimping the electronic components of the test seat 12. According to the requirements of the cold test operation or the hot test operation, the low-temperature water in the body 14 is matched with the heating element 15 to control the temperature of the electronic components to simulate the low-temperature environment or high-temperature environment in the future to perform the cold test operation or the hot test operation.

However, during the cold test operation, the low temperature of the water in the body 14 is transferred to the electronic components. It must pass through the first cold transfer resistance between the body 14 and the heating element 15, the second cold transfer resistance between the heating element 15 and the crimping tool 16, and the third cold transfer resistance between the crimping tool 16 and the electronic components. As a result, the low temperature of the water not only reduces the cold conductivity after passing through multiple cold transfer resistances, but also gradually increases in temperature and fails to meet the preset low temperature. As a result, the industry must consume energy to inject lower temperature water into the body 14 so that the crimping tool 16 can crimp the electronic components at the preset low temperature to perform the cold test operation, resulting in poor cold conductivity and increased energy costs.

During the thermal measurement operation, since the first side of the heating element 15 is attached to the body 14 and the second side is attached to the crimping tool 16, when the heating element 15 is heated, the high temperature of the first side will be transferred to the body 14. However, the low-temperature water flowing in the body 14 will continuously carry away the high temperature when exchanging heat with the first side of the heating element 15. Therefore, the high temperature transfer of the first side of the heating element 15 is a meaningless power loss and has no effect on the thermal measurement operation, but it causes the second side to be useless. The method is to control the crimping tool 16 with a preset high temperature, that is, the crimping tool 16 cannot perform thermal measurement operations on the electronic components at the preset high temperature. In order to ensure the thermal measurement temperature of the crimping tool 16, the industry must consume energy and increase the power of the heating element 15 so that the heating element 15 can be transmitted to the crimping tool 16 at a higher temperature, so that the crimping tool 16 can perform thermal measurement operations on the electronic components at the preset high temperature, resulting in unnecessary power consumption and increased energy costs.

The first object of the present invention is to provide a temperature control mechanism, including a carrier, a cold control unit and a heat control unit. The carrier is used to assemble the cold control unit. The cold control unit is provided with a joint component and a cold controller. The joint component is provided on one side of the cold controller for joining electronic components. The cold controller is used to change the temperature of the joint component. The heat control unit is provided with at least one heat controller and is located on the other side of the cold controller. The heat controller is used to change the temperature of the joint component. In the cold test operation, the cold controller can directly and quickly transfer low temperature to the joint component to change the cold test temperature, so as to reduce the cold transfer resistance and effectively improve the cold transfer rate, so as to achieve the benefits of improving the cold control performance and saving costs.

The second object of the present invention is to provide a temperature control mechanism, wherein the thermal controller of the thermal control unit is attached to the other side of the cold controller by a heat transfer surface and conducts heat to the other side of the cold controller to change the temperature of the joint component; thereby, in the thermal measurement operation, the heat loss and unnecessary power loss of the thermal joint surface of the thermal controller can be effectively reduced, and there is no need to increase the heating power. The thermal controller conducts heat to the joint component by the heat transfer surface in combination with the cold controller, and changes the thermal measurement temperature of the joint component, thereby achieving the benefits of improving thermal control performance and saving costs.

The third object of the present invention is to provide an operating device, comprising at least one operating device and at least one temperature control mechanism of the present invention, wherein the at least one operating device is used to perform a preset operation on an electronic component, and the temperature control mechanism of the present invention comprises a carrier, a cold control unit and a heat control unit for temperature control of the electronic component to improve operating efficiency.

The fourth object of the present invention is to provide a working machine, including a machine, a feeding device, a receiving device, a working device of the present invention, a conveying device and a central control device, wherein the feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be processed; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one processed electronic component; the working device of the present invention is arranged on the machine and is provided with at least one working device and at least one temperature control mechanism of the present invention for temperature controlling the electronic components and performing preset operations on the electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying at least one electronic component; the central control device controls and integrates the actions of each device to perform automated operations.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Please refer to FIG. 2 , which shows a first embodiment of the temperature control mechanism of the present invention, including a carrier, a cold control unit and a heat control unit.

