TWI403732B - Semiconductor component testing sub-press under pressure device - Google Patents

Abstract

The present invention provides a press-in head apparatus for semiconductor device test handler, in which the press-in head apparatus includes a press contact mechanism and a heat conduction mechanism. The press contact mechanism is configured with a press-in bar, which may be displaced up and down, and the press-in bar may drive a press-in jig to press contact with the semiconductor device. The heat conduction mechanism is assembled between the press-in bar of the press contact mechanism and the press-in jig, and comprises a heat exchange body and a heat conduction plate. The top surface of the heat exchange body is connected to the press-in bar, and its bottom surface is configured with a heat conduction plate, below which is connected with the press-in jig. In which, the bottom surface of the heat exchange body is recessed with a hollow chamber, and the middle of the top surface of the chamber is configured with a water inlet, which allows cooling fluid to flow into. The periphery of the chamber is configured with a plurality of water outlets. The top surface of the heat conduction plate is configured with fins as an array, and the fins are accommodated within the chamber of the heat exchange body. In this way, when the press-in jig is pressed contact with the semiconductor device, the cooling fluid may be evenly distributed from the central hot spot position toward the periphery, so as to proceed full-scale cold/heat exchange with the fins of the heat conduction plate, and further greatly enhance the cooling performance during testing, thereby achieving the practical benefits for ensuring testing quality.

Description

Indenter device under semiconductor component test sorter

The present invention provides a head unit that can greatly improve the cooling performance during testing to ensure the quality of the test.

Nowadays, after the fabrication of semiconductor components (such as ICs), they will be tested on the test sorter to test the defective products. Take the IC test sorter as an example. The test equipment of the test sorter is configured above. There is a lower pressure head device, and the lower pressure head device is provided with a crimping mechanism capable of pressing down the IC, so that the contact point of the IC does contact the test socket to perform the test operation, and the IC will be fast when performing the test operation. Producing self-heating, which exceeds the preset test temperature range and affects the test yield. To prevent the IC from overheating, the manufacturer is equipped with a heat conduction mechanism that reduces the IC temperature on the indenter device under the test sorter to ensure IC test. quality.

Please refer to FIGS. 1 and 2 , which are schematic diagrams of the test device 10 and the lower indenter device 20 . The test device 10 is provided with at least one circuit board 11 with a test socket 12 , and the pressure head device is located above the test device 10 . The 20 series includes a crimping mechanism having a lower pressing rod 21 and a lower pressing jig 22, and a heat transfer mechanism assembled between the lower pressing rod 21 and the lower pressing jig 22, the heat conducting mechanism including the heat exchange body 23 and the cooling The inside of the heat exchange body 23 is provided with an S-shaped flow channel 231 having a plurality of partitions 232. One end of the S-shaped flow channel 231 is connected to the inlet pipe 233 for inputting cooling water, and the other end is connected to the output cooling. The water outlet pipe 234 is further provided with a cover 235 on the top surface of the heat exchange body 23, and the cover 235 is coupled to the lower pressing rod 21, and the heat releasing end of one end of the cold chip 24 is attached to the heat exchange body. 23, the other end of the end of the heat is assembled with the lower pressing fixture 22; please refer to Figures 3 and 4, when the test socket 12 is placed on the IC13 to be tested, the lower pressing rod 21 can be controlled to drive the heat conduction mechanism and press down The jig 22 is synchronously lowered, and the lower pressing jig 22 is pressed against the IC 13 to be tested to perform the test. At this time, the water inlet pipe 233 of the heat exchange body 23 transports the cooling water liquid into the flow path 231, and causes the cooling water liquid to flow along the flow path of the S-type flow path 231 toward the water outlet pipe 234, since the IC 13 is tested. The generated self-heating system is conducted to the heat absorbing end of the cooling chip 24 via the pressing tool 22, and the heat absorbing end of the cooling chip 24 is cooled by the heat releasing end, and the heat exchange body 23 can be utilized. The cooling water liquid is subjected to a cold heat exchange with the heat releasing end of the cooling chip 24, so that the test of the IC 13 is maintained within a preset test temperature range; however, the flow path 231 of the heat exchange body 23 for the cooling water liquid flow is only a single To the S-type flow path, since the self-heating temperature of the IC13 intermediate position is the highest, when the water flows through the previous path, it is still lower than the front part of the exothermic end of the refrigerating wafer 24 because the initial water temperature is low. Good cold and heat exchange, but when the water flows to the middle and rear sections, the water temperature of the water has gradually increased, that is, it cannot be exchanged with the middle and the rear part of the heat release end of the cooling chip 24, and Reduce heat exchange efficiency, so that the cold wafer 24 cannot IC13 effect lowering the temperature of the neutral position, therefore a heat conduction mechanism must be improved.

