TWI564576B - Electronic components crimping device and its application test classification equipment - Google Patents

Description

Electronic component crimping device and test classification device thereof

The invention provides a dry air hood formed around the pressing member by using a gas passage between the outer pressing member of the anti-condensation mechanism and the pressing member of the pressing mechanism to guide the drying gas to reduce the moisture content of the surrounding air, thereby preventing The pressing member is dew condensation before pressing down the electronic component, and after pressing the electronic component under the pressing portion of the cover pressing member, the drying gas flows between the electronic component and the pressing member to prevent dew condensation, thereby improving the electronic component pressure of the test quality. Connect the device.

Nowadays, electronic components (such as ICs with wafers) are applied to different electronic devices. Since the environment in which the electronic devices are located may be a low-temperature environment or a high-temperature environment, the manufacturer ensures that the quality of the electronic components is used. The test equipment tests the electronic components and eliminates defective products; refer to Figures 1, 2, and 3, which are schematic diagrams of an electronic component testing device, which is equipped with a feeding device 12 and receiving materials on the machine table 11. The device 13 , the testing device 14 , the conveying device 15 and the crimping device 16 are provided with a feeding tray 121 having a plurality of electronic components 17 to be tested, and the receiving device 13 is provided with an empty receiving material The tray 131 is configured to accommodate a plurality of electronic components 17 that are tested. The test device 14 is provided with a circuit board 141 having a test socket 142 for testing the electronic components 17. The transport device 15 is provided with at least one for the first and second The pick-and-place device 151 for the three directions (such as the X, Y, and Z directions) is configured to transport the electronic component 17 to be tested/finished between the feeding device 12, the receiving device 13 and the testing device 14, and the crimping The device 16 is located above the test socket 142 of the test device 14 And a crimping jig 162 driven by the lower pressing rod 161 for displacement in the Z direction, the bottom of the crimping jig 162 having at least one pressing portion 163, and the pressing electronic component 17 and the crimping jig 162 The pressing portion 163 is equipped with a cooling fin 164. The heat absorbing end of one end of the cooling wafer 164 forms a cooling surface, and the heat releasing end of the other end forms a heat dissipating surface, and contacts the pressing portion 163 with a cooling surface, so that The electronic component 17 to be tested can perform a cold test operation in a simulated low temperature environment; when performing a low temperature cold test operation, the transport device 15 is used for pick and place The device 151 takes out the electronic component 17 to be tested on the supply tray 121 of the feeding device 12, and transfers it to the test socket 142 of the testing device 14, since the cooling wafer 164 is pressed against the pressure contact 162 by the cooling surface. In the portion 163, the pressing portion 163 is in a low temperature state, and the crimping device 16 drives the crimping jig 162 to be displaced downward in the Z direction by the pressing lever 161, so that the pressing portion 163 of the crimping jig 162 is pressed down. The heat source of the electronic component 17 to be tested causes the electronic component 17 to be tested to perform a cold test operation in a simulated low temperature environment; however, since the crimping fixture 162 of the crimping device 16 exhibits a low temperature state, when the crimping fixture The pressing portion 163 of the 162 is located in a working environment with high moisture content of the air, and the pressing portion 163 of the crimping jig 162 is liable to dew condensation on the surface of the pressing portion 163 of the low temperature before the electronic component is pressed down. Once the pressing member 163 presses down the electronic component 17, the water drops on the pressing portion 163 will affect the test quality. Further, when the pressing portion 163 presses the electronic component 17, the temperature of the electronic component 17 will also follow. The decrease causes the surface of the electronic component 17 to condense, thereby affecting the quality of the test.