The carrier can be configured in a fixed or movable manner; further, the carrier can be a fixed frame, a transfer arm or a support, etc.; for example, the carrier is a fixed frame, and the tester (not shown) can be relatively displaced toward the carrier; for example, the carrier is a transfer arm, and can be relatively displaced toward the tester by at least one direction of displacement; and the carrier is provided with at least one connecting component for connecting to the thermal controller of the thermal control unit, and the connecting component is provided with at least one non-thermal control space at a position relative to the thermal controller; In this embodiment, the carrier is a transfer arm 21, which can be displaced in at least one direction (for example, the Y-Z direction). The transfer arm 21 is provided with a connecting component 211 downward along the working axis A. The connecting component 211 is provided with a receiving portion 212 from the bottom surface to the top surface for assembling the thermal controller of the thermal control unit. The connecting component 211 is also provided with at least one non-thermal control space 213 from the top surface to the bottom surface and relative to the receiving portion 212. The non-thermal control space 213 is connected to the receiving portion 212.

However, it is also acceptable if there is a partition wall of appropriate thickness between the non-thermal control space 213 and the accommodating portion 212 .

According to the operation requirements, the connecting component 211 of the carrier does not have a receiving portion, and the bottom surface of the connecting component 211 is connected to the thermal controller.

The cooling control unit is mounted on the carrier and is provided with at least one joint component and at least one cooling controller. The joint component is arranged on one side of the cooling controller for joining electronic components. The cooling controller is connected to the joint component and can increase the cold conductivity of the joint component to change the temperature of the joint component.

The joining component can be a crimping tool, a carrier or a press-transfer tool. For example, the crimping tool can crimp electronic components, the carrier can carry electronic components, and the press-transfer tool can be provided with suction holes for crimping and transferring electronic components. Furthermore, the joining component can be an independent component assembled on one side of the cold controller, or directly formed on one side of the cold controller.

The cooling controller is a body with low temperature fluid to change the temperature of the joint parts. For example, the body is provided with low temperature fluid (such as refrigerant or cold water) to transfer the low temperature to the joint parts. Furthermore, the cooling controller is provided with a cold transfer surface and a cold junction surface. The cold transfer surface is relative to the joint parts, and the cold junction surface is relative to the thermal controller.

In this embodiment, the cooling controller is a body 22 having a fluid. One side of the body 22 is formed downward along the working axis A with a joint part 221 having a suction hole 222. The joint part 221 can be used for pressing and connecting electronic components, and the suction hole 222 can be used to absorb and transfer electronic components. The body 22 is provided with a flow channel 223 that can flow through the joint part 221. The water inlet pipe 2231 at one end of the flow channel 223 is connected to a low-temperature water supply device (not shown) to allow low-temperature water to flow into the flow channel 223. The water outlet pipe 2232 at the other end of the flow channel 223 is used to discharge the low-temperature water after heat exchange. The body 22 is also provided with a cold transfer surface 2233 and a cold connection surface 224. Since the conveying path of the flow channel 223 bends around the top surface of the joint component 221, the inner bottom surface of the flow channel 223 and the part opposite to the joint component 221 can be used as the cold transfer surface 2233 to transfer the low temperature to the joint component 221. The cold connection surface 224 is the top surface of the body 22, opposite to the thermal controller of the thermal control unit, and is assembled under the connecting component 211 of the transfer arm 21, so that the transfer arm 21 can drive the cold control unit to move in the Y-Z direction.

The thermal control unit is provided with at least one thermal controller, and is located on the other side of the cooling controller, and is capable of changing the temperature of the joint component 221; according to the operation requirements, the thermal controller can be a body with high-temperature fluid, a heating element or a cooling chip to change the temperature of the joint component, for example, the interior of the body is provided with a high-temperature fluid (such as hot water) to flow, and the high temperature is transferred to the joint component 221, for example, the heating element transfers the high temperature to the joint component 221 through the cooling controller through the heat transfer surface, and the above methods can change the temperature of the joint component 221. Furthermore, the thermal controller is provided with a heat transfer surface and a heat junction surface, the heat transfer surface is relative to the cooling controller, and transfers the high temperature to the joint component 221 through the cooling controller, and the heat junction surface is relative to the carrier.

According to the working requirements, the thermal controller can be installed inside the connecting component 211 of the carrier, or installed between the bottom surface of the connecting component 221 and the cold controller, and is not limited to this embodiment; for example, the top surface of the body 22 of the cold controller is provided with a convex portion, and the thermal controller can be an annular heating element, and is placed on the convex portion of the body 22, and the high temperature can also be transmitted to the connecting component 221 through the body 22.