Therefore, how to design a lower indenter device for improving the cooling efficiency and ensuring the quality of the test of the semiconductor component tester is the standard developed by the industry.

A first object of the present invention is to provide a pressure head device under the semiconductor component test sorting machine, which is provided with a heat conduction mechanism between the pressure bar and the lower pressure fixture under the pressure bonding mechanism, the heat conduction mechanism having a heat exchange body and heat conduction The top surface of the heat exchange body is connected to the lower pressing rod, and the bottom surface is provided with a heat conducting sheet connecting the lower pressing fixture, wherein the bottom surface of the heat exchange body is concavely provided with a hollow chamber, and is accommodated A water inlet into the cooling fluid is opened in the middle of the top surface of the chamber, and a plurality of water outlets are arranged around the chamber. The top surface of the heat conducting sheet is provided with array fins and the fins are placed in the heat. When the lower pressing fixture is crimped to the semiconductor component, the cooling fluid can be uniformly spread from the middle hot spot to the surrounding, so as to perform comprehensive cold and heat exchange with the fin of the heat conducting sheet, thereby greatly improving the test. The cooling efficiency of the time achieves the practical benefit of ensuring the quality of the test.

A second object of the present invention is to provide a pressing device for a semiconductor component test sorting machine, which is provided with a heat conducting mechanism between the pressing bar and the lower pressing jig under the crimping mechanism, the heat conducting mechanism having a heat exchange body and heat conduction a sheet and a cooling chip, wherein a top surface of the heat exchange body is coupled to the lower pressing rod, and a heat conducting sheet is disposed on the bottom surface, and a cooling wafer connecting the lower pressing fixture is further disposed under the heat conducting sheet, wherein the heat exchange body The bottom surface is recessed with a hollow chamber, and a water inlet for flowing into the cooling fluid is opened at a middle position of the top surface of the chamber, and a plurality of water outlets are opened around the chamber, and the top surface of the heat conducting sheet is set The fins of the array are arranged and the fins are accommodated in the chamber of the heat exchange body, so that when the pressing tool is crimped to the semiconductor component, the cooling fluid can be uniformly spread from the central hot spot to the surrounding area to be cooled The fins of the heat conduction sheet above the heat release end of the wafer are subjected to comprehensive cold and heat exchange, thereby greatly improving the cooling performance during the test, and achieving the practical benefit of ensuring the test quality.