An object of the present invention is to provide an electronic component crimping device comprising a pressing mechanism, a temperature control mechanism and an anti-condensation mechanism, wherein the pressing mechanism is configured with a crimper having a pressing member on one side of the transfer member The temperature control mechanism is configured to press the heat source of the electronic component, and the temperature control mechanism is provided with at least one temperature controller on the pressure device to maintain the electronic component in a preset test temperature range, and the anti-condensation mechanism is connected to the presser and The outer cover of the temperature control mechanism is provided with a cover pressing member fixed to the transfer member, the outer cover pressing member is provided with a through opening at a position corresponding to the pressing member at the bottom, and at least one pressure is provided on the outer peripheral side of the through port. a pressure passage for the pressure receiving surface of the electronic component, and a gas passage for the drying gas to flow between the outer cover pressing member and the pressure device, and the drying gas is guided by the gas passage to be discharged from the opening; thereby, The anti-condensation mechanism not only forms a dry air hood around the pressing member by using the drying gas discharged from the opening of the cover pressing member, but also prevents the pressing member from dew condensation before pressing, and can press the pressing portion at the pressing portion of the outer pressing member Drying gas after the pressure surface of the component A discharge flow port between the electronic component and the pressing member taken to prevent condensation, to the practical effectiveness of the test quality improvement.

A second object of the present invention is to provide a test and classification device for applying an electronic component crimping device, comprising a machine table, a feeding device, a receiving device, a testing device, a crimping device, a conveying device and a central control device, the feeding device Mounted on the machine table and provided with at least one feeding device for accommodating at least one electronic component to be tested, the receiving device is assembled on the machine table and provided Having at least one receiving device for accommodating at least one tested electronic component, the testing device being mounted on the machine table and provided with at least one tester for performing a test operation on the electronic component, the crimping device comprising a pressing mechanism, a temperature control mechanism and an anti-condensation mechanism, wherein the pressing mechanism presses the electronic component by a pressing member of the presser, and the temperature control mechanism uses the temperature controller to keep the electronic component at a preset test temperature, the prevention The condensation mechanism prevents condensation of the pressing member and the electronic component of the pressing mechanism, and assists pressing down the electronic component with the pressing portion. The conveying device is mounted on the machine table and is provided with at least one feeder for transferring Electronic components, the central control device is used to control and integrate the operation of each device to perform automated operations to achieve practical benefits of improving operational efficiency.

[study]

11‧‧‧ machine

12‧‧‧Feeding device

121‧‧‧ Feeding tray

13‧‧‧Receiving device

131‧‧‧ receiving tray

14‧‧‧Testing device

141‧‧‧ boards

142‧‧‧ test seat

15‧‧‧Conveyor

151‧‧‧ picker

16‧‧‧Crimping device

161‧‧‧lower bar

162‧‧‧Crimping fixture

163‧‧‧The Ministry of Pressure

164‧‧‧Cold wafer

17‧‧‧Electronic components

〔this invention〕

20‧‧‧Crimping device

21‧‧‧Picking mechanism

211‧‧‧ drive source

212‧‧‧Transfer

2121‧‧ ‧ room

213‧‧‧Links

2131‧‧‧First set of holes

214‧‧‧Crimping fixture

2141‧‧‧Pressing parts

215‧‧‧guides

2151‧‧‧Limited

22‧‧‧temperature control agency

221‧‧‧Chilled wafer

222‧‧‧ body

2221‧‧‧Second set of holes

2222‧‧‧室

2223‧‧‧Transportation line

223‧‧‧heat fins

224‧‧‧Bumps

23‧‧‧Anti-condensation mechanism

231‧‧‧Cushing parts

232‧‧‧ mouth

233‧‧‧掣压部

234‧‧‧ input port

235‧‧‧ gas passage

24‧‧‧Electronic components

241‧‧‧heat source

242‧‧‧ Pressure Department

243‧‧‧Contacts

30‧‧‧ machine

40‧‧‧Testing device

41‧‧‧ boards

42‧‧‧ test seat

43‧‧‧Transportation

50‧‧‧Feeding device

51‧‧‧Feeder

60‧‧‧ receiving device

61‧‧‧Receipt receiver

70‧‧‧Conveyor

71‧‧‧First mover

72‧‧‧First feeding stage

73‧‧‧Second feed stage

74‧‧‧Second shifter

75‧‧‧third shifter

76‧‧‧First receiving stage

77‧‧‧Second receiving platform

78‧‧‧fourth shifter

Figure 1: Schematic diagram of a conventional electronic component test equipment.