In this embodiment, the thermal controller is a heater 23, which is installed in the accommodating portion 212 of the connecting component 211 of the transfer arm 21 and is located on the other side of the body 22 of the cooler. The heater 23 has a heat transfer surface 231 on the bottom surface, which is opposite to and attached to the cold junction surface 224 of the body 22 of the cooler. The heater 23 has a heat junction surface 232 on the top surface, which is opposite to the non-thermal control space 213 of the connecting component 211.

Depending on the work requirements, during the thermal test, the temperature of the low-temperature water in the cooling controller can be close to room temperature to improve the heat conduction of the thermal controller.

According to the operation requirements, the connecting component 221 or the main body 22 can be equipped with at least one temperature sensor to sense the actual test temperature; further, the temperature sensor can transmit the sensing data to a processor (not shown), and the processor determines and analyzes whether the actual test temperature of the connecting component 221 meets the preset test temperature. In this embodiment, a temperature sensor is provided on one side of the suction hole 222 of the connecting component 221.

Please refer to Figures 3 and 4. The operating device includes at least one operating device and at least one temperature control mechanism of the present invention. At least one operating device is used to perform a preset operation on the electronic component. The operating device can be a tester or a picker. In this embodiment, the operating device is a test device. The test device is provided with an operating device that can be a tester on the machine 30. The tester is provided with an electrically connected circuit board 41 and a test seat 42. The test seat 42 has a probe for holding and testing electronic components. The temperature control mechanism of the present invention is arranged above the tester. The transfer arm 21 drives the cold control unit and the heat control unit to move in the Y-Z direction to transfer and press the electronic components of the test seat 42.

During the cold test of electronic components, the temperature control mechanism can turn off the heating element 23 of the heat control unit, or lower the heating temperature and control the temperature with a low-temperature fluid to reduce the heat exchange between the heating element 23 and the cold controller. The body 22 of the cold control unit inputs low-temperature water into the flow channel 223 through the water inlet pipe 2231. Since the cold controller uses the portion of the flow channel 223 opposite to the joint component 221 as the cold transfer surface 2233, and the cold transfer surface 2233 is directly connected to the joint component 221, when the low-temperature water flows along the flow channel 223 to the area of the cold transfer surface 2233, the cold transfer surface 2233 can transfer the low-temperature water to the cold transfer surface 2233. The low temperature is directly transferred to the joint component 221, which not only reduces multiple cold transfer resistances and effectively improves the cold conductivity, but also improves the cold control performance and saves costs. After the suction hole 222 of the joint component 221 adsorbs the electronic component 31, the transfer arm 21 drives the main body 22, the heating element 23 and the electronic component 31 to move downward along the operating axis A through the connecting component 211, and presses the electronic component 31 to the test seat 42. Since the joint component 221 has a preset test low temperature, the electronic component 31 can be placed in a low-temperature environment that simulates future use to perform a cold test operation, thereby improving the test quality.

During the thermal measurement of electronic components, the cooling unit can inject a relatively high temperature low temperature fluid into the flow channel 223 of the body 22. The temperature of the low temperature fluid can be close to room temperature to reduce the heat taken away by the low temperature fluid flowing in the flow channel 223. Since the heat junction 232 of the heating element 23 is relative to the non-heat control space 213, the non-heat control space 213 is a space, which can reduce the heat exchange of the heat junction 232 to reduce the Low power consumption means that the heater 23 can be driven with lower power, thereby saving energy costs. The heater 23 contacts the cold junction 224 of the body 22 with the heat transfer surface 231, so that the high temperature of the heater 23 is transferred to the joint component 221 through the body 22, so that the joint component 221 has a preset test high temperature. After the suction hole 222 of the joint component 221 absorbs the electronic component 31, the transfer arm 21 drives the body 22, the heater 23 and the electronic component 31 to move downward along the working axis A with the connecting component 211, and presses the electronic component 31 to the test seat 42. Since the joint component 221 has a preset test high temperature, the electronic component 31 can be placed in a high temperature environment that simulates future use to perform thermal testing operations to improve test quality.

Please refer to Figure 5. The second embodiment of the temperature control mechanism of the present invention is designed in a similar manner to the first embodiment. The difference between the second embodiment and the first embodiment is that the joint component 24 of the cold control unit is an independent component. Its top surface 241 is attached to the cold transfer surface 2233 of the body 22, and the bottom surface 242 is used to connect the electronic components. According to the operation requirements, different types of joint components 24 can be assembled or replaced on the cold transfer surface 2233 of the body 22. In this embodiment, the joint component 24 is provided with at least one suction hole 243, so that the electronic components can be taken in and pressed.