In order to make the reviewer further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, which will be described in detail later. Referring to FIG. 5, the test sorting machine of the present invention is provided on the machine. a feeding device 30, a receiving device 40, an empty device 50, a plurality of testing devices 60 and a conveying device 70, the feeding device 30 is provided with at least one tray 31 for receiving a plurality of semiconductor components to be tested. The receiving device 40 is provided with a plurality of trays 41 for receiving different levels of the completed semiconductor components, such as good semiconductor components, secondary semiconductor components and defective semiconductor components. The empty tray 31 of the feeding device 30 is housed, and the empty tray 31 is placed at the receiving device 40 for receiving the tested semiconductor components, and each testing device 60 is provided with at least one test socket. a circuit board 61 of 62 for receiving the semiconductor component to be tested, and transmitting the test result to a central control unit (not shown), wherein the central control unit controls the operation of each device, and the transport device 70 is provided with the first The transfer arm 71, the second transfer arm 72 and the stage 73, The first transfer arm 71 is provided with a pick-and-placer 711 capable of XYZ axial displacement for transferring the test/testing between the feeding device 30, the receiving device 40, the open device 50 and the stage 73. The semiconductor component, the second transfer arm 72 is provided with a pick-and-placer 721 capable of XYZ axial displacement, for transferring the semiconductor component to be tested/finished between the stage 73 and each test device 60, the load The stage 73 can be displaced in the Y direction for carrying the semiconductor component to be tested/tested between the first transfer arm 71 and the second transfer arm 72, and is disposed above the test seat 62 of the test device 60. There is a corresponding lower pressure device 80; please refer to Figures 6, 7, and 8, the lower pressing device 80 includes a crimping mechanism and a heat conducting mechanism, and the crimping mechanism is provided with a lowering and lowering pressing lever 81. The lower pressing rod 81 drives a press-fit semiconductor element under the pressing fixture 82. The heat conducting mechanism is mounted under the pressing rod 81 under the crimping mechanism, and includes a heat exchange body 83 and a heat conducting sheet 84. The bottom surface of the exchange body 83 is recessed with a hollow chamber 831 which is attached to the top surface of the semiconductor component hot spot corresponding to the test. The water inlet 832 is provided with a water inlet 832. In the embodiment, the water inlet 832 is disposed at an intermediate position of the top surface of the chamber 831, and the water inlet 832 is connected to a side of the heat exchange body 83 and can be supplied with cooling water. a fluid inlet pipe 833 for fluids, gas, and the like, and a plurality of water outlets 834 are disposed around the chamber 831. The water outlets 834 can communicate with a fluid output pipe 837 located on the other side of the heat exchange body 83. Each of the water outlets 834 is connected to the flow guiding groove 835 at the top surface of the heat exchange body 83. Each of the water guiding grooves 835 is connected to a discharge port 836, and the discharge port 836 is connected to the heat exchange body 83 to be in a heat. The fluid output tube 837 on the other side of the body 83 is configured to output the cooling fluid after the hot and cold exchange, and then a cover 838 for preventing fluid leakage is disposed on the top surface of the heat exchange body 83, and is connected by the cover 838. The lower surface of the pressing rod 81 and the bottom surface of the heat conducting sheet 84 can press the semiconductor element under test to contact the heat source of the conductive semiconductor element. In this embodiment, the bottom surface of the heat conducting sheet 84 further includes a connection. Pressure fixture 82 And pressing the tested semiconductor component with the pressing fixture 82 to contact the heat source of the conductive semiconductor component, and then conducting the heat source to the heat conducting sheet 84, and the top surface of the other heat conducting sheet 84 is mounted on the heat exchange body 83. The top surface of the heat conducting sheet 84 is further provided with an array of fins 841, and the fins 841 are received in the chamber 831 of the heat exchange body 83.

Referring to FIGS. 9 and 10, when the pressing lever 81 under the lower pressing device 80 drives the heat conducting mechanism and the lower pressing fixture 82 to be displaced downward in the Z-axis direction, the pressing fixture 82 is pressed against the semiconductor component 90 for testing operation. Since the semiconductor component 90 will rapidly generate self-heating when performing a test operation, the lower press fixture 82 conducts the high temperature of the semiconductor component 90 to the heat conduction sheet 84 and the fin 841 of the heat conduction mechanism. At this time, the heat conduction mechanism The fluid input pipe 833 can transport the cooling fluid to the heat exchange body 83. In the present embodiment, the cooling water liquid is delivered into the heat exchange body 83, and the cooling water liquid is injected into the heat inlet body 832 at the intermediate position. In the chamber 831, since the water inlet 832 is at the intermediate position, the cooling water liquid can be first exchanged with the fins 841 of the intermediate hot spot portion of the semiconductor component to be tested corresponding to the heat conduction sheet 84, and the semiconductor element 90 can be greatly reduced. The high temperature of the hot spot is then designed by using the water outlets 834 dispersed around the chamber 831 so that the water flows radially from the intermediate position to the periphery, and can be adjacent to the heat conducting sheet 84. The sheet 841 is used for large-area and uniform cold-heat exchange to reduce the high temperature of the peripheral portion of the semiconductor element 90, thereby improving the cooling performance of the heat conduction mechanism, and uniformly cooling the semiconductor element 90; then the heated liquid water flows from each water outlet 834. The flow guiding groove 835 on the top surface of the heat exchange body 83 is recirculated to the discharge port 836, and is discharged into the fluid output pipe 837, and the liquid output pipe 657 outputs the water liquid.