Figure 2: Schematic diagram of a conventional crimping device and test device.

Figure 3: Schematic diagram of the use of the pressing electronic components of the conventional press-fitting mechanism.

Figure 4: Schematic diagram (I) of the crimping device of the present invention.

Figure 5: Schematic diagram (2) of the crimping device of the present invention.

Figure 6: Schematic diagram of the use of the crimping device of the present invention (1).

Figure 7: Schematic diagram of the use of the crimping device of the present invention (2).

Figure 8 is a schematic view showing the application of the crimping device of the present invention to a test sorting device.

In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Referring to Figures 4 and 5, the electronic component crimping device 20 of the present invention comprises a pressing mechanism. The temperature control mechanism 22 and the anti-condensation mechanism 23 are provided with a transfer member for at least one direction displacement. In this embodiment, at least one drive source 211 is provided to drive a transfer. The member 212 is displaced in a third direction (such as the Z direction), and one of the transfer members 212 is configured with a presser having at least one pressing member for pressing against the electronic component, and further, the pressing member can have a lower portion In the embodiment, the presser is provided with a connecting member 213 and a crimping fixture 214, and the pressing device is provided with a pressing member and a pressure-carrying electronic component. The connecting member 213 is provided with a plurality of first sleeve holes 2131, and a guiding rod 215 is disposed on each of the first sleeve holes 2131. One end of the guiding rod 215 The fixing member 212 is fixed to the transfer member 212, and the limiting portion 2151 is disposed at the other end, so that the connecting member 213 can be displaced in the Z direction along the guiding rod 215 without falling off. The crimping jig 214 is fixed to the connecting member 213. The bottom surface of the fixture 213 is displaced in the Z direction, and the bottom surface of the jig 214 is crimped and provided with at least one pressing member 2141 for heating the heat source of the electronic component; the temperature control mechanism 22 is attached to the pressing mechanism 21 The thermostat is provided with at least one thermostat to maintain the electronic component in a preset test temperature range. In this embodiment, the first thermostat is disposed on the connecting member 213 of the crimper. A thermostat can be a refrigerating wafer, a heating element, etc., in this embodiment, the first thermostat is a refrigerated wafer 221, and can be made via a crimping fixture 214 as required by a preset test temperature. The electronic component is in a simulated working environment of a low temperature or a high temperature to perform a preset operation, and a second thermostat is disposed between the transfer member 212 of the pressing mechanism 21 and the connecting member 213, and the second thermostat is provided The body 222 of the second set of holes 2221 is sleeved, and the second set hole 2221 is sleeved on the guide rod 215 of the pressing mechanism 21, The body 222 can be displaced in the Z direction along the guiding rod 215. The inside of the body 222 is provided with a hollow chamber 2222. The chamber 2222 is connected to a plurality of fluid conveying conduits 2223 and accommodates a plurality of heat dissipating fins. The cover 223; the anti-condensation mechanism 23 is disposed on the outer portion of the presser and the temperature control mechanism 22 of the pressing mechanism 21, and at least one outer cover pressing member 231 is disposed, and the outer cover pressing member 231 is fixed under the transfer member 212. In the present embodiment, the inside of the outer cover pressing member 231 has an accommodating space for accommodating the connecting member 213 of the pressing mechanism 21, the crimping jig 214 and the temperature control mechanism 22, and the bottom of the outer cover pressing member 231. A through port 232 is defined in the position of the pressing member 2141 of the corresponding pressing mechanism 21, and at least one pressing portion 233 is disposed on the outer peripheral side of the opening 232 to press against the pressure on the peripheral side of the heat source of the electronic component. The surface of the electronic component can be evenly stressed by the electrical contact, and a gas passage with a drying gas is disposed between the outer cover pressing member 231 and the presser, and the gas is dried by the gas passage. A drying hood that prevents condensation is formed around the pressing member 2141. In this embodiment, it is tied to The cover member 231 is provided with at least one input port 234 for inputting dry gas, and a gas passage 235 for the flow of the dry gas between the cover member 231 and the presser, and a guide rod 215 of the press mechanism 21 The limiting portion 2151 is locked to the inner bottom surface of the outer cover pressing member 231, and the upper connecting member 213 is used by the limiting portion 2151 to make the connecting member 213 and the inner bottom surface of the outer cover pressing member 231 have a spacing, so that the outer cover pressing member 231 is A gas for drying gas is formed between the internal temperature control mechanism 22 and the connecting member 213 of the pressing mechanism 21 and the crimping jig 214. The passage 235, in turn, uses the gas passage 235 to guide the drying gas to form a drying hood around the pressing member 2141 at the opening 232 to reduce the moisture content of the air around the pressing member 2141, and prevent the pressing member 2141 of the crimper from being Condensation before the electronic component is pressed down, and the drying gas is discharged from the port 232. After the pressing member 2141 presses down the electronic component, the drying gas can be caused to flow between the electronic component and the pressing member 2141 to prevent condensation; The crimping device 20 further includes a fine adjustment mechanism for finely adjusting the amount of depression of the pressing member 2141 of the crimping device. In the embodiment, the fine adjustment mechanism is disposed on the bottom surface of the loading member 212 of the pressing mechanism 21. There is a chamber 2121 for injecting a gas, and a protrusion 224 is fixed on the body 222 of the temperature control structure 22. The protrusion 224 is embedded in the chamber 2121, and can be pushed by the gas pressure in the chamber 2121. The bump 224 is displaced in the Z direction, so that the bump 224 drives the presser to shift in the Z direction via the body 222 to finely adjust the amount of depression of the pressing member 2141 of the presser and to cause the pressing member 2141 to float.