Please refer to FIG. 6 . The third embodiment of the temperature control mechanism of the present invention is substantially similar to the second embodiment. The difference between the second embodiment and the third embodiment is that the carrier is a support, which can be fixed or movable. According to the operation requirements, the thermal controller can be coated with at least one heat insulating member at least one other part other than the heat transfer surface 231 to prevent heat loss, thereby reducing heating power and saving energy costs. In this embodiment, the support 25 can be displaced in at least one direction, and a connecting component 251 is provided upward along the working axis A for assembling a thermal controller as a heating element 23 and connecting to the body 22 of the cooling control unit. The heating element 23 is coated with a heat insulating component 233 at other parts except the heat transfer surface 231 to prevent heat loss. The flow channel 223 of the body 22 is used for the flow of low-temperature fluid, and the cold connection surface 224 is attached to the top surface of the heating element 23 and the connecting component 251. The cold transfer surface 231 of the body 22 is provided to prevent heat loss. The surface 2233 is connected to a connecting component which is a carrier 26. The carrier 26 has a receiving portion 261 for receiving electronic components. The receiving portion 261 can be a receiving groove or a plane with a suction hole. In this embodiment, the receiving portion 261 is a receiving groove for receiving electronic components. The carrier 25 utilizes a connecting component 251 to drive the main body 22, the heating element 23 and the carrier 26 to perform horizontal displacement, and carry the electronic components to different working positions, and can temperature-control the electronic components on the carrier 26 to be in a pre-temperature test environment.

Please refer to Figure 7. The fourth embodiment of the temperature control mechanism of the present invention is designed in a similar manner to the second embodiment. The difference between the fourth embodiment and the second embodiment is that the body 22 of the cold controller has a through hole 225 connected to the flow channel 223 on the cold junction surface 224 to accommodate the heater 23. The heat transfer surface 231 of the heater 23 is connected to the flow channel 223. There is no wall thickness between the heat transfer surface 231 of the heater 23 and the flow channel 223. The heat transfer surface 231 can directly contact the fluid, thereby improving the heat transfer efficiency. The heat junction surface 232 of the heater 23 is opposite to a connecting component 211 of the carrier of the transfer arm 21. In addition, the heater 23 is coated with a heat insulation component 233 at other parts except the heat transfer surface 231 to prevent heat loss.

Please refer to Figures 2-4 and 8. The operating device of the present invention is applied to an electronic component operating machine, which includes a machine 30, a feeding device 50, a receiving device 60, an operating device, a conveying device 70 and a central control device (not shown); the feeding device 50 is mounted on the machine 30 and is provided with at least one feeder to accommodate at least one electronic component to be processed; the receiving device 60 is mounted on the machine 30 and is provided with at least one receiving device , to accommodate at least one electronic component that has been processed; the operating device is configured on the machine 30 and is provided with at least one operating device and at least one temperature control mechanism of the present invention, and at least one operating device is used to perform a preset operation on the electronic component , the operator can be a tester or a picker, etc.; in this embodiment, the operating device is a test device, the operating device is a tester, the tester is provided with an electrically connected circuit board 41 and a test seat 42, the test seat 42 has a probe for holding and testing electronic components, the temperature control mechanism of the present invention is arranged above the tester, and is provided with a carrier, a cold control unit and a heat control unit for temperature control and crimping electronic components; the conveying device 70 is mounted on the machine 30, and is provided with at least one conveyor to convey electronic components. In this embodiment, the conveying device 70 is provided with a first conveyor 71 to take out the electronic components to be tested from the feeder of the feeding device 50 and transfer them to the second conveyor 72. The second conveyor 72 carries the electronic components to be tested to the side of the operating device. In this embodiment The transfer arm 21 of the temperature control mechanism drives the cold control unit and the heat control unit to move in the Y-Z direction, takes out the electronic component to be tested from the second conveyor 72, and transfers it to the test seat 42, and presses the electronic component to be tested with the joint component 221 of the cold control unit. According to the operation requirements, the cold control unit and the heat control unit are used to place the electronic component to be tested in a simulated future application temperature environment to perform cold testing or heat testing. The temperature control mechanism then transfers the tested electronic component to the test seat 42. The subcomponents are moved into the third conveyor 73 of the conveyor device 70 and unloaded. The fourth conveyor 74 of the conveyor device 70 takes out the tested electronic components from the third conveyor 73. According to the test results, the tested electronic components are transported to the receiver of the receiving device 60 for classification and storage. The central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve practical benefits of improving operation efficiency.