Referring to FIG. 11, another embodiment of the heat transfer mechanism of the lower indenter device of the present invention includes a heat exchange body 83, a heat conduction sheet 84, and a cooling wafer 85. The bottom surface of the heat exchange body 83 is recessed. The chamber 831 is provided with a water inlet 832 for inflowing a cooling fluid at a position corresponding to the hot spot of the semiconductor element to be tested. In the embodiment, the water inlet 832 is disposed at the top of the chamber 831. In the middle of the surface, the water inlet 832 is connected to a fluid input pipe 833 located on the side of the heat exchange body 83 and capable of inputting a fluid such as water, gas or the like, and a plurality of water outlets 834 are opened around the chamber 831, and the water outlets are respectively provided. 834 is a flow guiding groove 835 connected to the top surface of the heat exchange body 83. One end of each of the guiding grooves 835 is merged with a discharge port 836. The discharge port 836 is communicated inside the heat exchange body 83 to the heat exchange body 83. The fluid output tube 837 on the other side is configured to output the cooling fluid after the heat exchange, and then the top surface of the heat exchange body 83 is assembled with a cover 838 for preventing fluid leakage, and the sealing member 838 is connected to the crimping mechanism. Pressing lever 81, again The top surface of the heat conducting sheet 84 is mounted on the heat exchange body 83. The top surface of the heat conducting sheet 84 is provided with an array of fins 841, and the fins 841 are received in the chamber 831 of the heat exchange body 83. The bottom surface of the heat conducting sheet 84 is equipped with a cooling wafer 85. The heat releasing end of the cooling chip 85 is attached to the heat conducting sheet 84, and the heat absorbing end can press the semiconductor element under test to contact the heat source of the conductive semiconductor element. In this embodiment, the heat absorbing end of the refrigerating wafer 85 further includes a lower pressing fixture 82, and the lower pressing fixture 82 presses down the tested semiconductor component to contact the heat source of the conducting semiconductor component, and then The heat source is conducted to the heat absorbing end of the chilled wafer 85; refer to FIG. 12, the semiconductor element 90 is pressed by the pressing rod 81 under the crimping mechanism to drive the lower pressing fixture 82 against the semiconductor component 90 to be tested. The generated self-heating can be conducted to the heat absorbing end of the chilled wafer 85 via the lower pressing jig 82, and the heat absorbing end of the chilling chip 85 is subjected to cold heat exchange so that the semiconductor element 90 can be maintained within a preset test temperature range. And the cold side of the cold wafer 85 The high temperature is transmitted to the fin 841 of the heat conducting sheet 84. At this time, the fluid input pipe 833 of the heat exchange body 83 can input the cooling water liquid, and the cooling water liquid is injected into the chamber 831 through the water inlet 832 located at the intermediate position. The cooling water liquid can be cooled and exchanged with the fins 841 of the intermediate hot spot portion of the semiconductor component to be tested corresponding to the heat conducting sheet 84, so that the intermediate hot spot of the heat releasing end of the cooling wafer 85 is greatly cooled, so that the cooling wafer is cooled. The middle portion of the heat absorbing end of the 85 is rapidly cooled, and then the cooling liquid flows radially from the intermediate position to the respective water outlets 834 of the periphery, and is exchanged with the peripheral portion of the fin 841 of the heat conducting sheet 84 for heat exchange to make the cold wafer 85. The peripheral portion of the heat releasing end uniformly dissipates heat, and then the water of each water outlet 834 flows into the flow guiding groove 835 at the top surface of the heat exchange body 83, and is discharged to the discharge port 836, and then discharged into the fluid output pipe 837 to make the fluid The output pipe 837 outputs water liquid, which is a practical benefit of improving the cooling performance.