Referring to FIG. 6, the crimping device 20 of the present invention is applied to an electronic component testing and sorting device. The test sorting device is provided with a testing device 40 having a circuit board 41 and a test socket 42 on the machine table 30. The test socket 42 is provided. The transmission member 43 is provided with a plurality of probes for electrically conducting contact with the contacts of the electronic components. The crimping device 20 is mounted on the test socket 42 of the testing device 40 to perform electronic component cold sensing. During operation, the temperature control mechanism 22 of the crimping device 20 contacts the crimping fixture 214 of the pressing mechanism 221 with the cooling surface of the cooling wafer 221 to cool the pressing member 2141 of the crimping fixture 214 to a preset low temperature. The heat dissipating surface of the cooling chip 221 contacts the heat dissipating fins 223, and the heat dissipating fins 223 exchange heat with the fluid in the chamber 2222 of the body 222 to dissipate heat, and the air content of the surrounding environment of the crimping device 20 is high. In order to prevent the low-temperature pressing member 2141 from dew condensation before pressing down the electronic component, the anti-condensation mechanism 23 inputs dry air through the input port 234 of the cover pressing member 231, so that dry air flows into the cover pressing member 231 and the crimping jig. 214 gas passages 235, and flowing from the gas passage 235 to the opening 232 of the bottom surface of the cover pressing member 231, not only the temperature control mechanism 22 and the crimping jig 214 but also the dry air environment inside the outer cover pressing member 231, and the dry air When the discharge port 232 is discharged, a drying hood can be formed around the pressing member 2141, and the water content of the air surrounding the pressing member 2141 can be greatly reduced to effectively prevent the pressing member 2141 from dew condensation before pressing the electronic component. In order to effectively improve the quality of testing.