[Knowledge] 11: Circuit board 12: Test seat 13: Transfer arm 14: Body 141: Flow channel 15: Heating element 16: Pressing tool [Invention] 21: Transfer arm 211: Connecting component 212: Accommodating portion 213: Non-thermal control space 22: Body 221: Joint component 222: Suction hole 223: Flow channel 2231: Water inlet pipe 2232: Water outlet pipe 2233: Cold transfer surface 224: Cold junction surface 225: Perforation 23: Heating element 231: Heat transfer surface 232: Heat junction surface 233: Heat insulation component 24: Joint component 241: Top surface 242: Bottom surface 243: Suction hole 25: Supporting platform 251: Connecting component 26: Carrier 261: Supporting part A: Working axis 30: Machine 31: Electronic component 41: Circuit board 42: Test seat 50: Feeding device 60: Receiving device 70: Conveying device 71: First conveyor 72: Second conveyor 73: Third conveyor 74: Fourth conveyor

Figure 1: Schematic diagram of the use of the learning test device. Figure 2: Schematic diagram of the first embodiment of the temperature control mechanism of the present invention. Figure 3: Schematic diagram of the temperature control mechanism of the present invention applied to the working device. Figure 4: Schematic diagram of the use of the temperature control mechanism of the present invention. Figure 5: Schematic diagram of the second embodiment of the temperature control mechanism of the present invention. Figure 6: Schematic diagram of the third embodiment of the temperature control mechanism of the present invention. Figure 7: Schematic diagram of the fourth embodiment of the temperature control mechanism of the present invention. Figure 8: Configuration diagram of the working device of the present invention applied to the working machine.

21: Transfer arm

211: Connecting parts

213: Non-thermally controlled space

22: Body

221:Jointing parts

222: Suction hole

223: Runner

2231: Water inlet pipeline

2233: Cold noodles

224: Cold joint

23: Heating element

231: Heat transfer surface

232: Hot joint

A: Working axis

31: Electronic components

42: Test seat

Claims (10)

A temperature control mechanism comprises: a carrier; a cold control unit: mounted on the carrier and provided with at least one joint component and at least one cold controller, the joint component is arranged on one side of the cold controller for joining electronic components, the cold controller is connected to the joint component and can increase the cold conductivity of the joint component to change the temperature of the joint component; a heat control unit: provided with at least one heat controller and located on the other side of the cold controller, and can change the temperature of the joint component. As described in claim 1, the temperature control mechanism, wherein the cold controller is provided with a cold transfer surface on one side and a cold junction surface on the other side, the cold transfer surface is relative to the connecting component, the cold junction surface is relative to the thermal controller, the thermal controller is provided with a heat transfer surface and a hot junction surface, the heat transfer surface is relative to the cold junction surface of the cold controller, and the hot junction surface is relative to the carrier. As described in claim 2, the temperature control mechanism, wherein the cold controller is a body with a flow channel for flowing fluid, and the body is provided with the cold transfer surface on one side and the cold junction surface on the other side. The temperature control mechanism as described in claim 3 has a main body having at least one through hole connected to the flow channel on the cold junction surface for accommodating the thermal controller, and the heat transfer surface of the thermal controller contacts the fluid in the flow channel. The temperature control mechanism as described in any one of claims 2 to 4, wherein the thermal controller is covered with at least one thermal insulation member at at least one other portion other than the heat transfer surface. The temperature control mechanism as described in any one of claims 1 to 4, wherein the carrier is provided with a connecting component for connecting to the thermal controller, and the connecting component is provided with at least one non-thermal control space at a position relative to the thermal controller. In the temperature control mechanism described in any one of claims 1 to 4, the carrier can be fixed or displaced in at least one direction. The temperature control mechanism as described in any one of claims 1 to 4, wherein the joining component is a carrier, a press-fitting device or a press-transfer device. A working device, comprising: At least one operating device: for performing a preset operation on an electronic component; At least one temperature control mechanism as described in claim 1: for temperature control and bonding of the electronic component. A kind of operating machine, comprising: a machine; a feeding device: arranged on the machine, and provided with at least one feeder for accommodating at least one electronic component to be processed; a receiving device: arranged on the machine, and provided with at least one receiving device for accommodating at least one processed electronic component; at least one operating device as described in claim 9: arranged on the machine, for performing a preset operation on the electronic component; a conveying device: arranged on the machine, and provided with at least one conveyor for conveying at least one electronic component; a central control device: for controlling and integrating the actions of each device to perform automated operations.