Accordingly, the indenter device under the semiconductor component test sorting machine of the present invention can greatly improve the cooling performance, thereby improving the test quality and the production performance, and is actually a practical and progressive design, but no identical product is found. And publications are published, so that the requirements for invention patent applications are allowed, and applications are filed according to law.

[Literature]

10. . . Test device

11. . . Circuit board

12. . . Test stand

13. . . Semiconductor component

20. . . Lower press device

twenty one. . . Lower pressing rod

twenty two. . . Pressing fixture

twenty three. . . Hot swap body

231. . . Runner

232. . . Partition

233. . . Water inlet pipe

234. . . Outlet pipe

235. . . Cover

twenty four. . . Cooling chip

[this invention]

30. . . Feeding device

31. . . Trays

40. . . Receiving device

41. . . Trays

50. . . Open device

60. . . Test device

61. . . Circuit board

62. . . Test stand

70. . . Conveyor

71. . . First transfer arm

711. . . Pick and place

72. . . Second transfer arm

721. . . Pick and place

73. . . Loading platform

80. . . Lower press device

81. . . Lower pressing rod

82. . . Pressing fixture

83. . . Hot swap body

831. . . Room

832. . . water inlet

833. . . Fluid input tube

834. . . Outlet

835. . . Guide groove

836. . . exhaustion hole

837. . . Fluid output tube

838. . . Cover

84. . . Thermal conduction sheet

841. . . Fin

85. . . Cooling chip

90. . . Semiconductor component

Fig. 1 is a schematic view showing the arrangement of a crimping mechanism and a heat conducting mechanism of a conventional lower pressing device.

Figure 2: An exploded view of the part of the conventional heat transfer mechanism.

Figure 3: Schematic diagram of the use of the conventional crimping mechanism and heat transfer mechanism.

Figure 4: Schematic diagram of the cooling water flow of the conventional heat transfer mechanism.

Fig. 5 is a schematic view showing the configuration of each device of the test sorting machine of the present invention.

Figure 6 is an exploded view of the lower pressing device of the present invention.

Figure 7 is a schematic view showing another angle of the heat exchange body of the heat transfer mechanism of the present invention.

Figure 8 is a schematic view showing the assembly of the lower indenter device of the present invention.

Figure 9: Schematic diagram of the use of the present invention (1).

Figure 10: Schematic diagram of the use of the present invention (2).

Figure 11 is a schematic view showing another embodiment of the lower indenter device of the present invention.

Figure 12 is a schematic view showing the use of another embodiment of the lower indenter device of the present invention.

80. . . Lower press device

81. . . Lower pressing rod

82. . . Pressing fixture

83. . . Hot swap body

831. . . Room

832. . . water inlet

833. . . Fluid input tube

834. . . Outlet

835. . . Guide groove

836. . . exhaustion hole

837. . . Fluid output tube

838. . . Cover

84. . . Thermal conduction sheet

841. . . Fin

90. . . Semiconductor component

Claims (10)