Referring to FIGS. 5 and 7, the electronic component 24 to be tested in this embodiment is a heat source 241 protruding from the top surface of the wafer, and the peripheral side of the heat source 241 is a pressure receiving portion 242. The bottom surface of the 24 is provided with a plurality of solder balls 243. When the test socket 42 of the testing device 40 carries the electronic component 24 to be tested, the pressing mechanism 21 of the crimping device 20 is driven by the driving source 211. The shifting member 212 is displaced downward in the Z direction of the larger stroke, so that the transfer member 212 drives the temperature control mechanism 22 and the anti-condensation mechanism 23 to simultaneously shift the Z direction of the larger stroke downward, so that the anti-condensation mechanism 23 is covered by the cover. The pressing portion 233 of the member 231 presses the pressure receiving portion 242 of the electronic component 24 to be tested, and the connecting member 213 of the pressing mechanism 21 is placed on the guiding rod 215 by the first fitting hole 2131 to be displaced in the Z direction. When the pressing member 2141 of the crimping jig 214 presses the heat source 241 of the electronic component 24 to be tested and is pushed by the reaction force of the heat source 241, the crimping jig 214 can utilize the first set of the connecting member 213. The hole 2131 is displaced upward and downward along the Z direction of the guide rod 215 for a small stroke to adjust the pressing force of the pressing member 2141 of the crimping jig 214. And preventing the heat source 241 of the electronic component 24 to be tested from being pressed, and further, the pressing member 2141 of the pressing mechanism 21 and the pressing portion 233 of the anti-condensation mechanism 23 respectively press the heat source 241 of the electronic component 24 to be tested and the pressure. The portion 242 is such that the contact 243 of the electronic component 24 to be tested does contact the transmission member 43 of the test socket 42 to perform a cold-test operation, because the dry air in the gas passage 235 of the anti-condensation mechanism 23 is discharged from the port 232. The dry air can be dispersed around the pressing member 2141 and the electronic component 24, and the water content of the air around the pressing member 2141 and the electronic component 24 is greatly reduced, thereby effectively preventing the dew condensation member 2141 and the electronic component 24 from dew condensation; therefore, the The anti-condensation mechanism 23 can prevent the dew condensation from occurring before and after the pressing of the electronic component 24 by the pressing member 2141, and the pressing portion 233 of the outer cover pressing member 231 can assist the pressing of the electronic component 24 evenly, thereby effectively improving the test quality. Practical benefits.

Referring to Figures 4, 5 and 8, the crimping device 20 of the present invention is applied to a test sorting device comprising a crimping device 20, a machine table 30, a testing device 40, a feeding device 50, a receiving device 60, a conveying device 70 and a central control device, the feeding device 50 is mounted on the machine table 30, and is provided with at least one feeding device 51 for accommodating at least one electronic component to be tested; the receiving device 60 is assembled The machine 30 is provided with at least one receiving device 61 for accommodating at least one tested electronic component. The testing device 40 is mounted on the machine 30 and is provided with a circuit board having a test socket 42. 41, to test electronic components, the The crimping device 20 is mounted on the machine table 30, and is provided with a pressing mechanism 21, a temperature control mechanism 22 and an anti-condensation mechanism 23, and the pressing mechanism 21 presses the electronic component with the pressing member 2141 of the presser. The temperature control mechanism 22 maintains the electronic component with a preset test temperature by using a thermostat. The anti-condensation mechanism 23 prevents the depressing member 2141 of the pressing mechanism 21 and the electronic component from dew condensation, and assists the pressing of the electron with the pressing portion 233. The first loader 71 of the transport device 70 is taken out by the feeding device 50 to take out the electronic components to be tested, and is respectively sent to the first feeding stage 72 and the second feeding stage 73. A feeding stage 72 and a second feeding stage 73 carry the electronic components to be tested to the testing device 40, and the second feeder 74 and the third feeder 75 of the conveying device 70 respectively The electronic components to be tested on the first feeding stage 72 and the second feeding stage 73 are transferred to the testing device 40 to perform a test operation, and the tested electronic components at the testing device 40 are transferred to the first receiving material. The stage 76 and the second receiving stage 77, the first receiving stage 76 and the second receiving stage 77 carry the measured electronic components The fourth feeder 78 of the conveying device 70 is connected to the first receiving stage 76 and the second receiving stage 77 to take out the measured electronic components, and according to the test result, the measured electronic components are sent to The receiving device 60 is classified and placed, and the central control device is used to control and integrate the operations of the devices to perform automated operations, thereby achieving practical benefits of improving operational efficiency.