a pressing device for a semiconductor component test sorting machine, which is disposed above the testing device and includes a crimping mechanism and a heat conducting mechanism, wherein the crimping mechanism is provided with at least one lowering and lowering pressing bar; heat conduction The mechanism is disposed under the pressure bar below the pressure bar, and has a heat exchange body and a heat conduction plate with fins. The top surface of the heat exchange body is provided with a pressure bar under the pressing mechanism, and is provided with a detachable rod. The chamber of the fin is further provided with a water inlet of at least one phase-containing chamber at a hot spot corresponding to the semiconductor element to be tested, and at least one water outlet is opened around the chamber, and the bottom surface of the heat conducting sheet is in contact with the conductive semiconductor The heat source of the component is provided with fins on the top surface, and is assembled and coupled to the heat exchange body, and the fins are received in the chamber of the heat exchange body. The indenter device under the semiconductor component test sorting machine according to claim 1, wherein the heat transfer mechanism is recessed inside the heat exchange body and has a hollow chamber, and is located in the middle of the top surface of the chamber The water inlet is provided, and the water inlet is connected to a fluid input pipe located on the side of the heat exchange body. The indenter device of the semiconductor component test sorting machine according to the second aspect of the patent application, wherein the heat exchange body of the heat transfer mechanism has a water outlet connected to a guide groove of a top surface of the heat exchange body. The flow cell is merged to a discharge port which is in communication with a fluid outlet tube located on the other side of the heat exchange body. The indenter device of the semiconductor component test sorting machine according to the third aspect of the invention, wherein the heat transfer mechanism further comprises a cover on the top surface of the heat exchange body, and the crimping mechanism is connected by the cover. Press down the lever. The under-press device of the semiconductor component test classification machine according to claim 1, wherein the heat conduction plate bottom surface of the heat conduction mechanism further comprises a lower pressing fixture, and the lower pressing device is pressed to test the semiconductor. The component contacts the heat source of the conductive semiconductor component and conducts the heat source to the heat conductive sheet. a pressing device for a semiconductor component test sorting machine, which is disposed above the testing device and includes a crimping mechanism and a heat conducting mechanism, wherein the crimping mechanism is provided with at least one lowering and lowering pressing bar; heat conduction The mechanism is disposed under the pressing rod under the crimping mechanism, and has a heat exchange body, a heat conducting sheet with fins and a cooling chip, and a top surface of the heat exchange body is provided with a pressing rod under the crimping mechanism, and is provided There is a chamber for accommodating the fins, and at least one of the water inlets of the two-phase chamber is opened at a hot spot corresponding to the semiconductor element to be tested, and at least one water outlet is opened around the chamber, the top of the heat conduction sheet The surface is provided with fins, and is assembled and coupled to the heat exchange body, and the fins are received in the chamber of the heat exchange body. The upper portion of the refrigerant wafer is connected to the heat conduction sheet, and the lower portion contacts the heat source of the conductive semiconductor element. The indenter device of the semiconductor component test sorting machine according to claim 6, wherein the heat conducting mechanism is recessed in the interior of the heat exchange body and has a hollow chamber and is located in the middle of the top surface of the chamber The water inlet is provided, and the water inlet is connected to a fluid input pipe located on the side of the heat exchange body. The indenter device of the semiconductor component test sorting machine according to claim 7, wherein the heat exchange body of the heat transfer mechanism has a water outlet connected to a flow guiding groove communicating with a top surface of the heat exchange body. The flow guiding groove is connected to a discharge port, and the discharge port is further connected to a fluid output pipe located on the other side of the heat exchange body, and then the top surface is equipped with a cover, and the cover is connected with the pressure bar under the pressure contact mechanism. . The under-press device of the semiconductor component test sorting machine according to the sixth aspect of the invention, wherein the heat-dissipating mechanism of the heat-transfer mechanism is attached to the heat-conducting sheet at an upper heat-dissipating end, and the lower heat-absorbing end contacts the conductive semiconductor element. The heat source. The indenter device under the semiconductor component test classification machine according to claim 9 of the patent application scope, wherein the heat absorption end of the heat transfer mechanism of the heat transfer mechanism is further The semiconductor component is connected to the lower pressing fixture, and the lower pressing device is pressed to contact the heat source of the conducting semiconductor component, and then the heat source is conducted to the heat absorbing end of the cooling wafer.