20‧‧‧Crimping device

21‧‧‧Picking mechanism

211‧‧‧ drive source

212‧‧‧Transfer

2121‧‧ ‧ room

213‧‧‧Links

214‧‧‧Crimping fixture

2141‧‧‧Pressing parts

215‧‧‧guides

22‧‧‧temperature control agency

221‧‧‧Chilled wafer

222‧‧‧ body

2222‧‧‧室

2223‧‧‧Transportation line

223‧‧‧heat fins

224‧‧‧Bumps

23‧‧‧Anti-condensation mechanism

231‧‧‧Cushing parts

232‧‧‧ mouth

233‧‧‧掣压部

234‧‧‧ input port

235‧‧‧ gas passage

Claims (10)

An electronic component crimping device comprising: a pressing mechanism: a loading member configured to displace at least one direction, and a crimper having at least one pressing member disposed on one side of the moving member to be pressed Or transferring electronic components; temperature control mechanism: at least one thermostat is disposed on the pressure extractor of the pressing mechanism to maintain the electronic component in a preset test temperature range; the anti-condensation mechanism is attached to the pressure The external crimping device of the taking mechanism and the outer cover of the temperature control mechanism are provided with at least one outer cover pressing member, the outer cover pressing member is fixed under the moving carrying member, and the opening is opened at a position corresponding to the pressing member at the bottom portion. And a gas passage with a drying gas is disposed between the outer cover pressing member and the presser, and the drying gas of the gas passage forms an anti-condensation drying air hood around the pressing member of the presser. According to the electronic component crimping device of claim 1, wherein the crimping device of the pressing mechanism is provided with a connecting member and a crimping jig, and the crimping fixture is mounted on the connecting member. The bottom surface is provided with at least one of the pressing members on the bottom surface. The electronic component crimping device according to the second aspect of the invention, wherein the connecting member of the presser is provided with at least one first sleeve hole, and a guide rod is disposed in the first sleeve hole. One end of the guide rod is fixed to the transfer member, and the other end is provided with a limiting portion and is fixed to the cover pressing member outside the anti-condensation mechanism, so that the connecting member and the crimping jig are displaced in the third direction. The electronic component crimping device according to claim 3, wherein the anti-condensation mechanism is configured such that the guide rod of the pressing mechanism raises the connecting member of the presser to press the presser and the outer cover The bottom surface of the piece has a spacing. The electronic component crimping device according to claim 1, wherein the temperature control mechanism is provided with a first thermostat on the pressure extractor of the pressing mechanism, and the first thermostat can Cold wafer or heating element. The electronic component crimping device according to claim 5, wherein the temperature control mechanism is provided with a second thermostat in the cover pressing member outside the anti-condensation mechanism, and the second thermostat is provided A body having a chamber that communicates with at least one delivery conduit for delivering fluid. The electronic component crimping device according to claim 6 further includes a fine adjustment mechanism, wherein the fine adjustment mechanism is provided with a gas-fillable chamber on the bottom surface of the transfer member of the pressing mechanism, and the temperature control is performed At least one bump embedded in the chamber is fixed on the body of the structure. The electronic component crimping device according to claim 1, wherein the anti-condensation mechanism is provided with at least one input port communicating with the gas passage to input the dry gas. The electronic component crimping apparatus according to claim 1, wherein the anti-condensation mechanism is provided with at least one rolling portion pressed against the electronic component on the outer peripheral side of the opening of the outer cover pressing member. A test classification device for applying an electronic component crimping device, comprising: a machine table; a feeding device: disposed on the machine table, and provided with at least one feeding device for accommodating at least one electronic component to be tested Receiving device: disposed on the machine, and provided with at least one receiving device for accommodating at least one tested electronic component; at least one electronic component pressing according to claim 1 The connecting device is assembled on the machine; the conveying device is mounted on the machine and is provided with at least one shifter for transferring the electronic component; the central control device is for controlling and integrating the device Actuate to perform automated work.